Download Samsung DVD-C600/XAA Service manual

DVD PLAYER
DVD-C600
SERVICE MANUAL
SERVICE
Manual
DVD-C600
DVD PLAYER
CONTENTS
1. Precautions
2. Reference Information
ELECTRONICS
3. Product Specification
4. Disassembly and Reassembly
5. Circuit Descriptions
6. Troubleshooting
7. Exploded Views and Parts List
DOLBY DIGITAL DECODER BUILT-IN
DVD / VIDEO-CD / CD PLAYER DVD-C700
5
DIGITAL VIDEO
8. Electrical Parts List
9. Block Diagrams
SPATIALIZER
N-2-2
10. PCB Diagrams
11. Wiring Diagram
12. Schematic Diagrams
© Samsung Electronics Co., Ltd. FEB. 2000
Printed in Korea
AH68-00387A
1. Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer,
always make a safety check of the entire instrument,
including, but not limited to, the following items:
(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing.
(1)Protective shields are provided to protect both
the technician and the customer. Correctly replace
all missing protective shields, including any
remove for servicing convenience.
(2)When reinstalling the chassis and/or other assembly in the cabinet, be sure to put back in place
all protective devices, including, but not limited to,
nonmetallic control knobs, insulating fish papers,
adjustment and compartment covers/shields, and
isolation resistor/capacitor networks. Do not operate this instrument or permit it to be operated without all protective devices correctly installed and
functioning.
(2) Be sure that there are no cabinet openings through
which adults or children might be able to insert
their fingers and contact a hazardous voltage. Such
openings include, but are not limited to, excessively wide cabinet ventilation slots, and an improperly fitted and/or incorrectly secured cabinet back
cover.
(3) Leakage Current Hot Check-With the instrument
completely reassembled, plug the AC line cord
directly into a 120V AC outlet. (Do not use a isolation transformer during this test.) Use a leakage
current tester or a metering system that complies
with American National Standards institute (ANSI)
C101.1 Leakage Current for Appliances and
Underwriters Laboratories (UL) 1270 (40.7). With
the instrument’s AC switch first in the ON position
and then in the OFF position, measure from a
known earth ground (metal water pipe, conduit,
etc.) to all exposed metal parts of the instrument
(antennas, handle brackets, metal cabinets, screwheads, metallic overlays, control shafts, etc.), especially any exposed metal parts that offer an electrical return path to the chassis.
Any current measured must not exceed 0.5mA.
Reverse the instrument power cord plug in the outlet and repeat the test. See Fig. 1-1.
Any measurements not within the limits specified
herein indicate a potential shock hazard that must
be eliminated before returning the instrument to
the customer.
(READING SHOULD
NOT BE ABOVE
0.5mA)
LEAKAGE
CURRENT
TESTER
DEVICE
UNDER
TEST
TEST ALL
EXPOSED METER
SURFACES
2-WIRE CORD
ALSO TEST WITH
PLUG REVERSED
(USING AC ADAPTER
PLUG AS REQUIRED)
EARTH
GROUND
Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1) Unplug
the power supply cord and connect a jumper wire
between the two prongs of the plug. (2) Turn on the
power switch of the instrument. (3) Measure the
resistance with an ohmmeter between the
jumpered AC plug and all exposed metallic cabinet
parts on the instrument, such as screwheads,
antenna, control shafts, handle brackets, etc. When
an exposed metallic part has a return path to the
chassis, the reading should be between 1 and 5.2
megohm. When there is no return path to the chassis, the reading must be infinite. If the reading is
not within the limits specified, there is the possibility of a shock hazard, and the instrument must be
re-pared and rechecked before it is returned to the
customer. See Fig. 1-2.
Antenna
Terminal
Exposed
Melal Part
ohm
ohmmeter
Fig. 1-2 Insulation Resistance Test
Samsung Electronics
1-1
Precautions
2) Read and comply with all caution and safety related notes non or inside the cabinet, or on the chassis.
3) Design Alteration Warning-Do not alter of add to
the mechanical or electrical design of this instrument. Design alterations and additions, including
but not limited to, circuit modifications and the
addition of items such as auxiliary audio output
connections, might alter the safety characteristics of
this instrument and create a hazard to the user. Any
design alterations or additions will make you, the
service, responsible for personal injury or property
damage resulting therefrom.
4) Observe original lead dress. Take extra care to
assure correct lead dress in the following areas:
(1) near sharp edges, (2) near thermally hot parts (be
sure that leads and components do not touch thermally hot parts), (3) the AC supply, (4) high voltage,
and (5) antenna wiring. Always inspect in all areas
for pinched, out-of-place, or frayed wiring, Do not
change spacing between a component and the
printed-circuit board. Check the AC power cord for
damage.
1-2
5) Components, parts, and/or wiring that appear to
have overheated or that are otherwise damaged
should be replaced with components, parts and/ or
wiring that meet original specifications.
Additionally, determine the cause of overheating
and/or damage and, if necessary, take corrective
action to remove any potential safety hazard.
6) Product Safety Notice-Some electrical and mechanical parts have special safety-related characteristics
which are often not evident from visual inspection,
nor can the protection they give necessarily be
obtained by replacing them with components rated
for higher voltage, wattage, etc. Parts that have special safety characteristics are identified by shading,
an (
)or a (
)on schematics and parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might created shock, fire and/or
other hazards. Product safety is under review continuously and new instructions are issued whenever appropriate.
Samsung Electronics
Precautions
1-2 Servicing Precautions
CAUTION : Before servicing Instruments covered
by this service manual and its supplements, read and
follow the Safety Precautions section of this manual.
Note : If unforseen circument create conflict between
the following servicing precautions and any of the
safety precautions, always follow the safety precautions. Remember: Safety First.
1-2-1 General Servicing Precautions
(1) a. Always unplug the instrument’s AC power cord
from the AC power source before (1) re-moving
or reinstalling any component, circuit board,
module or any other instrument assembly, (2)
disconnecting any instrument electrical plug or
other electrical connection, (3) connecting a test
substitute in parallel with an electrolytic capacitor in the instrument.
b. Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this
service manual might be equipped.
c. Do not apply AC power to this instrument and
/or any of its electrical assemblies unless all
solid-state device heat sinks are correctly installed.
d. Always connect a test instrument’s ground lead
to the instrument chassis ground before connecting the test instrument positive lead. Always
remove the test instrument ground lead last.
(4) An insulation tube or tape is sometimes used and
some components are raised above the printed
wiring board for safety. The internal wiring is
sometimes clamped to prevent contact with heating components. Install such elements as they
were.
(5) After servicing, always check that the removed
screws, components, and wiring have been installed correctly and that the portion around the
serviced part has not been damaged and so on.
Further, check the insulation between the blades of
the attachment plug and accessible conductive
parts.
1-2-2 Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet
and turn the power ON. Connect the insulation resistance meter (500V) to the blades of the attachment
plug. The insulation resistance between each blade of
the attachment plug and accessible conductive
parts(see note) should be more than 1 Megohm.
Note : Accessible conductive parts include metal panels, input terminals, earphone jacks, etc.
Note : Refer to the Safety Precautions section ground
lead last.
(2) The service precautions are indicated or printed on
the cabinet, chassis or components. When servicing, follow the printed or indicated service precautions and service materials.
(3) The components used in the unit have a specified
flame resistance and dielectric strength.
When replacing components, use components
which have the same ratings. Components i-entified by shading, by( ) or by ( ) in the circuit diagram are important for safety or for the characteristics of the unit. Always replace them with the exact
replacement components.
Samsung Electronics
1-3
Precautions
1-3 ESD Precautions
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity.
Such components commonly are called Electrostatically Sensitive Devices(ESD). Examples of typical ESD
devices are integrated circuits and some field-effect
transistors and semiconductor chip components. The
following techniques should be used to help reduce
the incidence of component damage caused by static
electricity.
(1) Immediately before handling any semiconductor
component or semiconductor-equipped assembly,
drain off any electrostatic charge on your body by
touching a known earth ground. Alternatively,
obtain and wear a commercially available discharging wrist strap device, which should be
removed for potential shock reasons prior to applying power to the unit under test.
(7) Immediately before removing the protective materials from the leads of a replacement ESD device,
touch the protective material to the chassis or circuit assembly into which the device will be
installed.
CAUTION : Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
(8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your
clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient
to damage an ESD device).
(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
(3) Use only a grounded-tip soldering iron to solder or
unsolder ESD devices.
(4) Use only an anti-static solder removal devices.
Some solder removal devices not classified as
“anti-static” can generate electrical charges sufficient to damage ESD devices.
(5) Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage
ESD devices.
(6) Do not remove a replacement ESD device from its
protective package until immediately before your
are ready to install it.(Most replacement ESD
devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive materials).
1-4
Samsung Electronics
Precautions
1-4 Handling the optical pick-up
The laser diode in the optical pick up may suffer electrostatic breakdown because of potential static electricity from clothing and your body.
WRIST-STRAP
FOR GROUNDING
1M
The following method is recommended.
(1) Place a conductive sheet on the work bench (The
black sheet used for wrapping repair parts.)
(2) Place the set on the conductive sheet so that the
chassis is grounded to the sheet.
(3) Place your hands on the conductive sheet(This
gives them the same ground as the sheet.)
(4) Remove the optical pick up block
(5) Perform work on top of the conductive sheet. Be
careful not to let your clothes or any other static
sources to touch the unit.
THE UNIT
1M
CONDUCTIVE SHEET
Fig.1-3
(6) Short the short terminal on the PCB, which is inside the Pick-Up ASS’Y, before replacing the PickUp. (The short terminal is shorted when the PickUp Ass’y is being lifted or moved.)
(7) After replacing the Pick-up, open the short terminal on the PCB.
Be sure to put on a wrist strap grounded to the
sheet.
Be sure to lay a conductive sheet made of copper etc.
Which is grounded to the table.
Samsung Electronics
1-5
Precautions
1-5 Pick-up disassembly and reassembly
1-5-1 Disassembly
1-5-2 Assembly
1) Remove the power cable.
2) Switch SW1 on Deck PCB to “OFF” before
removing the FPC.
( Inserted into Main PCB MCN06. See Fig. 1-4)
3) Disassemble the Deck.
4) Disassemble the Deck PCB.
1) Replace the Pick-up.
2) Assemble the Deck PCB.
3) Reassemble the Deck.
4) Insert FPC into Main PCB MCN06 and switch SW1
on Deck PCB to “ON”. (See Fig 1-4)
Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged.
FPC
TO MAIN PCB
(MCN06)
SW1
OFF
ON
Fig. 1-4
1-6
Samsung Electronics
2. Reference Information
2-1 IC Dsecriptions
2-1-1 AIC1 (AK4324 ; Digital-to-Analog Converter)
DIF0
LRCK
BICK
SDATA
DIF1
DIF2
DEM0
AVDD
AVSS
De-emphasis
Control
Serial Input
Interface
PD
DEM1
DZFL
AOUTL+
8X
Interpolator
∆∑
Modulator
SCF
8X
Interpolator
∆∑
Modulator
SCF
AOUTL-
SMUTE
DFS
AOUTR+
AOUTR-
Clock Divider
DZFR
MCLK
PIN I / O NAME
CKS
DVDD
FUNCTION
DVSS
VREF
PIN I / O NAME
FUNCTION
13
I
DIF0
Digital input format pin
1
-
DVSS
Digital ground pin
2
I
DVDD
Digital power supply
14
I
DIF1
Digital input format pin
3
I
CKS
Master clock select pin (Internal pull-down pin)
Nomal speed "L":MCLK = 256fs, "H":MCLK = 384fs
Double speed "L":MCLK = 128fs, "H":MCLK = 192fs
15
I
DIF2
Digital input format pin
4
I
MCLK
Master clock input pin
16
0
AOUTR-
Rch negative analog output pin
5
I
PD
Power-Down mode pin. When at "L", the AK4324 is in
power-down and is held in rest.
The AK4324 should always be reset upon power-pin
17
O
AOUTR+
Rch positive analog output pin
6
I
BICK
Audio serial data input pin
64fs clock is recommended to be input on this pin
18
O
AOUTL-
Lch negative analog output pin
7
I
SDATA
Audio serial data input pin
2's complement MSB-first data is input on this pin.
19
O
AOUTL+
Lch positive analog output pin
8
I
LRCK
L/R clock pin.
20
-
AVSS
Analog ground pin
9
I
SMUTE
Soft mute pin
When this pin goes "H", soft mute cycle is initiated
When returning "L", the output mute releases.
21
O
VREF
Voltage reference input pin
10
I
DFS
Double speed sampling mode pin (Internal pull-down pin)
"L":normal speed, "H":double speed
22
O
AVDD
Analog power supply pin.
11
I
DEM0
De-emphasis frequency select pin
23
O
DZFR
Rch zero input detect pin
12
I
DEM1
De-emphasis frequency select pin
24
O
DZFL
Lch zero input detect pin
Note : Allinput pins except internal pull-down pins should not be left floating.
Samsung Electronics
2-1
Reference Information
2-1-2 RIC1 (KS1461 ; RF)
83 82 81 80 79 78 77 76
AGC-HOLD(OOH)
ADVD
5
AGC_DET
RF
MUX
BCA
BLOCK
74 BCAI
RF
Equalizer
RF SLM
& AGC
C
D
BCA
RFRP
GAIN_EQ(02H)
CDRSEL(00H)
TE1RES
DELAY_SEL(OOH)
PLLCTL
TBAL(O1H)
RREFEQ 10
VREF
GENERATOR
DELAY
D
GCA
RREF 11
CD1
S12
DVD1
DVD2
LDONB
FLT_CTL
CDRSEL
TESEL
AGC-HOLD
TBAL
GAIN_TE3
ENV_SEL
DVCTL_SEL
DPD_MUTE
GAIN_EQ
GAIN_FE
GAIN_ABCD
TE_OFST
FE_OFST
ABCD_OFST
DELAY_CD
DELAY_AB
PDLIMIT
ga_RFSUM
HOLD_CTL
ga_PLLDP
ga_PLLDN
HOLD_CTL(O8H)
DPDMUTE
DPD_MUTE(O2H)
SEOFHOLD
FLT_CTL(OOH)
CAL_ENDB(O2H)
DPDEQ1
9
PD,LPF
COM
EQ
D
TEOPST(04H)
MUX3
PDLIMITRES
TE1_LIMIT
D
GCA
COM
EQ
D
DPDEQ2
FAULTOUT
VREFEQ 12
EQ
VC AMP
GAIN_TE3(02H)
E 13
DELAY_SEL(00H)
PLLCTL
TE38
F 14
AUTO
OFSTCTL
RFCT
&
MIRR
CD1 S12 DVD1.2
RREFBF
CB 2
84
RFCT
85
CP 2
86
RFRP
87
RFRPN
88
CB 1
B
8
89
MROFST
A
4
DDVD
CP 1
3
DCD
7
MIRRI
2
6
90
75 BCAO
BCD
BDVD
91
MUX
CCD
CDVD
EQVCC
1
RFEQO
ACD
BCATH
EQGND
to RF EQ
TUNING BLOCK
EQIN
AGCLEVEL
92
RFAGCO
AGCB
93
AGCI
AGCP
94
AGCC
RDPF
95
EQF
PLLGF
99 98 97 96
EQG
VZOCTL
100
72 OSC
71 STB
S/IF
BLOCK
70 CLOCK
69 DATA
68 RREFDLY
DPD
BLOCK
67 VREFDPD
66 DPDGND
65 TE1RES
GCA
64 PLLCTL
OFSTHOLD
TBAL(01H)
TEOFST(04H)
63 DPDMUTE
to DPD
BLOCK
62 FAUL TOUT
CDRSEL(OOH)
GAIN_ABCD(OOH)
ADVD1 15
61 DPDEQ2
60 DPDEQ1
BDVD1 16
CDVD1 17
DDVD1 18
SUB
RF
MUX
ACD1 19
BCD1 20
D1
B1
C1
A1
ABCD
SUM
EQIN
59 TE30FST
ENV_SEL(02H)
GAIN_FE(03H)
58 BCA
57 MIRR
OFSTHOLD
MUX
CCD1 21
ABCD_OFST(O6H)
FE
56 DPDVCC
FE_0FST(05H)
DCD1 22
OFSTHOLD
AVCC 23
VREFA 24
73 RESET
CDRSEL(00H)
LDONB(00H)
ANALOG
VC AMP
55 DFCT2
MUX
54 DFCT1
TESEL(OOH)
ENVELOPE
FOK
53 DFCTTH1
DEFECT
52 DFCTTH2
ALPC
FOFST 25
FOFST
35
36
37 38
39
40
41 42 43
44
45
46
47
48
49
50
VREFLP_BGI
LDODVD
AGND
FE
FEN
TEN
TE
PDLIMITRES
ABCD
ABCDI
ENVP
DGND
FOKTH
FOKB
DFCT_CP1
DFCT_CP2
CC1
CC2
ENV
34
ENVB
33
ABCDN
32
PDCD
28 29 30 31
LDOCD
27
PDVD
26
OFSTHOLD
2-2
51 DVCC
Samsung Electronics
Samsung Electronics
CD optical laser monitor diode voltage input port
Power GND port for analog part
FE AMP output port
I
O
I
P
O
PDDVD
LDOCD
PDCD
AGND
FE
30
31
32
33
FEN
FE Input port for AMP GAIN setting
-
DPD EQ (A+C) output port
DPD EQ (B+D) output port
O
O
TE3OFST
DPDEQ1
DPDEQ2
59
60
61
CD optical laser diode driving voltage output port
DVD optical laser monitor diode voltage input port
DVD optical laser diode driving voltage output port
64
63
PLLCTL
DPDMUTE
I
I
DPD TE PLL variable input port
DPD TE MUTE control port (H : MUTE)
DPD defect waveform output port (MONITOR)
Resistance connection port for 3BTE offset
-
BANDGAP voltage input port for ALPC
O
BCA output port
O
BCA
58
FAULTOUT
Mirror output port
O
MIRR
57
ON/OFF connection port for auto offset block (L :
auto offset adjustment H : serial offset adjustment)
62
Power voltage input port for DPD TE
P
DPDVCC
56
center voltage, Use at other block
CAP connection port for focus auto offset (OPEN)
Defect output port for SERVO
parating level setting
Defect output port for PLL
O
O
DFCT1
DFCT2
54
DFCTTH1
-
DVCTTH2
52
53
Power voltage input port for digital circuit
P
DVCC
51
Resistance connection port for PLL defect comparating level setting
Resistance connection port for SERVO defect com-
AC coupling input port for defect
I
CC2
50
Output port of peak detector for defect
O
-
CC1
DFCT_CP2
Focus OK comparator output port
(L: FOCUS OK)
Peak hold time constant connection port SERVO
defect max. time setting
Peak hold time constant connection port PLL defect
min. time setting
49
48
-
O
FOKB
46
DFCT_CP1
I
FOKTH
45
47
Power GND input port for digital circuit
P
DGND
44
Focus OK comparing level input port
RF envelope detect output port
95
94
93
92
91
90
AGCP
AGCB
AGCLEVEL
EQGND
AGCI
AGCC
RFAGCO
EQIN
88
89
BCATH
RFEQO
EQVCC
MIRRI
CP1
CB1
MROFST
RFRPN
RFRP
CP2
CB2
RFCT
BCAO
BCAI
RESET
OSC
STB
CLOCK
DATA
RREFDLY
VREFDPD
DPDGND
TE1RES
PIN NAME
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
connection port for RF envelope detect
Bottom hold time constant setting RC
connection port for RF envelope detect
71
ABCD AC coupling input port for SERVO monitor
70
69
68
67
66
65
Peak hold time constant setting RC
ABCD AMP output port
Input port for ABCD AMP GAIN setting
Bias resistance port for PDLIMIT
TE AMP output port
Input port for TE AMP GAIN setting
O
-
-
I
O
I
-
O
I
I
FUNCTION
ENV
ENVB
ENVP
ABCDI
ABCD
ABCDN
PDLIMTRES
TE
TEN
I/O
43
42
41
40
39
38
37
36
35
34
PIN NAME
55
CAP connection port for analog part
29
I
I
O
-/O
O
Power voltage input port for analog part
P
LDODVD
CD optical main beam F input port for SERVO
I
28
CD optical main beam F input port for SERVO
I
BCD1
20
VREFLP_BGI
CD optical main beam F input port for SERVO
I
ACD1
19
27
CD optical main beam F input port for SERVO
I
DDVD1
18
OFSTHOLD
DVD optical main beam D input port for SERVO
I
CDVD1
17
26
DVD optical main beam C input port for SERVO
I
BDVD1
16
FOFST
DVD optical main beam B input port for SERVO
I
ADVD1
15
25
DVD optical main beam A input port for SERVO
I
F
14
VREFA
CD optical sub beam F input port for SERVO
I
E
13
24
CD optical sub beam E input port for SERVO
I
VREFEQ
12
AVCC
CAP connection port for RF EQ center voltage
O
RREF
11
23
Analog block bias resistance connection port
-
CCD1
RF EQ bias resistance connection port
-
RREFEQ
10
DCD1
RF AMP I/O buffer bias resistance connection port
-
RREFBF
9
22
DVD optical main beam D AC coupling input port for RF
21
DVD optical main beam C AC coupling input port for RF
I
DVD optical main beam B AC coupling input port for RF
I
BDVD
6
I
DVD optical main beam A AC coupling input port for RF
I
ADVD
5
CDVD
CD optical main beam D AC coupling input port for RF
I
DCD
4
DDVD
CD optical main beam C AC coupling input port for RF
I
CCD
3
8
CD optical main beam B AC coupling input port for RF
I
BCD
7
CD optical main beam A AC coupling input port for RF
I
ACD
1
FUNCTION
I/O
2
PIN NAME
-
-
I
P
I
-
RF peak hold time constant RC connection port for RF AGC
RF bottom hold time constant RC connection port for RF AGC
AGC level control voltage input port
Power GND input port for RF EQ
When AGC is “HOLD”, AGC voltage input port
AGC time constant CAP connection port
RF AGC AMP output port
RFAGCO input port for RF EQ
O
BCA comparating level control port
I
RF EQ output port
Power voltage input port for RF EQ
Input port for MIRR signal generation
Peak hold time constant RC connection port for
RFCT generation
RFCT generation
Bottom hold time constant RC connection port for
RF ripple offset control port for mirror
RF ripple AMP GAIN input port for mirror
RF ripple AMP output port for mirror
RFCT generation
Peak hold time constant RC connection port for
RFCT generation
Bottom hold time constant RC connection port for
RF ripple center voltage output port for mirror
BCA FILTER2
BCA FILTER1
Reset input port for auto offset block (L : RESET)
OSC time constant input port for auto offset block
Data enable input port
Clock input port
Data input port
Bias resistance connection port for delta block
CAP connection port for DPD TE center
Power GND input port for DPD TE
DPD TE PLL variable bias resistance
FUNCTION
I
O
P
I
-
-
I
I
O
-
-
O
O
I
I
I
I
I
-
O
P
I
I/O
100
VZOCTL
PLLGF
EQF
98
99
EQG
RDPF
97
96
PIN NAME
RF EQ control port (When No. PLLG isn’t adjusted,
apply DC CTL voltage.)
