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GR
400
D
64
MEMORY MODULE SPECIFICATION
L3
2GDC
GOODRAM
SPEED / DATA TRANSFER 400MHz / PC-3200
MODULE TYPE DDR SDRAM DIMM
MODULE DATA WIDTH 64
CAS LATENCY 3
MODULE DENSITY 2GB DUAL CHANNEL
professional memory for everyone
DDR MODULE
PART NUMBERING
SYSTEM
f2,49 (2x)
2,31
10,00
17,78
29,50
GOODRAM logo and GOODDRIVE logo are registered trademarks of Wilk Elektronik S.A.
All other trademarks and logos are the property of their respective owners.
All products and specifications are subject to change without notice.
Rev. 04.12.2007
Wilk Elektronik S.A.
Poland, 43-174 £aziska Górne, ul. Miko³owska 42
tel.: 0-32/ 736 90 00, fax: 0-32/ 736 90 01
www.wilk.com.pl l www.goodram.com
© Wilk Elektronik S.A. 2007
133,35
1
,9
R0
60,07
DDR SDRAM DIMM
133,35 x 29,5mm ± 0,1mm
1,27mm ± 0,13mm
TSOP, x8bit
GOLD PLATED
128,70
2,54
131,34
15 ns
15 ns
10 ns
40 ns
55 ns
65 ns
10
PCB DETAILS
PCB TYPE
BOARD DIMENSIONS
BOARD THICKNESS
DRAM PACKAGE INFORMATION
CONTACT PADS (PIN)
PIN 92
4.00 (2x)
DYNAMIC PARAMETERS FOR 400MHz
RAS# TO CAS# DELAY, tRCD
ROW PRECHARGE TIME, tRP
ROW ACTIVE TO ROW ACTIVE DELAY, tRRD
ACTIVE TO PRECHARGE TIME, tRAS
ACTIVE TO ACTIVE / AUTO REFRESH TIME, tRC
AUTO REFRESH TO ACTIVE / AUTO REFRESH, tRFC
DEVICE CYCLE TIME, tCK MAX
PIN 53
3
2,5
2
PIN 52
400MHz (2x200MHz) | PC-3200
333MHz (2x166MHz) | PC-2700
266MHz (2x133MHz) | PC-2100
PIN 1
CAS Latency
PIN 184
OPERATING FREQUENCY
PIN 145
GR400D64L3/2GDC
DDR SDRAM DIMM
2x1GB
64
64Mx8
16
2
2
NO
NO
184 PIN
2,6V
YES
128 BYTES
7,8 ms
PIN 144
PART NUMBER
MODULE TYPE
MODULE DENSITY
MODULE DATA WIDTH
DRAM CHIP ORAGNIZATION
NUMBER OF DRAM CHIPS
NUMBER OF MODULE RANKS
NUMBER OF MODULE SIDES
REGISTERED
ECC SUPPORT
PIN COUNT
SUPPLY VOLTAGE
SSTL_2 COMPATIBLE
PROGRAMMED SPD MEMORY
MAX AVG PERIODIC REFRESH INTERVAL
PIN 93
FEATURES
www.goodram.com
MEMORY MODULE SPECIFICATION
SPD CONFIGURATION
BYTE
DESCRIPTION
HEX
DEC
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
Number of Serial PD Bytes written during module production
Total number of Bytes in Serial PD device
Fundamental Memory Type (FPM, EDO, SDRAM …)
Number of Row Addresses on this assembly
Number of Column Addresses on this assembly
Number of DIMM Banks
Data Width of this assembly
Data Width of this assembly
Voltage Interface Level of this assembly
SDRAM Cycle time at Maximum Supported CAS Latency (CL), CL=X
SDRAM Access from Clock
DIMM configuration type (Non-parity, Parity or ECC)
Refresh Rate/Type
Primary SDRAM Width
Error Checking SDRAM Width
SDRAM Device Attributes: Minimum Clock Delay, Back-to-Back RCA
SDRAM Device Attributes: Burst Lengths Supported
SDRAM Device Attributes: Number of Banks on SDRAM Device
SDRAM Device Attributes: CAS Latency
SDRAM Device Attributes: CS Latency
SDRAM Device Attributes: Write Latency/DIMM Type Information
SDRAM Module Attributes
SDRAM Device Attributes: General
Minimum Clock Cycle at CL = X - 0.5
Maximum Data Access Time (tAC) from Clock at CL = X - 0.5
Minimum Clock Cycle at CL = X - 1
Maximum Data Access Time (tAC) from Clock at CL = X - 1
Minimum Row Precharge Time (tRP)
Minimum Row Active to Row Active delay (tRRD)
Minimum RAS to CAS delay (tRCD)
Minimum Active to Precharge Time (tRAS)
Module Bank Density
Address and Command Input Setup Time Before Clock
Address and Command Input Hold Time After Clock
Data Input Setup Time Before Clock
Data Input Hold Time After Clock
Write recovery time (tWR)
Internal write to read command delay (tWTR)
Internal read to precharge command delay (tRTP)
Memory Analysis Probe Characteristics
Extension of Byte 41 tRC and Byte 42 tRFC
SDRAM Device Minimum Active to Active/Auto Refresh Time (tRC)
SDRAM Device Minimum Auto Refresh to Active/Auto Refresh (tRFC)
SDRAM Device Maximum device cycle time (tCKmax)
SDRAM Device Maximum skew between DQS and DQ signals (tDQSQ)
DDR SDRAM Device Maximum Read Data Hold Skew Factor (tQHS)
Reserved for future use
SDRAM Device Attributes - DDR SDRAM DIMM Height
Reserved for future use
Reserved for future use
Reserved for future use
Reserved for future use
Reserved for future use
Reserved for future use
Reserved for future use
Reserved for future use
Reserved for future use
Reserved for future use
Reserved for future use
Reserved for future use
Reserved for future use
Reserved for future use
SPD Revision
Checksum for Bytes 0-62
0x80
0x08
0x07
0x0D
0x0B
0x02
0x40
0x00
0x04
0x50
0x70
0x00
0x82
0x08
0x00
0x01
0x0E
0x04
0x1C
0x01
0x02
0x20
0x01
0x60
0x70
0x75
0x75
0x3C
0x28
0x3C
0x28
0x80
0x60
0x60
0x40
0x40
0x00
0x00
0x00
0x00
0x00
0x37
0x41
0x28
0x28
0x50
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x11
0xF5
128
8
7
13
11
2
64
0
4
80
112
0
130
8
0
1
14
4
28
1
2
32
1
96
112
117
117
60
40
60
40
128
96
96
64
64
0
0
0
0
0
55
65
40
40
80
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
17
245
64-255
Manufacturer’s specific data
GOODRAM logo and GOODDRIVE logo are registered trademarks of Wilk Elektronik S.A.
All other trademarks and logos are the property of their respective owners.
All products and specifications are subject to change without notice.
Rev. 04.12.2007
Wilk Elektronik S.A.
Poland, 43-174 £aziska Górne, ul. Miko³owska 42
tel.: 0-32/ 736 90 00, fax: 0-32/ 736 90 01
www.wilk.com.pl l www.goodram.com
© Wilk Elektronik S.A. 2007
professional memory for everyone