Download Samsung SCH-A105S Service manual
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CDMA Cellular Phone SCH-A105 SERVICE Manual CDMA Cellular Phone CONTENTS 1. General Introduction 2. Specification 3. Installation 4. NAM Programming 5. Product Support Tools 6. Troubleshooting 7. Exploded view and its Part List OK/ MENU 8. Electrical Parts List ‘ 1. 4 7 3 2 6 5 8 0 9. Block diagram 9 10. PCB diagrams 11. Circuit diagrams ELECTRONICS ©Samsung Electronics Co.,Ltd. July. 2000 Printed in Korea. Code No.: GH68-01246A BASIC. 1. General Description The SCH-A105 cellular phone functions as both analog cellular phone working in AMPS (Advanced Mobile Phone Service) mode and digital cellular phone working in CDMA (Code Division Multiple Access) mode. CDMA type digital mode applies DSSS (Direct Sequential Spread Spectrum) mode which first came to be used in the military. The DSSS reduces channel cross talk and allow to use one frequency channel by multiple users in the same specific area, resulting in increase of channel capacity to about ten times compared to that of analog mode currently used. Soft/Softer Handoff, Hard Handoff, and Dynamic RF Power Control technologies are combined into this phone to reduce the call drop while usage. CDMA digital cellular network consists of MSO (Mobile Switching Office), BSC (Base Station Controller), BTS(Base Station Transmission System), and MS (Mobile Station). MS meets the specifications of the below: • IS-95A : Mobile Station-Base Station Compatibility Standard for Dual-Mode Wideband Spread Spectrum Cellular System • IS-96A : Speech Service Option 1 Standard for Dual-Mode Wideband Spread Spectrum Cellular System • IS-98A : Standards for Dual-Mode Wideband Spread Spectrum Cellular Mobile Station • IS-126 : Mobile Station Loopback Service Options Standard SAMSUNG Proprietary-Contents may change without notice 1-1 2. Specification 2-1 General Frequency Range Transmitter Receiver Digital Mode : 824.64 ~ 848.37 MHz : 869.64 ~ 894.37 MHz Analog Mode 824 ~ 849 MHz 869 ~ 894 MHz Channel Spacing : 1.23 MHz Number of Channels : 20 EA Duplex Spacing : 45 MHz Frequency Stability : ±2.5 ppm (-20˚C ~ +50˚C, -4˚F ~ +122˚F) Operating Temperature : -20˚C~+50˚C (-4˚F ~ +122˚F) Operating Voltage HHP : 3.6V DC (±10%) Hands-free : 13.7V DC (±10%) Item Size (mm) 30 kHz 832 CHs 45 MHz Weight (g) Including slim battery 80 x 42 x 22 93 Including standard battery 80 x 42 x 24 116 Operating Time (Digital Mode) Item Standby Time Talk Time Slim battery up to 100 hours up to 150 min Standard battery up to 170 hours up to 250 min SAMSUNG Proprietary-Contents may change without notice 2-1 Specification 2-2 Digital Mode Waveform Quality 0.944 or more Time Reference ±1uS or less Rx Sensitivity and Dynamic Range Tx Output Power -104 dBm, FER=0.5 % or less -25 dBm, FER=0.5 % or less 280 mW (24.5 dBm) Tx Frequency Deviation ±300 Hz or less Occupied Band Width 1.32 MHz Tx Conducted Spurious Emission Minimum Tx Power Control Open Loop Power Control Standby Output Power 900 kHz : -42 dBc / 30 kHz below 1.98 MHz: -54 dBc / 30 kHz below below -50 dBm -25 dBm: -57.0 dBm ~ -38.5 dBm -65 dBm: -17.5 dBm ~ + 1.5 dBm -104 dBm: +18.0 dBm ~ +30.0 dBm below -61 dBm Closed Loop Tx Power Control Range Test1: ±24 dB or less Test2: 0 mS ~ 2.5 mS Test3: ±24 dB or more Test4: ±24 dB or more Test5: ±24 dB or more SAMSUNG Proprietary-Contents may change without notice 2-2 Specification 2-3 ANALOG MODE TRANSMITTER 0.6W (+2/-4dB) RF output power Carrier ON/OFF conditions “ON” Condition “OFF” Condition Compressor Compression Rate Attack Time Recovery Time Reference Input within ±3dB of specification output (in 2mS) below-60dBm (in 2mS) 2:1 3mS 13.5mS Input level for producing a nominal ±2.9KHz peak freqency deviation of transmitted carrier 6dB/OCT within 0.3 ~ 3KHz Preamphasis Maximum Freqency Deviation F3 of G3 Supervisory Audio Tone Signaling Tone Wideband Data Post Deviation Limiter Filter 3.0 ~ 5.9KHz 5.9 ~ 6.1KHz 6.1 ~ 15KHz Over 15KHz ±12KHz ±2KHz (±10%) ±8KHz (±10%) ±8KHz (±10%) above 40 LOG (F/3000) dB above 35 dB above 40 LOG (F/3000) dB above 28 dB Spectrum Noise Suppression For all modulation f0+20KHz ~ f0+45KHz For modulation by voice and SAT f0 +45KHz For modulation by WBD(without SAT) and ST (with SAT) f0+45KHz ~ f0+60KHz f0+60KHz ~ f0+90KHz f0+90KHz ~ 2f0 Harmonic and conducted Spurious Emissions above 26 dB above 63 +10 LOG (PY) dB above 45 dB above 65 dB above 63 +10 LOG (PY) dB (where f0=carrier frequency PY=mean output power in watts) below 43 + 10 LOG (PY) dB SAMSUNG Proprietary-Contents may change without notice 2-3 Specification RECEIVER -6dB / OCT within 0.3 ~3KHz De-Emphasis Expander Expander Rate Attack Time Recovery Time Reference Input 1:2 within 3mS within 13.5mS output level to a 1000Hz tone from a carrier within ±2.9KHz peak frequency deviation 12dB SINAD / -116dBm Sensitivity Intermodulation Spurious Response Attenuation avove 65dB RSSI Range above 60dB Protection Against Spurious Response Interference above 60dB In Band Conducted Spurious Emission Transmit Band Receive Band Other Band below -60dBm below -80dBm below -47dBm Radiated Spurious Emission Frequency Range 25 ~ 70 MHz 70 ~ 130MHz 130 ~ 174 MHz 174 ~ 260 MHz 260 ~ 470 MHz 470 ~ 1GHz Maximum Allowable EIRP -45dBm -41dBm -41 ~ -32dBm -32dBm -32 ~ -26dBm -21dBm SAMSUNG Proprietary-Contents may change without notice 2-4 Specification 2-4 CDMA Debug Display Information (menu 8) IN IDLE MODE 1 2 3 SIx Sxxxx 4 T-xx x Dxxx Pxxx -xx 6 CHxxx 8 7 5 IN CONVERSATION MODE 9 10 TEx T-xx Pxxx REx 11 xx Dxxx x -xx 3 CHxxxx 1 : Sxxxxx : SID (System ldentification) toggle Nxxxxx : NID (Network Identification) toggle 2 : SIx : Slot cycle index (lowest between the system and the phone will be used) 3 : Handset Status : 0 - Acquisition 1 - Synchronization 2 - Paging (Idle) 3 - Traffic Initialization 4 - Traffic Mode 5 - Exit 4 : T-xx : Tx adjust, Value ranges from +63 ~ -63dB 5 : Dxxx : sector power in dBm 6 : -xx : Ec/Io 7 : Pxxx : PN offset 8 : CHxxxx : channel number 9 : TEx : Tx vocoder rate (8 is full rate, 1 is 1/8th rate) E : EVRC V : 13k or 8k 10 : REx : Rx vocoder rate (8 is full rate, 1 is 1/8th rate) 11 : xx : Walsh code used in traffic channel SAMSUNG Proprietary-Contents may change without notice 2-5 3. Installation 3-1 Installing a Battery Pack ➀ ➁ Insert the saw-toothed end on the bottom of the battery into the slots on the bottom of the phone (➀), then slide the battery down (➁). ➂ ➀ ➁ Push up and hold the catch above the battery on the back of the phone (➀) and lift the battery away. (➁ ~ ➂) SAMSUNG Proprietary-Contents may change without notice 3-1 Installation 3-2 For Desk Top Use 1. Choose a proper location to install the charger for Desk Top use. 2. Plug the power cord of the charger into an appropriate wall socket. When the power is connected correctly, the lamps turn on briefly. 3. To charge the battery pack, insert the battery pack into the rear slot of the charger. The lamp marked BAT on the front panel of the charger lights up red. 4. If you do not wish to use the phone while charging the battery, insert the phone with the battery pack attached into the front slot of the charger. The lamp marked PHONE on the front panel of the charger lights up red. SLIM BATTERY STANDARD BATTERY Figure 3-1 Charging the Phone and Battery SPECIFICATIONS USING “DTCA10” Battery Type Model Name SEC Code Charging Time Slim Battery Standard Battery (Li-ion, 500 mAh) (Li-ion, 1000 mAh) BTIA10AA BTSA10AA BTIA10AD BTSA10AD GH43-00173B GH43-00174B GH43-00179B GH43-00180B 4 hours 4 hours SAMSUNG Proprietary-Contents may change without notice 3-2 Installation 3-3 For Mobile Mount 3-3-1 Cradle 1. Choose a location where it is easy to reach and does not interfere with the driver’s safe operation of the car. 2. Separate the two halves of the clamshell by removing the two large slotted screws. See the figure 3-2. 3. Drill holes and mount the lower half of the clamshell by using the screws. 4. Place the cradle onto the remaining half of the clamshell and assemble them by using the screws. 5. Reassemble the two halves of the clamshell together. Adjust the mounting angle and tighten the two slotted screws. Figure 3-2 Cradle Installation 3-3-2 Hands-Free Box 1. Drill holes in a proper location for the hands-free box, attach the mounting bracket by using the screws. See the figure 3-3. 2. Install the hands-free box into the bracket. SAMSUNG Proprietary-Contents may change without notice 3-3 Installation 3-3-3 Hands-Free Microphone 1. It is recommended to install the microphone where it is 30-45 cm (12-18inch away from the driver. Choose the location where is least susceptible to interference caused by external noise sources, ie, adjacent windows, radio speakers, etc. Normal place is the sun visor. 2. Once the microphone has been correctly positioned, connect the microphone wire to the MIC jack on the hands-free box. MOUNTING BRACKET CAR 40 55 Figure 3-3 Hands-Free Box 1 Installation SAMSUNG Proprietary-Contents may change without notice 3-4 Installation 3-3-4 Cables 1. Connect the cradle and the hands-free box with the data cable. See the figure 3-4. 2. Connect the antenna cable to the RF jack of the cradle. 3. Connect the power cable as follows: Connect the red wire to the battery (+) terminal, black wire to the vehicle chassis. Then connect the battery (-) terminal to the vehicle chassis. Connect the yellow wire to the switched side of the ignition switch, and then connect the white to the stereo mute wire from your vehicle stereo. 4. Connect the other end of the power cable to the PWR jack of the hands-free box. Notes: It is recommended to connect the power cable directly to the battery to avoid power noise. Make sure the connection, in the vehicle, between the battery (-) terminal and vehicle chassis is made correctly. Make sure the fuse having a proper capacity is used on the power cable. Make sure the cables do not pass over any sharp metal edge that may damage it. SAMSUNG Proprietary-Contents may change without notice 3-5 4. NAM Programming NAM features can be programmed as follows: Notes: - If you enter the NAM program mode, each item shows the currenly stored data. Go to the next item by pressing OK/ . - You can modify the data by entering a new data. - If you enter a wrong digit, press CLR to delete the last digit. Press and hold CLR to delete all digits. - To scroll items backwards or forwards, press the VOLUME button on the left side of the phone. 4-1 General Setup LCD Display Key in 47 869#08#9 NAM program 1:General 2:Setup NAM1 3:Setup NAM2 47 869#08#9 1 -selects NAM programming -choose ‘GENERAL’ ESN B0000000 Volume ▼ -Electronic Serial Number of the phone CAI version 3 Volume ▼ -The version of Common Air Interface supported by the mobile VOC8/13/EVRC SO_VOIC_13K Volume ▼ SCM 01101010 Volume ▼ -Station Class Mark displays the power class(bit0~1), transmission(bit2), slotted class(bit5), dual mode(bit6). Lock Code 0000 (0000) 4-digit code -Lock code, current ststus is displayed to change, enter new code. OK/ -stores it <or> -Slot mode. ‘Yes’ indicates the slot mode. OK/ changes the status. -stores it. 0-7 OK/ -Slot mode index. The higher, the longer sleeping time to change, enter new one. -stores it. Pref NAM1... Digital pref OK/ -Preferred system selection for NAM1 changes the system. -stores it. Pref NAM2... Digital pref OK/ -Preferred system selection for NAM2 changes the system. -stores it. Slot Mode Yes Slot Index 2 Function -evrc, voice08k, voice13k SAMSUNG Proprietary-Contents may change without notice 4-1 NAM Programming 4-2 Setting Up NAM1 LCD Display Key in NAM Program 1:General 2:Setup NAM1 3:Setup NAM2 2 -Choose ‘Setup NAM1.’ Setup NAM1 1:Phone # 2:FM 3:CDMA 1 -Choose ‘Phone #’ Phone # 3003003000 Phone number -CDMA current number is displayed. to change, enter new one -stores it. Mobile ID # 3003003000 Phone number OK/ -CDMA current number is displayed. to change, enter new one -stores it. Setup NAM1 1:Phone # 2:FM 3:CDMA 2 -Choose ‘FM’ FM Home SID 20 ID number System ID for home, current status is displayed. - to change, enter new one. - store it. FM 1st Chn Channel number OK/ Current 1st paging channel. - to change, enter new one. - store it. ID number OK/ Acquisition system ID 1, Current status is displayed. - to change, enter new one. - store it. ID number Acquisition system ID 2, Current status is displayed. - to change, enter new one. - store it. 334 FM Acq SID1 20 FM Acq SID2 0 FM Acq SID3 OK/ OK/ OK/ ID number 0 OK/ Function Acquisition system ID 3, Current status is displayed. - to change, enter new one. - store it. SAMSUNG Proprietary-Contents may change without notice 4-2 NAM Programming LCD Display Key in FM Acq SID4 ID number Acquisition system ID 4, Current status is displayed. OK/ - to change, enter new one. - store it. ID number Acquisition system ID 5, Current status is displayed. OK/ - to change, enter new one. - store it. ID number Acquisition system ID 6, Current status is displayed. OK/ - to change, enter new one. - store it. ID number Lock system ID 1, current status is displayed. OK/ - to change, enter new one. - store it. ID number Lock system ID 2, current status is displayed. OK/ - to change, enter new one. - store it. ID number Lock system ID 3, current status is displayed. OK/ - to change, enter new one. - store it. ID number Lock system ID 4, current status is displayed. OK/ - to change, enter new one. - store it. ID number Lock system ID 5, current status is displayed. OK/ - to change, enter new one. - store it. ID number Lock system ID 6, current status is displayed. OK/ - to change, enter new one. - store it. ID number Lock system ID 6, current status is displayed. OK/ - to change, enter new one. - store it. * or # FM Registration, current status is displayed. OK/ - changes the status ‘YES’ to enable, ‘NO’ to disable - store it. 0 FM Acq SID5 0 FM Acq SID6 0 FM LockSID 1 0 FM LockSID 2 0 FM LockSID 3 0 FM LockSID 4 0 FM LockSID 5 0 FM LockSID 6 0 FM LockSID1 0 Auto Reg Yes Function SAMSUNG Proprietary-Contents may change without notice 4-3 NAM Programming LCD Display Key in FM pref. * or # Preferred system selection, current status is displayed. OK/ - changes the status ‘YES’ to enable, ‘NO’ to disable - store it. * or # Current Access Overload Class. OK/ - change the status. - store it. B pref FM ACCOLC 0 Setup NAM1 1:Phone # 2.FM 3:CDMA Function - Choose ‘CDMA’ 3 IMSI_MCC number 000 IMSI_MNC OK/ number -IMSI Moble Country Code, current code is displayed. to change, enter new one. -stores it. -IMSI Mobile Network Code, current code is displayed. to change, enter new one. -stores it. 00 OK/ B pref <or> OK/ -Preferred system selection, current system is displayed. changes the system. -stores it. CDMA ACCOLC. 0 class number CDMA Access Overload Class, current status is displayed. -to change, enter new one. -stores it. Pchn Sys A channel number CDMA pref.. 283 Pchn Sys B OK/ OK/ channel number 384 Schn Sys A OK/ channel number 691 Schn Sys B OK/ channel number 777 OK/ -Preferred channel currently used under system A to change, enter new one. -stores it. -Preferred channel currently used under system B to change, enter new one. -stores it. -Second channel currently used under system A to change, enter new one. -stores it. -Second channel currently used under system B to change, enter new one. -stores it. SAMSUNG Proprietary-Contents may change without notice 4-4 NAM Programming LCD Display Key in CD Acq SID 1 ID number 1~ 6 -1st Acquisition system ID, current status is displayed. OK/ to change, enter new one. -stores it. ID number 1~ 6 -2nd Acquisition system ID, current status is displayed. OK/ to change, enter new one. -stores it. ID number 1~ 6 -3rd Acquisition system ID, current status is displayed. OK/ to change, enter new one. -stores it. ID number 1~ 6 -4th Acquisition system ID, current status is displayed. OK/ to change, enter new one. -stores it. ID number 1~ 6 -5th Acquisition system ID, current status is displayed. OK/ to change, enter new one. -stores it. ID number 1~ 6 -6th Acquisition system ID, current status is displayed. OK/ to change, enter new one. -stores it. ID number -1st lock system ID,current status is displayed. OK/ to change, enter new one. -stores it. ID number -2nd lock system ID,current status is displayed. OK/ to change, enter new one. -stores it. ID number -3rd lock system ID,current status is displayed. OK/ to change, enter new one. -stores it. ID number -4th lock system ID,current status is displayed. OK/ to change, enter new one. -stores it. ID number -5th lock system ID,current status is displayed. OK/ to change, enter new one. -stores it. ID number -6th lock system ID,current status is displayed. OK/ to change, enter new one. -stores it. <or> -CDMA Home system ID, current status is displayed changes the status. -stores it. 20 CD Acq SID 2 0 CD Acq SID 3 0 CD Acq SID 4 0 CD Acq SID 5 0 CD Acq SID 6 0 CD lockSID 1 0 CD lockSID 2 0 CD lockSID 3 0 CD lockSID 4 0 CD lockSID 5 0 CD lockSID 6 0 CDMA Home SID Yes OK/ Function SAMSUNG Proprietary-Contents may change without notice 4-5 NAM Programming LCD Display Key in CDMA fSID <or> -CDMA foreign SID, current status is displayed. OK/ changes the system. -stores it. <or> -CDMA foreign NID, current status is displayed. OK/ changes the system. -stores it. number -first SID written in the list, current status is displayed. OK/ to change, enter new one. -stores it. number -first NID written in the list, current status is displayed. OK/ to change, enter new one. -stores it. number -2nd SID written in the list, current status is displayed. OK/ to change, enter new one. -stores it. number -2nd NID written in the list, current status is displayed. OK/ to change, enter new one. -stores it. number -3rd SID written in the list, current status is displayed. OK/ to change, enter new one. -stores it. number -3rd NID written in the list, current status is displayed. OK/ to change, enter new one. -stores it. number -4th SID written in the list, current status is displayed. OK/ to change, enter new one. -stores it. number -4th NID written in the list, current status is displayed. OK/ to change, enter new one. -stores it. Yes CDMA fNID Yes SID #1 20 NID #1 65535 SID #2 20 NID #2 65535 SID #3 20 NID #3 65535 SID #4 20 NID #4 65535 Function 4-3 Setting Up NAM 2 LCD Display Key in NAM Program 1:General 2:Setup NAM1 3:Setup NAM2 3 Function -Choose ‘Setup NAM2’ The NAM2 setup program is the same as ‘NAM1’ SAMSUNG Proprietary-Contents may change without notice 4-6 5. Product Support Tools 5-1 General IMPORTANT INFORMATION Purpose The Product Support Tool (PST) offers you the ability to interface with the SAMSUNG CDMA telephone using a PC. With this tool you can program the phones network system requirements and functionality, swap phone data, and download software upgrades. This document supports UniPST version 1.xx. NOTE: This software must be executed in the Windows95/98 mode. EQUIPMENT REQUIRED Make sure you have the following equipment setup: 1. Minimum PC configuration: 586 CPU, 16MB RAM, Windows95/98, 5MB of disk space free for software upgrade. 2. PST Software with appropriate cable (DM Cable for SAMSUNG CDMA phone). 3. Serial Port (16550 Serial Interface Card). 4. Power Supply (3.8 V) or Battery INSTALLATION Software 1.Insert the PST floppy disk into drive (A:\). 2.Create an appropriate directory on the C:\ drive for PST software, Execute Setup.exe file, The installation program creates folder and task bar on the windows95/98 start bar. SAMSUNG CDMA Phone The serial port should be configured to COM1 or COM2. Use the following procedure to connect the phone, cable, and PC . Plug the female end of the DM Cable into the 16550 card. Pull the black rubber connector away from the socket at the base of the phone. Plug the special connector on the cable into the socket at the base of the phone. SAMSUNG Proprietary-Contents may change without notice 5-1 Product Support Tools 5-2. PST (Product Support Tool) 5-2-1 Getting Started MAIN MENU SCREEN 1. At the Windows95/98, Double Click “UniPst.exe”. 2. The Main Menu Screen will be displayed. The Main Menu Screen shows the basic tasks that are available. CAUTION: DO NOT attempt to program phone with a low battery. PST SETUP UniPst supports SAMSUNG CDMA portable telephone. You can select serial port COM1 or COM2. 5-2-2 Operation Procedure Service Programming The Service Programming screens enable you to set and change the service activation parameters of the phones. These items can be changed individually or as a group via the “Edit Items” Property Sheet of the PST. There are several pages on the Service Programming Property Sheet (See below Figure). Read Data from File Click “open” icon to select the name of a file whose extension is “mmc”. The values will be read from the named file, and will initialize the parameter values seen on the Service programming screen Read Data from Phone Click Read from the Phone icon to upload the current programmable parameters of the phone. The values are read from the phone, so the phone must have the power ON and be properly connected to the PST. NOTE: To actually view the data you need to go to the Edit Items screens. Edit Items Click this icon to edit Number Assignment Module (NAM) items or UI items. There are two types of screens: 1. Parameters associated with a particular Number Assignment Module (NAM) 2. UI items settings Phone Book Click this icon to edit Phone Book. While you edit cell, you can use <Enter> and < UP , DOWN,LEFT,LIGHT Arrow> and <SPACE> key. If you want to edit phone number or name , you must move rectangle box to cell where you want to edit , Write it down . if <UP and DOWN Arrow> key is pressed, the cursor moves to next cell or previous cell. SAMSUNG Proprietary-Contents may change without notice 5-2 Product Support Tools Save Data to File Click this icon to save the current parameters to a file. Once you enter a filename, Click <OK> button to write all current parameters to that file. This way the same information can be downloaded into multiple phones. Write to Phone Click this icon to write the selected parameter values to the phone. Writing the selected values to the phone may take up to a minute. If there are dependencies in a field you can make all the changes in the proper fields and download the information all together. If you intend to use this “Write to Phone” feature, it is recommended that you do a “Read Data from Phone” first, and then make the changes, so that nothing gets inadvertently overwritten. NOTE: DO NOT TOUCH THE PHONE WHILE WRITING IS IN PROGRESS. Software Download and Upgrade Screen To begin a software upgrade or download, perform the following steps: 1. From the main menu screen choose DOWNLOAD MODE? Click open icon to choose a BIN file of the new software to be loaded. Choose the appropriate BIN file, then Click <Open> (see below figure). 