RF EQ peak frequency control voltage input port
I
I
RF EQ boost gain control voltage input port
I
RF EQ boost, peak frequency gain control port corresponding to wideband PLL (PLLG. PLLF resistance
internal design)
Bias resistance connection port for RF EQ frequency setting
-
I
FUNCTION
I/O
Reference Information
2-3
2-4
EFMOA
EFM
ASYCD
ASYDVD
RFI
EFMI
DVCTL
TBAL
FBAL
SPD
SLD
TRD
FOD
RSTB
COUT
TILTO
FE
EFM
ASYMETRY
D/A
CONVERTER
BLOCK
TRACK
COUNTER
ROM
DSP CORE
FOR
DIGITAL SERVO
PS1
WIDE
CAPTURE
RANGE PLL
SYSCON
INTERFACE
BLOCK
SUB CODE
READ BLOCK
SSTOP
/PSO
TE
TEST
SME
XI
A/D
CONVERTER
BLOCK
XO
TZCO
XOUT
I/O INTERFACE
BLOCK
LOCK
TIMING
GENERATOR
SMON
ENV
VREF
PLLHD
INTO_224
FDCTL
MAGICO
EQCTL
VCTRL
RVCO
PLCK
EFMRTD
RPD
PLLLOCK
RFD
MDOUT[3:0]
PSB
SENSE
MDATA[7:0]
MRDB
MWRB
CSB
DAB
SCOR
SQSI
SQCK
LDONB
TLKB
FLKB
Reference Information
2-1-3 SIC1 (KS1452 ; Digital Servo)
DIRC
DFCT
FOKB
MIRR
TZCA
PHI1
TILTI
Samsung Electronics
Samsung Electronics
Counter clock
Focus servo lock signal output pin
Tracking servo lock signal output pin
0 : 1BIT
System reset signal input pin
Micom chip select pin
Micom data/address select pin
Micom write clock signal input pin
O
O
I
I
I
I
I
FLKB
TLKB
PSB
RSTB
CSB
DAB
MWRB
6
7
8
9
10
11
12
Micom read clock signal input pin
Micom data pin 0
Micom data pin 1
Micom data pin 2
Micom data pin 3
Micom data pin 4
Micom data pin 5
Micom data pin 6
Micom data pin 7
Internal status monitor pin
Servo logic & ROM VDD power supply pin
System clock signal input pin
System clock signal output pin
Clock out (33.9688MHz) to DSP
Servo logic & ROM VSS power supply pin
Clock output pin for subcode data read
Subcode data input pin
Timing detection input pin for subcode data read
Motor ON signal input pin
Lock signal input pin
Direct jump control (for 1 track jump)
I
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
P
I
O
O
P
O
I
I
I
I
I
MRDB
MDATA0
MDATA1
MDATA2
MDATA3
MDATA4
MDATA5
MDATA6
MDATA7
SENSE
DVDD
XI
XO
XOUT
DVSS
SQCK
SQSI
SCOR
SMON
LOCK
DIRC
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
1 : 8BIT
Test pin (L : normal H : test)
I
O
TEST
COUT
Sled motor position sensor input pin 1
I
PS1
3
5
Limit switch/sled position sensor input pin0
I
4
Mode data3 out controlled by micom
O
MDOUT3
SSTOP/PSO
FUNCTION
1
I/O
2
PIN NAME
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
TE
VREF
SME
AVSS
SVSS
RFI
LPFCD
LPFDVD
EFMO
EFMI
EQCTL
SVDD
TZCO
EFMOA
MAGICO
VCTL
RPD
RFD
RVCO
PVSS
EFMRTD
PLLLOCK
PLCK
PVDD
INTO_224
PLLHD
MIRR
DFCT
LDONB
FDCTL
FOKB
PIN NAME
PLL logic block VSS power supply pin
Resistor pin for VCO GAIN
Gain adjust resister for frequence detector
Gain adjust resister for phase detector
Control voltage for VCO
P
I
I
I
I
EFM offset adjustment pin
Tracking zero cross output pin
Servo CPU VDD power supply pin
EQ control signal
EFM signal for test
EFM signal
Asymmetric input signal for DVD
Asymmetric input signal for CD
RF input signal
Servo CPU VSS power supply pin
Analog block VSS power supply pin
Spindle error input pin
Reference voltage input pin
Tracking error signal input pin
I
O
P
O
I
O
I
I
I
P
P
I
I
I
Input for hysteresis control of FD output (for test)
Latched EFM output signal
O
I
Frequency lock detect output
(H : Lock L : Unlock)
PLCK
PLL logic block VDD power supply pin
Servo interrupt monitor pin
PLL hold signal from micom
Mirror signal input pin
Defect Detection signal input pin
Laser diode ON signal output pin
PLL frequency detect control input pin
Focus OK signal input pin
FUNCTION
O
O
P
O
I
I
I
O
I
I
I/O
72
71
70
69
68
67
66
65
FBAL
TBAL
DVCTL
TILTO
AVDD
TILTI
ENV
FE
PIN NAME
O
O
O
O
P
I
I
I
I/O
Focus balance signal output pin
Tracking balance signal output pin
Depth variation control signal output pin
Tilt out (reserved)
Analog block VDD power supply pin
Tilt in (reserved)
RF envelope input pin
Focus error signal input pin
FUNCTION
Tracking actuator drive signal output pin
TE signal for tracking zero cross input pin
Mode data 0 out controlled by micom
Mode data 1 out controlled by micom
Mode data 2 out controlled by micom
O
I
O
O
O
TRD
TZCA
MDOUT0
MDOUT1
MDOUT2
78
79
80
O
FOD
75
77
Focus actuator drive signal output pin
O
76
Sled motor drive signal output pin
Spindle motor drive signal output pin
O
SLD
SPD
74
FUNCTION
I/O
73
PIN NAME
Reference Information
2-5
2-6
FG
MON
MDP
MDS
FSW
PLL_LOCK
CLV_LOCK
SERVO_LOCK
XTI1
XTO1
CK33MI
CK33MO
TO (12)
EFMI
PLCK
BCARZ
FROM R/F,
PLL(3)
CD CLV/CAV
WFCK 17.58/7.35KHz
M
SUBCODE I/F
23BIT SR
CD-G
M
SQ-VCD
DVDP,
MICOM I/F
M
TEST0, TEST1, TEST2
V-CD, CD-DA
DEINTERLEAVE
&
RAM CONTROL
(6, 4, 3)
trans ID ECC
EDC
DESCRAMBLER
TO MICOM (15)
MDAT(7:0), MRZA, ZCS, MWR,
MRD, ZIRQZD, ZWAIT, ZRST
Power(34)=VDD(11)+GND(23) Test Pin(3)
EFM DEMOD
(32, 28, 5)
(28, 24, 5)
CIRC
75Hz
676.08Hz
(208, 192, 17)
(182, 172, 11)
ECC
(6, 4, 3)
efmwr ID ECC
16-8 DEMOD
FRAME SYNC
DET/PROT/INS
(7.35KHz)
VCO TIMING
GENERATOR
7.35KHz = 4.3218M/588
17.58KHz = 26.16M/1488
ECSY
Monitor(8) GFS, FRSYZ, TX, EFMO, WFCK, RFCK, CK 16M, DEMPHA
M
DVD CLV/CAV
RFCK 17.58/7.35KHz
X'TAL &
TIMING GEN
VCO TIMING
GENERATOR
26.16MHz
FRAME SYNC
DET/PROT/INS
(17.57KHz)
32BIT SR
PWMO(7:0)
TO D-EQ (8)
SDATA[0] / CDATA
SDATA[1] / LRCK
SDATA[2] / BCLK
SDATA[3] / C2PO
SDATA[4] / SQDT
SDATA[5] / WFSY
SDATA[6] / SOS1
SDATA[7] / SQCK
DATREQ
CSTROBE
DTER
DATACK
TOS
TO AV (13)
DD(15:0)
DADR(8:0)
ZRAS
ZUCAS
ZLCAS
ZOE(1:0)
ZWE(1:0)
TO DRAM
256K*16
(32)
Reference Information
2-1-4 DIC1 (KS1453 ; DVD Data Processor)
Samsung Electronics
Samsung Electronics
DD5_BI
DVSS
DD9_BI
31
32
20
DD10_BI
DD1_BI
19
30
DD14_BI
18
29
DD0_BI
17
DD4_BI
DD15_BI
16
28
DVSS
15
DD11_BI
XTO_OUT
14
27
XTI_IN
13
DVDD
DVDD
12
26
MDAT0_BI
11
DD3_BI
MDAT1_BI
10
25
MDAT2_BI
9
DD12_BI
MDAT3_BI
8
24
MDAT4_BI
7
DD2_BI
MDAT5_BI
6
23
MDAT6_BI
5
DVSS
MDAT7_BI
4
DD13_BI
DVSS
3
22
MRZA_IN
2
21
DVSS
ZCS_IN
1
NAME
PIN
DRAM data bus
Digital GND (0V)
DRAM data bus
DRAM data bus
DRAM data bus
DRAM data bus
Digital power (+5V)
DRAM data bus
DRAM data bus
DRAM data bus
DRAM data bus
Digital GND (0V)
DRAM data bus
DRAM data bus
DRAM data bus
DRAM data bus
Digital GND (0V)
System clock output for 26.16 MHz
System clock input for 26.16 MHz
Digital power (+5V)
Micom data bus
Micom data bus
Micom data bus
Micom data bus
Micom data bus
Micom data bus
Micom data bus
Micom data bus
Digital GND (0V)
(L -> Register H -> Data)
Micom register select
Chip select (Active Low)
Digital GND (0V)
FUNCTION
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
SDATA5_OUT
SDATA4_OUT
SDATA3_OUT
SDATA2_OUT
SDATA1_OUT
SDATA0_OUT
DVDD
DATACK_OUT
TOS_OUT
DVSS
DVSS
DADR3_OUT
DADR4_OUT
DADR2_OUT
DADR5_OUT
DADR1_OUT
DADR6_OUT
DADR0_OUT
DVSS
DADR7_OUT
DADR8_OUT
ZRAS_OUT
ZOEO_OUT
DVDD
ZOE1_OUT
ZWE0_OUT
ZWE1_OUT
ZUCAS_OUT
ZLCAS_OUT
DVSS
DD7_BI
35
36
DD8_BI
DD6_BI
NAME
34
33
PIN
DVD data/Sub code frame sink (WFSY)
DVD data/Sub code serial data (SQDT)
DVD data/CD data error flag (C2P0)
DVD data/CD data bit clock (BLCK)
DVD data/CD data L/R clock (LRCK)
DVD data/CD data bitstream output
Digital power (+5V)
Data acknowledge signal output
Top of sector
Digital GND (0V)
Digital GND (0V)
DRAM address bus
DRAM address bus
DRAM address bus
DRAM address bus
DRAM address bus
DRAM address bus
DRAM address bus
Digital GND (0V)
DRAM address bus
DRAM address bus
DRAM row address strobe
DRAM output enable 0
Digital power (+5V)
DRAM output enable 1 (16M, --------, 16M)
DRAM write enable 0 (4M, 8M, 16M)
DRAM write enable 1 (8M ONLY)
DRAM upper column address strobe
DRAM row column address strobe
Digital GND (0V)
DRAM data bus
DRAM data bus
DRAM data bus
FUNCTION
SDATA7_BI
DVSS
67
68
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
DVSS
CK33MO_OUT
CK33MI_IN
DVSS
GFS_OUT
TX_OUT
FRSYZ_OUT
DVSS
DVSS
DVSS
DVSS
DVDD
DVDD
DVSS
DVSS
DVSS
PWM00_OUT
PWM01_OUT
PWM02_OUT
PWM03_OUT
DVDD
PWM04_OUT
PWM05_OUT
PWM06_OUT
PWM07_OUT
DVSS
DTER_OUT
DATREQ_IN
CSTROBE_OUT
SDATA6_OUT
66
69
NAME
PIN
Digital GND (+5V)
System clock output for 33.8688MHz
System clock input for 33.8688MHz
Digital GND (0V)
Good frame sync detection result output (“H”
active)
Digital out
Frame sync out
Digital GND (0V)
Digital GND (0V)
Digital GND (0V)
Digital GND (0V)
Digital power (+5V)
Digital power (+5V)
Digital GND (0V)
Digital GND (0V)
Digital GND (0V)
PWM output signal
PWM output signal
PWM output signal
PWM output signal
Digital power (+5V)
PWM output signal
PWM output signal
PWM output signal
PWM output signal
Digital GND (0V)
DVD data error output
Data request from A/V decoder or ROM decoder
Data strobe (clock) output
Digital GND (0V)
DVD data/Sub code serial clock (SQCK)
DVD data/Sub code block sink (S0S1)
FUNCTION
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
PIN
MWR_IN
MRD_IN
ZIRQZD_OUT
ZWAIT_OUT
ZRST_IN
DVSS
BCARZ_IN
DEMPHA_OUT
CK16M_OUT
DVDD
DVDD
DVDD
EFMI_IN
FSW_OUT
FG_IN
MON_OUT
DVSS
DVSS
MDS_OUT
MDP_OUT
SERLOCK_OUT
CLVLOCK_OUT
PLLLOCK_OUT
DVSS
PLCK_IN
RFCK_OUT
WFCK_OUT
EFMO_OUT
TEST2_IN
TEST1_IN
TEST0_IN
NAME
Micom write strobe (schmidt trigger)
Micom read strobe (schmidt trigger)
Interrupt request from micom
Micom read/write access wait (“L” wait)
Hardware reset active low
Digital GND (0V)
BCA input signal
When DEEMPHASIS is ON, “HIGH”.
2∫–¡÷ clock of CK33M/16.934MHz
Digital power (+5V)
Digital power (+5V)
Digital power (+5V)
EFM/EFM+ signal input
state)
Spindle motor output filter conversion output (3-
Reference signal for CAV
Spindle motor ON/OFF control output
Digital GND (0V)
Digital GND (0V)
Spindle motor speed control signal
(3-state)
Spindle motor phase control signal
(3-state)
Lock signal for SERVO
Lock signal for CLV
Lock signal for PLL
Digital GND (0V)
Phase locked clock
Reference frame pulse
Write frame pulse
EFM out
Test mode setting port
Test mode setting port
Test mode setting port
FUNCTION
Reference Information
2-7
Reference Information
2-1-5 DIC2 (KM416C254BJ-6 ; CMOS DRAM)
BLOCK DIAGRAM
RAS
UCAS
Control
LCAS
Clocks
Vcc
VBB Generator
Vss
W
Refresh Timer
Row Decoder
Lower
Data in
Buffer
Refresh Control
Lower
DQ0
to
DQ7
Data out
Memory Array
Refresh Counter
Buffer
262,144 x 16
Upper
Cells
Data in
Buffer
Row Address Buffer
AO
.
.
Upper
OE
DQ8
to
DQ15
Data out
Col. Address Buffer
A8
Column Decoder
FUNCTION
NAME
A0-A8
DQ0-15
Address Inputs
Data in/Out
VSS
Ground
RAS
Row Address Strobe
UCAS
Upper Column Address Strobe
LCAS
Lower Column Address Strobe
W
Read/Write Input
OE
Data Output Enable
V CC
Buffer
Power (+5V)
Power (+3.3V)
N.C
2-8
No Connection
Samsung Electronics
Reference Information
2-1-6 VIC1 (ZiVA-3 ; Audio/Video Decoder)
BLOCK DIAGRAM
ZiVA-3 Decoder
OSD
Decoder
SDRAM/
EDO/ROM
Interface
Memory
Controller
Subpicture
Decoder
Host
Interface
Host
Interface
Control Logic
MPEG
Video
Decoder
Secure View
CD-DA and
LPCM
Decoder
CSS
Descrambling
Program
DVD/CD
Interface
Stream
Decoder
Bus Key
Dolby Digital
Audio
Decoder
Authentication
(Optional)
Audio
DSP
Video
Mixer
Video
Interface
Digital
Audio
Interface
Audio
Interface
Scrambled, Compressed Content
Descrambled, Compressed Content
MPEG
Audio
Decoder
Decompressed Content
Display Content
LOGIC DIAGRAM
DA-DATA[0:3]
CS
Host
Interface
Signals
DTACKSEL
DA-LRCK
HADDR[2:0]
DA-BCK
Interface
RD
DA-XCK
Signals
DA-IEC
HDATA[7:0]
WAIT/DTACK
INT
EDO-CAS
HOST8SEL
EDO-RAS
R/W
Video
Audio
LDQM
VDATA[7:0]
MDATA[15:0]
Interface
HSYNC
MADDR[20:0]
Signals
VSYNC
MWE
VCLK
ROM-CS
SDRAM/EDO
Interface
Signals
SD-CAS
DVD-DATA0/CD-DATA
SD-RAS
DVD-DATA1/CD-LRCK
SD-CLK
DVD-DATA2/CD-BCK
SD-CAS[1:0]
DVD-DATA3/CD-C2PO
UDQM
DVD-DATA4/CDG-SDATA
DVD/CD
Interface
Signals
DVD-DATA5/CDG-VFSY
DVD-DATA6/CDG-SOS1
SYSCLK
DVD-DATA7/CDG-SCLK
VDD
VSS
VREQUEST
A_VSS
VSTROBE
A_VDD
ERROR
AREQUEST
Samsung Electronics
Interface
Signals
P10[10:0]
V-DACK/ASTROBE
A-DACK
Global
RESET
ZiVA Decoder
2-9
Reference Information
2-1-7 VIC50 (SAA7128 ; Digital Video Encoder)
BLOCK DIAGRAM
LLC1
VDDA
XCLK
TTXRQ
RCV2
RCV1
XTAL
XTALI
SCL
SDA
RESN
25,28,31,36
4
37
8
43
7
34
35
41
42
40
20
VDD I2C
21
I2 C-
SYNC/
INTERFACE
CLOCK
SA
Clock&Timing
I2 C-Control
I2 C-Control
9..16
I2 C-Control
Y
Y
MP
MP(7:0)
FADER
CbCr
D
30
CVBS
(CSYNC)
27
VBS
(CVBS)
24
C
(CVBS)
OUTPUT-
ENCODER
C
MP
INTERFACE
A
44
I2 C-Control
TTX
22,32,33
I2 C-Control
VSSA
23
Y
D
R(Cr)
RGBCbCr
G(Y)
29
B(Cb)
19
RTC1
AP
SP
FUNCTION
NAME
res.
1
3
2
VDD
VSS
I/O
26
A
6,17,39
5,18,38
PIN
PROCESSOR
Reserved pin, do not connect
2
I
SP
Test Pin;connected to digital ground for normal operation
3
I
AP
Test Pin;connected to digital ground for normal operation
4
I
LLC1
Line-Locked Clock input;this is the 27 MHz master clock
5
I
V SS1
Digital supply ground 1
6
I
V DD1
Digital supply 1
7
I/O
RCV1
Raster Contral 1 for video port. This pin receives/provides a VS/FS/FSEQ signal.
