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G l o b a l Vo i c e I S O m o d e m - E V B
Evaluation Board for the Si2494/39/38/37/36/35/29/19/18/17
ISOModem
Description
Features
The Global Voice ISOmodem EVB evaluation board
provides the system designer with an easy way of
evaluating the ISOmodem. The Voice ISOmodem EVB
consists of a motherboard with a complete removable
daughter card
The Voice ISOmodem is a complete controller based
modem chipset with an integrated and programmable
direct access arrangement (DAA) that meets the global
telephone line requirements. It is available in a 24-pin or
38-pin system side device and a 16-pin line side device.
The hardware versions at the time of publication are:
This evaluation board includes the following:
 Socketed module with the modem chipset
 USB or asynch RS232 Serial Interface
 RJ11 connection to the phone line
 Onboard relay-excludable RJ11 connection
 RS232 and USB interface to the PC
 Direct access to the ISOmodem signals for
embedded system evaluation
 Power from a provided 8.5–13.5 V dc power supply
or from the USB port
 Handset connector (J1)
 Onboard hookswitch
 External hookswitch connector
 Jumper matrix that allows any handset wiring
scheme to work with this board
 Onboard speakerphone microphone
 RCA jack connector to an optional off-board
speakerphone electret microphone
 Selectable and adjustable electret power supplies for
both handset and speakerphone microphones
 Onboard 300 mW audio power amplifier (into a 4 
load) for driving either onboard or external speaker.
 Onboard voice coil driven loudspeaker for call
monitoring
 LED display of all RS232 signals
Voice Mother Board Si24xxVMB Rev 2.0
 Modem Daughter Card Si24xx2G-DC Rev 2.0
 Modem Daughter Card Si24xx2G-QFN38-DC Rev
1.0
The voice daughter card is populated with the correct
ISOmodem system side chip (Si2494/39/38/37/36/35/
29/19/18/17) and the correct line side DAA chip, the
Si3018 to suit the voice applications.

The ISOmodem eliminates the need for a separate DSP
data pump, modem controller, memories, codec,
isolation transformers, relays, opto-isolators and a 3-4
wire hybrid. The ISOmodem is ideal for embedded
modem and voice applications due to its small board
area, controller based architecture, low power
consumption and global compliance.
An onboard rectifier, filter, and voltage regulator allow
the power input to be 7.5–13 V ac or dc (either polarity)
supplied through a screw terminal (J8) or a standard
2 mm power jack (J9). Alternatively, power can be
supplied through the USB interface (whether the USB or
RS232 interface is used).
The Power Source Selection in automatic, while the
signaling port is selected by a jumper (JP23).
The evaluation board audio power amplifier can drive
an external speaker for either call progress monitoring
or speakerphone function. A small onboard speaker,
suitable for call progress monitoring, is installed.
Please note that fax modem versions listed in the title
require a software driver in order to implement fax send/
receive functionality. The driver must be compliant with
the Silicon Labs ISOmodem and with applicable ITU-T
standards (e.g., T.30, T.31, T.4 and T.6) Contact Silicon
Labs for details.
Rev. 0.4 8/11
Copyright © 2011 by Silicon Laboratories
Si24xxVMB-EVB
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Functional Block Diagram
As shown in Figure 1, the daughter card is a plug-in component with the complete modem, while the rest of the
motherboard provides selectable serial RS232 or USB links, the sound subsystem, and power regulation and
distribution.
I/O LED
Display
USB/RS232
Connectors
J11/J10
Power
Connectors
Interface
Logic
ISOmodem
Daughter
Card
Si2494/
Si2438
Series
ISOmodem
Sound
Subsystem
Call
Progress
Audio
PCM
Pwr
Amp
Si3000
Ext.
Speaker
JP11
Handset
RJ10
EXT.
Microphone
J2
Regulation
&
Switching
Silicon Labs
SI3018 DAA
LED Status
Display
On Board
Hook Switch
Exclusion
Relay
RJ 11
Telephone
Connector
RJ 11
Telephone
Connector
Loudspeaker
Figure 1. Functional Block Diagram
The voice ISOmodem EVB provides a sound system consisting of the Si3000 codec along with a handset RJ10
connector as well as onboard microphone and loudspeaker with options for these devices to be placed off-board.
The bias voltages for both the onboard microphone and the handset microphone can modified and alternate
sources used.
This allows the board to be used as a telephone or as a speakerphone as is, or to be integrated into the customer's
system.
The evaluation board can drive an external speaker or a small onboard speaker. For speaker-phone applications it
is recommended that an off board loudspeaker be used.
An onboard rectifier, filter and voltage regulator allow the power input to be 8.5 to 13.5 V peak ac or dc of either
polarity supplied through screw terminals (J8) or a standard 2 mm power jack (J9). Alternatively the power can be
supplied through the USB interface. Automatic switching is provided for the power, but not for the data interface.
That data interface is selected by JP23.
2
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
1. Global Voice ISOmodem EVB
The evaluation board is shown in Figure 2. Note the socketed daughter card with the modem chipset on the bottom
right of the board.
Figure 2. Global Voice ISOmodem Evaluation Board
The ISOmodem chip requires software driver in order to perform either FAX or sound functionality. Contact Silicon
Labs for details. “AN244: Si2438/37/36/35/29/19/18/17 Fax Modem Designer’s Guide” and “AN93: Si2494/93/57/
39/34/15/04 Data Modem Designer’s Guide” are useful for driver development.
The Global Voice ISOmodem EVB provides an RJ11 jack for interfacing to the phone line and the USB or serial
ports can interface to a PC or a host CPU. This allows the board to operate as a class 1 fax modem for an
evaluation or as a global voice and data modem (depending on the specific ISOmodem used).
A handset, microphone and speaker can also be attached to demonstrate the sound features, which may include
TAM and speaker-phone operations, depending on the specific ISOmodem chip used. Table 1 lists which
ISOmodem chips have these features. A software driver or application is required to perform these data and sound
operations. The included UltraCOM application can demonstrate the sound features of the ISOmodem and
provides a tool to aid development.
Rev. 0.4
3
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
2. Daughter Cards
There are two types of daughter cards available for this EVB. One supports the TSSOP version of the system side
chip, and the other supports the QFN38 version of the system side.
An example of the TSSOP version of the daughter card is shown in Figure 3. It has the ISOmodem system-side
chip as well as the Si3018 DAA chip. The left side of the board contains the system side while the right side
contains the DAA chip along with the few interface parts needed to connect tot a telephone line.
Figure 3. Daughter Card
Although this card is provided as part of the global voice EVB, it can also be directly connected to an embedded
system using TTL logic.
When run by a software driver the chipset on this daughter card is capable of making fax calls, telephone calls with
a handset, data calls and both. TAM and speaker-phone operations. Table 1 lists the various ISOmodem chips and
their features.
Table 1. ISOModem Features
4
Part Number
Fax
Data
Handset
TAM
Speaker
Phone
Si2417
≤V.17
—

—
—
Si2418
≤V.17
—



Si2419
≤V.17
≤V.32bis

—
—
Si2429
≤ V.29
—



Si2435
≤V.34
—

—
—
Si2436
≤V.34
—



Si2437
≤V.34
≤V.34

—
—
Si2438
≤V.34
≤V.34



Si2439
—
≤V.34



Si2494
—
≤V.92



Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
3. Setup and Evaluation
This section explains how to set up the Voice ISOmodem EVB for evaluation as an RS-232 or USB interface.
Jumper settings and system interconnections are given, as well as the use of an demonstration and test
application provided called UltraCOM.
See the following documents for additional technical details
Si2494/39/38/37/36/35/29/19/18/17 data sheets
“AN244: Fax Modem Designer's Guide"
 “AN93: Data Modem Designer’s Guide”
Diagrams and tables are provided here that define the operation of all the jumpers, settings and connectors, as
well as their default states.


A typical global voice EVB as it arrives from the factory can be connected into a system by using only four cables.
Figure 4. Global Voice ISOmodem EVB Connection
The UltraCOM application provided on the included CD can be used to demonstrate:
Telephone Operation.
 Speakerphone Operation
 Telephone answering machine operation.
Fax Operation can be demonstrated but requires a fax driver application.

Rev. 0.4
5
6
Rev. 0.4
JP33 Autobaud
enable
J10. DB9
connection to
Host if JP 23
selects it.
JP23 Selects USB
or RS232
operation but If
no jumper is in
place neither is
used and host
must connnect
via J103 to
connect
J11. USB
connection to Host
if JP 23 selects it.
J1. Handset
Connector
J2. Optional
mic. Input
connector
JP8. On board
mic. And
jumper to
enable it.
J6. Uart Signaling
options. Shown
for TSSOP and
QFN default
setup.
JP5. Mic.
fixed gain vs
adjustable
gain jumper
J30. Aux
Audio
connector
J103. Alternate signal
connection path to
host. Used if no
jumper is at JP23.
CMOS signaling
JP6, JP15, JP9.
Si3000 line in mixer
jumpers for :
microphone, AUX in
(J30), & AOUT
R13. Speakerphone mic gain
control
R24. Audio
power amplifier
gain control
T1, V1A, V1B, Y2A, Y2B, PSTN
protection devices. Alternate
footprints support most
possible configurations
JP24 Chooses
EEPROM operation
instead of Si3000 for
non QFN daughter
cards
Daughter Cards
(rev 2.0 TSSOP ,
or rev 1.0 QFN)
plug into J101,
and JP16. here.
JP12. On
Board
Power Amp
Enable.
T59, TP12,TP13.
Shunt Resistor and
test points for
current
measurements
JP10, JP7, JP13.
PWR Amp
input mixer
jumpers for :
AOUT, Si3000
line out, & AUX
IN (J30)
Figure 5. Function and Location of Global Voice ISOmodem EVB Jumpers
UART signal
LED
displays
and test
points
JP1, 2, 3, 4.
Jumpers that
configure
handset wiring to
any style. See
schematic for
details.
JP34 Enable
Exclusion Relay
(operated by RI
pin)
J5. PSTN RJ11
connection
J5. Telephone
RJ11 connection
JP11, Audio
power output.
Recommended
for speakerphone operation.
J8, J9. Alternate
power supply
connector
options.
LS1, On Board
Speaker.
JP14, On Board
Speaker enable
jumper
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
3.1. Jumpers
Figure 5 shows the function and location of the jumpers present on the global fax EVB.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Table 2 explains the use of the data related jumpers. It also shows the default state.
Check all jumper settings on the EVB before applying power.
These default data related jumper settings shown below configure the EVB for USB serial operation with auto baud
as a default. Any terminal emulator program configured to communicate through the virtual com port created by the
provided driver can be used to communicate with the EVB. There are no BAUD settings required since the modem
has an auto baud feature.
The USB virtual com port drivers needed for the USB link to work are on the provided CD.
Customers that want to use an RS232 port only need to change JP23 and connect an RS232 cable to the host. As
with the USB configuration, any terminal emulator program configured to communicate through a PC COM port
can be used to communicate with the EVB.
Although the user can exercise many of the modem commands (including voice features) using a terminal
emulator program, a fax driver is required to implement fax send/receive functionality.
This EVB also provides an application, UltraCOM distributed on the CD that can act as a terminal emulator and as
a sound feature demonstration vehicle. See Appendix I for an UltraCOM quick start guide that shows how to run
this demonstration.
Table 2. Digital Data Related Jumpers
Jumper Number
JP23
Pins Jumped
Default State
1–2

2–3
Comments
USB selected
UART selected
Typical Si2438/37/36/35/29/19/18/17 FT
setup (24 pin pkg)
J6
1-2, 4-5, 7-8, 10-11, 13-14
JP33
1-2
Disable Auto baud
1-2
Enable EEPROM
JP24
2-3


Rev. 0.4
Enable Si3000
7
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Table 3 explains the use of the analog audio oriented jumpers and adjustments, while showing the default state.
These jumpers and adjustments can be used to tailor the operation of the global fax EVB so that it interfaces well
with the users host system and provides the maximum flexibility as the choice of loudspeaker microphone and
alternate sources of sound.
Table 3. Sound Related Jumpers
Jumper
Number
Pins Jumped
JP34
1–2
JP1
1–2

Handset pin 4 connection (ground)*
JP2
1–2

Handset pin 3 connection (ground)*
JP3
4–5

Handset pin 2 connection (earpiece signal)*
JP4
2–3

Handset pin 1 connection (mouthpiece signal)*
JP24
JP5
Default
State
Comments
Enable Exclusion Relay
1–2
Enable EEPROM (factory use only)
2–3

Enable Si3000
1–2

Variable mic gain = 6 to 34 dB
3–3
Fixed mic gain = 21 dB
JP6
1–2
JP15
1–2
External Line In to input mixer
JP9
1–2
AOUT to input mixer
JP8
1–2
JP10
1–2
JP7
1–2
JP13
1–2
Aux Input to power amp mixer
JP14
1–2
On Board Speaker connected
JP12
1–2


Mic to input mixer
Connects on board mic
AOUT to power amp mixer


Si3000 line out to power amp mixer
Enable Pwr Amp.
*Note: For typical Cisco handset.
8
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
3.2. I/O and Adjustments
Table 4 explains the use of the adjustable analog audio-oriented controls as well as their default state.
Table 4. Audio Adjustments
Ref
Default State
R13
4 turns CW
R24
CCW(21.4 dB)
Comments
Mic Preamp Gain 6 dB to 34 dB
Power Amp Gain 21.4 dB to 46.4 dB WRT line out
3.3. USB Interface Data Link Setup Quick Start
1. Set jumpers according to the default configuration shown in Table 2 on page 7.
2. Connect:
Install USB cable and provided driver.
 RJ-11 to phone line or test box.
3. Open the terminal emulator program, and apply power to the EVB.

