Download HP ProLiant ML350p Gen8 Server Maintenance and Service Guide

HP ProLiant ML350p Gen8 Server
Maintenance and Service Guide
Abstract
This document is for the person who installs, administers, and troubleshoots servers and storage systems. This document is intended for experienced
IT professionals or end-users with no or prior hardware setup experience. HP assumes you are qualified in the servicing of computer equipment and
trained in recognizing hazards in products with hazardous energy levels.
Part Number: 661081-008
January 2014
Edition: 8
© Copyright 2012, 2014 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or omissions contained herein.
Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.
Intel® and Xeon® are trademarks of Intel Corporation in the U.S. and other countries.
Contents
Customer self repair ...................................................................................................................... 5
Parts only warranty service ......................................................................................................................... 5
Illustrated parts catalog ............................................................................................................... 15
Mechanical components........................................................................................................................... 15
System components ................................................................................................................................. 18
Removal and replacement procedures ........................................................................................... 24
Required tools ......................................................................................................................................... 24
Safety considerations ............................................................................................................................... 24
Preventing electrostatic discharge .................................................................................................... 24
Symbols on equipment ................................................................................................................... 24
Rack warnings .............................................................................................................................. 25
Preparation procedures ............................................................................................................................ 25
Power up the server ....................................................................................................................... 26
Power down the server ................................................................................................................... 26
Remove the security bezel ............................................................................................................... 27
Remove the tower bezel ................................................................................................................. 27
Remove the rack bezel ................................................................................................................... 27
Extend the server from the rack........................................................................................................ 28
Access panel .......................................................................................................................................... 29
Air baffle ............................................................................................................................................... 30
PCI air baffles ......................................................................................................................................... 30
Fan blank ............................................................................................................................................... 31
Fan ....................................................................................................................................................... 32
Fan cage................................................................................................................................................ 33
Tower feet .............................................................................................................................................. 34
Component box blank ............................................................................................................................. 35
Drive blank ............................................................................................................................................. 36
Drive ..................................................................................................................................................... 36
Optical drive cage .................................................................................................................................. 37
Optical drive .......................................................................................................................................... 38
Front I/O assembly ................................................................................................................................. 39
Power supply blank ................................................................................................................................. 40
Power supply module ............................................................................................................................... 41
Power supply backplane .......................................................................................................................... 41
Expansion board ..................................................................................................................................... 44
Graphic card adapter .............................................................................................................................. 45
Cache module ........................................................................................................................................ 47
FBWC capacitor pack ............................................................................................................................. 48
SFF drive backplane ................................................................................................................................ 50
LFF drive backplane ................................................................................................................................. 51
Systems Insight Display assembly .............................................................................................................. 53
Heatsink ................................................................................................................................................. 54
Heatsink Retaining Levers ......................................................................................................................... 57
Processor ............................................................................................................................................... 58
DIMMs................................................................................................................................................... 63
Contents
3
System board ......................................................................................................................................... 64
System battery ........................................................................................................................................ 72
HP Trusted Platform Module ...................................................................................................................... 73
Troubleshooting .......................................................................................................................... 74
Troubleshooting resources ........................................................................................................................ 74
Diagnostic tools .......................................................................................................................... 75
HP Insight Diagnostics .............................................................................................................................. 75
HP Insight Diagnostics survey functionality .................................................................................................. 75
Integrated Management Log ..................................................................................................................... 75
HP Insight Remote Support software ........................................................................................................... 76
USB support ........................................................................................................................................... 76
Component identification ............................................................................................................. 77
Front panel components ........................................................................................................................... 77
Front panel LEDs and buttons .................................................................................................................... 78
Rear panel components ............................................................................................................................ 79
Rear panel LEDs ...................................................................................................................................... 80
System board components ........................................................................................................................ 81
System maintenance switch ............................................................................................................. 82
NMI functionality ........................................................................................................................... 83
DIMM slots ............................................................................................................................................. 83
Systems Insight Display LEDs ..................................................................................................................... 84
Systems Insight Display LED combinations ................................................................................................... 84
SAS and SATA device numbers ................................................................................................................. 85
Hot-plug drive LED definitions.................................................................................................................... 87
Fans ...................................................................................................................................................... 87
FBWC module LEDs (P222, P420, P420i, P421, P822) ............................................................................... 88
RPS riser board connectors ....................................................................................................................... 89
Cabling ..................................................................................................................................... 91
Server data cabling ................................................................................................................................. 91
Media device data cabling....................................................................................................................... 92
Optical drive cabling ............................................................................................................................... 92
Specifications ............................................................................................................................. 93
Environmental specifications ..................................................................................................................... 93
Server specifications ................................................................................................................................ 93
Power supply specifications ...................................................................................................................... 93
HP 460 W Gold Power Supply (92% efficiency)................................................................................ 94
HP 460 W Platinum Plus Power Supply (94% efficiency) ..................................................................... 94
HP 750 W Gold Power Supply (92% efficiency)................................................................................ 95
HP 750 W Platinum Plus Power Supply (94% efficiency) ..................................................................... 95
HP 1200 W Platinum Plus Power Supply (94% efficiency) ................................................................... 95
Acronyms and abbreviations ........................................................................................................ 97
Documentation feedback ............................................................................................................. 99
Index ....................................................................................................................................... 100
Contents
4
Customer self repair
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for
greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will
ship that part directly to you for replacement. There are two categories of CSR parts:
•
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts,
you will be charged for the travel and labor costs of this service.
•
Optional—Parts for which customer self repair is optional. These parts are also designed for customer
self repair. If, however, you require that HP replace them for you, there may or may not be additional
charges, depending on the type of warranty service designated for your product.
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the
Illustrated Parts Catalog.
Based on availability and where geography permits, CSR parts will be shipped for next business day
delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.
If assistance is required, you can call the HP Technical Support Center and a technician will help you over the
telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must
be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective
part back to HP within a defined period of time, normally five (5) business days. The defective part must be
returned with the associated documentation in the provided shipping material. Failure to return the defective
part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping
and part return costs and determine the courier/carrier to be used.
For more information about HP's Customer Self Repair program, contact your local service provider. For the
North American program, refer to the HP website (http://www.hp.com/go/selfrepair).
Parts only warranty service
Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty
service, HP will provide replacement parts free of charge.
For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these parts,
you will be charged for the travel and labor costs of this service.
Réparation par le client (CSR)
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin
de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la
période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être
effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:
Customer self repair 5
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à
votre produit.
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué
par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation
géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même
ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le
Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise
s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai
indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les
coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de
retour, et détermine la société de courses ou le transporteur à utiliser.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP
(http://www.hp.com/go/selfrepair).
Service de garantie "pièces seules"
Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de
rechange fournies par HP ne sont pas facturées.
Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à
HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
Riparazione da parte del cliente
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza
HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per
la sostituzione. Vi sono due categorie di parti CSR:
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere
spese addizionali a seconda del tipo di garanzia previsto per il prodotto.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono
identificate da un "No" nel Catalogo illustrato dei componenti.
Customer self repair 6
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento
di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del
centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente
deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve
spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il
componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione
fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.
Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il
corriere/vettore da utilizzare.
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).
Servizio di garanzia per i soli componenti
La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia
del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.
Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da
parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di spedizione
e di manodopera per il servizio.
Customer Self Repair
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere
Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der
Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses
Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen
Service berechnet.
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche
Kosten anfallen.
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.
Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen
Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und
sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert
werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es
erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen
Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen
Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das
Customer self repair 7
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer
Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den
Kurier-/Frachtdienst.
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter
(http://www.hp.com/go/selfrepair).
Parts-only Warranty Service (Garantieservice
ausschließlich für Teile)
Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich
für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile kostenlos zur
Verfügung.
Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch
dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service
berechnet.
Reparaciones del propio cliente
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self
Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar
sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios
de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente
CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se
clasifican en dos categorías:
•
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de
desplazamiento y de mano de obra de dicho servicio.
•
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si
precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de
servicio de garantía correspondiente al producto.
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que
el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado
realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el
catálogo ilustrado de componentes.
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su
destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el
mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de
asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales
para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán
devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá
hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes
defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no
Customer self repair 8
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de
componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en
contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite
la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Servicio de garantía exclusivo de componentes
La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según las
condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto sin
cargo adicional alguno.
Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por
parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.
Customer Self Repair
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij
de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat
onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee
categorieën CSR-onderdelen:
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen
voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen
voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het
product.
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met
de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij
reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en
kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Customer self repair 9
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).
Garantieservice "Parts Only"
Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van
de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.
Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze
onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening
gebracht.
Reparo feito pelo cliente
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo
pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.
Existem duas categorias de peças CSR:
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,
serão cobradas as despesas de transporte e mão-de-obra do serviço.
