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DSB75
Development Support Board
Rev. B1
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Hardware Description
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DSB75 Development Support Board Rev. B1 Hardware Description
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Document Name:
DSB75 Development Support Board Rev. B1
Hardware Description
Version:
v08
Date:
September 29, 2005
DocId:
DSB75_hd_v08
Status:
Strictly confidential / Released
General Notes
Product is deemed accepted by Recipient and is provided without interface to Recipient’s products.
The documentation and/or Product are provided for testing, evaluation, integration and information
purposes. The documentation and/or Product are provided on an “as is” basis only and may contain
deficiencies or inadequacies. The Documentation and/or Product are provided without warranty of any
kind, express or implied. To the maximum extent permitted by applicable law, Siemens further
disclaims all warranties, including without limitation any implied warranties of merchantability,
completeness, fitness for a particular purpose and non-infringement of third-party rights. The entire
risk arising out of the use or performance of the Product and documentation remains with Recipient.
This Product is not intended for use in life support appliances, devices or systems where a
malfunction of the product can reasonably be expected to result in personal injury. Applications
incorporating the described product must be designed to be in accordance with the technical
specifications provided in these guidelines. Failure to comply with any of the required procedures can
result in malfunctions or serious discrepancies in results. Furthermore, all safety instructions regarding
the use of mobile technical systems, including GSM products, which also apply to cellular phones
must be followed. Siemens or its suppliers shall, regardless of any legal theory upon which the claim
is based, not be liable for any consequential, incidental, direct, indirect, punitive or other damages
whatsoever (including, without limitation, damages for loss of business profits, business interruption,
loss of business information or data, or other pecuniary loss) arising out the use of or inability to use
the Documentation and/or Product, even if Siemens has been advised of the possibility of such
damages. The foregoing limitations of liability shall not apply in case of mandatory liability, e.g. under
the German Product Liability Act, in case of intent, gross negligence, injury of life, body or health, or
breach of a condition which goes to the root of the contract. However, Claims for Damages arising
from a breach of a condition which goes to the root of the contract shall be limited to the foreseeable
damage which is intrinsic to the contract, unless caused by intent or gross negligence or based on
liability for injury of life, body or health. The above provision does not imply a change on the burden of
proof to the detriment of the Recipient. Subject to change without notice at any time. The interpretation
of this general note shall be governed and construed according to German law without reference to
any other substantive law.
Copyright
Copying of this document and giving it to others and the use or communication of the contents thereof,
are forbidden without express authority. Offenders are liable to the payment of damages. All rights
reserved in the event of grant of a patent or the registration of a utility model or design.
Copyright © Siemens AG 2005
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Contents
0
Document History .........................................................................................................7
1
Introduction .................................................................................................................11
2
3
1.1
Supported Products .............................................................................................11
1.2
Related Documents .............................................................................................11
1.3
Scope of Delivery.................................................................................................12
1.4
Terms and Abbreviations.....................................................................................12
General Overview........................................................................................................14
2.1
Key Features at a Glance ....................................................................................14
2.2
System Overview .................................................................................................16
2.3
Location of Connectors, Switches, Jumpers, LEDs, Adjustable Resistors ..........17
2.4
Block Diagram .....................................................................................................18
2.5
Interface Overview...............................................................................................19
Description of DSB75 Interfaces ...............................................................................21
3.1
GSM Module Interface (Board-to-Board Connector) ...........................................21
3.2
Test Points...........................................................................................................23
3.3
GPIO Lines ..........................................................................................................25
3.4
SIM Card Interface...............................................................................................27
3.5
RS-232 Interfaces................................................................................................29
3.5.1
Serial Interface 1 (COM1) ......................................................................31
3.5.2
Serial Interface 2 (COM2) ......................................................................32
3.5.3
Debug Interface (COM3)........................................................................33
3.6
Analog Audio Interfaces.......................................................................................34
3.6.1
Audio Interface 1 (Handset) ...................................................................35
3.6.2
Audio Interface 2 (Headset or Speakerphone Operation)......................36
3.6.2.1 Recommended Headset ........................................................36
3.6.2.2 Speakerphone Operation.......................................................37
3.6.3
Microphone Circuit (Feeding Bridges) ...................................................38
3.7
Digital Audio Interface..........................................................................................39
3.8
USB Device Interface ..........................................................................................41
3.9
I²C Interface .........................................................................................................43
3.10 SD Card Interface ................................................................................................46
3.10.1 SD 4 Bit Mode........................................................................................48
3.10.2 SD 1 Bit Mode........................................................................................49
3.10.3 SPI Bus Mode ........................................................................................50
3.11 Serial Peripheral Interfaces .................................................................................51
3.12 Analog Interface...................................................................................................53
3.13 Antenna Interface ................................................................................................55
3.14 Power Supply Interfaces......................................................................................56
3.14.1 Internal Supply Voltages ........................................................................58
3.14.2 Power Supply for DSB75 and GSM Module ..........................................60
3.14.3 Battery Powered Operation of GSM Module..........................................61
3.14.3.1 Charging the Battery..............................................................61
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3.14.4
3.14.5
4
5
6
4.1
Indication of Asynchronous Serial Interface Signals............................................66
4.2
Indication of GPIO Signals and SYNC.................................................................66
4.3
Indication of Power ..............................................................................................67
4.4
Indication of I²C Lines ..........................................................................................67
Overview of Switches and Jumpers..........................................................................68
5.1
Overview of Switches ..........................................................................................68
5.2
Overview of Jumpers ...........................................................................................73
Connecting Antenna and GSM Module to DSB75....................................................75
Turn on / off the GSM Module .............................................................................77
6.1.1
Turn on the GSM Module.......................................................................77
6.1.2
Turn off the GSM Module.......................................................................78
6.1.3
Emergency Restart ................................................................................78
Technical Data of DSB75............................................................................................79
7.1
8
3.14.3.2 Charging Circuit .....................................................................62
Real Time Clock Supply.........................................................................63
Adjusting the VBATT+ Supply Voltage for the GSM Module .....................64
Status LEDs .................................................................................................................65
6.1
7
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Cable Requirements ............................................................................................82
Appendix......................................................................................................................83
8.1
List of Parts and Accessories ..............................................................................83
8.2
Circuit Diagrams of DSB75..................................................................................84
8.3
Floor Plan of the DSB75 ......................................................................................93
Figures
Figure 1: System overview ..................................................................................................... 16
Figure 2: Location of the connectors, switches, jumpers, LEDs and adjustable resistors...... 17
Figure 3: Block diagram ......................................................................................................... 18
Figure 4: Pin assignment of the B2B connector ..................................................................... 21
Figure 5: Overview of B2B connector pins and the corresponding test points....................... 23
Figure 6: Location of the test points ....................................................................................... 23
Figure 7: GPIO circuit............................................................................................................. 25
Figure 8: GPIO - location of switches and LEDs .................................................................... 26
Figure 9: SIM card interface ...................................................................................................27
Figure 10: Pin location of the Molex SIM card holder and test pins ....................................... 28
Figure 11: RS-232 interfaces ................................................................................................. 29
Figure 12: Location of the RS-232 interfaces and switches ................................................... 30
Figure 13: Recommended adapter cable from PC to COM2 on DSB75 ................................ 33
Figure 14: Analog audio interface – overview ........................................................................ 34
Figure 15: Location of the audio connectors and switches .................................................... 35
Figure 16: Siemens Car Kit Portable HKP-500 ...................................................................... 37
Figure 17: Circuit of microphone feeding bridges................................................................... 38
Figure 18: DAI interface ......................................................................................................... 39
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Figure 19: Location of DAI connector X703 ........................................................................... 39
Figure 20: Example for connecting measurement equipment................................................ 40
Figure 21: USB device interface............................................................................................. 41
Figure 22: Location of the USB interface, switches and jumper............................................. 42
Figure 23: I²C interface........................................................................................................... 44
Figure 24: I²C interface location ............................................................................................. 44
Figure 25: SD card interface .................................................................................................. 46
Figure 26: Location of slide switches and card reader pins ................................................... 47
Figure 27: SPI interfaces........................................................................................................ 51
Figure 28: SPI interfaces location and related switches......................................................... 52
Figure 29 PWM filter characteristics....................................................................................... 53
Figure 30: Analog interface location and related switches ..................................................... 53
Figure 31: Analog interface ....................................................................................................54
Figure 32: Power supply interfaces ........................................................................................ 56
Figure 33: Location of the power supply connectors, switches and jumpers ......................... 57
Figure 34: Input circuit schematic (5V DC/DC converter) for power supply ........................... 58
Figure 35: Schematic for audio supply (5V0_I) ...................................................................... 59
Figure 36: Schematic for GSM module supply (3V3_4V5 or BATT+) .................................... 59
Figure 37: Battery screw terminal........................................................................................... 61
Figure 38: Schematic of charging circuit ................................................................................ 63
Figure 39: Location of jumpers and resistors for adjusting BATT+ voltage (3V3_4V5) ......... 64
Figure 40: Location of LEDs................................................................................................... 65
Figure 41: ASC signal indication circuit.................................................................................. 66
Figure 42: GPIO signal indication circuit ................................................................................ 66
Figure 43: Location, signal names and switch positions of the slide switches ....................... 72
Figure 44: Location of jumpers............................................................................................... 74
Figure 45: Illustration of positions to cut the trace for jumpers X203 and X122 ..................... 74
Figure 46: Mounting GSM module onto the DSB75 ............................................................... 75
Figure 47: Top view on DSB75 with connected GSM module and RF cable ......................... 76
Figure 48: Turn on circuit ....................................................................................................... 77
Figure 49: Schematic of page signals .................................................................................... 84
Figure 50: Schematic of position list....................................................................................... 85
Figure 51: Schematic sheet 1 – B2B connector, test points, USB interface .......................... 86
Figure 52: Schematic sheet 2 – ASC0, ASC1 and ASC2 interface........................................ 87
Figure 53: Schematic sheet 3 – SD card reader .................................................................... 88
Figure 54: Schematic sheet 4 – GPIOs, power supply........................................................... 89
Figure 55: Schematic sheet 5 – SIM card, I2C, SPI, analog and antenna interface .............. 90
Figure 56: Schematic sheet 6 – charging interface ................................................................ 91
Figure 57: Schematic sheet 7 – audio interface ..................................................................... 92
Figure 58: Floor plan top side.................................................................................................93
Figure 59: Floor plan bottom side........................................................................................... 94
Tables
Table 1: Key features ............................................................................................................. 14
Table 2: Interfaces of the DSB75 ........................................................................................... 19
Table 3: Pin assignment of B2B connector X100................................................................... 22
Table 4: Pin assignment – B2B connector X100 and test points X101 .................................. 24
Table 5: Pin assignment – B2B connector X100 and test points X102 .................................. 24
Table 6: LED indication of GPIO status.................................................................................. 25
Table 7: GPIO assignment and switch position...................................................................... 26
Table 8: Pin assignment – SIM card holder X503 and test pins X501 ................................... 28
Table 9: Pin assignment of 1st serial interface COM1 (X201) ............................................... 31
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Table 10: Pin assignment of 2nd serial interface COM2 (X202) ............................................ 32
Table 11: Pin assignment of debug interface COM3 (X205).................................................. 33
Table 12: Pin assignment of handset audio interface 1 (X502).............................................. 35
Table 13: Pin assignment of audio interface 2 (X700, X701) ................................................. 36
Table 14: Pin assignment of the USC/DAI interface X703 ..................................................... 40
Table 15: Pin assignment of USB device interface X110....................................................... 42
Table 16: Pin assignment of the I²C interface X511............................................................... 45
Table 17: Pin assignment of SD card interface X301 (SD 4 bit mode) .................................. 48
Table 18: Pin assignment of SD card interface X301 (SD 1 bit mode) .................................. 49
Table 19: Pin assignment of SD card interface X301 (SPI bus mode)................................... 50
Table 20: Alternative configuration of SPI interface lines....................................................... 51
Table 21: Pin assignment of the SPI interfaces X510 ............................................................ 52
Table 22: Pin assignment of the analog interface .................................................................. 54
Table 23: Description of power supply units........................................................................... 58
Table 24: Recommended specification of the laboratory PSU............................................... 60
Table 25: Connecting the laboratory PSU to X400 and X401 ................................................ 60
Table 26: Pin assignment of the screw terminal X602 ........................................................... 61
Table 27: Pin assignment of the X700 jack for the plug-in charger........................................ 62
Table 28: Pin assignment of the X701 jack for the plug-in charger........................................ 62
Table 29: Adjusting BATT+ voltage (3V3_4V5) ..................................................................... 64
Table 30: Overview of switch positions .................................................................................. 68
Table 31: Overview of jumpers............................................................................................... 73
Table 32: DSB75 maximum ratings........................................................................................ 79
Table 33: DSB75 technical data............................................................................................. 79
Table 34: List of parts and accessories.................................................................................. 83
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Document History
Preceding document: "DSB75 Development Support Board Rev B1 Hardware Description", v07
New document: "DSB75 Development Support Board Rev. B1 Hardware Description" Version v08
Chapter
What is new
3.6.2
Added description of EPREF.
3.6.2.2,
3.6.3
Added information about required bias voltage for speakerphone operations.
3.7
Table 14: Updated pin description of PCM interface.
Preceding document: "DSB75 Development Support Board Rev B1 Hardware Description", v06
New document: "DSB75 Development Support Board Rev. B1 Hardware Description" Version v07
Chapter
What is new
6.1.1
Modified section “Toggling low-high state of DTR”.
7
Table 33: DSB75 technical data: Added Ignition key, Emergency key, Ignition via
DTR, Ignition via USB
Preceding document: "DSB75 Development Support Board Rev B1 Hardware Description", v05
New document: "DSB75 Development Support Board Rev. B1 Hardware Description" Version v06
Chapter
What is new
8.2
Figure 56: Schematic sheet 6 – charging interface – corrected value of R604
Preceding document: "DSB75 Development Support Board Rev B1 Hardware Description", v04
New document: "DSB75 Development Support Board Rev. B1 Hardware Description" v05
Chapter
What is new
2.2
Modified Figure 2: Location of the connectors, switches, jumpers, LEDs and
adjustable resistors
3.1
Corrected Table 3: Pin assignment of B2B connector X100 and Table 4: Pin
assignment – B2B connector X100 and test points X101
Board-to-board connector X100 will be supplied by Molex
3.3
Added note that the status of GPIOs 1 – 6 and 9 – 10 will be indicated by LEDs.
Deleted test pin X102 for connecting measurement equipment or an external
application. Corrected Table 7: GPIO assignment and switch position
3.5.1
Table 9: Pin assignment of 1st serial interface COM1 (X201) – modified note on DTR line
3.11
Table 20: Alternative configuration of SPI interface lines – deleted GPIO as alternative
interface
Table 21: Pin assignment of the SPI interfaces X510 – corrected pin names
5.1
Table 30: Overview of switch positions – corrected the functions of several switches
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Preceding document: "DSB75 Development Support Board Rev B1 Hardware Description", v03
New document: "DSB75 Development Support Board Rev. B1 Hardware Description" v04
Chapter
What is new
1.4
Updated table: “Terms and Abbreviations”
2.5
Deleted “for ORGA test device” in table 2, row “SIM”
3.3
Deleted line: “It is important to switch the used GPIO lines to the LED driver (S450 –
S459 pos.3).”
3.6.2
Updated table 12. Added description for pin 1 – 8 (X700), pin 1 – 7, 9 (X701)
3.6.2.2
Added “The plug of “Siemens Car Kit portable HKP-500” is compatible to Lumberg
connector X701. The plug of “Siemens Car Kit Portable” is compatible to Lumberg
connector X700. Changed Siemens ordering number for HKP-500.
3.6.3
Modified figure: ”Circuit of microphone feeding bridges”
3.8
Corrected switch position for a direct connection of the USB lines to the GSM module.
Table 14: deleted column “Remark”
3.9
Deleted section “I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400
kbps in Fast mode. It consists of two lines: the serial data line I²CDAT and the serial
clock line I²CCLK. The electrical characteristics comply with the I²C standard.”
Deleted section “A master is the device which initiates a data transfer on the bus and
generates the clock signals to permit that transfer. At this time, any device addressed
is considered a slave. The master can operate as a master transmitter or as a master
receiver.”
Changed: VEXT to VDD
Modified figure: “I²C interface”
Corrected table 15: Pin assignment of the I²C interface X511
3.10
Modified figures: “SD card interface” and “Location of slide switches”
3.11
Modified figure: “SPI interfaces”
Corrected figure: “SPI interfaces location and related switches”
3.12
Deleted list item “The filter characteristic depends on the signal frequency range.”
Added new figure: “PWM filter characteristics”
Modified figures: “Analog interface” and “Analog interface location and related
switches”
3.14
Modified figure: “Power supply interfaces”
3.14.1
Corrected Table 23, row “GSM module supply”: 4.7F to 4700µF.
3.14.3.2
Modified figure: “Schematic of charging circuit”
3.14.5
Replaced “slide switches” with “jumpers”
Deleted constraints: “The maximum voltage is set only via the slide switches, it cannot
be adjusted via the resistors.
4.1
Modified figure: “ASC signal indication circuit”
4.2
Modified figure: “GPIO signal indication circuit”
8.2
Added figures: “Schematic of page signals” and “Schematic of position list”
Modified figure: “Schematic sheet 6 – charging interface”
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Preceding document: ”DSB75 Development Support Board Hardware Description", v02
New document: "DSB75 Development Support Board Rev. B1 Hardware Description" v03
Chapter
What is new
2.2
Modified figure: “System overview”
2.3
Modified figure: “Placement of connectors, switches, jumpers, LEDs and adjustable
resistors”
2.4
Modified figure: “Block diagram”
3.3
Modified figure: “GPIO circuit”
3.5.1
Corrected value of level converter D200 (COM1). Added information: “Therefore the
PWR_IND signal is used for enabling and shut down converters.”
3.5.2, 3.5.3
Corrected value of level converter D201 (COM2, COM3). Added information:
Therefore the PWR_IND signal is used for enabling and shut down converters.
3.6
Modified figure: “Analog audio interface – overview”; modified figure: “Location of the
audio connectors and switches”
3.6.2.2
New speakerphone added.
3.8
Added information about second USB interface X111. Modified figure: “USB device
interface”.
3.9
Added information about functionality of LEDs V503, V504. Modified figure: ”I²C
interface”.
3.10
Modified figure: ”SD card interface”
3.12
Modified figure: ”Analog interface”
3.14
Modified figure: ”Power supply interface”
3.14.1
Modified information in Table 23, row “Power supply of digital part of DSB75”. Added
new row in Table 23: “Digital IO supply (VDD)””
3.14.2
Corrected information about power indication.
3.14.3
Changed information about battery operation. Added recommendations for batteries.
3.14.3.1
Added Siemens ordering number and technical data for plug-in charger. Added new
table: “Pin assignment of the X701 jack for the plug-in charger”.
3.14.3.2
Corrected: Imax=150mV / 0.3Ohm = 500mA @ Jumper X600 open;
Imax =150mV / 0.15Ohm =1A @ Jumper X600 closed
Modified figure: “Schematic of charging circuit”.
3.14.4
New chapter: “Real Time Clock Supply”
4.2
Modified information about indication of GPIO signals. Modified figure: “GPIO signal
indication circuit”.
4.3
Corrected information about indication of power.
4.4
New chapter: “Indication of I²C Lines”
5.1
Completely updated table: “Overview of switch positions”.
5.2
Table 31: added jumpers X122, X203, X204, X206, X420, X421 X562, X600 and
footnotes 2, 3. Added figure: “Location of jumpers”.
6
Added mounting description and figure: “Mounting GSM module onto the DSB75”.
6.1.1
Deleted constraints: “Start-up by DTR0 toggling is only effective if the USB host is not
active. Start-up by plugging the USB cable is only effective if the RS-232 lines are
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Chapter
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What is new
deactivated by the host application (e.g. if the terminal program is closed). In later
releases of DSB75 this problem will be solved.” Modified figure: “Turn on circuit”.
6.1.2
Added information about automatic restart of the module.
7
Updated technical data.
7.1
More detailed list of cable requirements.
8.2
Modified figures “Schematic sheet1” … “Schematic sheet7”
8.3
Modified figure: “Floor plan top side”; added figure: “Floor plan bottom side”
Preceding document: ”DSB75 Development Support Board Hardware Description", v01
New document: ”DSB75 Development Support Board Hardware Description", v02
Chapter
What is new
Completely revised and updated all chapters and technical specifications. Added new chapters and
appendix.
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1
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Introduction
This document describes the
DSB75 Development Support Board
Rev. B1
The DSB75 Development Support Board is designed to assist system integrators in
developing and evaluating products based on Siemens GSM modules. Furthermore, it is part
of the Siemens reference equipment submitted for Type Approval GSM modules.
This document describes all interfaces of the DSB75, provides technical specifications and
presents guidelines for connecting and operating the GSM modules to be evaluated.
At present, the DSB75 has not been approved to comply with the CE marking regulations
and can be used for laboratory purposes only. Also, please note that the DSB75 and the
connected GSM module are not ESD protected. Because of these current limitations, take
care that the device is only used by authorized staff.
Note: The document is only valid for the DSB75 Rev. B1. DSB75 Rev. A2 boards are no
longer considered in the document.