2. Click Download? to begin downloading the file. You will notice various messages and a progress bar that informs the user what percentage of the downloading has already occurred. 3.Click Mode Select box, then Select SERVICE MODE?to return to the Service Mode Screen. NOTE: DO NOT POWER OFF WHILE THE PHONE IS BEING DOWNLOADED! SAMSUNG Proprietary-Contents may change without notice 5-3 Product Support Tools 5-3 TEST PROCEDURE 5-3-1 Configuration of Test Spectrum Analyzer RF In HP8924C RF In/Out Audio Audio Out In Directional Coupler To A-Out Test Jig To A-In DC Power Supply (+3.93V) ❈ CAUTION : Because there is the loss (0.33V at Max Power) of the test jig and Data cable, you’d better input 3.93V to the DC Power Supply to use 3.6V (Battery normal voltage) at Cellular phone Items needed to purchase from SAMSUNG ITEMS PARTS # RF Cable Test cable DM Cable Test JIG (RF Interface Pack Ass’y) GH39-00026A GH39-00028A GH39-30525A GH80-00001A REMARK Including 1. Power Cable(Black,Red) 2. 9-pin RS232 data Cable SAMSUNG Proprietary-Contents may change without notice 5-4 Product Support Tools 5-3-2 List of Equipment - DC Power Supply - Test Jig - Test Cable - CDMA Mobile Station Test Set - Spectrum Analyzer(include CDMA Test Mode) HP8924C, HP83236A, CMD-80, etc HP8596E TEST JIG AUDIO SELECT LEFT: AUDIO IN RIGHT: AUDIONOFF DC POWER INPUT PORT CHANGE VOLTAGE LEVEL BY MODEL (3.8VDC) RED: + BLACK: GND UP: AUTO POWER ON DOWN: NOT USE AUTO DB25 CONNECTOR CPMMECT TO DB25 CONNECTOR OF TEST CABLE A-IN - DC3.8v + D89 CONNECTOR CONNECT TO IBM PC SERIAL PORT TO_PC T E S T HHP I/F TEST JIG P A C K BJ11 CONNECTOR CONNECT TO HP SERIAL PORT TO_HP TO A-OUT TO A-IN PROBE NOT USED CONNECT TO AUDIO OUT PORT OF TEST EQUIPMENT (USE BNC CABLE) CONNECT TO AUDIO IN PORT OF TEST EQUIPMENT (USE BNC CABLE) TEST CABLE 2 3 1 4 5 6 SAMSUNG Proprietary-Contents may change without notice 5-5 Product Support Tools TEST CABLE CONNECTIONS 1 MHC 172 2 RF CABLE (1.4 dB Loss) 3 BNC CONNECTOR (RF) 4 PLUG CONNECT TO SCH-A105 5 DATA CABLE 6 Dsub 25PIN CONNECTOR (DATA) Dsub 25 PIN CONNECTOR PIN DESCRIPTION (TEST CABLE 1, BACK SIDE) DATA DESCRIPTION Dsub CONN. PIN NO. DATA DESCRIPTION Dsub CONN. PIN NO. V_F 12,21 DP_RX_DATA 8 DGND 2,4,6,13,19 HP_PWR 9 BATT 15,16,22 RI 10 C_F 3,20 CD 11 TX_AUDIO 5 RTS 14 DP_TX_DATA 7 CTS 17 RX_AUDIO 1 DTR 18 15 14 1 17 16 2 3 19 18 4 5 21 20 6 7 23 22 8 9 25 24 10 11 SAMSUNG Proprietary-Contents may change without notice 5-6 12 13 Product Support Tools 5-4. CONVERSION TABLE OF FREQUENCY vs CHANNEL TYPE CHANNEL CONVERSION EQUATION REMARK TX 1 ≤ N≤ 799 F=0.03 ✕ N + 825.00 FREQUENCY 990 ≤N≤1023 F=0.03 ✕ (N-1023) + 825.00 N ; CH NUMBER RX 1 ≤N≤ 799 F=0.03 ✕ N + 870.00 F ; FREQUENCY FREQUENCY 990 ≤N≤1023 F=0.03 ✕ (N-1023) + 870.00 Change to Test Mode A. To change the phone’s state from Normal Mode to Test Mode, You should enter the following keys. “*759#813580“ B. The command “0 1” is Suspend. C. To finish the Test Mode, You should enter the command “0 2”. * Note: Make sure to change to “Digital only” or “Analog only” mode in NAM1, EST MODE. (Refer to 4. NAM Programming) Channel Selection and Tx Power Output Level Control 1. Digital Mode (CDMA) A. Enter to Test Mode ( * 7 5 9 # 8 1 3 5 8 0 ). B. “0 1” : Suspend. C. “0 9 0 3 6 3 #” : Set to ‘0363’ channel. D. “0 7” : Carrier On. E. “3 4” : Spread spectrum to 1.23MHz band width. F. “7 1 2 7 5 #” : Output RF power level setting. “275” means AGC level and AGC level range is from 0 to 511. 2. Analog Mode ( FM ) A. Enter to Test Mode ( * 7 5 9 # 8 1 3 5 8 0 ). B. “0 1” : Suspend. C. “4 6” : Vocoder initial to Analog mode. D. “0 9 0 3 8 3 #” : Set to ‘0383’ channel. E. “0 7” : Carrier On. F. “7 2 2 7 5 #” : Output RF power level setting. “275” means AGC level and AGC level range is from 0 to 511. G. “1 0 2” : RF Power level control, 2(0~7) means power level . SAMSUNG Proprietary-Contents may change without notice 5-7 Product Support Tools 5-5 TEST COMMAND TABLE Command No. Signal. Name Description 1 SUSPEND enter to test menu 2 RESTART escape from test menu 3 SAVE_VAL Save values in e2prom only in auto test 4 GET_MODE Get mode CDMAFM AUTO TEST 5 SET_MODE Set mode CDMAFM AUTO TEST 6 WRITE_NV Write the EEPROM item 7 CARRIERON turn on the carrier 8 CARRIEROFF turn off the carrier 9 LOADSYN load the synthesizer for locking 10 PWRLEVEL change RF power level 11 RXMUTE mute rx audio 12 RXUNMUTE unmute rx audio 13 RXMUTE mute tx audio 14 TXUNMUTE unmute tx audio 15 VOC_ESEC Echo Canceller 16 STON turn on ST 17 STOFF turn off ST 18 LCD_CONTRAST index up key JOJ_98.11.23(contrast) 19 INDEX_DECR index dn key JOJ_98.07.07 20 LNA_GAIN_WR 22 SNDNAM Send NAM Information 23 SNDVERSION Send Software Version 24 SNDESN Send ESN 25 BACKLIGHT_ON Backlight on 26 BACKLIGHT_OFF Backlight off 27 LAMP_ON LAMP on 28 LAMP_OFF LAMP off 29 REBUILD Rebuilding EEPROM 30 SPC - - 31 PLINE Product lile information 32 SATON turn on SAT 33 SATOFF turn off SAT 34 CDATA continuously sen TX Control data 35 VOLUME_UP Electric Volume Up 36 VOLUME_DOWN Electric Volume Down SAMSUNG Proprietary-Contents may change without notice 5-8 Product Support Tools Command No. Signal. Name Description 38 VOC_ENC_OFFSET Vocoder ENC offset 39 VOC_DEC_OFFSET Vocoder DEC offset 40 VOC_CDMA_UNITY_GAIN Vocoder CDMA unity gain 41 VOC_FM_HFRX_UPGAIN Vocoder fm hfrx upgain 42 DTMFON turn on DTMF 43 DTMFOFF turn off DTMF 44 COMPANDORON turn on compandor 45 COMPANDOROFF turn off compandor 47 FM_AUD_GAIN FM audio gain 48 VIBRATOR_ON activate a vibrator 49 VIBRATOR_OFF inactivate a vibrator 50 BATT_TYPE Battery Type 51 BBA BBASIC supplier 52 HW_VERSION HW version hmk_96.12.09 53 CARRIER Target Carrier option 54 VOC13K Target Service option 55 EXT_AUDIO External Audio Path OnOff 56 LOOP_BACK Loop back on 57 MIC_ON mute MIC Path 58 MIC_OFF unmute MIC Path 59 ALLPATH tune on the all audio path 60 FM_TX_GAIN 61 FM_RX_GAIN 62 DTMF_VOL_TX 63 TX_LIMITER 64 FM_SAT_LEVEL 65 FM_FREQ_SGAIN 66 FM_ST_GAIN 67 READ_BATT Saved Low battery value read 68 VBATT1 set the low battery position in the standby 69 VBATT2 set the low battery position in the talking 70 WRITE_BATT write a BATT 71 CDMA_TXADJ sets tx_agc_adj for cdma mode 72 FM_TXADJ sets tx_agc_adj for fm mode 73 SET_PA_RO set TX power AMP ctrl RO JOJ_98.06.29 74 OFF_PA_RO off TX power AMP ctrl RO JOJ_98.06.29 READ_RSSI read a RSSI - - 75 SAMSUNG Proprietary-Contents may change without notice 5-9 Product Support Tools Command No. Signal. Name Description 76 WRITE_RSSI write a RSSI 77 READ_TEMP read a TEMP 78 RXRAS_AUTO adj RXRAS from 8924C JOJ_98.06.20 79 BUZZER_ON Buzzer on 80 BUZZER_OFF Buzzer off 81 VOC_PCMLPON turn on to play a PCM LOOP BACK 82 VOC_PCMLPOFF turn off to play a PCM LOOP BACK 83 DATASVC_ON rsm_ifc data svc 84 DATASVC_OFF rsm_ifc data svc 85 SPEAKER_ON turn on the speaker path 86 SPEAKER_OFF turn off the speaker path 87 FM_LOOP_TEST FM loop back 88 TRK_ADJ TRK LOCAL ADJUST 89 CDTRK_ADJ CDMA TRK LOCAL ADJUST 90 EVRC_TEST EVRC Check Mode kjg_980417_evrc 91 SVC_LED SVC_LED control hjkim_990113 92 TXRAS_ADJ TX RAS adj = TXRAS offset arry 93 RXRAS_ADJ RX RAS adj = RXRAS offset arry 94 HW_CHANFLAT 95 SW_CHANFLAT 96 CH_FLATNESS 97 FM_TX_PWR 99 TEMP 100 MAX - - setting the volume for power Level 2-7 SAMSUNG Proprietary-Contents may change without notice 5-10 6. Troubleshooting 6-1 Logic Section 6-1-1 Power Failure Press & hold END/ button Q110 Drain=‘H’? No Check the signal path from the battery terminal to Q110 source, R185, R115 & Q102. Yes Check U105, R188, C165 & R112 and its neighboring circuits. No Check Q104 and its neighboring circuits. No Check U201 and its neighboring circuits. Yes U104 pin9p=‘H’? No Q104 collector=‘L’? Yes U201 pin 1 output =3.0V? Yes END SAMSUNG Proprietary-Contents may change without notice 6-1 Troubleshooting 6-1-2 Abnormal Initial Operation (Normal +3.3V source) Press END/ button TCXO CLK applied to U401 pin 36& U501 pin35? No Check TCXO output, R310 and C325. Replace if required. No Check U401 and its meighboring circuit. Replace if required. No Check ‘H’ level input from U101 pin P6 and U401 pin79. No Check the LED and its neighboring circuit. Replace if required. No Check the LCD pins and its neighboring circuit. Replace if required. Yes TCXO CLK signal output from U401 pin 37? Yes CHIPX8 CLK signal output from U401 pin 38? Yes LED ON? Yes Normal initial display on LCD? Yes END SAMSUNG Proprietary-Contents may change without notice 6-2 Troubleshooting 6-1-3 Abnormal Backlight,LCD or LED Operation Press and button on the phone ‘H’ level output from U104 pin 7L? No Check U104 pin7L Replace if required No Check Q108 & Q107 and its neighboring circuits. Replace if required No Check U104 pin 13p Yes ‘H’ level from U101 pin7L drive Q108 & Q107? Yes ‘L’ level from U104 pin13p? Yes Backligh LED or LCD on SAMSUNG Proprietary-Contents may change without notice 6-3 Troubleshooting 6-1-4 Abnormal Key Data Input Check initial status Scanning signals output from U104 pins 4A, 4B,5A,5C,5D,6C, 5E.? No Check U104 pins 4A,4B,5A,5C,5D,6C,5E No Replace the keypad assembly Yes Check U104 pin 2A,4C, and 3B Yes Check CON J1. Yes Normal key data input? Yes END SAMSUNG Proprietary-Contents may change without notice 6-4 Troubleshooting 6-1-5 Abnormal Key Tone Check initial status Scanning signals ouput from U104 pins 4A,4B,5A,5C,5D,6C, 5E.? No Check U104 pins 4A,4B,5A,5C,5D,6C,5E. No Replace the Keypad assembly. Yes Check U104 pins 2A,4C and 3B. Yes Check CON J1. Yes Normal Key data input? Yes END SAMSUNG Proprietary-Contents may change without notice 6-5 Troubleshooting 6-2 Transmitter Section Abormal transmitter section No Check TX PLL OK? No Yes Check U303 Pin2? YES Check OSC300? Pin1 969.96 MHz CH:486 Tcxo:19.68 MHz Yes Check TX Power level. OK? No Check U304 Tx IF Level? Yes Gain: -15 dBm No Check U504 Local Input Level? Yes Check Q503 Level? CDMA:0 dBm Gain: 0 dBm No Yes Gain: + 20 dB No SAMSUNG Proprietary-Contents may change without notice 6-6 Check U304 Tx IF Level? Gain: + 28 dB Troubleshooting 6-3 Receiver Section RX part No Check CDMA SVC&ROAM? Check LNA in/output OK? No Check Duplexer & LNA power Gain: +18 dB Yes Yes Yes Check 1st local & mixer power OK? Check mixer in/output OK? Gain: -11 dB No Check PLL (U407) & VCO output local: - 5 dBm BUFFER OUTPUT: - 5 dBm Yes Check IF AMP in/output OK? No Check IF AMP power OK? Gain: +19 dB Yes Check IF filter in/output OK? No Check IF filter