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de
taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o
pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser
feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico
da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR
de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é
preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.
A peça com defeito deve ser enviada com a documentação correspondente no material de transporte
fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a
HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço
postal a ser utilizado.
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o
fornecedor de serviços local. Para o programa norte-americano, visite o site da HP
(http://www.hp.com/go/selfrepair).
Serviço de garantia apenas para peças
A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do
serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.
Customer self repair 10
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 11
Customer self repair 12
Customer self repair 13
Customer self repair 14
Illustrated parts catalog
Mechanical components
Item
Description
Spare part number
Customer self repair (on
page 5)
1
Front bezel
667267-001
Mandatory1
2
Second optical drive cage
670612-001
Optional2
3
Fan cage
667255-001
Optional2
4
Fan blank
667262-001
Mandatory1
5
Fan louver
667258-001
Optional2
6
PCI air baffles (2)
667280-001
Mandatory1
7
System air baffle
667256-001
Mandatory1
8
Bezel ear kit
667274-001
Mandatory1
a) Bezel ear, right
—
—
b) Bezel ear, left*
—
—
Illustrated parts catalog
15
Item
Description
Spare part number
Customer self repair (on
page 5)
c) T-10 screws (4)*
—
—
d) T-15 screws (4)*
—
—
e) Discovery service cable*
—
—
f) Server baseblank covers (2)*
—
—
9
Tower feet
667264-001
Mandatory1
10
LFF drive blank
667279-001
Mandatory1
11
SFF drive blank
667276-001
Mandatory1
12
Drive cage blank*
667261-001
Mandatory1
13
Heatsink retaining levers*
751444-001
Mandatory1
*Not shown
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be
charged for the travel and labor costs of this service.
2
Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,
however, you require that HP replace them for you, there may or may not be additional charges, depending on the type
of warranty service designated for your product.
3
No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that
an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.
1
Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
2
Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces
pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.
3
No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces
pièces sont identifiées par la mention “Non” dans le Catalogue illustré.
1
Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
2
Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese
addizionali a seconda del tipo di garanzia previsto per il prodotto.
3
No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate
da un “No” nel Catalogo illustrato dei componenti.
1
Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie
diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.
2
Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei
diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.
3
No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen,
muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.
„Nein“ gekennzeichnet.
1
Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP
que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano
de obra de dicho servicio.
1
Illustrated parts catalog
16
Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su
sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al
producto.
3
No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario
haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos
componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.
2
Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te
vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.
2
Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.
3
No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
1
Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,
serão cobradas as despesas de transporte e mão-de-obra do serviço.
2
Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa
adicional, dependendo do tipo de serviço de garantia destinado ao produto.
3
No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia
do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”
(Não), no catálogo de peças ilustrado.
1
Illustrated parts catalog
17
System components
Item
Description
Spare part number
Customer self repair (on
page 5)
13
Power supplies
—
—
a) HP 460W CS Gold (92% efficiency)
511777-001
Mandatory1
b) HP 460 W CS Platinum Plus (94%
efficiency)*
c) HP 750 W CS Gold (92% efficiency)*
660184-001
Mandatory1
511778-001
Mandatory1
660183-001
Mandatory1
660185-001
Mandatory1
14
d) HP 750 W CS Platinum Plus (94%
efficiency)*
f) HP 1200 W CS Platinum Plus (94%
efficiency)*
Heatsink
667268-001
Optional2
15
Processors**
—
—
a) 1.8 GHz Intel Xeon E5-2650L
processor, 8C, 70 W
b) 1.8 GHz Intel Xeon E5-2603 processor,
4C, 80 W*
c) 1.8 GHz Intel Xeon E5-2603v2
processor, 4C, 80 W*
d) 2.0 GHz Intel Xeon E5-2650 processor,
8C, 95 W*
e) 2.0 GHz Intel Xeon E5-2630L processor,
6C, 60 W*
f) 2.0 GHz Intel Xeon E5-2620 processor,
6C, 95 W*
670534-001
Optional2
670533-001
Optional2
730243-001
Optional2
670526-001
Optional2
670535-001
Optional2
670529-001
Optional2
Illustrated parts catalog
18
Item
Description
Spare part number
Customer self repair (on
page 5)
730239-001
Optional2
730241-001
Optional2
670525-001
Optional2
670528-001
Optional2
670530-001
Optional2
730244-001
Optional2
670524-001
Optional2
670527-001
Optional2
730236-001
Optional2
730242-001
Optional2
670523-001
Optional2
730238-001
Optional2
730240-001
Optional2
670522-001
Optional2
730245-001
Optional2
730235-001
Optional2
670537-001
Optional2
670521-001
Optional2
670539-001
Optional2
730234-001
Optional2
730247-001
Optional2
670538-001
Optional2
730248-001
Optional2
730249-001
Optional2
16
g) 2.0 GHz Intel Xeon E5-2640v2
processor, 8C, 95 W*
h) 2.1 GHz Intel Xeon E5-2620v2
processor, 6C, 80 W*
i) 2.2 GHz Intel Xeon E5-2660 processor,
8C, 95 W*
j) 2.3GHz Intel Xeon E5-2630 processor,
6C, 95W*
k) 2.4 GHz Intel Xeon E5-2609 processor,
4C, 80 W*
l) 2.4 GHz Intel Xeon E5-2630L v2
processor, 6C, 60 W*
m) 2.4 GHz Intel Xeon E5-2665 processor,
8C, 115 W*
n) 2.5 GHz Intel Xeon E5-2640 processor,
6C, 95 W*
o) 2.5 GHz Intel Xeon E5-2670v2
processor, 10C, 115 W*
p) 2.5 GHz Intel Xeon E5-2609v2
processor, 4C, 80 W*
q) 2.6 GHz Intel Xeon E5-2670 processor,
8C, 115 W*
r) 2.6 GHz Intel Xeon E5-2650v2
processor, 8C, 95 W*
s) 2.6 GHz Intel Xeon E5-2630v2
processor, 8C, 80 W*
t) 2.7 GHz Intel Xeon E5-2680 processor,
8C, 130 W*
u) 2.7 GHz Intel Xeon E5-2697v2
processor, 12C, 130 W*
v) 2.8-GHz Intel Xeon processor
E5-2680v2, 115W
w) 2.9 GHz Intel Xeon E5-2667 processor,
6C, 130 W*
x) 2.9 GHz Intel Xeon E5-2690 processor,
8C, 135 W*
y) 3.0 GHz Intel Xeon E5-2637 processor,
2C, 80 W
z) 3.0 GHz Intel Xeon E5-2690v2
processor, 10C, 130 W*
aa) 3.0 GHz Intel Xeon E5-2667v2
processor, 8C, 130 W*
bb) 3.3 GHz Intel Xeon E5-2643
processor, 4C, 130 W*
cc) 3.3 GHz Intel Xeon E5-2643v2
processor, 6C, 130 W*
dd) 3.5 GHz Intel Xeon E5-2637v2
processor, 4C, 130 W*
DIMMs
—
—
a) 2 GB, PC3L-10600E-9, single-rank x8
664694-001
Mandatory1
b) 2 GB, PC3-14900E-13, single-rank x8
715269-001
Mandatory1
Illustrated parts catalog
19
Item
Description
Spare part number
Customer self repair (on
page 5)
c) 2 GB, PC3L-12800E-11, single-rank x8 715279-001
Mandatory1
d) 4 GB, PC3L-12800E-11, dual-rank x8
715280-001
Mandatory1
e) 4 GB, PC3L-12800R-11, single-rank x4 715282-001
Mandatory1
f) 4 GB, PC3-14900E-13, dual-rank x8
715270-001
Mandatory1
g) 4 GB, PC3-14900R-13, single-rank x4
715272-001
Mandatory1
h) 4 GB, PC3L-10600R-9, single-rank x4* 664688-001
Mandatory1
i) 4 GB, PC3-12800R-11, single-rank x4* 664689-001
Mandatory1
j) 4 GB, PC3L-10600E-9, dual-rank x8*
664695-001
Mandatory1
k) 8 GB, PC3-12800R-11, single-rank x4* 664691-001
Mandatory1
l) 8 GB, PC3L-10600R, dual-rank x4*
664690-001
Mandatory1
m) 8 GB, PC3L-10600E, dual-rank x8*
664696-001
Mandatory1
n) 8 GB, PC3L-12800E-11, dual-rank x8
715281-001
Mandatory1
o) 8 GB, PC3L-12800R-11, dual-rank x4
715283-001
Mandatory1
p) 8 GB, PC3L-12800R-11 , single-rank x4 735302-001
Mandatory1
q) 8 GB, PC3-14900E-13 , dual-rank x8
715271-001
Mandatory1
r) 8 GB, PC3-14900R-13 , dual-rank x4
715273-001
Mandatory1
s) 8 GB, PC3-14900R-13, single-rank x4
735303-001
Mandatory1
t) 16 GB, PC3L-12800R-11, dual-rank x4
715284-001
Mandatory1
u) 16 GB, PC3-14900R-13, dual-rank x4 715274-001
Mandatory1
v) 16 GB, PC3L-10600R-9, dual-rank x4* 664692-001
Mandatory1
w) 16 GB, PC3-12800R-11, dual-rank x4* 684031-001
Mandatory1
x) 32 GB, PC3-14900L-13, quad-rank x4
715275-001
Mandatory1
y) 32 GB, PC3L-10600L, quad-rank x4*
664693-001
Mandatory1
17
System board assembly
667253-001
Optional2
18
SFF drive backplane
693610-001
Optional2
19
LFF drive backplane
693611-001
Optional2
20
Front I/O module assembly*
667260-001
Optional2
21
SID module assembly*
667271-001
Optional2
22
Miscellaneous cable kit
667266-001
Mandatory1
a) Mini-SAS to Mini-SAS, 12.75-in*
—
—
b) Drive backplane power cable*
—
—
c) Graphic support cable, 2x4*
701539-001
—
Mini-SAS cables
—
—
a) Mini-SAS cable, 35 in*
667277-001
Mandatory1
b) Mini-SAS cable, 25.5 in*
498424-001
Mandatory1
Power cable*
667259-001
Optional2
23
24
Illustrated parts catalog
20
Item
Description
Spare part number
Customer self repair (on
page 5)
25
SATA cable*
667265-001
Mandatory1
26
SFF drive backplane with expander*
693610-001
Optional2
27
LFF drive backplane with expander*
693611-001
Optional2
28
Fan module*
667254-002
Mandatory1
29
Bracket support holder*
667263-001
Mandatory1
a) Right holder
—
—
b) Left holder
—
—
Optional2
32
Two-bay power supply backplane board* 667269-001
(with 2 T-15 screws)
Four-bay power supply backplane board* 667281-001
(with 2 T-15 screws)
Two-bay power supply blank*
667270-001
33
Rail kit*
667272-001
Mandatory1
34
Rack bezel*
667273-001
Mandatory1
35
Power supply air baffle*
667257-001
Optional2
30
31
Optional2
Mandatory1
*Not shown
**All processors in this HP ProLiant server must have the same cache size, speed, number of cores, and rated maximum
power consumption.