1.1
Supported Products
DSB75 comes as a universal evaluation kit for variety of different Siemens GSM modules. At
present these are the following:
ƒ MC75
ƒ TC63
ƒ TC65
The diversity of the supported products implies that, due to hardware or software specific
properties, major differences occur regarding the availability of interfaces and the
implementation of features. Therefore, please consult the specifications supplied with your
module, especially [1] and [2], to make sure whether or not a described interface, signal,
operating mode or function offered by the DSB75 is supported.
1.2
[1]
[2]
[3]
Related Documents
Hardware Interface Description of your GSM module
AT Command Set of your GSM module
Application 07: Rechargeable Lithium Batteries in GSM Applications
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1.3
Scope of Delivery
Quantity
1.4
s
Description
1
DSB75 Development Support Board
1
MiniMag antenna (850 MHz – 1990 MHz)
1
Adapter cable for MiniMag antenna
2
RF adapter cable 150mm
1
Votronic handset
2
Hexagon nuts (DIN 934 – ISO 4032)
2
Screws M2 (DIN 84 – ISO 1207)
2
Insulating spacers for M2, self-gripping
Terms and Abbreviations
Abbreviation
Description
ADC
Analog-to-Digital Converter
ASC
Asynchronous Serial Controller
B2B
Board-to-Board connector
CE
Conformité Européene (European Conformity)
CSD
Circuit Switched Data
CTS
Clear to Send
DAC
Digital-to-Analog Converter
DAI
Digital Audio Interface
DRX
Discontinuous Reception
DSB
Development Support Board
DSR
Data Set Ready
DTR
Data Terminal Ready
DTX
Discontinuous Transmission
EMC
Electromagnetic Compatibility
ESD
Electrostatic Discharge
GPIO
General Purpose Input/ Output
GPRS
General Packet Radio Service
GSM
Global Standard for Mobile Communications
IGT
Ignition
I/O
Input/Output
kbps
kbits per second
LDO
Low Drop Out Regulator
LED
Light Emitting Diode
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Abbreviation
Description
Li-Ion
Lithium-Ion
MMC
Multi Media Card
NTC
Negative Temperature Coefficient
PCB
Printed Circuit Board
PCM
Pulse Code Modulation
PSU
Power Supply Unit
PTT
Push-To-Talk
PWM
Pulse Width Modulation
RF
Radio Frequency
ROM
Read-only Memory
RTC
Real Time Clock
RTS
Request to Send
Rx
Receive Direction
SAR
Specific Absorption Rate
SCLK
Serial Clock
SD
Secure Digital
SELV
Safety Extra Low Voltage
SIM
Subscriber Identification Module
SMA
RF connector system: SubMiniature version A
SPI
Serial Peripheral Interface
Tx
Transmit Direction
USB
Universal Serial Bus
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2
General Overview
2.1
Key Features at a Glance
s
Table 1: Key features
Feature
Implementation
GSM module interface
•
Direct connection and mechanical fixing of GSM module via 80-pin
board-to-board connector and screws.
Power supply
•
Laboratory PSU (9V…15V)
or
•
Battery 3.3V…4.5V
•
Implemented charging circuit (FET)
•
Operation with plug-in charging adapter
Antenna interface
•
Integrated connection between module’s Hirose connector and SMA
connector
SIM interface
•
SIM card connector with front tray loading and card detection
•
Supported SIM cards: 3V and 1.8V
•
SD card connector with front slot, card detection indication and write
protection indication
•
Supply voltage: 2.9V
•
Supported modes:
SD mode or
SPI mode
•
Two analog audio interfaces (both with microphone supply) for
connecting a handset, headset or speakerphone.
•
One digital audio interface (DAI)
•
Host mode
•
Supports 3V or 5V devices (configurable)
•
Connected I²C EEPROM (128kBit) with adjustable addresses
SPI interface
•
Two interfaces to be used alternatively to other interfaces
(option)
•
Host mode
Serial interfaces
•
•
Three RS-232C interfaces:
COM1 - serial interface for data communication
COM2 - serial interface for control purposes
COM3 - serial interface for debug purposes
Max. baud rate: 460800 bps
•
Autobauding at TBD bps
USB interfaces
•
USB 1.1 Full Speed (12 Mbit/s) device interface at B receptacle
(default)
GPIOs
•
10 GPIOs at pins
•
Switchable pull-up/down resistors (for 8 GPIO’s)
•
LED signaling (for 8 GPIO’s)
Battery charging
SD Card interface
Audio interfaces
I²C interface
DSB75_hd_v08
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Feature
ADC inputs
DAC output
Signal indication
Configuration facilities
Temperature range
Implementation
•
2 analog inputs
•
Switchable loop with DAC output at each line
•
One analog output for DC or AC voltages
•
Filtered PWM signal
•
23 LEDs are available for signal indication
•
Two LEDs for on/off indication
•
Several module signal lines have multiple functions (depending on the
GSM module and its configuration). Those lines are switchable to the
right interfaces by slide switches and jumpers.
•
Adjustable module supply voltage
•
Normal operation:
15°C to +35°C
•
Storage:
-40°C and +85°C
Size:
177mm x 160mm x 36mm (PCB)
Physical characteristics •
DSB75_hd_v08
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System Overview
PC
COM3 (RS-232C)
Debug interface
ASC0
2 LEDs
for I2C
12 LEDs
for ASC0,
ASC1
GSM
module
X501
80 Test points
Audio
interface 1
X503
Card
holder
Emergency
restart
SD
card
SIM
card
RF
X100
B2B
Flex
cable
(option)
+
Battery
X602
SMA
LED
module On
S420
Card
holder
X502
Ignition
RF
SIM test
X301
RF cable
V242 - V243,
V450 - V455
-
LED
DSB On
Measurement
equipment
X101,X102
D500
Battery connector
V230 - V241
X505
I2C
EEPROM
DSB75
V503, V504
X506
Jumper
X120, X121, X203,
X405, X410, X411,
X420, X421, X500,
X710
S421
X400
X401
Power supply
9V...15V
8 LEDs
for GPIOs
I2C
X110
USB B
ASC2
RF cable
SPI
X205
X201
X202
ASC1
USB A
USB device
COM3
alternative module connection
X703
COM1
X510
DAI
interface
X511
I2C device
SPI1/2 device
Digital aud io
measurement
equipment
or codec
Remote control
Relay box
COM2
COM1 (RS-232C)
COM4
COM2 (RS-232C)
Lab
Power
Supply
Audio interface 2
or charging interface
2.2
V431
V430
Lumberg
X700
or X701
RF
or
Handset
GSM
module
Plug-in
charger
ORGA
SIM test
RF
Antenna
or GSM
tester
Figure 1: System overview
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2.3
Location of Connectors,
Adjustable Resistors
Switches,
X201
X202
Jumpers,
LEDs,
(X111 bottom side)
X205
X110
X401
X400
X203
X120
S112
S5 01
S50 0
1 39
2 40
X101
S 455 S 456 S4 57
S46 0 S 461S4 62
S 450 S 451
S4 54 S 453 S4 52
V452
SD_D2 (GPIO3)
SD_D1 (GPIO2)
V453
SD_CLK (GPIO5)
V455
SD_CMD (GPIO6)
1
3
1
3
C413
X410
X405
X411
X561
X560
X562
(1)
39
40
SD_D0 (GPIO1)
R414
X 510
V 240
V23 8
3
3
V450
V451
(40)
C414
1
2
X102
(80)
R415
1
3
S111
1 3
X 551
1
X121
3
SD_D3 (GPIO4)
X 552
1
1
X703
3
S110
1 3
V454
S5 04
X554
3
1
S 503
S200
3
V 239
V 241
V2 42
S201
1
S 502
X204
X 511
X206
not_used V457
not_used V456
I2CDAT V504
I2CCLK V503
RXD2_GPIO9
TXD2_GPIO10
V244
V 243
3
S 465 S 464 S 463
3
1
3
1
S 468 S 467 S 466
V23 0
V 234
V23 1
V 235
V23 2
V2 36
V23 3
V 237
1
S 458 S 459 S46 9
1
C415
S713 S712
3
X4 20
X 421
3 1
1 3
1
X122
X602
S301 S303 S305 S307
3
S601
S730
1 3
S731
1 3
1 3
S300 S302 S304 S306
S717 S716
1
1 3
X6 00
(41)
X500
X501
S714
X710
S715
S710
X301
(bottom
side)
X502
S711
1 3
40
1
S4 2 0
S 421
X505
X100
80
41
X506
V431
V430
X700
X503
(X701 bottom side)
Figure 2: Location of the connectors, switches, jumpers, LEDs and adjustable resistors
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2.4
Block Diagram
Test points
2x40 pole
SIM
/6
SIM
8 pin
CCxxx
SIM
for future use
USB-OTG
Chip
USB
/3
USB_DN, USB_DP, VUSB_IN
USB Mini A/B
3x
VBUS_B
USB B
ASC2/GPIO
/2
RXD2_GPIO9,TXD2_GPIO10
SD / GPIO
/8
SD_xxx(GPIO1-6)
SPICS, SPIDI
Digital baseband processor
SYNC
/2
/1
ASC1
/4
SD_DET(GPIO8),
SD_WP(GPIO7)
PWR_IND
I
8x
EN
/6
SDXX_I
/2
SPI2_CS,
SPI2_DI
11x
SYNC
VEXT
/4
SD
/2
SD
/4
/4
ASC1
EN
EN
RTS0,CTS0,RING0,DCD0,DSR0,DTR0
RXD0,TXD0
SD
SD
/8
(RXD0,TXD0)_I
I
EN1
VDD
/4
/4
SPI1/2
2x10pin
RS232
ASC0
EN
USC(1,2)
USC(0:6)
VDD
/7
RS232
I
EN2
I
2x
USC
SD-Card
4x
12x
/6
ASC2 (Debug)
SD_DET(GPIO8),
SD_WP(GPIO7)
RXD1, TXD1, RTS1, CTS1
RXD0 ... RING0
/2
VDD
/6
10x
PWR_IND
/8
EN2
VDD
/4
ASC0
SD
I RS232
EN
/2
DTR
SD / GPIO
2x
5V
SD
SD
/9
/7
DAI
/2
I2CCLK, I2CDAT
DAC (PWM)
/1
DAC_OUT
10pin
5V
I2C
VDD
SPI1_CS,SPI1_DI
Level
Shifter
I2C
10pin
ADC (MUX)
/2
BATT+
/5
BATT+
Charge
/1
VCHARGE
Charge
/3
CHARGEGATE, VSENSE, ISENSE
Charge
/1
BATTEMP
Audio
/1
Audio
/1
ADC(1,2)_IN
/1
EEPROM
2x
3V3-4V5
Battery
5V
Feeding
Bridge
5V
Feeding
Bridge
/2
MIC2(N,P)
Audio1
/2
EP2(N,P)
ext. Supply
/1
VEXT
Audio2
/2
MIC1(N,P)
Audio2
/2
EP1(N,P)
2x
JP
Switch
TP_ENV
Audio1
(Screw terminal)
Charging
VMIC
AGND
Analog baseband
AGND
Charger,
AGND
AGND
EMC
EMC
Headset
Handset
EMRG_RST
Reset
/1
EMERG_RST
On
/1
IGT
RTC Supply
/1
VDDLP
IGT
BATT+
Adj. Reg.
3V3-4V5
LDO
3V0
DTR
d/dt
gn
VBUS_B
/8
VDD
LDO
PWR_IND
/1
PWR_IND
ge
EN
EN1
JP
80 pole B2B
EN2
5V
DC/DC
5V
JP
PSU 9V
RF
SD
RF Cable
GSM module
Hirose
SMA
Figure 3: Block diagram
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2.5
s
Interface Overview
Table 2: Interfaces of the DSB75
Interface
Reference
number
Description
IGT
S421
Ignition push button
Emergency
reset
S420
Emergency reset push button
Handset
X502
Audio interface 1 (4-pin western jack). Intended for connecting a
handset.
SIM
X503
SIM card holder
RF
X506
RF signal (SMA connector)
Green LED
V431
DSB ON. Power LED that indicates the operating voltage for the
DSB75.
Yellow LED
V430
Module ON. Power LED that indicates the operating voltage for the
GSM module.
SD card
X301
SD card holder
Charger,
X700, X701
Two different functions provided by the same connector (Lumberg
connector):
Headset,
a) Input for plug-in charger
Carkit
b) Audio 2 interface for headset or speakerphone
X700 for old, X701 for new Siemens accessories.
9V
X400 (red)
GND
X401 (black)
COM1
X201
Supply voltage nominal +9V. Connectors used to attach a laboratory
PSU.
Serial interface 1 (9-pin SubD connector). RS-232C interface with 8
data and modem control lines. Intended for GPRS data, circuit
switched data, multiplexed data, AT commands.
Connects to the module’s serial interface ASC0.
COM2
X202
Serial interface 2 (9-pin SubD connector). RS-232C interface with 2
data and 2 modem control lines: TXD1 and RXD1 plus RTS1 and
CTS1 for hardware handshake. Intended for GPRS data and AT
commands.
Connects to the module’s serial interface ASC1.
COM3
X205
Debug interface (9-pin SubD connector). RS-232C interface with
2 data lines: TXD2 and RXD2.
Connects to the module’s serial interface ASC2 (for Siemens internal
use only).
USB B
X110, X111
USB device interface (type B receptacle)
GSM
module
X100
80 pole board-to-board connector for GSM module
RF
X505
RF connector for connecting GSM module via RF cable
Battery
X602
Battery connector
Test points
X101, X102
80 test pins (80 pole dual strip1); 1:1 connection to B2B connector
X100, Terminal for GPIO’s, ADCn_IN lines
I²C
X511
3V and 5V I²C interface (10 pole dual strip1)
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Interface
Reference
number
s
Description
SPI1/2
X510
SPI interface 1 and 2 (10 pole dual strip1)
DAI
X703
DAI (digital audio interface)
Intended for digital audio measurements.
SIM
X501
SIM test interface (8 pole single strip1)
Remote
control
X120, X121,
X203, X405,
X410, X411,
X420, X421,
X500, X710
Jumpers used to connect special PC controlled relay box.
DAC filter
X560 - X562
Jumpers used to insert a customized DAC filter.
BATT+
current
X122
Jumpers used for BATT+ current measurement.
1
Grid of the strip connectors: 0.1 inch
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s
3
Description of DSB75 Interfaces
3.1
GSM Module Interface (Board-to-Board Connector)
The Molex board-to-board connector X100 on the DSB75 is an 80-pin double-row receptacle.
Figure 4 shows the names and positions of the pins on the DSB75. The pin allocation is
identical to the GSM module, but pin names may be different.
Several pins have multiple functions depending on the type of GSM module and alternate
configuration.
Figure 4: Pin assignment of the B2B connector
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s
Table 3: Pin assignment of B2B connector X100
Pin no.
Signal name
Signal name
Pin no.
80
GND
GND
1
79
DAC_OUT
ADC1_IN
2
78
PWR_IND
ADC2_IN
3
77
TP_ENV
GND
4
76
RXD2_GPIO9
TXD2_GPIO10
5
75
SPICS
SD_WP(GPIO8)
6
74
SD_3(GPIO4)
SPIDI
7
73
SD_2(GPIO3)
SD_DET(GPIO7)
8
72
SD_1(GPIO2)
SD_CMD(GPIO6)
9
71
SD_0(GPIO1)
SD_CLK(GPIO5)
10
70
I2CDAT
I2CCLK
11
69
USB_DP
VUSB_IN
12
68
USB_DN
USC5
13
67
VSENSE
ISENSE
14
66
VMIC
USC6
15
65
EPN2
CCCLK
16
64
EPP2
VSIM
17
63
EPP1
CCIO
18
62
EPN1
CCRST
19
61
MICN2
CCIN
20
60
MICP2
CCGND
21
59
MICP1
USC4
22
58
MICN1
USC3
23
57
AGND
USC2
24
56
IGT
USC1
25
55
EMERG_RST
USC0
26
54
DCD0
BATTEMP
27
53
CTS1
SYNC
28
52
CTS0
RXD1
29
51
RTS1
RXD0
30
50
DTR0
TXD1
31
49
RTS0
TXD0
32
48
DSR0
VDDLP
33
47
RING0
VCHARGE
34
46
VEXT
CHARGEGATE
35
45
BATT+
GND
36
44
BATT+
GND
37
43
BATT+
GND
38
42
BATT+
GND
39
41
BATT+
GND
40
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Note:
The electrical
characteristics of this
interface meet the
requirements of GSM
module’s application
interface.
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3.2
Test Points
All module pins at the B2B connector X100 are connected 1:1 to pin headers X101, X102.
They may be used for connecting measurement equipment, customized host interfaces or as
access points to GPIOs, DAC, ADCs, audio lines, etc.
1
40
39
40
X101
1 39
2 40
1
2
X102
41
80
1
40
X100
80
41
Figure 5: Overview of B2B connector pins and the corresponding test points
39
40
X101
1 39
2 40
X102
1
2
Figure 6: Location of the test points
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Table 4: Pin assignment – B2B connector X100 and test points X101
X100 pin
number
Signal name
Signal name
X100 pin
number
80
GND
40
39
GND
1
79
DAC_OUT
38
37
ADC1_IN
2
78
77
PWR_IND
36
35
ADC2_IN
3
TP_ENV
34
33
GND
4
76
RXD2_GPIO9
32
31
TXD2_GPIO10
5
SPICS
30
29
SD_WP(GPIO8)
6
75
X101 test
point
SD_3(GPIO4)
28
27
SPIDI
7
73
SD_2(GPIO3)
26
25
SD_DET(GPIO7)
8
72
SD_1(GPIO2)
24
23
SD_CMD(GPIO6)
9
71
SD_0(GPIO1)
22
21
SD_CLK(GPIO5)
10
70
I2CDAT
20
19
I2CCLK
11
69
USB_DP
18
17
VUSB_IN
12
68
USB_DN
16
15
USC5
13
67
VSENSE
14
13
ISENSE
14
66
VMIC
12
11
USC6
15
65
EPN2
10
9
CCCLK
16
64
EPP2
8
7
VSIM
17
63
EPP1
6
5
CCIO
18
62
EPN1
4
3
CCRST
19
61
MICN2
2
1
CCIN
20
74
Note:
The electrical
characteristics of this
interface meet the
requirements of GSM
module’s application
interface.
Table 5: Pin assignment – B2B connector X100 and test points X102
X100 pin
number
Signal name
Signal name
X100 pin
number
60
MICP2
40
39
CCGND
21
59
MICP1
58
MICN1
38
37
USC4
22
36
35
USC3
23
57
AGND
34
33
USC2
24
56
IGT
32
31
USC1
25
55
EMERG_RST
30
29
USC0
26
54
DCD0
28
27
BATTEMP
27
53
CTS1
26
25
SYNC
28
52
CTS0
24
23
RXD1
29
51
RTS1
22
21
RXD0
30
50
DTR0
20
19
TXD1
31
49
RTS0
18
17
TXD0
32
48
DSR0
16
15
VDDLP
33
47
RING0
14
13
VCHARGE
34
46
VEXT
12
11
CHARGEGATE
35
45
BATT+
10
9
GND
36
44
BATT+
8
7
GND
37
43
BATT+
6
5
GND
38
42
BATT+
4
3
GND
39
41
BATT+
2
1
GND
40
DSB75_hd_v08
X102
test point
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3.3
s
GPIO Lines
The DSB75 board has 10 GPIO facilities (see Figure 7). Which of them are used depends on
the type of GSM module and the software configuration.
If the GPIO lines are configured as input, the level may be set to 0 or 1 by S460 - S469.
The GPIO lines can be connected to measurement equipment or to an external host
application via the test pin X101.
3V0
3V0
8x LED
Buffer
B2B
X100
SD_DO(GPIO1)
SD_D1(GPIO2)
SD_D2(GPIO3)
SD_D3(GPIO4)
SD_CLK(GPIO5)
SD_CMD(GPIO6)
RXD2_GPIO9
TXD2_GPIO10
VDD
8
8
S450
S451
S452
S453
S454
S455
S458
S459
SD_WP(GPIO7)
SD_DET(GPIO8)
S460
S461
S462
S463
S464
S465
S468
S469
1
3
1
8x10K
Enable
V450 (GPIO1; SD_D0 )
V451 (GPIO2; SD_D1)
V452 (GPIO3; SD_D2)
V453 (GPIO4; SD_D3)
V454 (GPIO5; SD_CLK)
V455 (GPIO6; SD_CMD)
V242 (GPIO9)
V243 (GPIO10)
D450, D221
8x10K
3
Test points
X101
PWR_IND
Figure 7: GPIO circuit
GPIO status is indicated by LEDs (for GPIOs 1-6 and 9-10).
Table 6: LED indication of GPIO status
GPIO level
LED status
0 (low)
on
1 (high)
off
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1
V457
10
1
2
9
I2CDAT V504
I2CCLK V503
S455 S4 56 S457
V450
V451
V452
V456
S 500
X 511
9
S454 S4 53 S452
S450 S451
S460 S4 61 S462
S465 S464 S463
S468 S467 S4 66
S458 S4 59 S469
X 5 10
2
S 501
V 230
V 2 40
V 238
V 241
V 2 39
R XD 2_G P IO 9 V 242
T X 2_G P IO 1 0 V 2 43
1
V 24 4
S110
V 2 34
V 231
V 235
V 232
V 236
V 233
V 2 37
3
SD_D0 (GPIO1)
SD_D1 (GPIO2)
SD_D2 (GPIO3)
V454
V453 SD_D3 (GPIO4)
SD_CLK (GPIO5)
V455
SD_CMD (GPIO6)
10
Figure 8: GPIO - location of switches and LEDs
Table 7: GPIO assignment and switch position
X100 pin
1
Signal name
GPIO
S450-459
S460-469
71
SD_D0
1
S450:3
S460:x1
72
SD_D1
2
S451:3
S461:x
73
SD_D2
3
S452:3
S462:x
74
SD_D3
4
S453:3
S463:x
10
SD_CLK
5
S454:3
S464:x
9
SD_CMD
6
S455:3
S465:x
8
SD_WP
7
6
SD_CD
8
76
RXD2_GPIO9
9
S458:3
S468:x
5
TXD2_GPIO1
0
10
S459:3
S469:x
Switch position x may be position 1 or 3.
high level input: x=1
low level input: x=3
Electrical characteristics are specified in section 7.