8
I/O
RCV2
Raster Contral 2 for video port. This pin provides an HS pulse of programmable length or receives
an HS pulse.
2-10
Samsung Electronics
Reference Information
PIN
I/O
9
I
MP7
10
I
MP6
11
I
MP5
12
I
MP4
13
I
MP3
14
I
MP2
15
I
MP1
16
I
MP0
17
I
V DD2
Digital supply voltage 2
18
I
V SS2
Digital ground 2
19
I
RTCI
20
I
21
I
SA
22
I
V SSA1
Analog ground 1 for Red (Cr), C(CVBS), Green(Y) outputs
23
O
R(Cr)
Analog output of Red (Cr)signal
24
O
C
25
I
V DDA1
Analog supply voltage 1 for R(Cr), C(CVBS) outputs
26
O
G(Y)
Analog output of Green(Y) signal
27
O
VBS
Analog output of VBS (CVBS) signal
28
I
V DDA2
Analog supply voltage 2 for VBS(CVBS), Green(Y) outputs
29
O
B(Cb)
Analog output of Blue(Cb) signal
30
O
CVBS
Analog output of CVBS(CSYNC) signal
31
I
V DDA3
Analog supply voltage 3 for Blue(Cb)and CVBS(CSYNC), outputs
32
I
V SSA2
Analog ground 2 for VBS (CVBS), Blue(Cb), CVBS(CSYNC)outputs
33
I
V SSA3
Analog ground 3 for the DAC reference ladder and the oscillator
34
O
XTAL
Crystal oscillator output
35
I
XTAL1
36
I
V DDA4
Analog supply voltage 4 for the DAC reference ladder and the oscillator
37
O
XCLK
Clock output of the crystal oscillator
38
I
V SS3
Digital supply ground 3
39
I
V DD3
Digital supply 3
40
I
RESN
41
I
SCL
12C serial clock input
42
I/O
SDA
12C serial data input/output
43
O
TTXRQ
44
I
TTX
Samsung Electronics
FUNCTION
NAME
VDD
12C
Double speed 54 MHzMPEG port. It is an input for "CCIR 656" style multiplexed Cb, Y, Cr data.
Data are sampled on the rising and falling clock edge;data sampled on the risting edge then are sent to
the encoding part of the device, data sampled on the falling edge are sent to the RGB part of the device.
(or vice verse, depending on programming)
Real Time Control input. If the LLC1 clock is provided by an SAA7111 or SAA7151B, RTCI should be
connected to the RTCO pin of the respective decoder to improve the signal quality.
Sense input for 12C bus voltage;connect to 12C bus supply
Select 12C address; low selects slave address 88h, high selects slave address 8Ch.
Analog output of Chrominance (CVBS) signal
Crystal oscillator input; if the oscillator is not used, this pin should be connected to ground.
Reset input, active LOW. After reset is applied, all digital I/Os are in input mode; PALBlackburst on CVBS, VBS and C;RGB outputs set to lowest voltage.
The 12C-bus receiver waits for the START condition.
Teletext Request output, indicating when text bits are requested
Teletext bit stream input
2-11
Reference Information
2-1-8 MIC1 (TMP93CM41F ; Main Micom)
PAO~PA6
PA7(SCOUT)
PORT A
VCC[3]
VSS[3]
900L-CPU
P50 to P57
(ANO to AN7)
AVCC
AVSS
VREFH
VREFL
10-BIT 8CH
A/D
CONVERTER
XWA
XBC
ADE
XHL
XIX
XIY
XIZ
XSP
W
B
D
H
A
C
E
L
(TXD1)P93
(RXD1)P94
(SCLK1)P95
SERIAL I/O
OSC
IX
IY
IZ
SP
32bit
(TXD0)P90
(RXD0)P91
(SCLK0/CTS0)P92
High
Frequency
SR
(CH,0)
P C
CLK
Low
F
Frequency
OSC
SERIAL I/O
(CH,1)
INTERRUPT
(PG 00)P60
(PG 01)P61
(PG 02)P62
(PG 03)P63
(PG 10)P64
(PG 11)P65
(PG 12)P66
(PG 13)P67
(T10)P70
X1
X2
XT1
XT2
AM8/16
EA
RESET
ALE
TEST2,1
CONTROLLER
NMI
WATCH-DOG
WDTOUT
PATTERN
GENERATOR
(CH,0)
PATTERN
TIMER
GENERATOR
(CH,1)
2KB RAM
PORT 0
P00 to P07
(AD0 to AC7)
PORT 1
P10 to P17
(AD8 to AD15/A8 toA15
PORT 2
P20 to P27
(A0 to A7/A16 to A23)
8BIT TIMER
(TIMER 0)
8BIT TIMER
(T01)P71
(T02)P72
(TIMER 1)
8BIT PWM
(TIMER 2)
(T03)P73
8BIT PWM
(TIMER 3)
PORT 3
(INT4/T14)P80
(INT5/T15)P81
(T04)P82
(T05)P83
(INT6/T16)P84
(INT7/T17)P85
(T06)P86
16BIT TIMER
(TIMER 4)
P30(RD)
P31(WR)
P32(HWR)
P33(WAIT)
P34(BUSRQ)
P35(BUSAK)
P36(R/W)
P37(RAS)
16BIT TIMER
(TIMER 5)
CS/WAIT
CONTROLLER
(3-BLOCK)
P40(CS0/CAS0)
P41(CS1/CAS1)
P42(CX2/CAS2)
(INTO)P87
2-12
Samsung Electronics
Samsung Electronics
TXD1
094
SCLK1
AM8/16
CLK
Vcc
Vss
X1
X2
/EA
/RESET
20
21
22
23
24
25
26
27
28
29
30
TXDO
17
RXDO
INTO
16
SCLKO
P86
15
19
INT7
14
18
P83
11
/INT6
P82
10
13
INT5
9
12
P73
/INT4
8
P71
P72
7
P70
5
6
AVcc
/NMI
AVss
2
4
VREFL
1
3
PORT
NAME
No
DSP H/W reset
O
/MRST
/EA
X2
X1
GND
VCC
CLK
AM8
MC
STB
High frequency OSC out
External access CS41/CS40
O
I
Master reset from FRONT
High frequency OSC in
I
I
56
GND
-
60
59
58
57
55
-
54
53
Address mode (H: 8 bit mode)
Clock output (System clock÷2)
50
I
RF control data
O
MD
49
48
O
Serial data clock
I
52
Serial data input
I
TXD
SCLK
47
RF control clock
Serial data output
O
RXD
46
O
Interrupt from DSP
I
ZINT
45
51
Request to front micom
O
RRQ
44
43
42
41
40
39
38
37
36
35
34
33
32
31
No
I/O RF data latch
-
I
-
PLL CTL
Interrupt from spindle motor FG
I
PLL control
DAC rest1
I
I
Interrupt from front micom
I
FGINT
-
Interrupt from AV-DEC
O
-
Non-maskable interrupt
I
AV-DEC H/W reset
A/D VCC input
-
O
A/D GND input
O
A/D Ref input (L)
I
-
FUNCTION
I
DRST1
SRQ
DVDINT
-
ZIVA_RST
-
ZRST
-
AVCC
AGND
GND
ASSIGNED
I/O
NAME
A15
A14
A13
A12
A11
A10
A9
A8
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
Vcc
ALE
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
TEST2
TEST1
P97
P96
PORT
NAME
HA15
HA14
HA13
HA12
HA11
HA10
HA9
HA8
HAD7
HAD6
HAD5
HAD4
HAD3
HAD2
HAD1
HAD0
VCC
ALE
-
AMUT0
DRST
DIF2
DIF0
DEMO1
DEMO0
DFS
TEST2
TEST1
XT2
XT1
D/A control
Test pin. connect to TEST1
Address latch enable
-
Front MUTE
DAC REST
D/A control
D/A control
D/A control
O
O
O
O
O
O
O
O
Address 15
Address 14
Address 13
Address 12
Address 11
Address 10
Address 9
Address 8
I/O Address/Data 7
I/O Address/Data 6
I/O Address/Data 5
I/O Address/Data 4
I/O Address/Data 3
I/O Address/Data 2
I/O Address/Data 1
I/O Address/Data 0
-
O
O
O
O
O
O
O
FUNCTION
Test pin. connect to TEST2
-
-
I/O D/A control
O
-
-
O
O
ASSIGNED
I/O
NAME
/CS1
P40/CS0
80
81
P37
P36
P35
P34
/WAIT
P32
/WR
/RD
A23
A22
A21
A20
A19
A18
A17
A16
Vcc
VSS
/WDTOUT
PORT
NAME
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
No
/CS1
-
RAS
R/*W
BUSAK
RCODE
/MWAIT
-
/WR
/RD
HA23
HA22
HA21
HA20
HA19
HA18
HA17
HA16
VCC
GND
WDTOUT
Address 17 (AV-DECODER)
Address 18 (Data processor)
Address 19
Address 20 (D. SERVO)
Address 23
/Read strobe
/Write strobe
O
O
O
O
O
O
O
O
O
98
99
100
EDT
O
I/O ECK
O
-
97
Chip select 1
(SRAM, 1M Bit, 128KB)
-
96
I/O DVD/CD
95
I
I/O
94
93
92
91
90
89
88
87
86
I/O
/Wait
84
85
83
Address 16
82
No
O
Watch dog timer output
FUNCTION
-
-
O
ASSIGNED
I/O
NAME
VREFH
P57
P56
P55
P54
P53
P52
P51
P50
Vss
P67
P66
P65
P64
P63
P62
P61
P60
/CS2
PORT
NAME
AVCC
VREFO
RFO
RFRP1
FOKB
SENSE
FR
TILTO
SLOCK
GND
RSTB
CSB
DAB
SDA
SCL
-
-
DIF
/CS2
-
IIC clock (VIDEO ENCODER)
-
I
I
I
I
I
I
I
I
-
O
O
O
A/D Ref input (H)
RF sum signal
Tracking lock monitor from SERVO
Focus lock monitor from RF
SENSE monitor from SERVO
Spindle direction from SP driver
Monitor signal
LOCK monitor from DSP
D.Servo IC reset
D.Servo IC chip select
D.Servo IC data/Address select
I/O IIC clock (VIDEO ENCODER)
O
O
O
FUNCTION
(EPROM, 4M Bit, 512KB)
Chip slect 2
I/O D/A control
O
ASSIGNED
I/O
NAME
Reference Information
2-13
Reference Information
2-1-9 MIC8 (M27C801 ; 8MB (1M x 8-bit) CMOS EPROM)
BLOCK DIAGRAM
Data Outputs
DQ0-DQ7
Vcc
Vss
OE/VPP
Output Enable
Chip Enable and
Prog Logic
CE
Y
Decoder
A0-A19
Address
Inputs
X
Decoder
Output Buffers
Y
Gating
.
.
.
.
.
.
.
2,097,152-Bit
Cell Matrix
TOP VIEW
2-14
A19
1
32 Vcc
A16
2
31 A18
A15
3
30 A17
A12
4
29 A14
A7
5
28 A13
A6
6
27 A8
A5
7
26 A9
A4
8
25 A11
A3
9
NAME
FUNCTION
A0-A19
Address Inputs
CE
Chip Enable Input
DQ0-DQ7
Data Input/Outputs
OE
Output Enable Input
24 OE/VPP
Vcc
Vcc Syply Voltage
A2 10
23 A10
Vss
A1 11
22 CE
A0 12
21 DQ7
DQ0 13
20 DQ6
DQ1 14
19 DQ4
DQ2 15
18 DQ4
Vss 16
17 DQ3
Ground
Samsung Electronics
Samsung Electronics
P25
P26
8
9
AN5/P85
AN6/P86
AN7/P87
P70/INT0
P71/INT1
P72/INT2
P73/INT3
24
25
26
27
28
29
30
AN3/P83
AN4/P84
AN2/P82
21
23
AN1/P81
20
22
VDD
17
AN0/P80
CF2
16
19
CF1
15
18
XT2
VSS
14
XT1
P24
7
13
P23
6
*RES
P22
5
12
P21
4
P27
P20
3
TEST1
PWM1
2
11
P52
1
10
PORT
NAME
No
REMOCON
-
-
RRQ
MODE4
MODE3
MODE2
MODE1
MODE0
-
-
-
VDD
-
-
GND
-
GND
-
-
-
-
-
-
-
-
-
-
MRST
-
-
-
-
-
-
-
-
-
-
Reset
-
-
-
-
-
-
-
-
-
-
I
58
60
REMOCON data in
Roulette sensor
I
57
I
Request to front micom
I
56
59
HARDWARE MODE SELECT
I
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
No
I
HARDWARE MODE SELECT
HARDWARE MODE SELECT
I
I
I
HARDWARE MODE SELECT
HARDWARE MODE SELECT
I
-
GND
GND
High frequency OSC out
High frequency OSC in
Low frequency OSC out
Low frequency OSC in
Front end reset
FUNCTION
O
ASSIGNED
I/O
NAME
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
S17
S16
VP
VDD
S15/T15
S14/T14
S13/T13
S12/T12
S11/T11
S10/T10
S9/T9
S8/T8
S7/T7
S6/T6
S5/T5
S4/T4
S3/T3
S2/T2
S1/T1
S0/T0
PORT
NAME
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
-28V
+5V
SEG4
SEG3
SEG2
SEG1
-
GRID1
GRID2
GRID3
GRID4
GRID5
GRID6
GRID7
GRID8
GRID9
GRID10
GRID11
O
O
O
O
O
O
O
O
O
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
O
P17/PWMO
80
FLT SEGMENT CONTROL
O
P16/BUZ
P15/SCK1
79
P14/S11
P13/S01
78
FLT SEGMENT CONTROL
76
P11/S10
P12/SCK0
-
FLT SEGMENT CONTROL
O
75
74
O
FLT SEGMENT CONTROL
O
P10/S00
P07
P06
P05
P04
P03
P02
P01
P00
S31
S30
S29
S28
PORT
NAME
77
FLT SEGMENT CONTROL
O
73
72
71
70
69
68
67
66
65
64
63
62
61
No
-
FLT SEGMENT CONTROL
-
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FUNCTION
O
O
O
O
O
O
O
O
O
O
O
O
ASSIGNED
I/O
NAME
-
-
-
-
SRQ
SCLK
RXD
TXD
-
-
KEY5
KEY4
KEY3
KEY2
KEY1
KEY0
SEG20
SEG19
SEG18
SEG17
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
KEY SCAN
KEY SCAN
KEY SCAN
KEY SCAN
KEY SCAN
KEY SCAN
O
O
O
I
I
I
I
O
O
SERIAL DATA IN
SERIAL CLOCK
I
O
-
-
-
-
Request to Main Micom
SERIAL DATA OUT
O
-
GND
FLT SEGMENT CONTROL
FUNCTION
O
ASSIGNED
I/O
NAME
WIDE
MR
DS
LED
P34
P35
P36
P37
GND
VDD
P40
P41
P42
P43
P44
P45
P46
P47
P50
P51
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
SW1
JOG DATA
JOG DATA
TV TYPE
TV TYPE
-
I
I
I
I
-
SCART CONTROL
O
STANDBY LED
POWER ON/OFF CONTROL
O
ON/OFF
DISC SENSOR
O
JOG LED
MOTOR L
O
O
MOTOR R
O
O
SCART CONTROL
O
O
SCART CONTROL
O
-
ROULETTE SW1
ROULETTE SW2
I
TRAY XLOSE SW
I
I
FUNCTION
TRAY OPEN SW
I
LED
ML
-
SCON_B
RGBCTL
+5V
GND
AD
AT
J2
J1
SW2
P32
CL SW
P33
P31
82
OP SW
84
P30
81
ASSIGNED
I/O
NAME
83
PORT
NAME
No
Reference Information
2-1-10 FIC2 (LC866232 ; Front Micom)
2-15
Reference Information
MEMO
2-16
Samsung Electronics
3. Product Specifications
NTSC
GENERAL
Power Requirements
AC 120V, 60Hz
Power Consumption
20W
Weight
Dimensions
Operating Temperature Range
Operating Humidity Range
DVD
(Digital Versatile Disc)
CD : 5 inches
DISC
15.4lbs
W 10.2 in X D 16.3 in X H 4.4 in
+41°F ~ +95°F
10% to 75%
Reading Speed : 11.45 ft/sec.
Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
Reading Speed : 3.9 to 4.6 ft/sec.
(Compact Disc)
Maximum Play Time : 74min.
CD : 31/2 inches
Reading Speed : 3.9 to 4.6 ft/sec.
(Compact Disc)
Maximum Play Time : 20min.
VCD : 5 inches
Composite Video
Reading Speed : 3.9 to 4.6 ft/sec.
Maximum Play Time : 74min. (Video + Audio)
2 Channel : 1.0Vp-p (75ohm load)
Y : 1.0Vp-p (75ohm load)
Video Output
Component Video
Pb : 0.70Vp-p (75ohm load)
S-Video
2 channel
Output Level
Audio Output
Pr : 0.70Vp-p (75ohm load)
* Frequency Response
Luminance Signal : 1.0Vp-p (75ohm load)
Color Signal : 0.286Vp-p (75ohm load)
L (1/L), R (2/R)
Analog : 2Vrms (1KHz)
Digital : 1.15Vp-p
48KHz Sampling : 4Hz to 22 KHz
96KHz Sampling : 4Hz to 44KHz
* S/N Ratio
110dB
* Dynamic Range
96dB
* Total Harmonic Distortion
0.003%
* : Nominal specification
Samsung Electronics
3-1
Product Specification
PAL
GENERAL
Power Requirements
AC 110V ~ 240V, 50/60Hz
Power Consumption
20W
Weight
9.8Kg
Dimensions
Operating Temperature Range
+5°C ~ 35°C
Operating Humidity Range
10% ~ 75%
DVD
(Digital Versatile Disc)
CD : 12cm
DISC
W 525mm X D 510mm X H 230mm
(Compact Disc)
CD : 8cm
(Compact Disc)
VCD : 12cm
Reading Speed : 3.49m/sec.
Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
Reading Speed : 1.2 to 1.4m/sec.
Maximum Play Time : 74min.
Reading Speed : 1.2 to 1.4m/sec.
Maximum Play Time : 20min.
Reading Speed : 1.2 to 1.4m/sec.
Maximum Play Time : 74min. (Video + Audio)
R (Red) : 0.714Vp-p (75ohm load)
G (Green) : 0.714Vp-p (75ohm load)
Scart Jack
Video Output
B (Blue) : 0.714Vp-p (75ohm load)
Composite Video : 1.0Vp-p (75ohm load)
Luminance Signal : 1.0Vp-p (75ohm load)
Color Signal : 0.286Vp-p (75ohm load)
Component Video
S-Video
Luminance Signal : 1Vp-p (75ohm load)
Color Signal : 0.286Vp-p (75ohm load)
Scart Jack
2 Channel : L (1/L), R (2/R)
RCA-Jack
2 Channel : L (1/L), R (2/R)
Output Level
Audio Output
2 Channel : 1.0Vp-p (75ohm load)
* Frequemvy Response
Analog : 2Vrms (1KHz)
Digital : 1.15Vp-p
48KHz Sampling : 4Hz to 22KHz
96KHz Sampling : 4Hz to 44KHz
* S/N Ratio
110dB
* Dynamic Range
96dB
* Total Harmonic Distortion
0.003%
* : Nominal specification
3-2
Samsung Electronics
4. Disassembly and Reassembly
4-1 Cabinet and PCB
Note : Reassembly in reverse order.
4-1-1 Door-Tray Removal
1) Supply power and open Tray Œ.
2) Lift up the Door-Tray ´ in the direction of arrow “A” by both hand to remove.
3) Close Tray Πand power off.
Note : If Tray Œ doesn’t open, insert a Screw driver ¨ into the Emergency hole ˇ (as shown in detailed drawing) and then turn it in the direction of arrow “B”. Open Tray manually.
ΠTRAY
"A"
´ DOOR-TRAY
"A"
¨ SCREW DRIVER
ˇ EMERGENCY HOLE
"B"
CLOSE
OPEN
<Bottom View>
Fig. 4-1 Door-Tray Removal
Samsung Electronics
4-1
Disassembly and Reaasembly
4-1-2 Top Cabinet Removal
1) Remove 5 Screws Πon the back Top Cabinet.
2) Remove 4 Screws ´, ˇ on the left and right side.
3) Lift up the Top Cabinet in direction of arrow.
Π5 SCREWS
´ 2 SCREWS
ˇ 2 SCREWS
Fig. 4-2 Top Cabinet Removal
4-2
Samsung Electronics
4-1-3 Ass’y Front-Panel, Front PCB, Headphone PCB Removal
1) Remove 2 Screws Œ and disassemble the Ass’y Front Panel ´.
2) Remove Knob-Shuttle ˇ.
3) Remove 11 Screws ¨, ˆ and disassemble the Front PCB Ø.
4) Remove 2 Screws ∏ and disassemble the Headphone PCB ”.