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be
charged for the travel and labor costs of this service.
2
Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,
however, you require that HP replace them for you, there may or may not be additional charges, depending on the type
of warranty service designated for your product.
3
No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that
an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.
1
Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
2
Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces
pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.
3
No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces
pièces sont identifiées par la mention “Non” dans le Catalogue illustré.
1
Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
2
Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese
addizionali a seconda del tipo di garanzia previsto per il prodotto.
3
No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate
da un “No” nel Catalogo illustrato dei componenti.
1
Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie
diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.
1
Illustrated parts catalog
21
Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei
diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.
3
No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen,
muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.
„Nein“ gekennzeichnet.
2
Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP
que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano
de obra de dicho servicio.
2
Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su
sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al
producto.
3
No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario
haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos
componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.
1
Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te
vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.
2
Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.
3
No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
1
Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,
serão cobradas as despesas de transporte e mão-de-obra do serviço.
2
Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa
adicional, dependendo do tipo de serviço de garantia destinado ao produto.
3
No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia
do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”
(Não), no catálogo de peças ilustrado.
1
Illustrated parts catalog
22
Illustrated parts catalog
23
Removal and replacement procedures
Required tools
You need the following items for some procedures:
•
T-10 Torx screwdriver
•
T-15 Torx screwdriver
•
HP Insight Diagnostics software ("HP Insight Diagnostics" on page 75)
Safety considerations
Before performing service procedures, review all the safety information.
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system
or handling parts. A discharge of static electricity from a finger or other conductor may damage system
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
To prevent electrostatic damage:
•
Avoid hand contact by transporting and storing products in static-safe containers.
•
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
•
Place parts on a grounded surface before removing them from their containers.
•
Avoid touching pins, leads, or circuitry.
•
Always be properly grounded when touching a static-sensitive component or assembly.
Symbols on equipment
The following symbols may be placed on equipment to indicate the presence of potentially hazardous
conditions.
This symbol indicates the presence of hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified personnel.
WARNING: To reduce the risk of injury from electric shock hazards, do not open this
enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.
This symbol indicates the presence of electric shock hazards. The area contains no user
or field serviceable parts. Do not open for any reason.
WARNING: To reduce the risk of injury from electric shock hazards, do not open this
enclosure.
Removal and replacement procedures
24
This symbol on an RJ-45 receptacle indicates a network interface connection.
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do
not plug telephone or telecommunications connectors into this receptacle.
This symbol indicates the presence of a hot surface or hot component. If this surface is
contacted, the potential for injury exists.
WARNING: To reduce the risk of injury from a hot component, allow the surface to cool
before touching.
This symbol indicates that the component exceeds the recommended weight for one
individual to handle safely.
WARNING: To reduce the risk of personal injury or damage to the equipment, observe
local occupational health and safety requirements and guidelines for manual material
handling.
These symbols, on power supplies or systems, indicate that the equipment is supplied
by multiple sources of power.
WARNING: To reduce the risk of injury from electric shock, remove all power cords to
completely disconnect power from the system.
Rack warnings
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
•
•
•
•
•
The leveling jacks are extended to the floor.
The full weight of the rack rests on the leveling jacks.
The stabilizing feet are attached to the rack if it is a single-rack installation.
The racks are coupled together in multiple-rack installations.
Only one component is extended at a time. A rack may become unstable if more than one
component is extended for any reason.
WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:
• At least two people are needed to safely unload the rack from the pallet. An empty 42U rack
can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might
become unstable when being moved on its casters.
• Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle
the rack from both sides.
WARNING: To reduce the risk of personal injury or damage to the equipment, adequately
stabilize the rack before extending a component outside the rack. Extend only one component at
a time. A rack may become unstable if more than one component is extended.
WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately
secured at the top and bottom to the building structure.
Preparation procedures
To access some components and perform certain service procedures, you must perform one or more of the
following procedures:
Removal and replacement procedures
25
•
Power down the server (on page 26).
If you must remove a server from a rack or a non-hot-plug component from a server, power down the
server.
•
Remove the tower bezel (on page 27).
•
Remove the rack bezel.
•
Extend the server from the rack (on page 28).
If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet,
you can use the locking feature of the rack rails to support the server and gain access to internal
components.
For more information about telco rack solutions, refer to the RackSolutions.com website
(http://www.racksolutions.com/hp).
Power up the server
To power up the server:
1.
Connect each power cord to the server.
2.
Connect each power cord to the power source.
3.
Press the Power On/Standby button.
The server exits standby mode and applies full power to the system. The system power LED changes
from amber to green.
Power down the server
Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical
server data and programs.
IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the
system.
To power down the server, use one of the following methods:
•
Press and release the Power On/Standby button.
This method initiates a controlled shutdown of applications and the OS before the server enters standby
mode.
•
Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter
standby mode.
This method forces the server to enter standby mode without properly exiting applications and the OS.
If an application stops responding, you can use this method to force a shutdown.
•
Use a virtual power button selection through iLO 4.
This method initiates a controlled remote shutdown of applications and the OS before the server enters
standby mode.
Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.
Removal and replacement procedures
26
Remove the security bezel
Unlock the security bezel, press the latch on the security bezel, and then remove the security bezel.
Remove the tower bezel
This server has a removable bezel that must be unlocked and opened before accessing the hard drives. The
bezel must be kept closed during normal server operations.
1.
Using the key provided with the server, unlock the bezel with a clockwise turn.
2.
Remove the tower bezel.
Remove the rack bezel
1.
If installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
Removal and replacement procedures
27
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 29).
6.
Loosen the rack bezel thumbscrews located inside the chassis.
7.
Remove the rack bezel.
Extend the server from the rack
IMPORTANT: If the server is installed in a telco rack, remove the server from the rack to access
internal components.
1.
Pull down the quick release levers on each side of the server.
2.
Extend the server from the rack.
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is
adequately stabilized before extending a component from the rack.
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release
latches and sliding the server into the rack. The sliding rails could pinch your fingers.
Removal and replacement procedures
28
3.
After performing the installation or maintenance procedure, slide the server back into the rack, and then
press the server firmly into the rack to secure it in place.
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release
latches and sliding the server into the rack. The sliding rails could pinch your fingers.
Access panel
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can
lead to thermal damage.
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
5.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
Open the locking latch, slide the access panel to the rear of the chassis, and then remove the access
panel.
If the locking latch is locked, use a T-15 Torx screwdriver to unlock it.