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3.4
SIM Card Interface
The DSB75 has an integrated SIM card interface. An appropriate SIM card (3V or 1.8V) is
required to start the GSM module. The SIM card holder X503 placed on the DSB75 is from
type Molex. To open the card holder simply press the yellow pin.
In parallel to the SIM card holder X503, the test points X501 are connected, e.g. for SIM test
equipment.
In series to the recognition switch (holder pins 7 and 8) there is a jumper X500 connected. It
must set for normal operation and may be used for testing the SIM card detection ability from
a remote device.
Figure 9 shows the simplified interface schematic.
The pin location of the SIM card holder and SIM test pins is shown in Figure 10.
The pin assignment is given in Table 8.
SIM test pins
CCGND
VSIM
CCRST
CCIO
CCCLK
CCIN
X501
Card holder
B2B
X100
4,5,7
1
2
6
3
8
X503
SIM card
4
1
21
17
CCGND
VSIM
2
6
3
7
19
18
16
20
CCRST
CCIO
CCCLK
CCIN
X500
8
Figure 9: SIM card interface
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s
X500
1
X501
8
1 2 3
7
4 5 6
8
X503
Figure 10: Pin location of the Molex SIM card holder and test pins
Table 8: Pin assignment – SIM card holder X503 and test pins X501
Pin number on
holder X503
X501 test
points
Signal name
I/O
Function
1
1
VSIM
O
Supply voltage U = 2.93V (typ.) or 1.8V for
SIM card, generated by the module.
2
2
CCRST
O
Chip card reset, prompted by the module
3
3
CCCLK
O
Chip card clock
4,8
4, 5, 7
CCGND
-
Separate ground line for the SIM card to
improve EMC
5
-
CCVPP
-
Not connected
6
6
CCIO
I/O
Serial data line, bi-directional
7
8
CCIN
I
Chip card detection
0 = Chip card drawer is inserted
1 = Chip card drawer is not inserted
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3.5
RS-232 Interfaces
The DSB75 offers three asynchronous RS-232 interfaces:
• COM1 (ASC0)
• COM2 (ASC1)
• COM3 (ASC2)
The status of all interface lines is indicated by LEDs (refer to section 4).
For using ASCx lines on the test pins X101, X102 without the DSB75 level converter please
disable receiver outputs by removing jumpers X204 and X206.
Figure 11 shows the simplified interface schematic. Figure 12 shows the placement of the Dsub connectors, switches, jumper and the pin location. Electrical characteristics are specified
in section 7.
3V0
9 pole D-sub
X201
RS232
level converter
D200
TXD0
USC2
RTS0,DTR0
3
32
1
ASC_SD
1
200
1
200
2
3
1
3
JP
49,50
2
JP
PWR_IND
78
RXD1, CTS1
29,53
RXD2_GPIO9
TXD2_GPIO10
RTS,DTR
GND
DTR
RS232
level converter
D201
S303,307
9 pole D-sub
X202
2,8
1
S302,306
3
2
2
200
2
2
200
RXD, CTS
3
1
S301,305
TXD1, RTS1
5
3V0
ASC_SD
V200
200
EN
d/dt
V420
PWR_IND
PWR_IND
56
TXD
7,4
X203
X204
IGT
RXD
SD
S201
1
24
200
S300,304
1
3
3
31,51
1
76
S458
3,7
ASC_SD
SD
S459
2
1
200
1
200
3
1
3
JP
PWR_IND
TXD, RTS
GND
9 pole D-sub
X205
3
1
5
5
5
RXD
TXD
GND
COM3 (ASC2)
USC1
4
S200
1
25
8,6,1,9 CTS,DSR, DCD,
RING
4
COM2 (ASC1)
CTS0, DSR0, 52,48,54,47
DCD0, RING0
30
RXD0
COM1 (ASC0)
B2B
X100
EN
X206
LED indication (0=on, 1=off)
Figure 11: RS-232 interfaces
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Common
COM1
(X201)
COM2
(X202)
X201
X202
6
9
1
6
5
COM3
(X205)
X205
6
9
1
9
1
5
5
X203
1
X120
1
S455 S456 S457
S454 S453 S452
S450 S451
S460 S461 S462
S458 S459 S469
S468 S467 S466
3
S465 S464 S463
S110
1
2
X510
1
9
10
X562
39
40
X101
1
1 39
2 40
X551
X554
X552
S200
S502
S201
10
9
X703
10
S504
X511
9
1
2
S501
2
1
X204
S503
X206
1
S500
1
1 X561
1 X560
X102
1
2
S713 S712
S300 S302 S304 S306
S717 S716
S301 S303 S305 S307
S731
S730
Figure 12: Location of the RS-232 interfaces and switches
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3.5.1
s
Serial Interface 1 (COM1)
The 1st serial interface COM1 (X201) of the DSB75 is intended for the communication
between the GSM module and the host application. This RS-232C interface is a data and
control interface for transmitting data, AT commands and providing multiplexed channels etc.
All modem status lines are available.
A level converter D200 adapts and inverts the V.24 signals (2.9V level) from the GSM
module to RS-232C level.
The output lines are switched off (high impedance) while the GSM module is in POWER
DOWN mode. Therefore the PWR_IND signal is used to enable and shut down converters.
The rising edge of the DTR line voltage generates an ignition signal (impulse) via the V420
differential circuit so that it is possible to turn on the GSM module from the host, by plugging
in the serial cable or by remote control.
The USC lines (USC1, USC2) can be used as an alternative to the standard ASC0 lines
(RXD0, TXD0). In this case the switches S200, S201 have to be set to position 3. The
usability of the USC lines depends on the software configuration of the GSM module and is
for Siemens internal use only.
Table 9: Pin assignment of 1st serial interface COM1 (X201)
X201
pin
Name
I/O
1
DCD
O
Data Carrier Detected
DCD0
2
RXD
O
Receive Data
RXD0
S200:1
USC1
S200:3
TXD0
S201:1
USC2
S201:3
3
4
TXD
DTR
I
I
Description
Transmit Data
Data Terminal Ready
X100
signal
name
Config.
switches
Remark
For Siemens
internal use only
For Siemens
internal use only
DTR0
Note: Low-to-high transition of
the DTR line activates the
ignition signal of the GSM
module.
5
GND
-
Ground
GND
6
DSR
O
Data Set Ready
DSR0
Attention: Switch DSR0_I
(X122) must be set to DSR0_I
position.
7
RTS
I
Request To Send
RTS0
8
CTS
O
Clear To Send
CTS0
9
RING
O
Ring Indication
RING0
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3.5.2
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Serial Interface 2 (COM2)
The 2nd serial interface COM2 (X202) of the DSB75 is intended for the communication
between the GSM module and the host application. This RS-232C interface includes only the
data lines RXD/TXD for transmitting GPRS data and AT commands, and the two control lines
RTS/CTS.
A level converter D201 adapts and inverts the V.24 signals (2.9V level) from the GSM
module to the RS-232C level.
The output lines are switched off (high impedance) if the GSM module is in POWER DOWN
mode. Therefore the PWR_IND signal is used to enable and shut down converters.
There are two alternative approaches to configure the ASC1 lines:
• as SD card interface (see section 3.10.2)
• as SPI interface (see section 3.10.3)
For using ASC1 lines at the test pins X101/X102 without a RS-232 level shifter, the switches
S300, S302, S304 and S306 have to be set to position 1.
Table 10: Pin assignment of 2nd serial interface COM2 (X202)
X202
pin
Name
I/O
Description
X100
signal
name
Config.
switches
2
RXD
O
Receive Data
RXD1
S302:3
S303:1
3
TXD
I
Transmit Data
TXD1
S300:3
S301:1
5
GND
-
Ground
GND
7
RTS
I
Request To Send
RTS1
S304:3
S305:1
8
CTS
O
Clear To Send
CTS1
S306:3
S307:1
1, 4,
6, 9
nc
Remark
nc= not connected
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s
As the X202 interface has only four lines, you may need a customized adapter cable for the
RS-232 connection. This is useful, for example, if your application also requires the lines
DSR, DCD, RING. In such a case it is recommended to use the following pin assignment:
9 pole Sub-D
on DSB75 side
(male)
9 pole Sub-D
on PC side
(female)
1
2
3
4
5
6
7
8
9
1
6
9
5
DCD
RXD
TXD
DTR
GND
DSR
RTS
CTS
RING
RXD
TXD
GND
RTS
CTS
1
2
3
4
5
6
7
8
9
1
6
9
5
Figure 13: Recommended adapter cable from PC to COM2 on DSB75
3.5.3
Debug Interface (COM3)
The debug interface COM3 (X205) of the DSB75 is reserved for Siemens internal software
debugging. It is a two wire interface with data lines only.
A level converter D201 adapts and inverts the V.24 signals (2.9V level) from the GSM
module to RS-232C level.
The output lines are switched off (high impedance) if the GSM module is in POWER DOWN
mode.
The ASC2 lines of the GSM module are used by default as GPIOs (see section 3.3)
Table 11: Pin assignment of debug interface COM3 (X205)
Pin
Name
I/O
Description
X100 signal
name
Config.
switches
2
RXD
O
Receive Data
RXD2_GPIO9
S458:1
3
TXD
I
Transmit Data
TXD2_GPIO10
S459:1
5
GND
-
Ground
GND
1, 4, 6,
7, 8, 9
nc
Remark
nc= not connected
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3.6
Analog Audio Interfaces
The DSB75 comprises two analog audio interfaces. Both audio interfaces are providing a
supply circuit to feed an active microphone.
Figure 14 shows the simplified interface schematic.
Figure 15 shows the location of switches and the pin assignment of the audio connectors.
Electrical characteristics are specified in section 7.
Note: All specified data, e.g. load resistance are valid in TALK mode only.
B2B
X100
VMIC
3
66
S730
AGND
1
3
57
S731
1
AGND_I
MICP1,
MICN1
59,58
VMIC_I
2
S716,717
VMIC_I
MICP1_I,
MICN1_I
3
5V0
Western Jack
X502
4
Feeding
Bridge
1
Audio Interface 1:
MICP
+
MICN
1
Handset
AGND_I
3
EPP
6R8
EPP1,
EPN1
63,62
2
S712,713
2
3
6R8
1
Lumberg
X700
VMIC_I
MICP2_I,
MICN2_I
MICP2,
MICN2
60,61
2
S714,715
>=8 Ohm
EPN
3
Audio Interface 2:
10
Feeding
Bridge
MICP
9
1
+
AGND
AGND_I
Headset
AGND_I
11
EPP
6R8
EPP2,
EPN2
64,63
2
S710,711
12
3
EPN
6R8
Lumberg
X701
1
12
11
AGND_I
10
8
MICP
32 Ohm
or
+
AGND
Headset
EPP
EPN
32 Ohm
Figure 14: Analog audio interface – overview
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1
S713 S712
X122 1
S300 S302 S304 S306
S717 S716
X602
S301 S303 S305 S307
X420
X421
1
1
1 1
X501
S240
X500
5
8
1 2 3
2 4
1 3
S421
S601
S730
S731
1
X710
S714
8
S715
1
S710
3
S711
X503
12
X100
X506
X502
V431 V430
1
X700
X701 (bottom side)
4 5 6
7
Figure 15: Location of the audio connectors and switches
3.6.1
Audio Interface 1 (Handset)
This balanced interface has been optimized for use with the Votronic handset supplied with
the DSB75.
The Votronic handset is a passive handset. Power supply for its microphone is provided by
the DSB75.
The handset connects to the 4-pin Western jack X502. The pin assignment of the X502 jack
is shown in Table 12.
Table 12: Pin assignment of handset audio interface 1 (X502)
Signal name
Pin
I/O
Description
MICN
1
I
Microphone inverted
EPN
2
O
Loudspeaker inverted
EPP
3
O
Loudspeaker not inverted
MICP
4
I
Microphone not inverted
The Votronic handset is the reference handset used with the DSB75. Acoustic approval of
the Siemens DSB75 module applies to the reference configuration comprising the Votronic
handset and the DSB75. GSM applications that incorporate audio devices other than the
reference handset must be submitted for additional type approval.
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3.6.2
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Audio Interface 2 (Headset or Speakerphone Operation)
The unbalanced audio interface 2 is designed for use with headsets or speakerphones. The
interface is available on the 12-pin Lumberg connectors X700 and X701. The pin assignment
of the Lumberg jacks is shown in Table 13. The power for the microphone (VMIC) is supplied
by the GSM module. EPREF may be used for single ended loudspeaker configurations
saving an additional coupling capacitor.
Table 13: Pin assignment of audio interface 2 (X700, X701)
Signal name
X700 pin
X701 pin
I/O
GND
1
2
-
Ground
Not relevant for audio.
R
2
-
4.7k resistor to pin 3, necessary
for old charger types.
Not relevant for audio
VCharge
3
1
I
Supply voltage provided by the
plug-in charger.
Not relevant for audio
n.c.
4, 6, 7, 8
3, 4, 6, 7
-
Not connected.
Not relevant for audio
EPREF
-
9
-
100µF capacitor to AGND.
AC coupled loudspeaker ground
GND
5
5
-
5kOhm to GND.
AGND
9
11
-
Microphone and stereo
loudspeaker ground
MICP
10
12
I
Microphone not inverted.
EPP
11
10
O
Loudspeaker not inverted.
EPN
12
8
O
Loudspeaker inverted.
3.6.2.1
Description
Recommended Headset
A standard headset interface for mobile applications offered by Siemens is, for example, the
PTT headset, ordering number L36880-N4001-A123 or Headset PTT HHS-510.
Please note that the headset interface has no detections for a device plug or Push-To-Talk
key (PTT).
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3.6.2.2
s
Speakerphone Operation
The recommended speakerphones which are currently available for the audio interface 2 are
the “Siemens Car Kit Portable” and “Siemens Car Kit Portable HKP-500” (ordering number is
L36880-N5601-A109).
The plug of “Siemens Car Kit portable HKP-500” is
compatible to Lumberg connector X701.
The plug of “Siemens Car Kit Portable” is compatible to
Lumberg connector X700.
The required bias voltage for the MICP2 pin of the GSM
module has to be achieved by an additional 2.2-kOhmresistor (see chapter 3.6.3, description of microphone
interface 2).
Figure 16: Siemens Car Kit Portable HKP-500
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3.6.3
s
Microphone Circuit (Feeding Bridges)
This section describes the microphone signal path through feeding bridges. The location of
the audio connectors can be seen in Figure 14. Figure 17 shows the principal circuit of
microphone feeding bridges.
The bridge for the audio interface 1 is optimized for feeding the Votronic headset. The
balanced microphone is supplied with filtered 5V.
The bridge for the unbalanced interface 2 is supplied directly from VMIC_I (2.5V). The GSM
module requires a bias voltage of 1V…1.6V between MICP2_I and AGND_I. This is normally
achieved by the voltage drop of the electret microphone in the case of headset operation.
Please note for speakerphone operation, that no voltage drop occurs using the “Siemens Car
Kit Portable” or “Siemens Car Kit portable HKP-500”. In this case an additional
2.2 kOhm resistor has to be connected between MICP2_I and AGND_I. It is recommended
to connect this resistor between X102, pin 34 (AGND) and X102, pin 40 (MICP2).
VMIC_I
4.7k
5V0_I
4.7k
2.2k
10µF
MICP1_I
47k
10n
X502
47k
AGND_I
MICP
100nF
600R/200MHz
1n
MICN
MICN1_I
600R/200MHz
100nF
10n
2.2k
EMC-Filter
VMIC_I
2.2k
X700, X701
(Lumberg)
2.2k
MICP2_I
MICP
600R/200MHz
MICN2_I
2.2nF 5.6k
2.2nF
AGND
AGND_I
600R/200MHz
Figure 17: Circuit of microphone feeding bridges
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3.7
s
Digital Audio Interface
The Digital Audio Interface (DAI) can be used for acoustic approval or for transferring PCM
digital audio data between the GSM module and the customer application. The DAI of the
GSM module is designed for use with a codec or a DSP.
The DSB75 provides different possibilities for connections between the GSM module and the
system environment. This includes the 10 pin DAI connector X703 as well as the possibility
to use the pin headers (X101, X102).
Note: The DAI signals DAI0… DAI6 are connected to the signals USC0… USC6. The table
below shows the pin assignment of the 10 pin DAI connector X703.
Figure 18 shows the simplified interface schematic.
Figure 19 shows the pin location of DAI connector.
Electrical characteristics are specified in section 7.
B2B
X100
5V0
USC0
USC1
USC2
USC3
USC4
USC5
USC6
26
25
24
23
22
13
15
VDD
1
2
3
4
5
6
7
8
9
7
10
2x5 pin
X703
5V0
2.9V
DAI0
DAI1
DAI2
DAI3
DAI4
DAI5
DAI6
GND
Figure 18: DAI interface
1
9
X703
2
10
Figure 19: Location of DAI connector X703
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Table 14: Pin assignment of the USC/DAI interface X703
Signal name
Pin
PCM Interface
Type Approval DAI
I/O
Remark
I/O
5V0
1
O
O
VDD
2
O
O
DAI0 (USC0)
3
TXDAI
O
Clock 104kHz
O
DAI1 (USC1)
4
RXDAI
I
RX
I
DAI2 (USC2)
5
FS
O
TX
O
DAI3 (USC3)
6
BITCLK
O
Reset
I
DAI4 (USC4)
7
nc
I
Test1
I
DAI5 (USC5)
8
nc
I
Test2
I
DAI6 (USC6)
9
nc
I
Reset2
I
GND
10
-
-
-
-
5.0V supply for external
circuit
2.9V supply for external
circuit
Optional: FS_OUT
Ground
DAI adapter
X703
10 pole
25 pole
D-Sub
5V0 1
DSB75
USC0
USC2
3
5
USC1
USC6
4
9
10
2x
2
e.g.
74HCT4050
2
2x 3k3
2x
6k8
24
23
25
22
12
GSM
audio tester
(e.g. R&S UPL16)
with
GSM 11.10
DAI interface
Figure 20: Example for connecting measurement equipment
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3.8
USB Device Interface
DSB75 supports a USB 1.1 Full Speed (12 Mbit/s) device interface. It is primarily intended for
use as command and data interface and for downloading firmware.
The second USB interface with mini AB connector (X111) is reserved for future use and has
been not described.
Figure 21 shows the simplified interface schematic. Figure 22 shows the placement of the
USB connectors, switches, jumper and the pin location. Electrical characteristics are
specified in section 7.
DSB75 provides a USB B receptacle to connect a host device. The USB lines VBUS, D+, Dare connected directly to the GSM module via slide switches S110 - S112 (position 3).
In series to VBUS line there is a jumper (X120) connected. It is set during normal operation
and may be used for remote control facilities.
The rising edge of VBUS voltage generates an ignition signal (impulse) via the differential
circuit V420. This way it is possible to turn on GSM module from the host, by plugging in the
serial cable or by remote control.
The EMC circuit protects the DSB75 and the GSM module against overvoltage (e.g. ESD).
The USB I/O pins are capable of driving the signal at minimum 3.0V. They are protected from
5V input voltage driven from the host according to the USB specifications.
B2B
X100
IGT
56
d/dt
V420
USB-B
X110
Jumper
VUSB_IN
USB_DN
USB_DP
12
68
69
S110 3
1
S111
S112
1
VBUS
X120
EMC
2
3
1
3
3
1
4
D-
D+
GND
Figure 21: USB device interface
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X201
X205
X110
6
1
9
6
1
5
9
5
1423
X120
1
1
3
S455S456S457
S454S453S452
S450S451
S460S461S462
S465S464S463
S468S467S466
X400
1
1
S112 X121
1
S110
S458S459S469
X401
S111
Figure 22: Location of the USB interface, switches and jumper
Table 15: Pin assignment of USB device interface X110
X110
pin
Name
I/O
Description
X100 signal name
Config.
switches
1
VBUS
I (Supply)
USB bus voltage
VUSB_IN
S110:3
2
D-
Diff. I/O
Data line minus
USB_DN
S111:3
3
D+
Data line plus
USB_DP
S112:3
4
GND
GND
GND
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3.9
s
I²C Interface
The GSM module is the bus master device. The I2CDAT and I2CCLK lines have to be
connected on the slave side to a positive supply voltage via a current source or pull-up
resistor.
The number of interfaces connected to the bus is only dependent on the bus capacity limit of
400pF.
Each device connected to the bus is software addressable by a unique address, and simple
master/slave relationships exist at all times.
On the DSB75 both I²C lines can alternatively be used as SPI interface lines (if supported by
the GSM module, see section 3.11).