Π2 SCREWS
´ ASS'Y FRONT-PANEL
ˇ KNOB-SHUTTLE
¨ 6 SCREWS
Ø FRONT PCB
” HEADPHONE PCB
∏ 2 SCREWS
ˆ 5 SCREWS
Fig. 4-3 Ass’y Front-Panel, Front PCB, Headphone PCB Removal
Samsung Electronics
4-3
Disassembly and Reaasembly
4-1-4 Main PCB, Jack PCB, S.M.P.S. Removal
1) Remove 2 Screws (4 Screws ; Region - Europe) Œ.
2) Remove 3 Screws ´ and lift the Jack PCB ˇ up.
CAUTIONS ;
(1) When disassembling, switch the SW1 to “OFF” on the Deck PCB and remove the FPC connected to MCN06 on Main PCB.
(See Fig.1-4 on page 1-6)
(2) When assembling, insert the FPC into the MCN06 on Main PCB and switch SW1 to “ON” on the Deck PCB.
(See Fig.1-4 on page 1-6)
3) Disconnect FPC (Pin 36) from MCN06 on Main PCB ˆ, remove 4 Screws ¨ and lift the Main PCB ˆ up.
4) Remove 4 Screws Ø, 1 Screw ∏ and lift the S.M.P.S. PCB ” up.
ˇ JACK PCB
´ 3 SCREWS
¨ 4 SCREWS
MCN06
∏ 1 SCREW
(Black color ; 3x8)
ˆ MAIN PCB
Ø 4 SCREWS
” S.M.P.S. PCB
FPC (Pin 36)
Π2 SCREWS (Black color)
; Region - America
<Region - Europe>
Π4 SCREWS (Black color)
Fig. 4-4 Main PCB, Jack PCB, S.M.P.S. Removal
4-4
Samsung Electronics
Disassembly and Reaasembly
Wire Arrangement
JACK PCB
S.M.P.S. PCB
CORE-FERRITE
MAIN PCB
TO HEADPHONE PCB CON23
Fig. 4-5 Wire Arrangement (Top View)
Samsung Electronics
4-5
Disassembly and Reaasembly
4-1-5 Ass’y Deck Removal
1) Remove 4 Screws Œ, ´ and Bracket-PCB ˇ.
2) Remove 4 Screws ¨ from the Ass’y Deck and lift it up.
ˇ BRACKET-PCB
Π2 SCREWS
´ 2 SCREWS
¨ 4 SCREWS
Fig. 4-6 Ass’y Deck Removal
4-6
Samsung Electronics
Disassembly and Reaasembly
4-2 PCB Location
FRONT PCB
JACK PCB
MAIN PCB
S.M.P.S. PCB
HEADPHONE PCB
KEY PCB
Fig. 4-7 PCB Location
Samsung Electronics
4-7
Disassembly and Reaasembly
4-3 Connector Diagram
CT6
Ú
CT7
Ô
CT3
ˆ
CT4

JACK PCB
ˇ
Œ
∏
CT2
CT9
HEADPHONE PCB
CT1
˜
MAIN PCB
¯
CT8
Æ
ı
”
Ø
¨
˝
S.M.P.S. PCB
CT5
Ò
’
´
FRONT PCB
NO.
CONNECTOR NO.
DIRECTION
CONNECTOR NO.
NO.
Œ
JCN01
JACK PCB
CT1
S.M.P.S. PCB
PCN02
´
ˇ
JCN05
JACK PCB
CT2
MAIN PCB
MCN03
¨
ˆ
JCN03
JACK PCB
CT3
MAIN PCB
MCN02
Ø
∏
CN5
DECK PCB
CT4
MAIN PCB
MCN06
”
’
PCN03
S.M.P.S. PCB
CT5
MAIN PCB
MCN01
˝
Ô
JCN04
JACK PCB
CT6
HEADPHONE PCB
CON23

Ò
FCN01
FRONT PCB
CT7
JACK PCB
JCN02
Ú
Æ
FCN04
FRONT PCB
CT8
MAIN PCB
MCN04
ı
˜
TCN03
DECK PCB
CT9
MAIN PCB
MCN05
¯
Fig. 4-8 Connector Diagram
4-8
Samsung Electronics
Disassembly and Reaasembly
4-4 Deck
3-4-1 Tray Removal
CAUTIONS ;
1) When disassembling Deck Ass’y,
switch the SW1 to “OFF” on the Deck PCB and remove the FPC connected to MCN06 on Main PCB. (See Fig.1-4 on page 1-6)
2) When assembling Deck Ass’y,
insert the FPC into the MCN06 on Main PCB and switch SW1 to “ON” on the Deck PCB. (See Fig.1-4 on page 1-6)
1) Insert a Screw driver ´ into Emergency hole Œ and turn Gear Load ˇ in the direction of arrow “A”.
2) When the Tray ¨ comes out a little, pull it in the direction of arrow “B” by hand.
3) Disconnect Flat Cable Ø.
4) Pull the Tray ¨ to disassemble, while simultaneously pushing the Stopper ˆ, in direction of arrow “C”.
CAUTION ; Do not stain with grease Pick-Up Lens, Turn table, Roulette Disc, Tray Disc, Belt.
ˆ STOPPER
"C"
ˇ GEAR LOAD
"C"
"B"
¨ TRAY DISC
ˆ STOPPER
Ø FLAT CABLE
´ SCREW DRIVER
ΠEMERGENCY HOLE
"A"
CLOSE
OPEN
<Bottom View>
Fig. 4-9 Tray Removal
Samsung Electronics
4-9
Disassembly and Reaasembly
4-4-2 Tray Roulette Removal
1) Remove Screw Œ.
2) Lift up the Tray Roulette ´.
ΠSCREW
´ TRAY ROULETTE
´ TRAY ROULETTE
TRAY DISC
<Assembly Point>
TRAY DISC
Fig. 4-10 Tray Roulette Removal
4-10
Samsung Electronics
Disassembly and Reaasembly
4-4-3 Bracket Worm Ass’y Removal
1) Disconnect LCN02 Œ from Sensor PCB ´.
2) Push the 4 Hooks ˇ in direction of arrow and remove the Sensor PCB ´.
3) Remove 2 Screws ¨ and lift up the Bracket Worm Ass’y ˆ.
4) Remove Belt Ø.
5) Remove Washer ∏ and the Gear Roulette ”.
6) Remove 2 Screws ’ and the Shaft Worm Ass’y ˝.
7) Remove 2 Screws Ô and the Worm Motor .
¨ 2 SCREWS
ˆ BRACKET WORM ASS'Y
Ø BELT
∏ WASHER
” GEAR ROULETTE
˝ SHAFT WORM ASS'Y
Ô 2 SCREWS
 WORM MOTOR
’ 2 SCREWS
ˇ HOOK
ΠLCN02
ˇ HOOK
ˇ HOOK
´ SENSOR PCB
´ SENSOR PCB
ˇ HOOK
<Bottom View>
Fig. 4-11 Bracket Worm Ass’y Removal
Samsung Electronics
4-11
Disassembly and Reaasembly
4-4-4 Ass’y P/U Deck Removal
1) Remove Rubber Pad Protect Œ.
2) Insert a Screw driver ˇ into Emergency hole ´ and turn Gear Load ¨ in the direction of arrow “A” so that
Ass’y P/U Deck Ø is positioned at DATIL-A.
3) Remove the Ass’y P/U Deck Ø in direction of arrow “C”, while simultaneously pushing the 2 Hooks ˆ in
direction of arrow “B”.
CAUTION ; Do not stain with grease Pick-Up Lens, Turn table, Roulette Disc, Tray Disc, Belt.
"C"
Ø ASS'Y P/U DECK
SLIDER RACK
ΠRUBBER PAD PROTECT
CAUTION ;
Suface of adhesion.
<Assemlby Point>
"B"
ˆ HOOK
SLIDER RACK
ˆ HOOK
"B"
<DETAIL-A>
ˇ SCREW DRIVER
´ EMERGENCY HOLE
"A"
¨ GEAR LOAD
CLOSE
OPEN
<Bottom View>
Fig. 4-12 Ass’y P/U Deck Removal
4-12
Samsung Electronics
Disassembly and Reaasembly
4-4-5 Slider Rack Removal
1) Remove the Slider Rack ´ in direction of arrow “B”, while simultaneously pushing the Lever Locker Œ in
direction of arrow “A”.
<Assembly Point>
"B"
´ SLIDER RACK
´ SLIDER RACK
ΠLEVER LOCKER
"A"
1
ΠLEVER LOCKER
Fig. 4-13 Slider Rack Removal
Samsung Electronics
4-13
Disassembly and Reaasembly
4-4-6 Belt Pulley, Gear Pulley Removal
1) Remove Belt Pulley Œ.
2) Push the Hook ˇ in the Boss ´ in the direction of arrow.
3) Lift up the Gear Pulley ¨.
CAUTION ; Do not stain with grease Pick-Up Lens, Turn table, Roulette Disc, Tray Disc, Belt.
ΠBELT PULLEY
¨ GEAR PULLEY
´ BOSS
ˇ HOOK
´ BOSS
¨ GEAR PULLEY
Fig. 4-14 Belt Pulley, Gear Pulley Removal
4-14
Samsung Electronics
Disassembly and Reaasembly
4-4-7 Gear Tray, Gear Convert, Gear Cam, Gear Load Removal
1) Push the Hook ´ below the Gear Tray Œ in the direction of arrow and lift up Gear Tray Œ.
2) Push the Hook ´ below the Gear Convert ˇ in the direction of arrow and lift up Gear Convert ˇ.
3) Push the Hook ´ below the Gear Cam ¨ in the direction of arrow and lift up Gear Cam ¨.
4) Remove Gear Load ˆ.
¨ GEAR CAM
ˆ GEAR LOAD
ˇ GEAR CONVERT
ΠGEAR TRAY
´ HOOK
<Bottom Side>
Fig. 4-15 Gear Tray, Gear Convert, Gear Cam, Gear Load Removal
Samsung Electronics
4-15
Disassembly and Reaasembly
4-4-8 Spring Locker, Lever Locker Removal
1) Remove Spring Locker Œ.
2) Lift up the Lever Locker ´ pushing the direction of arrow “A”.
3) Remove the Gear Syncro ¨ in direction of arrow “B”, while simultaneously pushing the 2 Hooks ˇ.
¨ GEAR SYNCRO
´ LEVER LOCKER
"A"
ΠSPRING LOCKER
"B"
ˇ HOOKS
Fig. 4-16 Spring Locker, Lever Locker Removal
4-16
Samsung Electronics
Disassembly and Reaasembly
4-4-9 PCB Motor Ass’y, PCB Switch Removal
1) Push the Hook Œ in the direction of arrow “A”, 4 Hooks ´ in the direction of arrow “B” and lift up
PCB Motor Ass’y ˇ.
2) Push the 3 Hooks ¨, ˆ, Ø in the direction of arrow “C” and lift up PCB Switch Ass’y ∏.
ˇ PCB MOTOR ASS'Y
´ 2 HOOKS
"B"
∏ PCB SWITCH
"B"
´ 2 HOOKS
ΠHOOK
"A"
¨ HOOK
ˆ HOOK
"C"
"C"
Ø HOOK
"C"
Fig. 4-17 PCB Motor Ass’y, PCB Switch Removal
Samsung Electronics
4-17
Disassembly and Reaasembly
4-4-10 Clamper Removal
1) Pull the Clamper ´ by hand in the direction of arrow ”B”, while simultaneously pushing the 4 Hooks Œ in
direction of arrow “A”.
2) Remove the Magnet ˇ.
3) Lift up the Plate Chuck ¨.
¨ PLATE CHUCK
"B"
"A"
"A"
ˇ MAGNET
Π4 HOOKS
"A"
´ CLAMPER
"A"
Fig. 4-18 Clamper Removal
4-18
Samsung Electronics
Disassembly and Reaasembly
4-4-11 Pick-Up Ass’y Removal
1) Remove Washer Œ and lift up the Gear Feed U ´.
2) Disconnect FPC ˇ from CN2.
3) Push the Stopper ¨ in the direction of arrow “A”.
4) Pull the Shaft P/U ˆ in the direction of arrow “B” to remove.
5) Lift up the Pick-up Ø in the direction of arrow “C”.
CAUTION ; Do not stain with grease Pick-Up Lens, Turn table, Roulette Disc, Tray Disc, Belt.
ΠWASHER
´ GEAR FEED U
CN2
Ø PICK-UP ASS'Y
ˇ FPC
ˆ SHAFT P/U
ˆ SHAFT P/U
"B"
"C"
"A"
¨ STOPPER
Fig. 4-19 Pick-Up Ass’y Removal
Samsung Electronics
4-19
Disassembly and Reaasembly
4-4-12 PCB Deck Removal
1) Remove the soldering of CN4 Π(Pin 6).
2) Remove the Soldering pole of Motor Feed ´ (+, - pole).
3) Remove 3 Screws ˇ.
4) Remove the FPC ¨ from Motor Spindle Ass’y side.
5) Remove PCB Deck ˆ.
ˇ 3 SCREWS
¨ FPC
ΠCN4
ˆ PCB DECK
´ FEED MOTOR
Fig. 4-20 PCB Deck Removal
4-20
Samsung Electronics
Disassembly and Reaasembly
4-4-13 Spindle Motor Removal
1) Remove 3 Screws Œ.
2) Lift up the Spindle Motor ´.
´ SPINDLE MOTOR
Π3 SCREWS
Fig. 4-21 Spindle Motor Removal
Samsung Electronics
4-21
Disassembly and Reaasembly
4-4-14 Bracket Deck Ass’y Removal
1) Remove 4 Screws Œ.
2) Lift up the Bracket Deck Ass’y ´.
Π4 SCREWS
´ BRACKET DECK ASS'Y
ˇ SUB CHASSIS
Fig. 4-22 Bracket Deck Ass’y Removal
4-22
Samsung Electronics
Disassembly and Reaasembly
4-4-15 Assembly of Gear
ΠGEAR CAM
TIMING POINT-1
´ GEAR TRAY
ΠGEAR CAM
ˇ GEAR CONVERT
´ GEAR TRAY
TIMING POINT-2
ΠGEAR CAM
ˇ GEAR CONVERT
´ GEAR TRAY
¨ TRAY DISC
Fig. 4-23 Assembly of Gear
Samsung Electronics
4-23
Disassembly and Reaasembly
MEMO
4-24
Samsung Electronics
5. Circuit Descriptions
5-1 S.M.P.S.
5-1-1 Comparsion between Linear Power Supply and S.M.P.S.
5-1-1 (a) Linear
Vout
Vreg
REGULATOR
+
Vp
(Np) –
Common power
(Ex.120/220V 50/60Hz)
+
Vs
– (Ns)
+
Fig. 5-1 Linear Power Supply
Waveform/Description
Vs
0
t
Input : Common power to transformer (Vp).
Fig. 5-2
Vs
0
t
The output Vs of transformer is determined by the ratio
of 1st Np and 2nd Ns.
Vs = (Ns/Np) x Vp
Fig. 5-3
Vout
0
t
Vout is output (DC) by diode and condensor.
Fig. 5-4
Samsung Electronics
5-1
Circuit Descriptions
Advantages and disadvantages of linear power supply
Change by common power
1) Advantages : Little noise because the output waveform
of transformer is sine wave.
2) Disadvantages :
ΠAdditional margin is required because Vs is changed (depending on power source). (The regulator
loss is caused by margin design).
´ Greater core size and condensor capacity are needed, because the transformer works on a single
power frequency.
v
Vout
Vreg
0
t
Regulator loss
Fig. 5-5
5-1-1 (b) S.M.P.S. (Pulse width modulation method)
Vout
Transformer
(Np)
(Ns)
+
+
(Vp)
(Vs)
–
–
REGULATOR
+
+
Vin
Switch
ON/OFF Control
+
Vs switch
–
I switch
Fig. 5-6
Terms
1) 1st : Common power input to 1st winding.
2) 2nd : Circuit followings output winding of transformer.
3) f (Frequency) : Switching frequency (T : Switching cycle)
4) Duty : (Ton/T) x 100
5-2
Samsung Electronics
Circuit Descriptions
5-1-2 Circuit description (FLY-Back PWM (Plise Width Modulation) Control)
5-1-2 (a) AC Power Rectification/Smoothing Terminal
1) PD01,PD02,PD03,PD04 : Convert AC power to DC(Wave rectification)
2) PE3 : Smooth the voltage converted to DC(Refer to VIN of Fig. 5-7)
3) PC01, PC02, PC10, PC11, PC12, PC13, PL01, PL02, PL03 : Noise removal at power input/output
4) PVA1 : SMPS protection at power surge input (PVA1 pattern open is to remove noise)
5) PR10 : Rush current limit resistance at the moment of power cord insertion.
ΠRush current = (AC input voltage x 1.414 - Diode drop voltage) / Pattern resistance + PL02,01 resistance + PC10 resistance + PR10) (AC230V based : approx. 26A)
´ Without PR10, the bridge diode might be damaged as the rush current increases.
5-1-2 (b) SNUBBER Circuit : PR15, PR16, PC04, PC05, PD11, PR17
1) Prevent residual high voltage at the terminals of
switch during switch off/Suppress noise.
High inverted power occurs at switch (PIC1) off,
because of the 1st winding of transformer :
(V= LI xdi/dt. LI : Leakage Induction)
A very high residual voltage exists on both terminals
of PIC1 because dt is a very short.
Vswitch
Inverted power
by leakage
inductance
dt
2) SNUBBER circuit protects PIC1 from damage
through leakage voltage suppression by RC,
(Charges the leakage voltage to PD11 and PC04, and
discharges to PR15 and PR16).
0
t
3) PC05, PR17 : For noise removal
Toff
Fig. 5-7
5-1-2 (c) PIC1 Vcc circuit
1) PR11, PR12, PR13, PR14 : PIC1 driving resistance (PIC1 works through driving resistance at power cord in)
2) PIC1 Vcc : PR18, PD12, PE6
ΠUse the output of transformer as Vcc, because the current starts to flow into transformer while PIC1 is active.
´ Rectify to PD12 and smooth to PE6.
ˇ Use the output of transformer as PIC1 Vcc : The loads are different before and after PIC1 driving.
(Vcc of PIC1 decreases below OFF voltage, using only the resistance due to load increase after PIC1 driving.)
Samsung Electronics
5-3
Circuit Descriptions
5-1-2 (d) Feedback Control Circuit
Trans PD33
PIC1
STR-G6153T
PL34
PE33
5.8V
PC34
OCP
GND
#
DRAIN !
@
%
PR35
$
F/B
VCC
C
A
E
K
PIC2
PC09
PR36
PC44
PR37
PR38
K
1st GND
P
PIC3
2.5V
A
PR39
2nd GND
Fig. 5-8
1) F/B terminal of PIC1 determines output duty cycle.
2) C-E(Collector-Emitter) of PIC2 and F/B potential of PIC1 are same.
Operation descriptions
1) Internal OP-Amp ‘+’ base potential of PIC3 is 2.5V and external “-” input potential is connected with PR38 and
PR39 to maintain Vout of 5.8V. (Vout = ((PR36 x PR39) / PR39) x 2.5V)
2) If load of 5.8 V terminal increases(or AC input voltage decreases) and Vout decreases below 5.8V, then :
PIC3 ‘P’ potential down below 2.5V --> PIC3 A-K of base current down --> PIC3 of A-K current down -->
PIC2 Diode current down --> PIC2 C-E current down --> PIC2 C-E voltage up --> PIC1 F/B voltage up -->
Out Duty up --> Transformer 1st current up --> Transformer 1st power up --> Vout up --> Maintain Vout 5.8V
3) If load of 5.8 V terminal decreases(or AC input voltage rises) and Vout rises above 5.8V, then :
Reverse sequence of the above description --> Duty down --> Vout down --> Maintain 5.8V (i.e., the feedback
to maintains 5.8V).
ΠPR35, PR36 : Reduce 5.8V overshoot
´ PR37, PC44 : Prevent PIC3 oscillation(for phase correction)
ˇ PC09 : Adjust feedback response rate
5-4
Samsung Electronics
Circuit Descriptions
5-1-3 Internal Block Diagram
5-1-3 (a) Internal Block Diagram of S.M.P.S. Circuit
FLT Driving
Circuit
Smoothing
Circuit
Noise
Removal
(SNUBBER)
Converter
Rectified Circuit
3.3V Rectified
VoltageCircuit
5V Rectified
Smoothing Circuit
5V Rectified
VoltageCircuit (x2)
O
U
T
P
U
T
Motor 8V
1 Port
PWM Control
Circuit
(1L0380)
Line Filter
3.3V Rectified
Smoothing Circuit
Voltage
Detection
Circuit
Power IN
(85~265V)
8V Rectified
Smoothing Circuit
8V Rectified
VoltageCircuit
-8V Rectified
Smoothing Circuit
-8V Rectified
VoltageCircuit
Fig. 5-9
5-1-3 (b) PIC1 (STR-G6153T) Internal Block Diagram
Vcc
5
6.3V
2uA
+
_
32V
Sync.