Removal and replacement procedures
29
To replace the component, reverse the removal procedure.
Air baffle
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 29).
6.
Remove the air baffle.
To replace the component, reverse the removal procedure.
PCI air baffles
To remove the component:
1.
2.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
Power down the server (on page 26).
Removal and replacement procedures
30
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 29).
6.
Remove the PCI air baffles.
To replace the component, reverse the removal procedure.
Fan blank
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
5.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
Remove the access panel ("Access panel" on page 29).
Removal and replacement procedures
31
6.
Remove the fan blank.
To replace the component, reverse the removal procedure.
Fan
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
5.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
Remove the access panel ("Access panel" on page 29).
Removal and replacement procedures
32
6.
Remove the fan.
To replace the component, reverse the removal procedure.
Fan cage
IMPORTANT: When installing or replacing server components, one or more fans might need to
be removed. To prevent an orderly or immediate server shutdown, HP highly recommends
powering down the server during these procedures. To determine if powering down is required,
see the specific procedure.
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 29).
6.
Remove the air baffle ("Air baffle" on page 30).
Removal and replacement procedures
33
7.
Remove the fan cage.
To replace the component, reverse the removal procedure.
Tower feet
NOTE: This procedure applies to tower servers only.
To remove the component:
1.
Open and remove the bezel ("Remove the tower bezel" on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
Removal and replacement procedures
34
4.
Place the server on the side.
5.
Remove the tower feet.
To replace the component, reverse the removal procedure.
Component box blank
To remove the component:
1.
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
2.
For rack models, do the following:
a. If installed, remove the security bezel (on page 27).
b. Power down the server (on page 26).
c.
Remove all power:
i.
Disconnect each power cord from the power source.
Removal and replacement procedures
35
ii. Disconnect each power cord from the server
d. Remove the access panel ("Access panel" on page 29).
e. Remove the rack bezel.
3.
Remove the component box blank.
To replace the component, reverse the removal procedure.
Drive blank
To remove the component:
1.
2.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if install, remove the security bezel (on page 27).
Remove the drive blank.
To replace the component, reverse the removal procedure.
Drive
Removal and replacement procedures
36
WARNING: To reduce the risk of injury from electric shock, do not remove more than one drive
carrier at a time.
To remove the component:
1.
2.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
Remove the drive.
To replace the component, reverse the removal procedure.
Optical drive cage
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
For tower models, do the following:
a. Place the server on a flat, level surface with the access panel facing up.
b. Remove the access panel ("Access panel" on page 29).
5.
For rack models, do the following:
a. Extend the server from the rack (on page 28).
b. Remove the access panel ("Access panel" on page 29).
o
Release thumbscrews and remove the rack bezel.
6.
Remove the air baffle ("Air baffle" on page 30).
7.
Remove the fan cage.
8.
Disconnect the data cable and the power cable from the rear of the optical drive cage.
Removal and replacement procedures
37
9.
Using the T-15 screwdriver, loosen T-15 screws securing the optical drive cage.
10.
Remove the optical drive cage.
To replace the component, reverse the removal procedure.
Optical drive
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
Removal and replacement procedures
38
b. Disconnect each power cord from the server.
4.
For tower models, do the following:
a. Place the server on a flat, level surface with the access panel facing up.
b. Remove the access panel ("Access panel" on page 29).
5.
For rack models, do the following:
a. Extend the server from the rack (on page 28).
b. Remove the access panel ("Access panel" on page 29).
c.
Release thumbscrews and remove the rack bezel.
6.
Remove the air baffle ("Air baffle" on page 30).
7.
Remove the fan cage.
8.
Disconnect and remove the optical drive power and data cables.
9.
Remove the optical drive.
To replace the component, reverse the removal procedure.
Front I/O assembly
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
For tower models, do the following:
a. Place the server on a flat, level surface with the access panel facing up.
Removal and replacement procedures
39
b. Remove the access panel ("Access panel" on page 29).
5.
For rack models, do the following:
a. Extend the server from the rack (on page 28).
b. Remove the access panel ("Access panel" on page 29).
c.
Release thumbscrews and remove the rack bezel.
6.
Remove the air baffle ("Air baffle" on page 30).
7.
Remove the fan cage.
8.
Remove the front I/O module assembly.
To replace the component, reverse the removal procedure.
Power supply blank
Remove the blank.
To replace the component, reverse the removal procedure.
Removal and replacement procedures
40
Power supply module
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Access the product rear panel.
5.
If removing a DC power supply, first remove the grounding wire.
6.
Remove the power supply.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or
power supply blank to cool before touching it.
To replace the component, reverse the removal procedure.
Power supply backplane
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
Removal and replacement procedures
41
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
5.
Access the product rear panel.
6.
Remove all power supply modules from the power supply cage ("Power supply module" on page 41).
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or
power supply blank to cool before touching it.
7.
Remove the screws, and slide the power supply cage out of the server:
o
Two-bay power supply configuration
Removal and replacement procedures
42
o
8.
Four-bay power supply configuration
Loosen the two thumbscrews, and remove the power supply backplane from the cage:
o
Two-bay power supply backplane board
Removal and replacement procedures
43
o
Four-bay power supply backplane board
To replace the component, reverse the removal procedure, if the screws are not attached to the backplane
assembly, use the screws provided in the spare backplane assembly kit.
Expansion board
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 29).
6.
Remove the air baffle ("Air baffle" on page 30).
Removal and replacement procedures
44
7.
Open the PCI retainer latch.
8.
Remove the expansion board.
NOTE: If removing an expansion board from slots 3, 6 or 8, first release the retaining lever on
the system board and then remove the card from the system.
To replace the component, reverse the removal procedure.
Graphic card adapter
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
Removal and replacement procedures
45
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 29).
6.
Remove the air baffle ("Air baffle" on page 30).
7.
Loosen the screws, and then remove the graphic card bracket.
8.
Open the PCI retainer latch.
Removal and replacement procedures
46
9.
Disconnect the cables from the graphic card.
10.
Remove the graphic card.
To replace the component, reverse the removal procedure.
Cache module
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be
powered down and the last to be powered back up. Taking this precaution ensures that the system
does not erroneously mark the drives as failed when the server is powered up.
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
Removal and replacement procedures
47
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 29).
6.
Remove the air baffle ("Air baffle" on page 30).
7.
Disconnect the capacitor pack cable from the cache module.
8.
Remove the cache module.
To replace the component, reverse the removal procedure.
FBWC capacitor pack
Removal and replacement procedures
48
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove
the battery pack while an array capacity expansion, RAID level migration, or stripe size migration
is in progress.
CAUTION: After the server is powered down, wait for 30 seconds and then check the amber LED
before disconnecting the cable from the cache module. If the amber LED flashes after 30 seconds,
do not disconnect the cable from the cache module. The cache module is backing up data, and
data will be lost if the cable is disconnected while the amber LED is still flashing.
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 29).
6.
Remove the air baffle ("Air baffle" on page 30).
7.
Remove the fan cage.
8.
Disconnect the cable from the cache module only if the capacitor pack is not being used to recover data
from the server or transfer data to another server.
9.
Remove the capacitor pack.
To replace the component, reverse the removal procedure.
Removal and replacement procedures
49
SFF drive backplane
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
For tower models, do the following:
a. Place the server on a flat, level surface with the access panel facing up.
b. Remove the access panel ("Access panel" on page 29).
5.
For rack models, do the following:
a. Extend the server from the rack (on page 28).
b. Remove the access panel ("Access panel" on page 29).
c.
Release thumbscrews and remove the rack bezel.
6.
Disconnect all cables from the drive backplane.
7.
Using a T-15 screwdriver, remove the screws that secure the SFF drive cage to the server.
Removal and replacement procedures
50
8.
Remove the SFF drive cage.
9.
Remove all drives from the drive cage ("Drive" on page 36).
10.
Loosen the thumbscrew on the drive backplane and remove it from the cage.
To replace the component, reverse the removal procedure.
LFF drive backplane
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
Removal and replacement procedures
51
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
For tower models, do the following:
a. Place the server on a flat, level surface with the access panel facing up.
b. Remove the access panel ("Access panel" on page 29).
5.
For rack models, do the following:
a. Extend the server from the rack (on page 28).
b. Remove the access panel ("Access panel" on page 29).
c.
Release thumbscrews and remove the rack bezel.
6.
Disconnect all cables from the drive backplane.
7.
Using a T-15 screwdriver, remove the screws that secure the LFF drive cage to the server.
8.
Remove the LFF drive cage.
Removal and replacement procedures
52
9.
Remove all drives from the drive cage ("Drive" on page 36).
10.
Loosen the thumbscrew on the drive backplane and remove it from the cage.
To replace the component, reverse the removal procedure.