The I²C interface lines are available on the DSB75 at the 10 pin header X511. A level shifter
V500/V501 converts from 3V up to 5V logic. The 3V logic lines are connected directly to the
pins of the pin header X511, if switches S500 and S501 are set to position 1.
Attention: Two external pull-up resistors must be installed in the host application. There are
no on-board pull-up resistors.
The 5V compliant lines are an alternative to the 3V lines available on the X511 pin header.
To use 5V lines, set the switches S500 and S501 to position 3.
The two logic voltages 5V0 and VDD are available at the X511 pin header for supplying the
external I²C device driver.
For a simple test facility a 128kBit EEPROM device (D500) with adjustable address area
(S502 - S504) is implemented. Accordingly the switches S500 and S501 are set to position 3
(see Figure 23).
The LED V503 indicates that I2CCLK line is active (low).
The LED V504 indicates that I2CDAT line is active (low).
Figure 23 shows the simplified interface schematic.
Figure 24 shows the placement of the I²C switches and the pin location.
Electrical characteristics are specified in section 7.
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10 pole pin
X511
VDD
2
V504 (DAT)
V503 (CLK)
5V
0
VDD
0=on
1=off
level shifter:
B2B
X100
I2CCLK,
I2CDAT
11,70
1
2
S500,
S501
3
2,4
3k3
8,10
GND
V500/
V501
3k3
2
2
1,3
5V0
D500
2
VDD
7
I2C_CLK_5V,
I2C_DAT_5V
5V0
9
VDD
VDD
SCL,SDA
A(0:2)
I2C_CLK_3V,
I2C_DAT_3V
Address
3
3
1
EEPROM
128kBit
S502 (A0),
S503 (A1),
S504 (A2)
AT24C128N
V504
V503
Figure 23: I²C interface
S501
S504
S503
S502
S500
2
1
10
X511
9
Figure 24: I²C interface location
DSB75_hd_v08
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s
Table 16: Pin assignment of the I²C interface X511
X511
pin
Name
I/O
Description
X100 signal
name
Config.
switches
Remark
1
I2C_CLK_5V
O
Clock,
(5V logic)
I2CCLK
S500:3
EEPROM
accessible
2
I2C_CLK_3V
O
Clock,
(3V logic)
I2CCLK
S500:1
External
pull-up
resistor required
3
I2C_DAT_5V
I/O
Data,
(5V logic)
I2CDAT
S501:3
EEPROM
accessible
4
I2C_DAT_3V
I/O
Data,
(3V logic)
ISCDAT
S501:1
External
pull-up
resistor required
5
n.c.
6
n.c.
7
5V0
O
5V0 supply
voltage
8
GND
9
VDD
10
GND
DSB75_hd_v08
ON when DSB75
is supplied
Ground
O
2.9V supply
voltage
ON when GSM
module is active
Ground
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3.10
SD Card Interface
The SD card interface provides a card reader for SD (Secure Digital) memory cards.
It has a smooth push-push mechanism with front cover retention for temper-resistant card
insertion. There are two contacts for card detection and write protect detection.
The SD card interface can be operated in three modes:
• SD 4 bit mode
• SD 1 bit mode
• SPI bus mode
The supported operation mode depends on the type of GSM module and the selected
configuration (see subsections 3.10.1, 3.10.2 and 3.10.3). Each mode has to be set and
configured on the DSB75 by slide switches.
Figure 25 shows the simplified interface schematic.
Figure 26 shows the location of card reader pins and slide switches.
Electrical characteristics are specified in section 7.
B2B
X100
4)
8
10
S450-455
SD_xx
N412
71-74,10,9
1
6
3
47k
8
8
7
7
6
6
5
5
4
4
3
3
2
2
SD_D3_I
1
1
SD_D2_I
9
9
SD_D1_I
SD_D0_I
SD_CLK_I
VDD
alternative
SD_CMD_I
3
ASC1 1)
53,51,31,29
4
3
1
1
S301,303,
S305,307
3)
card
detect
SD_D0_I
write
protect
slide
DAT1
unlock
SD_DET
11
lock
SD_WP
X301
6
DAT0
GND
2)
CLK
VDD
GND
50k
CMD
CD/DAT3
DAT2
SD Card
SD_CLK_I
SD card holder
SD_CMD_I
SD_D3_I
1) ASC1= TXD1, RXD1, RTS1, CTS1
2) Internal switch is closed after power up and open
during regular data transfer, used for card detection,
if GPIO8 not available for card detection.
3) Card detect switch is closed when card is inserted.
4) Write protect switch is closed when card is unlocked
or MMC is inserted.
S300,302
S304,306
Figure 25: SD card interface
DSB75_hd_v08
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1
S455S456S457
S454S453S452
S450S451
S460S461S462
X510
S465S464S463
S458S459S469
2
1
S468S467S466
S110
3
9
10
39
40
1
1 39
2 40
X101
X551
S501
X562
X552
S200
S504
S201
S502
9 10
9
1
X703
X554
10
2
S503
S500
X511
1 2
1 X561
1 X560
X102
1
2
S713S712
S717S716
S300S302S304S306
S301S303S305S307
S731
S730
1
X500
11 10 8 7 6 5 4 3 2 1 9
X301
Figure 26: Location of slide switches and card reader pins
DSB75_hd_v08
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3.10.1
SD 4 Bit Mode
Table 17: Pin assignment of SD card interface X301 (SD 4 bit mode)
X301
pin
1
X301
signal
name
CD/DAT3
I/O
I/O
Description
Data line bit
3,
Card detect
Remark
Card detect at power on:
0 or open = card
removed
1 or 50k pull-up = card
inserted
X100
signal
name
SD_D3
Configuratio
n
switches
S453:1
S301:1
Note: This is no removal
detection during card
operation!
2
CMD
O
Command /
Response
SD_CM
D
GND
3
VSS1
Supply
Ground
4
VDD
Supply
Supply
voltage
2.9V
5
CLK
O
Clock
25.4kHz …13MHz
(depends on SW
performance)
SD_CLK
S455:1
S303:1
S454:1
S305:1
6
VSS2
Supply
Ground
GND
7
DAT0
I/O
Data line bit 0
SD_D0
S450:1
S307:1
8
DAT1
I/O
Data line bit 1
SD_D1
S451:1
9
DAT2
I/O
Data bus bit 2
SD_D2
S452:1
10
CD
I
Card
detection
0 = card inserted
1 = card removed
SD_DET
Note: On each edge an
interrupt will be
generated. Removing the
card will stop its
operation before
disconnecting it.
11
WP
DSB75_hd_v08
I
Write protect
detection
0 = unlocked
1 = locked
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3.10.2
SD 1 Bit Mode
Table 18: Pin assignment of SD card interface X301 (SD 1 bit mode)
X301
pin
X301
signal
name
1
-
I/O
I/O
Description
Remark
Not used
X100
signal
name
SD_D3
Configuratio
n switches
S453:3
S301:1
2
CMD
O
Command /
Response
SD_CM
D
GND
3
VSS1
Supply
Ground
4
VDD
Supply
Supply
voltage
2.9V
5
CLK
O
Clock
25.4kHz …13MHz
(depends on SW
performance)
SD_CLK
S455:1
S303:1
S454:1
S305:1
6
VSS2
Supply
Ground
GND
7
DATA
I/O
Data line
SD_D0
S450:1
S307:1
8
-
Not used
9
-
Not used
10
CD
I
Card
detection
0 = card inserted
1 = card removed
SD_DET
Note: On each edge an
interrupt will be generated.
Removing the card will stop
its operation before
disconnecting it.
11
WP
DSB75_hd_v08
I
Write protect
detection
0 = unlocked
1 = locked
Page 49 of 94
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3.10.3
SPI Bus Mode
This interface is an option and an alternative to the ASC1 and SPI2 interfaces. It has to be
reconfigured via AT commands as SPI bus mode SD card interface. For further information
refer to section 3.11.
Table 19: Pin assignment of SD card interface X301 (SPI bus mode)
X301
pin
X301
signal
name
1
CS
I/O
O
Description
Chip select
Remark
Active low
X100
signal
name
TXD1
Configuratio
n switches
S300:3
S301:3
S453:3
2
DI
I
Data input
Data out (DO) at SD card
side
CTS1
S306:3
S307:3
S450:3
3
VSS1
Supply
Ground
GND
4
VDD
Supply
Supply
voltage
2.9V
5
SCLK
O
Clock
up to 3.25MHz
RTS1
S304:3
S305:3
S454:3
6
VSS2
Supply
Ground
7
DO
O
Data output
GND
Data in (DO) at SD card
side
RXD1
S302:3
S303:3
S455:3
8
-
Not used
9
-
Not used
10
CD
I
Card
detection
0 = card inserted
1 = card removed
SD_DET
Note: On each edge an
interrupt will be generated.
Removing the card will stop
its operation before
disconnecting it.
11
WP
DSB75_hd_v08
I
Write protect
detection
0 = unlocked
1 = locked
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3.11
Serial Peripheral Interfaces
The Serial Peripheral Interface (SPI) system consists of one master device and one or more
slave devices.
The master is defined as a microcomputer providing the SPI clock, and the slave as any
integrated circuit receiving the SPI clock from the master. The GSM module always operates
as a master device in master-slave operation mode.
The SPI has a 4-wire synchronous serial interface. Data communication is enabled with a
low active Slave Select or Chip Select wire (CS). Data are transmitted with a 3-wire interface
consisting of wires for serial data input (DI), serial data output (DO) and serial clock (SCLK).
The GSM module may provide two different SPI interfaces available alternatively to the I²C-,
and ASC1- lines (depending on software configuration). On the DSB75, they are available on
the 10 pin X510 pin header.
In order to use the SPI interfaces some switches have to be set (see Figure 27).
The logic voltage VDD is available at the X510 pin header for the supply of the external SPI
device driver.
Table 20: Alternative configuration of SPI interface lines
SPI interfaces
SPI1
Alternative interfaces
CS1
DI1
DO1
I2C
I2CDAT
SCLK1
SPI2
CS2
I2CCLK
ASC1
TXD1
DI2
RXD1
DO2
CTS1
SCLK2
RTS1
Figure 27 shows the simplified interface schematic.
Figure 28 shows the placement of the SPI related switches and the pin location.
Electrical characteristics are specified in section 7.
B2B
X100
TXD1
RXD1
RTS1
CTS1
SPICS
SPIDI
I2CCLK
I2CDAT
31
29
51
53
75
7
11
70
4
S300
S302
S304
S306
10 pin
X510
4
1
3
4
S456
S457
S500
S501
4
1
3
VDD
1
3
5
7
CS2
DI2
SCLK2
DO2
2
4
6
8
CS1
DI1
SCLK1
DO1
9
10
SPI2
SPI1
VDD
GND
Figure 27: SPI interfaces
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S455S456S457
S454S453S452
S450S451
X510
S460S461S462
2
1
S465S464S463
S458S459S469
3
S468S467S466
S110
1
9
10
9
1
X703
10
2
S501
X562
39
40
1 39
2 40
X101
1
X551
X554
X552
S200
S504
S201
S502
9 10
S503
S500
X511
1 2
1 X561
1 X560
1
2
X102
S713S712
S717S716
S300S302S304S306
S301S303S305S307
Figure 28: SPI interfaces location and related switches
Table 21: Pin assignment of the SPI interfaces X510
X510
pin
Name
I/O
Description
X100 signal
name
Config.
switches
1
CS2
O
Chip select 2
TXD1
S300:1
2
CS1
O
Chip select 1
SPICS
S456:1
3
DI2
I
Data in 2
RXD1
S302:1
4
DI1
I
Data in 1
SPIDI
S457:1
5
SCLK2
O
Clock 2
RTS1
S304:1
6
SCLK1
O
Clock 1
I2CCLK
S500:1
7
DO2
O
Data out 2
CTS1
S306:1
8
DO1
O
Data out 1
I2CDAT
S501:1
9
VDD
O
2.9V supply out
10
GND
DSB75_hd_v08
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3.12
Analog Interface
The DSB75 provides an analog interface allowing you to efficiently evaluate the
characteristics of the analog baseband codec of the GSM module:
•
•
•
•
•
This analog interface has 2 analog inputs and one analog output.
The analog input lines are available on the pin header X101.
The analog output is available as a pulse width modulation (PWM) signal on the pin
header X101.
A filter circuit 2nd order smoothes the PWM signal.
The filter on the DSB75 is optimized for 8.125kHz PWM frequency and can be removed
by customer. Therefore the jumpers X560 - X562 have to be replaced by customer
circuit.
0,1
1
10
100
1000
10000
100000
0
-10
Filter attenuation [dB]
-20
-30
-40
-50
-60
-70
-80
-90
PWM frequency [Hz]
Figure 29 PWM filter characteristics
•
For self test facilities it is possible to turn on test loops. Each analog input can be
connected to the filter output.
X562
39
40
X101
1
1 39
2 40
1
X551
X552
S501
S503
S200
9
1
X703
X554
10
2
S504
S201
S502
9 10
S500
X511
Figure 30 shows the placement of the related switches and the pin location.
Figure 31 shows the simplified interface schematic.
Electrical characteristics are specified in section 7.
3
1 X561
1 X560
X102
1
2
Figure 30: Analog interface location and related switches
DSB75_hd_v08
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Test point strips
X101
B2B
X100
79
DACOUT
38
Filter:
41
GND
40
GND
2
X560
1
2
X561
X562
3
3
1
X551
DACOUT_F
DACOUT_F
1
1
X552
2
37
3
35
57
34
AD1_IN
AD2_IN
AGND
DACOUT
AD1_IN
AD2_IN
AGND
Figure 31: Analog interface
Table 22: Pin assignment of the analog interface
Pin
Name
I/O
Description
X100 signal
name
Switch
setting
for loop
Remark
X101/37
AD1_IN
I
ADC Input 1
AD1_IN
X551:3
X101/35
AD2_IN
I
ADC Input 2
AD2_IN
X552:3
If no loop required
Keep switches in
position 1
X101/34
AGND
Ground for
ADC Inputs
AGND
X101/38
DACOUT
O
DAC Output
(PWM)
DACOUT
X561/1
DACOUT_F
O
DAC Output
(filtered)
DACOUT
X101/40
GND
DSB75_hd_v08
If no loop required:
Jumper bridge X561
can be removed
Ground for
DAC Output
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3.13
s
Antenna Interface
The RF signal of the GSM module is connected via the supplied RF adapter cable to the
Hirose RF jack X505 located on the DSB75. Furthermore, in order to send or receive data,
connect an external RF antenna to the SMA jack X506 which is internally connected to the
Hirose RF connector X505.
To obtain optimum send and receive performance, a steel grounding plate (at least 300mm x
300mm) should be placed underneath the antenna.
Please consider that the supplied antenna equipment has been chosen to achieve optimum
RF performance when operating the GSM module at the DSB75. Siemens does not accept
warranty claims for damage caused by inappropriate equipment connected to the antenna
connectors.
Electrical characteristics are specified in section 7.
DSB75_hd_v08
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3.14
Power Supply Interfaces
The constant voltage supply on the PCB provides all the supply voltages required for
operating DSB75 and the GSM module. The power supply source can be a 9V…15V
laboratory PSU or mains adapter and, in addition, an external battery used to feed only the
GSM module.
The DSB75 has three power supply interfaces:
• Interface X400/X401 – connects to a laboratory PSU for supplying the DSB75 itself and
the connected GSM module. See section 3.14.2.
• Interface X602 (screw terminal block) - connects to an external battery for supplying only
the GSM module, while DSB75 is powered from the laboratory PSU. See section 3.14.3.
• Interface X700 or X701 (Lumberg connector) – input for charging the battery. See section
3.14.3.1.
The S601 toggle switch selects whether to feed the GSM module from the laboratory PSU or
a battery. If no battery is connected the S601 switch must be flipped down to supply voltage
(BATT+) for the GSM module. Vice versa, if a battery is present, it must be flipped up.
Figure 32 shows the simplified power supply interfaces schematic. Figure 33 shows the
placement of the power supply connectors, switches, jumpers and the pin location.
5V0
N412
LDO
PWR_IND
VDD (2.9V)
EN
V200
N400
+
PSU
9-15V
-
red
X400
black
-
5.0V-8V
5.0V
DC
LDO
3V0
DC
X401
X700
Charger +
N411
PWR_IND
1
3
X701
-
X405
2
4
41-45
V60x, N600
6
X710
S601
5V0
4,5
33
100µF +
adj.
3V3_4V5
S601
regulator
3
SD
1
1
+
VBAT
Charging
circuit
3
34
35
14
67
27
1,2
Battery
78
N410
B2B
X100
PWR_IND
VDDLP
BATT+
VCHARGE
CHARGEGATE
ISENSE
VSENSE
BATTEMP
X602
Figure 32: Power supply interfaces
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s
X110
1423
X401
X400
1
1
X120
S112 X121
1
S111
N400
C413
V 601
N410
V 602
X410 X405
1
1
1
X411
V 600
N6 00
C414
C415
1
X122 1
X602
S601
5
1
X710
S714
S715
X505
S710
TP105
S711
1
12
TP106
X506
V431 V430
X700
Figure 33: Location of the power supply connectors, switches and jumpers
DSB75_hd_v08
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3.14.1
Internal Supply Voltages
This section describes the internal supply voltages generated by the power supply unit of
DSB75. A simplified block diagram of the power supply concept is shown in section 3.14.
Table 23: Description of power supply units
Power Supply Unit
Description
General supply 5V0
(see Figure 34)
DSB75 accepts an input voltage between 9V and 15V DC on jacks X400
and X401.
These ports are protected against polarity reversal by a simple diode
V400.
To reduce power dissipation, a DC/DC converter N400 provides a
constant voltage of 5.0V. This voltage is used for supplying 3 LDOs and
the audio section with power and is available for battery charging,
supplying I2C and DAI interface.
Audio supply (5V0_I)
(see Figure 35)
Audio power supply is decoupled with simple low pass filters from 5V0
supply.
GSM module supply
(3V3_4V5 or BATT+)
(see Figure 36)
For supplying the GSM module with regulated voltage the toggle switch
S601 must be flipped down.
In addition, the LDO for battery voltage N410 is adjustable for three
voltage values (please refer to Table 29 and Figure 39).
Two capacitors at 4700µF suppress voltage drops and ripples at GSM
burst.
For remote control, the jumper X405 has to be set to shut down the
voltage.
Power supply to digital
part of DSB75
(3V0)
(see Figure 32)
The simple LDO (N411) regulates the 5V0 voltage down to 3.0V.
Digital IO supply
(VDD)
(see Figure 32)
The simple LDO (N412) regulates the 5V0 voltage down to 2.9V but this
voltage is enabled by inverted PWR_IND signal. Therefore VDD is only
present when the GSM module is operating.
This voltage supplies the digital devices (RS232 driver, LED-driver).
This voltage supplies the digital IO pull-up resistors, EEPROM, SD card
and the digital interfaces: I²C, SPI, DAI.
3N3
C402
8K25
LM2596S-ADJ
2-POL
2
47U
2
5
1
2
GND1 GND2
V400
1
X401
OUT
1
C400,401,405
3
6
N400
V401
2-POL
1SR154-400
2
1
2
X400
ZJYS51R5-2PT
4
40V/1A
1
R401
2K7
R400
5V0
C403,410,413
470,473
L401
4812µF
661µF
L400
GND
GND
GND
GND
GND
Figure 34: Input circuit schematic (5V DC/DC converter) for power supply
DSB75_hd_v08
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5V0
GND
GND
GND
100µF
5V0_I
C753
C752
R751
100µF
R750
C751
100R
100N
100R
C750
100N
AUDIO
GND
Figure 35: Schematic for audio supply (5V0_I)
SD
GND
3
5
ADJ
3V3_4V5
N410
C412,414,415
C411
1
4
VOUT
R410
R409
LP3856-ADJ
1N
10K
2
5V0
VIN
2K7
2
9410µF
1
X405
GND
2
R414
R411
GND
1K
GND
2
R415
1
1K
X410
1
1K
X411
GND
Figure 36: Schematic for GSM module supply (3V3_4V5 or BATT+)
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3.14.2
s
Power Supply for DSB75 and GSM Module
The voltage provided by the 9V…15V PSU generates all supply voltages required for the
DSB75 and the connected GSM module when battery operation is disabled.
The output power of the laboratory PSU has to satisfy the SELV requirements in accordance
to EN 60950.
Table 24: Recommended specification of the laboratory PSU
Parameters
Value
Unit
Min.
Typical
Max.
Output voltage
8.5
12
15.5
Output current
1.5
V
A
Table 25: Connecting the laboratory PSU to X400 and X401
Voltage
Connector
Color
Supply voltage +9V…+15V
4 mm PCB jack
Red (X400)
Ground
4 mm PCB jack
Black (X401)
If no battery is present and the GSM module is powered from the laboratory PSU be sure
that the S601 toggle switch is in down position.
The green LED (V431) on the DSB75 is driven by 3V0 voltage and indicates that the DSB75
is supplied with power and switched on. See also 4.3.
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3.14.3
Battery Powered Operation of GSM Module
-
1
Battery
Battery Connector
The external battery connects to the screw
terminal block X602 (see Figure 37).
3
5
+
X602
Figure 37: Battery screw terminal
For battery operation, the toggle switch S601 must be flipped up (position 3). In this case, the
GSM module is powered only from the battery. Furthermore, it is necessary to keep the
laboratory PSU connected for operating parts of the DSB75.
Table 26: Pin assignment of the screw terminal X602
X602 pin.
