Download LCD TV SERVICE MANUAL

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LCD TV
SERVICE MANUAL
CHASSIS : LP91A
MODEL : 42LH20R
42LH20R-MA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION .................................................................9
TROUBLE SHOOTING ............................................................................14
BLOCK DIAGRAM...................................................................................17
EXPLODED VIEW .................................................................................. 18
SVC. SHEET ...............................................................................................
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-2-
LGE Internal Use Only
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by
in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.
AC Volt-meter
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
To Instrument's
exposed
METALLIC PARTS
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-3-
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
0.15uF
1.5 Kohm/10W
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1 Ω
*Base on Adjustment standard
LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
-4-
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-5-
LGE Internal Use Only
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
3. Test method
This spec sheet is applied to LCD TV used LP91A chassis.
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC
2. Specification
Each part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity : 65±10%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
4. Electrical specification
4.1. General Specification
No
Item
Specification
1
Screen Size
2
Aspect Ratio
16:9
3
LCD Module
42” TFT WXGA LCD
4
Operating Environment
Temp.: 0 ~ 40 deg
Measurement
42” wide Color Display Module
Remark
Resolution : 1366*768
Humidity : 0 ~ 85 %
5
Storage Environment
Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6
Input Voltage
AC100-240V~, 50/60Hz
≤ 200 W
42” HD
7
LDC Module
HD
983 x 576 x 46
(Maker : LGD)
Unit : mm
0.227 x 0.681
18 EEFL
Coating
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3H
-6-
LGE Internal Use Only
5. Chroma& Brightness (Optical)
5.1. LCD Module
the Color Coordinates check condition
- 50cm from the surface, Full White Pattern
- Picture mode Vivid
No.
Item
1.
Luminance
2.
VIew angle (R/L, U/D)
3.
Color Coordinates
Min.
Typ.
400
500
Max.
cd/m2
Unit
178 / 178
degree
Maker
Remark
(W/O PC mode)
White
RED
Green
Blue
4.
Contrast ratio
5.
Luminance Variation
Wx
Typ
0.279
Typ
Wy
-0.03
0.292
+0.03
Xr
0.637
Yr
0.335
Xg
0.290
Yg
0.611
Xb
0.145
Yb
0.062
800:1
LGD
LGD 42”(HD)
LC420WXE-SBA1
1200:1
1.3
6. Component Video Input (Y, PB, PR)
Specification
No
Resolution
Remark
H-freq(kHz)
V-freq(Hz)
59.94
Pixel Clock(MHz)
1
720* 480
15.73
13.500
SDTV, DVD 480I( 525I)
2
720* 480
15.75
60.00
13.514
SDTV, DVD 480I( 525I)
3
720* 576
15.625
50.00
13.500
SDTV, DVD 576I( 625I) 50Hz
4
720* 480
31.47
59.94
27.000
SDTV 480P
5
720* 480
31.50
60.00
27.027
SDTV 480P
6
720* 576
31.25
50.00
27.000
SDTV 576P 50Hz
7
1280* 720
44.96
59.94
74.176
HDTV 720P
8
1280* 720
45.00
60.00
74.250
HDTV 720P
9
1280* 720
37.50
50.00
74.25
HDTV 720P 50Hz
10
1920* 1080
28.125
50.00
74.250
HDTV 1080I 50Hz,
11
1920* 1080
33.72
59.94
74.176
HDTV 1080I
12
1920* 1080
33.75
60.00
74.25
HDTV 1080I
13
1920* 1080
56.25
50
148.5
HDTV 1080P
14
1920* 1080
67.432
59.94
148.350
HDTV 1080P
15
1920* 1080
67.5
60.00
148.5
HDTV 1080P
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-7-
LGE Internal Use Only
7. RGB
7.1. Analog PC, RGB- DTV –NOT SUPPORT
Specification
No
Resolution
H-freq(kHz)
Proposed
V-freq(Hz)
Pixel Clock(MHz)
1
640* 350
31.468
70.09
25.17
EGA
2
720* 400
31.469
70.09
28.32
DOS
3
640* 480
31.469
59.94
25.17
VESA( VGA)
4
800* 600
37.879
60.317
40
VESA( SVGA)
5
1024* 768
48.363
60.004