4. Select the serial COM channel used.
5. Type "AT" followed by a carriage return. (Autobaud automatically adjusts modem DTE speed and protocol.).
The modem should echo "AT" and then send the "OK" response code.
6. Type ATH1 and ATH0 to seize and release the telephone line.
3.4. UltraCOM Installation Instructions
Perform the following steps:
1. Double-click the ultracom.msi file to launch the installer. Click Next.
Figure 6. UltraCOM Setup Wizard
2. Accept the default installation path and click Next.
Rev. 0.4
9
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Figure 7. Select Installation Folder Dialog Box
3. Click Install to start the installation.
Figure 8. Install Dialog Box
10
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
4. After installation is complete, click Finish to close the installer.
Figure 9. Completing UltraCOM Setup Wizard
5. UltraCOM may be launched from the desktop link or from the Start menu:
Start Programs→UltraCOM→UltraCOM
6. From the UltraCOM main menu, select Help Index. This will load the help file.
7. Select the Quick Start link from the main menu and review the information.
Rev. 0.4
11
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Figure 10. Quick Start
3.5. USB Interface Data Link Setup Quick Start
1. Set jumpers according to the default configuration shown in Figure 5.
2. Install the USB driver for your operating system from the CD supplied with the evaluation board.
3. Connect:
USB cable to PC
RJ-11 to phone line or test box
4. Open the terminal emulator program.


5. Select one of the USB Virtual Com Port numbers in the emulator program's user interface.
6. Type "AT" followed by a carriage return. (Autobaud automatically adjusts modem DTE speed and protocol.).
The modem should echo "AT" and then send the "OK" response code.
7. Type ATH1 and ATH0 to seize and release the telephone line.
12
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
3.6. Sound Demonstration Using UltraCOM Quick Start Guide
Step 1: Perform the Quick Start USB Interface Data Link Setup Quick Start
1. Set jumpers according to the default configuration shown in Figure 5.
2. Install the USB driver for your operating system from the CD supplied with the evaluation board.
3. Connect:
USB cable to PC
RJ-11 to phone line or test box
4. Open the terminal emulator program.


5. Select one of the USB Virtual Com Port numbers in the emulator program's user interface.
6. Type "AT" followed by a carriage return. (Autobaud automatically adjusts modem DTE speed and protocol.).
The modem should echo "AT" and then send the "OK" response code.
7. Type ATH1 and ATH0 to seize and release the telephone line.
Step 2
Add connections to a loudspeaker and a handset as shown in the following diagram.
Figure 11. Sound Demonstration Hardware Interconnect Guide
Step 3:
1. Install UltraCOM (provided in this kit) on Windows XP
2. Launch UltraCOM.
Rev. 0.4
13
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Step 4:
Select "Terminal-Open" making sure the serial configuration is as shown (except for port selection), then select OK.
Figure 12. UltraCOM Serial Configuration Dialog Box
14
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Step 5:
1. Select Open Plug-In (The Green Icon) in the screen snapshot that follows.
2. Respond OK to "Load Plug-in" "24xx Voice Functions"
Figure 13. UltraCOM Load Plug-In Dialog Box
Rev. 0.4
15
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Step 6:
Wait for the screen below to open and the patch to load.
Figure 14. UltraCOM Plug-Ins Patch Load Phase
16
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Step 7:
Use the interface above to do the following:
Go off hook with the handset by selecting the handset symbol
Select the speakerphone button to start that mode.
 Dial a DTMF number.
 Note the following suggestions.


Use
the external off-board speaker for speakerphone functionality
the on-board electret for the microphone.
Use the PSTN, a PBX or a Line Simulator for the phone line.
Use
How to Change the Patch Used in the UltraCOM Plug-In
Figure 15. UltraCOM Plug-In Patch Changing
3.7. Power Requirements
The EVB has an onboard diode bridge, filter capacitor, and voltage regulators. Power can be supplied from the
USB connection or a source capable of providing 8.5–13.5 V dc or 6–9.5 VRMS peak ac and at least 300 mA. A
suitable wall mounted 9 V supply is provided with the kit.
Of the 300 mA required current 200 mA is used to drive the loudspeaker and may be removed from the
requirement if the power amp is enabled by placing a jumper on JP12.
Power may be applied to the Voice ISOmodem EVB through the screw terminals, J8, the 2 mm power jack, J9, or
the USB cable. The modem cable may be used to supply power even if the modem is configured for RS-232
operation.
The power consumed by the audio section is limited with an active limiter. This circuit will protect the power
sources when the sound is overdriven or if the amplifier output is shorted. The power amplifier is also naturally
protected with thermal limiting. Digital operations such as host to modem serial data transfer or the modem
telephone line operations are unaffected by the limiter operation.
Note that the modem will take power from wherever it finds it and that it is possible to use the RS232 port for
signaling and the USB for power or to use the USB for signaling and to provide power through the provided
external 9 V supply.
Rev. 0.4
17
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
3.8. EVB Part Numbers
The Voice ISOmodem evaluation boards are offered in multiple versions. The first four numbers indicate the
system-side device. The options include speed and various audio capabilities as well as package and temperature.
See Figure 16:
S i2 4 3 8 F T 1 8 -E V B
S i2 4 3 7 F T 1 8 -E V B
S i2 4 3 6 F T 1 8 -E V B
S i2 4 3 5 F T 1 8 -E V B
S i2 4 1 9 F T 1 8 -E V B
S i2 4 1 8 F T 1 8 -E V B
S i2 4 1 7 F T 1 8 -E V B
S i2 4 9 4 A F M 1 8 -E V B
S i2 4 3 9 A F M 1 8 -E V B
Figure 16. EVB Part Number Example
18
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
4. Voice ISOmodem EVB Functional Description
The Voice ISOmodem EVB is a multipurpose evaluation system. The modem daughter card illustrates the small
size and few components required to implement an entire controller-based modem with global compatibility. The
daughter card can be used independently of, or in conjunction with, the motherboard. The motherboard adds
features that enhance the ease of evaluating the many capabilities of the Si24xx ISOmodem.
4.1. Motherboard
The motherboard provides a convenient interface to the Si24xx ISOmodem DC (daughter card). The versatile
power supply allows for a wide range of ac and dc voltages to power the board.
A versatile digital IO system allows either a USB virtual com port to be used to interface to the board or an RS-232
transceivers with a DB9 connector allowing the EVB to be easily connected to a PC or other terminal device. A
jumper option allows direct access to the LVCMOS/TTL level serial inputs to the Si24xx, bypassing the RS-232
transceivers or USB interface. This is particularly useful for directly connecting the Si24xx to embedded systems.
The motherboard provides connectivity to a telephone line or a phone extension via a pair of RJ11connectors. The
extension connector may be actively excluded by an onboard relay.
A switch and a connector is provided on the motherboard that is read by the modem firmware and can perform the
hookswitch function.
The motherboard also contains a complete sound system including microphone, loudspeaker and handset
connector. The sound system includes easy to adjust gain controls and extra inputs that allow system generated
noises to be added to the sound.
A functional block diagram of the system as a whole can be seen below.
USB
Connector
J11
Direct Access Header
LED
Drivers &
Display
USB
Interface
CP2101
J103
Sound
Subsystem
J101
Call
Progress
Audio PWM
RXD, TXD, CTSb
JP23 jumper selects USB
vs. UART or neither
RS232
Connector
J10
RS232
Drivers &
receivers
MUX
CD,
RI,
DTR,
RTS,
DSR
Si24xx
ISOmodem
Optioning
Switch
Matrix
J6
PCM
Handset
RJ10
Si3000
Ext.
Speaker
JP11
EXT.
Microphone
J2
Silicon Labs
Si3018 DAA
ISOmodem
Daughter Card
JP16
RIb
Enabled
by JP34
Tip and Ring
Exclusion
Relay
RJ 11
Telephone
Connector
RJ 11
Telephone
Connector
Figure 17. Sound System Block Diagram
Rev. 0.4
19
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
4.1.1. Power Supply
4.1.1.1. Power Distribution
The power distribution diagram for the global voice EVB can be seen in Figure 18 below. Analog and Digital
voltages are separately regulated while the audio power amplifier supply is current limited to prevent accidental
overload and disruption of the digital supplies.
USB
Connector
J11
Switch
(2 diodes)
Current
Limiter
+(4-5)V Audio Pwr Amp
5 Volt
Regulator
3.3 Volt
Regulator
External
Power
Connector
J8
+5V Power
Rectifier
Bridge &
Capacitor
External
Power
Connector
J9
+3.3V Analog
5 Volt
Regulator
Switch
(2 diodes)
Manual
Reset Switch
3.3 Volt
Regulator
Reset
Generator
+3.3V Digital
Master Reset
Figure 18. Power Distribution Diagram
The onboard full-wave rectifier and filter ensure the correct polarity is applied to the Voice ISOmodem EVB.
Daughter card 3.3 V power is supplied through voltage regulator U3. Daughter card current can be measured by
connecting a DVM across R59, a 1  current sensing resistor in the 3.3 V supply line to the daughter card.
The input voltage to either J8 or J9 must be between 8.5 and 13.5 V dc, or 6 and 9.5 VPEAK ac. The motherboard
includes a diode bridge (D12) to guard against a polarity reversal of the dc voltage or to rectify an ac voltage. The
power source must be capable of continuously supplying at least 100 mA. The voltage regulator, U10, can provide
5 V for the motherboard and the input for voltage regulator U3, which outputs 3.3 V for use on the motherboard and
to power the daughter card. Alternately, power may be supplied to U3 through D11 from the USB port.
The power consumed by the audio section is limited with an active limiter. This circuit will protect both power
sources and the audio amplifier when the sound is overdriven or if the amplifier output is shorted. Digital operations
such as host to modem serial data transfer or the modem telephone line operations are unaffected by the limiter
operation.
Two indicator LEDs indicate main power (+5 V) and audio amp power (~+4.5 V). See Figure 15 for locations. You
will notice the one for the audio power blinking when audio is loud and clipping. This is normal.
20
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
4.1.2. Reset Circuitry
The Si24xx requires a reset pulse to remain low for at least 5.0 ms after the power supply has stabilized during the
power up sequence or for at least 5.0 ms during a power-on reset. Most production Si24xx modem chipset
applications require that RESET be controlled by the host processor. Certain Si24xx operation modes, including
power down, require a hardware reset to recover.
The Voice ISOmodem EVB contains two reset options, an automatic power-on reset device, U18 (DS1818)
(default), and a manual reset switch (S1) to permit resetting the chip without removing power. A reset, regardless of
the mechanism, causes all modem settings to revert to factory default values.
4.1.3. DS1818
The DS1818 is a small, low-cost device that monitors the voltage on VD and an external reset pushbutton. If VD
drops below 3.0 V, the DS1818 provides a 220 ms active-low reset pulse. On power up, the DS1818 also outputs
an active low reset pulse for 220 ms after VD reaches 90% of the nominal 3.3 V value. The DS1818 outputs a 220
ms reset pulse any time the power supply voltage exceeds the 3.3 V 10% window.
4.1.4. Manual Reset
The manual reset switch (S1) performs a power-on reset. This resets the Si24xx to factory defaults without turning
off power. Pressing S1 activates the reset monitor in the DS1818 and produces a 220 ms active low reset pulse.
4.1.5. Interface Selection
The serial interface of the Voice ISOmodem EVB can be connected to a computer, terminal, embedded system, or
any other data terminal equipment (DTE) via a standard RS-232 interface, USB interface, or through a direct TTL
serial interface.
At the heart of this capability is the MUX and the jumper that controls it: JP23.
Table 5. Board Configuration
JP23
Modem Signalling Done Via
X
Header, J103
1–2 Jumped
USB Port
2–3 Not Jumped
Serial Port
4.1.5.1. RS-232 Interface
The serial cable connects to J10 on the motherboard and provides a data link the PC or embedded host processor.
Moving the jumper on JP23 enables the RS232 interface or the USB interface.
The Maxim MAX3237 transceiver interfaces directly with the TTL levels available at the serial interface of the
Si24xx and, using internal charge pumps, makes these signals compatible with the RS-232 standard. The RS-232
transceiver on the Voice ISOmodem EVB can communicate at rates between 300 bps and 1 Mbps. This simplifies
the connection to PCs and other data terminal equipment (DTE).
The signals available on the Voice ISOmodem EVB serial interface (DB9 connector) are listed in Table 6 along with
the various signal names used and both connector pin numbers and ISOmodem package pin numbers.
Rev. 0.4
21
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Table 6. DB9 Pin Connections (J10)
J10 Name
J10 Symbol
J10 Pin
ISOmodem Pin
Number
ISOmodem
Signal Name
Carrier Detect
CD
1*
See Note*
DCD/EESD
Received Data
RXD
2
9
RXD
Transmit Data
TXD
3
10
TXD
Data Terminal Ready
DTR
4*
See Note*
ESC/RI
Signal Ground
SG
5
6
GND
Data Set Ready
DSR
6*
See Note*
INT/AOUT
Ready to Send
RTS
7*
See Note*
RTS/RXCLK
Clear to Send
CTS
8
11
CTS
Ring Indicator
RD
9*
17
RI
*Note: JP6 jumper option.
4.1.5.2. USB Interface
The USB cable connects to J11 on the motherboard and provides both data and power.
This operation mode uses the standard factory jumper settings illustrated in Table 2 on page 7.
Installing a jumper on J23 enables the USB interface and disables the RS-232 interface. The USB interface is
provided by U12. A USB driver for this chip is available for most PC and MAC operating systems on the CD.
4.1.5.3. Direct Access Interface
The direct access interface header (J103) can be used to connect the motherboard to an embedded system.
If J103 is used in this manner, it is necessary to remove the jumber from JP23 to disable both the RS-232 and USB
interface and prevent signal contention. See Table 5.
In this mode, the motherboard continue to supply a few other signals and functions such as power (derived from
J8, J9, or USB) as well as a power-on reset signal and the telephone line connection via the exclusion relay contact
and the RJ-11 jack connected to the modem line side.
J103 provides access to all the ISOmodem system side signals available on the daughter card.
If the user wishes to go further and use his embedded system's power supply or reset line, he can remove the
daughter card from the mother board and integrate it directly into his system.
22
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
4.1.6. Exclusion Relay
The exclusion relay (Figure 19) on the motherboard allows the modem to turn on the relay and exclude the phone
line connection from an auxiliary device such as a telephone connected to the second RJ11 socket. The relay is
enabled via jumper JP34.
The control signal used is the one called RIb and is managed by special command sequences (see application
notes AN93 or AN244). RIb goes low to turn on the relay via a driver transistor.
See the diagram below for the location of the connectors and the relay.
Note that the RIb signal must be kept high during the reset pulse, due to the use of this pin for special
manufacturing functions. This demands that this pin drive either an NMOS relay driver transistor or a 3.3 V
referenced buffer like the one used here.
Exclusion Relay Optional Footprints to be used if customer longitudinal surge voltage requirements exceed capability of exclusion relay. RJ11 connection to Telephone
RJ11 connection to PSTN
Optional Footprints to be used if customer has unusual metallic surge voltage requirements.
Figure 19. Exclusion Relay and Surge Protection
Rev. 0.4
23
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
4.1.7. Surge Protection Circuits
This evaluation board is designed to provide several possible levels of surge protection.
The ISOmodem alone does not need surge protection for a global implementation except for the components
normally selected and implemented on the daughter card. These are the P3100B sidactor and the Y2 caps used
for C1, C2, C8, and C9.
There are two basic reasons a customer may enhance this surge protection. The first is to protect the telephone
exclusion relay, which often does not meet the same surge capability of the Y2 caps, and the second is to meet
enhanced requirements put forth by customers and/or corporate guidelines.
Thus, footprints for either low-current 800 V or 1 kV high-current longitudinal GDTs are in place on the board (see
Figure 20) to protect either the typical 2.5 kV exclusion relay or the 5 kV capacitors on the daughter card. But, note
that the relay used on this motherboard is 5 kV rated (as are the capacitors) and does not need special protection.
Regardless of which GDT is used by the customer, it is required to stay at 1 kV or less to control stress on the
ISOmodem during the GDT arcing process.
For extra metallic protection where higher current surges are mandated, a GDT combined with a common-mode
choke acting as a delay element is recommended. The choke protects the Sidactor due to its leakage inductance,
allowing the metallic GDT to fire first. There are two possible GDTs shown in Figure 20, and the optimal one can be
chosen by the trading of cost for current carrying capacity. When populated with capable ceramic parts, the
motherboard and modem can survive 15 kV/ 2 , 1.2/50 µs combination waveform, i.e. 7.5 kA surge current.
Figure 20. Optional Surge Protection Enhancement Circuits
24
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
4.1.8. The Sound System
JP13
Aux In (JP30)
JP10
Mixer &
Jumpers
External
Speaker
JP11
Power Amp
JP7
AOUT
R24 sets gain,
JP12 enables
Line Out
Internal
Microphone
Filter
PWM
ISOmodem
PCM
Local
Speaker
Enabled
by JP14
Handset
Type
Matrix
JP1-4
Si3000
Handset
J1
JP8
SI3000 LINE IN (J30)
Line In
JP6
Mixer
JP5 & R13 set
gain
JP15
SPKR_L
Preamp
LINE_O
External
Microphone
J2
SPKR_R
JP9
JP30
Optional Connections
Figure 21. Sound System
The sound system on the board is centered around the Si3000 code chip shown in the above diagram, and is
designed to demonstrate handset operation as well as speakerphone and telephone answering machine
operation.
The Si3000 links to the ISOmodem via a PCM bus that allows the transfer of audio between the modem and the
various audio "peripherals" that the Si3000 links to the following:
Loudspeaker
 Handset microphone and speaker
 Microphone
 Line In
 Line Out
4.1.8.1. The Power Amplifier and Loudspeaker