Function
1, 2
GND
4, 5
VBAT (BATT+)
3
Thermal resistor (NTC)
The following batteries meet the requirements of the GSM module:
ƒ
Lithium Ion with 10k NTC
ƒ
Lithium Polymer with 10k NTC
See module specification [1] for details.
3.14.3.1
Charging the Battery
The battery charging current should be supplied from an external plug-in charger connected
to the Lumberg connector X700 or X701 on the DSB75.
Please note that the plug-in charger is not part of the delivery scope of the DSB75. It can be
purchased on request from your local Siemens dealer:
Siemens ordering number: A5BHTN00127458 (connector compatible to X701)
Charging can be accomplished regardless whether the battery was deeply or partly
discharged.
The charger has to meet the following requirements:
Output voltage:
4.75V … 10V
Output current:
≥550mA or ≥1050mA
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Table 27: Pin assignment of the X700 jack for the plug-in charger
Pin no.
Name
I/O
Description
1
GND
-
Ground
2
R
-
4.7k resistor to pin 3 (necessary for old charger types)
3
VCharge
I
Supply voltage provided by the plug-in charger
4 -12
-
-
Not relevant for charger (keep not connected)
Table 28: Pin assignment of the X701 jack for the plug-in charger
Pin no.
Name
I/O
Description
1
VCharge
I
Supply voltage provided by the plug-in charger
2
GND
-
Ground
3 -12
-
-
Not relevant for charger (keep not connected)
3.14.3.2
Charging Circuit
If a battery is used, it is possible to charge the battery by the charger circuitry on the DSB75.
The charger circuitry provides trickle charge to the battery when the mobile is in deep
discharge lockout or undervoltage lockout (when the battery condition is not suitable), and
provides fast charging at normal charging conditions.
This section describes the charging circuit of the DSB75 only. The battery management and
charging algorithm is described in [1]. Figure 38 shows the charging circuit of DSB75.
For supplying the GSM module by battery the toggle switch S601 must be flipped up to
connect the module’s supply voltage pin BATT+ to the battery and to be ready for connecting
the external charger.
The jumper X710 selects either the voltage from the external charger or the 5V0 board
voltage for battery charging.
Trickle Charging:
The 5.0V LDO regulator N600 protects the VCHARGE line against not allowed voltages >5V.
The diode V600 prevents reverse battery discharging if the charger is removed. The GSM
module delivers the trickle current back to the battery if a valid battery is recognized
chargeable and VCHARGE > VBATT+.
There are two trickle charge currents possible: 5mA (battery is deep discharged) or 30mA
(battery has undervoltage).
Fast Charging:
The charge current is controlled by the GSM module (via CHARGEGATE). The
CHARGEGATE is a current sink (operation range 0…0.6mA). Because CARGEGATE needs
overvoltage protection (>4.5V), FET V601 reduces the control voltage.
VCHARGEGATE= VBATT+ - VGS(V601) = max 3.5V
The CHARGEGATE control current flows through the R604. This resistor determines the
gate source voltage VGS(V602). The value of R604 is dimensioned for driving the maximal fast
charge current of 1A at 0.5mA control current. In this case the fast-charging-FET V602
reaches only the beginning of the saturation region.
The current is measured differentially via the sense lines VSENSE, ISENSE (voltage drop at
shunt resistors R602 and R603).
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The battery voltage is measured at the VSENSE line.
The battery temperature is measured at the BATTEMP line (voltage drop at NTC in battery
pack).
The diode V603 prevents reverse battery discharging in fast charging path if the power failed.
Current calculation:
The current will be ramped up and down by battery management and reaches the maximum
at VISENSE = 150mV.
Imax
=150mV / 0.3Ohm =
500mA @ Jumper X600 open
=150mV / 0.15Ohm = 1A
@ Jumper X600 closed
DSB75
B2B
X100
N600
LDO
5.0V
GSM module
VCHARGE
Charging On
Trickle charge current 5mA or 30mA
5mA or 30mA
Trickle curent control
3
4
X600
POWER
3
R602
0R15
10k
6
X602
V603
+
-
T
+
-
BATTEMP
4,5
1,2
V602
Charger
supply
5V...8V
U
ISENSE
MUX
2
3
VSENSE
VISENSE
5V0
R604
+
S601
1
10k
1
max.150mV
R603
0R15
X710
1.2V
I
BATT+
ADC
+A
- D
Sense
Battery management
3V3_4V5
BATT+
B ATT+
S601
X700, X701
Fast charge current
I=VISENSE/(R603+R602)
+
BATT+
V601
CHARGEGATE
Control current
0...0.6mA
Charging current control
Figure 38: Schematic of charging circuit
3.14.4
Real Time Clock Supply
A 100µF capacitor placed on the DSB75 is charged by the VDDLP line of the GSM module
as long as the voltage BATT+ is applied.
In case of power failure, the real time clock of the GSM module is supplied by the capacitor
for approx. 40 seconds.
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3.14.5
s
Adjusting the VBATT+ Supply Voltage for the GSM Module
For test purposes, the VBATT+ voltage supplied to the GSM module can be adjusted using
jumpers and variable resistors.
The jumpers X410 and X411 serve to set the VBATT+ voltage range, and the variable resistors
R414 and R415 are used to adjust the supply voltage within the selected range. Therefore,
first set the range (lower limit or normal). Then turn the screw of the associated resistor R414
or R415 to reduce or increase the desired voltage, while measuring the module’s input
voltage at its test points BATT+ and GND. Take into account that voltage drops and ripples
may occur. The maximum voltage is set only via the jumpers, it cannot be adjusted via the
resistors.
Figure 39 shows the location of the jumpers and variable resistors on the DSB75. The
settings for adjusting the supply voltage of the GSM module are described in Table 29.
Table 29: Adjusting BATT+ voltage (3V3_4V5)
Voltage
type
Jumper
X410
Jumper
X411
Variable
Resistor
Voltage range
Default setting
Upper limit
closed
closed
---
4.5V +-5% fixed
Normal
closed
open
R415
2.85V. to 4.5V
4.1V +- 5%
Lower limit
open
closed
R414
2.85V. to 4.5V
3.5V +- 5%
Figure 39: Location of jumpers and resistors for
adjusting BATT+ voltage (3V3_4V5)
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4
s
Status LEDs
TXD0 / USC1
CTS0
RING0
RXD0 / USC2
RTS0
DSR0
DTR0
DCD0
The DSB75 comprises several status LEDs. The position, the corresponding signal and the
color of the LEDs can be seen in Figure 40.
RXD1
RTS1
CTS1
TXD1
TXD2 / GPIO10
RXD2 GPIO9
SYNC
GPIO1 / SD_DO
I2CDAT
I2CCLK
GPIO2 / SD_D1
GPIO3 / SD_D2
GPIO4 / SD_D3
SD_CLK / GPIO5
SD_CMD / GPIO6
Figure 40: Location of LEDs
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4.1
s
Indication of Asynchronous Serial Interface Signals
All signals of the asynchronous interfaces ASC0, ASC1 and ASC2 are connected to buffers
which drive 16 indicator LEDs. These buffers are enabled via the PWR_IND line which is
activated by the module. As a result, the indication only is active if the module is turned on.
For all: 0=on, 1=off
RTS0,
CTS0,
DSR0,
DTR0,
DCD0,
RING0,
RXD1,
TXD1,
RTS1,
CTS1
RXD2
TXD2
3V0
12
14x
14x
14
RXD0
LED
Signal
V235
V230
V233
V234
V237
V232
V236
V231
RXD0 / USC2
TXD0 / USC1
RTS0
CTS0
DSR0
DTR0
DCD0
RING0
V238
V240
V241
V239
RXD1
TXD1
RTS1
CTS1
V242
V243
RXD2 / GPIO9
TXD2 / GPIO10
USC2
TXD0
USC1
PWR_IND
EN
Figure 41: ASC signal indication circuit
4.2
Indication of GPIO Signals and SYNC
If no SD card is in use, the GPIO signals provided at the B2B connector can be used for
status indication. Buffers connected to these lines are enabled by the PWR_IND line which is
activated by the GSM module. As a result, the indication only is active if the module is turned
on.
For all: 0=on, 1=off
excepted SYNC signal: 0=off, 1=on
3V0
SD_DO
SD_D1
SD_D2
SD_D3
SD_CLK
SD_CMD
RXD2_GPIO9
TXD2_GPIO10
LED
Signal
V450
V451
V452
V453
V454
V455
V242
V243
GPIO1 / SD_DO
GPIO2 / SD_D1
GPIO3 / SD_D2
GPIO4 / SD_D3
GPIO5 / SD_CLK
GPIO6 / SD_CMD
GPIO9 / RXD2
GPIO10 / TXD2
8x
3V0
8x
8
8
SYNC
PWR_IND
EN
V244
Figure 42: GPIO signal indication circuit
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4.3
s
Indication of Power
There are two power control LEDs on the DSB75.
The green power control LED V431 is connected to the DSB75 supply voltage 3V0 which is
always available when the DSB75 receives an input voltage.
The yellow power control LED V430 is driven from the supply voltage VDD that is only active
if a module is connected and turned on.
4.4
Indication of I²C Lines
The LED V503 indicates that I2CCLK line is active (low).
The LED V504 indicates that I2CDAT line is active (low).
For detailed information see Figure 23.
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5
s
Overview of Switches and Jumpers
This section provides an overview of all switches and jumpers located on DSB75. The exact
location of each switch and jumper is shown in Figure 2 and Figure 43.
5.1
Overview of Switches
Table 30: Overview of switch positions
Reference
Function
Switch position 1
S110
Do not use this position! (reserved for
future use)
Switch position 3
Connects the VUSB_IN line directly to USB
connector X110 (VBUS)
Source of VUSB_IN voltage is the DSB75
(5V)
S111
Do not use this position! (reserved for
future use)
Connects the USB_DN line directly to USB
connector X110 (D-)
Connects the USB_DN line to the USBOTG interface (D110, X111)
S112
Do not use this position! (reserved for
future use)
Connects the USB_DP line directly to USB
connector X110 (D+)
Connects the USB_DP line to the USBOTG interface (D110, X111)
S200
S201
S300
Using RXD0 line as ASC0-RXD
Using USC2 line as ASC0-RXD
Connects B2B connector signal RXD0 to
the RS-232 transceiver D200 used for
asynchronous serial interface ASC0
Connects B2B connector signal USC2 to
the RS-232 transceiver D200 instead of
RXD0
Using TXD0 line as ASC0-TXD
Using USC1 line as ASC0-TXD
Connects B2B connector signal TXD0 to
the RS-232 transceiver D200 used for
asynchronous serial interface ASC0
Connects B2B connector signal USC1 to
the RS-232 transceiver D200 instead of
TXD0
Using TXD1 line as SPI2 chip select
Using TXD1 line as ASC1-TXD or SD card
chip select (SPI mode)
Connects B2B connector signal TXD1 to
the signal SPI2_CS at connector X510
pin 1
S301
Using TXD1 line as ASC1-TXD
Connects B2B connector signal TXD1 to
the RS-232 transceiver D201 used for
asynchronous serial interface ASC1 if
S300 is in position 3
S302
Using RXD1 line as SPI2 data in
Switch position 2: Connects B2B
connector signal RXD1 to the signal
SPI2_DI at connector X510 pin 3
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Connects B2B connector signal TXD1 to
S301 pin 2
Using TXD1 line as SD card chip select
(SPI mode)
Connects B2B connector signal TXD1 to
the card reader connector X301 pin 1 if
S300 is in position 3
Using RXD1 line as ASC1-RXD or SD card
data in (SPI mode)
Connects B2B connector signal RXD1 to
S303 pin 2
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Reference
Function
Switch position 1
S303
Using RXD1 line as ASC1-RXD
Connects B2B connector signal RXD1 to
the RS-232 transceiver D201 used for
asynchronous serial interface ASC1 if
S302 is in position 3
S304
Using RTS1 line as SPI2 clock
Connects B2B connector signal RTS1 to
the signal SPI2_SCLK at connector X510
pin 5
S305
Using RTS1 line as ASC1-RTS
Connects B2B connector signal RTS1 to
the RS-232 transceiver D201 used for
asynchronous serial interface ASC1 if
S304 is in position 3
S306
Using CTS1 line as SPI2 data out
Connects B2B connector signal CTS1 to
the signal SPI2_DO at connector X510
pin 7
S307
Using CTS1 line as ASC1-CTS
Connects B2B connector signal CTS1 to
the RS-232 transceiver D201 used for
asynchronous serial interface ASC1 if
S306 is in position 3
S450
S451
S452
S453
S454
S455
S456
s
Switch position 3
Using RXD1 line as SD card data in (SPI
mode)
Connects B2B connector signal RXD1 to
the card reader connector X301 pin 2 if
S302 is in position 3
Using RTS1 line as ASC1-RTS or SD card
clock (SPI mode)
Connects B2B connector signal TXD1 to
S305 pin 2
Using RTS1 line as SD card clock (SPI
mode)
Connects B2B connector signal RTS1 to
the card reader connector X301 pin 5 if
S304 is in position 3
Using CTS1 line as ASC1-RCS or SD card
data out (SPI mode)
Connects B2B connector signal TXD1 to
S307 pin 2
Using CTS1 line as SD card clock (SPI
mode)
Connects B2B connector signal CTS1 to
the card reader connector X301 pin 7 if
S306 is in position 3
Using SD_D0 line as SD card data0
Using SD_D0 line as GPIO1
Connects B2B connector signal SD_D0 to
SD card connector X301 pin 7
Connects B2B connector signal SD_D0 to
S460 pin 2
Using SD_D1 line as SD card data1
Using SD_D1 line as GPIO2
Connects B2B connector signal SD_D1 to
SD card connector X301 pin 8
Connects B2B connector signal SD_D1 to
S461 pin 2
Using SD_D2 line as SD card data2
Using SD_D2 line as GPIO3
Connects B2B connector signal SD_D2 to
SD card connector X301 pin 9
Connects B2B connector signal SD_D2 to
S462 pin 2
Using SD_D3 line as SD card data3
Using SD_D3 line as GPIO4
Connects B2B connector signal SD_D3 to
SD card connector X301 pin 1
Connects B2B connector signal SD_D3 to
S463 pin 2
Using SD_CLK line as SD card clock
Using SD_CLK line as GPIO5
Connects B2B connector signal SD_CLK
to SD card connector X301 pin 5
Connects B2B connector signal SD_CLK to
S464 pin 2
Using SD_CMD line as SD card command
Using SD_CMD line as GPIO6
Connects B2B connector signal SD_CMD
to SD card connector X301 pin 2
Connects B2B connector signal SD_CMD
to S465 pin 2
Using SPICS line as SPI1 chip select
Don’t use!
Connects B2B connector signal GPIO7 to
pin 2 of the SPI connector X510 (signal
GPIO7_SPI)
Connects B2B connector signal SPICS to
S466 pin 2
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Reference
Function
Switch position 1
S457
s
Switch position 3
Using SPIDI line as SPI1 data in
Don’t use!
Connects B2B connector signal GPIO8 to
pin 4 of the SPI connector X510 (signal
GPIO8_SPI)
Connects B2B connector signal SPIDI to
S467 pin 2
Using RXD2 line as ASC2-RXD
Using RXD2 line as GPIO9
Connects B2B connector signal
RXD2_GPIO9 to the RS-232 transceiver
D201 used for asynchronous serial
interface ASC2
Connects B2B connector signal
RXD2_GPIO9 to S468 pin 2
Using TXD2 line as ASC2-TXD
Using TXD2 line as GPIO10
Connects B2B connector signal
TXD2_GPIO10 to the RS-232 transceiver
D201 used for asynchronous serial
interface ASC2
Connects B2B connector signal
TXD2_GPIO10 to S469 pin 2
S460
Pulls up GPIO1
Pulls down GPIO1
S461
Pulls up GPIO2
Pulls down GPIO2
S462
Pulls up GPIO3
Pulls down GPIO3
S463
Pulls up GPIO4
Pulls down GPIO4
S464
Pulls up GPIO5
Pulls down GPIO5
S465
Pulls up GPIO6
Pulls down GPIO6
S466
Don’t use!
Don’t use!
S467
Don’t use!
Don’t use!
S468
Pulls up GPIO9
Pulls down GPIO9
S469
Pulls up GPIO10
Pulls down GPIO10
S500
Activates 3 Volt I2CCLK line at connector
X511
Activates 5 Volt I2CCLK line at connector
X511
S501
Activates 3 Volt I2CDAT line at connector
X511
Activates 5 Volt I2CDAT line at connector
X511
S502
EEPROM address line A0 is low
EEPROM address line A0 is high
S503
EEPROM address line A1 is low
EEPROM address line A1 is high
S504
EEPROM address line A2 is low
EEPROM address line A2 is high
X551
AD1_IN signal is open
AD1_IN signal is connected to the filtered
DAC_OUT signal
X552
AD2_IN signal is open
AD2_IN signal is connected to the filtered
DAC_OUT signal
X554
Module boots from flash (normal
operation)
For Siemens internal use only!
S458
S459
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Module boots from ROM based flash loader
(necessary if flash is empty or corrupt)
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Reference
Function
Switch position 1
S7101)
S711
S7121)
S713
S7141)
S715
S7161)
S717
S7301)
Switch position 3
Disconnects a speaker connected to the
Lumberg connector X700 or X701
(audio interface 2)
Activates a speaker connected to the
Lumberg connector X700 or X701 (audio
interface 2)
Disconnects a speaker connected to the
handset connector X502
(audio interface 1)
Activates a speaker connected to the
handset connector X502 (audio interface 1)
Disconnects a microphone connected to
the Lumberg connector X700 or X701
(audio interface 2)
Activates a microphone connected to the
Lumberg connector X700 or X701 (audio
interface 2)
Disconnects a microphone connected to
the handset connector X502
(audio interface 1)
Activates a microphone connected to the
handset connector X502 (audio interface 1)
Connects voltage VMIC to the microphone
feeding bridges
Disconnects voltage VMIC
(necessary for using audio inputs)
S7311)
s
Connects analog ground AGND to the
microphone feeding bridges
(necessary for using audio inputs)
Audio (microphone) inputs at X502,700,701
doesn’t work
Disconnects analog ground AGND
Audio (microphone) inputs at X502, X700,
X701 does not work
1)
Set the switch to position 3 (disconnect state) using a separate customized audio circuit
connected to the pin headers X101, X102.
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EEPROM A0
S500
=0 1
S502
=1 3
EEPROM A1
=0 1
S503
=1 3
EEPROM A2
=0 1
=1 3 S504
VUSB_IN
3
5V; on EEPROM
1
3V; on SPI1_CLK
I2CCLK
USB_DN
S501
3
5V; on EEPROM
1
3V; on SPI1_CLK
from X111 1
S110
from X110 3
S111
I2CDAT
USB_DP
AD2_IN
from X110 3
from X111 1
from X110
3
from X111 1
S112
open 1
on DAC_OUT
3 S552
open 1
AD1_IN
on DAC_OUT
RXD2_GPIO9
Don't Use
GPIO9
GPIO6
GPIO2
GPIO1
SD_D0 / GPIO1
SD_D1 / GPIO2
SD_CLK / GPIO5
SD_CMD / GPIO6
S551
3
RXD2 1
GPIO9
3
pull-up 1
pull-down
3
3
S459 1
S458
S 46
3
pull-up 1
pull-down
3
pull-up 1
pull-down
3
S4
3 pull-down
Don't use
6
S 4 6 1 pull-up
68
S 46
3 pull-down
GPIO5
S 4 6 4 1 pull-up
5
S461
pull-down 3
pull-up 1
SD_D0 1
GPIO1 3
GPIO2 3
SD_D1 1
GPIO5 3
SD_CLK 1
GPIO6 3
SD_CMD 1
TXD2_GPIO10
3 pull-down
GPIO10
9
S 4 6 1 pull-up
7
pull-up 1
pull-down
GPIO10
TXD2
1 pull-up
GPIO4
S 46 3 3 pull-down
S711
1 pull-up
GPIO3
3 pull-down
S710
S462
S460
3 GPIO4
S451
S452
54
S457
55
S 45 6
S4
S4
SD_D3 / GPIO4
S 4 5 3 1 SD_D3
S450
3 GPIO3
SD_D2 / GPIO3
1 SD_D2
3 Don't use
1
SPI1_DI
1
SPI1_CS
3
Don't use
1 TXD0
S201
TXD0_I
off 1
on
1 RXD0
TXD1/SD
RXD0_I
3 USC2
SD-CardSPI-Mode
S713
S717
S712
S730
S716
S301
S300
3
off 3
S200
S731
on 1
VMIC
CS 3
SD-Card SPI-Mode DO
3
S303
S302
1 open
3
VEXT (boot load)
SYNC
RTS1/SD
SD-Card SPI-Mode SCLK
3
S305
S304
RTS1 1
CTS1/SD
SD-Card SPI-Mode DI
3 on
1 off
3 on
1 off
EPP2
MICN2
MICP2
1 off
3 on
1 off
EPN1
EPP1
3 on
1 off
3 on
MICP1
3 TXD1/SD
TXD1
3 RXD1/SD
RXD1
1 SPI2_DI
RXD1 1
X554
1 off
1 SPI2_CS
TXD1 1
RXD1/SD
3 on
EPN2
SPICS
off 3
MICN1
3 USC1
S714
1 off
SPIDI
on 1
AGND
S715
3 on
3 RTS1/SD
1
3
S307
CTS1 1
S306
RTS1
SPI2_SCLK
3 CTS1/SD
CTS1
1 SPI2_DO
Figure 43: Location, signal names and switch positions of the slide switches
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5.2
s
Overview of Jumpers
Table 31: Overview of jumpers
Referenc
e
Function
Jumper set
Jumper not set
X120 1)
Voltage that is delivered by an USB
host connected to X110 can be used as
source for the module’s USB interface,
switch S110 must be in position 3
X121 1)
Voltage that is delivered by an USB
Voltage that is delivered by an USB host
host connected to X111 can be used as connected to X111 cannot be used as source
source for the module’s USB interface
for the module’s USB interface
X122
Connects BATT+ voltage to GSM
module
Voltage that is delivered by an USB host is
disconnected to the module’s USB interface,
switch S110 must be in position 1 to deliver
that voltage from the 5-volt supply on the
DSB75
Disconnects BATT+ voltage from GSM
module
Jumper pins can be used for BATT+ current
measurements 3)
X203 1)
Enables DTR at COM1 interface
Disables DTR at COM1 interface 3)
X204
Enables receiver outputs of COM1
Disables receiver outputs of COM1
Enables receiver outputs of COM2
Disables receiver outputs of COM2
Disables BATT+ generation
Enables BATT+ generation
X206
X405
1)
X410 1)
X411
1)
Both jumpers set: maximal BATT+ voltage is generated (4.5 Volt)
Jumper on X410 set: nominal BATT+ voltage is generated (4.1 Volt)
Jumper on X411 set: minimal BATT+ voltage is generated (3.5 Volt)
X420 1)
Ignition on
Ignition off
EMERG_RST on
EMERG_RST off
Enables SIM card detection
Disables SIM card detection
Connects signal DAC_OUT to filter
circuit
Disconnects signal DAC_OUT from filter
circuit
X561 2)
Enables the loop back of the filtered
signal DAC_OUT_F to the ADCx_IN
signals
Filtered signal DAC_OUT_F terminates on this
jumper pin 1 (access point)
X562 2)
Ground pins
X600
Resistor R602 (150mΩ) shorted
Resistor R602 (150mΩ) not shorted
Jumper set to pin 1 and 2: charger
circuit is supplied by external charger
interface voltage
Charger circuit is not supplied
X421
1)
X500 1)
X560
X710
2)
1)
Jumper set to pin 2 and 3: charger
circuit is supplied by internal voltage
5V0
1)
2)
3)
Jumper is intended for controlling the described function from a remote device.