65
VESA( XGA)
6
1280* 768
47.776
59.87
79.5
Remark
VESA( WXGA)
7
1360* 768
47.72
59.799
84.75
VESA( WXGA)
8
1280* 1024
63.668
59.895
109.00
XGA
Only FHD Model
9
1920* 1080
66.587
59.934
138.50
WUXGA(Reduced Blanking)
Only FHD Model
8. HDMI Input
8.1. PC –Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No
1
Resolution
640 x 480
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
31.469
59.94
25.17
Proposed
Remark
VESA( VGA)
2
800 x 600
37.879
60.317
40.00
VESA( SVGA)
3
1024 x 768
48.363
60.004
65.00
VESA( XGA)
4
1280 x 768
47.776
59.87
79.5
VESA( WXGA)
5
1360 x 768
47.72
59.799
84.62
VESA( WXGA)
6
1366 x 768
47.7
60.00
84.62
WXGA
7
1280 x 1024
63.595
60.00
108.875
SXGA
8
1920 x 1080
66.647
59.988
138.625
WUXGA
8.2. DTV Mode
Specification
No
Resolution
H-freq(kHz)
Remark
V-freq(Hz)
Pixel Clock(MHz)
1
720 x 480
15.73
59.94
13.500
SDTV, DVD 480I(525I)
Spec. out
2
720 x 480
15.75
60.00
13.514
SDTV, DVD 480I(525I)
but display.
3
720 x 576
15.625
50.00
13.500
4
720 x 480
31.47
59.94
27
SDTV 480P
5
720 x 480
31.5
60.00
27.027
SDTV 480P
6
720 x 576
31.25
50.00
27
SDTV 576P
7
1280 x 720
44.96
59.94
74.176
HDTV 720P
8
1280 x 720
45
60.00
74.25
HDTV 720P
9
1280 x 720
37.5
50.00
74.25
HDTV 720P
10
1920 x 1080
28.125
50.00
74.25
HDTV 1080I
11
1920 x 1080
33.72
59.94
74.176
HDTV 1080I
12
1920 x 1080
33.75
60.00
74.25
HDTV 1080I
13
1920 x 1080
56.25
50.00
148.5
HDTV 1080P
14
1920 x 1080
67.432
59.94
148.350
HDTV 1080P
15
1920 x 1080
67.5
60.00
148.5
HDTV 1080P
SDTV, DVD 576I(625I) 50Hz
16
1920 x 1080
27
24.00
74.25
HDTV 1080P
17
1920 x 1080
33.75
30.00
74.25
HDTV 1080P
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-8-
LGE Internal Use Only
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV,
LP91A/B/C/D chassis.
(2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened
2) Click the “Connect” button and confirm “Dialog Box”
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 ±5 °C of temperature and 65±10% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.
(3) Download the EDID
- EDID datas are automatically download when adjusting
the Tool Option2
(4) ADC Calibration – RGB / Component
(4) Check SW Version.
3) Click the “Config.” button and Change speed I2C Speed
setting : 350Khz~400Khz
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input
4. PCB assembly adjustment method
4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
4) Read and write bin file.
Click “(1)Read” tab, and then load download
file(XXXX.bin) by clicking “Read”.
- LH20/ LH30
1
1
Filexxx.bin
Fil
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-9-
LGE Internal Use Only
1
Filexxx.bin
5) Click “(2)Auto” tab and set as below
6) Click “(3)Run”.
7) After downloading, you can see the “(4)Pass” message.
(3). Adjustment method
- The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value
Caution : Don’t Press “IN-STOP” key after completing the
function inspection.
4.3. EDID D/L method
Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data
4.1.2. Using the Memory Stick
* USB download : Service Mode
1) Insert the USB memory stick to the ISB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message “Copy the file from the Memory”
4.3.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2seconds.
4) After Finished the Download, Automatically DC Off -> On
4.3.2. 2nd Method
* Caution :
Must be checked that the tool option is right or not.
If tool option is wrong, hdmi edid data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear “OK”, then compele.
5) Check The update SW Version.
4.2. Input tool option.
Adjust tool option refer to the BOM.
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process
4.3.3. RS-232C command Method
(1) Command : AE 00 10
After Input Tool Option and AC off
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
* Caution
Don’t connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of edid could be
failed.