solderling Loss: -10 dB Yes RF Rx FM OK BBA INPUT: -52 dBm SAMSUNG Proprietary-Contents may change without notice 6-7 Troubleshooting 6-4 RF Section Start CDMA mode Normal CDMA SVC & ROAM OK? No Check CDMA RX path No Check Transmitter Yes Setup CDMA call. OK? No Yes Measure CDMA FER Yes Normal CDMA RF? SAMSUNG Proprietary-Contents may change without notice 6-8 7. Exploded View and its Parts List 7-1 Cellular phone Exploded View 2-1 2-2 2-3 6-3 6-2 6-1 SAMSUNG Proprietary-Contents may change without notice 7-1 Exploded view and its Part List SEC.CODE No Description 1 2 REMARK Silver Gray Champagne Gold SUA, FOLDER REAR GH75-00148M GH75-00148L LCD MODULE GH96-00869A GH96-00869A 2-1 BUZZER 3002-001062 3002-001062 2-2 SPEAKER 3001-001103 3001-001103 2-3 VIBRATOR 3101-001169 3101-001169 3 SUA, FOLDER FRONT COVER GH97-01592B GH97-01592A 4 SCREW MACHINE 6001-000464 6001-000464 5 LCD WINDOW GH72-01045A GH72-01045A 6 KEY PCB GH59-00085A GH59-00085A 6-1 MIC 3003-001034 3003-001034 6-2 METAL DOME SHEET GH74-00456A GH74-00456A 6-3 REED SWITCH 3409-001039 3409-001039 7 MAIN PBA GH92-00824A GH92-00824A 8 BATTERY GH43-00179B GH43-00173B 500 mAh GH43-00180B GH43-00174B 1000 mAh 9 SCREW MACHINE 6001-001057 6001-001057 10 SUA, REAR COVER GH75-00149B GH75-00149A 11 ANTENNA GH42-00015B GH42-00015B 12 KEY PAD GH73-00085F GH73-00085F 13 VOLUME KEY GH72-00300C GH72-00300C 14 EAR JACK COVER GH72-00301A GH72-00301A 15 SUA, FRONT CASE GH75-00525B GH75-00525A 16 RF JACK DUMMY GH73-00083A GH73-00083A SAMSUNG Proprietary-Contents may change without notice 7-2 Exploded view and its Part List 7-2 Desk-Top Rapid Charger Ass’y A TYPE 7-3 Travel Charger Ass’y SEC. CODE Remark A GH44-00104D Brazil B GH44-00104C Mexico (TC010, GH44-00080B) 7-4 Cigarette Lighter Adaptor Ass’y B (CLC020, GH44-00070A) SAMSUNG Proprietary-Contents may change without notice 7-3 Exploded view and its Part List 7-5 Hands Free Kit Ass’y 7-6 Cradle Exploded View SAMSUNG Proprietary-Contents may change without notice 7-4 8.ElectricalPartsList Level SEC CODE Design LOC ITEMS DESCRIPTIONS 0 SCH-A105G/TCL 1 3001-001103 SPEAKER 0.05W, 32ohm, 111dB, - 1 3003-001034 MIC-CONDENSOR 2V, 130UA-500UA, -44DB+-3DB, 2.2KOHM 1 GH42-00015B ANTENNA-SCHA100 SCH-A100, 824-849MHz, 0/-3DBD, 50OHM 1 GH43-00173B BATTERY-500mA, L/GRY, ISR, MAIN 3.7V, 540mAh, -, 540mA, 4.2V 1 GH43-00174B BATTERY-1000M, L/GRY, ISR, MAIN 3.6V, 915mAH, -, 965mAH, - 1 GH44-00104D CHARGER-DTCA101 SCH-A101, AC/DC, -, 110-220VAC 1 GH82-00008A A/SMATERIALASSY-SCHA100 SCH-A100, -, KOR, SVCPBAASS’Y, -, -, 2 3001-001103 SPEAKER 0.05W, 32ohm, 111dB, - 2 3002-001062 BUZZER-MAGNETIC 88dB, 3.6V, 90mA, 2.731KHz, TP 2 3003-001034 MIC-CONDENSOR 2V, 130UA-500UA, -44DB+-3DB, 2 3101-001169 MOTOR MOTOR-DC 8500rpm, -, 3V, 110mA 2 3409-001039 REEDSWITCH SWITCH-REED 2 6001-000464 SCREW-MACHINE PH, +, M1.4, L4, BLACK, SM10C, - 2 6001-001057 SCREW-MACHINE PH, +, M1.4, L6, ZPC(BLK), MSWR20, 2 GH39-00026A RFCABLE CBFSIGNAL-SCHA100 SCH-A100, -, RFTESTCABLE, 1800+-20, 2 GH42-00015B ANT ANTENNA-SCHA100 SCH-A100, 824-849MHz, 0/-3DBD, 2 GH68-00370A LABEL(R)-FRONTDUMMYSHEET SCH-A100, PCSHEET, PI4.4, T0.3, 2 GH72-00300C PMO-VOLUMEKEY SCH-A100, PC, GRY, -, - 2 GH72-00301A PMO-EARJACKCOVER SCH-A100, PUR, L/GRY, -, - 2 GH72-01045A PMO-LCDWINDOW(SVC) SCH-A101, ACRYL, BLK, -, - 2 GH73-00083A RMO-RFJACKDUMMY SCH-A100, RUBBER, -, GRY, 50 2 GH73-00085F RMO-KEYPAD SCH-A100, RUBBER, -, -, - 2 GH74-00456A MPR-METALDOMESHEET SCH-A101, PETFILM+SUS301, T0.07, -, - 2 GH75-00148L MEC-FOLDERREAR SCH-A100, -, BEG 3 GH71-00049G NPR-DECORATIONPANNEL SCH-A100, AL, T0.6, GLD 3 GH72-00293A PMO-REARFOLDER SCH-A100, PC, BEG, -, - 3 GH74-00138A MPR-DECO.PANNELTAPE SCH-A100, TESA, T0.2, TRP, - 3 GH74-00151A MPR-DECOPANNALBOHOTAPE SCH-A100, VINYL, T0.2, -, - 2 GH75-00525A MEC-SUA.FRONT SCH-A101(ISRL), -, BEG 3 GH72-00286A PMO-FRONTCOVER SCH-A100, PC, BEG, -, - 3 GH72-00287A PMO-LEDLENS SCH-A100, ACRYL, TRP, -, - 3 GH72-00295A PMO-HINGEDUMMY SCH-A100, POM, BLK, -, - 3 GH73-00263A RMO-FOLDHOLDER SGH-A100, RUBBER, -, D/GRY, - BUZZER 100VDC, 0.5A, 1000US, 1000US SAMSUNGProprietary-Contentsmaychangewithoutnotice 8-1 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 GH97-00925D MEAREAR-COVER SCH-A101, -, ISRL, GRY, -, -, - 3 GH71-00050A NPR-ANTENNABRAKET SCH-A100, ZNGOLDPLT, -, AU 3 GH71-10639A NPR-SHIELDSTRIP(A) SCH-1100, C1720S-1/2H, T0.1, GOLD 3 GH75-00149A MEC-SUA.REARCOVER SCH-A100, -, GRY 4 GH68-00389A LABEL(R)-DUPLEXDUMMY SCH-A100, MAT, 22X11, T0.05, GRY 4 GH70-10633A IPR-LOCKERSPRING SCH-750, STS304, T0.3, - 4 GH72-00298A PMO-REARCOVER SCH-A100, PC, GRY, -, - 4 GH72-00299A PMO-LOCKER SCH-A100, PC, GRY, -, G5295 2 GH97-01591A MEAETC-KEYFPCB SCH-A101, -, ISRL, WHT, -, -, - 3 GH59-00085A KEYPADASS’Y UNIT-SCHA101KEYPAD SCH-A101, KBSCHA101, KEYPADASS’Y, - 3 GH71-00207A NPR-SOLDERFINGER SCH-A120, C5210TS, T0.15, AU 3 GH72-00294A PMO-SHIELDCOVER SCH-A100, ABS, BLK, -, - 2 GH97-01592A MEAETC-FOLDERFRONT SCH-A101, -, ISRL, BEG, -, -, - 3 GH72-00297B PMO-LCDWINDOW SCH-6900, ACRYL(T1), -, -, - 3 GH74-00152A MPR-WINDOWBOHOTAPE SCH-A100, VINYL, T0.2, -, - 3 GH74-00566A MPR-SPEAKNET SCH-A101, HIMERON, PI12.6XT1.65, -, - 3 GH75-00146D MEC-FOLDERFRONT SCH-A100, -, BEG 4 GH72-00288D PMO-FOLDERFRONT SCH-A100(ISRL), PC, BEG, -, - 4 GH72-00289A PMO-EARPIECE SCH-A100, PC, GRY, -, - 4 GH74-00135A MPR-LCDWINDOWTAPE SCH-A100, TESA, T0.2, TRP, - 4 GH74-00137A MPR-EARPIECETAPE SCH-A100, TESA, T0.2, TRP, - 4 GH74-00600A MPR-LCDSPONGE SCH-A101, SRSPORON, T0.5, BLK, - 4 GH75-00414B MEC-HINGEASS’Y SCH-850, -, BLK 5 GH70-00020A IPR-SPRINGHINGE SCH-A100, STS304, PI4.5XPI0.65X8.2, - 5 GH72-00291A PMO-SHAFTHINGE SCH-A100, POM, BLK, -, - 5 GH72-00292A PMO-CAMHINGE SCH-A100, POM, BLK, -, - 5 GH72-00861A PMO-HINGEHOUSING SCH-850, PC, SIL, -, - 3 GH75-00164A MEC-MAGNETICHOLDER SCH-A100, SEC, BLK 4 GH70-40005A ICT-MAGNETIC SPH-7000, MAGNETIC, 3x15XT1.0, - 4 GH72-00296A PMO-MAGNETICHOLDER SCH-A100, PC, BLK, -, - 4 GH74-00150A MPR-TAPEMAGNETICHODER SCH-A100, TESA, T0.2, TRP, - 1 GH92-00824A PBAMAIN-IFC2 IFC2, -, KORA, MAINPBA, -, -, - 2 0405-001035 D402 DIODE-VARACTOR 1SV279, 15V, 3nA, USC, TP 2 0405-001035 D403 DIODE-VARACTOR 1SV279, 15V, 3nA, USC, TP SAMSUNG Proprietary-Contents may change without notice 8-2 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 0405-001035 D501 DIODE-VARACTOR 1SV279, 15V, 3nA, USC, TP 2 0405-001035 D502 DIODE-VARACTOR 1SV279, 15V, 3nA, USC, TP 2 0406-001051 ZD102 DIODE-TVS SMS05C, 6V, 300W, SOT-23-6 2 0406-001051 ZD103 DIODE-TVS SMS05C, 6V, 300W, SOT-23-6 2 0406-001084 ZD201 DIODE-TVS SMF05, 6/-/V, 200W, - 2 0407-000115 D100 DIODE-ARRAY DAN202U, 80V, 100mA, CA2-3, SC-70, 2 0407-000115 D202 DIODE-ARRAY DAN202U, 80V, 100mA, CA2-3, SC-70, 2 0407-001006 D200 DIODE-ARRAY DA221, 20V, 100mA, C2-3, EM3, TR 2 0407-001006 D201 DIODE-ARRAY DA221, 20V, 100mA, C2-3, EM3, TR 2 0407-001006 D500 DIODE-ARRAY DA221, 20V, 100mA, C2-3, EM3, TR 2 0409-001016 D401 DIODE-PIN BAR63-02W, 50V, 100mA, SCD-80, TP 2 0501-000162 Q106 TR-SMALL SIGNAL 2SA1576, PNP, 200mW, SOT-323, TP, 180- 2 0501-000162 Q301 TR-SMALL SIGNAL 2SA1576, PNP, 200mW, SOT-323, TP, 180- 2 0501-000218 Q400 TR-SMALL SIGNAL 2SC4081, NPN, 200mW, UMT, TP, 180-3 2 0501-000225 Q102 TR-SMALL SIGNAL 2SC4617, NPN, 200mW, EM3, TP, 120-5 2 0501-000225 Q108 TR-SMALL SIGNAL 2SC4617, NPN, 200mW, EM3, TP, 120-5 2 0501-002096 Q503 TR-SMALL SIGNAL BFP420, NPN, 160mW, SOT-343, TP, 50- 2 0501-002110 Q401 TR-SMALL SIGNAL AT32033, NPN, 200mW, SOT-23, TP, 70 2 0501-002202 Q107 TR-SMALL SIGNAL MMBT2222AWT1, NPN, 150mW, SOT-323 2 0501-002202 Q201 TR-SMALL SIGNAL MMBT2222AWT1, NPN, 150mW, SOT-323 2 0504-000167 Q104 TR-DIGITAL RN1102, NPN, 100mW, 10K/10K, SSM, TP 2 0504-000167 Q160 TR-DIGITAL RN1102, NPN, 100mW, 10K/10K, SSM, TP 2 0504-000167 Q302 TR-DIGITAL RN1102, NPN, 100mW, 10K/10K, SSM, TP 2 0504-000167 Q502 TR-DIGITAL RN1102, NPN, 100mW, 10K/10K, SSM, TP 2 0504-000167 Q510 TR-DIGITAL RN1102, NPN, 100mW, 10K/10K, SSM, TP 2 0504-000167 Q511 TR-DIGITAL RN1102, NPN, 100mW, 10K/10K, SSM, TP 2 0504-000168 Q100 TR-DIGITAL RN1104, NPN, 100mW, 47K/47K, SSM, TP 2 0504-000168 Q103 TR-DIGITAL RN1104, NPN, 100mW, 47K/47K, SSM, TP 2 0504-000168 Q410 TR-DIGITAL RN1104, NPN, 100mW, 47K/47K, SSM, TP 2 0504-000172 Q200 TR-DIGITAL RN2104, PNP, 100mW, 47K/47K, SSM, TP 2 0504-000172 Q500 TR-DIGITAL RN2104, PNP, 100mW, 47K/47K, SSM, TP 2 0505-001037 U502 FET-SIL ICON -, P, -12V, +-2.5A, 0.1ohm, 1W, TSSO 2 0505-001119 Q402 FET-SIL ICON 2SK2685, P, 6V, 20mA, -, 100mW, CMPA 2 0505-001165 Q110 FET-SIL ICON SI3443DV, P, -20V, +-3.5mA, 65mohm 2 0505-001165 Q501 FET-SIL ICON SI3443DV, P, -20V, +-3.5mA, 65mohm SAMSUNG Proprietary-Contents may change without notice 8-3 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 1001-001048 U407 IC-ANALOG SWITCH SW395TR, SPDP, SOT-26, 6P, -, DUAL, 2 1103-001184 U105 IC-EEPROM 24C256, 32Kx8Bit, dBGA, 8P, 92MIL, -, 2 1109-001133 U102 IC-ETC. MEMORY 84VD21194, 2MX8/1MX16Bit, BGA, 61P, 2 1201-001248 U300 IC-CASCODE AMP 0916, SOT-143, 4P, -, -, 2.7V, -, 6Vd 2 1201-001248 U301 IC-CASCODE AMP 0916, SOT-143, 4P, -, -, 2.7V, -, 6Vd 2 1201-001259 U500 IC-POWER AMP 23124, LCC, 8P, -, SINGLE, -, PLASTI 2 1201-001384 U400 IC-MMIC AMP MD57-0001, SOT-26, 6P, 114MIL, SIN 2 1202-000192 U200 IC-VOLFAGECOMP. 75W393, -, 8P, -, DUAL, 36V, CMOS, PL 2 1203-001285 U403 IC-SWITCHVOL. REG. 5205, SOT-23, 5P, 150MIL, PLASTIC, 2 1203-001285 U404 IC-SWITCHVOL. REG. 5205, SOT-23, 5P, 150MIL, PLASTIC, 2 1203-001285 U503 IC-SWITCHVOL. REG. 5205, SOT-23, 5P, 150MIL, PLASTIC, 2 1203-001717 U201 IC-VOLTAGE REGULATOR 5210, MSOP, 8P, 117MIL, PLASTIC, 3.0V, -, 2 1203-001835 U101 IC-RESET 3470, SOT23, 5P, -, PLASTIC, 0.99/1.01V, 2 1204-001375 U202 IC-ENCODER/DECODER ST5092TQFPTR, QFP, 44P, -, PLASTIC 2 1204-001504 U401 IC-IF CIRCUIT IFR3000, TQFP, 48P, -, PLASTIC, 3.5V, -, - 2 1204-001505 U501 IC-IF CIRCUIT IFT3000, TQFP, 48P, -, PLASTIC, 3.5V, -, - 2 1205-001535 U504 IC-MIXER RF2628, MSOP, 8P, 190MIL, PLASTIC, 2 1205-001883 U104 IC-TRANSCEIVER MSM3000, BGA, 196P, -, PLASTIC, 4.6V, -, 2 1209-001197 U302 IC-PLL LMX2332LSLB, CSP, 20P, -, PLASTIC, 2 1404-001040 R502 THERMISTOR-NTC 10kohm, 5%, 3650K, -, TP 2 1404-001165 TH1 THERMISTOR-NTC 10kohm, 3%, 4100K, 30MW/C, TP 2 2007-000137 R143 R-CHIP 2kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000137 R330 R-CHIP 2kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000137 R405 R-CHIP 2kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000137 R526 R-CHIP 2kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000138 R101 R-CHIP 100ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000138 R103 R-CHIP 100ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000138 R106 R-CHIP 100ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000138 R108 R-CHIP 100ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000138 R111 R-CHIP 100ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000138 R144 R-CHIP 100ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000138 R302 R-CHIP 100ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000139 R416 R-CHIP 220ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000140 R110 R-CHIP 