Jumper is intended for replacing DAC-OUT- filter by customer.
Cut the trace of the jumper at the first use (see also Figure 45).
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X203
s
X120
X121
X206
X204
X405
X410
X411
X561
X562
X560
X122
X600
X500
X420
X710
X421
Figure 44: Location of jumpers
X122
X203
Figure 45: Illustration of positions to cut the trace for jumpers X203 and X122
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6
s
Connecting Antenna and GSM Module to DSB75
To prevent mechanical damage, be careful not to force, bend or twist the module. In order to
prevent short-circuits, ensure that the GSM module does not come into contact with any part
of the DSB75.
Follow these steps to connect the components:
• Connect the supplied RF cable to the appropriate RF connector on the GSM module.
• Plug the opposite end of the RF cable to the Hirose RF jack X505 located on the
component side of DSB75.
• Connect the 80-pin B2B connector of the GSM module to the 80-pin board-to-board
connector X100 of the DSB75.
• Insert the M2 screws (1) from the bottom side into the small holes of the DSB75 (5). Push
the self-gripping spacers (3) onto the screws as far as possible.
• Mount the GSM module (4) upside down onto the M2 screws and spacers and secure it
with the M2 nuts (2).
• Connect the external antenna to the SMA jack X506 of the DSB75.
• Plug the power cables to the connectors X400 and X401 of the DSB75.
Figure 46: Mounting GSM module onto the DSB75
The pin assignment of the B2B connector can be found in Figure 4. Figure 47 shows a GSM
module directly connected to the DSB75.
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s
Figure 47: Top view on DSB75 with connected GSM module and RF cable
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6.1
Turn on / off the GSM Module
All the hardware driven solutions described in [1] for turning on and off the GSM module are
implemented on DSB75 and can be used by as follows:
6.1.1
Turn on the GSM Module
There are several ways to turn on the GSM module:
Non-locking ignition key S421:
The major approach is to switch on the connected GSM module by pressing the ignition
(IGT) switch S421 for at least 400ms. The ignition switch is located on the component side of
the DSB75.
A 2-pin jumper (X420) connected in parallel to switch S421 makes it possible to control the
IGT signal from a remote unit.
Toggling low-to-high state of DTR:
As an alternative to the ignition key S421, the GSM module can be activated by toggling the
DTR line available on COM1.
The high signal of DTR generates a low pulse on IGT which switches the module on. For this
purpose, the DSB75 uses a differentiator circuit comprising the RC combination C420, R420,
R421 and the transistor V420.
Note: Before activating DTR keep the lines inactive for at least 500 milliseconds (see chapter
7).
IGT
VBUS_AB
Board to Board connector
220K
2u2
1M
Jumper
X420
Jumper
X120
USB
connector 1
X100
X110
DSUB9
RS232 (ASC0)
Plugging the USB cable:
Plugging in the USB cable to one of the two USB connectors triggers the IGT signal in the
same manner as DTR0. In this case, the USB supply voltage delivered from the USB host
starts the GSM module.
The 2-pin jumper (X120) connected in series with the USB voltage lines makes this function
remote controllable.
X201
100k
d/dt
Ignition
switch
S421
DTR
220K
Jumper
X203
2u2
100k
PWR_IND
d/dt
PWR_IND enables the LED-drivers,
RS232 drivers, pull-up resistors
Figure 48: Turn on circuit
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6.1.2
s
Turn off the GSM Module
Normal Power-off
The best and safest approach to switch off the module is using the AT command AT^SMSO.
This procedure lets the GSM module log off from the network and safe data before it shuts
down.
Emergency-off
The emergency-off (9V power shut off or battery power off) option is reserved only for use in
the case of emergency. It should be used only exceptionally when, due to serious problems,
the software is not responding for more than 5 seconds.
After normal power-off or emergency-off, the module can be restarted by pressing the
ignition key S421.
If the power supply is restarted within one minute, the module may start automatically.
6.1.3
Emergency Restart
The emergency restart option is reserved only for use in the case of emergency. It should be
used only exceptionally when, due to serious problems, the software is not responding for
more than 5 seconds.
Pulling down the module’s EMERG_RST pin by pressing the key S420 causes at release a
reset of the GSM module (0 -> 1 edge).
This may cause the loss of information stored in the volatile memory since the reset is
initialized.
The 2-pin jumper X421 connected in parallel to the key S420 can be used to shut off the
module from a remote unit.
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7
Technical Data of DSB75
Table 32: DSB75 maximum ratings
Parameter
Supply voltage
Condition
Min.
Laboratory PSU
Max.
Unit
-30
+30
V
Operating temperature
+15
+35
°C
Storage temperature
-40
+85
°C
Table 33: DSB75 technical data
Parameters
Supply current peak
Supply current
average
Condition
Min.
*) for module MC75,
adjusted values
dependent on module
hardware
VEXT
Switched logic high
level voltage (on if
GSM module on)
Max.
Unit
1
A
300
400
mA
9.0
15
V
Nominal supply voltage 2.85
for the GSM module
(adjustable)
4.1 *)
4.55
V
Minimum supply
voltage for GSM
module (adjustable)
2.85
3.5*)
4.55
V
Maximum supply
voltage for GSM
module
4.45
4.5
4.55
V
2.75
2.93
3.05
V
2.95
2.975
3.00
V
Laboratory PSU at 9V
requirements during
GSM transmission
Supply voltage
VBATT+ output voltage
Typical
8.5
IOmax = 50mA
3V0
Supply voltage for
DSB75 circuits
VDD
Supply voltage for the
pull-up resistors and
external use
IOmax = 50mA
2.8
2.9
3.0
V
+5V
Audio interface supply
voltage
Audio interface supply
voltage
4.75
5.0
5.25
V
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Parameters
Charging interface
Battery interface
Condition
Min.
Typical
4.75
6.6
10
V
Fast charging current
(Jumper X600 not set)
450
500
550
mA
Fast charging current
(Jumper X600 set)
950
1000
1050
mA
Trickle charge current
(Deep Discharge
Lockout)
4
5
7
mA
Trickle charge current
25
(Undervoltage Lockout)
30
35
mA
Battery voltage
3.8
4.2
V
3.3
10
See module
specification
[1] for detail.
Peak current
COM1 to COM3
Output voltage range
(load resistance 5kΩ)
± 4.9
I C interface 5V
± 5.0
A
± 5.4
V
mA
Output resistance
520
Ω
Input voltage range
-25
Input resistance
3.2
5.2
Input threshold low
0.65
1.25
1.6
VOL
2.8
VIL
VIH
I C interface 3V
2.5
± 19
VOH
2
kΩ
Output short-circuit
current
Input threshold high
2
Unit
Charger voltage
NTC to ground at
BATTEMP (near
battery) @ 25˚C
RS-232 interfaces
Max.
2.4
25
V
7.2
kΩ
V
2.5
V
0.4
V
5.0
V
0.8
V
5.3
V
Internal pull-up resistor
3.3
kΩ
External pull-up resistor
3.3
kΩ
required
Voltage levels
DSB75_hd_v08
See module specification [1] for detail.
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Parameters
Audio interface 1
(balanced input)
Handset Mode
(AT^SNFS=1)
Audio interface 1
(balanced input)
General Information
Condition
Min.
Typical
Max.
Unit
Differential output
voltage at full scale sine
1kHz
1.6
Vpp
Differential input
voltage for 0dBm0
(after settling)
30
mV
Maximum differential
output voltage, no load
6.0
Differential output
resistance
Vpp
15
Differential output load
Ω
0
Ω
Differential input
voltage
1.6
V
Input impedance
4.0
kΩ
Microphone supply
voltage
5.0
V
Microphone supply DC
resistance
4.6
kΩ
Audio interface 2
Output voltage
(single ended input)
Differential output
resistance
General Information
s
3.4
Vpp
15
Differential output load
Ω
16
Ω
Input voltage
1.6
V
Input impedance
2.0
kΩ
Microphone supply
voltage
2.5
V
Microphone supply DC
resistance
2.2
kΩ
SPI interface
Digital audio interface
SIM interface
USB interface
The interface lines are
connected directly to
the GSM module
See module specification [1] for details.
SD card interface
Ignition (Key)
Emergency Restart
(Key)
Ignition via DTR line
@COM1
VI = ±3V…±9V:
signal
VI >±9V:
~~~
|________|~~~~~~~~~~~~~~~
| ≥ 1s
| ≥ 0.5s |
signal
~~~
|________|~~~~~~~~~~~~~~~
| ≥ 0.5s
| ≥ 0.5s |
Rise time ≤ 1ms.
Low high transition of this signal switches the module on.
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Parameters
Ignition via VBUS line
@USB-Interface
Condition
Min.
s
Typical
Max.
Unit
VImin = 4V
signal
~~~
|________|~~~~~~~~~~~~~~~
| ≥ 1s
| ≥ 0.5s |
Rise time ≤ 1ms
Low high transition of this signal switches the module on.
RF attenuation
Adapter between RF
0.1
connector X505 (type
Hirose U.FL-R-SMT)
and RF connector X506
(type SMA)
Antenna
GSM 8501)
Frequency range
0.2
dB
0.1
824
894
MHz
GSM 900
880
960
MHz
GSM 1800
1710
1880
MHz
GSM 1900
1850
1990
MHz
Antenna VSWR
2:1
Antenna gain
Dimensions of
DSB75 PCB
0
dBd
Depth
177
mm
Width
160
mm
Height with feet
43
mm
240
g
Weight
1)
7.1
Although the provided antenna is rated for a frequency range from 890MHz to
1990MHz (2170MHz), its coverage also includes the 850MHz frequency band,
sufficient ground plane and mounting provided.
Cable Requirements
The DSB75 has been tested and approved for use with a maximum cable length of 3m for
following interfaces:
- USB interface (shielded)
- Serial interfaces COM1 to COM3 (RS232)
- Power supply
- Charger
- Analog audio interface
- Antenna interface
- ADC inputs
- DAC output
It is recommended to keep the digital lines for I²C-, SPI- and DAI- interfaces as short as
possible.
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8
Appendix
8.1
List of Parts and Accessories
s
Table 34: List of parts and accessories
Description
Supplier
Ordering information
Votronic Handset
VOTRONIC
Votronic HH-SI-30.3/V1.1/0
VOTRONIC
Entwicklungs- und Produktionsgesellschaft für
elektronische Geräte mbH
Saarbrücker Str. 8
66386 St. Ingbert
Germany
Phone :
Fax :
Email :
RF Cable
Antenna
Hirose
+49-(0)6 89 4 / 92 55-0
+49-(0)6 89 4 / 92 55-88
[email protected]
http://www.hirose.de
Ordering number: U.FL-2LP-066-A(150)
KÖBEL Mobile
SMARTEQ-MiniMAG Dualband,
0dBd, 2.6m RG174, SMA (m)
Communication
Sesamstrasse 12 Ordering number: 1140.26 with crimped SMA
D-24632
connector
Lentföhrden
Travel Charger
Siemens
Siemens ordering number:
A5BHTN00127458
Headset
Siemens
Car Kit
Siemens
Siemens ordering number:
L36880-N4001-A123
or
PTT HHS-510
Siemens Car Kit Portable HKP-500
ordering number:
L36880-N5601-A109
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EPN2_I
/sheet7 5 E
/sheet7 6 D
CC IO
/sheet1 4 A
/sheet1 2 F
/sheet5 6 B
CC CLK
/sheet1 4 B
BAT TEMP
/sheet1 2 C
/sheet1 2 E
/sheet6 2 D
BAT T+
/sheet1 4 D
/sheet6 5 B
/sheet6 4 D
ASC_SD
/sheet2 1 F
/sheet2 12 A
/sheet2 12 C
ASC_EN2
/sheet2 12 C
/sheet2 9 F
ASC_EN1
/sheet2 12 B
/sheet2 9 E
AGND_I
/sheet7 8 C
/sheet7 6 C
DC D0
/sheet1
/sheet1
/sheet2
/sheet2
AGND
/sheet1 2 C
/sheet1 3 F
/sheet7 8 C
EMERG_RST
/sheet1 2 C
/sheet1 3 F
/sheet1 7 B
GPIO8
/sheet1
/sheet1
/sheet4
/sheet4
4C
2G
12 F
2E
GPIO7_SPI
/sheet5 7 C
/sheet4 12 E
2B
3E
10 B
6B
DT R0
/sheet1
/sheet1
/sheet2
/sheet2
4C
3G
12 F
2E
GPIO7_I
/sheet4 12 F
/sheet4 14 F
2B
3E
10 B
5B
GPIO7
/sheet1
/sheet1
/sheet4
/sheet4
GPIO6_I
/sheet4 12 E
/sheet4 14 E
GPIO5_I
/sheet4 14 E
/sheet4 12 E
GPIO4_I
/sheet4 12 E
/sheet4 14 D
GPIO3_I
/sheet4 14 D
/sheet4 12 D
GPIO2_I
/sheet4 12 D
/sheet4 14 D
GPIO1_I
/sheet4 12 C
/sheet4 14 C
GPIO10_I
/sheet4 14 G
/sheet4 12 G
EPP2_I
/sheet7 5 E
/sheet7 6 C
EPP2
/sheet1 4 B
/sheet1 3 F
/sheet7 4 E
EPP1_I
/sheet7 5 E
/sheet7 8 D
DT R
/sheet4 1 F
/sheet2 13 B
DSR0
/sheet1
/sheet1
/sheet2
/sheet2
DP_B
/sheet1 5 D
/sheet1 11 A
DM_B
/sheet1 5 C
/sheet1 11 A
2C
3E
10 B
5B
DAC_OUT
/sheet1 4 D
/sheet1 3 G
/sheet5 7 A
AD2_IN
/sheet1 4 C
/sheet1 2 G
/sheet5 10 B
2C
3E
3D
5E
CT S1
/sheet1
/sheet1
/sheet3
/sheet2
CT S1_I
/sheet3 5 D
/sheet2 9 D
2C
3E
10 B
5B
CT S0
/sheet1
/sheet1
/sheet2
/sheet2
CH AR GEGAT E
/sheet1 2 B
/sheet1 2 E
/sheet6 1 C
EPP1
/sheet1 4 A
/sheet1 3 F
/sheet7 4 E
EPN2
/sheet1 4 B
/sheet1 3 F
/sheet7 4 E
CC IN
/sheet1 4 A
/sheet1 2 F
/sheet5 6 B
CC RST
/sheet1 4 A
/sheet1 2 F
/sheet5 6 B
EPN1_I
/sheet7 5 F
/sheet7 8 D
MICP2_I
/sheet7 5 F
/sheet7 6 C
MICP2
/sheet1 2 D
/sheet1 3 F
/sheet7 4 F
MICP1_I
/sheet7 5 G
/sheet7 8 C
MICP1
/sheet1 2 D
/sheet1 3 F
/sheet7 4 G
MICN 2_I
/sheet7 5 F
/sheet7 6 C
MICN 2
/sheet1 4 A
/sheet1 3 F
/sheet7 4 F
MICN 1_I
/sheet7 5 G
/sheet7 8 D
MICN 1
/sheet1 2 D
/sheet1 3 F
/sheet7 4 G
ISENSE
/sheet1 4 B
/sheet1 2 F
/sheet6 5 B
IGT
/sheet1 2 C
/sheet1 3 F
/sheet4 1 F
I2C_D AT_5V
/sheet5 7 C
/sheet5 5 D
I2C_D AT_3V
/sheet5 7 C
/sheet5 7 C
/sheet5 5 D
I2C_C LK_5V
/sheet5 5 C
/sheet5 7 C
I2C_C LK_3V
/sheet5 7 C
/sheet5 7 C
/sheet5 5 D
I2CD AT
/sheet1 4 B
/sheet1 3 G
/sheet5 1 D
I2CC LK
/sheet1 4 B
/sheet1 2 G
/sheet5 1 C
GPIO9_I
/sheet4 12 F
/sheet4 14 F
GPIO8_SPI
/sheet5 7 C
/sheet4 12 F
GPIO8_I
/sheet4 14 F
/sheet4 12 F
3
D
G
D
E
B
E
2
3
3
5
C
E