The Power amplifier on the global Voice ISOmodem EVB can drive a 4  speaker with 300 mW of audio that has 3
possible sources:
Si3000 Line out
 Aux in, J30 signal SPKR_AUX_IN (e.g., a customer system's generated beeps or ticks)
 Call progress analog signal from modem. (ISOmodem's call dialing and negotiation tones)
The power amplifier itself is a low cost, rugged 3.3 V bridge device, the LM4862M. Similar parts are available from
other vendors.

The sources listed above can be independently turned off by jumpers JP7, 10, and 13 or be gain controlled with no
interaction, by changing the value of the summing node current injection resistors' values.
The inverted input of this chip is used as a summing junction for an audio mixer for the inputs mentioned above and
with gain control effected via the feedback resistor R24.
Rev. 0.4
25
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
The customer can change the resistor values when integrating the global Voice ISOmodem EVB to his system, but
should keep the RC formed by the 1 µF input caps at a 50 Hz or higher corner to avoid a thump on turn on.
The power amplifier is enabled by JP12. This jumper can also be tied to a host signal to allow the host to shut down
the amplifier.
4.1.8.2. The Call Progress Signal
The call progress tone discussed in this section comes from a PWM output pin on the ISOmodem. The PWM
signal is processed by a high-pass filter (see below).
When using this circuit it is important to extend the modem reset time to 10 ms. This is the time to charge C83 via
the built in weak pull ups in case that the modem has been operating prior to reset and has put the AOUT into a
PWM state that is 100% low. Any modifications to this circuit or reset time should be done keeping in mind the
following rule: The ISOmodem reset time and AOUT capacitive loading must be balanced so that the AOUT pin
must have time to charge it's load to a high state.
It should be noted that when creating the call progress output with this circuit, about half the noise present in the
audio bandwidth on the modem supply pins is passed along with the call progress tone. Consequently, the modem
supply needs to be fairly clean.
PWM Filter
Figure 22. High-Pass Filter
4.1.8.3. The Input Mixer
An input mixer is also in the sound section of the global fax EVB. It drives the line input of the Si3000 with a mixture
of the following possible sources:
An electret microphone
 An auxiliary line input, J30 signal (Si3000_LINE_IN)
 Call progress analog signal from modem. (ISOmodem's call dialing and negotiation tones)
4.1.8.4. The Speakerphone Electret Microphone