1kohm, 5%, 1/16W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 8-4 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 2007-000140 R117 R-CHIP 1kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000140 R126 R-CHIP 1kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000140 R127 R-CHIP 1kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000140 R135 R-CHIP 1kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000140 R146 R-CHIP 1kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000140 R210 R-CHIP 1kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000140 R213 R-CHIP 1kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000141 R204 R-CHIP 2.2kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000141 R309 R-CHIP 2.2kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000143 R124 R-CHIP 4.7kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000143 R187 R-CHIP 4.7kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000143 R206 R-CHIP 4.7kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000143 R529 R-CHIP 4.7kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000144 R281 R-CHIP 5.1kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000144 R310 R-CHIP 5.1kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000146 R105 R-CHIP 6.8kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000146 R128 R-CHIP 6.8kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000147 R532 R-CHIP 8.2kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R109 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R121 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R132 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R139 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R194 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R196 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R200 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R426 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R427 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R510 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R512 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R517 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000148 R582 R-CHIP 10kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000151 R134 R-CHIP 15kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000153 R100 R-CHIP 22kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000153 R123 R-CHIP 22kohm, 5%, 1/16W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 8-5 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 2007-000153 R125 R-CHIP 22kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000153 R129 R-CHIP 22kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000153 R145 R-CHIP 22kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000153 R147 R-CHIP 22kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000155 R185 R-CHIP 27kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000156 R504 R-CHIP 30kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000156 R506 R-CHIP 30kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000157 R102 R-CHIP 47kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000157 R107 R-CHIP 47kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000157 R520 R-CHIP 47kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000159 R211 R-CHIP 56kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R112 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R115 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R116 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R118 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R119 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R120 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R188 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R199 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R203 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R205 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R414 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R420 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R441 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R508 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R524 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R531 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000162 R533 R-CHIP 100kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000163 R201 R-CHIP 120kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000165 R202 R-CHIP 200kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000168 R485 R-CHIP 470kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000170 R209 R-CHIP 1Mohm, 5%, 1/16W, DA, TP, 1005 2 2007-000172 R301 R-CHIP 10ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000172 R305 R-CHIP 10ohm, 5%, 1/16W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 8-6 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 2007-000172 R307 R-CHIP 10ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000172 R311 R-CHIP 10ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000172 R407 R-CHIP 10ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000172 R423 R-CHIP 10ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000172 R522 R-CHIP 10ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000174 R417 R-CHIP 47ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000174 R525 R-CHIP 47ohm, 5%, 1/16W, DA, TP, 1005 2 2007-000242 R208 R-CHIP 1.5kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000242 R580 R-CHIP 1.5kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000242 R581 R-CHIP 1.5kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000775 R419 R-CHIP 33kohm, 5%, 1/16W, DA, TP, 1005 2 2007-000932 R104 R-CHIP 470ohm, 5%, 1/16W, DA, TP, 1005 2 2007-001156 R175 R-CHIP 750ohm, 5%, 1/16W, DA, TP, 1005 2 2007-001284 R415 R-CHIP 4.7ohm, 5%, 1/16W, DA, TP, 1005 2 2007-001294 R149 R-CHIP 36ohm, 5%, 1/16W, DA, TP, 1005 2 2007-001294 R150 R-CHIP 36ohm, 5%, 1/16W, DA, TP, 1005 2 2007-001294 R151 R-CHIP 36ohm, 5%, 1/16W, DA, TP, 1005 2 2007-001316 R507 R-CHIP 820ohm, 5%, 1/16W, DA, TP, 1005 2 2007-001311 R537 R-CHIP 270ohm, 5%, 1/16W, DA, TP, 1005 2 2007-001313 R130 R-CHIP 330ohm, 5%, 1/16W, DA, TP, 1005 2 2007-001313 R131 R-CHIP 330ohm, 5%, 1/16W, DA, TP, 1005 2 2007-001313 R138 R-CHIP 330ohm, 5%, 1/16W, DA, TP, 1005 2 2007-001317 R314 R-CHIP 910ohm, 5%, 1/16W, DA, TP, 1005 2 2007-001319 R122 R-CHIP 1.2kohm, 5%, 1/16W, DA, TP, 1005 2 2007-001320 R501 R-CHIP 1.8kohm, 5%, 1/16W, DA, TP, 1005 2 2007-001320 R523 R-CHIP 1.8kohm, 5%, 1/16W, DA, TP, 1005 2 2007-001323 C251 R-CHIP 3kohm, 5%, 1/16W, DA, TP, 1005 2 2007-001325 R148 R-CHIP 3.3kohm, 5%, 1/16W, DA, TP, 1005 2 2007-001325 R207 R-CHIP 3.3kohm, 5%, 1/16W, DA, TP, 1005 2 2007-003006 R303 R-CHIP 16ohm, 5%, 1/16W, DA, TP, 1005 2 2007-003006 R304 R-CHIP 16ohm, 5%, 1/16W, DA, TP, 1005 2 2007-003010 R306 R-CHIP 20ohm, 5%, 1/16W, DA, TP, 1005 2 2007-003023 R514 R-CHIP 62kohm, 5%, 1/16W, DA, TP, 1005 2 2007-003112 R320 R-CHIP 27ohm, 5%, 1/16W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 8-7 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 2007-007014 R160 R-CHIP 51kohm, 5%, 1/16W, DA, TP, 1005 2 2007-007135 R515 R-CHIP 18kohm, 1%, 1/16W, DA, TP, 1005 2 2007-007142 R410 R-CHIP 10kohm, 1%, 1/16W, DA, TP, 1005 2 2007-007307 R408 R-CHIP 150ohm, 1%, 1/16W, DA, TP, 1005 2 2007-007311 R505 R-CHIP 22kohm, 1%, 1/16W, DA, TP, 1005 2 2007-007315 R516 R-CHIP 3.9kohm, 1%, 1/16W, DA, TP, 1005 2 2007-007319 R521 R-CHIP 390ohm, 1%, 1/16W, DA, TP, 1005 2 2007-007480 R500 R-CHIP 130kohm, 1%, 1/16W, DA, TP, 1005 2 2007-007489 R503 R-CHIP 150kohm, 1%, 1/16W, DA, TP, 1005 2 2007-007771 C219 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R113 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R162 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R198 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R300 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R308 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R312 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R313 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R450 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R518 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R519 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R536 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R540 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2007-007771 R541 R-CHIP 0ohm, 5%, 1/16W, DA, TP, 1005 2 2203-000233 C105 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C106 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C107 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C108 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C123 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C125 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C151 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C203 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C300 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C302 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C304 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C305 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 8-8 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 2203-000233 C306 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C310 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C312 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C313 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C314 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C319 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C327 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C332 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C333 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C334 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C434 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C436 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C437 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C454 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C491 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C510 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C523 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C529 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C530 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C531 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C545 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C552 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C571 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C572 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C580 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C581 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000233 C583 C-CERAMIC, CHIP 0.1nF, 5%, 50V, NP0, TP, 1005 2 2203-000254 C109 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C114 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C115 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C117 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C128 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C137 