C
E
2B
3E
10 B
5B
2B
3E
10 B
5B
4
3
2
5
5
9
2
2
2
5
C
E
C
E
4B
2G
2E
11 E
4C
2G
11 E
2E
SD_D0
/sheet1 4 C
SD_CMD _I
/sheet4 12 E
/sheet3 3 D
SD_CMD
/sheet1
/sheet1
/sheet4
/sheet4
SD_CLK_I
/sheet4 12 E
/sheet3 3 D
SD_CLK
/sheet1
/sheet1
/sheet4
/sheet4
RXD2_I
/sheet4 12 F
/sheet2 9 D
RXD2_GPIO9
/sheet1 4 C
/sheet1 3 G
/sheet4 11 F
/sheet2 5 E
RXD1_I
/sheet3 5 C
/sheet2 9 D
RXD1
/sheet1
/sheet1
/sheet3
/sheet2
RXD0_I
/sheet2 10 B
/sheet2 7 B
/sheet2 5 B
RXD0
/sheet1 2 B
/sheet1 2 E
/sheet2 9 B
RT S1_ I
/sheet3 5 C
/sheet2 10 D
RT S1
/sheet1
/sheet1
/sheet3
/sheet2
RTS0
/sheet1
/sheet1
/sheet2
/sheet2
RIN G0
/sheet1
/sheet1
/sheet2
/sheet2
PWR_IND
/sheet1
/sheet1
/sheet4
/sheet2
/sheet2
/sheet2
POWER
/sheet6 1 A
/sheet6 4 E
4C
3G
2E
11 D
4C
3G
2E
11 D
4C
3G
2E
11 D
4
2
3
8
C
G
D
C
2C
2E
10 C
5E
TXD 1
TXD 0_I
/sheet2 7 B
/sheet2 10 B
/sheet2 5 B
TXD 0
/sheet1 2 B
/sheet1 2 E
/sheet2 9 B
TP_ENV
/sheet1 4 C
/sheet1 3 G
SYNC
/sheet1
/sheet1
/sheet5
/sheet2
SPI2_SCLK
/sheet5 7 C
/sheet3 3 C
SPI2_DO
/sheet5 7 C
/sheet3 3 D
SPI2_DI
/sheet5 7 C
/sheet3 3 C
SPI2_CS
/sheet5 7 C
/sheet3 3 B
SD_WP
/sheet1
/sheet1
/sheet3
/sheet3
SD_DET
/sheet1 4 C
/sheet1 2 G
/sheet3 3 C
SD_D3_I
/sheet4 12 D
/sheet3 3 D
SD_D3
/sheet1
/sheet1
/sheet4
/sheet4
SD_D2_I
/sheet4 12 D
/sheet3 3 E
SD_D2
/sheet1
/sheet1
/sheet4
/sheet4
SD_D1_I
/sheet4 12 D
/sheet3 3 D
SD_D1
/sheet1
/sheet1
/sheet4
/sheet4
SD_D0_I
/sheet4 12 C
/sheet3 3 D
/sheet1 3 G
/sheet4 2 E
/sheet4 11 C
4
2B
2E
2B
5E
VDD
/sheet7 11 F
/sheet5 7 C
/sheet5 1 B
/sheet5 3 C
/sheet5 2 B
VCHARGE
/sheet1 2 B
/sheet1 2 E
/sheet6 5 A
VBUS_B
/sheet1 7 C
/sheet1 14 A
/sheet4 1 F
VBAT
/sheet6 2 D
/sheet6 4 D
USC6
/sheet1 4 B
/sheet1 2 F
/sheet7 11 F
USC5
/sheet1 4 B
/sheet1 2 F
/sheet7 11 F
USC4
/sheet1 2 D
/sheet1 2 F
/sheet7 11 F
USC3
/sheet1 2 C
/sheet1 2 F
/sheet7 11 F
USC2
/sheet1 2 C
/sheet1 2 F
/sheet7 11 F
/sheet2 9 B
USC1
/sheet1 2 C
/sheet1 2 F
/sheet7 11 F
/sheet2 9 B
USC0
/sheet1 2 C
/sheet1 2 F
/sheet7 11 F
USB_DP
/sheet1 4 B
/sheet1 5 D
/sheet1 3 G
USB_DN
/sheet1 4 B
/sheet1 5 C
/sheet1 3 F
TXD 2_I
/sheet4 12 G
/sheet2 10 D
TXD 2_GPIO10
/sheet1 4 C
/sheet1 2 G
/sheet4 11 G
/sheet2 5 E
TXD 1_I
/sheet3 5 B
/sheet2 10 D
/sheet1
/sheet1
/sheet3
/sheet2
/sheet5 4 D
/sheet5 7 D
/sheet4 15 A
/sheet4 15 C
/sheet4 2 B
/sheet3 2 B
/sheet3 9 C
/sheet2 9 C
/sheet2 6 B
VUSB_IN
/sheet1 2 G
/sheet1 4 B
/sheet1 5 C
VUSB_3V3
/sheet1 9 B
/sheet1 10 C
VUSB
/sheet1 7 C
/sheet1 12 C
/sheet1 12 C
/sheet1 10 C
/sheet4 5 B
VSIM
/sheet1 2 F
/sheet1 4 A
/sheet5 6 B
VSENSE
/sheet1 4 B
/sheet1 3 F
/sheet6 5 B
VMIC_I
/sheet7 8 B
/sheet7 6 B
VMIC
/sheet1 4 B
/sheet1 3 F
/sheet7 8 B
VEXT
/sheet1 3 E
/sheet1 2 B
/sheet5 9 D
VDD_EN
/sheet4 13 A
/sheet2 8 E
VDDLP
/sheet1 2 B
/sheet1 2 E
/sheet4 1 F
5
6
7
06.07.2004
Siemens AG
DATE
USER
APPR'D
8
SCHEMATIC
DSB75
B1
TOP HIERARCHY LEVEL
9
10
netlist1
1:1
E
D
C
B
A
Strictly confidential / Released
E
D
C
/sheet4 1 G
EPN1
/sheet1 4 A
/sheet1 3 F
/sheet7 4 F
1F
2D
4B
4B
6B
6B
AD1_IN
/sheet1 4 D
/sheet1 2 G
/sheet5 10 B
6V6
/sheet7 7 A
/sheet6 4 E
5V0_I
/sheet7 11 C
/sheet7 12 B
5V0
/sheet7 10 B
/sheet7 8 A
/sheet7 11 F
/sheet5 4 C
/sheet5 7 D
/sheet4 7 A
/sheet4 13 A
/sheet4 4 B
3V3_4V5
/sheet6 4 D
/sheet4 11 A
/sheet1 2 F
/sheet5 6 B
CC GND
/sheet1
/sheet1
/sheet5
/sheet5
/sheet5
/sheet5
2
8.2
B
A
3V0
/sheet1 10 E
/sheet4 2 D
/sheet4 6 D
/sheet4 3 B
/sheet4 8 B
/sheet2 12 C
/sheet2 5 A
/sheet2 8 E
/sheet2 1 D
/sheet2 12 A
/sheet2 12 A
/sheet2 2 A
/sheet2 9 E
/sheet2 8 D
/sheet2 12 C
/sheet2 5 D
/sheet2 6 E
/sheet2 9 F
1
DSB75 Development Support Board Rev. B1 Hardware Description
s
Circuit Diagrams of DSB75
Figure 49: Schematic of page signals
29.09.2005
DSB75_hd_v08
Page 85 of 94
/sheet1
/sheet1
/sheet1
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/sheet1
/sheet1
/sheet1
/sheet1
/sheet1
/sheet1
/sheet1
/sheet1
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/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet3
/sheet3
/sheet3
/sheet3
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet5
/sheet5
/sheet5
/sheet5
/sheet5
/sheet5
/sheet5
/sheet5
/sheet6
/sheet6
/sheet6
/sheet6
/sheet6
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
15 A
14 D
9D
10 E
7 D
7D
9D
8D
10 D
10 D
11 B
11 B
12 D
13 D
6C
6D
6D
3E
3E
8B
10 A
10 A
12 A
12 A
12 A
10 C
10 C
12 C
12 C
12 C
8B
8B
5A
5D
6F
2C
2C
2B
3B
4A
4A
5A
6A
4A
7A
10 A
10 A
6A
11 A
11 A
13 A
14 A
2F
2F
2D
7B
9B
9B
7B
5C
11 D
11 D
11 D
11 E
11 E
11 E
11 F
11 G
2F
1D
1D
5B
5B
6B
4E
9A
9A
1C
4B
3B
2B
1B
5C
6C
5C
6C
8C
C731
C732
C733
C734
C735
C736
C737
C738
C739
C740
C750
C751
C752
C753
D110
D200
D201
D220
D221
D450
D500
L111
L112
L114
L115
L116
L201
L202
L203
L400
L401
L402
L480
L700
L701
L702
L703
L704
L705
L730
L731
L732
L733
N400
N410
N411
N412
N600
R110
R111
R112
R113
R114
R115
R116
R117
R118
R119
R120
R200
R201
R202
R203
R204
R205
R206
R207
R208
R209
R210
R211
R212
R213
R214
R215
R220
R221
R230
R231
R232
R233
R234
R235
R236
R237
R238
R239
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet1
/sheet2
/sheet2
/sheet2
/sheet2
/sheet4
/sheet5
/sheet1
/sheet1
/sheet1
/sheet1
/sheet1
/sheet2
/sheet2
/sheet2
/sheet4
/sheet4
/sheet4
/sheet4
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet7
/sheet4
/sheet4
/sheet4
/sheet4
/sheet6
/sheet1
/sheet1
/sheet1
/sheet1
/sheet1
/sheet1
/sheet1
/sheet1
/sheet1
/sheet1
/sheet1
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
2
9C
9C
10 C
11 C
11 D
11 D
11 D
11 D
11 D
10 D
10 B
11 B
11 B
12 B
9C
11 B
11 D
4B
4F
2E
4E
14 A
14 A
14 B
14 B
14 B
13 B
14 D
14 C
2A
6A
6A
4B
6A
4C
4C
4C
5C
5D
12 C
12 D
12 D
12 D
4A
8A
7B
13 A
2B
6C
7 C
7C
6D
7D
12 C
12 C
12 D
11 B
12 B
11 B
14 B
13 B
13 B
14 B
14 B
13 B
13 B
14 B
14 C
13 C
13 C
14 C
14 D
13 D
7B
7B
12 A
12 C
2B
2A
2B
2B
2B
2A
2C
2B
2D
2E
R240
R241
R242
R243
R244
R246
R250
R251
R252
R260
R261
R262
R263
R264
R266
R267
R270
R271
R272
R300
R302
R303
R400
R401
R409
R410
R411
R414
R415
R416
R417
R418
R420
R421
R450
R451
R452
R453
R454
R455
R456
R457
R460
R461
R462
R463
R464
R465
R466
R467
R468
R469
R470
R471
R472
R473
R474
R475
R476
R477
R478
R479
R480
R481
R482
R483
R484
R485
R486
R487
R488
R489
R492
R494
R495
R502
R503
R507
R508
R509
R510
R511
R512
R551
R552
R554
R555
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet2
/sheet3
/sheet3
/sheet3
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet4
/sheet5
/sheet5
/sheet5
/sheet5
/sheet5
/sheet5
/sheet5
/sheet5
/sheet5
/sheet5
/sheet5
/sheet5
2E
2E
2E
2F
2F
6F
1F
6E
8E
9C
9C
10 C
6B
10 D
9F
9E
8D
8E
8E
8C
2B
2C
5A
5A
7A
9A
9B
10 B
10 B
8B
8C
8C
2F
3G
5D
5E
5E
5E
5E
5E
5E
5E
14 C
15 C
14 D
15 D
14 D
15 D
14 D
15 E
14 E
15 E
14 E
15 E
14 E
15 F
14 F
15 F
14 F
15 F
14 G
15 G
2C
3C
11 C
11 D
11 D
11 D
11 E
11 E
11 F
11 G
2F
2G
2G
3C
4C
3D
5D
5D
5C
1C
1D
9B
9B
9D
8A
3
R556 /sheet5 9 A
R557 /sheet5 8 A
R558 /sheet5 8 A
R560 /sheet5 2 B
R561 /sheet5 2 B
R562 /sheet5 2 C
R563 /sheet5 2 C
R601 /sheet6 4 B
R602 /sheet6 3 B
R603 /sheet6 4 B
R604 /sheet6 2 C
R700 /sheet7 4 B
R701 /sheet7 3 B
R702 /sheet7 5 B
R703 /sheet7 5 B
R704 /sheet7 5 C
R705 /sheet7 6 C
R707 /sheet7 6 D
R730 /sheet7 9 B
R731 /sheet7 9 C
R732 /sheet7 10 C
R733 /sheet7 10 C
R734 /sheet7 11 C
R735 /sheet7 10 D
R736 /sheet7 10 D
R737 /sheet7 11 D
R750 /sheet7 11 B
R751 /sheet7 12 B
S110 /sheet1 5 C
S111 /sheet1 5 C
S112 /sheet1 5 D
S200 /sheet2 8 B
S201 /sheet2 8 B
S300 /sheet3 3 B
S301 /sheet3 4 B
S302 /sheet3 3 C
S303 /sheet3 4 C
S304 /sheet3 3 C
S305 /sheet3 4 C
S306 /sheet3 3 D
S307 /sheet3 4 D
S420 /sheet4 2 G
S421 /sheet4 4 F
S450 /sheet4 12 C
S451 /sheet4 12 D
S452 /sheet4 12 D
S453 /sheet4 12 D
S454 /sheet4 12 E
S455 /sheet4 12 E
S456 /sheet4 12 F
S457 /sheet4 12 F
S458 /sheet4 12 F
S459 /sheet4 12 G
S460 /sheet4 14 C
S461 /sheet4 14 D
S462 /sheet4 14 D
S463 /sheet4 14 D
S464 /sheet4 14 E
S465 /sheet4 14 E
S466 /sheet4 14 F
S467 /sheet4 14 F
S468 /sheet4 14 F
S469 /sheet4 14 G
S500 /sheet5 2 C
S501 /sheet5 2 D
S502 /sheet5 5 E
S503 /sheet5 5 E
S504 /sheet5 5 E
S601 /sheet6 4 D
S710 /sheet7 5 E
S711 /sheet7 5 E
S712 /sheet7 5 E
S713 /sheet7 5 F
S714 /sheet7 5 F
S715 /sheet7 5 F
S716 /sheet7 5 G
S717 /sheet7 5 G
S730 /sheet7 8 B
S731 /sheet7 8 C
TP101 / sheet1 9 G
TP104 / sheet1 9 G
TP106 / sheet1 10 G
TP105 / sheet1 8 G
TP103 / sheet1 9 G
TP102 / sheet1 8 G
TP501 / sheet5 3 C
TP502 / sheet5 3 D
4
TP401 / sheet4 8 B
V110 /sheet1 12 C
V111 /sheet1 13 B
V112 /sheet1 12 B
V200 /sheet2 7 E
V230 /sheet2 3 B
V231 /sheet2 3 A
V232 /sheet2 3 B
V233 /sheet2 3 B
V234 /sheet2 3 B
V235 /sheet2 3 A
V236 /sheet2 3 C
V237 /sheet2 3 B
V238 /sheet2 2 D
V239 /sheet2 2 E
V240 /sheet2 2 E
V241 /sheet2 2 E
V242 /sheet2 2 E
V243 /sheet2 2 F
V244 /sheet2 3 F
V400 /sheet4 3 A
V401 /sheet4 6 A
V420 /sheet4 3 G
V430 /sheet4 2 C
V431 /sheet4 3 C
V450 /sheet4 5 D
V451 /sheet4 5 E
V452 /sheet4 4 E
V453 /sheet4 4 E
V454 /sheet4 5 E
V455 /sheet4 5 E
V456 /sheet4 4 E
V457 /sheet4 4 E
V500 /sheet5 4 C
V501 /sheet5 4 D
V502 /sheet5 2 B
V503 /sheet5 2 B
V504 /sheet5 2 B
V600 /sheet6 3 A
V601 /sheet6 2 C
V602 /sheet6 2 B
V603 /sheet6 1 B
X100 /sheet1 3 E
X101 /sheet1 4 D
X102 /sheet1 2 D
X110 /sheet1 15 A
X111 /sheet1 15 C
X120 /sheet1 14 A
X121 /sheet1 13 D
X122 /sheet1 3 D
X201 /sheet2 14 B
X202 /sheet2 14 C
X203 /sheet2 13 B
X204 /sheet2 9 E
X205 /sheet2 14 D
X206 /sheet2 9 F
X301 /sheet3 7 C
X400 /sheet4 2 A
X401 /sheet4 2 A
X405 /sheet4 8 A
X410 /sheet4 9 B
X411 /sheet4 9 B
X420 /sheet4 5 G
X421 /sheet4 2 G
X500 /sheet5 4 B
X501 /sheet5 4 A
X502 /sheet7 13 D
X503 /sheet5 4 B
X505 /sheet5 8 D
X506 /sheet5 8 D
X510 /sheet5 7 C
X511 /sheet5 7 D
X551 /sheet5 9 B
X552 /sheet5 9 B
X554 /sheet5 10 C
X560 /sheet5 7 A
X561 /sheet5 9 A
X562 /sheet5 7 A
X600 /sheet6 3 B
X602 /sheet6 3 D
X700 /sheet7 3 B
X701 /sheet7 3 D
X703 /sheet7 12 F
X710 /sheet7 7 B
Z 110 /sheet1 8 D
5
6
7
Siemens AG
DATE 06.07.2004
USER
APPR'D
8
SCHEMATIC
DSB75
B1
TOP HIERARCHY LEVEL
9
10
poslist1
1:1
E
D
C
B
E
Strictly confidential / Released
E
D
C
B
A
C100
C101
C109
C110
C111
C112
C113
C114
C115
C116
C117
C118
C120
C121
C122
C123
C124
C125
C126
C130
C200
C201
C202
C203
C204
C205
C206
C207
C208
C209
C210
C211
C230
C231
C232
C302
C303
C304
C305
C400
C401
C402
C403
C405
C410
C411
C412
C413
C414
C415
C416
C417
C420
C421
C450
C470
C471
C472
C473
C480
C481
C482
C483
C484
C485
C486
C487
C488
C492
C510
C511
C513
C521
C522
C550
C551
C552
C601
C602
C603
C604
C605
C700
C701
C702
C705
C730
1
DSB75 Development Support Board Rev. B1 Hardware Description
s
Figure 50: Schematic of position list
29.09.2005
Page 86 of 94
Figure 51: Schematic sheet 1 – B2B connector, test points, USB interface
29.09.2005
1
AD2_IN
AD1_IN
CCIN
CCRST
CCIO
VSIM
CCCLK
USC6
ISENSE
USC5
VUSB_IN
I2CCLK
SD_CLK
SD_CMD
SD_DET
GPIO8
SD_WP
TXD2_GPIO10
TXD0
TXD1
RXD0
RXD1
SYNC
BATTEMP
USC0
USC1
USC2
USC3
USC4
CHARGEGATE
VCHARGE
VDDLP
2
GND
MICP2
USC3
MICN1
USC4
MICP1
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
ST80
X100
2-20POL
40
39
38
37
36
35
34
33
32
31
30
29
28
27
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
GND
3
X122
2-20POL
40
39
38
37
36
4
DM_B
DP_B
USB_DP
USB_DN
35
34
33
VUSB_IN
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
BATT+
MICN1
MICP1
MICP2
MICN2
EPN1
EPP1
EPP2
EPN2
VMIC
VSENSE
USB_DN
USB_DP
I2CDAT
SD_D0
SD_D1
SD_D2
SD_D3
GPIO7
RXD2_GPIO9
TP_ENV
PWR_IND
DAC_OUT
RING0
DSR0
RTS0
DTR0
RTS1
CTS0
CTS1
DCD0
EMERG_RST
IGT
VEXT
C126
33P
2
4
TP_ENV
AD2_IN
PWR_IND
AD1_IN
DAC_OUT
C125
33P
1
3
VSIM
EPP2
CCCLK
EPN2
USC6
VMIC
ISENSE
VSENSE
USC5
USB_DN
VUSB_IN
USB_DP
I2CCLK
I2CDAT
SD_CLK
SD_D0
SD_CMD
SD_D1
SD_DET
SD_D2
GPIO8
SD_D3
SD_WP
GPIO7
TXD2_GPIO10
RXD2_GPIO9
6
5
4
3
2
5
S112
2
S111
2
S110
2
3
1
3
1
3
1
GND
GND GND
47P
6
R110
33R
GND GND
R112
33R
R111
33R
7
VBUS_B
VUSB
EMERG_RST
7
GND
NB_C130
1N
GND GND
8
DTG
OTG
DP
DM
VP_DAT
VM_SE0
VP
VM
BODY
GND
2 4
7
C114
3
Z110
GND
ISP1261BS
GND
8
GND
9
TP102 TP105 TP101 TP103 TP104
-
1
CX91-F/13MHZ
16
15
14
13
12
11
10
9
33
GND
9
GND
25
26
27
28
29
30
31
32
TP106
-
CP_OUT
VREF_5V
OTG_ID
VREG_1V8
VREG_3V3
VIO
ATX
FREQSEL
D110
10
10
GND
3V0
GND
GND
R120
33R
R118
1K
GND
V110
33R
R119
12
SI1413DH
NB = not mounted
VUSB
GND
VUSB_3V3
VUSB
6
GND
DM_B
DP_B
11
Siemens AG
DATE 06.07.2004
USER
APPR'D
GND
GND
R117
0R
R116
1
1
6
X121
2
5
0R
3
4
ESDA6V1-5W6
V111
13
2
L111
0R
GND
47P
C101
L115
0R
0R
GND
1
SCHEMATIC
2
2
3
4
1
15
5
X110
GND
X111
MINI-USB
1
2
3
4
5
sheet1
1:1
GND GND GND
47P
C100
X120
TOP HIERARCHY LEVEL
B1
L116
0R
L114
DSB75
0R
L112
VBUS_B
14
F
E
D
C
B
A
Strictly confidential / Released
G
F
E
D
C
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
15K
1
10U
C122
R113
CCIN
MICN2
CCRST
EPN1
CCIO
EPP1
6
R114
1
X101
5
47P
C111
5
2
4
47P
C112
B
AGND
CCGND
6
4
3
Test equipment measurement
X102
GND
GND
AGND
2
ESDA6V1-5W6
47P
C117
1
47P
C118
GND
GND
NB_ C123
V112
R115
3
GND
3
22P
CHARGEGATE
VEXT
VCHARGE
RING0
VDDLP
DSR0
TXD0
RTS0
TXD1
DTR0
RXD0
RTS1
RXD1
CTS0
SYNC
CTS1
BATTEMP
DCD0
USC0
EMERG_RST
USC1
IGT