(1) Profile : Must be changed the option value because being
different with some setting value depend on
module maker, inch and market
(2) Equipment : adjustment remote control.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 10 -
LGE Internal Use Only
4.3.4. EDID data
(1) Analog(RGB): 128bytes>
4.4. ADC Calibration
4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
(2) HDMI 1 : 256Bytes
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : Component” by using D/E
(CH +/-) and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
(3) HDMI 2 : 256Bytes
OK
4.4.2. ADC Calibration - RGB (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : RGB” by using D/E(CH +/-)
and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
OK
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 -
LGE Internal Use Only
4.5. Check SW Version
5.2. Adjustment of White Balance
(1) Method
1) Push In-star key on Adjust remote-controller.
2) SW Version check
Check “SW VER : V3.xx” – LH70
: (For automatic adjustment)
* LP91A~D Support RS-232C & I2C DDC CommunicationWhite Balance Mode.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heatrun pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
5. PCB assembly adjustment method
5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Country’s Language and
signal Condition.
(2) Equipment : adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.)
(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with aging
command (F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value.
* White Balance Adjustment
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Three modes – Cool / Medium / Warm
- Required Equipment
1) Remote controller for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product LCD TV( ch : 9 ),
(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for Auto adjustment)
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.3. Adjustment of White Balance
- 12 -
(for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit” key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter “0000” (Password)
6) Select “3. W/B ADJUST”
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.
10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others
11) When adjustment is completed, Enter “COPY ALL”.
12) Exit adjustment mode using EXIT key on R/C.
LGE Internal Use Only
* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
Coordinate
Mode
x
y
Temp
uv∆
Cool
0.276±0.002 0.283±0.002
11,000K
0.000
Medium
0.285±0.002 0.293±0.002
9,300K
0.000
Warm
0.313±0.002 0.329±0.002
6,500K
0.003
To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : User 1
Dynamic Contrast : Off
Dynamic Colour : Off
(If you miss the upper condition, the coordinates of W/B
can be lower than the spec.)
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 13 -
LGE Internal Use Only
TROUBLESHOOTING
No power
(LED indicator off)
:
[A] PROCESS
Fail
Check short of Main B/D
or Change Power B/D
Fail
Check short of IC1001,
IC1003, IC1007
Check 24V, 12V, 5,2V
of Power B/D
Pass
Check Output of
IC1001, IC1003, IC1007
Fail
Re-soldering or Change defect
part of IC1001, IC1003, IC1007
Pass
Pass
Change IC1002,, Q1003
Fail
Check LEDAssy
Change LEDAssy
Pass
Check P307 Connector
No Raster
[B]: Process
Pass
Check LED status
On Display Unit
Fail
Repeat A PROCESS
Pass
Check Panel Link Cable
Or Module
Fail
Change Panel Link Cable
Or Module
Fail
Change Inverter Connector
Or Inverter
Pass
Check Inverter Connector
Or Inverter
Pass
Check Output of IC802
Fail
Change IC802
Pass
Check LVDS Cable
Fail
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Change Module
- 14 -
LGE Internal Use Only
No Raster on PC Signal
Pass
Check Input source Cable
and Jack
Pass
Check the Input/Output
Of J104
Fail
Re-soldering or
Change the defect part
Pass
Check the Input/Output
Of IC100
Fail
Re-soldering or
Change the defect part,
Check RGB EDID Data
Pass
Check the Input/Output
Of IC800
Fail
Re-soldering or
Change the defect part
Pass
Repeat [A], & [B] Process
No Raster on HDMI Signal
No Raster on COMMPONENT Signal
Pass
Pass
Check Input source
Cable And Jack
Check Input source
Cable And Jack
Pass
Pass
Check The Input/Output
Of JK101
Check the Input/Output
Of JK301, JK302, JK303
Fail
Re-soldering or
Change the defect part
Check the Input/Output
Of IC300, IC301, JK302
Fail
Re-soldering or
Change the defect part
Pass
Pass
Check the Input/Output
Of IC800
Fail
Re-soldering or
Change the defect part
Fail
Re-soldering or
Change the defect part
Check HDMI EDID Data
Re-download HDCP
Pass
Check the Input/Output
Of IC800
Fail
Re-soldering or
Change the defect part
Pass
Repeat [A], & [B] Process
Repeat [A], & [B] Process
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
LGE Internal Use Only
No Raster On AV (Video, S-Video)Signal
No Signal On TV(RF) Signal
Pass
Pass
Check Input source
Cable And Jack
Check Input source
Cable And Jack
Pass
Pass
Check The Input/Output
Of JK101, JK201
Fail
Re-soldering or
Change the defect part
Check The Input/Output
Of TU500
Fail
Re-soldering or
Change the defect part
Pass
Pass
Check the Input/Output
Of IC800
Fail
Re-soldering or
Change the defect part
Check the Input/Output
Of IC800
Pass
Fail
Re-soldering or
Change the defect part
Pass
Repeat [A], & [B] Process
Repeat [A], & [B] Process
No Sound
Check The Input Sourse.