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C150 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - SAMSUNG Proprietary-Contents may change without notice 8-9 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 2203-000254 C187 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C205 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C206 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C209 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C301 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C303 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C311 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C320 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C321 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C324 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C325 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C326 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C329 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C414 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C416 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C429 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C433 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C440 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C441 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C444 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C445 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C451 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C459 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C462 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C463 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C464 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C467 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C490 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C500 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C501 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C502 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C503 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C505 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C506 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - SAMSUNG Proprietary-Contents may change without notice 8-10 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 2203-000254 C509 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C516 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C519 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C522 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C532 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C540 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C541 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C546 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C549 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C570 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000254 C599 C-CERAMIC, CHIP 10nF, 10%, 16V, X7R, TP, 1005, - 2 2203-000278 C328 C-CERAMIC, CHIP 0.01nF, 0.5pF, 50V, NP0, TP, 1005 2 2203-000311 C447 C-CERAMIC, CHIP 0.12nF, 5%, 50V, NP0, TP, 1005 2 2203-000311 C456 C-CERAMIC, CHIP 0.12nF, 5%, 50V, NP0, TP, 1005 2 2203-000311 C507 C-CERAMIC, CHIP 0.12nF, 5%, 50V, NP0, TP, 1005 2 2203-000311 C514 C-CERAMIC, CHIP 0.12nF, 5%, 50V, NP0, TP, 1005 2 2203-000425 C424 C-CERAMIC, CHIP 0.018nF, 5%, 50V, NP0, TP, 1005 2 2203-000438 C110 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C112 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C116 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C120 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C129 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C130 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C131 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C132 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C133 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C135 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C136 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C138 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C139 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C140 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C307 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C408 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C409 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - SAMSUNG Proprietary-Contents may change without notice 8-11 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 2203-000438 C415 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C419 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C420 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C425 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C430 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C432 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C439 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C446 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C469 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C472 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C477 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C497 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C511 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C525 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C533 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C536 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C539 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C544 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C547 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000438 C548 C-CERAMIC, CHIP 1nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000466 C308 C-CERAMIC, CHIP 0.001nF, 0.25pF, 50V, NP0, TP, 1005 2 2203-000489 C513 C-CERAMIC, CHIP 2.2nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000489 C542 C-CERAMIC, CHIP 2.2nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000550 C411 C-CERAMIC, CHIP 0.02nF, 5%, 50V, NP0, TP, 1005 2 2203-000585 C207 C-CERAMIC, CHIP 220pF, 10%, 50V, X7R, TP, 1005, - 2 2203-000585 C322 C-CERAMIC, CHIP 220pF, 10%, 50V, X7R, TP, 1005, - 2 2203-000585 C465 C-CERAMIC, CHIP 220pF, 10%, 50V, X7R, TP, 1005, - 2 2203-000628 C495 C-CERAMIC, CHIP 0.022nF, 5%, 50V, NP0, TP, 1005 2 2203-000679 C111 C-CERAMIC, CHIP 0.027nF, 5%, 50V, NP0, TP, 1005 2 2203-000679 C113 C-CERAMIC, CHIP 0.027nF, 5%, 50V, NP0, TP, 1005 2 2203-000696 C309 C-CERAMIC, CHIP 0.002nF, 0.25pF, 50V, NP0, TP, 1005 2 2203-000714 C127 C-CERAMIC, CHIP 3.3nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000725 C316 C-CERAMIC, CHIP 3.9nF, 10%, 50V, X7R, TP, 1005, - 2 2203-000812 C404 C-CERAMIC, CHIP 0.033nF, 5%, 50V, NP0, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 8-12 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 2203-000812 C468 C-CERAMIC, CHIP 0.033nF, 5%, 50V, NP0, TP, 1005 2 2203-000812 C551 C-CERAMIC, CHIP 0.033nF, 5%, 50V, NP0, TP, 1005 2 2203-000885 C330 C-CERAMIC, CHIP 4.7nF, 10%, 25V, X7R, TP, 1005, - 2 2203-000885 C410 C-CERAMIC, CHIP 4.7nF, 10%, 25V, X7R, TP, 1005, - 2 2203-000885 C458 C-CERAMIC, CHIP 4.7nF, 10%, 25V, X7R, TP, 1005, - 2 2203-000940 C103 C-CERAMIC, CHIP 470pF, 10%, 50V, X7R, TP, 1005, - 2 2203-000940 C104 C-CERAMIC, CHIP 470pF, 10%, 50V, X7R, TP, 1005, - 2 2203-000940 C119 C-CERAMIC, CHIP 470pF, 10%, 50V, X7R, TP, 1005, - 2 2203-000940 C400 C-CERAMIC, CHIP 470pF, 10%, 50V, X7R, TP, 1005, - 2 2203-000995 C121 C-CERAMIC, CHIP 0.047nF, 5%, 50V, NP0, TP, 1005 2 2203-000995 C407 C-CERAMIC, CHIP 0.047nF, 5%, 50V, NP0, TP, 1005 2 2203-001072 C273 C-CERAMIC, CHIP 0.056nF, 5%, 50V, NP0, TP, 1005 2 2203-001072 C315 C-CERAMIC, CHIP 0.056nF, 5%, 50V, NP0, TP, 1005 2 2203-001153 C600 C-CERAMIC, CHIP 0.068nF, 5%, 50V, NP0, TP, 1005 2 2203-001153 C601 C-CERAMIC, CHIP 0.068nF, 5%, 50V, NP0, TP, 1005 2 2203-001153 C602 C-CERAMIC, CHIP 0.068nF, 5%, 50V, NP0, TP, 1005 2 2203-001153 C603 C-CERAMIC, CHIP 0.068nF, 5%, 50V, NP0, TP, 1005 2 2203-001153 C604 C-CERAMIC, CHIP 0.068nF, 5%, 50V, NP0, TP, 1005 2 2203-001153 C605 C-CERAMIC, CHIP 0.068nF, 5%, 50V, NP0, TP, 1005 2 2203-001153 C606 C-CERAMIC, CHIP 0.068nF, 5%, 50V, NP0, TP, 1005 2 2203-001153 C607 C-CERAMIC, CHIP 0.068nF, 5%, 50V, NP0, TP, 1005 2 2203-001153 C608 C-CERAMIC, CHIP 0.068nF, 5%, 50V, NP0, TP, 1005 2 2203-001153 C609 C-CERAMIC, CHIP 0.068nF, 5%, 50V, NP0, TP, 1005 2 2203-001383 C428 C-CERAMIC, CHIP 0.0005nF, 0.25pF, 50V, NP0, TP, 1005 2 2203-001385 R530 C-CERAMIC, CHIP 0.0015nF, 0.25pF, 50V, NP0, TP, 1005 2 2203-001412 C418 C-CERAMIC, CHIP 0.03nF, 5%, 50V, NP0, TP, 1005 2 2203-001416 C331 C-CERAMIC, CHIP 33nF, 10%, 16V, Y5V, TP, 1005, 1.0mm 2 2203-001432 C118 C-CERAMIC, CHIP 47nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-001432 C167, C168 C-CERAMIC, CHIP 47nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-003054 C422 C-CERAMIC, CHIP 0.009nF, 0.25pF, 50V, NP0, TP, 1005 2 2203-000425 C470 C-CERAMIC, CHIP 0.018 nF, 5%, 50V, NP0, TP, 1005 2 2203-005055 C512 C-CERAMIC, CHIP 0.0056nF, 0.25pF, 50V, NP0, TP, 1005 2 2203-005061 C122 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C126 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C134 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C160 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 8-13 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 2203-005061 C161 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C165 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C166 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C208 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C210 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C212 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C217 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C218 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C252 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C253 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C317 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C401 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C403 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C474 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C475 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C484 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C528 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 C598 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005061 R282 C-CERAMIC, CHIP 100nF, +80-20%, 16V, Y5V, TP, 1005 2 2203-005393 C448 C-CERAMIC, CHIP 0.005nF, 0.1pF, 50V, NP0, TP, 1005 2 2404-001017 C124 C-TA, CHIP 1uF, 20%, 10V, GP, TP, 2012, 2, 0 2 2404-001017 C520 C-TA, CHIP 1uF, 20%, 10V, GP, TP, 2012, 2, 0 2 2404-001086 C335 C-TA, CHIP 4.7uF, 20%, 6.3V, GP, TP, 2012, - 2 2404-001092 C323 C-TA, CHIP 220nF, 20%, 20V, GP, TP, 2012, - 2 2404-001100 C200 C-TA, CHIP 33uF, 20%, 6.3V, GP, TP, 3719, - 2 2404-001100 C202 C-TA, CHIP 33uF, 20%, 6.3V, GP, TP, 3719, - 2 2404-001100 C213 C-TA, CHIP 33uF, 20%, 6.3V, GP, TP, 3719, - 2 2404-001100 C250 C-TA, CHIP 33uF, 20%, 6.3V, GP, TP, 3719, - 2 2404-001100 C534 C-TA, CHIP 33uF, 20%, 6.3V, GP, TP, 3719, - 2 2404-001105 C153 