Voltage
Ref.
UVLO
Vck
1mA
OSC.
Feedback
1
Drain
3
Source
GND
4
2.5R
S
Q
R
R
LEB
Voffset
Sense
Rsense
5v
Reset
7.5V
Reset
+
_
Sense
FET
S
Q
Thermal
Protection
R
OVP
Control IC
2
OCP
Fig. 5-10
Samsung Electronics
5-5
Circuit Descriptions
5-2 RF
5-2-1 RIC1 (KS1461)
KS1461 is combined with KS1452 and KS1453 as bipolar IC developed for DVD SERVO system.
Main features include DVD waveform equalizing, CD waveform equalizing, focus error signal generation, 3-beam
tracking error signal generation, DPD 1-beam tracking error, defect, envelope, MIRR output, etc. after receiving the
pick-up output converted into I/V.
5-2-1 (a) Basic Potentiometer
KS1461 uses a single power method and each circuit is based on V of 2.5V.
V (Pin 12, 20, 24, 67) terminal is needed for IC, which uses the peripheral V.
5-2-1(b) RF signal
Fig. 5-11 shows the flow of signal generated by the pick-up.
A, B, C, D signals detected from pick-up are converted in to RF signal(A+B+C+D) via RF summing AMP.
104
MIRRI
RFAGCO 474
EQIN
?
.
m
A
B
C
PICK-UP
D
PD LD F
104
%
104
^
104
&
104
*
MIRR
RE SUM
& AGC
RF EG
G MIRR
,
TESEL
E
DPD
TE
Mhx
y TE
3
4 TE
5
6
7
i
ABCD
SUM
8
ABCDI
103
ENV
FOK
DEFECT
FE
w
E
RFEQO
I
P
[
F
d
T
ABCD
ENV
FOKB
DFCT2
DFCT1
FE
ALPC
Fig. 5-11
Fig. 5-12 shows the waveform-equalizing block diagram for the RF signal.
It outputs to EQout (Pin 86) terminal by initially changing switching AMP gain of DVD and CD, and then adjusting the level in RF SUM & AGC. It controls RF SUM & AGC gain by means of Pin 89-95 and interfaces with PWM
signal, (output from PWM terminal of KS1453, via low-pass filter to adjust boost gain and peak frequency.
EQout terminal is connected with EQin (Pin 86).
5-6
Samsung Electronics
Circuit Descriptions
EQIN
,
VZOCTL
‚
RFEQO
RFDVCC
·
VREFEQ
PLLGF
EQG
PWM1
°
RF EQ
EQF
.
‡
REAGCO ?
PWM2
474
Fig. 5-12
The control parameters of DVD EQ and CD EQ are as follows.
1) DVD CD EQ control parameter
ΠEQG (Pin 97) : Changes the gain of peak frequency with EQ frequency characteristic. Convert PWM signal,
output from KS1453, into DC via low-pass filter.
´ EQF (Pin 98) : Changes the peak frequency with EQ frequency characteristic. Convert PWM signal, output
from KS1453, into DVD via low-pass filter.
Samsung Electronics
5-7
Circuit Descriptions
5-3 System Control
5-3-1 Outline
The main micom peripheral circuit is composed of 16bit Micom (MIC1 ; TMP93CM41F), 8M EPROM (MIC8 ; AM27C080) for Microcode and data save, 512 byte EE-PROM (MIC5 ; KS24C020) for permanent storage of data needed at
power off, MIC4 (74AC573) to latch only address in the bus where address and data are mixed, address decoder
(MIC7 ; 74HC00) for selection of ex-ternal device chip and 20MHz clock oscillator for micom operation. The Micom
(MIC1 ; TMP93CM41F) mounted in main board analizes the key commands of front panel or instructions of remote
control through communication with Micom (FIC1 ; LC86P6232) of front and controls the devices on board to execute the corresponding commands after initializing the devices connected with micom on board at power on.
5-3-2 Block Diagram
RIC1
RF AMP
KS1461
SIC1
DIGITAL SERVO
KS1452
DIC1
DATA PROCESSOR
KS1453
VIC1
A/V DECODER
ZIVA-3
VIC50
VIDEO ENCODER
SAA7128
AIC1,2,3,4
D/A CONVERTER
AK4324
DRIC3
ROULETTE MOTOR DRIVE
Ka3082
FIC1
FRONT MICOM
LC86P6232
MIC1
MAIN MICOM
TMP93CM41F
MIC7
ADDR DECODER
74HC00
MICOM
BLOCK
MIC2
ADDR LATCH
74AC573
DATA BUS
MIC5
EEPROM
KS24C020
MIC8
EPROM
AT27C080
LOW ADDRESS
HIGH ADDRESS
Fig. 5-13
5-8
Samsung Electronics
Circuit Descriptions
5-3-3 Waveform Description
When micom accesses each device sharing bus, it falls the chip select signal of corresponding chip to (CS2:MIC8-22,
/DSPCS:DIC1-2, /DVDCS:VIC1-206/SRVCS:SIC1-10) 0 (Low) before trial.
So to speak, the bus is used by time-division as shown in Fig 5-14, 5-15, 5-16.
Two and more devices can't be accessed simultaneously.
/CS2
/DSPCS
/DVDCS
/SRVCS
/WR
/RD
Fig. 5-14
• CH1 : CS2 (MIC8-22, EPROM CHIP SELECT)
• CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)
• CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT)
• CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)
• CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL)
• CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL)
/CS2
/DSPCS
/DVDCS
/SRVCS
/WR
/RD
Fig. 5-15
• CH1 : CS2 (MIC8-22, EPROM CHIP SELECT)
• CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)
• CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT)
• CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)
• CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL)
• CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL)
Samsung Electronics
5-9
Circuit Descriptions
/CS2
/DSPCS
/DVDCS
/SRVCS
/WR
/RD
Fig. 5-16
• CH1 : CS2 (MIC8-22, EPROM CHIP SELECT)
• CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)
• CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT)
• CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)
• CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL)
• CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL)
5-10
Samsung Electronics
Circuit Descriptions
5-4 Servo
5-4-1 Outline
SERVO system of DVD is divided into Focusing SERVO, Tracking SERVO, SLED Linked SERVO and CLV
SERVO (DISC Motor Control SERVO).
1) Focusing SERVO
Focuses the optical spot output from object lens onto the disc surface. Maintains a uniform distance between
object lens of Pick-up and disc (for surface vibration of disc).
2) Tracking SERVO
Make the object lens follow the disc track in use of tracking error signal (created from Pick-up).
3) SLED Linked SERVO
When the tracking actuator inclines outwardly as the object lens follows the track during play, the SLED motor
moves slightly (and counteracts the incline).
4) CLV SERVO (DISC Motor Control SERVO)
Controls the disc motor to maintain a constant linear velocity (necessary for RF signal).
5-4-2 Block Diagram
SLED M/T
DISC
LD
HALL
PCB
PD
DECK
OPEN/CLOSE
MOTOR
ROULETTE
MOTOR
DRIC2
KA3010D
MOTOR DRIVE
DRIC3
KA3082
FOCUSING
ROULETTE MOTOR DRIVE
TRACKING
SPINDLE M/T
CN1
HA1+
HA1–
HA2–
HA2+
SLED+
SLED–
AO
DO
CO
BO
FO
EO
PD
LD
F–
T+
T–
F+
SPINDLE
MIC1
TMP 93CS41F
›
#
@ SIC8
% NJM2903
^
RIC1
KS1461
+
t
SIC1
KS1452
1
&
2
8
7 DRIC2
KA3010D
!
@
!
x
DRIC1 0
KA3011D“
FIC1
LC86P6232
FRONT MICOM
OPEN/CLOSE S/W
ROLUETTE SENSOR
DISC SENSOR
Fig. 5-17
Samsung Electronics
5-11
Circuit Descriptions
5-4-3 Operation
1) FOCUSING SERVO
(1) FOCUS INPUT
The focus loop is changed from open loop to closed loop, and the triangular waveform moves the object lens up
and down (at pin 75 of SIC1 during Focus SERVO ON.) At that time, S curve is input to pin 65 of SIC1.
ABAD (pin 39 of RIC1) signal, summing signal of PD A, B, C, D, is generated, and zero cross(2.5V) point occurs
when S curve is focused and ABAD signal exceeds a preset,constant value. The focus loop is changed to
closed loop, and the object lens follows the disc movement, maintaining a constant distance from the disc.
(these operations are same in CD and DVD).
Vref
Pin75 of SIC1 (FOD)
Pin65 of SIC1 (FEI)
Vref
Pin39 of RIC1 (ABCD)
1.5V
Fig. 5-18
(2) PLAY
When focus loop closes the loop during focus servo on, both pin 65 and pin 75 of SIC1 are controlled by VREF
voltage (approx. 2.5V), and pin 1, 2 of DRIC2 are approximately 4.5V.
2) TRACKING SERVO
(1) NORMAL PLAY MODE
ΠFor DVD
Composite : The signal output from PD A, B, C, D of Pick-up, the tracking error signal (pin36 of RIC1) uses the
phase difference of A+C and B+D in RIC1, and inputs to terminal 64 of SIC1. Then, it is output to SIC1 pin 76 via
digital equalizer, and applied to the tracking actuator through DRIC2.
Pins 17, 18 of SIC1 are controlled by VREF(approx. 2.5V) during normal play.
Meanwhile, DVD repeats the track jump from 1 to 4 in inner direction at normal play (because data- read speed
from disc is faster than data output speed on screen).
´ For CD, VCD
Receive the signal output through E, F of Pick-up, from RIC1. The tracking error signal is similar to DVD.
5-12
Samsung Electronics
Circuit Descriptions
(2) SEARCH Mode :
Search mode : Fine seek,(Moving the tracking actuator slightly little below 255 track) and coarse search, moving
much in use of sled motor. The coarse search will be described in sled linked servo and now, the fine seek is
explained shortly.
If the object lens is located near target, cut off the tracking loop and give the control signal as many as desired
count to move the tracking actuator via SIC1 pin 76 terminal(TRD).
3) SLED LINKED SERVO
• Normal play mode
Move SLED motor slightly by means of PWM signal in SIC1 pin 73, as the tracking actuator moves along with
track during play. Control to move the entire Pick-up as the tracking actuator moves.
• Coarse serach mode
In case of long-distance search (such as chapter serach), SIC1 uses sled FG (SIC8 pin 1, 7, which is generated) by
rotation of sled motor via hall PCB. Then, read ID and compute the existing track count after input of next
track. If the existing track count is within fine seek range, tracking begins using fine seek.
4) CLV SERVO(DISC MOTOR CONTROL SERVO)
Input RF signal (from Pick-up) to SIC1 pin59. Detect SYNC signal from RF in SIC1, and output PWM signal to
SIC1 pin 55 for constant linear velocity.
Samsung Electronics
5-13
Circuit Descriptions
5-5 DVD Data Processor
5-5-1 Outline
DIC1(KS1453) performs Sync detection, EFM/EFM demodulation and error correction and Spindle motor control
(CLV control) after inputting sliced EFM signal of RF signal at disc playback and EFM read clock (PLCK) signal generated from PLL. Outputs data which converted to the last audio and video from A/V decoder(VIC1). KS1453 uses
external memory(4M DRAM) as buffer as well as for error correction and carries out Variable Bit Rate transfer function. VBR function uses the external buffer as buffer to absorb the difference of transfer rate occurring because the
transfer rate of disc playback is faster than data transfer rate demanded by A/V decoder(Video/Audio Signal
Process Chip).
In case of general disc refresh, the memory is almost filled up periodically. It is because Write rate to memory after
disc playback and signal process is faster than Read of A/V decoder. When the memory is filled, this status is reported by interrupt to main micom, which controls the servo to kick back the pick-up to the previous track after memorizing the last data read from disc until now. It takes some times to jump to the previous track and return to the
original(jump location) again. The memory will have an empty space because A/V decoder reads out data of memory.
When the memory has an empty space, where data can be processed and written and the pick-up correctly gets to
the original location(before kick back location) again, it reads data again avoids the interrupt of data read previously. The basic operation repeats to perform as described above.
5-5-2 Block Diagram
DIC2
(KM416C254)
[
D
A
D
R
8.
.
0
[
[
D
D
1
5.
.
0
[
MDP 109
MDS 110
[
R C
A A
S S
Z
R
A
S
Z
C
A
S
W
E
CLOCK 27MHz
CLOCK 33.8688MHz
CLOCK 27MHz
O
E
Z Z
W O
E E
O O
SDATA[7..0]
CSTROBE
DATREQ
DIC1
DATACK
(KS1453)
DTER
TOS
MDAT[7:0]
MRZA(3)
ZCS(2)
MWR(128)
MRD(127)
ZIRQZD(126)
14
95
177, 178
[
EFM 116
EFMI
PLCK 104
PLCK
A
8.
.
0
[
[
D
1
5.
.
0
192
191
196
200
69
70
58
71
57
AD[7..0]
HA[23..8]
*WR(73)
VIC1
DVD-D[7..0]
VSTROBE
(ZiVA-3)
REQUEST
DACK
HDATA[7..0]
*ERR
HADDR[3..0]
/CS
/RD
/WR
/INT
INTO(ZIRQZD)
INT4(/INT)
*RD(72)
MIC1 TMP93CM41F
Fig. 5-19
5-14
Samsung Electronics
Circuit Descriptions
5-5-3 Waveform Description
It measures the timing that data processed in DIC1 at DVD playback.
STROBE
REQ
DACK
SDATA all
2
2
0
1
0
Fig. 6-20
• CH1 : STROBE (DIC1-69, CLOCK)
• CH2 : REQ (DIC1-70, DATA REQUEST)
• CH3 : DACK (DIC1-58, DATA ACKNOWLEDGE)
• CH4 : SDATA (DIC1-60~67, DATA)
Samsung Electronics
5-15
Circuit Descriptions
5-6 Video
5-6-1 Outline
VIC50 sends VSYNC and HSYNC from VIC1(A/V decoder) and receives 8bit video data.
VIC50 does RGB encoding, copy guard processing and D/A conversion of 8bit video data inputted from VIC1(A/V
decoder) by control of MIC1(Micom).
Video signal converted into analog signal is outputted via amplifier of analog part.
(Main Board)
(Output Board)
CVBS-1
VIC1
A/V Decoder
ZiVA-3
MIC1
Main Micom
TMP93CM41F
Video
data
VIC52
Amplifier
BA7660
CVBS-2
Y
VIC50
SAA7128
C
Video
encoder
Y
VIC51
Amplifier
BA7660
Pr
Pb
Fig. 5-21 Video Output Block Diagram
5-16
Samsung Electronics
Circuit Descriptions
5-6-2 NTSC/PAL Digital Encoder (VIC50 : SAA7128)
VIC50 inputted from pin4 with 27MHz generates HSYNC and VSYNC which are based on video signal. Each
HSYNC and VSYNC outputted from Pin8 and Pin7 are inputted to Pin157 and Pin158 of A/V decoder VIC1(ZIVA3). VIC1 is the synchronous signals with the video signal and control the output timing of 8bit video signal of ITUR601 format. (Pin180, 182, 184 ~ 189 (MSP))
8bit data is inputted to Pin9(MSB) and Pin16 of VIC50 and the inputted data is demuxed with each 8bit of Y/R-Y/BY. The separate signal is encoded to NTSC or PAL by control of MIC1. The above signals, that is CVBS
(Composite Video Burst Synchronized)(Pin30), S-Video (Y:Pin27, C:Pin24), Y/Pb/Pr(Pin27/Pin29/Pin23) and
GB(Pin26/Pin29/Pin23). In course of encoding, 8bit data can extend to 10bit or more. To convert the extended data
to quantization noise as possible, VIC50 adopts 10bit D/A converter. VIC50 perform video en-coding as well as
copy protection.
VIC1 (SSA7128)
CR-CB
9~16
Demultiplexer
VDATA
[7:0]
RGB encoding
Luminace
processing
Y
Trap
VSYNC
HSYNC
27M
7
8
4
Chrominance
processor
MRST
SDA
SCL
40
42
41
CTRL+CFG
register
Cloed captions
CGMS
10-bit DAC
MACROVISION
7.0.1/6.1
30
CVBS
27
Y
24
C
23
Pr/R
26
G
29
Pb/B
Fig. 5-22
5-6-3 Amplifier (VIC51, VIC52 : BA7660)
VIC51 and VIC52 are 6dB amplifier. Based on CVBS signal, the final output level must be 2Vpp without 75ohm terminal resistance. Because the level of video encoder output is only 1.1Vpp, the level is adjusted with the special
amplifier. When mute of pin1 is high active, if the pin is floating and connected to power, the output signal is never
outputted. CVBS, Y, C, Cr and Cb outputted from video encoder are inputted to VIC52 (Pin7, Pin2 and Pin4) and
VIC51 (Pin7 and Pin4) respectively and outputted from VIC52 (Pin10, Pin15 and Pin13) and VIC51 (Pin10 and Pin
13). Pin9, Pin12 and Pin14 of VIC51 and VIC52 are feedback pin to SAG compensation(DC characteristic compensation of signal). Resistance(VR3-VR14) which is inserted to input terminal is bias resistance for input offset. The
signal to which gain is adjusted by amplifier is outputted from jack via 75ohm.
Samsung Electronics
5-17
Circuit Descriptions
5-6-4 Scart Jack Output (PAL Only)
The AV1 of scart jacks is used for connecting a TV or other display devices and the AV2 for a VCR or other players.
When the DVD player is turned on, the RGB, CVBS, or S-VIDEO is outputted to AV1 and CVBS to AV2. When the
player is turned off, CVBS signal of the TV is inputted and CVBS or RGB of a VCR inputted via AV2 is outputted.
In case of AV2, the reverse signal flow to that.
Switching of power on/off is controlled by SCIC1, SCIC2, and SCIC5.
The control signal (Pin 9,10,11) of SCIC1 and SCIC2 is outputted from PIN100 of FIC1 and connected to the signal(Pin 4) inverted by FIC3.
The control signal(Pin 9,10,11) of SCIC5 is also outputted from Pin100 of FIC1 and inverted again by SCQ8.
According to the characteristics that SCART Jack is supplied same pins for the output of CVBS signal and Y signal
and for the R signal and C signal, SCIC3 lets the user select two signals in setup menu.
This control signal (Pin 9,10,11) of the switch is outputted from Pin 92 of FIC1.
The signal selected by switch is amplified by SIC4 and SIC6 and outputted through the SCART jack.
The scart jack has the function select signal (Pin 8 of AV1) that the TV can select automatically RF and the external
video signal.
SCQ1 to SCQ7 are the circuit to point, FIC1 (Pin100, 94) controls. When the TV aspect ratio is 4/3 or 16/9, it is outputted 4.5 ~ 7V or 9.5 ~ 12V each. But, when the DVD video source is 16/9 and 16/9 wide is selected in setup
menu, 4.5 ~ 7V is outputted. Otherwise, 9.5 ~ 12V is outputted.
When the player is turned off, the TV works with function selection by output signal of VCR in relation of SCQ9
and SCQ10.
RGB control signal (Pin 16 of AV1) is outputted that the TV can select between RGB and CVBS.
SCQ11 ~ SCQ14 and SCQ17 are for RGB control and controlled by FIC1 (Pin91).
When the player is turned off, receives VCR input (Pin 37 of AV2) and buffers in this circuit and then outputs to
Pin 16 of AV1.
CVBS_TV_IN
CVBS_VCR_IN
CVBS_S
Y_S
SIC2
(14053)
Switch
CVBS_TV_IN
SIC1
(14053)
Switch
C_S
R_S
R_VCR_IN
G_S
G_VCR_IN
B_S
B_VCR_IN
SIC3
(14053)
Switch
SIC4
(NJM2267)
Amplifier CVBS_VCR_OUT
SIC5
(14053)
Switch
R/C_TV_OUT
SIC6
G_TV_OUT
(BA7660)
Amplifier B_TV_OUT
CVBS/Y_VCR_OUT
R_TV_OUT
G_TV_OUT
AV1
TV
B_TV_OUT
R_VCR_IN
G_VCR_IN
B_VCR_IN
AV2
VCR
CVBS_VCR_OUT
Fig. 5-23
5-18
Samsung Electronics
Circuit Descriptions
5-7 Audio
5-7-1 Outline
The four data (Data 0~3) outputted from A/V decoder (VIC1 ; ZiVA-3) are supplied to DATA 0 for 2-channel
mixed audio output and to DATA 1~3 for Analog audio output (5.1-channel).
The audio data (0~3) transmitted from A/V decoder (VIC1 ; ZiVA-3) are converted into analog signal via audio
D/A converter and outputted via post filter and amplifier.
CD and VCD are outputted with only 2 channels audio data and transmit them to Data 0 and Data 1.
Front L/R channel is outputted in mixed audio output (L/R output) and analog audio output and surround L/R,
center and subwoofer aren’t outputted.
If DVD of 2 channels source disc is used, it is outputted by the same way with CD and VCD.