USC2
2
6 5 2 1
A
CCGND
GND
47P
NB_C124
15K
8
RCV
XTAL1
5
GND2
GND4
19
PSW
XTAL2
4
GND1
GND5
20
VUSB
10K
4
VUSB_3V3
3
RESET
CP_CAP_B
21
CFG2
CP_CAP_A
22
1
24
OE
GND3
18
22P
17
C113
100N
C120
CFG1
VBAT
23
470N
C109
GND
2U2
C116
2U2
C115
C110
10U
4U7
C121
DSB75_hd_v08
GND
1
DSB75 Development Support Board Rev. B1 Hardware Description
s
1
ASC_SD
3V0
GND
47K
2
R244
220R
R243
220R
R242
220R
R241
220R
R239
220R
R240
220R
R238
220R
V231
2
2
V239
V242
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
LYT679-CO
V244
LST679-CO
V243
LYT679-CO
2
V241
LST679-CO
2
2
V240
LGT679-CO
LST679-CO
V238
V236
2
LST679-CO
V232
2
LGT679-CO
V237
2
LST679-CO
V233
2
LYT679-CO
V234
2
LYT679-CO
V230
2
LGT679-CO
V235
2
LST679-CO
LGT679-CO
R236
220R
R232
220R
R237
220R
R233
220R
R234
220R
R230
220R
R235
220R
R231
2
3
3
5
7
9
3
5
7
9
12
14
16
18
12
14
16
18
D220
1A3
1Y3
2A3
2A4
2Y4
D221
4
2A4
2Y4
GND
2A3
2Y3
2A2
2A1
2Y1
2Y2
1A4
1A3
1Y3
1Y4
1A2
1A1
2OE
1Y2
1Y1
1OE
VCC
SN74LVC244A
GND
2A2
2Y3
2A1
2Y2
2Y1
1A4
1A2
1Y2
1Y4
1A1
1Y1
2OE
1OE
VCC
SN74LVC244A
GND
10
17
15
13
11
8
6
4
2
19
1
20
GND
10
17
15
13
11
8
6
4
2
19
1
20
GND
C230
100N
GND
C231
100N
LGT679-CO
5
R263
100K
VDD
RXD1
TXD1
CTS1
RTS1
RXD2_GPIO9
TXD2_GPIO10
SYNC
PWR_IND
3V0
DCD0
RING0
RXD0_I
TXD0_I
CTS0
RTS0
DSR0
PWR_IND
3V0
6
DTR0
GND
3
2
1
C2
B1
E1
7
V200
BC847
E2
B2
C1
VDD_EN
TXD0_I
RXD0_I
GND
4
5
6
R215
0R
R214
0R
33P
GND
GND
100K
R272
8
3V0
2
S201
2
S200
8
RXD1_I
RXD2_I
CTS1_I
3
1
3
1
9
100K
R266
100K
R267
USC1
TXD0
USC2
RXD0
9
100K
R262
3V0
19
17
DSR0
RXD0_I
10
TXD2_I
RTS1_I
C206
100N
18
RTS0
GND
18
20
21
16
17
19
22
23
24
3
1
25
28
20
C205
21
DTR0
TXD0_I
16
22
DCD0
24
3
1
25
28
23
100N
100N
100N
CTS0
TXD1_I
100K
PWR_IND
3V0
C201
C200
RING0
10
V-
V+
T3OUT
T4OUT
T5OUT
T3IN
T4IN
T5IN
R3IN
R3OUT
T3OUT
T4OUT
T5OUT
T3IN
T4IN
T5IN
R3IN
R3OUT
2
11
9
8
12
10
7
6
5
13
14
15
4
27
26
2
11
9
8
12
10
7
6
5
13
14
R220
0R
3V0
ASC_SD
ASC_EN1
C204
0R
GND
13
220R
DTR
R208
220R
220R
R212
R211
220R
9
8
7
6
5
4
3
2
1
9
8
7
6
5
4
3
2
1
9
8
7
6
5
4
3
2
1
X205
X202
X201
DSB75
B1
TOP HIERARCHY LEVEL
SCHEMATIC
L202
R213
600R/100MHZ
220R
R210
220R
L203
R209
600R/100MHZ
220R
220R
R205 220R
R206
R207
R204
220R
R203
220R
R200
220R
14
220R
L201
R201
R202
600R/100MHZ
220R
06.07.2004
GND
Siemens AG
APPR'D
USER
DATE
3V0
3V0
3V0
ASC_SD
ASC_EN2
R221
C208
100N
C209
100N
GND
27 C203
4 100N
100N
15
26
GND
12
NB = not mounted
GND
R2IN
R2OUT
D201
R1IN
R1OUT
R1OUTB
T2OUT
EN
T2IN
SHDN
T1OUT
T1IN
C2-
MBAUD
V-
V+
VCC
C2+
C1-
C1+
MAX3237ECAI
GND
R2IN
R2OUT
D200
R1IN
R1OUT
R1OUTB
T2OUT
T1OUT
EN
SHDN
MBAUD
T2IN
T1IN
C2-
C2+
C1-
C1+
VCC
MAX3237ECAI
11
ASC2
ASC1
ASC0
15
sheet2
1:1
F
E
D
C
B
A
Strictly confidential / Released
G
F
E
D
C
B
3V0
R250
7
R270
NB_ C210
NB_C211
6
R260
33P
3V0
10K
VDD
100K
R261
220R
5
R264
100N
C202
100N
C207
4
R252
R271
100K
2
1
GND
X203
GND
A
3
4K7
100K
ASC_EN1
2
1
2
2
R251
33R
3V0
100K
R246
C232
10U
X204
X206
Page 87 of 94
1
GND
GND
9pol SubD
9pol SubD
9pol SubD
DSB75_hd_v08
ASC_EN2
1
DSB75 Development Support Board Rev. B1 Hardware Description
s
Figure 52: Schematic sheet 2 – ASC0, ASC1 and ASC2 interface
29.09.2005
GND
GND
C
RXD1
TXD1
VDD
R303
0R
R302
0R
GND
GND
NB_C302
2
220N
C304
33P
GND
33P
DSB75_hd_v08
Page 88 of 94
CTS1
RTS1
SD_DET
GND
100P
C305
2
S306
2
S304
2
S302
2
S300
3
3
1
3
1
3
1
3
1
SPI2_DO
SPI2_SCLK
SPI2_DI
SPI2_CS
4
2
S307
2
S305
2
S303
2
S301
3
1
3
1
3
1
3
1
CTS1_I
RTS1_I
RXD1_I
TXD1_I
5
6
GND
X301
NB_ = not mounted
15
14
11
10
9
8
7
6
5
4
3
2
1
13
12
CCM05-5770
7
06.07.2004
Siemens AG
APPR'D
USER
DATE
SD_WP
8
47K
VDD
DSB75
B1
TOP HIERARCHY LEVEL
SCHEMATIC
R300
9
10
sheet3
1:1
E
D
C
B
A
Strictly confidential / Released
SD_D2_I
SD_D3_I
SD_D1_I
SD_D0_I
SD_CLK_I
SD_WP
SD_CMD_I
NB_C303
A
1
DSB75 Development Support Board Rev. B1 Hardware Description
s
Figure 53: Schematic sheet 3 – SD card reader
29.09.2005
G
F
E
D
C
MODULE "ON"
Figure 54: Schematic sheet 4 – GPIOs, power supply
29.09.2005
1
EMERG_RST
DTR
VBUS_B
IGT
VDDLP
VDD
SD_D2
SD_D3
SD_CLK
SD_CMD
GPIO7
GPIO8
SD_D0
SD_D1
PWR_IND
GND
3V0
R480
2
GND
2
GND
S420
GND
3
1
2
2U2
C420
2U2
C492
GND
X401
2
GND
2-POL
1
2
1
10
2
4
6
8
11
13
15
17
19
1
220K
R492
R420
220K
GND
GND
2A4
2A3
2A2
2A1
1A4
1A3
1A2
1A1
2OE
1OE
VCC
D450
3
GND GND
3
2
1
C2
B1
E1
2Y4
2Y3
2Y2
2Y1
1Y4
1Y3
1Y2
1Y1
SN74LVC244A
GND
20
GND
L400
V400
V420
E2
B2
C1
GND
C400
330U
BC847
18
16
14
12
9
7
5
3
ZJYS51R5-2PT 1SR154-400
2
1
C405
330U
4
5
6
1
V457
1
V453
5V0
GND
1
1
4
GND
3
1
S421
2
1
2
2K7
LGT679-CO
GND
R401
LGT679-CO
2
IGT
5
LGT679-CO
2
1
V454
2
5
6 N400
LGT679-CO
LGT679-CO
2
V455
1
OUT
GND
V450
L480
1U
V451
2
LGT679-CO
2
V456
FB
VIN
ON_OFF
GND1 GND2
LGT679-CO
LGT679-CO
2
V452
GND
4
1
40V/1A
1
R457
R456
R455
R454
R453
R452
R451
R450
VUSB
47U
3V0
L401
220R
220R
220R
220R
220R
220R
220R
220R
V401
GND
2
X400
2-POL
R400
C413
4700U
C403
1U
6
GND GND
NB_L402
1U
GND
C473
100U
LM2596S-ADJ
6
7
5V0
C470
1U
7
GND
C410
10U
3
GND
10K
X405
VOUT1
1
GND
N411
ADJ/GND VOUT2
VIN
8
8
4
2
GND
LM1086ISX
R409
2
1
3N3
C402
8K25
3
TP401
GND
GND
6
LP3856-ADJ
SD GND1
VIN
3V0
1
2
GND
GND
C472
100U
5
C480
100U
4
R416
9
N410
ADJ
VOUT
9
5
4
R410
GND
R411
3
100R
10
1K
1K
4
C415
4700U
SD_CMD
SD_CLK
SD_D3
SD_D2
SD_D1
SD_D0
TXD2_GPIO10
RXD2_GPIO9
4
GND
GND
10
11
GND
GND
GND
GND
GND
GND
GND
S459
2
S458
2
S457
2
S456
2
S455
2
S454
2
S453
2
S452
2
S451
2
S450
2
5V0
3
1
3
1
3
1
3
1
3
1
3
1
3
1
3
1
3
1
3
1
VDD_EN
NB = not mounted
GND
R489
0R
R488
0R
GPIO8
GPIO7
R487
0R
R486
0R
R485
0R
R484
0R
R483
0R
R482
0R
3V3_4V5
12
10N
C416
VIN
GPIO9_I
GPIO8_I
GPIO7_I
GPIO6_I
GPIO5_I
GPIO4_I
GPIO3_I
GPIO2_I
GPIO1_I
BYPASS
06.07.2004
GND
S469
2
S468
2
S467
2
S466
2
S465
2
S464
2
S463
2
S462
2
S461
2
S460
2
N412
5
3
1
3
1
3
1
3
1
3
1
3
1
3
1
3
1
3
1
3
1
R478
10K
R476
10K
R474
10K
R472
10K
R470
10K
R468
10K
R466
10K
R464
10K
R462
10K
R460
10K
GND
C417
1U
DSB75
B1
TOP HIERARCHY LEVEL
SCHEMATIC
GND
14
VOUT
LP3985IM5X-2.9
VEN
GPIO10_I
Siemens AG
APPR'D
USER
DATE
GPIO10_I
TXD2_I
GPIO9_I
RXD2_I
GPIO8_I
GPIO8_SPI
GPIO7_I
GPIO7_SPI
GPIO6_I
SD_CMD_I
GPIO5_I
SD_CLK_I
GPIO4_I
SD_D3_I
GPIO3_I
SD_D2_I
GPIO2_I
SD_D1_I
GPIO1_I
SD_D0_I
GND
1
3
4
13
2
2
C471
1U
B
R495
X410
X411
2K7
1K
2
1
2
1
C412
10U
R414
C414
4700U
R415
A
220R
V430
R494
X421
C421
100U
100K
DSB "ON"
100U
C450
220R
V431
120R
18R
R417
R418
3V0
R481
2
1
1M
1
100K
2
1
R421
1
X420
NB_C481
NB_C482
NB_C483
NB_C484
NB_C485
NB_C486
C401
1U
3
2
1
2
1
33P
33P
33P
33P
33P
33P
33P
Page 89 of 94
NB_C487
DSB75_hd_v08
33P
R479
10K
R477
10K
R475
10K
R473
10K
R471
10K
R469
10K
R467
10K
R465
10K
R463
10K
R461
10K
VDD
VDD
GND
15
sheet4
1:1
F
E
D
C
B
D
Strictly confidential / Released
NB_C488
DSB75 Development Support Board Rev. B1 Hardware Description
s
1N
C411
E
D
C
B
I2CDAT
I2CCLK
NB_C511
33P
GND
VDD
NB_C510
GND
33P
GND
R512
0R
R511
0R
V503
1
2
6
1
R562
47K
VDD
E2
5
C1
E1
2
B2
B1
R561
47K
R563
220R
GND
S501
2
S500
2
3
1
3
1
V502
BC857S/UMT1N
V504
4
LGT679-CO
3
C2
2
1
CCDET2
CCDET1
GND
CCRST
CCCLK
CCIO
CCVPP
CCVCC
VDD
SIM
X503
R502
6
5
1
CCGND
8
7
4
2
3
6
5
1
FDG313N
V500
VSS
WC
E2
E1
E0
VCC
AT24C128N-10SI-2.7
SCL
SDA
D500
V501
FDG313N
X500
2
X501
8
4
7
3
2
1
8
5V0
CCGND
5
GND
C550
100N
4
R508
VDD
1
2
Figure 55: Schematic sheet 5 – SIM card, I2C, SPI, analog and antenna interface
29.09.2005
S504
2
S503
2
S502
2
100R
R509
100R
R510
1
3
1
3
1
3
SIM
GND
I2C_DAT_5V
I2C_DAT_3V
I2C_CLK_3V
I2C_CLK_5V
100P
C513
220N
C521
1N C522
CCGND
6
8
10
9
X562
X560
HIROSE
6
7
4
5
2
9
3
8
10
7
1
6
5
2
4
X511
X510
3
1
GND
1
1
NB = not mounted
VDD
5V0
I2C_DAT_5V
I2C_CLK_5V
VDD
SPI2_DO
SPI2_SCLK
SPI2_D1
SPI2_CS
CCGND
CCRST
CCCLK
CCIO
VSIM
CCIN
DAC_OUT
7
R557
0R
Siemens AG
APPR'D
USER
DATE
GND
GND
1
2 3 4
06.07.2004
50 Ohm
1
X505
VEXT
R555
1K
ANTENNA
I2C_DAT_3V
I2C_CLK_3V
I2C_DAT_3V
NB_R558
GND
1K
I2C_CLK_3V
GPIO8_SPI
GPIO7_SPI
GND
2
2
8
X506
R554
100R
2
X552
2
X551
3
1
1
2
2
X554
R552
100R
R551
100R
X561
DSB75
B1
TOP HIERARCHY LEVEL
SCHEMATIC
1-POL
SMA
3
1
3
GND
GND
1
R556
1K
9
1U
C552
5
1U
C551
4
7
R503
R560
220R
3
3K3
R507
6
3K3
2
4
3K3
4
3
3K3
A
1
3
3
1
2
5
6
1
2
5
Page 90 of 94
6
GND
GND GND
DSB75_hd_v08
5
SYNC
AD2_IN
AD1_IN
10
sheet5
1:1
E
D
C
B
A
Strictly confidential / Released
4
3
2
DSB75 Development Support Board Rev. B1 Hardware Description
s
TP502
TP501
s
DSB75 Development Support Board Rev. B1 Hardware Description
Strictly confidential / Released
A
CHARGE
LP2985IM5X-5.0
1
3
VIN
VOUT
EN
GND
C604
10N
GND
GND
N600
VCHARGE
V600
2
C605
2U2
BYP
0R
5
C603
2U2
POWER
GND
GND
ISENSE
2
0R
2
3
S
D
G
0R15
0R15
R602
R603
X600
1
BATT+
220N
C602
FDD5614P
R604
100N
C601
4K7
1
GND
B
VSENSE
R601
V602
1
V603
CRS04
2
GND
3
SI1012X
1
C
2 V601
CHARGEGATE
D
ACCU
S601
5-POL
VBAT
GND
BATTEMP
6
3V3_4V5
4
VBAT
3
2
1
3
1
2
6
4
5
BATT+
POWER
E
6V6
X602
DATE
06.07.2004
USER
APPR'D
DSB75
B1
TOP HIERARCHY LEVEL
1:1
SCHEMATIC
Siemens AG
sheet6
Figure 56: Schematic sheet 6 – charging interface
DSB75_hd_v08
Page 91 of 94
29.09.2005
Page 92 of 94
1
2
X701
12-POL
X700
8
9
10
11
12
14
13
1
2
3
4
5
6
7
3
4K7
L701
Figure 57: Schematic sheet 7 – audio interface
29.09.2005
4
MICN1
S717
2
S716
2
MICP1
2
S714
2
S713
S715
2
MICP2
EPN1
S712
2
L702
EPP1
S710
2
L703
S711
2
600R/100MHZ
EPN2
EPP2
600R/100MHZ
MICN2
10K
R700
GND
600R/100MHZ
600R/100MHZ
R701
L704
R702
C702
100U
2K2
5
1
3
1
3
1
3
1
3
1
3
1
3
1
3
1
3
600R/100MHZ
L705
C700
2N2
MICN1_I
MICP1_I
MICN2_I
MICP2_I
EPN1_I
EPP1_I
EPN2_I
EPP2_I
R705
6R8
C701
2N2
R707
6
SG1
GND
6R8
100N
C705
L700
ZJYS51R5-2PT
EPN2_I
EPP2_I
AGND_I
MICP2_I
MICN2_I
VMIC_I
3
1
7
2
X710
5V0
6V6
MICN1_I
EPN1_I
EPP1_I
MICP1_I
AGND_I
AGND
VMIC
VMIC_I
2
S731
2
S730
8
1
1
3
3
C730
10U
9
C731
100N
9
C732
10U
10
5V0
GND
100N
C740
R736
6R8
R735
6R8
100N
C733
AUDIO
10
GND
R750
100R
GND
11
GND
GND
5V0
VDD
USC0
USC1
USC2
USC3
USC4
USC5
USC6
GND
5V0_I
GND
GND
GND
R751
100R
12
C753
100U
1
2
3
4
5
6
7
8
9
10
X703
L733
DAI
600R/100MHZ
L732
600R/100MHZ
L731
600R/100MHZ
L730
600R/100MHZ
GND
X502
06.07.2004
4
3
2
1
Siemens AG
APPR'D
USER
DATE
5V0_I
13
DSB75
B1
TOP HIERARCHY LEVEL
SCHEMATIC
14
15
sheet7
1:1
F
E
D
C
B
A
Strictly confidential / Released
G
F
E
D
C
B
POWER SUPPLY
12-POLIG
13
1
2
3
4
5
6
7
8
9
10
11
12
14
R703
U = 6,6 V
Iin=500mA
2K2
5K6
R704
LUMBERG 12 POL
8
47K
7
R733
6
R730
5
4K7
4K7
R731
100N
C750
4
R732
100N
C751
1N
3
R734
2
47N
1N
47N
C735
C736
C738
10N
C734
C737
10N
C739
C752
100U
2K2
2K2
DSB75_hd_v08
R737
A
1
DSB75 Development Support Board Rev. B1 Hardware Description
s
47K
GND
s
DSB75 Development Support Board Rev. B1 Hardware Description
Strictly confidential / Released
8.3
Floor Plan of the DSB75
X205
X201
X202
X110
R205 R206
R201 R202 R203
R204
R207
R208 R209
R250 R210 R211
L203
C209
R260
R261
R262
TP103
C206
D200
C208
R264 C205
C230
D220
V233 V232
V231
V230
V237 V236
V235
V234
R494
R495
R492
C492
R233 R232
R231
R230
R237 R236
R235
R234
R244
R239 R240
R243 R242 R241
R238
V244
C211
V238
R245
V200 V243 V242 V241 V239 V240
C231
R266 X206
R251
C232
V290
R246
X204
R267
C750
D221
R252
C751
C753
R272 R271
C752
R750
R270
R215
R751
C210 R214
S201
S200
X554
X703
R554
X101
R212
L115
L111 L114
L116
L205
X400
C101
R213
C201 X203
X401
L112
C100
V111
C114 V112
X120 C117 R118
V400
L400
R120
TP102
C113
S463
C203 R489 S464
Z110
R119
C109
S112
C118
R464
C401
C200
R468
R465
S466 R466
X121
C115 C110 D110
R462
R472 R467
C112
R263
C124
C116
S462 S453
C121
R473
C111
C123
S461
S110
S469
S452 S457
C405
R478
R483
S111
R114
R484 C130
C482
R113
C400
R479
C120
R111
V110
R474
S451
C483
V401
R112
R117 R116
S459
R485
R489
C480 R115
C488
C484 C122
L401
N400
S467
R486 S456
R475
R110 L480
R487
S458
R401
N412
R476
C486
R400
C402
S450 R482 C485
S468
C416
R470
S455
R461
C403
C481
S454
X510 R488 R477 C487
S460
S465
C410
C417
R460
R471
R508 V502 R457
+
R463 C450
V450 R450
R509 R561 R456 V457
L402
C473
R503
C413
R562 V456
V451 R451
N411
R510
D450
V500
R409
V452 R452
V504
V501
X511 R507
V503 R563
N410
V453 R453
R418
R502
V601
R417
R560
V454 R454
S500
C412
R416
D500
C550
R411
R455
S501
V455
C603
C470
X552 X551
TP501
R410
N600
X405
C510
C472
C411 X410
R511
V600
X411
S502
V603 C605 C471
R552
R551
S503
R414
X561
C551
S504
TP502
C552 C421
C511
X560
R512
X562
R556
R558 R557 R555
- C414 +
R415
X102
- C415 +
C204
R221
C207
D201
L201
R200
R220
C202
C125 C126
S713
S712
C731 S717 S716
C732
C730
S730
S731
R731
R733
R736
X421 C737
C736
C738
X420
V420
TP101
S301 S303
C420
L730
L731
R420
L732
R421 C739 L733
R737
R601
S306
S305 S307
R730
R732
C735
X500
X501
X602
X600
R602
S601
C305
C601
R300
C513 C521 C522
C304
C734
R734
R604
X505
S421 S240
X710
C705 L700
R704
TP105
S715 R705
R703
R702
S710 R707 C701
C700
C702
S711
S714
V602
X100
X502
X122
R603
S300 S302 S304
C740
C733
R735
TP104
C602
R302 R303
C302 C303
X503
R481
TP106
X506
V431
L705
R480
V430
L701 L704 R700
L702 L703 R701
X700
Figure 58: Floor plan top side
DSB75_hd_v08
Page 93 of 94
29.09.2005
DSB75 Development Support Board Rev. B1 Hardware Description
Strictly confidential / Released
s
X111
TP104
X301
X701
Figure 59: Floor plan bottom side
DSB75_hd_v08
Page 94 of 94
29.09.2005