Fail
Change The Source Input.
Pass
Check The Input/Output
Of IC600.
Fail
Re-soldering or
Change the defect part.
Pass
Check The Speaker.
Fail
Change Speaker.
Pass
Check The Speaker Wire.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 16 -
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
AV2
( Sid e AV)
HDMI3
USB
USB
Fo r D/ L
RS232
TV
( RF)
AV1
MNT_OUT
COMP1
COMP2
RGB_PC
PC_Aud io
EEPROM
24C02
SIDE_V : 1Vp p
SIF
SUB_SCL / SDA
PC_SCL/ SDA
EEPROM
24C02
HDMI3_SCL/ SDA
AUDIO
AMP
HDMI1_SCL/
_
SDA
HDM 2_SCL/ SDA
232C Driver
ST3232C
SIDE_L/ SIDE_R :5 00mVrms
TMDS
Tx/ Rx : ± 15Vp p
TUNER
TU_MAIN
MNT_LOUT/ ROUT: 500m Vrm s
AV11_LIN/ RIN :5 00m Vrms
MNT_OUT: 1Vp p
AV1_VIN: 1Vp p
COMP2_Y/ Pb /Pr
/
: 1/ 0. 7Vp p
Co mp 1_L/ R :5 00mVrms
Co mp 2_L/ R :5 00mVrms
Pr : 1/ 0. 7Vp p
COMP1_Y/ Pb / P
PC_R/ G/ B/ HS/ VS
EEPROM
24C02
EEPROM
24C02
PC_Aud io _L/ R :7 00m Vrms
TMDS
TMDS
AV2_VIN
AV2_LIN/ RIN
HDMI_DATA_3
USB_DN/ PN
IIS_OUT
OUT_O_TX_A±
OUT_O_TX_A
OUT_O_TX_B
OUT_O_TX_B±
OUT_O_TX_C
OUT_O_TX_C±
OUT_O_TX_CLK±
OUT_O_TX_C
OUT_O_TX_D
OUT_O_TX_D±
OUT_O_TX_E
OUT_O_TX_E±
OUT_E_TX_A
OUT_E_TX_A±
OUT_E_TX_B
OUT_E_TX_B±
OUT_E_TX_C
OUT_E_TX_C±
OUT_E_TX_CLK
OUT_E_TX_CLK±
OUT_E_TX_D ±
OUT_E_TX_
OUT_E_TX_E ±
OUT_E_TX_
MAIN SCALER
TXD / RXD :5V Dig it al
SIF
TU_MAIN
MNT_L/ R OUT
AV1_LIN/ RIN
MNT_VOUT
AV1_VIN
COMP2_LIN/ RIN
COMP2_Y/ Pb / Pr: 1/0. 7Vp p
MNT_OUT RIN
COMP1_LIN/
COMP1_Y/ Pb / Pr: 1/ 0. 7Vp p
PC_R/ G/ B/ HS/ VS
PC_Aud io _L/ R
IR
HDMI_DATA_1
HDMI_DATA_2
TX
DDR2( 512MB)
EEPROM( 256K)
Serial Flas h
( 8MByt e)
PWM
NTP3100L
R_CH
L_CH
L VDS c onnec tor
HDMI1
HDMI2
R_SPK_OUT
L_SPK_OUT
BLOCK DIAGRAM
LGE Internal Use Only
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
806
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
A10
310
510
300
500
120
A2
900
200
A5
LV1
530
550
802
803
801
804
805
540
521
400
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by
in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
- 18 -
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
AUDIO_R
MNT_ROUT
MNT_LOUT
MNT_VOUT
C100
POP NOISE
MUTE_LINE
16V 10uF C101
R101 0
HOTEL_OPT