The electret microphone listed above is amplified by a preamp before this mixer. The gain of the microphone
preamp can be adjusted via a potentiometer if JP5 pins 1 and 2 are jumpered, or is fixed by R12 and R15 when
JP5 pins 2 and 3 are jumpered. It is intended for speakerphone use.
This electret microphone in this case can be either the microphone that comes installed on this board or an
external one connected to the RCA jack J2. There is a dedicated electret power supply available to power either of
these two microphones. The supply is configured so that it is easy for the user to adjust its voltage between 0 and
3.3 V by varying R27 and R30. This allows the user to most closely match the operation of his intended target. The
onboard electret is enabled by JP8.
26
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
4.1.8.5. The Handset
The handset signals are all processed by the Si3000 chip. The board provides a matrix of connectors to allow ANY
handset pin configuration to be used. This jumper array is shown in Figure 23. The default setting is shown in
Table 3 on page 8.
Microphone Signal
Earpiece Signal
Figure 23. Handset
Rev. 0.4
27
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
4.2. Daughter Cards
There are two types of daughter card; one is for QFN packaged modem chips, and one is for smaller packages.
The daughter card itself is a complete modem solution perfectly suited for use in an embedded system.
The daughter card requires a 3.3 V supply capable of providing at least 35 mA. Be sure to provide the proper
power-on reset pulse to the daughter card if it is used in the stand-alone mode.
The Voice ISOmodem EVB motherboard connects to the daughter card through two connectors, J101 and JP16.
JP101 is an 8x2 socket providing connection to all Si24xx digital signals and a regulated 3.3 V power.
The Si24xx digital signals and power also appear at JP103 and they are LVCMOS and TTL compatible. JP103 can
be used for monitoring purposes or may be used as the interface to the users host if JP23 has no jumper, thus
disabling the on board digital multiplexer. In this case note that the PCM link to the Si3000 is still in place and is still
connected to the daughter card signals.
JP16 is a 4x1 socket providing connection between the daughter card and both the RJ-11 phone jack and the
exclusion relay on the motherboard.
The daughter cards for this global Voice ISOmodem EVB come with the appropriate ISOmodem system side chip
installed and are identical otherwise. The possible ISOmodem system side chips are shown in Figure 24:
Si2438FT
Si2437FT
Si2436FT
Si2435FT
Si2419FT
Si2418FT
Si2417FT
Si2494FM
Si2439FM
Figure 24. ISOmodem System-Side Chip Part Number Scheme
The line side chip on the daughter card is the Si3018 DAA chip. It works with a few low cost discrete parts that
complete the telephone line interface.
Small 33 pF capacitors link the system side to the isolated side and provide both data and power transfer to the
isolated telephone line circuit.
The connection between the Si3018 chip and the telephone line is done via a diode bridge to control line polarity
and beads to control EMI.
A Sidactor is placed across the phone line for surge arresting reasons, while a pair of capacitors link the tip and
ring to system ground in order to minimize EMI radiation and EMI Susceptibility.
PCB layout for this circuit is somewhat critical, for link integrity, EMI, and surge reasons,. Anyone planning to
design a PCB layout should check application note AN244 or AN93 and also submit the PCB design to Silicon
Labs for checking. The layout used on this daughter card is shown in this user's guide.
28
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
4.2.1. Reset Requirements
The Voice ISOmodem daughter card must be properly reset at powerup. The reset pin (pin 8) of the Si24xx (J101,
pin 13) must be held low for at least 5.0 ms after power is applied and stabilized to ensure the device is properly
reset.
4.2.2. Crystal Requirements
Clock accuracy and stability are important in modem applications. To ensure reliable communication between
modems, the clock must remain within 100 ppm of the design value over the life of the modem. The crystal
selected for use in a modem application must have a frequency tolerance of less than 100 ppm for the combination
of initial frequency tolerance, drift over the normal operating temperature range, and five year aging. Other
considerations, such as production variations in PC board capacitance and the tolerance of loading capacitors,
must also be taken into account.
4.2.3. Protection
The Voice ISOmodem EVB meets or exceeds all FCC and international PTT requirements and recommendations
for high-voltage surge and isolation testing without any modification. The protection/isolation circuitry includes C1,
C2, C8, C9, FB1, FB2, and RV1. The PCB layout is also a key "component" in the protection circuitry. The Voice
ISOmodem EVB provides isolation to 3 kV. Contact Silicon Laboratories for information about designing to higher
levels of isolation.
4.2.4. Daughter Card Strapping and Jumper Options
Both types of daughter cards have some strapping options that are preconfigured at the factory. These are
explained in the schematic and in more detail in AN93.
The QFN daughter card also has a two jumper options. One, JP1, selects SPI operation, which is usable if the user
also does not use a jumper at JP23 on the motherboard and provides host SPI connectivity at J103. The other
jumper, JP2, enables the operation of the EEPROM chip, which is on the daughter card. There is an EEPROM chip
on the motherboard, which is only used with the TSSOP daughter card.
Rev. 0.4
29
681
681
R163
R42
"RS232"
"USB"
R41
R162
D53
10K
10K
D52
U13
RED
RED
JP23
JP1/3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Si24xx
CLKOUT/EECS/A0
SDO/EECLK_RTSb/D5
FSYNCH/D6
DCDb/D4
RTSb/D7
GND
RXD/RD
ESC/D3
TXD/WR
SDI/EESD/D2
CTSb/CS
RIb/D1
RESET
INTb/D0
VD
AOUT/INTb
Table NOT on silkscreen
1B2
2B2
3B2
4B2
1B1
2B1
3B1
4B1
1B2
2B2
3B2
4B2
1B1
2B1
3B1
4B1
Si2401
NC
GPIO1
GPIO5
GPIO2
NC
GND
RXD
GPIO3
TXD
NC
CTS
NC
RESET
NC
VD
GPIO4
15
1
4
7
9
12
0.1uF
15
1
4
7
9
12
0.1uF
RXD
TXD
CTSb
CD_M
ENABLE_MUXb
SELECT
OE
S
1A
2A
3A
4A
C72
+3.3V
OE
S
1A
2A
3A
4A
C71
+3.3V
BAV23A
D54
3
6
10
13
2
5
11
14
IDT74CBTLV3257
U14
3
6
10
13
2
5
11
14
IDT74CBTLV3257
Net names correspond to Si24xx.
See table for Si2401 equivalents
RS232
+3.3V
USB
RI_T
DTR_T
RTS_T
DSR_T
RI_U
DTR_U
RTS_U
DSR_U
RXD_T
TXD_T
CTS_T
CD_T
RXD_U
TXD_U
CTS_U
CD_U
To Host Interface Page
RESETb
R59
GND
GND
GND
GND
TP8
Turret
TP9
Turret
TP2
Turret
GND
R40
10K
TP7
Turret
TP25
Turret
+3.3V
RI_M
DTR_M
RTS_M
DSR_M
Select High Chooses B2 port
1.0
1uF
C69
RXD
TXD
CTSb
CD
RIb
RTSb
RTSb
DSRb
C70
560pF
1
19
2
3
4
5
6
7
8
9
ESC
NC
DCD
2401
SOIC16
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
U26
74LCX541
18
17
16
15
14
13
12
11
0.1uF
INTb
NC
C75
RIb
ESC
RTSb
NC
NC
DCD
DCD
ESC
24xx
TSSOP24
24xx
SOIC16
ESC
RIb
DCDb
2
4
6
8
10
12
14
16
TP23
TP22
TP21
TP20
TP19
TP17
TP16
TP24
R170
R169
R160
R159
R158
R157
R156
R155
HEADER 5x3
J6
Leaded
681
681
681
681
681
681
681
681
DSR
RTS
DTR
RI
CD
CTS
TXD
RXD
AOUT_INTb
D48
D47
D46
D45
D44
D43
D42
D41
+3.3V
AOUT/INTb
INTb
NC
RIb
15
RIb
FSYNCH
NC
24xx
SOIC16
CLKOUT_EECSb
FSYNCHb
ESC
SDI_EESD
RIb
INTb
AOUT_INTb
SDO_EECLK_RTSb
DCDb
INTb/AOUT
GPIO1
NC
RIb
NC
2401
SOIC16
JP6 Right Pin Signals
SDI/EESD
24xx
TSSOP24
RTSb
RIb
FSYNCHb
SDI_EESD
Si2401 16 pin
RIGHT
LEFT
DCD or nc
NC or RIb
ESC or NC
nc or GPIO1
nc or INTb/AOUT
"SDO_EECLK_RTSb"
"DCDb"
"GND"
"ESC"
"SDI_EESD"
"RIb"
"INT"
"AOUT_INTb"
ESC
SDI_EESD
RIb
INTb
AOUT_INTb
SDO_EECLK_RTSb
DCDb
12 SDO_EECLK_RTSb SDO/EECLK
9
6
3
"SOIC16: 1-2, 5-6, 7-8, 11-12, 14-15"
"TSSOP24: 1-2, 4-5, 7-8, 10-11, 13-14"
1
2
4
5
7
8
10
11
13
14
2
4
6
8
10
12
14
16
Silk Screen Text
1
3
5
7
9
11
13
15
Leaded
RS-232 Si24xx 24 pin
Si24xx 16 pin
RIGHT
LEFT
RIGHT
LEFT
CD
DCD or NC
DCD or SDI/EESD
RI
NC or RIb
RI or FSYNCH
DTR
ESC or NC
ESC or RIb
RTS
NC or RTSb
RTS or SDO/EECLK
NC or INTb
DSR INTb or AOUT/INTb
"Recommended J6 settings"
2
4
6
8
10
12
14
16
Leaded
1
3
5
7
9
11
13
15
2
4
6
8
10
12
14
16
J103
8X2 Shrouded Header
1
3
5
7
9
11
13
15
J101
HEADER 8x2
"CLKOUT_EECSb" 1
3
"FSYNCHb"
5
"RTSb"
7
"RXD"
9
"TXD"
11
"CTSb"
13
"RESETb"
15
"+3.3V"
"J6 Jumper Connectiveity"
+3.3V
CLKOUT_EECSb
FSYNCHb
RTSb
RXD
TXD
CTSb
RESETb
RTSb
RTS_M
INTb
DSR_M
DTR_M
RI_M
CD_M
Table on back
silkscreen for
J6
10K
CLKOUT_EECSb
FSYNCHb
RTSb
RXD
TXD
CTSb
RESETb
VCC_Modem
10K
R43
Figure 25. Motherboard Main Digital Logic
G1
G2
A1
A2
A3
A4
A5
A6
A7
A8
+3.3V
NC
NC
NOPOP
R39
C73
560pF
JP6 Left Pin Signals
+3.3V
1uF
C74
1
R49
10K
10K
JP33
1
Autobaud Dis.
2
SDO_EECLK_RTSb
SDI_EESD
R51
"SI3000 EN"
C33
R70
JP24
R87
0
0
+3.3V
IN1
IN2
IN3
IN4
NC1
NC2
NC3
NC4
Q1
COM1
COM2
COM3
COM4
R101
R60
CLKOUT_EECSb
SDI_EESD
FSYNCHb
V2A
10K
R91
1.5k
R85
8
10
0 NI
5
3
0 NI
200
10K
2
15
10
7
C35
6
5
2
1
10K
SCLK
MOSI
MISO
/CS
+3.3V
5
4
3
2
1
NOPOP
J7
5
4
3
2
1
/WP
/HOLD
+3.3V
0.1uF
3
7
D6
MMBD3004S-7-F
TP6
BLUE
TIP
TP5
BLUE
RING
7
8
9
10
11
12
1
2
3
4
5
6
J5B
RJ-11
PSTN LINE
J5A
RJ-11
TELEPHONE
Extra High Surge
Protection: Large
Ceramic GDT's
To Si3000 Codec on Voice
and Call Progress Page
SDI_EESD
FSYNCHb
SSI_CLKOUT
SSI_SDO
AOUT_INTb
To AOUT circuit on Voice
and Call Progress Page
+5V_RAW
Fujitsu FTR-C1GA4.5G
K1A
5 kV rated Relay
Pull Down Can
strap FSYNCHb to
GND enabling
EEPROM
R52
R84
1.5k
800V
GTCA28-801L-P05
NOPOP
V1B
350V
GTCA28-351L-P05
NOPOP
V2B
D5
EXCLUSION
+5V_RAW
U5
EEPROM 32K
U27
MAX4521
Q5
+3.3V