Systems Insight Display assembly
CAUTION: When routing cables, always be sure that the cables are not in a position where they
can be pinched or crimped.
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
For tower models, do the following:
a. Place the server on a flat, level surface with the access panel facing up.
b. Remove the access panel ("Access panel" on page 29).
5.
For rack models, do the following:
a. Extend the server from the rack (on page 28).
b. Remove the access panel ("Access panel" on page 29).
c.
Release thumbscrews and remove the rack bezel.
6.
Disconnect the cable that connects the Systems Insight Display assembly to the system board.
7.
Remove the thumbscrews securing the Systems Insight Display assembly.
Removal and replacement procedures
53
8.
Remove the Systems Insight Display assembly.
To replace the component, reverse the removal procedure.
Heatsink
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 29).
6.
Remove the air baffle ("Air baffle" on page 30).
Removal and replacement procedures
54
7.
Open the heatsink retaining levers.
8.
Remove the heatsink.
To replace the heatsink:
1.
Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol to
evaporate before continuing.
Removal and replacement procedures
55
2.
Remove the heatsink protective cover.
3.
Install the heatsink, and then close the heatsink retaining levers.
4.
Install the air baffle.
5.
Install the access panel.
6.
Do one of the following:
o
For tower models, return the server to an upright position, and then install the bezel.
o
For rack models, slide the server back into the rack.
7.
Connect each power cord to the server.
8.
Connect each power cord to the power source.
9.
Press the Power On/Standby button.
The server exits standby mode and applies full power to the system. The system power LED changes
from amber to green.
Removal and replacement procedures
56
Heatsink Retaining Levers
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 29).
6.
Remove the air baffle ("Air baffle" on page 30).
7.
Open the heatsink retaining levers.
Removal and replacement procedures
57
8.
Remove the heatsink.
9.
Remove the heatsink retaining levers.
To replace the component, reverse the removal procedure.
Processor
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor
configurations must contain processors with the same part number.
CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the
heatsink is removed from the processor after it has been installed.
CAUTION: To prevent possible server overheating, always populate processor socket 2 with a
processor and a heatsink or a processor socket cover and a heatsink blank.
IMPORTANT: Processor socket 1 must be populated at all times or the server does not function.
Removal and replacement procedures
58
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 29).
6.
Remove the air baffle ("Air baffle" on page 30).
7.
Open the heatsink retaining levers.
Removal and replacement procedures
59
8.
Remove the heatsink.
9.
Open each of the processor locking levers in the order indicated, and then open the processor retaining
bracket.
Removal and replacement procedures
60
10.
Remove the processor from the processor retaining bracket.
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,
especially the contact area.
To install a processor:
1.
Install the processor. Verify that the processor is fully seated in the processor retaining bracket by
visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE
SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
Removal and replacement procedures
61
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To
avoid damage to the system board, do not touch the processor or the processor socket contacts.
2.
Close the processor retaining bracket. When the processor is installed properly inside the processor
retaining bracket, the processor retaining bracket clears the flange on the front of the socket.
CAUTION: Do not press down on the processor. Pressing down on the processor may cause
damage to the processor socket and the system board. Press only in the area indicated on the
processor retaining bracket.
3.
Press and hold the processor retaining bracket in place, and then close each processor locking lever.
Press only in the area indicated on the processor retaining bracket.
4.
Use the alcohol swab to remove all the existing thermal grease from the heatsink. Allow the alcohol to
evaporate before continuing.
5.
Apply the thermal grease to the top of the processor in the following pattern.
Removal and replacement procedures
62
6.
Install the heatsink, and then close the heatsink retaining levers.
7.
Install the air baffle.
8.
Install the access panel.
9.
Do one of the following:
o
For tower models, return the server to an upright position.
o
For rack models, slide the server back into the rack.
10.
Connect each power cord to the server.
11.
Connect each power cord to the power source.
12.
Press the Power On/Standby button.
The server exits standby mode and applies full power to the system. The system power LED changes
from amber to green.
13.
Do one of the following:
o
For tower models, install the bezel.
o
For rack models, if removed, install the security bezel.
DIMMs
CAUTION: To avoid damage to the hard drives, memory, and other system components, the air
baffle, drive blanks, and access panel must be installed when the server is powered up.
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
Removal and replacement procedures
63
b. Disconnect each power cord from the server.
4.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
5.
Remove the access panel ("Access panel" on page 29).
6.
Remove the air baffle ("Air baffle" on page 30).
7.
Open the DIMM slot latches..
8.
Remove the DIMM.
To replace the component, reverse the removal procedure.
System board
IMPORTANT: If replacing the system board or clearing NVRAM, you must re-enter the server
serial number through RBSU.
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
5.
Do one of the following:
o
For tower models, place the server on a flat, level surface with the access panel facing up.
o
For rack models, extend the server from the rack (on page 28).
Remove the access panel ("Access panel" on page 29).
Removal and replacement procedures
64
6.
Remove the air baffle ("Air baffle" on page 30).
7.
Remove the fan cage.
8.
Remove all DIMMs ("DIMMs" on page 63).
9.
Remove any installed PCI cards.
10.
Remove the PCI card support bracket on both sides.
11.
Disconnect all cables connected to the system board.
12.
Open the heatsink retaining levers.
Removal and replacement procedures
65
13.
Remove the heatsink.
14.
Open each of the processor locking levers in the order indicated, and then open the processor retaining
bracket.
Removal and replacement procedures
66
15.
Remove the processor from the processor retaining bracket.
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,
especially the contact area.
CAUTION: To avoid damage to the system board:
• Do not touch the processor socket contacts.
• Always install the processor socket cover after removing the processor from the socket.
• Do not tilt or slide the processor when lowering the processor into the socket.
CAUTION: Removal of the processor or heatsink renders the thermal layer between the
processor and heatsink useless. Clean the component with the provided alcohol swab, then add
thermal grease.
16.
Loosen the four system board thumbscrews.
17.
Using the system board tray handles, slide the tray forward, and then remove the failed system board.
Removal and replacement procedures
67
To replace the system board:
1.
Install the spare system board.
2.
Open each of the processor locking levers in the order indicated, and then open the processor retaining
bracket.
Removal and replacement procedures
68
3.
Remove the clear processor socket cover. Retain the processor socket cover for future use.
4.
Install the processor. Verify that the processor is fully seated in the processor retaining bracket by
visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE
SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To
avoid damage to the system board, do not touch the processor or the processor socket contacts.
5.
Close the processor retaining bracket. When the processor is installed properly inside the processor
retaining bracket, the processor retaining bracket clears the flange on the front of the socket.
Removal and replacement procedures
69
CAUTION: Do not press down on the processor. Pressing down on the processor may cause
damage to the processor socket and the system board. Press only in the area indicated on the
processor retaining bracket.
6.
Press and hold the processor retaining bracket in place, and then close each processor locking lever.
Press only in the area indicated on the processor retaining bracket.
7.
Install the processor socket cover onto the processor socket of the failed system board.
8.
Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.
Allow the alcohol to evaporate before continuing.
9.
Apply all the grease to the top of the processor in the following pattern to ensure even distribution.
Removal and replacement procedures
70
10.
Install the heatsink, and then close the heatsink retaining levers.
11.
Install the processor socket cover onto the processor socket of the failed system board.
IMPORTANT: Install all components with the same configuration that was used on the failed
system board.
12.
Install all components removed from the failed system board.
13.
Install the access panel.
14.
Do one of the following:
o
For tower models, return the server to an upright position.
o
For rack models, slide the server back into the rack.
15.
Connect each power cord to the server.
16.
Connect each power cord to the power source.
17.
Press the Power On/Standby button.
The server exits standby mode and applies full power to the system. The system power LED changes
from amber to green.
18.
Do one of the following:
o
For tower models, install the bezel.
o
For rack models, if removed, install the security bezel.
After you replace the system board, you must re-enter the server serial number and the product ID.
1.
During the server startup sequence, press the F9 key to access RBSU.
2.
Select the Advanced Options menu.
3.
Select Service Options.
4.
Select Serial Number. The following warnings appear:
WARNING! WARNING! WARNING! The serial number is loaded into the system during
the manufacturing process and should NOT be modified. This option should only
be used by qualified service personnel. This value should always match the
serial number sticker located on the chassis.
Removal and replacement procedures
71
Warning: The serial number should ONLY be modified by qualified personnel.
This value should always match the serial number located on the chassis.
5.
Press the Enter key to clear the warning.
6.
Enter the serial number and press the Enter key.
7.
Select Product ID. The following warning appears:
Warning: The Product ID should ONLY be modified by qualified personnel. This
value should always match the Product ID on the chassis.
8.
Enter the product ID and press the Enter key.
9.
Press the Esc key to close the menu.
10.
Press the Esc key to exit RBSU.
11.
Press the F10 key to confirm exiting RBSU. The server automatically reboots.