SPK_R+_HOTEL
POP NOISE
MUTE_LINE
16V 10uF
SPK_R-_HOTEL
C
B E
Q101
RT1C3904-T112 E
B
Q100
RT1C3904-T112
16V100uF C102
C
R105 0
HOTEL_OPT
R106 0
NON_HOTEL_OPT
C103
100pF
READY
R103 0
HOTEL_OPT
R102 75
[YL]O-SPRING_B
D103
30V
NON_HOTEL_OPT
6
7
3
SHIELD
5
4
2
C-LUG4
C-LUG3
0-SPRING
C-LUG2
C-LUG1
ZD107
SD05
ZD106
SD05
D106
30V
D107
30V
R122
75
R121
75
S-VIDEO
R123
10K
S-VIDEO
SIDE_C
C104
OPT
READY
SIDE_Y
+3.3V_MULTI_MST
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GND
1
S-VIDEO
JK101
PSJ014-01
6L
5L
7K
6J
5J
JK100
PPJ226-01
S_VIDEO_DET
[RD]CONTACT_B
[RD]O-SPRING_B
D102
30V
NON_HOTEL_OPT
[WH]C-LUG_B
[YL]CONTACT_B
S-VIDEO(China Model)
MNT_OUT
3H [RD]CONTACT_A_2
4H [RD]O-SPRING_A_2
9H [RD]2P_CAN
8G [WH]C-LUG_A_2
9G [WH]2P_CAN
3F [YL]CONTACT_A
4F [YL]O-SPRING_A
9F [YL]2P_CAN
3E [RD]CONTACT_A_1
4E [RD]O-SPRING_A_1
9E [RD]1P_CAN_2
8D [WH]C-LUG_A_1
9D [WH]1P_CAN
8C [RD]C-LUG_A
9C [RD]1P_CAN_1
8B [BL]C-LUG_A
9B [BL]1P_CAN
3A [GN]CONTACT_A
4A [GN]O-SPRING_A
9A [GN]1P_CAN
SD05
ZD105
ADUC30S03010L_AMODIODE
D105
30V
D104
30V
ZD104
SD05
D100
30V
D101
30V
ZD100
SD05
ZD101
SD05
ZD102
SD05
SD05
ZD103
COMPONENT1, AV1, MNT_OUT[JACK PACK TYPE D] : JK100
EAX56856904
H6 LCD MERCURY
10K
10K
R112
220K
R116 10K
R111
220K
R115 10K
R110
75
R100
220K
R113
R104
220K
R114
R107
75
R108
75
R109
75
R120
12K
R119
12K
R117
12K
R118
12K
CVBS_RIN
CVBS_LIN
CVBS_VIN
COMP2_R
COMP2_L
COMP2_PR
COMP2_PB
COMP2_Y
COMPONENT1
AV1
LGE Internal Use Only
INPUT1
MSTAR N-EU
1
9
2008/12/16
INPUT1 : COMPONENT1, S-VIDEO
2
5
4
7
R2IN 8
T2OUT
V- 6
C2-
C2+
C1- 3
V+
1
0
0
R230
JK201
JK204
R204
4.7K
2C[RD]U_CAN
5C[RD]CONTACT
4C[RD]O_SPRING
2B[WH]U_CAN
3B[WH]C_LUG
2A[YL]U_CAN
0
R201
D208
30V
READY
USB_DP
USB_DL_P
5.6B
ZD203
5.6B
ZD202
D205
30V
D206
30V
R227
75
RXD
TXD
0
R237
Non_OCP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D207
30V
READY
Itís possibel to 27~47ohm
R200
USB_DN USB_DL_N
0
1A Design
C210 10uF 6.3V
220uF
16V
C212
L201 500
100uF
16V
C214
R205
4.7K
IR_OUT
D201
ADUC30S03010L_AMODIODE
30V
D200
ADUC30S03010L_AMODIODE
30V
+3.3V_MST
100
100
5A[YL]CONTACT
Close to SIDE_USB
**
R203
R202