K1C
MMBTA06LT1
+3.3V
1
16
9
8
9
MMBT3906-7-F
0.1uF
3
14
11
6
K1B
R114
4
V1A
1000V
RA-102M-C6-Y
NOPOP
350V
RA-351M-C6-Y
NOPOP
R115
R113
10K
10K
Extra Surge
Protection:
Small Glass
GDT's.
R69
T1
3.3mH
NOPOP
SDO_EECLK_RTSb
CLKOUT_EECSb
Exclusion En.
JP34
+3.3V "EEPROM EN"
2
Leaded
JP16
4X1 Socket
T1 and GDT's may be
needed for unnusual
surge requirements.
For details contact the
factory.
4
1
From Power Supply Page
16
VCC
GND
8
16
VCC
GND
8
3
2
Connectors
for ISOModem
module.
13
V+
FB11
600 Ohm
BLM18AG601SN1
12
VL
V-
TP13
RED
Isense
20
VCC
GND
5
12
TP12
RED
+3.3V
GND
10
8
VCC
Rev. 0.4
4
1
-
GND
30
+
4
+3.3V
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
5. Motherboard and Daughter Card Schematics
AOUT_INTb
EXT MIC.
To MODEM
LCL. MIC.
MK1
EN. LCL MIC
RCA JACK
J2
RESETb
SDI_EESD
FSYNCHb
1
2
D3
0.1uF
C24
JP8
0.1uF
C25
R33
1K
2K
100uF
C17
0.1uF
C14
R21
MMBD3004S-7-F
0.1uF
C26
R34
1K
+
VGND
7
U20B
0.1uF
C27
R35
1K
R28
200
AD8602ARM
R10
4.7K
5.1K
VGND
U21B
AD8602ARM
7
1K
5
6
2
3
-
+
2
3
V-
1
R17
0.1uF
0.1uF
RESET*
HDST
0.1uF
JP6
JUMPER
JP9
1
JUMPER
JP15
1
JUMPER
1
Si3000
U2
C30
R2
2
2
2
MCLK
SDO Output
Input
SDI
FSYNC
SCLK
+3V3_A
9
3
7
5
4
6
8
R5
100K
0.1uF
C4
CAPS FOR AD8602ARM OPAMPS
C29
10K
C28
R25
10K
10K
5.5KHz
pole
SI3000_LINE_IN
R20
AD8602ARM
V+ U22A
V-
1
V+ U20A
49.9K
R15
560pF
D1
0
VGND
R19
2
3
-
+
C15
2.2nF
GND
11
15
1
16
10
V-
V+
1
AD8602ARM
U21A
1uF
C31
100K
R38
R37
100K
+3V3_A
+3V3_A
10K
power
Consumption
Here is 20
mA at 3.3
Volts
LINEI
LINEO
SPKR_R
SPKR_L
MIC_IN
2
GND
0.1uF
C3
MIC_BIAS
NI
6
5
-
+
7
C34
1uF
R31
10K
R44
3.01K
R29
3.01K
R22
499
1uF
1uF
JP13
JP10
JP7
C98
2
1
3
5
7
9
J30
2
4
6
8
10
2
4
6
8
10
10uF
JP12
1uF
1uF
4.7uF
1
2
3
4
LM4862
SHUTDOWN
BYPASS
IN+
IN-
U4
+4.5V
14KHZ pole
5X2 Shrouded Header
1
3
5
7
9
C8
0.1uF
C10
R7
Several footprint compatiple
variations of this amplifier are in
production allowing an easy price
vs power tradeoff. EG. LM4819.
0
R32
C37
2 C18
2
Pwr Amp Enable
C23
C22
1
1
1
D2
MMBD3004S-7-F
+3V3_A
High Pass set for 50 Hz Corner
SPKR_AUX_IN
SI3000_LINE_IN
SPKR_AUX_IN
VGND
C11
1uF
1uF
AD8602ARM
U22B
R11
2K
C7
0.1uF
C5
Figure 26. Motherboard Sound Processing Circuits
100K
R45
-
+
+3V3_A
R30
10M
C13
+3V3_A
AD8602ARM
VGND
324K
1uF
C20
10K
R4
EXT MIC IN
GAIN SEL
1-2 Variable
2-3 Fixed
R27
+3V3_A
VGND
100K
R36
5
6
JP5
0
R16
R18
100K
3 R14 1K
R12
R9
Si3000 Option Strapping
EXT MIC IN GAIN ADJ
CW: 34 dB
CCW: 6 dB
1
R13
0.1uF 50K
C12
+3V3_A
2
SSI_CLKOUT
SSI_SDO
2
1
8
4
12
VD
13
VA
GND
14
+3.3V
8
4
8
4
MMBD3004S-7-F
2
1
6
VDD
GND
7
VO2
VO1
C21
1uF
C19
2.2nF
R23
3.01K
2K
200
R3
8
5
2
C6
R6
2K
FB4
FB3
FB2
FB1
100uF
600 Ohm
600 Ohm
600 Ohm
600 Ohm
JP14
50K
"Pin 1"
ATT Ref Handset
Speaker at pins 2&3
Mic. in. is at pin 4
with GND at pin 1.
Cisco Ref Handset
Speaker at pins
2&3, Mic. in. is
at pin 1 and GND
is pin 4
En. Lcl. Speaker
SPEAKER
LS1
DIFF SPKR OUT
JP11
"Do not gound
speaker+ or
Speaker -
Gain WRT to Line
Out: CW/46.4 dB
CCW: 21.4 dB
R24
Pin 5
Pin 5
1
2
3
4
J1
Differing handsets can be accomodated
as shown in these two examples
+
EXT DIFF SPKR GAIN ADJ
"Pin 1"
JP1
JP2
JP3
JP4
3
1
+3V3_A
2
To MUX
+
-
+
-
Rev. 0.4
1
+3.3V
JP4
JP1
Pin 1
JP1
Pin 1
JP4
HANDSET
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
31
USB
SG
DTR(I)
TXD(I)
RXD(O)
RD(O)
CTS(O)
RTS(I)
9
8
7
6
R108
0
NOPOP
+V
DD+
GND
J11
USB Type B
1
2
3
4
0.01uF
C60
Keep Very Close
D14
600 Ohm
BLM18AG601SN1
FB9
RS-232, Female, Front View
5
4
3
DSR(O)
MH
MH
10
11
2
CD(O)
DB9
J10
D15
15V
DN1
0.1uF
C63
15V
DN2
15V
DN3
5
4
7
8
DD+
560pF
RST
RI
DCD
DTR
DSR
TXD
RXD
RTS
CTS
SUSPEND
SUSPEND
CP2102
REGIN
VBUS
U12
FB8
9
2
1
28
27
26
25
24
23
11
12
R112
10K
TXD_232
RTS_232
DTR_232
DSR_232
RD_232
CD_232
CTS_232
RXD_232
0.1uF
600 Ohm
BLM18AG601SN1
C53
C52
C62
0.1uF
C55
1uF
+3.3V
Figure 27. Motherboard Host I/O
0.1uF
C61
15V
DN4
15V
DN5
15V
DN6
GND
3
15V
DN7
15V
DN8
C57
C56
10K
R109
14
15
11
9
8
12
10
7
6
5
4
0.1uF
27
0.1uF
SHDN
MBAUD
R3IN
R2IN
R1IN
T5OUT
T4OUT
T3OUT
T2OUT
T1OUT
V-
V+
26
VCC
GND
2
1
C54
1uF
EPAD
SH
SH
6
5
6
VDD
Rev. 0.4
GND
10K
R111
MAX3237
EN
R3OUT
R2OUT
R1OUT
R1OUTB
T5IN
T4IN
T3IN
T2IN
T1IN
C2-
C2+
C1-
C1+
U11
13
18
20
21
16
17
19
22
23
24
3
1
25
28
C58
0.1uF
0.1uF
C59
10K
32
R110
+3.3V
RI_U
CD_U
DTR_U
DSR_U
TXD_U
RXD_U
RTS_U
CTS_U
VCC_USB
TXD_T
RTS_T
DTR_T
DSR_T
RI_T
CD_T
CTS_T
RXD_T
Output voltages:
CMOS, 0 and 5
Volts
input
threshold of
0.8 and 2.4
Volts
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4
7-12V AC/DC PWR
J9
3
2
1
7-12V AC/DC PWR
2
1
FB6
600 Ohm
FB7
-
600 Ohm
25V
0.01uF
C51
Bridge Rectifier
D12
0.01uF
25V
+
J8
C42
R105
R103
1.6
1.6
470uF
C45
+
R98
0.05
IN
OUT
GND
U10
LM2937ES-5.0
TO263-3N
OUT
GND
0.1uF
50V
C48
VCC_USB
IN
D9
R104
0.05
C39
10uF
D7
C49
10uF
D13
D11
STPS140Z
SOD-123
STPS140Z
STPS140Z
STPS140Z
SOD-123
+5V_RAW
C65
1uF
C43
1uF
IN
IN
R97
200
3.57
R96
MMBTA06LT1
Q4
OUT
GND
U1
LT1963A-3.3 V
SOT223
OUT
GND
U3
LT1963A-3.3 V
SOT223
200
R99
FCX1051ATA
Q3
+
R57
0.05
D50
RED
R1
0.05
C2
10uF
0.1uF
R161
C41
560uF
6.3V
C96
+3.3V PWR
C66
10uF
Figure 28. Motherboard Power Supply and Reset
470uF
C44
+
50V
0.1uF
C40
U8
LM2937ES-5.0
TO263-3N
3
2
RST
RESET
DS1818
GND
VCC
U18
681
1
S1
1.33K
R102
RED
D51
R100
1.33K
+4.5V
D49
C1
TP1
RED
+3V3_A
0.1uF
NOPOP
MMBD3004S-7-F
TP10
RED
+4.5V
+3V3_A
+3.3V
+4.5V
RESETb
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
33
Rev. 0.4
RESETb
RXD
TXD
CTSb
RTSb
C54
1uF
R18
FB5
12
CLKOUT_EECSb_AO
FSYNCH
RTSb
RXD
R110
200
TXD
R111
200
R112
200
CTSb
RESETb
C56
0.1uF
1.2K
3
8
9
10
11
CTSb
AOUT_INTb
FSYNCH
INTb
RIb
DCDb
CLKOUT_EECSb_AO
16
17
18
INTb
RIb
SDI_EESD
PKG_16.7 & PKG_24.11
PKG_16.11 & PKG_24.15
PKG_16.3 & PKG_24.4
PKG_24.16
PKG_24.17
PKG_16.15 & PKG_24.23
VDD
7
VDB 19
24
23
22
15
4
VDA
C53
0.22uF
SDO_EECLK_RTSb
DCDb
ESC
AOUT_INTb
FSYNCH
U12
1
3
5
7
9
11
13
15
2
4
6
8
10
12
14
16
10K
10K
10K
10K
1K
10K
13
SDO_EECLK_RTSb
DCDb
ESC
SDI_EESD
RIb
INTb
AOUT_INTb
1
2
Y3
27 MHz
C2A
C1A
OUT
VCC
3
4
VDD
C55
0.1uF
8
XTALI
No
Yes
Yes
No
Yes
No
No
No
No
No
Yes
Yes
No
No
No
X
X
Yes
No
Yes
No
No
No
No
Pin11
Pin3
Pin15
AOUT_INTb FSYNCH(RI) DCDb
R102
R103
R106
Pin7
CTSb
R101
C40
33pF
33pF
RESET
U13
Si24xx-16 pin
RIb
R120
9
NI
NI
These components are for
internal Silabs use only.
No
No
No
Yes
Yes
No
No
Yes
No
SPI 32 kHz
SPI 27 MHz
UART 32 kHz
SPI 4.9252 MHz
No
No
No
No
No
X
X
No
No
No
Yes
Yes
Yes
Pin16
Pin15
AOUT_INTb INTb
R102
R104
X
X
No
No
Yes
No
Yes
No
X
X
Yes
No
X
No
X
Yes
Pin17 Pin23
RIb
DCDb
R105 R106
32.768 kHz
4.9152 MHz
27 Mhz
Parallel 4.9152 MHz
Parallel 27 Mhz
UART 27 Mhz
UART 4.9152 MHz
UART 32.768 kHz
SPI
SPI
SPI
C2A
C1A
XTALO
2
10
XTALI
C52
0.1uF
1
SDI_EESD R121
C2A
C1A
XTALO
CLKIN/XTALI
C50
0.1uF
TSSOP24 System Side Strapping Table
No
No
Pin11
CTSb
R101
UART 27 MHz
UART 4.9152 MHz
SOIC16 System Side Strapping Table
VDD
RTSb_SPI_CSb
RXD_SPI_MISO
TXD_SPI_MOSI
CTSb_SPI_SCLK
DCDb
ESC
RIb
INTb
VA
Y1B
Y1
32.768KHz 4.9152MHz
XTALO
C41
RESETb
16
5
6
7
15
14
3
11
VDA 13
SDO_EECLK_RTSb
RXD
TXD
CTSb
DCDb
ESC
FSYNCH
AOUT_INTb
C51
0.22uF
Y1, Y1B & Y3 are alternate footprints and frequencies.
The Values of C40 & C41 vary. See The BOM.
GND
NC
XTALO
2
14
XTALI
1
2QO\RQH6\VWHPVLGHSDUWLV
VROGHUHGDWWLPH8RU8
Figure 29. Daughter Card (Si24xx2G-DC Rev 2.0) System Side
J1
SOCKET 8x2
1
3
5
7
9
11
13
15
R101
R102
R103
R104
R105
R106
2
4
6
8
10
12
14
16
C2A
RESET
C1A
RTSb/SPI_CSb/D7
RXD/SPI_MISO/RDb
TXD/SPI_MOSI/WRb
CTS/SPI_SCLK/CSb
XTALO
CLKIN/XTALI
Si2493
CLKOUT/EECSb/A0
INTb/D0
RIb/D1
SDI/EESD/D2
SDO/EECLK/D5
DCDb/D4
ESC/D3
AOUT/INTb
FSYNCH/D6
VDB
VDA
VDD
4
VDD3.3
5
21
VD3.3
VD 3.3
GND
GND
6
20
GND
34
12
:LUHVFRPPRQWR
SLQSDUWV
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
C2A
C1A
56.2
R13
56.2
R12
1M
R9
Bias
C2
C1
C6
10
7
4
6
5
0.1uF 0.1uF
C0603 C0603
C5
33pF
33pF
QB
DCT2
DCT3
DCT
RX
VREG2
14
2
3
R1
1.07K
8
9
1
12
13
16
20M
20M
2.49K
R4
2.7nF
I_GND
3.65K
R3
Z1
43V
0.01uF
C10
0.01uF
C3
+
-
I_GND
D1
HD04
Figure 30. Daughter Card (Si24xx2G-DC Rev 2.0) Line Side
Keep 5 mm creepage
rules between this DAA
section and all else.
I_GND
100K
R6
Place C3 near D1
Q3
MMBTA42LT1
Q2
MMBTA92LT1
Add 0.020 to 0.030 sq.
inches of Cu at all
transistor collectors
Ring Detect/CID/Voltage monitoring
100K
R5
Q1
MMBTA42LT1
Q4
MMBTA06LT1
No GND or I_GND
copper planes in DAA
section.
R7
R8
150
R2
73.2
R11
DC Term
536
R10
C4
1uF
C7
Q5
MMBTA06LT1
I_GND
RNG1
RNG2
QE
QE2
Si3018
VREG
IB
C2B
C1B
U2
IGND
15
Rev. 0.4
SC
+
11
1uF C4X
X8R 25V
C9
680pF
600 Ohm
FB1
600 Ohm
FB2
C8
680pF
R15
0
P3100SB
RV1
R16
0
TIP
RING
J2
TSM-104-01-T-SV
4X1 Header
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
35
AOUT
Rev. 0.4
VDD
C56
0.1uF
FB5
TPV7
TPV1
TPV2
TPV3
TPV4
TPV5
TPV6
EESDI
EESDO
EECS
EECLK
C2A
RIb
VDD
16
15
14
20
34
33
32
31
30
29
28
24
23
22
21
19
35
0
0
SDI
U1
Si2493
C1A
1
3
5
7
9
11
13
15
37
36
18
17
7
1
3
5
7
9
11
13
15
10K
10K
2
4
6
8
10
12
14
16
C50
JP1
JP2
C51
0.22uF
0.1uF
C0402
2
4
6
8
10
12
14
16
J1
SOCKET 8x2
XTALO
CLKIN/XTALI
C1A
C2A
VREG
Pin 2 FSYNCH R104
Pin 35 INTb
R101
CLKOUT
FSYNCH
RTSb_SPI_CS
RXD_SPI_MISO
TXD_SPI_MOSI
CTSb_SPI_SCLK
RESETb
RESET_
AOUT
AOUTb
GPIO11/A0
GPIO18/D0
GPIO17/D1
GPIO16/D2
GPIO25/D3
GPIO24/D4
EC/D5
DCD_/D6
UART_RTS_/SPI_CS_/D7
UART_TXD/SPI_MOSI/WR_
UART_RXD/SPI_MISO/RD_
UART_CTS_/SPI_SCLK/CS_
RIb
INT_
EESDI
EESDO
EECS
EECLK
FSYNCH_
CLKOUT
SDI
SDO
NC1
NC2
NC3
GPIO1
26
VDD
5
VDD
C1A
C2A
EE En
SPI En
INTb
AOUT
ESC
SDI
SDO
DCDb
XTALO
XTALI
0.1uF
C0402
C52
R123
R122
6
5
2
1
C57
0 GPIO1
0
RIb
0.1uF
3
No
No
RIb
DCDb
No
Yes
Pin 19
Pin 28
Yes
Y1C
Yes
No
Y1B
No
No
Y1A
Y1A
32.768KHz
XTALO
XTALI
Y1B
4.9152MHz
No
Yes
No
RIb
R102
R102
R103
No
No
Yes
DCDb
R103
C41 33pF
C40 33pF
The two Crystals are
alternate footprints and