System battery
If the server no longer automatically displays the correct date and time, you might have to replace the battery
that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not
properly handled. To reduce the risk of personal injury:
•
•
•
•
Do not attempt to recharge the battery.
Do not expose the battery to temperatures higher than 60°C (140°F).
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
Replace only with the spare designated for this product.
To remove the component:
1.
Do one of the following:
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 27).
o
For rack models, if installed, remove the security bezel (on page 27).
2.
Power down the server (on page 26).
3.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
4.
For tower models, do the following:
a. Place the server on a flat, level surface with the access panel facing up.
b. Remove the access panel ("Access panel" on page 29).
5.
For rack models, do the following:
a. Extend the server from the rack (on page 28).
b. Remove the access panel ("Access panel" on page 29).
c.
6.
Release thumbscrews and remove the rack bezel.
Remove the air baffle ("Air baffle" on page 30).
Removal and replacement procedures
72
7.
Remove the battery.
IMPORTANT: Replacing the system board battery resets the system ROM to its default
configuration. After replacing the battery, reconfigure the system through RBSU.
For more information about battery replacement or proper disposal, contact an authorized reseller or an
authorized service provider.
HP Trusted Platform Module
The TPM is not a customer-removable part.
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM,
administrators should consider the system compromised and take appropriate measures to ensure
the integrity of the system data.
If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP
authorized service provider for a replacement system board and TPM board.
Removal and replacement procedures
73
Troubleshooting
Troubleshooting resources
The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving
common problems and comprehensive courses of action for fault isolation and identification, issue resolution,
and software maintenance on ProLiant servers and server blades. To view the guide, select a language:
•
English (http://www.hp.com/support/ProLiant_TSG_v1_en)
•
French (http://www.hp.com/support/ProLiant_TSG_v1_fr)
•
Spanish (http://www.hp.com/support/ProLiant_TSG_v1_sp)
•
German (http://www.hp.com/support/ProLiant_TSG_v1_gr)
•
Japanese (http://www.hp.com/support/ProLiant_TSG_v1_jp)
•
Simplified Chinese (http://www.hp.com/support/ProLiant_TSG_v1_sc)
The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages
and information to assist with interpreting and resolving error messages on ProLiant servers and server
blades. To view the guide, select a language:
•
English (http://www.hp.com/support/ProLiant_EMG_v1_en)
•
French (http://www.hp.com/support/ProLiant_EMG_v1_fr)
•
Spanish (http://www.hp.com/support/ProLiant_EMG_v1_sp)
•
German (http://www.hp.com/support/ProLiant_EMG_v1_gr)
•
Japanese (http://www.hp.com/support/ProLiant_EMG_v1_jp)
•
Simplified Chinese (http://www.hp.com/support/ProLiant_EMG_v1_sc)
Troubleshooting
74
Diagnostic tools
HP Insight Diagnostics
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions,
that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server
installations, troubleshoot problems, and perform repair validation.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS
is not running. To run this utility, launch the SmartStart CD.
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and
other related data needed for effective server management. Available in Microsoft® Windows® and Linux
versions, the utility helps to ensure proper system operation.
For more information or to download the utility, refer to the HP website (http://www.hp.com/servers/diags).
HP Insight Diagnostics survey functionality
HP Insight Diagnostics (on page 75) provides survey functionality that gathers critical hardware and software
information on ProLiant servers.
This functionality supports operating systems that may not be supported by the server. For operating systems
supported by the server, see the HP website (http://www.hp.com/go/supportos).
If a significant change occurs between data-gathering intervals, the survey function marks the previous
information and overwrites the survey data files to reflect the latest changes in the configuration.
Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can be
installed through the HP PSP.
NOTE: The current version of SmartStart provides the memory spare part numbers for the server.
To download the latest version, see the HP website (http://www.hp.com/support).
Integrated Management Log
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event
with 1-minute granularity.
You can view recorded events in the IML in several ways, including the following:
•
From within HP SIM
•
From within Survey Utility
•
From within operating system-specific IML viewers
o
For NetWare: IML Viewer (does not apply to HP ProLiant DL980 Servers)
o
For Windows®: IML Viewer
o
For Linux: IML Viewer Application
Diagnostic tools
75
•
From within the iLO 4 user interface
•
From within HP Insight Diagnostics (on page 75)
For more information, see the Management CD or DVD in the HP Insight Foundation suite for ProLiant.
HP Insight Remote Support software
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or
upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or
HP contractual support agreement. HP Insight Remote Support supplements your monitoring 24 x 7 to ensure
maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of
hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s
service level. Notifications may be sent to your authorized HP Channel Partner for on-site service, if
configured and available in your country. The software is available in two variants:
•
HP Insight Remote Support Standard: This software supports server and storage devices and is
optimized for environments with 1–50 servers. Ideal for customers who can benefit from proactive
notification but do not need proactive service delivery and integration with a management platform.
•
HP Insight Remote Support Advanced: This software provides comprehensive remote monitoring and
proactive service support for nearly all HP servers, storage, network, and SAN environments, plus
selected non-HP servers that have a support obligation with HP. It is integrated with HP Systems Insight
Manager. A dedicated server is recommended to host both HP Systems Insight Manager and HP Insight
Remote Support Advanced.
Details for both versions are available on the HP website (http://www.hp.com/go/insightremotesupport).
To download the software, go to Software Depot (http://www.software.hp.com).
Select Insight Remote Support from the menu on the right.
USB support
HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by
the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB
devices through legacy USB support, which is enabled by default in the system ROM.
Legacy USB support provides USB functionality in environments where USB support is not available normally.
Specifically, HP provides legacy USB functionality for the following:
•
POST
•
RBSU
•
Diagnostics
•
DOS
•
Operating environments which do not provide native USB support
Diagnostic tools
76
Component identification
Front panel components
•
SFF
Item
Description
1
Media/Drive cage bay
2
SAS/SATA drives (8)
3
Serial number/iLO information pull tab*
4
Optical drive
5
USB connectors (4)
*The serial number/iLO information pull tab is double-sided. The top side shows the server serial number, and the reverse
side shows the default iLO account information. The same information is printed on a label attached to the chassis.
Component identification 77
•
LFF
Item
Description
1
Media/Drive cage bay
2
SAS/SATA drive (6)
3
Serial number/iLO information pull tab*
4
Optical drive
5
USB connectors (4)
*The serial number/iLO information pull tab is double-sided. The top side shows the server serial number, and the reverse
side shows the default iLO account information. The same information is printed on a label attached to the chassis.
Front panel LEDs and buttons
Component identification 78
Item
Description
Status
1
Power On/Standby button
and system power LED
Solid green = System on
Flashing green (1 Hz/cycle per sec) = Performing power on sequence
Solid amber = System in standby
Off = No power present*
2
NIC status LED
Solid green = Link to network
Flashing green (1 Hz/cycle per sec) = Network active
Off = No network activity
3
Health LED
Solid green = Normal
Flashing amber = System degraded
Flashing red (1 Hz/cycle per sec) = System critical
Fast-flashing red (4 Hz/cycles per sec) = Power fault**
4
UID button/LED
Solid blue = Activated
Flashing blue (1 Hz/cycle per sec) = Remote management or
firmware upgrade in progress
Off = Deactivated
*Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has
occurred, or the power button cable is disconnected.
**To identify components in a degraded or critical state, see the Systems Insight Display LEDs ("Systems Insight Display
assembly" on page 53), check iLO/BIOS logs, and reference the server troubleshooting guide.
Rear panel components
Item
Description
1
Power supply 4
2
Power supply 3
3
Power supply 2
4
Power supply 1
5
PCIe slot 1 (Processor 1)
6
PCIe slot 2 (Processor 1)
7
PCIe slot 3 (Processor 1)
Component identification 79
Item
Description
8
PCIe slot 4 (Processor 1)
9
UID button/LED
10
Kensington security lock
11
Serial connector
12
iLO connector
13
NIC connector 3
14
NIC connector 4
15
NIC connector 2
16
NIC connector 1
17
USB connectors (4)
18
Video connector
19
PCIe slot 5 (Processor 2)
20
PCIe slot 6 (Processor 2)
21
PCIe slot 7 (Processor 2)
22
PCIe slot 8 (Processor 2)
23
PCIe slot 9 (Processor 2)
Rear panel LEDs
Item
Description
Status
1
NIC activity LED
Green or flashing green = Network activity
Off = No network activity
2
NIC link LED
Green = Linked to network
Off = No network connection
Component identification 80
Item
Description
Status
3
Power supply LED
Green = Normal
Off = One or more of the following conditions exists:
•
•
•
•
Power
Power
Power
Power
is unavailable.
supply failed.
supply is in standby mode.
supply exceeded current limit.