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2404-001105 C201 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2404-001105 C318 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2404-001105 C412 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2404-001105 C435 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 SAMSUNG Proprietary-Contents may change without notice 8-14 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 2404-001105 C438 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2404-001105 C443 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2404-001105 C460 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2404-001105 C504 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2404-001105 C508 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2404-001105 C524 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2404-001105 C538 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2404-001105 C543 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2404-001105 C573 C-TA, CHIP 10uF, 20%, 6.3V, GP, TP, 2012 2 2703-000144 L506 INDUCTOR-SMD 180nH, 10%, 1.25x2x0.85mm 2 2703-000175 L421 INDUCTOR-SMD 270nH, 10%, 0.8x1.6x0.8mm 2 2703-000214 L422 INDUCTOR-SMD 470nH, 10%, 1.25x2x1.25mm 2 2703-000295 L580 INDUCTOR-SMD 220nH, 10%, 0.8x1.6x0.8mm 2 2703-000295 L581 INDUCTOR-SMD 220nH, 10%, 0.8x1.6x0.8mm 2 2703-001126 L403 INDUCTOR-SMD 270nH, 5%, 2.29x1.73x1.52mm 2 2703-001126 L505 INDUCTOR-SMD 270nH, 5%, 2.29x1.73x1.52mm 2 2703-001172 L401 INDUCTOR-SMD 100nH, 5%, 1.6x0.8x0.8mm 2 2703-001178 L512 INDUCTOR-SMD 3.3nH, 0.3nH, 1x0.5x0.5mm 2 2703-001190 L504 INDUCTOR-SMD 15nH, 5%, 1.6x0.8x0.8mm 2 2703-001222 L420 INDUCTOR-SMD 150nH, 10%, 1.6x0.8x0.8mm 2 2703-001263 L490 INDUCTOR-SMD 4.7nH, 10%, 1x0.5x0.5mm 2 2703-001285 L402 INDUCTOR-SMD 39nH, 5%, 1.6x0.8x0.8mm 2 2703-001285 L550 INDUCTOR-SMD 39nH, 5%, 1.6x0.8x0.8mm 2 2703-001512 L501 INDUCTOR-SMD 27nH, 5%, 1.8x1.12x1.02mm 2 2703-001514 L413 INDUCTOR-SMD 68nH, 5%, 1.8x1.12x1.02mm 2 2703-001701 L405 INDUCTOR-SMD 6.8nH, 10%, 1.0x0.5x0.5mm 2 2703-001708 L301 INDUCTOR-SMD 5.6nH, 10%, 1.0x0.5x0.5mm 2 2703-001708 L305 INDUCTOR-SMD 5.6nH, 10%, 1.0x0.5x0.5mm 2 2703-001727 L452 INDUCTOR-SMD 22nH, 5%, 1x0.5x0.5mm 2 2703-001752 L407 INDUCTOR-SMD 39nH, 5%, 1.0x0.5x0.5mm 2 2703-001752 L423 INDUCTOR-SMD 39nH, 5%, 1.0x0.5x0.5mm 2 2703-001769 L450 INDUCTOR-SMD 220NH, 5%, 2.0X1.25X1.2mm 2 2703-001953 L404 INDUCTOR-SMD 6.8nH, 5%, 1.0x0.5x0.5mm 2 2703-001953 L409 INDUCTOR-SMD 6.8nH, 5%, 1.0x0.5x0.5mm SAMSUNG Proprietary-Contents may change without notice 8-15 Electrical Parts List Level SEC CODE Design LOC ITEMS DESCRIPTIONS 2 2703-001956 L510 INDUCTOR-SMD 100nH, 5%, 1.6x0.8x0.8mm 2 2703-001969 L300 INDUCTOR-SMD 8.2nH, 10%, 1.0x0.5x0.5mm 2 2703-001969 L302 INDUCTOR-SMD 8.2nH, 10%, 1.0x0.5x0.5mm 2 2703-001969 L406 INDUCTOR-SMD 8.2nH, 10%, 1.0x0.5x0.5mm 2 2703-001969 L551 INDUCTOR-SMD 8.2nH, 10%, 1.0x0.5x0.5mm 2 2703-001970 L513 INDUCTOR-SMD 18nH, 5%, 1.0x0.5x0.5mm 2 2703-001938 L410 INDUCTOR-SMD 56nH, 5%, 1.0x0.5x0.5mm 2 2801-003747 X102 CRYSTAL-SMD .032768MHz, 30PPM, 28-ACM, 9PF, 2 2802-001104 X101 RESONATOR-CERAMIC 27MHz, 0.5%, TP, 2.5X2X1.2 2 2806-001200 OSC300 OSCILLATOR-VCO 967MHz, -, 50, TP, 3V, 8.5MA 2 2809-001225 U303 OSCILLATOR-VCTCXO 19.68MHz, 2.5PPM, 10KOHM//10PF, TP, 2 2904-001074 F403 FILTER-SAW 85.380MHz, 13KHz, +-13KHz/1.5dB, 2 2904-001171 F502 FILTER-SAW 836.5MHz, 25MHz, +-12.5MHz/2dB, TP, +- 2 2904-001172 F500 FILTER-SAW 836.5MHz, 25MHz, +-12.5MHz/1.5, TP, +- 2 2904-001173 F402 FILTER-SAW 881.5MHz, 25MHz, +-12.5MHz/2dB, TP, +- 2 2904-001174 F501 FILTER-SAW 130.38MHz, 1.26MHz, +-0.63MHz/1dB, TP, 2 2904-001236 F400 FILTER-SAW 85.38MHz, -, 0.8, TP, 9.4dB, - 2 2909-001094 F401 FILTER-DUPLEXER 881.5MHz, 836.5MHz, 3.5/1.6dB, TP, 824- 2 3301-001105 L304 CORE-FERRITE AB, 1.6x0.8x0.8mm, -, - 2 3301-001105 L306 CORE-FERRITE AB, 1.6x0.8x0.8mm, -, - 2 3301-001105 L307 CORE-FERRITE AB, 1.6x0.8x0.8mm, -, - 2 3301-001105 L400 CORE-FERRITE AB, 1.6x0.8x0.8mm, -, - 2 3301-001105 L411 CORE-FERRITE AB, 1.6x0.8x0.8mm, -, - 2 3301-001105 L412 CORE-FERRITE AB, 1.6x0.8x0.8mm, -, - 2 3301-001105 L502 CORE-FERRITE AB, 1.6x0.8x0.8mm, -, - 2 3301-001105 L507 CORE-FERRITE AB, 1.6x0.8x0.8mm, -, - 2 3301-001120 L500 CORE-FERRITE BEAD AB, 2.0x1.25x0.9mm, -, - 2 3705-001178 CN401 CONNECTOR-COAXIAL SMC, JACK, 100Mohm, 50ohm, .5DB 2 3710-001447 J1 CONNECTOR-SOCKET 40P, 2R, 0.5mm, SMD-S, AUF 2 3710-001510 CN101 CONNECTOR-SOCKET 18P, 1R, 0.5MM, SMD-A, AUF 2 3722-001456 CN402 JACK-PHONE 2P, 2.6PI, AuF, BLK, - 2 4709-001080 L303 RF POWER SPLITTER 2WAY, 955-979MHz, 12dB, -, TP 2 GH41-00102A PCB PCB-SCH-A105 SCH-A105, FR-4, 0.7T, 118 x 90, - 1 GH96-01124A EAR-MIC ELAETC-EARPHONE SCH-2000, SPRINT, USA, 20mW, 32ohm SAMSUNG Proprietary-Contents may change without notice 8-16 9. Block Diagrams SAMSUNG Proprietary-Contents may change without notice 9-1 10. PCB Diagrams 10-1 Main PCB Top View SAMSUNG Proprietary-Contents may change without notice 10-1 PCB diagrams 10-2 Main PCB Bottom View SAMSUNG Proprietary-Contents may change without notice 10-2 11. Circuit Diagrams 11-1 LOGIC Circuit Diagram 1 3 2 5 4 6 7 10 9 8 11 12 R187 4.7K I M D _C T L 3.0V 3.0V C187 10NF R101 100 R 1 02 47K R100 22K R1 0 3 10 0 DTR A A DP _ T X_ D A TA CTS CD R1 1 3 0 C1 0 3 47 0 P F R104 470 HP _ P WR R1 1 1 10 0 R106 100 R1 0 5 6. 8 K PS _ H OL D DP _ R X_ D A TA R1 1 2 10 0 K RI R108 100 R130 330 C106 1 0 0 PF Q100 R116 100K A L T _L E D R138 330 C1 1 0 1N F C1 1 1 27 P F R122 1.2K S V C _L E D 1 2 C115 10NF C _ R X_ I D (0 : 3 ) T X _ IQ _ D (0 : 7 ) 3.0V 3.0T R125 22K 4K 4L 3L 1N 3N 3K 1M 2N 7P 7M 8N 8L 1 1B 1 1C 1 2A 1 3A 1 2B 1 0B 1 0C 1 0D 1 1A 7N 1 0N 4N 1 0M 1 2P 1 0L R127 1K R128 6.8K C118 47NF C117 10NF C119 4 7 0 PF P A _ R0 R129 22K C T L _I N _ C H IP _ S EL E C T A L T _L E D MODE P C M _C L K P C M _S Y N C C O _ DO U T C O _ DI N C120 1NF D C T L _C L K A ( 2 0) R I N GE R R132 10K U 10 5 3.0V 2 3 4 VCC A1 WP 7 6 SCL 5 SDA A2 GND 1 4 8 A0 R175 750 2 6 R134 15K 5 X101 R 162 SCL SDA E 3.0V R135 1K P L L _D A T A P L L _C L K P L L _E N R 161 NC S E L 1_ P A _O N U101 C161 82NF 3.0V 2 1 C O N _S L E EP R160 51K 5 T P105 C160 1 0 0 NF SRT VCC1 4 C123 1 0 0 PF 3 1 D100 3 R139 10K C124 1UF 10V R143 2K 2 1 1 AD ( 0 :1 5 ) C A( 0 : 19 ) 13L 14L 11K 12K 13K 14K 11J 12J 13J 14J 11H 12H 13H 14H 13G 11G 14G 13F 14F 12G 11F 14E 13E 12F 14D 11E 13D 12E 14C 10E 13C 12D 14B 13B 12C 11D 11M 12N 13N 12L 14M 14N 11L 12M 1B 1C 2C 2H 7L AD(0 ) AD(1 ) AD(2 ) AD(3 ) AD(4 ) AD(5 ) AD(6 ) AD(7 ) AD(8 ) AD(9 ) AD(1 0) AD(1 1) AD(1 2) AD(1 3) AD(1 4) AD(1 5) F_WE 3. 0 V A(0) A(1) A(2) A(3) A(4) A(5) A(6) A(7) A(8) A(9) A(10 ) A(11 ) A(12 ) A(13 ) A(14 ) A(15 ) A(16 ) A(17 ) A(18 ) A(19 ) _RD 2F 2E 2D 2C 3E 3D 3C 3B 7B 7D 7E 8B 8C 8D 8E 9C 9F 4E 4D 7C A(1) A(2) A(3) A(4) A(5) A(6) A(7) A(8) A(9) A(10 ) A(11 ) A(12 ) A(13 ) A(14 ) A(15 ) A(16 ) A(17 ) A(18 ) A(19 ) A( 2 0 ) 2G 2H 3G 4B 4C 5B 5C R1 9 8 0 3. 0 V RE S O UT AD C _ DA T A _S B D T AD C _ CL K _ SB C K AD C _ EN A _ SB S T CH I P X8 EL _ E N C1 2 1 47 P F R1 4 4 10 0 6 4 5 3 1 C134 1 0 0 NF MIC R E E D_ S W V B A TT AGND 2 L E D _O N Z D 1 02 Q107 SPK+ SPK- 2 CD RI D P _ TX _ D AT A D P _ RX _ D AT A R148 3.3K R151 R150 R149 36 36 36 H 3. 0 V U1 02 A( 1 : 19 ) 1A 5A 6A 10 A 1B 6D 9D 1E 9E 10 E 1F 10 F 1K A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A1 0 A1 1 A1 2 A1 3 A1 4 A1 5 A1 6 A1 7 A1 8 A1 9 C1 5 3 10 U F 6. 3 V D CI O F CI O S CE 2 S RY / _ BY _W E SA R1 9 4 10 K 9G 6J 6C 5D 6B 8F 3H 4F 4J 5G 6G 7J 7F 8H 3J 4G 4H 5J 7H 7G 8J 8G 6 4 5 3 1 AD ( 0 :1 5 ) AD ( 0 ) AD ( 1 ) AD ( 2 ) AD ( 3 ) AD ( 4 ) AD ( 5 ) AD ( 6 ) AD ( 7 ) AD ( 8 ) AD ( 9 ) AD ( 1 0) AD ( 1 1) AD ( 1 2) AD ( 1 3) AD ( 1 4) AD ( 1 5) R1 9 6 10 K E 3F VS S 1 9H VS S 2 F 5K NC 1 4 6K NC 1 5 NC 1 6 10 K CN 10 1- 1 1 2 3 4 5 6 7 8 9 10 11 12 13 A L T _L E D _O N A(2) L C D _E DGND A D ( 0) A D ( 2) A D ( 4) A D ( 6) 1 1 3 3 5 5 7 7 9 9 1111 1313 1515 1717 1919 2121 2323 2525 2727 2929 3131 3333 3535 3737 3939 TX _ A UD I O 2 2 4 4 6 6 8 8 1 01 0 1 21 2 1 41 4 1 61 6 1 81 8 2 02 0 2 22 2 2 42 4 2 62 6 2 82 8 3 03 0 3 23 2 3 43 4 3 63 6 3 83 8 4 04 0 DP _ R X_ D A TA DP _ T X_ D A TA HP _ P WR RI CD V_ F VB A T T KEY3 VBAT T O N _ SW L E D _O N AG N D BU Z MO T O R 3. 0 V SV C _ LE D _ ON RE S O UT EL _ E N AD ( 1 ) AD ( 3 ) AD ( 5 ) AD ( 7 ) RT S VB A T T VB A T T CT S DT R 14 15 16 17 18 19 20 21 22 C600 68PF C601 68PF C602 68PF C603 68PF C604 68PF C605 68PF C606 68PF C607 68PF C608 68PF C1 2 6 10 0 N F GND HP_P WR DG N D C1 2 8 10 N F HP _ P WR RX DP _ R X_ D A TA TX DP _ T X_ D A TA C1 2 7 3. 3 N F En g i ne e r : CO MP AN Y C 6 09 6 8 PF TI T L E: R& D CH K : MF G EN G R C H K : Ch a n ge d by : M S J Da t e C h a ng e d : 4 5 6 7 SAMSUNG Proprietary-Contents may change without notice 11-1 8 9 2 0 0 0 .5 .4 10 H NA ME Ad d r es s Ci t y DO C CT R L C H K : 3 G C_ F V_ F VB A T T Dr a w n b y : Z D 1 03 2 R1 9 9 10 0 K A( 0 ) RX _ A UD I O 2 1 C1 5 1 10 0 P F VC C F 5H 6H VC C S DQ 0 DQ 1 DQ 2 DQ 3 DQ 4 DQ 5 DQ 6 DQ 7 _C E F DQ 8 _C E 1 S DQ 9 _O E DQ 1 0 _L B DQ 1 1 _U B DQ 1 2 _W P / AC C DQ 1 3 _R E S ET DQ 1 4 DQ 1 5 /A - 1 NC 1 NC 2 NC 3 NC 4 NC 5 NC 6 NC 7 NC 8 NC 9 NC 1 0 NC 1 1 NC 1 2 NC 1 3 C1 5 0 10 N F R1 4 5 22 K J1 C132 C135 C133 1NF 1NF 1NF 3 GA T E Q1 1 0 C_ F DTR CTS RTS 3 Q108 4 VB A T T R E E D_ S W R146 1K R147 22K R1 0 7 47 K 3 G C 1 2 9 C 1 3 6 C1 3 0 C1 3 1 C1 3 8 C1 3 9 C1 4 0 1 N F 1 N F 1N F 1N F 1N F 1N F 1N F R174 NC 3.0V ON _ S W_ S E NS E Q1 0 4 1 2 5 6 R1 8 5 27 K C1 2 5 10 0 P F 1 G 3 2 RT S Q106 3 2 2 B 1 3. 0 V SV C _ LE D 1 2 M O T OR C122 1 0 0 NF Q160 V B A TT R1 2 3 22 K VI N TC X O _N 5F 5J 6E 6K 9E 9K 10F 10J 2A 4C 3B 5C 4B 5D 4A 6C 5A 6D 5P 6L 5G 5H 6F 6G 6H 6J 7E 7F 7G 7H 7J 7K 8E 8F 8G 8H 8J 8K 9F 9G 9H 9J 10G 10H 8B 1D 2M 10A 8P 3.0V R E S OU T O N _ SW _ S EN S E J A C K_ S P S _ HO L D E L _ EN 1 3M 5B 7C 7A 8A 0 8C 9B 9C 9D 6B 7D 7B 9A 6M 6N 6P 8D 9M 1 1P 3A 6A 9P NC R1 1 8 10 0 K R1 2 4 4. 7 K TX _ C LK _T X _ CL K D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 _RD _LWR _HWR _RAM _CS1 _ROM _CS1 _ROM _CS2 _RAM _CS2 PA_O N2 ADC_ DATA _SBD T ADC_ CLK_ SBCK ADC_ ENA_ SBST CHIP X8 GPIO 22 U 10 4 C1 1 2 1N F R1 1 9 10 0 K ON _ S W FM _ C LK FM _ S TB C_ R X _I D ( 0) C_ R X _I D ( 1) V_ F _ CO N _S L E EP _I D L E F G N D _ R E SE T 3 VCC2 C 137 1 0NF R133 T P101 T P102 T P103 T P104 S YNTH _LOC K P A_ON P A_R0 P A_R1 T RK_L O_AD J T X_AG C_AD J R X_AG C_AD J L NA_R ANGE G PIO2 5 G PIO2 3 G PIO2 6 G PIO2 7 P CM_C LK P CM_S YNC P CM_D IN P CM_D OUT W DOGS TB_P CMSC S A UX_P CM_C LK A UX_P CM_S YNC A UX_P CM_D IN A UX_P CM_D OUT G PIO2 4 G PIO_ INT4 R INGE R X TAL_ IN X TAL_ OUT W DOG_ EN L NA_G AIN T MS T CK T DO T DI _ TEST G PIO1 4 G PIO1 5 G PIO1 6 G PIO8 G PIO9 G PIO1 0 G PIO1 3 G PIO1 9 G PIO2 0 G PIO2 1 G PIO1 2 _ RESI N R ESOU T K EYSE NSE4 G PIO7 G PIO_ INT0 C1 6 6 10 0 N F C1 1 4 10 N F C1 1 6 1N F TX_I QDAT A0 TX_I QDAT A1 TX_I QDAT A2 TX_I QDAT A3 TX_I QDAT A4 TX_I QDAT A5 TX_I QDAT A6 TX_I QDAT A7 C_RX _IDA TA0 C_RX _IDA TA1 C_RX _IDA TA2 C_RX _IDA TA3 C_RX _QDA TA0 C_RX _QDA TA1 C_RX _QDA TA2 C_RX _QDA TA3 NC0 NC1 GPIO 29 GPIO 30 GPIO _INT 1 GPIO _INT 2 _GP_ CS _CTS _RFR PDM1 PDM2 DP_T X_DA TA DP_R X_DA TA YAMN 1 SLEE P_XT AL_I N LCD_ E SLEE P_XT AL_O UT NC2 NC3 FM_R X_CL K FM_R X_ST B FM_R X_QD ATA FM_R X_ID ATA KEYS ENSE 3 GPIO _INT 3 MODE 0 MODE 1 TMOD E I_OF FSET Q_OF FSET _TX_ CLK TX_C LK TCX0 R582 10K LOCK P A _ ON R126 1K C1 1 3 27 P F VDD0 VDD1 VDD2 VDD3 VDD4 VDD5 VDD6 VDD7 KEYS ENSE 0 KEYS ENSE 1 KEYS ENSE 2 GPIO 0 GPIO 1 GPIO 2 GPIO 3 GPIO 4 GPIO 5 GPIO 6 GPIO 17 GPIO 18 GND0 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND1 0 GND1 1 GND1 2 GND1 3 GND1 4 GND1 5 GND1 6 GND1 7 GND1 8 GND1 9 GND2 0 GND2 1 GND2 2 GND2 3 GPIO 11 _SLE EP _IDL E LCD_ CS GPIO 28 C T R K _L O _ AD J T X _ AG C _ AD J R X _ AG C _ AD J R1 2 0 10 0 K R1 2 1 10 K 1L TX_I Q_D( 0) 3J TX_I Q_D( 1) 2K TX_I Q_D( 2) 1K TX_I Q_D( 3) 4J TX_I Q_D( 4) 3H TX_I Q_D( 5) 1J TX_I Q_D( 6) 2J TX_I Q_D( 7) C_RX _ID( 0) 1G C_RX _ID( 1) 2G C_RX _ID( 2) 3G C_RX _ID( 3) 4G C_RX _QD( 0) 1F C_RX _QD( 1) 2F 3F C_RX _QD( 2) 4F C_RX _QD( 3) 1A 1P 9N 5K 8M 9L 3M 5M 5N 2P 3P 4P 5L 4M 11N 13P 10K 14A 14P 2E 1E 3E 4E 5E KE Y 3 10P 2B 3C 4D TP10 6 3D C _ R X_ Q D (0 : 3 ) 1 1 R E E D_ S W 3 3. 