frequencies. The values of
C40 and C41 are different at
the two frequencies. See The
BOM.
1K
10K
32.768 kHz
4.9152 MHz
27 Mhz
** R102 is 1k because
Voice motherboards use a
10 k pullup on RIb when
the exclusion relay driver
is enabled via the jumper.
3
7
VDD
/WP
/HOLD
VDD
OUT
4
0.1uF
VCC
SCLK
MOSI
MISO
/CS
Y1C
27 MHz
U3
EEPROM 32K
GND
NC
EECLK
EESDI
EESDO
EECS
2
1
C55
The 27 MHz oscillator is a
stand-in for a customer
provide system clock, saving
the cost of a crystal and two
caps.
Figure 31. QFN Daughter Card (Si24xx2G-QFN38-DC Rev 1.0) System Side
R120
R121
2
3
8
9
10
11
12
13
1.2K
R18
1
4
27
38
These components are for internal
Silabs use only.
C54
1uF
P13 RESETb
P16
ESC
DCDb
RTSb_SPI_CS
TXD_SPI_MOSI
RXD_SPI_MISO
CTSb_SPI_SCLK
RIb
INTb
P14
P8
P4
P5
P9
P7
P11
P12
FSYNCH
CLKOUT
SDI
SDO
P3
P1
P10
P2
GPIO1
GND
25
GND
6
8
VCC
GND
36
4
VDD
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
C2A
C1A
56.2
R13
56.2
C2
C1
1M
R9
Bias
33pF
33pF
C6
0.1uF 0.1uF
C0603 C0603
C5
10
7
4
6
5
Rev. 0.4
VREG2
I_GND
QB
DCT2
DCT3
DCT
RX
RNG1
RNG2
QE
QE2
Si3018
VREG
IB
C2B
C1B
IGND
15
R12
11
R1
1.07K
R7
R8
150
R2
20M
20M
R4
Q4
MMBTA06LT1
2.49K
100K
R5
3.65K
R3
Q1
MMBTA42LT1
I_GND
Ring Detect/CID/Voltage monitoring
73.2
R11
DC Term
536
2.7nF
Z1
43V
0.01uF
C10
Q3
MMBTA42LT1
Q2
MMBTA92LT1
0.01uF
C3
+
I_GND
100K
R6
Place C3 near D1
Hookswitch
-
I_GND
D1
HD04
FB2
C9
680pF
600 Ohm
FB1
600 Ohm
R15
0
P3100SB
RV1
C8
680pF
R16
0
No Ground Plane In DAA Section
Figure 32. Daughter Card (Si24xx2G-QFN38-DC Rev 1.0) Line Side
8
9
1
12
13
16
Q5
MMBTA06LT1
14
2
3
C7
R10
C4
1uF
1uF C4X
X8R 25V
+
SC
U2
Add 0.020 to 0.030 sq. inches of Cu at all
transistor collectors
TIP
RING
4X1 Header
TSM-104-01-T-SV
J2
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
37
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Figure 33. Motherboard Primary Side Component and Silkscreen View
6. Motherboard and Daughter Card PCB Layouts
38
Rev. 0.4
Figure 34. Motherboard Bottom Side Component and Silkscreen View
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4
39
Figure 35. Motherboard Primary Side Signal Layer
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
40
Rev. 0.4
Figure 36. Motherboard Layer 2 Ground Plane
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4
41
Figure 37. Motherboard Layer 3 Power Plane
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
42
Rev. 0.4
Figure 38. Motherboard Secondary Side, Signal Layer
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4
43
Figure 39. Daughter Card Primary Side, Component and Silkscreen
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
44
Rev. 0.4
Figure 40. Daughter Card Secondary Side, Component and Silkscreen
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4
45
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Figure 41. Daughter Card Primary Side
.
46
Rev. 0.4
Figure 42. Daughter Card Secondary Side
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4
47
Figure 43. QFN Daughter Card Primary Side, Component and Silkscreen
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
48
Rev. 0.4
Figure 44. QFN Daughter Card Secondary Side, Component and Silkscreen
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4
49
Figure 45. QFN Daughter Card Primary Side
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
50
Rev. 0.4
Figure 46. QFN Daughter Card Secondary Side
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Rev. 0.4
51
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
7. Bill of Materials
The following sections contain the bills of materials for the motherboard and daughter card.
7.1. Motherboard Bill of Materials
Table 7. MotherBoard Bill of Materials
Item
NI
Qty
Ref
Value
Rating
48
NI
3
R2, R114,
R115
0
1A
1
NOPOP
1
C1
0.1 µF
33
NOPOP
1
J7
2 mm, RT ANG
63
NOPOP
6
R39, R49,
R51
10 k
1/10W
71
NOPOP
1
R108
0
1A
77
NOPOP
1
T1
3.3 mH
90
NOPOP
1
V1A
1000 V
91
NOPOP
1
V1B
92
NOPOP
1
93
NOPOP
Type
PCB Footprint
Mfr Part Number
Mfr
ThickFilm
R0603
CR0603-16W-000
Venkel
X7R
C0402
C0402X7R100-104M
Venkel
SHROUDE
D
CONN1X5-S5B-PHSM4-TB
S5B-PH-SM4-TB
JST
ThickFilm
R0603
CR0603-10W-1002F
Venkel
ThickFilm
R0603
CR0603-16W-000
Venkel
TelCom
IND-CMC-7X8
750311349
Wurth/Midcom
1000V
GDT
GDT-RA-C6-Y
RA-102M-C6-Y
OKAYA
800 V
800V
GDT
GDT-450-6X8MM
GTCA28-801L-P05
Tyco
V2A
350 V
350V
GDT
GDT-RA-C6-Y
RA-351M-C6-Y
OKAYA
1
V2B
350 V
350V
GDT
GDT-450-6X8MM
GTCA28-351L-P05
Tyco
2
2
C2 C39
10 µF
10V
±20%
X7R
C1206
C1206X7R100-106M
Venkel
3
27
C3, C4, C5,
C10, C12,
C14, C24,
C25, C26,
C27, C28,
C29, C30,
C33, C35,
C53, C56,
C57, C58,
C59, C61,
C62, C63,
C71, C72,
C75, C96
0.1 µF
10V
±20%
X7R
C0402
C0402X7R100-104M
Venkel
4
2
C6, C17
100 µF
16V
±20%
Alum_Elec
C6.6X6.6MM
EEEFK1C101P
Panasonic
5
16
C7, C11,
C18, C20,
C21, C22,
C23, C31,
C34, C37,
C43, C54,
C55, C65,
C69, C74
1 µF
10V
±10%
X7R
C0603
C0603X7R100-105K
Venkel
6
3
C8, C49,
C66
10 µF
16V
±10%
X5R
C0805
C0805X5R160-106K
Venkel
7
4
C13, C52,
C70 C73
560 pF
16V
±10%
X7R
C0603
C0603X7R160-561K
Venkel
8
2
C15, C19
2.2 nF
16V
±10%
X7R
C0603
C0603X7R160-222K
Venkel
9
2
C40, C48
0.1 µF
50V
±10%
X7R
C0603
C0603X7R500-104K
Venkel
52
Voltage
10V
Tol
±20%
±1%
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Table 7. MotherBoard Bill of Materials (Continued)
Item
NI
Qty
Ref
Value
10
1
C41
11
3
12
Rating
Voltage
Tol
Type
PCB Footprint
Mfr Part Number
Mfr
560 µF
6.3V
±20%
Alum_Elec
C3.5X8MM-RAD
EEUFM0J561
Panasonic
C42, C51,
C60
0.01 µF
25 V
±10%
X7R
C0402
C0402X7R250-103K
Venkel
2
C44, C45
470 µF
25 V
±20%
Alum_Elec
C10.3X10.3MM
EMVE250ADA471MJ
A0G
United
Chemicon
13
1
C98
4.7 µF
6.3 V
±10%
X5R
C0603
C0603X5R6R3-475K
Venkel
14
8
DN1, DN2,
DN3, DN4,
DN5, DN6,
DN7, DN8,
15 V
225 mW
15 V
Zener, Dual
SOT23-AAK
MMBZ15VDLT1G
On Semi
15
7
D1, D2, D3,
D6, D14,
D15, D49
MMBD3004S-7-F
225 mA
300 V
DUAL
SOT23-AKC
MMBD3004S-7-F
Diodes Inc.
16
13
D5, D41,
D42, D43,
D44, D45,
D46, D47,
D48, D50,
D51, D52,
D53
RED
25 mA
1.9 V
SMT, ChipLED
LED-HSMX-C170
HSMC-C170
Avago
Technologies
17
4
D7, D9, D11,
D13
STPS140Z
1.0 A
40 V
Schottky
SOD-123
STPS140Z
ST MICRO
18
1
D12
Bridge
Rectifier
0.8 A
100 V
BRIDGE
MiniDIP4
HD01-T
Diodes Inc.
19
1
D54
BAV23A
400 mA
200 V
DUAL
SOT23-KKA
BAV23A
Diodes Inc.
20
9
FB1, FB2,
FB3, FB4,
FB6, FB7,
FB8, FB9,
FB11
600 
200 mA
SMT
L0603
BLM18AG601SN1
MuRata
21
4
HD5, HD6,
HD7, HD8
Screw
MH-125NP
NSS-4-4-01
Richco
Plastic Co
22
4
HW1, HW2,
HW3, HW4
Standoff
N/A
2397
SPC Technology
23
4
JP1, JP2,
JP3, JP4
Header 5x1
Header
CONN1X5-TSW
TSW-105-07-T-S
Samtec
24
3
JP5, JP23,
JP24
Header 1x3
Header
CONN-1X3
TSW-103-07-T-S
Samtec
25
9
JP6, JP7,
JP8, JP9,
JP10, JP12,
JP13, JP14,
JP15
Jumper
Header
CONN-1X2
TSW-102-07-T-S
Samtec
26
1
JP11
HEADER 4X1
Header
CONN-1X4
TSW-104-07-T-S
Samtec
27
1
JP16
4X1 Socket
Socket
CONN-1X4
SSW-104-01-T-S
Samtec
28
2
JP33, JP34
JUMPER
Unshrouded
CONN-1X2
68000-402
Berg
29
1
J1
RJ10 - Handset
Handset
RJ10-4P4C
806-GMX-N-44
Mouser
30
1
J2
RCA Jack
RCA
CONN-RCA-RCJ04X
161-0097-E
Kobiconn
Rev. 0.4
53
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Table 7. MotherBoard Bill of Materials (Continued)
Item
Qty
Ref
Value
Type
PCB Footprint
Mfr Part Number
Mfr
31
1
J5
RJ–11
RJ-11
RJ11-DUAL-MTJG
MTJG-2-64-2-2-1
ADAM
TECH
32
1
J6
HEADER 5x3
Header
CONN3X5
TSW-105-07-S-T
Samtec
34
1
J8
CONN TRBLK 2
TERM BLK
CONN-1X2-TB
1729018
PHOENIX
CONTACT
35
1
J9
Power Jack
BARREL
CONN-3-PWR
ADC-002-1
Adam Tech
36
1
J10
DB9
D-SUB
CONN-9-DBF
D09S33E4GX00LF
FCI
37
1
J11
USB Type B
USB
CONN-USB-B
292304-1
Tyco
38
1
J30
5x2 Shrouded
Header
Shrouded
CONN2X5-4W
5103309-1
Tyco
39
1
J101
HEADER 8x2
Header
CONN2X8
TSW-108-07-S-D
Samtec
40
1
J103
8x2 Shrouded
Header
Shrouded
CONN2X8-4W
5103309-3
Tyco
41
1
K1
Relay
HV
DPDT
RLY-TXS2SA
FTR-C1GA4.5G
Fujitsu
42
1
LS1
Speaker
0.5 W
Max
SPEAKERRE2308NL
RE-2308-NL
Regal
43
1
MK1
Microphone
MIC-6X2.7mm
CMC-2742PBJ-A
CUI Inc
44
2
Q1 Q4
MMBTA06LT1
500 mA
80 V
NPN
SOT23-BEC
MMBTA06LT1
On Semi
45
1
Q3
FCX1051ATA
2W
40 V
NPN
SOT89-BCE
FCX1051ATA
Zetex
46
1
Q5
MMBT3906-7-F
200 mA
40 V
PNP
SOT23-BEC
MMBT3906-7-F
Diodes Inc.
47
4
R1, R57,
R98, R104
0.05 
1/4 W
±5%
ThickFilm
R0805
LCR0805-R050J
Venkel
49
2
R3, R28
200 
1/10 W
±1%
ThickFilm
R0603
CR0603-10W-2000F
Venkel
50
16
R4, R17,
R19, R20,
R25, R31,
R40, R41,
R42, R43,
R52, R60,
R87, R91
R109, R110,
R111, R112,
R113
10 k
1/10 W
±1%
ThickFilm
R0603
CR0603-10W-1002F
Venkel
51
6
R5, R18,
R36, R37,
R38, R45
100 k
1/10 W
±1%
ThickFilm
R0603
CR0603-10W-1003F
Venkel
52
4
R6, R7, R11,
R21
2 k
1/10 W
±1%
ThickFilm
R0603
CR0603-10W-2001F
Venkel
53
2
R9, R32
0
1A
ThickFilm
R0603
CR0603-16W-000
Venkel
54
1
R10
4.7 k
1/16 W
±5%
ThickFilm
R0603
CR0603-16W-472J
Venkel
55
1
R12
5.1 k
1/16 W
±5%
ThickFilm
R0603
CR0603-16W-512J
Venkel
56
2
R13, R24
50 k
TRIM
POT-PV37W
PV37W503C01B00
Murata
57
5
R14, R16,
R33, R34,
R35
1 k
ThickFilm
R0603
CR0603-16W-1001F
Venkel
54
NI
Rating
Voltage
Tol
1A
1/16 W
±1%
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Table 7. MotherBoard Bill of Materials (Continued)
Item
NI
Qty
Ref
Value
Rating
58
1
R15
49.9 k
59
1
R22
60
3
61
Voltage
Tol
Type
PCB Footprint
Mfr Part Number
Mfr
1/16 W
±0.5
%
ThickFilm
R0603
CR0603-16W-4992D
Venkel
499 
1/10 W
±1%
ThickFilm
R0603
CR0603-10W-4990F
Venkel
R23, R29,
R44
3.01 k
1/16 W
±1%
ThickFilm
R0603
CR0603-16W-3011F
Venkel
1
R27
324 k
1/10 W
±1%
ThickFilm
R0603
CR0603-10W-3243F
Venkel
62
1
R30
10 M
1/16 W
±1%
ThickFilm
R0603
CR0603-16W-1005F
Venkel
64
1
R59
1
1/10 W
±1%
ThickFilm
R0603
CR0603-10W-1R00F
Venkel
65
2
R69, R70
0
10 A
0
Wire
RES-7MM
ZOR-12-R
Yageo
66
2
R84, R85
1.5 k
1/16 W
±5%
ThickFilm
R0603
CR0603-16W-152J
Venkel
67