4
UID LED
Blue = Activated
Flashing blue = System is being managed remotely
Off = Deactivated
5
iLO 4 link LED
Green = Linked to network
Off = No network connection
6
iLO 4 activity LED
Green or flashing green = Network activity
Off = No network activity
System board components
Item
Description
1
Slot 1 PCIe3 x16 (8, 4, 1)
2
Slot 2 PCIe3 x8 (4, 1)
3
Slot 3 PCIe3 x16 (16, 8, 4, 1)
4
Slot 4 PCIe3 x8 (4, 1)
5
Processor 1 DIMM slots
6
Smart Array P420i memory cache module
7
Mini-SAS connectors (2)
8
Processor 2 DIMM slots
9
Processor socket 2
10
SD card slot
11
Front panel connectors (2)
12
Fan cage connector
Component identification 81
Item
Description
13
Internal USB tape connector
14
Discovery service cable connector
15
System battery
16
SATA connectors
17
Internal USB connector
18
Processor 2 DIMM slots
19
TPM connector
20
System maintenance switch
21
NMI header
22
Slot 9 PCIe3 x8 (4, 1)
23
Slot 8 PCIe3 x16 ( 16, 8, 4, 1)
24
Slot 7 PCIe3 x8 (4, 1)
25
Slot 6 PCIe3 x16 (16, 8, 4, 1)
26
Slot 5 PCIe2 x8 (4, 1)
27
Processor 1 DIMM slots
28
Processor socket 1 (populated)
System maintenance switch
Position
Default
Function
S1
Off
Off = iLO 4 security is enabled.
On = iLO 4 security is disabled.
S2
Off
Off = System configuration can be
changed.
On = System configuration is locked.
S3
Off
Reserved
S4
Off
Reserved
S5
Off
Off = Power-on password is enabled.
On = Power-on password is disabled.
S6
Off
Off = No function
On = ROM reads system configuration
as invalid.
S7
—
Reserved
S8
—
Reserved
S9
—
Reserved
S10
—
Reserved
S11
—
Reserved
S12
—
Reserved
To access the redundant ROM, set S1, S5, and S6 to on.
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all
system configuration settings from both CMOS and NVRAM.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to
properly configure the server or data loss could occur.
Component identification 82
NMI functionality
An NMI crash dump creates a crash dump log before resetting a system which is not responding.
Crash dump log analysis is an essential part of diagnosing reliability problems, such as failures of operating
systems, device drivers, and applications. Many crashes freeze a system, and the only available action for
administrators is to restart the system. Resetting the system erases any information which could support
problem analysis, but the NMI feature preserves that information by performing a memory dump before a
system reset.
To force the system to invoke the NMI handler and generate a crash dump log, do one of the following:
•
Use the iLO Virtual NMI feature.
•
Short the NMI header ("System board components" on page 81).
For more information, see the HP website (http://www.hp.com/support/NMI).
DIMM slots
DIMM slots are numbered sequentially (1 through 12) for each processor. The supported AMP modes use the
letter assignments for population guidelines.
NOTE: For proper orientation, the arrow indicates the front of the server.
Component identification 83
Systems Insight Display LEDs
The HP Systems Insight Display LEDs represent the system board layout.
Item
Description
Status
1
Power cap
To determine Power cap status, see
"Systems Insight Display LED combinations
(on page 84)."
2
AMP Status
Green = AMP mode enabled
Amber = Failover
Off = AMP mode disabled
3
DIMM LEDs
Amber = DIMM error
Off = Normal
All other LEDs
Amber = Failure
Off = Normal
IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.
Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing
each DIMM in a bank with a known working DIMM.
Systems Insight Display LED combinations
When the health LED on the front panel illuminates either amber or red, the server is experiencing a health
event. Combinations of illuminated Systems Insight Display LEDs, the system power LED, and the health LED
indicate system status.
Component identification 84
Systems Insight Display Health LED
LED and color
Processor (amber)
Red
System power
LED
Status
Amber
One or more of the following conditions
might exist:
•
•
•
•
Processor in socket X has failed.
Processor X is not installed in the socket.
Processor X is unsupported.
ROM detects a failed processor during
POST
Processor (amber)
Amber
Green
Processor in socket X is in a pre-failure
condition.
DIMM (amber)
Red
Green
One or more DIMMs have failed.
DIMM (amber)
Amber
Green
DIMM in slot X is in a pre-failure condition.
Overtemperature (amber)
Amber
Green
The Health Driver has detected a cautionary
temperature level.
Overtemperature (amber)
Red
Amber
The server has detected a hardware critical
temperature level.
Fan (amber)
Amber
Green
Fan has failed or is missing, but still meets the
minimum fan requirements.
Fan (amber)
Red
Green
Fan has failed or is missing and no longer
meets the minimum fan requirements.
Power supply (amber)
Red
Amber
•
•
•
Power supply (amber)
Amber
Green
•
•
•
•
Only one power supply installed and in
standby mode.
Power supply fault
System board fault
Redundant power supply is installed and
only one power supply is functional.
AC power cord is not plugged into
redundant power supply.
Redundant power supply fault
Power supply mismatch at POST or
through hot-plug addition.
Power cap (off)
—
Amber
Standby
Power cap (green)
—
Flashing green
Waiting for power
Power cap (flashing
amber)
—
Amber
Power cap has been exceeded
Power cap (green)
—
Green
Power is available
IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.
Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing
each DIMM in a bank with a known working DIMM.
SAS and SATA device numbers
With optional drive cages installed, the server supports up to 24 SFF drives or up to 18 LFF drives. The server
does not support mixing SFF and LFF drives.
Component identification 85
HP recommends that you populate drive bays starting with the lowest SAS or SATA device number. Drives
are numbered from left to right in each component box. Component boxes are numbered 1 through 3, from
bottom to top.
•
SFF drives
•
LFF drives
Component identification 86
Hot-plug drive LED definitions
Item
LED
Status
1
Locate
Solid blue
The drive is being identified by a host application.
Flashing blue
The drive carrier firmware is being updated or requires an update.
Rotating green
Drive activity
Off
No drive activity
Solid white
Do not remove the drive. Removing the drive causes one or more of
the logical drives to fail.
Off
Removing the drive does not cause a logical drive to fail.
Solid green
The drive is a member of one or more logical drives.
Flashing green
The drive is rebuilding or performing a RAID migration, strip size
migration, capacity expansion, or logical drive extension, or is
erasing.
Flashing
amber/green
The drive is a member of one or more logical drives and predicts
the drive will fail.
Flashing amber
The drive is not configured and predicts the drive will fail.
Solid amber
The drive has failed.
Off
The drive is not configured by a RAID controller.
2
3
4
Activity ring
Do not remove
Drive status
Definition
Fans
IMPORTANT: Fan louvers must be present for the redundant configuration. Without the louvers,
all four fans are nonredundant.
Component identification 87
Item
Description
Configuration
1
Fan 1
Redundant (primary fan
when processor 2 is
installed)
2
Fan 2
Primary
3
Fan 3
Primary
4
Fan 4
Primary
FBWC module LEDs (P222, P420, P420i, P421,
P822)
The FBWC module has three single-color LEDs (one amber and two green). The LEDs on the cache module
installed on a storage controller are duplicated on the reverse side of the module to facilitate status viewing.
1 - Amber
2 - Green
3 - Green
Interpretation
Off
Off
Off
The cache module is not powered.
Component identification 88
1 - Amber
2 - Green
3 - Green
Interpretation
Off
Flashing 0.5 Hz
Flashing 0.5 Hz
The cache microcontroller is executing from within its
boot loader and receiving new flash code from the host
controller.
Off
Flashing 1 Hz
Flashing 1 Hz
The cache module is powering up, and the capacitor
pack is charging.
Off
Off
Flashing 1 Hz
The cache module is idle, and the capacitor pack is
charging.
Off
Off
On
The cache module is idle, and the capacitor pack is
charged.
Off
On
On
The cache module is idle, the capacitor pack is charged,
and the cache contains data that has not yet been
written to the drives.
Off
Flashing 1 Hz
Off
A backup is in progress.
Off
On
Off
The current backup is complete with no errors.
Flashing 1 Hz
Flashing 1 Hz
Off
The current backup failed, and data has been lost.
Flashing 1 Hz
Flashing 1 Hz
On
A power error occurred during the previous or current
boot. Data might be corrupt.
Flashing 1 Hz
On
Off
An overtemperature condition exists.
Flashing 2 Hz
Flashing 2 Hz
Off
The capacitor pack is not attached.
Flashing 2 Hz
Flashing 2 Hz
On
The capacitor has been charging for 10 minutes, but
has not reached sufficient charge to perform a full
backup.
On
On
Off
The current backup is complete, but power fluctuations
occurred during the backup.
On
On
On
The cache module microcontroller has failed.