If 5.1-channel source disc, front L/R channel is outputted in Data 1, Surround L/R in Data 2 and Center/Subwoofer in Data 3. At that time, 5.1 channel can be downmixed in 2 channel in Data 0.
Mixed Audio Output (2-Channel)
DATA0
LRCK
BCK
AIC1
AK4324
D/A CONVERTER
POST
FILTER
POST
FILTER
AIC2
AK4324
D/A CONVERTER
POST
FILTER
POST
FILTER
AMP
FRONT-L
AMP
FRONT-R
AIC3
AK4324
D/A CONVERTER
POST
FILTER
POST
FILTER
AMP
SURROUND-L
AMP
SURROUND-R
AIC4
AK4324
D/A CONVERTER
POST
FILTER
POST
FILTER
AMP
CENTER
AMP
SUB WOOFER
AMP
L
AMP
R
Analog Audio Output (5.1-Channel)
DATA1
VIC1
(ZiVA-3)
A/V Decoder
DATA2
DATA3
(OPTION)
Fig. 5-24 Audio Output Block Diagram
Samsung Electronics
5-19
Circuit Descriptions
5-7-2 DVD Audio Output
Source Data Types :
MPEG-1,-2, Dolby Digital,
CD-DA, LPCM
VIC4, 10 (LOCAL DRAM)
VIC1 (ZiVA-3 ; A/V DECODER)
HOST or DVD/CD
INTERFACE
IEC-958/1937
OUTPUT PROCESS
AUDIO INPUT
BUFFER
Compressed Data
(MPEG, Dolby Digital),
CD-DA, LPCM
AUDIO DECODER
(MPEG, DOLBY DIGITAL,
CD-DA, LPCM
AUDIO OUTPUT
BUFFER
IEC-958/1937
INTERFACE
RECEIVER
or
DECODER
(IEC-958/1937)
2-Channel LPCM, Decoder
Dolby Digital, Decoded MPEG
Uncompressed 16- or 24-bit
LPCM camples at
fs=44.1,48,96KHz
2-, 4, or 6CHANNEL OUTPUT
PROCESS
DIGITAL AUDIO
INTERFACE
AUDIO
DAC
Fig. 5-25 Audio Decoder and Output Interface Datapath
1) Compressed Data
The audio data inputted to VIC1 (ZiVA-3) A/V decoder is divided into compressed data and uncompressed data.
It is compressed data that is compressed with multi-channel audio data such as Dolby digital, MPEG, DTS, etc.
The compressed data inputted to VIC1 (ZiVA-3) is converted into the uncompressed data of 2, 4, and 6 channels
through ZiVA-3 built-in audio decoder and is outputted to Data 0, 1, 2, and 3 through digital audio interface.
The compressed data is transmitted to external AC-3 amplifier or MPEG/DTS amplifier as IEC-958/1937 transmission data format compressed by ZiVA-3 built-in IEC-958 output process.
2) Uncompressed Data
The uncompressed data is that data isn’t compressed, so it is called CD-DA, LPCM data.
The 2 channels data is converted through audio decoder 2-channel data and Data 0 and Data 1 are outputted in
digital audio interface.Via IEC-958 output process, they is transmitted to digital amplifier or AC-3/MPEG/DTS
amplifier built in the external digital input source with IEC-958/1937 transmission format.
5-20
Samsung Electronics
Samsung Electronics
See "Fine Seek Check"
Yes
TE occurs in
search range?
Yes
Actual velocity occurs
at DRIC2-11, 12 terminal?
Yes
Actual velocity occurs
at SIC1-73 terminal?
Yes
PS0, PS1 is input
SIC1-2, 3 terminal from
SIC8-1, 7?
No Search Operation
No
No
No
No
Focus On?
No
No
Replace Hall PCB
Check DRIC2 peripheral circuit.
Check SIC1 peripheral circuit.
Yes
0.1Vp-p sine wave
occurs at search at SIC8-2, 6
terminal?
Check SIC8 peripheral circuit.
A
Check SIC1 peripheral circuit.
Yes
Pick-up transfer smooth.
Yes
TE is within
2V and 3V?
Yes
Track incomming is
delayed?
Yes
TZCO signal
(SIC1-52) is occurs?
Yes
FINE SEEK MIRR
signal (RIC1-57) is missing?
FINE SEEK Check
Check SIC1 Peripheral curcuit.
Check RIC1 Peripheral curcuit.
No
Check RIC1-36 terminal.
No
Check DRIC2 peripheral circuit.
Check MCN06 and pick-up.
Yes
DRIC2-17, 18
terminal outputs are
normal?
Yes
SIC1-76 output
is normal?
Time out due to many jump counts.
Check MECHA.
No
No
No
No
Yes
6. Troubleshooting
6-1
6-2
Check or replace disc motor.
Yes
DRIC1-23 signal
MON is "H" ?
Yes
No
No
No
No
Yes
RIC1-86 output
are normal?
Yes
RIC1-88 output
is normal?
Check DRIC1 soldering and power.
Check DIC1, MIC1.
No
Check RIC1 peripheral
circuit and A, B, C, D.
No
Check RIC1 soldering and power.
Check path to RIC1 and SIC1.
After resoldering SIC1.
DRIC1-24 output (FG)
is normal?
Yes
SPD output is normal?
(SIC1-74)
Yes
Input of RF signal
is normal? (SIC1-59)
Abnormal rotation of
disc motor
Check signal line state from
DRIC1-26, 27 to tray motor.
Yes
Check DRIC2-26, 27
output at open/close
Yes
FIC1-81, 82 is
Open ; "L", "L" ?
Close ; "H", "H"?
No Tray open/close
No
No
Check DRIC2
Micom (FIC1) erroe.
Troubleshooting
Samsung Electronics
Samsung Electronics
A
No focus incoming and
no disc occurs.
Yes
LD is outputted
from object lens at
play key input?
No Disc recognition
No
B
Check open state from
DRIC4 to pick-up.
Yes
DRIC4-1, 2 output
are normal?
Yes
FE in SIC1-65
is within specified range?
A
No focus incoming
No
No
Check DRIC4
Check RIC1 and A, B, C, D input.
Troubleshooting
6-3
6-4
Check SIC1 soldering and power.
Yes
SELED FG Ps0, PS1
is input normally.
(SIC1-2, 3)
No pick-up home positing
No
Check SIC8, DRIC2 signal
transfer system
Yes
RIC1-29 output
is 200mV?
Yes
RIC1-28 is 5V?
LD out pick-up replace.
Yes
Current exceeds 0.1A?
Yes
Divide RQ1 emitter terminal
voltage and 5V real voltage
difference into 33ohm.
B
NO LD ON
No
Yes
Check MIC1
LD MPD error. Replace pick-up
Open check in related circuit.
No
No
RIC1-50
output is 0V?
No
Troubleshooting
Samsung Electronics
Samsung Electronics
Check AVJ2 peripheral
soldering shot.
Yes
Base terminal level
of AQ1, 2, 3, 4
are "L"?
Yes
AOP1-1, 7 output
is normal?
Yes
Analog output of
AIC1-16, 17, 18, 19
is normal?
Yes
Normal DATA 0 is
input in AIC1-7?
CD/VCD/DVD L/R output error
(Mixed Audio output)
No
No
No
No
Check MIC1-41 mute.
Check AOP1 peripheral circuit.
Check VIC1-169
(CD/VCD ; 16.9344MHz,
DVD ; 18.432MHz)
Check VIC1-161 output.
VIC1 peripheral soldering
and short check.
Yes
Signals are output
from SIC1-42, 44?
Yes
27MHz clock is
input in DIC1-14?
Yes
'NO DISK' appears
after pick-up moves up and
down twice at power on?
DVD play error
No
No
No
Replace SIC1.
Check 27MHz oscillating part.
Check DIC1, MIC1 peripheral short.
Troubleshooting
6-5
6-6
Check AVJ4 peripheral
soldering shot.
Yes
No
Check VIC5.
Replace PIC1.
No
Pulse is missing
in PIC1-5?
Yes
Voltage exists in
PIC1-5?
Yes
PIC1 drain (pin 1)
voltage is missing?
No
PD01 voltage
is missing?
PF01 error?
Output in
AIC5-6, 8, 10 is
normal?
Check VIC1 peripheral circuit.
No
No
No Power
(Standby LED OFF)
Yes
Output in VIC1-159 is normal?
Digital output error
Yes
No
No
Yes
Yes
Replace PIC1.
Check feed back.
Check PR11, 12, 13, 14.
Check 2d voltage.
Check PR10.
Replace fuse.
Troubleshooting
Samsung Electronics
Check A/V decoder signal process block.
Samsung Electronics
C
Yes
Play works?
Yes
/CS2, /RD, /WR signal occur?
Yes
All clocks (20MHz,
33.8688MHz, 27MHz) of main PCB
oscillate normally?
Yes
No
No
No
Check VIC1 peripheral unit.
Yes
Check short pin out of micom
common-bus (8-bit).
Check short or operating of micom.
Check soldering of micom and
communication devices.
Yes
Check all clock oscillating parts.
Yes
Check eith article
"No Front (SET) Operation"
No
MIC1-10, 19
waveform state (0, 1)
changes whenever pressing
front key?
No
MIC7-4, 5 pin is fixed to 0V?
No
MIC1-9 is fixed to 0V?
All power is measured
correctly and front cable is
properly connected?
Yes
C
Key operation or
remote control error
Yes
Yes
Yes
Check MIC1 peripheral soldering.
Check DVD signal process block.
Check A/V decoder signal process block.
Troubleshooting
6-7
6-8
D
Yes
Analog signals output
normally at pin 30, 27, 24,
29, 23, in VIC50?
Yes
Video data are inputed
normally at pin 9 ~ 16 in
VIC50?
Yes
SYNC signal is
normal at pin 7, 8 in
VIC50?
Yes
Control signal is
normal at pin 41, 42 in VIC50?
(When power on
or open)
Yes
MRST is high state
at pin 40 in VIC50?
Yes
27MHz clock input
is normal at pin 4 in
VIC50?
Yes
Power level is
normal at pin 6, 17, 20, 25, 28,
31, 36, 39 in VIC50?
Video output error in
RCA Jacks
No
No
No
No
No
No
No
Change VIC50.
No
Check the soldering of VIC50.
Change VIC50.
No
Check the connection with
pin 180, 182, 184 ~ 189 in VIC1.
Check the soldering of VIC50.
Check the connection between
pin 86, 87 in MIC1 and pin 41, 42 in VIC50.
Check the connection between
pin 1 in FIC1 and pin 40 in VIC50.
Check the connection between
pin 10 in VIC6 and pin 4 in VIC50.
Check the connection between
pin 2 in PIC6 and Emmiter in PQ24.
Check the RCA cable.
Yes
Video signals of
about 1V appear at
output jacks?
Yes
Video signals of
about 2V appear at pin 10, 13, 15
in VIC51, 52?
Yes
Pin 1 in VIC51, 52 is in
Low state?
Yes
Power is normal
at pin 16 in VIC51, 52?
Yes
Analog signals
are inputed normally at pin 2, 4,
7 in VIC51, 52?
D
No
No
No
No
No
Change VIC51, 52.
No
Check the connection between
VIC51, 52 and output jacks.
Check the soldering of
VIC51, 52.
Connect to ground.
Check the connection between
VIC51, 52 and Emmiter of PQ24.
Check the connection between
VIC50 and VIC51, 52.
Troubleshooting
Samsung Electronics
Samsung Electronics
If the problem persists ;
Check after replacing Jack PCB,
with another one.
Check other parts for abnormal
front operation persists.
Yes
Key of STOP, PLAY, OPEN
work normally?
No
Operational waveform
is missing in FIC3
(FLT) pin?
Yes
FIC1 soldering is OK?
Yes
Reset working in
FIC1-12?
Yes
12MHz oscillation (FY1)?
Yes
REF +/-, 5V-all, -28V
power is supplied.
No front (SET) operation
No
Yes
No
No
No
No
Check S/W interface.
Check communication status with
main micom
(Check FIC1 pins 27, 73, 74, 75, 76)
Check FIC1 peripheral circuit.
Check FIC1 soldering.
Check reset peripheral circuit of FIC2.
Check X-TAL peripheral circuit.
Check power status.
Troubleshooting
6-9
Troubleshooting
MEMO
6-10
Samsung Electronics
7. Exploded View and Parts List
Page
7-1 Cabinet Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
7-2
7-2 Deck Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 7-4
Samsung Electronics
7-1
7-2
2
1
4
6
703
151
151
S.N.A. : Service Not Available
3
151
701
FCN04A
S.N.A. (DECK-DVD MECHA)
151
11
601 (ASSY-PCB-MAIN)
151
702
14
12
150
151
602 (ASSY-PCB-JACK)
15
12
150
13
JCN05A
JCN03A
605
13
150
150
150
UT01
S.N.A. (CHASSIS-REAR)
610
101
603 (ASSY-PCB-SMPS)
S.N.A. (CABINET-BOTTOM)
151
151
151
Exploded Views and Parts List
7-1 Cabinet Assembly
Samsung Electronics
Exploded Views and Parts List
Loc. No
Parts No.
1
2
3
4
6
11
12
13
14
15
101
150
151
601
602
603
605
610
701
702
703
FCN04A
JCN3A
JCN5A
UT01
AH97-00215D
AH97-00216C
AH64-11306M
AH64-00302A
AH61-00206A
AH61-00151A
AH64-80034A
AH97-00296A
AH61-00133A
3301-001368
AH64-00203B
6003-000275
6003-000276
AH92-00665A
AH92-00184A
AH92-00537A
AH63-00040A
AH39-00034A
AH92-00311A
AH92-00554A
AH92-00555A
3809-001155
3809-001154
3809-001157
AH59-10141E
Samsung Electronics
Description ; Specification
Remark
ASSY-CABINET FRONT;DVD-C600
ASSY-DOOR TRAY;DVD-C600
KNOB-VOLUME;ABS 94HB BLK
KNOB-JOG;-,ABS 94HB,-,BLK,-,DVD-C700
BRACKET-JACK;-,SECC US,-,T1.0,-,-,DVD-C7
CHASSIS-PCB;-,SECC US,-,T0.8,-,243*123,D
FOOT-BOTTOM;-,ABS94,HB,T2,BLK,-,DVD-860K
ASSY-BRKT PCB;RC5910P,-,THOMSON
CHASSIS-FRAME;-,SECC US,-,T1.0,-,-,RC591
FERRITE-CORE;AE,28X8,2X16.4 2000,2600GAUSS
CABINET-TOP;-,PCM,-,0.625T,-,-,429*109*3
SCREW-TAPTITE;BH,+,B,M3,L10,BLK,SWCH1018
SCREW-TAPTITE;BH,+,B,M3,L10,ZPC(YEL),SWC
ASSY-PCB-MAIN;DVD-C600,MAIN PCB
ASSY-PCB-JACK;RC5910P,JACK PCB
ASSY PCB-SMPS;DVD-C700,SMPS PCB
GROUND-REAR;-,PBS,T0.2,-,DVD-909
POWER CORD;KJ-10W,-,1.83M,CONNECTOR,
ASSY-PCB-FRONT;DVD-C700,FRONT PCB
ASSY PCB-KEY;DVD-C700/XAA,KEY PCB
ASSY PCB-HEADPHONE;DVD-C700/XAA,HEADPHON
CABLE-FLAT;30V,-20to+80C,300mm,24P,1mm,U
CABLE-FLAT;30V,-20to+80C,60mm,17P,1.25mm
CABLE-FLAT;30V,-20to+80C,60mm,35P,1.25mm
REMOCON-ASS’Y;-,-,-,-,DVD-C700,-
7-3
7-4
H520
903
H527
H510
H523
H514
902
H522
H526
H525
H521
901
H500
H300
900
H530
LCN01A
H511
H512
H513
H400
TCN03A
H414
H416
H415
H417
H450
H412
H440
H411
H410
H421
H413
H418
H419
H431
H432
H433
H430
H420
905
908
H230
H201
904
H243
H242
H241
H212
H211
S.N.A. : Service Not Available
CN1A
CN5A
909
905
H240
H210
H220
905
H200
Exploded Views and Parts List
7-2 Deck Assembly
Samsung Electronics
Exploded Views and Parts List
Loc. No
Parts No.