1
R96
3.57 
1/10 W
±1%
ThickFilm
R0603
CR0603-10W-3R57F
Venkel
68
3
R97, R99,
R101
200 
1/10 W
±5%
ThickFilm
R0603
CR0603-10W-2000J
Venkel
69
2
R100, R102
1.33 K
1/10 W
±1%
ThickFilm
R0603
CR0603-10W-1331F
Venkel
70
2
R103, R105
1.6 
1/4 W
±5%
ThickFilm
R1206
CR1206-8W-1R6J
Venkel
72
11
R155, R156,
R157, R158,
R159, R160,
R161, R162,
R163, R169,
R170
681 
1/10 W
±1%
ThickFilm
R0603
CR0603-10W-6810F
Venkel
73
1
S1
SW
Pushbutton
50 mA
Tactile
SW4N6.5X4.5-PB
101-0161-EV
Mountain
Switch
74
4
TP1, TP10,
TP12, TP13
Red
Loop
Testpoint
151-207-RC
Kobiconn
75
5
TP2, TP7,
TP8, TP9,
TP25
Turret
Turret
TP[12594]
2551-2-00-44-00-0007-0
Mill-Max
76
10
TP5, TP6,
TP16, TP17,
TP19, TP20,
TP21, TP22,
TP23, TP24,
Blue
Loop
Testpoint
151-205-RC
Kobiconn
78
2
U1, U3
LT1963A-3.3 V
LDO
SOT223
LT1963AEST3.3#PBF
Linear Technologies
79
1
U2
Si3000
VOICE
CODEC
SO16N6.0P1.27
SI3000-KS
SiLabs
80
1
U4
LM4862
SO8N6.0P1.27
LM4862M
National
Semiconductor
81
1
U5
EEPROM 32K
Serial
TSSOP8N6.4P0.65
25LC320A-I/ST
Microchip
Technology
82
2
U8, U10
5
LDO
TO263-3N
LM2937ES-5.0
National
Semiconductors
83
1
U11
MAX3237
RS232
TSSOP28
MAX3237EIPWR
TI
12 Vdc
1.5 A
max
0.5 A
max
5.5 V
Rev. 0.4
55
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Table 7. MotherBoard Bill of Materials (Continued)
Item
NI
Qty
Ref
Value
84
1
U12
85
2
86
Rating
Voltage
Type
PCB Footprint
Mfr Part Number
Mfr
CP2102
MCU
QFN28N5X5P0.5
CP2102-GM
SiLabs
U13, U14
IDT74CBTLV3257
MUX
TSSOP16N6.4P0.65
IDT74CBTLV3257PG
G
IDT
1
U18
DS1818
SOT-23
DS1818-10
Dallas
Semiconductor
87
3
U20, U21,
U22
AD8602ARM
SOP8N4.9P0.65
AD8602ARM
Analog
Devices
88
1
U26
74LCX541
TSSOP20N6.4P0.65
74LCX541MTC
Fairchild
89
1
U27
MAX4521
TSSOP16N6.4P0.65
MAX4521CUE+
Maxim
3.3 V
Tol
10%
Buffer
Table 8. Motherboard Bill of Materials (Non-Populated Footprints)
Item
Qty
Reference
Value
Rating
91
3
R1,R73,R102
0R
92
2
R31,R32
10k
93
1
C10
10 uF
56
PCB Footprint
Manufacturer Part
Number
Manufacturer
1/16 W
RC0603
CR0603-16W-000T
Venkel
1/16 W ±5%
RC0603
CR0603-16W-103JT
Venkel
CC0805
GRM21BR71A106KE51L
Murata
10 V
Tol
±10
%
Dielectric
X7R
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
7.2. Daughter Card Bill of Materials
Table 9. Si24xx Daughter Card Bill of Materials
Item
Qty
Ref
Value
Rating
Voltage
Tol
Type
PCB Footprint
Mfr Part Number
Mfr
1
2
C1, C2
33 pF
Y2
250 V
±10%
Y2
C1808
SCC1808X330K502T
Holy Stone
2
1
C3
0.01 µF
250 V
±10%
X7R
C0805
GRM21BR72E103KW03L
Murata
3
1
C4
1 µF
50 V
±20%
Alum_Elec
C3.3X3.3MM
EEE1HS010SR
Panasonic
4
2
C5, C6
0.1 µF
16 V
±20%
X7R
C0603
C0603X7R160-104M
Venkel
5
1
C7
2.7 nF
50 V
±20%
X7R
C0603
C0603X7R500-272M
Venkel
6
2
C8, C9
680 pF
250 V
±10%
Y2
C1808
SCC1808X681K502T
Holy Stone
7
1
C10
0.01 µF
16 V
±20%
X7R
C0603
C0603X7R160-103M
Venkel
8
2
C40,
C41
18 pF
50 V
±5%
COG
C0603
C0603COG500-180J
Venkel
9
3
C50,
C52,
C56
0.1 µF
10 V
±20%
X7R
C0603
C0603X7R100-104M
Venkel
10
2
C51,
C53
0.22 µF
6.3 V
±10%
X5R
C0603
C0603X7R6R3-224K
Venkel
25 V
±10%
Y2
11
1
C54
1 µF
12
1
D1
HD04
0.8 A
13
3
FB1,
FB2,
FB5
600 
200 mA
14
1
J1
SOCKET 8x2
15
1
J2
4X1 Header_0
16
2
Q1 Q3
MMBTA42LT1
200 mA
300 V
17
1
Q2
MMBTA92LT1
100 mA
300 V
18
2
Q4 Q5
MMBTA06LT1
500 mA
19
1
RV1
P3100SB
20
1
R1
1.07 k
1/2 W
21
1
R2
150 
22
1
R3
3.65 k
400 V
X5R
C0603
C0603X5R250-105K
Venkel
BRIDGE
MiniDIP4
HD04-T
Diodes Inc.
SMT
L0603
BLM18AG601SN1
Murata
SOCKET
SOCKETX8-100-SMT
SSW-108-22-G-D-VS
Samtec
CONN1X4-100-SMT
TSM-104-01-T-SV
Berg
NPN
SOT23-BEC
MMBTA42LT1
On Semi
PNP
SOT23-BEC
MMBTA92LT1
On Semi
80 V
NPN
SOT23-BEC
MMBTA06LT1
On Semi
275 V
Sidactor
DO-214AA-NP
P3100SBL
Littelfuse
±1%
ThickFilm
R2010
CR2010-2W-1071F
Venkel
1/16 W
±5%
ThickFilm
R0603
CR0603-16W-151J
Venkel
1/2 W
±1%
ThickFilm
R2010
CR2010-2W-3651F
Venkel
23
1
R4
2.49 k
1/2 W
±1%
ThickFilm
R2010
CR2010-2W-2491F
Venkel
24
2
R5, R6
100 k
1/16 W
±5%
ThickFilm
R0603
CR0603-16W-104J
Venkel
25
2
R7, R8
20 M
1/8 W
±5%
ThickFilm
R0805
CR0805-8W-206J
Venkel
26
1
R9
1 M
1/16 W
±1%
ThickFilm
R0603
CR0603-16W-1004F
Venkel
27
1
R10
536 
1/4 W
±1%
ThickFilm
R1206
CR1206-4W-5360F
Venkel
28
1
R11
73.2 
1/2 W
±1%
ThickFilm
R2010
CR2010-2W-73R2F
Venkel
29
2
R12,
R13
56.2 
1/16 W
±1%
ThickFilm
R0603
CR0603-16W-56R2F
Venkel
30
2
R15,
R16
0
1A
ThickFilm
R0603
CR0603-16W-000
Venkel
31
2
R120,
R121
0
1A
ThickFilm
R0603
CR0603-16W-000
Venkel
32
1
R18
1.2 k
1/10 W
±5%
ThickFilm
R0603
CR0603-10W-121J
Venkel
33
4
R101,
R102,
R103,
R104,
R106
10 k
1/10 W
±5%
ThickFilm
R0603
CR0603-10W-103J
Venkel
34
1
R105
1 k
1/10 W
±5%
ThickFilm
R0603
CR0603-10W-102J
Venkel
Rev. 0.4
57
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Table 9. Si24xx Daughter Card Bill of Materials (Continued)
Item
Qty
Ref
Value
Rating
35
3
R110,
R111,
R112
200 
1/10 W
36
1
U2
Si3018
Voltage
Tol
Type
PCB Footprint
Mfr Part Number
Mfr
±5%
ThickFilm
R0603
CR0603-10W-2000J
Venkel
LineSide
SO16N6.0P1.27
Si3018-F-GS
SiLabs
ISOMODEM
300 V
37
1
U12
Si24xx
TSSOP24N6.4P0.65
Si2493-E-FT
SiLabs
38
1
U13
Si24xx
16pin SOIC
Si24xx
Silicon
Laboratories
39
1
Y1B
(Y1, Y3)
32.768 kHz
XTAL-3X8-LD
ECS–.327–12.5–8X
ECS
International
40
1
Z1
43 V
SOD-123
BZT52C43-7-F
Diodes Inc.
500 mW
43 V
Zener
Table 10. Daughter Card Bill of Materials (Non-Populated Footprints)
Item Qty
58
Reference
Value
Rating
Tol
Dielectric
PCB Footprint
Manufacturer Part
Number
Manufacturer
1
1
C50
0.1 µF
16 V
±20%
X7R
CC0603
C0603X7R160-104MNE
Venkel
2
2
C55,C56
0.1 µF
10 V
±20%
X7R
CC0603
C0603C124K
Kemet
3
1
R18
1.3 k
1/16 W
±5%
RC0603
CR0603-16W-132JT
Venkel
4
5
R19,R20,
R21,R22,R23
0
1/16W
±5%
RC0603
CR0603-16W-000J
Venkel
5
1
U4
Si2401
16pin SOIC
Rev. 0.4
Silicon Labs
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
7.3. QFN Daughter Card Bill of Materials
Table 11. Si24xx QFN Daughter Card Bill of Materials
Item
Qty
Ref
Value
Rating
Voltage
Tol
Type
PCB Footprint
Mfr Part Number
Mfr
1
2
C1, C2
33 pF
Y2
250 V
±10%
Y2
C1808
SCC1808X330K502T
Holy Stone
2
1
C3
0.01 µF
250 V
±10%
X7R
C0805
C0805X7R251-103K
Venkel
3
1
C4
1 µF
50 V
±20%
Alum_Elec
C3.3X3.3MM
EEE1HS010SR
Panasonic
5
2
C5, C6
0.1 µF
16 V
±20%
X7R
C0603
C0603X7R160-104M
Venkel
6
1
C7
2.7 nF
50 V
±20%
X7R
C0603
C0603X7R500-272M
Venkel
7
2
C8, C9
680 pF
250 V
±10%
Y2
C1808
SCC1808X681K502T
Holy Stone
8
1
C10
0.01 µF
16 V
±20%
X7R
C0603
C0603X7R160-103M
Venkel
9B
2
C40, C41
18 pF
50 V
±5%
COG
C0603
C0603COG500-180J
Venkel
10
5
C50, C52,
C55, C56,
C57
0.1 µF
10 V
±10%
X7R
C0402
C0402X7R100-104K
Venkel
11
1
C51
0.22 µF
10 V
±10%
X7R
C0603
C0603X7R100-224K
Venkel
12
1
C54
1 µF
25 V
±10%
X5R
C0603
C0603X5R250-105K
Venkel
13
1
D1
HD04
0.8 A
BRIDGE
MiniDIP4
HD04-T
Diodes Inc.
14
3
FB1, FB2,
FB5
600 
200 mA
SMT
L0603
BLM18AG601SN1
MuRata
15
2
JP1, JP2
JUMPER
Header
CONN-1X2
TSW-102-07-T-S
Samtec
16
1
J1
SOCKET 8x2
SOCKET
SOCKETX8-100-SMT
SSW-108-22-G-D-VS
Samtec
17
1
J2
4X1 Header
SMT
CONN1X4-TSM
TSM-104-01-T-SV
Samtec
18
2
Q1, Q3
MMBTA42LT1
200 mA
300 V
NPN
SOT23-BEC
MMBTA42LT1
On Semi
19
1
Q2
MMBTA92LT1
100 mA
300 V
PNP
SOT23-BEC
MMBTA92LT1
On Semi
20
2
Q4, Q5
MMBTA06LT1
500 mA
80 V
NPN
SOT23-BEC
MMBTA06LT1
On Semi
21
1
RV1
P3100SB
275 V
Sidactor
DO-214AA-NP
P3100SBL
Littelfuse
22
1
R1
1.07 k
1/2 W
±1%
ThickFilm
R2010
CR2010-2W-1071F
Venkel
23
1
R2
150 
1/16 W
±5%
ThickFilm
R0603
CR0603-16W-151J
Venkel
24
1
R3
3.65 k
1/2 W
±1%
ThickFilm
R2010
CR2010-2W-3651F
Venkel
25
1
R4
2.49 k
1/2 W
±1%
ThickFilm
R2010
CR2010-2W-2491F
Venkel
26
2
R5, R6
100 k
1/16 W
±5%
ThickFilm
R0603
CR0603-16W-104J
Venkel
27
2
R7, R8
20 M
1/8 W
±5%
ThickFilm
R0805
CR0805-8W-206J
Venkel
28
1
R9
1 M
1/16 W
±1%
ThickFilm
R0603
CR0603-16W-1004F
Venkel
29
1
R10
536 
1/4 W
±1%
ThickFilm
R1206
CR1206-4W-5360F
Venkel
30
1
R11
73.2 
1/2 W
±1%
ThickFilm
R2010
CR2010-2W-73R2F
Venkel
31
2
R12, R13
56.2 
1/16 W
±1%
ThickFilm
R0603
CR0603-16W-56R2F
Venkel
32
2
R15, R16
0
1A
ThickFilm
R0603
CR0603-16W-000
Venkel
Y2
400 V
Rev. 0.4
59
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
Table 11. Si24xx QFN Daughter Card Bill of Materials
Item
Qty
Ref
Value
Rating
33
1
R18
1.2 k
34
2
R101,
R104
36
1
38
Voltage
Tol
Type
PCB Footprint
Mfr Part Number
Mfr
1/16 W
±5%
ThickFilm
R0402
CR0402-16W-122J
Venkel
10 k
1/10 W
±5%
ThickFilm
R0603
CR0603-10W-103J
Venkel
R122
0
1A
ThickFilm
R0402
CR0402-16W-000
Venkel
1
U1
Si2494/39
ISOMODEM
QFN38N5X7P0.5
Si2494-A-FM/Si2439-AFM
SiLabs
39
1
U2
Si3018
LineSide
SO16N6.0P1.27
Si3018-F-GS
SiLabs
40
1
U3
EEPROM 32K
Serial
TSSOP8N6.4P0.65
25LC320A-I/ST
Microchip
Technology
41
1
Y1A
32.768 kHz
XTAL-3X8-LD
ECS–.327–12.5–8X
ECS
International
44
1
Z1
43 V
SOD-123
BZT52C43-7-F
Diodes Inc.
300 V
500 mW
43 V
Zener
Table 12. Si24xx QFN Daughter Card Bill of Materials (Non-Populated Footprints)
Item
Qty
Ref
Value
4
1
C4X
1 µF
9
2
C40, C41
33 pF
32B
2
R120,
R121
0
1A
34
1
R103
10 k
1/10 W
35
1
R102
1 k
1/10 W
36B
1
R123
0
1A
42
1
Y1B
4.9152 MHz
43
1
Y1C
27 MHz
60
Rating Voltage
Tol
Type
PCB Footprint
Mfr Part Number
Mfr
25 V
±10%
X8R
C1206
C3216X8R1E105K
TDK
50 V
±5%
COG
C0402
C0402COG500-330J
Venkel
ThickFilm
R0603
CR0603-16W-000
Venkel
±5%
ThickFilm
R0603
CR0603-10W-103J
Venkel
±5%
ThickFilm
R0603
CR0603-10W-1001J
Venkel
ThickFilm
R0402
CR0402-16W-000
Venkel
XTAL-HC49U-SMT
FOXSDLF/049-20
FOX
Electronic
FOX924B-27.000
FOX
3.3 V
XTAL OSC OSC4N5X3.2-FOX924
Rev. 0.4
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
8. Complete Design Package on CD
(See Sales Representative for Details)
Silicon Laboratories can provide a complete design package of the Voice ISOmodem EVB including the following:
OrCad Schematics
Gerber Files
Please contact your local sales representative or Silicon Laboratories headquarters sales for ordering information.