RPS riser board connectors
Item
Connector
Description
1
J7
Graphic card power connector
Component identification 89
Item
Connector
Description
2
J9
Drive backplane bay 1/optical drive power connector
3
J5
Drive backplane bay 2 power connector
4
J6
Drive backplane bay 3 power connector
5
J8
Graphic card power connector
Component identification 90
Cabling
Server data cabling
Item
Description
1
Optical drive connector
2
Drive cage 1, SAS connector 2
3
Drive cage 1, SAS connector 1
4
SATA connector
5
SAS connector
6
SAS connector
Cabling 91
Media device data cabling
Item
Description
1
Optical drive connector
2
Optical drive connector
3
Optical drive connector
4
SATA connector
5
SATA connector
6
SATA connector
Optical drive cabling
Cabling 92
Specifications
Environmental specifications
Specification
Value
Temperature range*
Operating
10°C to 35°C (50°F to 95°F)
Nonoperating
-30°C to 60°C (-22°F to 140°F)
Relative humidity
(noncondensing)
Operating, maximum wet bulb 10% to 90%
temperature of 28°C (82.4°F)
Nonoperating, maximum wet 5% to 95%
bulb temperature of 38.7°C
(101.7°F)
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048
m (10,000 ft) is applicable. No direct sunlight allowed.
Server specifications
Specification
Value
Dimensions
Rack model
—
Height
21.8 cm (8.58 in)
Depth
73.22 cm (28.83 in)
Width
48.26 cm (19.00 in)
Tower model
—
Height
46.2 cm (18.19 in)
Depth
74.00 cm (29.13 in)
Width
21.8 cm (8.58 in)
Weight
Rack model
—
Maximum
50.06 kg (110.36 lbs)
Minimum
27.63 kg (60.91 lbs)
Tower model
—
Maximum
52.09 kg (144.84 lbs)
Minimum
31.09 kg (70.33 lbs)
Power supply specifications
Depending on installed options, the server is configured with one of the following power supplies:
Specifications
93
•
HP 460 W Gold Power Supply (92% efficiency)
•
HP 460 W Platinum Plus Power Supply (94% efficiency)
•
HP 750 W Gold Power Supply (92% efficiency)
•
HP 750 W Platinum Plus Power Supply (94% efficiency)
•
HP 1200 W Platinum Plus Power Supply (94% efficiency)
HP 460 W Gold Power Supply (92% efficiency)
Specification
Value
Input requirements
—
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Rated input current
5.5 A at 100 VAC
2.6 A at 200 VAC
Rated input power
526 W at 100V AC input
505 W at 200V AC input
Btus per hour
1794 at 100V AC input
1725 at 200V AC input
Power supply output
—
Rated steady-state power
460 W at 100V to 120V AC input
460 W at 200V to 240V AC input
Maximum peak power
460 W at 100V to 120V AC input
460 W at 200V to 240V AC input
HP 460 W Platinum Plus Power Supply (94% efficiency)
Specification
Value
Input requirements
—
Rated input voltage
100 to 240 VAC
Rated input frequency
47 Hz to 63 Hz
Rated input current
8A
Rated input power
509 W at 115V AC input
495 W at 230V AC input
Btus per hour
1764
1736
1694
1687
Power supply output
—
Rated steady-state power
460 W at 100V to 120V AC input
460 W at 200V to 240V AC input
Maximum peak power
460 W at 100V to 120V AC input
460 W at 200V to 240V AC input
at
at
at
at
100V
115V
200V
230V
AC
AC
AC
AC
input
input
input
input
Specifications
94
HP 750 W Gold Power Supply (92% efficiency)
Specification
Value
Input requirements
—
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Rated input current
8.9 A at 100 VAC
4.3 A at 200 VAC
Rated input power
857 W at 100V AC input
824 W at 200V AC input
Btus per hour
2925 at 100V AC input
2812 at 200V AC input
Power supply output
—
Rated steady-state power
750 W at 100V to 120V AC input
750 W at 200V to 240V AC input
Maximum peak power
750 W at 100V to 120V AC input
750 W at 200V to 240V AC input
HP 750 W Platinum Plus Power Supply (94% efficiency)
Specification
Value
Input requirements
—
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Rated input current
8.5 A at 100 VAC
4.1 A at 200 VAC
Rated input power
831 W at 115V AC input
808 W at 230V AC input
Btus per hour
2878
2834
2769
2758
at
at
at
at
100V
115V
200V
230V
AC
AC
AC
AC
input
input
input
input
Power supply output
—
Rated steady-state power
750 W at 100V to 120V AC input
750 W at 200V to 240V AC input
Maximum peak power
750 W at 100V to 120V AC input
750 W at 200V to 240V AC input
HP 1200 W Platinum Plus Power Supply (94% efficiency)
Specification
Value
Input requirements
—
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Specifications
95
Rated input current
10 A at 100 VAC
6.7 A at 200 VAC
Rated input power
990 W at 115V AC input
1315 W at 230V AC input
Btus per hour
3060
3380
4503
4485
at
at
at
at
100V
115V
200V
230V
AC
AC
AC
AC
input
input
input
input
Power supply output
—
Rated steady-state power
800 W at 100V AC input
900 W at 120V AC input
1200 W at 200V to 240V AC
input
Maximum peak power
800 W at 100V AC input
900 W at 120V AC input
1200 W at 200V to 240V AC
input
Specifications
96
Acronyms and abbreviations
AMP
Advanced Memory Protection
CS HE
HP Common Slot High-Efficiency (power supply)
CSR
Customer Self Repair
FBWC
flash-backed write cache
iLO
Integrated Lights-Out
IML
Integrated Management Log
LFF
large form factor
LRDIMM
load reduced dual in-line memory module
NMI
nonmaskable interrupt
NVRAM
nonvolatile memory
ORCA
Option ROM Configuration for Arrays
PCIe
Peripheral Component Interconnect Express
Acronyms and abbreviations 97
POST
Power-On Self Test
PSP
HP ProLiant Support Pack
RBSU
ROM-Based Setup Utility
RPS
redundant power supply
SAS
serial attached SCSI
SATA
serial ATA
SFF
small form factor
SID
Systems Insight Display
SIM
Systems Insight Manager
TPM
Trusted Platform Module
UID
unit identification
USB
universal serial bus
Acronyms and abbreviations 98
Documentation feedback
HP is committed to providing documentation that meets your needs. To help us improve the documentation,
send any errors, suggestions, or comments to Documentation Feedback (mailto:[email protected]).
Include the document title and part number, version number, or the URL when submitting your feedback.
Documentation feedback
99
Index
A
access panel 29
air baffle 30
B
battery 72
buttons 24, 77
C
cables 91
cabling 91, 92
cache module 47
components 15, 77
connectors 77
crash dump analysis 83
D
data cabling 91
device bay blank 35
device numbers 85
diagnosing problems 74
diagnostic tools 75
diagnostics utility 75
DIMM slots 83
DIMMs 63
drive LEDs 87
drives, removing 36
E
electrostatic discharge 24
environmental requirements 93
error messages 74
expansion board 44
extending server from rack 28
F
fan blank 31
fan cage 33
fans 32, 87
FBWC capacitor pack 48
features 77
firmware upgrade utility, troubleshooting 74
front I/O assembly 39
front panel components 77
front panel LEDs 78
G
graphics card option 45
H
hard drive blanks 36
hard drive LEDs 87
hard drives, determining status of 87
heatsink 54
heatsink levers 57
HP iLO 77
HP Insight Diagnostics 75
HP Insight Diagnostics survey functionality 75
HP Insight Remote Support software 76
I
identifying components 77
IML (Integrated Management Log) 75
Insight Diagnostics 75
L
LEDs, hard drive 87
M
mechanical components 15
media device data cabling 92
memory dump 83
N
NIC connectors 79
NMI header 83
O
operating system crash 83
optical device 38
Index
100
optical drive cage 37
utilities 75
P
W
PCI air baffle 30
POST error messages 74
power LEDs, system 78
power supply blank 40
power supply specifications 93, 94, 95
powering down 26
powering up 26
problem diagnosis 74
processors 58
warnings 25
R
rack bezel 26, 27
rear panel components 79
rear panel LEDs 80
S
safety considerations 24
safety information 24
security bezel 27
server specifications 93
server warnings and cautions 25
specifications, server 93
static electricity 24
symbols on equipment 24
system board battery 72
system board components 81
system board replacement 64
system components 18, 77
system configuration settings 82
system maintenance switch 82
Systems Insight Display 53
Systems Insight Display LEDs 84
T
technical support 5
temperature requirements 93
tower bezel, removing 27
tower feet 34
TPM (Trusted Platform Module) 73
troubleshooting 74
troubleshooting, firmware upgrade utility 74
Trusted Platform Module (TPM) 73
U
USB support 76
Index
101