4A[YL]O_SPRING
9 R2OUT
10 T2IN
PPJ218-01
SIDE_USB
REAR_USB
USB_DL_P
USB_DL_N
REAR_USB
R229
USB
R1OUT
11 T1IN
12
13 R1IN
14 T1OUT
15 GND
16 VCC
IC200
ST3232CDR
SIDE AV
C202
0.1uF
C201
0.1uF
C200
0.1uF
C1+
KJA-UB-4-0004
+3.3V_MST
REAR_USB
JK205
R222
220K
READY
R225
R223
220K
READY
R224
10K
10K
JK200
10
GND 2
ENABLE 3
5 ILIMIT
4 FAULT/
VIN 1
6 VOUT
IC202 OCP_READY
MIC2009YM6-TR
Pin to Pin with
EAN43439401
SIDE_RIN
SIDE_LIN
9
8
7
6
C
A
KDS226
D213
AC
OCP_READY
5
4
3
2
1
R210
4.7K
OCP_READY
C208
0.1uF
OCP_READY
L200
120OHM
OCP_READY
R238
510
OCP_READY
C209
10uF
OCP_READY
+5V_USB
SHILED
15
14
13
12
11
VSS
A2
A1
A0
4
3
2
1
5
6
7
8
SDA
SCL
WP
R218
100
R217
100
R220
4.7K
C204
0.1uF
+5V_MULTI
C
R221
4.7K
10K
10K
R234
R232
220K
R231
220K
R233
PC_B
ZD201
SD05
ZD200
SD05
30V
PC_AUD_L
PC_AUD_R
DDC_WP
DSUB_SCL
DSUB_SDA
R236
12K
R235
12K
R213
75
PC_G
PC_R
ADUC30S03010L_AMODIODE
30V
C207
0.1uF
C206
0.1uF
R212
75
C205
0.01uF
+5VST_MST
D203
30V
CDS3C30GTH
D202
30V
CDS3C30GTH
R211
75
C
D209
R215
4.7K
R214
4.7K
R208
68
R207
68
PC_VS
DSUB_SCL
C211
68pF
PC_HS
DSUB_SDA
C213
68pF
D204
ADUC30S03010L_AMODIODE
INPUT2
MSTAR N-EU
2
9
2008/12/16
INPUT2 : PC,RS-232C,SIDE AV,USB
READY
R219
4.7K
SHIELD_PLATE
R216
100
T_TERMINAL2
8
B_TERMINAL2
T_SPRING
R_SPRING
6B
7B
5
4
B_TERMINAL1
7A
E_SPRING
T_TERMINAL1
3
DDC_GND
DDC_CLOCK
SYNC_GND
GND_1
V_SYNC
NC
BLUE
H_SYNC
BLUE_GND
GREEN
DDC_DATA
GREEN_GND
RED
GND_2
RED_GND
6A
VCC
IC201
CAT24C02WI-GT3
PC EDID
PEJ024-01
16
10
9
8
7
6
PC
SOUND
JK203
5
4
3
2
1
6630TGA004K
KCN-DS-1-0089
JK202
PC
A
AC
KCN-DS-1-0088
R209
1K
OCP_READY
OCP_READY
R206
160
R228
12K
12K
R226
SIDE_V
IR_OUT
UB01123-4HHS-4F
C203
0.1uF
1
2
3
5 4
1
2
3
4
ENKMC2837-T112
D210
RS-232C (CI ITEM)
C
ENKMC2837-T112
D211
AC
A
AC
A
ENKMC2837-T112
D212
EAX56856904
H6 LCD MERCURY
USB DOWN STREAM
5
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
USB DOWN STREAM
LGE Internal Use Only
21
22
E
2SC3875S
21
20 JACK_GND
1 DATA2+
.
2 DATA2_SHIELD
3 DATA2-
4 DATA1+
5 DATA1_SHIELD
6 DATA1-
7 DATA0+
8 DATA0_SHIELD
9 DATA0-
11
10 CLK+
12
13
14
15
16
17
18
19
B
Q300C
JK301
QJ41193-CFEE1-7F
R300
10K
.