Rev. 0.4
61
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
DOCUMENT CHANGE LIST
Revision 0.2 to Revision 0.3






















62
Updated Table 3, “Sound Related Jumpers,” on
page 8.
 Corrected R13 adjustment information.
 Changed obsolete references, such as “JP5”.
 Updated Table 5, “Board Configuration,” on page 21.

Revision 0.1 to Revision 0.2
Updated Voice Motherboard description,
schematics, silkscreens, and configuration from 1.0
to 2.0 revision.
Updated Daughtercard description, schematics,
silkscreens, and configuration.
Added support for Si2494/39 voice and data
modems.
Updated "Description" on page 1.
Updated "2.Daughter Cards" on page 4.
Added "4.1.7.Surge Protection Circuits" on page 24.
Updated "4.1.8.2.The Call Progress Signal" on page
26.
Updated "4.2.Daughter Cards" on page 28.
Added "4.2.4.Daughter Card Strapping and Jumper
Options" on page 29.
Added "7.3.QFN Daughter Card Bill of Materials" on
page 59.
Added "8.Complete Design Package on CD" on
page 61.
Updated Figure 5, “Function and Location of Global
Voice ISOmodem EVB Jumpers,” on page 6.
Updated Figure 29 on page 34.
Added Figure 31, “QFN Daughter Card (Si24xx2GQFN38-DC Rev 1.0) System Side,” on page 36.
Added Figure 32, “Daughter Card (Si24xx2GQFN38-DC Rev 1.0) Line Side,” on page 37.
Added Figure 43, “QFN Daughter Card Primary
Side, Component and Silkscreen,” on page 48.
Added Figure 44, “QFN Daughter Card Secondary
Side, Component and Silkscreen,” on page 49.
Added Figure 45, “QFN Daughter Card Primary
Side,” on page 50.
Added Figure 46, “QFN Daughter Card Secondary
Side,” on page 51.
Updated Table 2, “Digital Data Related Jumpers,” on
page 7.
Added Table 11, “Si24xx QFN Daughter Card Bill of
Materials,” on page 59.
Added Table 12, “Si24xx QFN Daughter Card Bill of
Materials (Non-Populated Footprints),” on page 60.
Added
missing jumper information.
Revision 0.3 to Revision 0.4

Rev. 0.4
Updated "3.3.USB Interface Data Link Setup Quick
Start" on page 9.
Removed
JP5 reference.
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
NOTES:
Rev. 0.4
63
Si2494/39/38/37/36/35/29/19/18/17FT18-EVB
CONTACT INFORMATION
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
Tel: 1+(512) 416-8500
Fax: 1+(512) 416-9669
Toll Free: 1+(877) 444-3032
Please visit the Silicon Labs Technical Support web page:
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx
and register to submit a technical support request.
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from
the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features
or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to
support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.
Silicon Laboratories, Silicon Labs, and ISOmodem are trademarks of Silicon Laboratories Inc.
Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders.
64
Rev. 0.4