0 V 2 Q_ O F FS E T R1 3 1 33 0 S V C _L E D _O N R1 1 5 10 0 K 3 C1 0 9 10 N F R1 1 7 1K Q103 LC D _ E B SE N D _E N D 1 2 Q1 0 2 X1 0 2 3 R1 8 8 10 0 K R1 0 9 10 K R1 1 0 1K I_ O F FS E T 3.0V 2D 4H 1H 2L A L T _L E D _O N C1 0 5 10 0 P F C108 1 0 0 PF C104 4 7 0 PF C107 1 0 0 PF C1 6 5 10 0 N F RE V : 2. 4 Tim e C h a ng e d : QA C HK : 11 Si z e : A2 S C H -A 1 0 5 LO G IC Dr a w in g 12 1 8 A Nu m b er : 12 Pa g e :1 Circuit diagrams 11-2 TX Circuit Diagram 2 1 3 4 6 5 3.0R V B A TT 7 8 9 11 10 12 3.0V D500 1 2 R500 1 3 0 K, 1 % A 3 A R501 1.8K S E L 1_ P A _O N V_ F R502 R505 2 2 K ,1 % C 5 00 1 0 NF 3.0V 2 31 32 33 34 A DC_D ATA_ SBDT A DC_E NA_S BST A DC_C LK_S BCK C511 1NF 42 43 4 T X_AG C_AD J TH1 R517 10K C513 2 . 2 NF R516 3 . 9 K, 1 % C530 1 0 0 PF C514 1 2 0 PF D502 R521 3 9 0 ,1 % 1 2 T XIF_ T XIF R515 41 1 8 K ,1 % C583 1 0 0 PF 3 . 0 BT C 21 9 47 45 40 23 6 3 .0 V 3.0B L502 T XVCO _T2 A DC_D ATA T XVCO _T1 V CONT ROLA DC_E NABL E L OCK_ DET P D_IS ET T XIF_ OUT/ P D_OU T T XIF_ OUT T CXO T X_CL K/ T X_CL K F M_MO D V DDM2 V DDM1 V DD5 V DD4 V DD3 V DD2 V DD1 T XD0 T XD1 T XD2 T XD3 T XD4 T XD5 T XD6 T XD7 10 48 44 39 22 7 5 3 1 U5 0 0 R506 C506 10NF C505 10NF 30 K , 5% ADC_ IN3 ADC_ IN2 A DC_C LK L501 27nH C512 5 . 6 PF S BI_E N S BDT_ FM/ S BSK_ IDLE / S BCK_ SEL2 G NDD G ND7 G ND6 G ND5 G ND4 G ND3 G ND2 G ND1 R5 0 7 27 0 R510 10K 3 2 Q500 R514 62K 3 4 2 LOCK 11 12 13 14 15 16 17 18 T X_IQ _D(0 ) T X_IQ _D(1 ) T X_IQ _D(2 ) T X_IQ _D(3 ) T X_IQ _D(4 ) T X_IQ _D(5 ) T X_IQ _D(6 ) T X_IQ _D(7 ) C518 NC _ T X _C L K T X _ CL K T X _ IQ _ D (0 : 7 ) R523 1.8K C533 1NF 5 L5 0 0 C5 0 9 10 N F RF I N RF O U T G G G G 10 1112 13 C546 10NF C539 1NF 3 . 0 BT R5 4 0 0 B TX O U TP U T 3 G L5 1 3 18 n H R5 3 3 10 0 K C5 1 6 10 N F Q5 1 0 3 3 1 1 2 L5 1 2 3. 3 n H R5 2 0 47 K C5 1 7 NC * PA _ R 0 3 2 Q 502 F5 0 0 C5 1 5 NC 1 5 C OU T G G G G _I D L E C5 2 5 1N F 6 4 3 1 IN 2 R5 2 5 47 C5 2 8 10 0 N F C5 3 2 10 N F C5 3 1 10 0 P F C536 1NF D F501 L505 2 7 0 nH 9 TXIF C543 10UF 6.3V 6 6 5 2 1 Q 511 C520 1UF 10V 8 R530 NC C541 10NF C549 10NF _ I D LE 2 C5 0 8 10 U F 6. 3 V C5 1 0 10 0 P F 6 R5 2 6 2K T X I F_ 5 EN 4 R EF_B YP 2 PA _ O N C5 2 9 10 0 P F IN- OUT+ IN+ F5 0 2 L506 1 8 0 nH 4 2 3 OUT- G1 G2 G3 G4 G5 G6 C5 8 1 10 0 P F 3 O UT G ND 7 R5 4 1 0 R5 8 1 1. 5 K R531 100K IN G2 5 3 . 0 BT R524 100K L5 8 1 22 0 n H 2 G1 R5 2 9 4. 7 K P D _ OU T R519 0 C5 8 0 10 0 P F C571 1 0 0 PF L507 1 S1 _ 2 S2 _ 2 7 3 VR E F GN D 1 1 Q5 0 1 R518 0 TCXO U 50 3 VIN S1 _ 1 S2 _1 8 3. 0 T 3.0T C540 10NF D2 VC C 2 GN D 2 9 VB A T T 2 0C 5 1 9 1 0 N F R 5 2 2 1 0 19 R5 8 0 1. 5 K C570 10NF D C538 10UF 6.3V D1 VC C 1 GN D 3 3. 0 T C523 1 0 0 PF L5 8 0 22 0 n H C522 10NF 4 4 24 36 37 38 35 GN D 4 8 V _ F _CO N 25 8 C524 10UF 6.3V C5 0 1 10 N F U5 02 1 26 C5 0 4 10 U F 6. 3 V 3. 0 T 1 TX _ I Q_ D ( 0: 7 ) P D _ OU T D NC ADC_ IN1 46 C507 1 2 0 PF D501 C 5 0 3C 5 0 2 1 0 N F1 0 N F 30 27 28 29 RBIA S B R512 10K R532 8.2K SEL1 _PA_ ON R508 100K C598 1 0 0 NF 30 K , 5% U 50 1 15 0 K ,1 % R 5 04 R 5 0 3 1 2 5 6 7 C5 4 4 1N F 10 C5 4 8 1N F 4 C300 1 0 0 PF 6 C5 5 2 10 0 P F E 2 3 IF - L5 0 4 15 n H 5 OU T VC C IF + RF - O UT 3 C5 4 2 2. 2 N F 8 R5 3 6 0 LO C5 4 7 1N F 1 GN D 1 GN D 2 C5 5 1 33 P F 1 3 4 6 7 LO B Y PA S S R5 3 7 27 0 L5 1 0 10 0 n H G G G G U5 04 1 3.0R IN C5 4 5 10 0 P F Q5 0 3 L5 5 1 8. 2 n H 5 L5 5 0 39 n H 2 4 E C301 10NF L300 8 . 2 nH 3.0R R3 2 0 27 o h m U300 1 2 C303 10NF C305 1 0 0 PF U301 F R F_IN C302 1 0 0 PF 4 G ND2 C304 1 0 0 PF 3 R X _ LO 1 4 R F_OU T G ND1 C306 1 0 0 PF 4 G ND2 R F_IN R302 100 2 L305 5 . 6 nH R300 0 2 C308 1PF C310 1 0 0 PF C312 1 0 0 PF R303 16 L306 R306 20 O S C 30 0 5 C318 10UF 6.3V V CC O UT C316 3 . 9 NF 5 VT R310 5.1K 2 3 17 D O_RF _ IF_I N I F_IN 20 G ND1 G ND2 G ND3 G ND4 G ND5 G ND6 G ND7 G ND8 G ND9 CLK FOLD EN C328 10PF DATA D OIF R313 0 C3 1 1 10 N F TR K _ LO _ A DJ 8 3. 0 B U3 0 3 C3 1 4 10 0 P F R3 0 5 10 3 2 14 15 12 2 3 OUT GND R3 0 9 2. 2 K T CXO_ IN R X_IN 18 R X _ IF _ I N R312 0 22 _ RX_I N C324 10NF C323 2 2 0 NF 20V 2 3 4 6 8 24 C317 1 0 0 NF G1 G2 G3 G4 G5 1 23 R308 0 C315 56PF C307 1NF C313 1 0 0 PF R304 16 7 G C320 10NF F L3 0 4 R301 10 6 C309 2PF 3.0R R307 10 3. 0 R L303 VP VP1 L302 8 . 2 nH R F_OU T VCC VCC1 C534 33UF 6.3V 3 G ND1 L301 5 . 6 nH 6 1 4 7 9 10 13 16 19 21 C3 1 9 10 0 P F 4 1 VCC R3 1 1 10 Q3 0 1 G VC 1 C3 2 1 10 N F C3 2 2 22 0 P F L3 0 7 C3 2 5 10 N F R3 3 0 2K U3 02 C3 2 7 10 0 P F C3 2 6 10 N F 3 11 PL L _ CL K TC X O 2 CO N _ SL E E P 1 Q3 0 2 R X _ IF _ D O PL L _ EN H C331 33NF C330 4 . 7 NF R314 910 C329 10NF C3 3 4 10 0 P F 3 4 5 6 7 SAMSUNG Proprietary-Contents may change without notice 11-2 8 9 Da t e C h a ng e d : TI T L E: R& D CH K : DO C CT R L C H K : MF G EN G R C H K : RE V : 2. 4 2 0 0 0 . 5 .4 Tim e C h a ng e d : Q A C HK : 10 11 NA ME Ad d r es s Ci t y Dr a w n b y : Ch a n ge d by : MS J 2 CO MP AN Y En g i ne e r : C3 3 3 10 0 P F C335 4 . 7 UF 6.3V 1 H PL L _ DA T A C3 3 2 10 0 P F S C H -A 1 0 5 TX Dr a w in g Nu m b er : 12 Si z e : A2 12 1 8 A Page : 3 Circuit diagrams 11-3 RX Circuit Diagram 1 3 2 4 5 6 7 8 9 10 11 12 R450 0 3.0R I M D _C T L C N 4 00 1 1 2 2 3 3 A N T CO N A L400 A L492 NC F4 0 3 3. 0 R Q400 L490 4 . 7 nH L491 NC 3 C N 4 01 C4 6 9 1N F C400 4 7 0 PF 1 L4 2 1 27 0 n H D401 F402 L406 8 . 2 nH 4 5 6 7 8 9 1 01 11 21 31 41 51 61 71 81 92 02 12 22 32 42 52 62 72 82 93 03 13 2 L404 6 . 8 nH G G G G G G G G G G G G G G G G G G G G G G G G G G G G G ANT C419 1NF Q402 RX 3 2 TX 2 F 401 C420 1NF L409 6 . 8 nH 4 R414 C428 1 0 0 K 0 . 5 PF L410 56nH C432 1NF C423 NC 1 3 C4 0 9 1N F L 4 52 2 2 nH C412 10UF 6.3V L402 39nH 2 IN OUT 4 1 VDD RF IF 5 L408 NC 1 3 4 6 C4 9 7 1N F 6 C4 1 8 30 P F 2 G ND 3 U 4 00 C430 1NF C431 NC L4 2 0 15 0 n H R4 16 22 0 2 6 4 5 C GND RF2 3 VB VA COM RF1 1 C4 2 2 9P F R441 100K C4 2 6 NC 10 IN + OU T + 5 9 IN - OU T - 4 L4 0 3 27 0 n H C4 2 1 (c o i l )N C C4 1 5 1N F RX I F _R X I F G1 G2 G3 G4 G5 G6 C4 2 4 18 P F 1 2 3 6 7 C4 2 5 1N F 8 R4 1 5 4. 7 3 C475 100N F 1 MO D E 2 C4 6 7 10 N F C474 100N F RX _ L O L4 1 1 C5 9 9 10 N F C U4 01 1 S E N D_ E N D R202 200K R204 2.2K 2 3 C204 NC 8 AOUT VCC A- BOUT A+ B- R201 120K 7 J A C K_ S C205 10NF 7 ENA OUTB 3 6 R205 100K MIC R203 100K 5 INB BYPB ENB GND C5 7 3 10 U F 6. 3 V 4 3 . 0 AV R207 3.3K E R208 1.5K C4 9 0 10 N F C206 10NF C4 9 1 10 0 P F 3 . 0 AV C208 1 0 0 NF C2 0 3 10 0 P F C4 3 6 10 0 P F C4 5 1 10 N F R4 8 547 0 K RX _ A GC _ A DJ 3. 0 V R4 1 9 33 K C210 1 0 0 NF _SLE EP 33 SPK+ SPK- C4 8 4 10 0 N F I NC 1 4 M C1+ GN D A MI C 3 - NC 1 5 MI C 3 + NC 1 6 2 C252 1 0 0 NF C218 1 0 0 NF 2 1 VC C A NC1 VC C P 1 3 . 0 AV NC 1 7 D200 NC 1 8 44 43 42 41 40 39 38 37 36 35 34 C216 NC NC2 C253 1 0 0 NF R210 1K 3 . 0 AV U 20 2 VLR6 3 VLR+ NC11 2 8 NC3 NC10 2 7 7 D201 C 274 NC 1 5 C220 NC R284 NC 8 LO GNDP 2 9 NC4 MCLK 10 FS DR 11 C O _ DI N NC9 SET F RXQD 3 RXQD 2 RXQD 1 RXQD 0 RXID 3 RXID 2 38 39 40 41 42 CH I P X8 C_RX _QD( 0:3) C_RX _QD( 3) C_RX _QD( 2) C_RX _QD( 1)C_RX _QD( 0:3) C_RX _QD( 0) 45 46 C_RX _ID( 3) C_RX _ID( 2) 48 C_RX _ID( 0) D C_ R X _I D ( 0: 3 ) TCXO CD _I FM MA _R XF _QD ATA_ RXID 0 CDMA _IF/ RM_R X_CL K FM_R X_ST B VCON TROL FM_R X_ID ATA_ RXID 1 FM_I F FM_I F/ GND1 GND2 SBCK _SLE EP/ GND3 SBST _IDL E/ GND4 GND5 SBDT _FM/ SBI_ EN GND6 FM_S LOT GND7 GND8 GND9 DNC GND1 0 1 2 47 FM _ C LK FM _ S TB C_RX _ID( 1) 3 5 8 13 16 18 19 23 34 43 E C217 1 0 0 NF RX _ I F_ I N R283 NC 1 VIN C219 0 R282 1 0 0 NF C440 10NF 2 C438 10UF 6.3V R4 2 0 10 0 K 3 IN L4 1 2 OUT C4 4 7 12 0 P F C4 4 1 10 N F EN REF_ BYP R4 2 6 10 K 5 GND D4 0 2 C4 4 3 10 U F 6. 3 V 4 26 F C4 3 9 1N F C4 4 4 10 N F C4 4 8 5P F L4 1 3 68 n H R4 2 7 10 K _ S L EE P 25 C4 4 5 10 N F P C M _C L K 24 C4 4 6 1N F R4 2 3 10 3. 0 R U4 0 3 RX _ I F_ D O D4 0 3 C4 5 6 12 0 P F P C M _S Y N C 23 C4 5 8 4. 7 N F NC 8 GN D DX CO VC C BZ CI CS - CC L K NC 6 3.0V NC 7 NC5 HIP X8 C 21 22 25 31 MIC2 + 30 MIC2 29 NC12 VFR+ VDD1 VDD2 VDD3 VDD4 VDD5 VDD6 VDD7 VDD8 VDDM M I C 1 -3 3 NC13 3 2 VFR3 4 T X _ AU D I O R X _ AU D I O 7 32 30 31 26 29 ADC_ CLK_ SBCK ADC_ ENA_ SBST ADC_ DATA _SBD T R 2 0 91 M 3 11 12 10 9 FM_I F C4 3 7 F M _ I F _ 10 0 P F C250 33UF 6.3V C251 3K 36 TC X O RX I F _R X I F C2 0 2 33 U F 6. 3 V C209 10NF R281 5.1K C211 NC * C212 1 0 0 NF C4 5 9 10 N F GATE R206 4.7K 4 6 14 15 17 20 24 35 44 C4 3 4 10 0 P F 3. 0 B 2 3 . 0 AV C207 2 2 0 PF C5 7 2 10 0 P F C4 3 3 10 N F I_OF C4 3 5 10 U F 6. 3 V 3. 0 V TCXO /N OUTA 1 6 B+ 5 4 GND C201 10UF 6.3V 8 INA RXVC O_OU T R200 10K D VIN RXVC O_T2 U200 RXVC O_T1 3. 0 V U201 Q_OF FSET 3 7 27 28 3 . 0 AV F L4 5 0 22 0 n H L4 0 7 39 n H (1 0 0 5) Q410 3. 0 B C 273 5 6PF F4 0 0 Q4 0 1 1 3 C200 33UF 6.3V C4 1 4 10 N F 3. 0 R C4 2 9 C4 9 5 10 N F 22 P F L4 0 5 6. 8 n H B U4 0 7 3 1 C4 7 3 NC LOSR C LO T X O UT P U T R417 47 C4 1 0 4. 7 N F 2 G G G G L423 39nH R4 0 8 15 0 , 1% C4 6 8 33 P F C416 10NF 5 L4 0 1 10 0 n H (c o i l) R4 1 0 10 K , 1% (1 % ) Q_ O F FS E T C413 NC R409 NC FM _ I F_ I_ O F FS E T C407 C408 47PF 1NF C411 20PF C215 NC FM _ I F C4 7 7 1N F C4 0 3 10 0 N F TC X O _N R4 0 7 10 C4 0 4 33 P F IN 1 2 OU T 4 C4 7 0 9P F C401 1 0 0 NF R405 2K B 5 4 IN G8 G7 G6 G5 G4 G3 G2 G1 10 8 7 6 5 3 2 1 6 GND4 GND3 5 GND2 4 3 GND1 C N 4 02 9 2 2 OUT 1 L4 2 2 C4 7 1 47 0 n H C4 7 2 NC 1N F 12 13 14 15 16 17 18 19 20 21 22 3. 0 A V U4 0 4 G R211 56K V B A TT 3 C462 10NF C460 10UF 6.3V 3.0V D202 2 1 VIN C O _ DO U T C T L _I N _ C H IP _ S EL E C T C T L _C L K IN OUT 5 2 GND 3 EN REF_ BYP 4 G C4 6 3 10 N F C2 1 3 33 U F 6. 3 V C4 5 4 10 0 P F C4 6 4 10 N F 1 GATE BUZ 1 3 1 R213 1K C4 6 5 22 0 P F 2 3 Q200 2 Q201 H CO MP AN Y En g i ne e r : Ch a n ge d 1 2 3 4 5 6 7 SAMSUNG Proprietary-Contents may change without notice 11-3 8 9 by :MS J Da t e C h a ng e d :2 0 0 0 . 10 5. 4 TI T L E: R& D CH K : DO C CT R L C H K : MF G EN G R C H K : Ti m e C h a ng e d QA : C HK : 11 H NA ME Ad d r es s Ci t y Dr a w n b y : RE V : 2. 4 SC H- A1 05 RX Dr a w i n g Nu m b er : 12 Si z e : A2 12 1 8 A Pa g e : 2