Transcript
Advanced Engineering by Thermaltake P/N : CL-P0326 Application for Intel LGA775 130W Solution SPECIFICATION Fan Dimension : ∅ 90x90x25 mm Heat Sink Dimension : 89.5x89.5x45 mm Rated Voltage : 12V Rated Current : 0.03 AMP Fan Speed : 4200RPM Air Flow : 71.79CFM (Duty cycle at 100%) Static Pressure: 7.23 mm H2O (Duty cycle at 100%) Max. Noise : 44 dB (Duty cycle at 100%) Bearing Type : 1 Ball 1 Sleeve Bearing Life Expectation : 40,000 hrs in 25℃ Connector : 4Pin PWM Thermal Interface: TIC-1000A Weight: 540g Thermal Resistance: R=0.31 ℃/W FEATURES: 9025 circle fan Back Plate Spring screw -Application for Intel LGA775 130W Solution. -Aluminum extrusion with Copper core inserted. -The fourth fan pin has PWM (Pulse Width Modulation) an speed control function: decrease energy consumption, reduces acoustics noise and increase fan performance. -Plastic back plate & spring screw. -TIC-1000A interface material perform well. . UYHGFRDESAZ Al extrusion with Cu core DIMENSION THERMAL PERFORMANCE C H IP T E M P E R A T U R E (T c) R IS E A B O V E A M B IE N T - ℃ 30 25 20 15 10 5 0 0 10 20 30 40 50 60 70 HEAT DISSIPATED - WATTS Unit: mm www.thermaltake.com [email protected] REVISION A. 2005.12