900
901
902
903
904
905
908
909
CN1A
CN5A
H200
H201
H210
H211
H212
H220
H230
H240
H241
H242
H243
H244
H300
H400
H410
H411
H412
H413
H414
H415
H416
H417
H418
H419
H420
H421
H430
H431
H432
H433
H440
H450
H500
H510
H511
H512
H513
H514
H520
H521
H522
H523
H525
H526
H527
H530
LCN01A
TCN03A
6003-000198
6003-000101
6003-000156
AH60-10014A
6001-001258
AH60-10143U
6003-000108
BG60-10020A
3809-001158
3809-001156
AH97-00307A
AH61-00289A
AH30-00004A
AH30-00005A
AH66-00093A
AH31-00014A
AH41-00140A
AH61-00335A
AH66-00090A
AC60-30306A
AH61-00290A
AH61-00291A
AH97-00244A
AH61-00332A
AH61-00120A
AH66-00105A
AH66-00085A
AH66-00084A
AH66-00035A
AH66-00037A
AH66-00038A
AH66-00086A
AH66-00041A
AH61-00125A
AH66-00087A
AH66-00088A
AH66-00104A
AH61-00283A
AH33-00006A
AH66-00089A
AH41-00130A
AH41-00135A
AH97-00243A
AH66-00106A
AH66-00034A
AH97-00237A
AH61-50324A
AH66-00036A
AH61-00333A
AH61-00360A
AH97-00238A
AH61-00334A
AH66-00040A
6031-001159
AH66-00042A
AH41-00129A
3809-001152
3809-001153
Samsung Electronics
Description ; Specification
Remark
SCREW-TAPTITE;PWH,+,B,M3,L12,ZPC(YEL),SW
SCREW-TAPTITE;-,-,B,M3,L10,ZPC(YEL),SWRC
SCREW-TAPTITE;PH,+,B,M2,L4,CBLACK,SWRCH1
SCREW;PH,+,-,M2,L3,YEL,-,
SCREW-MACHINE;BH,+,M1.7,L4,ZPC(BLK),SWRC
SCREW-TAP TITE;-,SWRCH18A,-,PH,-,DP-3,+,
SCREW-TAPTITE;BH,+,B,M2.6,L6,ZPC(YEL),SW
SCREW-SP MOTOR;-,BHW TOOTH,-,-,M1.7,L3,CABLE-FLAT;30V,-20to+80C,50mm,11P,1mm,UL
CABLE-FLAT;30V,-20to+80C,420mm,36P,1.25m
ASSY-PU DECK;DP-4,-,CHASSIS-SUB;-,ABS+GF 20%,-,-,-,-,-,-,-,D
PICK UP-ASSY;DP-4
PICK UP-ASSY CHANGER;12pF√fl∞°(PCB)
RACK-SLIDE;-,M90-44(DURACON),-,-,-,-,DVMOTOR-SPINDLE ASSY;-,-,-,PCB-DECK ASSY;PV-32,-,-,-,-,108*78*1.6T,
BRACKET-DECK ASSY;-,DP-4,-,-,-,-,-,GEAR-FEED(U);-,-,-,-,-,-,DP-4,WHT,-,WASHER-SLIT;-,-,ID2.1,OD5.0,T0.5,-,POLYS
SHAFT-PU;-,SUS420J2,-,-,-,-,DP-4
DAMPER;-,BUTYL 45µµ,-,-,-,-,DP-4,-,-,
ASSY-BASE MAIN;DP-4,-,FRAME-MAIN ASSY;-,ABS+SECC+POM,-,-,-,-,FRAME-MAIN;-,ABS,-,2,347,357,80,BLK,-,DP
PULLEY-MOTOR ASSY;-,POM,-,DP-4,GEAR-LOAD;-,-,-,-,-,-,DP-4,BLK,-,GEAR-PULLEY;-,-,-,-,-,-,DP-4,WHT,-,GEAR-CAM;-,POM,M1,86,80,-,-,DP-4
GEAR-TRAY;-,POM,M1,86,80,-,-,DP-4
GEAR-CONVERT;-,POM,M1,M1.52,22,28,-,-,DP
GEAR-SINCRO;-,-,-,-,-,-,DP-4,WHT,-,LEVER-LOCKER;-,POM,-,-,-,DP-4
SPRING-LOCKER;-,-,SUS304-WPB,-,0.4,-,DPSLIDER-CAM;-,ABS,-,-,-,DP-4
BELT-LOAD;-,RUBBER,T=1,-,-,BLK,DP-4
CLAMPER-ASSY;-,POM+MAGNET,-,-,-,DP-4
PLATE-CHUCK;-,DURACON M90-44,-,-,DP-4
MAGENT;-,-,-,-,-,-,CLAMPER;-,M90-44(DURACON),-,-,-,DV-P32
PCB-PULLEY MOTOR ASSY;DP-4,-,-,-,-,37*18
PCB-S/W ASSY;DP-4,-,-,-,-,34*22*1.6T,-,ASSY-TRAY DISC;DP-4,-,TRAY-DISC SUB ASSY;-,ABS+SECC+SUS,-,BLK,
TRAY-DISC;-,ABS,-,BLK,-,DP-4
ASSY-ROLLER;DP-4,-,SHAFT-ROLLER;STS,PI1.5,RCD-C1
TRAY-ROULETTE;-,ABS,-,BLK,-,DP-4
BRACKET-WORM ASSY;-,SECC+SUM,-,-,-,-,DPBRACKET-ASSY;-,SECC+SUM,-,-,-,-,DP-4,ASSY-WORM MOTOR;DP-4,-,SHAFT-WORM ASSY;-,SUS+POM,-,-,-,-,DP-4
GEAR-ROULETTE;-,POM,M0.5,60,-,-,DP-4
WASHER-PLAIN;POLYSLIDE,-,ID3.6,OD8,T0.4,
BELT-WORM;-,CR,-,10%,-,BLK,DP-4
PCB-SENSOR ASSY;DP-4,-,-,-,-,34*22*1.6T,
CABLE-FLAT;30V,-20to+80C,200mm,6P,1.25mm
CABLE-FLAT;30V,-20to+80C,330mm,11P,1.25m
7-5
Exploded Views and Parts List
MEMO
7-6
Samsung Electronics
8. Electrical Parts List
Loc.No
601
AC10
AC11
AC12
AC4
AC5
AC56
AC57
AC58
AC59
AC6
AC61
AC62
AC7
AC71
AC73
AC74
AC8
AD1
AD2
AD4
AD5
AD6
AD7
AE10
AE11
AE30
AE31
AE33
AE4
AE41
AE5
AE6
AE7
AE8
AE9
AIC5
AL19
AL20
AL21
AL22
AL5
AL6
AOP1
AOP5
AQ1
AQ17
AQ18
AQ19
AQ2
AQ20
AQ21
AQ22
AQ3
AQ33
AQ34
AQ35
AQ4
AR10
AR11
AR119
Part No
2203-000444
2202-000806
2203-000595
2203-000444
2203-000595
2203-000192
2203-000192
2202-002037
2202-002037
2203-000595
2203-001388
2203-000260
2203-000192
2203-000192
2301-000161
2301-000161
2203-000192
0407-000114
0407-000114
0401-000101
0401-000101
0407-000114
0407-000114
2401-002144
2401-002144
2401-000302
2401-000037
2401-002144
2401-002068
2401-000302
2401-002068
2401-000913
2401-002068
2401-002068
2401-000913
AH14-10004R
2901-001125
2901-001125
2701-000113
2701-000113
3301-000297
2701-000113
1201-000163
1201-000163
0501-000341
0504-000118
0504-000118
0504-001003
0501-000341
0504-000156
0504-000128
0504-000156
0501-000341
0504-000128
0504-000128
0504-000156
0501-000341
2001-000878
2001-000878
2007-000766
Samsung Electronics
Description ; Specification
ASSY PCB-MAIN;DVD-C600/XAA,MAIN PCB
C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,C-CERAMIC,MLC-AXIAL;220pF,10%,50V,Y5P,TP
C-CERAMIC,CHIP;0.22nF,5%,50V,NP0,TP,2012
C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,C-CERAMIC,CHIP;0.22nF,5%,50V,NP0,TP,2012
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,CHIP;0.22nF,5%,50V,NP0,TP,2012
C-CERAMIC,CHIP;10nF,5%,50V,X7R,TP,2012
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-FILM,PEF;12nF,5%,50V,TP,6.5X5.5X3.0X5,
C-FILM,PEF;12nF,5%,50V,TP,6.5X5.5X3.0X5,
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTC-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;470uF,20%,16V,GP,TP,8x11.5,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;33uF,20%,16V,GP,TP,5x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;33uF,20%,16V,GP,TP,5x11,5
C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
C-AL;33uF,20%,16V,GP,TP,5x11,5
C-AL;33uF,20%,16V,GP,TP,5x11,5
C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
IC;M74HCU04,SOP,TAPE 14P
FILTER-EMI ON BOARD;50V,0.5A,-,220pF,7x7
FILTER-EMI ON BOARD;50V,0.5A,-,220pF,7x7
INDUCTOR-AXIAL;100uH,5%,2.5x3.4mm
INDUCTOR-AXIAL;100uH,5%,2.5x3.4mm
CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
INDUCTOR-AXIAL;100uH,5%,2.5x3.4mm
IC-OP AMP;4560,SOP,8P,173MIL,DUAL,100V/m
IC-OP AMP;4560,SOP,8P,173MIL,DUAL,100V/m
TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOTTR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TOTR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TOTR-DIGITAL;KSR2003,PNP,300MW,22K/22K,TOTR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOTTR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K
TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOTTR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K
TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOTR-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CHIP;330OHM,5%,1/10W,DA,TP,2012
Remark
Loc.No
Part No
AR12
AR121
AR13
AR14
AR15
AR150
AR151
AR157
AR158
AR18
AR19
AR20
AR21
AR22
AR23
AR24
AR25
AR26
AR27
AR28
AR29
AR30
AR31
AR32
AR41
AR42
AR9
AR90
AR91
AR92
AVJ1
AVJ2
AVJ4
AVJ5
AZD1
AZD2
AZD3
AZD4
AZD5
AZD6
AZD7
HC01
HC02
HR03
HR04
JCN01
JCN02
JCN04
JCN3
JCN5
JP71
SVJ1
VC101
VC105
VC106
VC106A
VC2
VC3
VE51
VE54
VE55
2007-001055
2007-001247
2007-001055
2007-001055
2001-000290
2001-000429
2001-000429
2007-000468
2007-000468
2001-000429
2001-000429
2001-000003
2001-000878
2001-000878
2001-000878
2007-001055
2007-001055
2007-001055
2007-000300
2001-000003
2001-000281
2001-000429
2001-000429
2007-000766
2001-000003
2001-000281
2001-000878
2001-000241
2001-000281
2001-000780
3722-001355
3722-001353
3722-001053
3707-001005
0403-000551
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
2401-002299
2401-002299
2001-000273
2001-000273
AH39-00136A
3711-001061
AH39-00135A
3708-000189
3708-000277
2001-000429
3722-001375
2203-000858
2007-000029
2203-000192
2007-000029
2202-002037
2202-002037
2401-002042
2401-000369
2401-000913
Description ; Specification
Remark
R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;91OHM,5%,1/10W,DA,TP,2012
R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm
R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;10KOHM,5%,1/10W,DA,TP,2012
R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;330OHM,5%,1/10W,DA,TP,2012
R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;1.5KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MM
JACK-RCA;3P(4P),3.2MM,NI,GRN/RED/BLU,JACK-RCA;6P,3.2MM,NI,YEL/WHT/RED,JACK-RCA;1P,3.2mm,NI,BLK,CONNECTOR-OPTICAL;PLUG,SM,-,4.4/2.0MM
DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500m
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
C-AL;4.7uF,20%,50V,GP,TP,5x7,5
C-AL;4.7uF,20%,50V,GP,TP,5x7,5
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
LEAD CONNECTOR-ASSY;-,-,-,-,-,-,-,-,5100
CONNECTOR-HEADER;BOX,6P,1R,2mm,ANGLE,SN
LEAD CONNECTOR-ASSY;-,-,-,-,-,-,-,-,5100
CONNECTOR-FPC/FC/PIC;17P,1.25mm,ANGLE,SN
CONNECTOR-FPC/FC/PIC;35P,1.25mm,ANGLE,SN
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
JACK-DIN;4P,-,NI,BLK,C-CERAMIC,CHIP;0.039nF,5%,50V,NP0,TP,201
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-AL;100UF,20%,6.3V,GP,-,6.3X11,5
C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
8-1
Electrical Parts List
Loc.No
Part No
Description ; Specification
VE58
VE58A
VE60
VE61
VE66
VE67
VIC51
VIC52
VL101
VL102
VL113
VL115
VL116
VR10
VR108
VR11
VR117
VR12
VR121
VR122
VR123
VR125
VR13
VR130
VR131
VR132
VR133
VR14
VR146
VR175
VR176
VR177
VR178
VR192
VR193
VR3
VR4
VR5
VR7
VR8
VR9
VZD1
VZD10
VZD11
VZD12
VZD13
VZD14
VZD2
VZD3
VZD4
VZD5
VZD6
VZD7
VZD8
VZD9
2401-000369
2401-000913
2401-001353
2401-000913
2401-001353
2401-000913
1201-001419
1201-001419
2701-000160
2701-000160
2701-000138
2701-000002
2701-000002
2001-000008
2001-000969
2001-000008
2001-000969
2001-000591
2001-000515
2001-000515
2001-000290
2001-000290
2001-000591
2001-000969
2001-000780
2001-000003
2001-000554
2001-000591
2001-000969
2001-000969
2001-000281
2001-000003
2001-000515
2001-000969
2001-000969
2001-000591
2001-000591
2001-000591
2001-000008
2001-000008
2001-000008
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
C-AL;100UF,20%,6.3V,GP,-,6.3X11,5
C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,
IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,
INDUCTOR-AXIAL;22uH,5%,2.4x3.4mm
INDUCTOR-AXIAL;22uH,5%,2.4x3.4mm
INDUCTOR-AXIAL;18uH,5%,2.5x3.4mm
INDUCTOR-AXIAL;100uH,10%,4.2x9.8mm
INDUCTOR-AXIAL;100uH,10%,4.2x9.8mm
R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm
R-CARBON;270OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MM
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
602
AC10
AC11
AC12
AC4
AC5
AC56
AC57
AC58
AC59
2203-000444
2202-000806
2203-000595
2203-000444
2203-000595
2203-000192
2203-000192
2202-002037
2202-002037
ASSY-PCB-JACK;RC5910P,JACK PCB
C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,C-CERAMIC,MLC-AXIAL;220pF,10%,50V,Y5P,TP
C-CERAMIC,CHIP;0.22nF,5%,50V,NP0,TP,2012
C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,C-CERAMIC,CHIP;0.22nF,5%,50V,NP0,TP,2012
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
8-2
Remark
Loc.No
AC6
AC61
AC62
AC7
AC71
AC73
AC74
AC8
AD1
AD2
AD4
AD5
AD6
AD7
AE10
AE11
AE30
AE31
AE33
AE4
AE41
AE5
AE6
AE7
AE8
AE9
AIC5
AL19
AL20
AL21
AL22
AL5
AL6
AOP1
AOP5
AQ1
AQ17
AQ18
AQ19
AQ2
AQ20
AQ21
AQ22
AQ3
AQ33
AQ34
AQ35
AQ4
AR10
AR11
AR119
AR12
AR121
AR13
AR14
AR15
AR150
AR151
AR157
AR158
AR18
AR19
AR20
AR21
AR22
AR23
Part No
2203-000595
2203-001388
2203-000260
2203-000192
2203-000192
2301-000161
2301-000161
2203-000192
0407-000114
0407-000114
0401-000101
0401-000101
0407-000114
0407-000114
2401-002144
2401-002144
2401-000302
2401-000037
2401-002144
2401-002068
2401-000302
2401-002068
2401-000913
2401-002068
2401-002068
2401-000913
AH14-10004R
2901-001125
2901-001125
2701-000113
2701-000113
3301-000297
2701-000113
1201-000163
1201-000163
0501-000341
0504-000118
0504-000118
0504-001003
0501-000341
0504-000156
0504-000128
0504-000156
0501-000341
0504-000128
0504-000128
0504-000156
0501-000341
2001-000878
2001-000878
2007-000766
2007-001055
2007-001247
2007-001055
2007-001055
2001-000290
2001-000429
2001-000429
2007-000468
2007-000468
2001-000429
2001-000429
2001-000003
2001-000878
2001-000878
2001-000878
Description ; Specification
Remark
C-CERAMIC,CHIP;0.22nF,5%,50V,NP0,TP,2012
C-CERAMIC,CHIP;10nF,5%,50V,X7R,TP,2012
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-FILM,PEF;12nF,5%,50V,TP,6.5X5.5X3.0X5,
C-FILM,PEF;12nF,5%,50V,TP,6.5X5.5X3.0X5,
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTC-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;470uF,20%,16V,GP,TP,8x11.5,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;33uF,20%,16V,GP,TP,5x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;33uF,20%,16V,GP,TP,5x11,5
C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
C-AL;33uF,20%,16V,GP,TP,5x11,5
C-AL;33uF,20%,16V,GP,TP,5x11,5
C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
IC;M74HCU04,SOP,TAPE 14P
FILTER-EMI ON BOARD;50V,0.5A,-,220pF,7x7
FILTER-EMI ON BOARD;50V,0.5A,-,220pF,7x7
INDUCTOR-AXIAL;100uH,5%,2.5x3.4mm
INDUCTOR-AXIAL;100uH,5%,2.5x3.4mm
CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
INDUCTOR-AXIAL;100uH,5%,2.5x3.4mm
IC-OP AMP;4560,SOP,8P,173MIL,DUAL,100V/m
IC-OP AMP;4560,SOP,8P,173MIL,DUAL,100V/m
TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOTTR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TOTR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TOTR-DIGITAL;KSR2003,PNP,300MW,22K/22K,TOTR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOTTR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K
TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOTTR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K
TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOTR-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CHIP;330OHM,5%,1/10W,DA,TP,2012
R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;91OHM,5%,1/10W,DA,TP,2012
R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm
R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
Samsung Electronics
Electrical Parts List
Loc.No
Part No
AR24
AR25
AR26
AR27
AR28
AR29
AR30
AR31
AR32
AR41
AR42
AR9
AR90
AR91
AR92
AVJ1
AVJ2
AVJ4
AVJ5
AZD1
AZD2
AZD3
AZD4
AZD5
AZD6
AZD7
HC01
HC02
HR03
HR04
JCN01
JCN02
JCN04
JCN3
JCN5
JP71
SVJ1
VC101
VC105
VC106
VC106A
VC2
VC3
VE51
VE54
VE55
VE58
VE58A
VE60
VE61
VE66
VE67
VIC51
VIC52
VL101
VL102
VL113
VL115
VL116
VR10
VR108
VR11
VR117
VR12
VR121
VR122
2007-001055
2007-001055
2007-001055
2007-000300
2001-000003
2001-000281
2001-000429
2001-000429
2007-000766
2001-000003
2001-000281
2001-000878
2001-000241
2001-000281
2001-000780
3722-001355
3722-001353
3722-001053
3707-001005
0403-000551
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
2401-002299
2401-002299
2001-000273
2001-000273
AH39-00136A
3711-001061
AH39-00135A
3708-000189
3708-000277
2001-000429
3722-001375
2203-000858
2007-000029
2203-000192
2007-000029
2202-002037
2202-002037
2401-002042
2401-000369
2401-000913
2401-000369
2401-000913
2401-001353
2401-000913
2401-001353
2401-000913
1201-001419
1201-001419
2701-000160
2701-000160
2701-000138
2701-000002
2701-000002
2001-000008
2001-000969
2001-000008
2001-000969
2001-000591
2001-000515
2001-000515
Samsung Electronics
Description ; Specification
R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;10KOHM,5%,1/10W,DA,TP,2012
R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;330OHM,5%,1/10W,DA,TP,2012
R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;1.5KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MM
JACK-RCA;3P(4P),3.2MM,NI,GRN/RED/BLU,JACK-RCA;6P,3.2MM,NI,YEL/WHT/RED,JACK-RCA;1P,3.2mm,NI,BLK,CONNECTOR-OPTICAL;PLUG,SM,-,4.4/2.0MM
DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500m
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
C-AL;4.7uF,20%,50V,GP,TP,5x7,5
C-AL;4.7uF,20%,50V,GP,TP,5x7,5
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
LEAD CONNECTOR-ASSY;-,-,-,-,-,-,-,-,5100
CONNECTOR-HEADER;BOX,6P,1R,2mm,ANGLE,SN
LEAD CONNECTOR-ASSY;-,-,-,-,-,-,-,-,5100
CONNECTOR-FPC/FC/PIC;17P,1.25mm,ANGLE,SN
CONNECTOR-FPC/FC/PIC;35P,1.25mm,ANGLE,SN
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
JACK-DIN;4P,-,NI,BLK,C-CERAMIC,CHIP;0.039nF,5%,50V,NP0,TP,201
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-AL;100UF,20%,6.3V,GP,-,6.3X11,5
C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
C-AL;100UF,20%,6.3V,GP,-,6.3X11,5
C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,
IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,
INDUCTOR-AXIAL;22uH,5%,2.4x3.4mm
INDUCTOR-AXIAL;22uH,5%,2.4x3.4mm
INDUCTOR-AXIAL;18uH,5%,2.5x3.4mm
INDUCTOR-AXIAL;100uH,10%,4.2x9.8mm
INDUCTOR-AXIAL;100uH,10%,4.2x9.8mm
R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
Remark
Loc.No
Part No
Description ; Specification
VR123
VR125
VR13
VR130
VR131
VR132
VR133
VR14
VR146
VR175
VR176
VR177
VR178
VR192
VR193
VR3
VR4
VR5
VR7
VR8
VR9
VZD1
VZD10
VZD11
VZD12
VZD13
VZD14
VZD2
VZD3
VZD4
VZD5
VZD6
VZD7
VZD8
VZD9
2001-000290
2001-000290
2001-000591
2001-000969
2001-000780
2001-000003
2001-000554
2001-000591
2001-000969
2001-000969
2001-000281
2001-000003
2001-000515
2001-000969
2001-000969
2001-000591
2001-000591
2001-000591
2001-000008
2001-000008
2001-000008
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
0403-001211
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm
R-CARBON;270OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MM
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
603
PC01
PC02
PC04
PC05
PC07
PC09
PC10
PC11
PC12
PC13
PC14
PC15
PC44
PCN01
PCN02
PCN03
PD01
PD02
PD03
PD04
PD11
PD12
PD3
PD31
PD32
PD33
PD34
PD35
PD37
2305-001021
2305-001021
2301-000140
2201-000129
2301-000129
2301-000415
2201-000916
2201-000916
2202-002037
2202-002037
2202-002037
2202-002037
2301-000129
3711-000178
3711-000632
AH39-00143A
0402-001009
0402-001009
0402-001009
0402-001009
0402-000378
0402-001013
0402-001013
0402-001013
0402-000430
0402-001251
0402-001251
0402-001013
0402-000132
ASSY PCB-SMPS;RC5910P,SMPS PCB
C-FILM,MPEF;100nF,20%,275V,TP,17.5x7x13.
C-FILM,MPEF;100nF,20%,275V,TP,17.5x7x13.
C-FILM,PEF;10nF,10%,630V,BK,16.5X9.5X5.7
C-CERAMIC,DISC;0.1nF,10%,1kV,Y5P,TP,7x4,
C-FILM,PEF;100nF,5%,50V,TP,10X9X4.3X5,5m
C-FILM,PEF;22nF,5%,50V,TP,6.5x10.5x4mm,5
C-CERAMIC,DISC;100pF,10%,400V,Y5U,TP,10x
C-CERAMIC,DISC;100pF,10%,400V,Y5U,TP,10x
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-FILM,PEF;100nF,5%,50V,TP,10X9X4.3X5,5m
CONNECTOR-HEADER;1WALL,2P,1R,3.96mm,STRA
CONNECTOR-HEADER;BOX,11P,1R,2mm,ANGLE,SN
LEAD CONNECTOR-ASSY;-,-,-,-,-,-,-,-,5264
DIODE-RECTIFIER;1SR139,600V,1A,MSR,TP
DIODE-RECTIFIER;1SR139,600V,1A,MSR,TP
DIODE-RECTIFIER;1SR139,600V,1A,MSR,TP
DIODE-RECTIFIER;1SR139,600V,1A,MSR,TP
DIODE-RECTIFIER;EG01C,1000V,500mA,DO-41
DIODE-RECTIFIER;1SR153-400,400V,800mA,DO
DIODE-RECTIFIER;1SR153-400,400V,800mA,DO
DIODE-RECTIFIER;1SR153-400,400V,800mA,DO
DIODE-RECTIFIER;FML-G02S,200V,3.0A,TO-22
DIODE-RECTIFIER;FMG-22R,200V,10A,TO-220F
DIODE-RECTIFIER;FMG-22R,200V,10A,TO-220F
DIODE-RECTIFIER;1SR153-400,400V,800mA,DO
DIODE-RECTIFIER;1N4004,400V,1A,DO-41,TP
Remark
8-3
Electrical Parts List
Loc.No
PD38
PE10
PE11
PE12
PE13
PE3
PE31
PE32
PE33
PE35
PE36
PE37
PE38
PE39
PE4
PE41
PE42
PE43
PE44
PE6
PF0A
PIC1
PIC2
PIC3
PIC4
PIC5
PIC6
PL01
PL02
PL03
PL11
PQ1
PQ2
PQ21
PQ22
PQ23
PQ24
PQ3
PQ4
PR10
PR11
PR12
PR13
PR14
PR15
PR16
PR17
PR18
PR2
PR20
PR3
PR31
PR32
PR33
PR34
PR35
PR36
PR37
PR38
PR39
PR4
PR40
PR5
PR6
PT01
PVA01
8-4
Part No
0402-000132
2401-001353
2401-000302
2401-000302
2401-000302
2401-001682
2401-000302
2401-001998
2401-000133
2401-000360
2401-000133
2401-001130
2401-002144
2401-001130
2401-000302
2401-002036
2401-002144
2401-002144
2401-002036
2401-001583
3601-000453
1203-001721
0604-000186
AC14-12006D
1203-000122
1203-001697
1203-001083
AC29-30050A
AC27-92001Q
3301-000297
3301-000297
0501-000398
0501-000616
0504-000142
0504-000118
0502-000298
0502-000298
0504-000118
0504-000142
2006-000262
2001-000073
2001-000073
2001-000073
2001-000073
2003-000994
2003-000994
2003-000148
2001-000666
2003-000148
2001-000429
2001-000734
2001-000034
2001-000429
2001-000429
2001-000440
2001-000362
2001-000221
2001-000429
2004-000869
2004-000459
2001-000429
2003-000111
2001-000281
2001-000429
AH26-00008A
1405-000186
Description ; Specification
DIODE-RECTIFIER;1N4004,400V,1A,DO-41,TP
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;82uF,20%,400V,GP,BK,22x25,10mm
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;1000uF,20%,25V,GP,TP,10x20,5mm
C-AL;1000uF,20%,16V,GP,TP,10x20,5
C-AL;100uF,20%,50V,GP,TP,8x11.5,5
C-AL;1000uF,20%,16V,GP,TP,10x20,5
C-AL;330uF,20%,35V,GP,TP,10x16,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;330uF,20%,35V,GP,TP,10x16,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;1uF,20%,50V,GP,TP,5x11,2.5mm
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;1uF,20%,50V,GP,TP,5x11,2.5mm
C-AL;47uF,20%,50V,WT,TP,6.3x11,5
FUSE-AXIAL LEAD;250V,1.6A,SLOW-BLOW,GLAS
IC-PWM CONTROLLER;STR-G6153T,T0-220,5P,1
PHOTO-COUPLER;TR,-,200mW,DIP-4,ST
IC;KA431Z,TO-92,TAPING
IC-NEGA.FIXED REG.;7908,TO-220,3P,-,PLAS
IC-VOLTAGE REGULATOR;78R08,TO-220,4P,-,P
IC-VOLTAGE REGULATOR;3RF23,TO-202,4P,12.
FILTER-LINE NOISE;-,400UH,-,250V,COIL-LINE FILTER;BSF-2120Z,25MH,-,-,CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
TR-SMALL SIGNAL;KSC945,NPN,250mW,TO-92,T
TR-SMALL SIGNAL;KSC2328A-Y,NPN,1W,TO-92L
TR-DIGITAL;KSR2001,PNP,300MW,4.7K/4.7K,T
TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TOTR-POWER;KSD73,NPN,30W,TO-220,-,120-240
TR-POWER;KSD73,NPN,30W,TO-220,-,120-240
TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TOTR-DIGITAL;KSR2001,PNP,300MW,4.7K/4.7K,T
R-CEMENT;2.7ohm,10%,2W,CB,TP,7.5x11x20.
R-CARBON;33KOHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;33KOHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;33KOHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;33KOHM,5%,1/4W,AA,TP,2.4X6.4MM
R-METAL OXIDE(S);33Kohm,5%,2W,AF,TP,3.9x
R-METAL OXIDE(S);33Kohm,5%,2W,AF,TP,3.9x
R-METAL OXIDE;100OHM,5%,2W,AE,TP,6X16MM
R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-METAL OXIDE;100OHM,5%,2W,AE,TP,6X16MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;220OHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;150OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-METAL;3Kohm,1%,1/8W,AA,TP,1.8x3.2mm
R-METAL;2.2Kohm,1%,1/8W,AA,TP,1.8x3.2m
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-METAL OXIDE;0.47ohm,5%,1W,AD,TP,4.3x12
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
TRANS-SWITCHING;-,85V-240V,UL/CSA,EE2821
VARISTOR;470V,4500A,17x12mm,TP
Remark
Loc.No
Part No
Description ; Specification
Remark
PZD31
RC12
RC13
RL03
0403-000716
2201-000812
2201-000812
3301-000297
DIODE-ZENER;MTZJ4.7B,4.7V,4.55-4.8V,500m
C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,12.
C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,12.
CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
701
FC01
FC02
FC03
FC1
FC10
FC14
FC15
FC16
FC2
FC3
FC4
FC6
FCN01
FCN02
FCN02A
FCN04
FD1
FD10
FD2
FD3
FD4
FD8
FD9
FE1
FE12
FE13
FE2
FE5
FE8
FIC1
FIC2
FIC3
FL1
FLD01
FLD03
FLD04
FQ01
FQ03
FR1
FR101
FR102
FR103
FR104
FR105
FR106
FR11
FR12
FR13
FR14
FR16
FR17
FR18
FR19
FR20
FR21
FR25
FR2S
FR30
FR31
FR32
2202-000807
2202-000807
2202-000807
2202-002037
2203-000192
2202-002037
2202-002037
2203-000444
2203-000389
2203-000389
2203-000192
2203-000192
AH39-00140A
3710-001550
3710-001550
3708-001440
0401-000101
0401-000101
0401-000101
0401-000101
0401-000101
0401-000101
0403-000551
2401-000922
2401-000249
2401-000249
2401-001507
2401-001507
2401-001507
AH09-00010C
1203-001252
0801-002166
2701-000114
0601-001447
0601-001416
0601-001416
0504-000118
0504-000118
2001-000273
2001-000273
2001-000273
2001-000273
2001-000273
2001-000290
2001-000290
2001-000449
2001-000449
2001-000449
2001-000325
2001-000027
2001-000027
2001-000449
2001-000449
2001-000449
2007-000477
2007-000931
2007-000029
2007-000282
2007-000282
2007-000282
ASSY-PCB-FRONT;DVD-C700,FRONT PCB
C-CERAMIC,MLC-AXIAL;22nF,+80-20%,25V,Y5V
C-CERAMIC,MLC-AXIAL;22nF,+80-20%,25V,Y5V
C-CERAMIC,MLC-AXIAL;22nF,+80-20%,25V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,C-CERAMIC,CHIP;0.015nF,5%,50V,NP0,TP,201
C-CERAMIC,CHIP;0.015nF,5%,50V,NP0,TP,201
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
LEAD CONNECTOR-ASSY;-,-,-,-,-,-,-,-,5100
CONNECTOR-SOCKET;8P,2R,2mm,ANGLE,AU15U
CONNECTOR-SOCKET;8P,2R,2mm,ANGLE,AU15U
CONNECTOR-FPC/FC/PIC;24P,1mm,ANGLE,SN
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500m
C-AL;22uF,20%,16V,GP,TP,5x5,5
C-AL;100uF,20%,10V,GP,TP,6.3x5,2.5
C-AL;100uF,20%,10V,GP,TP,6.3x5,2.5
C-AL;47uF,20%,16V,GP,TP,6.3x5,5
C-AL;47uF,20%,16V,GP,TP,6.3x5,5
C-AL;47uF,20%,16V,GP,TP,6.3x5,5
IC MICOM;LC866232,SANYO,100PIN,QFP,QIP,
IC-VOL. DETECTOR;7545,TO-92,3P,-,PLASTIC
IC-CMOS LOGIC;7SHU04,INVERTER,SSOP,5P,63
INDUCTOR-AXIAL;10uH,10%,2.5x3.4mm
LED;ROUND,RED,3.1mm,650nm
LED;ROUND,GRN,3.1mm,563nm
LED;ROUND,GRN,3.1mm,563nm
TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TOTR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TOR-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;120OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;100OHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CHIP;1MOHM,5%,1/10W,DA,TP,2012
R-CHIP;470OHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
Samsung Electronics
Electrical Parts List
Loc.No
Part No
FR33
FR34
FR35
FR36
FR37
FR38
FR39
FR3S
FR40
FR43
FR44
FR45
FR46
FR4S
FR5
FR51
FR52
FR53
FR54
FR55
FR56
FR6
FR6S
FR7S
FR8S
FRE01
FSW01
FSW02
FSW03
FSW04
FSW05
FSW06
FY1
VFD1
2007-000282
2007-000282
2007-000282
2007-000282
2007-000282
2007-000282
2007-000282
2007-000029
2007-000282
2001-000793
2001-000429
2001-000429
2007-000282
2007-000029
2001-000325
2007-000029
2007-000029
2007-000282
2007-000282
2001-000273
2001-000429
2001-000325
2007-000282
2007-000282
2007-000282
AH59-60001J
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
2802-000108
AH07-00014A
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CARBON;47OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CARBON;120OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;120OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
MODULE-REMOCON;GP1U271R,38KHZ,-,MESH,-,
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
RESONATOR-CERAMIC;12MHZ,0.5%,BK,10.0X5.0
VF-DISPLAY;-,-,25X104MM,DVD-909/DOM
KEC11
KOP03
KR1
KR2
KR3
KR32
KR33
KR34
KR35
KR4
KVR4
KZD1
KZD2
KZD3
KZD4
2401-001225
1201-000191
2001-000666
2001-000666
2001-000290
2001-000331
2001-000734
2001-000331
2001-000734
2001-000290
2101-001054
0403-001211
0403-001211
0403-001211
0403-001211
C-AL;4.7uF,20%,16V,GP,TP,3x5,5
IC-OP AMP;4558,DIP,8P,300MIL,DUAL,20V/mV
R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;12KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;12KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
VR-ROTARY;10KOHM,20%,1/20W,SIDE
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D
H230
CN1
CN1A
CN2
CN4
CN5
CN5A
DRC12
DRC16
DRC38
DRE10
DRE8
DRE9
DRR14
DRR18
DRR2
SL1
SW1
AH41-00140A
3708-001394
3809-001158
3708-001395
3711-004322
3708-001448
3809-001156
2202-002037
2202-002037
2202-002037
2401-001475
2401-001475
2401-001475
2001-000405
2001-000685
2001-000405
2701-000122
AH34-00005A
PCB-DECK ASSY
CONNECTOR-FPC/FC/PIC;11P,1MM,ANGLE,SN
CABLE-FLAT;30V,-20to+80C,50mm,11P,1mm,UL
CONNECTOR-FPC/FC/PIC;11P,1MM,ANGLE,SN
CONNECTOR-HEADER;NOWALL/2LAY,6P,2R,2MM,S
CONNECTOR-FPC/FC/PIC;36P,1.25mm,ANGLE,SN
CABLE-FLAT;30V,-20to+80C,420mm,36P,1.25m
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-AL;47uF,20%,10V,GP,TP,6.3x5,5mm
C-AL;47uF,20%,10V,GP,TP,6.3x5,5mm
C-AL;47uF,20%,10V,GP,TP,6.3x5,5mm
R-CARBON;180OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;390ohm,2%,1/8W,AD,TP,1.8x3.2mm
R-CARBON;180OHM,5%,1/8W,AA,TP,1.8X3.2MM
INDUCTOR-AXIAL;12uH,5%,2.4x3.4mm
SWITCH-;-,30V,-,-,100M OHM,-,-,-,-
702
FC2
FCN03
FCN03A
FLD02
FSW24
FSW25
FSW26
FSW27
FSW28
FSW29
FSW30
FSW31
FSW32
FSW33
FSW34
FSW35
FSW36
FSW37
JOG01
2203-000389
3711-004388
3711-004388
0601-001448
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
3406-001037
ASSY PCB-KEY;DVD-C700/XAA,KEY PCB
C-CERAMIC,CHIP;0.015nF,5%,50V,NP0,TP,201
CONNECTOR-HEADER;NOWALL,8P,2R,2mm,ANGLE,
CONNECTOR-HEADER;NOWALL,8P,2R,2mm,ANGLE,
LED;ROUND,ORG,3.1mm,610nm
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
SWITCH-ROTARY;5V,1MA,24PULSE/NO CLICK,12
H440
TCN01
TCN02
TCN03
TCN03A
AH41-00130A
3708-001444
3710-001248
3708-001445
3809-001153
PCB-PULLEY MOTOR ASSY
CONNECTOR-FPC/FC/PIC;6P,1.25mm,STRAIGHT,
CONNECTOR-SOCKET;3P,1R,2.5mm,STRAIGHT,SN
CONNECTOR-FPC/FC/PIC;11P,1.25mm,ANGLE,SN
CABLE-FLAT;30V,-20to+80C,330mm,11P,1.25m
H450
SCN01
SSW01
SSW02
AH41-00135A
3711-003379
AH34-00008A
AH34-00008A
PCB-S/W ASSY
CONNECTOR-HEADER;NOWALL,3P,1R,2.5mm,STRA
SWITCH-MICRO;MLS-24,-,-,DP-4,-,-,-,-,SWITCH-MICRO;MLS-24,-,-,DP-4,-,-,-,-,-
703
CON23
HPJ01
KC1
KC101
KC102
KC2
KCE8
KCE9
KEC10
3711-001061
3722-000345
2202-002037
2202-002127
2202-002127
2202-002037
2401-000249
2401-000249
2401-001225
ASSY PCB-HEADPHONE;DVD-C700/XAA,HEADPHON
CONNECTOR-HEADER;BOX,6P,1R,2mm,ANGLE,SN
JACK-PHONE;3P,6.4mm,AG,BLK,C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-AL;100uF,20%,10V,GP,TP,6.3x5,2.5
C-AL;100uF,20%,10V,GP,TP,6.3x5,2.5
C-AL;4.7uF,20%,16V,GP,TP,3x5,5
H530
LC01
LC02
LCN01
LCN01A
LCN02
LR01
LR02
LR03
LR04
LSS01
LSS02
AH41-00129A
2202-002037
2202-002037
3708-001443
3809-001152
3711-000826
2001-000281
2001-000281
2001-000660
2001-000660
AH32-00002A
0604-001005
PCB-SENSOR ASSY
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
CONNECTOR-FPC/FC/PIC;6P,1.25mm,ANGLE,SN
CABLE-FLAT;30V,-20to+80C,200mm,6P,1.25mm
CONNECTOR-HEADER;BOX,2P,1R,2mm,ANGLE,SN
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;33KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;33KOHM,5%,1/8W,AA,TP,1.8X3.2MM
SENSOR-ROULETTE;-,-,DP-4,-,-,-,-,-,PHOTO-INTERRUPTER;TR,-,-,DIP-4,BK
Samsung Electronics
Description ; Specification
Remark
Loc.No
Part No
Description ; Specification
Remark
8-5
Electrical Parts List
MEMO
8-6
Samsung Electronics
9. Block Diagrams
9-1 NTSC
DRIC3 (KA3082)
5 Disc Roulette Motor Driver
DECK ASS'Y
1
5
MIC5 2K EEPROM
2
4
MIC8 8M EPROM
3
FIC1
(LC86P6232)
Front Controller
MIC1
(TMP93CM41F)
Main Controller
Remote Control
Roulette
Motor
MIC3 1M SDRM
Pick-UP
& I/V Amp
Disc
Motor
DRIC1 (KA3011D)
Spindle Motor Driver
Feed
Motor
DRIC2 (KA3010D)
Focusing, Tracking,
Open/Close,
Sled Motor Driver
RIC1
(KS1461)
RF Amp & DPD
Optical
DIC2 4M DRAM
Coaxial
VIC4/10 32M SDRAM
L1T
DIC1
(KS1453)
DVD & CD Processor
SIC1
(KS1452)
Digital Servo
AIC1
(AK4324)
Audio DAC
LPF
AMP
L2T
LPF
AMP
R1T
VIC1
(ZiVA-3)
A/V Decoder
R2T
AMP/VR
HEAD PHONE
CVBS1
AMP
CVBS2
AMP
VIC50
(SAA7128)
Video Encoder
Samsung Electronics
Yout
Cout
AMP
AMP
Y
AMP
Pb
AMP
Pr
9-1
Block Diagrams
9-2 PAL
DRIC3 (KA3082)
5 Disc Roulette Motor Driver
DECK ASS'Y
1
5
MIC5 2K EEPROM
2
4
MIC8 8M EPROM
3
FIC1
(LC86P6232)
Front Controller
MIC1
(TMP93CM41F)
Main Controller
Remote Control
Roulette
Motor
MIC3 1M SDRM
Pick-UP
& I/V Amp
Disc
Motor
DRIC1 (KA3011D)
Spindle Motor Driver
Feed
Motor
DRIC2 (KA3010D)
Focusing, Tracking,
Open/Close,
Sled Motor Driver
RIC1
(KS1461)
RF Amp & DPD
Optical
DIC2 4M DRAM
VIC4/10 32M SDRAM
L1T
DIC1
(KS1453)
DVD & CD Processor
SIC1
(KS1452)
Digital Servo
Coaxial
AIC1
(AK4324)
Audio DAC
LPF
AMP
L2T
LPF
AMP
R1T
VIC1
(ZiVA-3)
A/V Decoder
R2T
AMP/VR
HEAD PHONE
CVBS1
AMP
CVBS2
AMP
VIC50
(SAA7128)
Video Encoder
AMP
Yout
Cout
AMP
AV1
AMP
AV2
AMP
SCART JACK
9-2
Samsung Electronics
10. PCB Diagrams
10-1 Main - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-2
10-2 Jack - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-3
10-3 S.M.P.S. - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-4
10-4 Front - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-5
10-5 Key - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-6
10-6 Head Phone - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-7
10-7 Deck - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-7
10-8 Switch - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-8
10-9 Motor - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-8
Samsung Electronics
10-1
PCB Diagrams
10-2
SOLDER SIDE
COMPONENT SIDE
10-1 Main
Samsung Electronics
PCB Diagrams
10-2 Jack
Samsung Electronics
10-3
PCB Diagrams
10-3 S.M.P.S.
10-4
Samsung Electronics
PCB Diagrams
SOLDER SIDE
COMPONENT SIDE
10-4 Front
Samsung Electronics
10-5
PCB Diagrams
SOLDER SIDE
COMPONENT SIDE
10-5 Key
10-6
Samsung Electronics
PCB Diagrams
10-6 Head Phone
10-7 Deck
COMPONENT SIDE
SOLDER SIDE
Samsung Electronics
10-7
PCB Diagrams
10-8 Sensor
10-8
10-9 Motor
Samsung Electronics
11. Wiring Diagram
JACK PCB
DECK PCB
S.M.P.S. PCB
MAIN PCB
SENSOR PCB
SWITCH PCB
MOTOR PCB
FRONT PCB
KEY PCB
HEAD PHONE PCB
Samsung Electronics
11-1
Wiring Diagram
MEMO
11-2
Samsung Electronics
12. Schematic Diagrams
12-1 S.M.P.S. - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-2
12-2 Main Power Supply - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-3
12-3 Main Micom - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-4
12-4 Servo - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-5
12-5 Video Encoder - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-6
12-6 Video - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-7
12-7 Audio DAC - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-8
12-8 Audio- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-9
12-9 RF - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-10
12-10 ZiVA - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-11
12-11 DSP - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-12
12-12 Front Micom/VFD Display - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-13
12-13 Scart Jack (Europe Only) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-14
12-14 Head Phone - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-15
12-15 Key - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-16
12-16 Deck - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-17
12-17 Deck Control - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-18
12-18 Remote Control - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-19
Samsung Electronics
Block Identification of PCB
Main PCB (Component Side)
Jack PCB (Conductor Side)
12-1
Schematic Diagrams
12-1 S.M.P.S.
12-2
Samsung Electronics
Schematic Diagrams
12-2 Main Power Supply
Samsung Electronics
12-3
Schematic Diagrams
12-3 Main Micom
12-4
Samsung Electronics
Schematic Diagrams
12-4 Servo
Samsung Electronics
12-5
Schematic Diagrams
12-5 Video Encoder
12-6
Samsung Electronics
Schematic Diagrams
12-6 Video
CVBS Output
Y Output
C Output
Samsung Electronics
12-7
Schematic Diagrams
12-7 Audio DAC
12-8
Samsung Electronics
Schematic Diagrams
12-8 Audio
Samsung Electronics
12-9
Schematic Diagrams
12-9 RF
12-10
Samsung Electronics
Schematic Diagrams
12-10 ZiVA
Samsung Electronics
12-11
Schematic Diagrams
12-11 DSP
12-12
Samsung Electronics
Schematic Diagrams
12-12 Front Micom/VFD Display
Samsung Electronics
12-13
Schematic Diagrams
12-13 Scart Jack (Europe Only)
R Output (Scart Jack)
12-14
G Output (Scart Jack)
B Output (Scart Jack)
Samsung Electronics
Schematic Diagrams
12-14 Head Phone
Samsung Electronics
12-15
Schematic Diagrams
12-15 Key
12-16
Samsung Electronics
Schematic Diagrams
12-16 Deck
Samsung Electronics
12-17
Schematic Diagrams
12-17 Deck Control
12-18
Samsung Electronics
Schematic Diagrams
12-18 Remote Control
Samsung Electronics
12-19
Schematic Diagrams
MEMO
12-20
Samsung Electronics