R302
1K
RT1C3904-T112
20 JACK_GND
1 DATA2+
2 DATA2_SHIELD
3 DATA2-
4 DATA1+
5 DATA1_SHIELD
6 DATA1-
7 DATA0+
8 DATA0_SHIELD
9 DATA0-
11
10 CLK+
12
13
14
15
16
17
18
19
JP301
+5V_HDMI_1
JP300
A2
4
3
5
6
7
8
SDA
SCL
WP
VCC
4
3
2
1
TMDS1_RX2+
CEC
TMDS1_RXCTMDS1_RXC+
TMDS1_RX0TMDS1_RX0+
TMDS1_RX1TMDS1_RX1+
TMDS1_RX2-
VSS
A2
A1
A0
5
6
7
8
SDA
SCL
WP
VCC
IC300
CAT24C02WI-GT3
TMDS2_RXC+
TMDS2_RX0TMDS2_RX0+
TMDS2_RX1TMDS2_RX1+
TMDS2_RX2TMDS2_RX2+
CEC
TMDS2_RXC-
VSS
2
1
A0
E
A1
IC301
CAT24C02WI-GT3
R303
1K
C
JK302
QJ41193-CFEE1-7F
22
B
RT1C3904-T112
R301
10K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HPD_MST_1
HPD_MST_2
Q301
+5V_HDMI_2
JP303
JP302
R307 100
R306 100
R331 100
R305 100
R304 100
R327 100
A2
R308 R310
10K 10K
C302
0.01uF
D300
KDS184S
+5V_HDMI_1
+5V_MULTI
R309 R311
10K 10K
DDC_WP
HPD_MST_3
DDC_SDA1
DDC_SCL1
DDC_WP
DDC_SDA2
DDC_SCL2
D301
KDS184S
A1
C301
0.01uF
C
1 DATA2+
2 DATA2_SHIELD
3 DATA2-
4 DATA1+
5 DATA1_SHIELD
6 DATA1-
7 DATA0+
8 DATA0_SHIELD
9 DATA0-
10 CLK+
11 CLK_SHIELD
12 CLK-
13 CEC
14 NC
15 SCL
16 SDA
17DDC/CEC_GND
18 +5V_POWER
E
Q303
BSS83
CEC_READY
D
B
G
S
JP305
JP304
VSS
A2
A1
A0
D304
CDS3C30GTH
30V CEC_READY
R313
0
D303
MMBD301LT1G
30V
CEC_READY
R315
68K
CEC_READY
+3.3V_MST
R316
56K
CEC_READY
TMDS3_RXC+
TMDS3_RX0TMDS3_RX0+
TMDS3_RX1TMDS3_RX1+
TMDS3_RX2TMDS3_RX2+
4
3
2
1
SDA
SCL
WP
VCC
CEC
CEC_C
5
6
7
8
IC302
CAT24C02WI-GT3
CEC
TMDS3_RXC-
R314
1K
RT1C3904-T112
Q302C
2SC3875S
19 HPD
B
KJA-ET-0-0032
JK303
20
JACK_GND
R312
10K
+5V_HDMI_3
R318 100
R317 100
R329 100
A2
C300
0.01uF
DDC_SDA3
DDC_SCL3
DDC_WP
HDMI
MSTAR N-EU
R319 R320
10K 10K
D302
KDS184S
+5V_HDMI_3
+5V_MULTI
MST_HPD : USE MST HPD
3
9
2008/12/16
SW_HPD : USE SW HPD (Default)
OPTION
A1
+5V_MULTI
+5V_HDMI_2
A2
2SC3875S
A1
C
EAX56856904
H6 LCD MERCURY
C
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
.
.
8
ZD401
ZD402
LED_R
LED_B
IR
GND
C414
19_22_26"
C402
100pF
50V
19_22_26"
L405
BG1608B121F
0
READY
R400
0.1uF
READY
+3.3V_MST
R426 47K
IR-OUT
B
IR
R428 10K
IR-OUT
E Q405
2SC3052
IR-OUT
C
R427
10K
IR-OUT
+5VST_MST
NON_19_22_26"
C411
0.1uF
KEY2
KEY1
+3.3V_MULTI_MST
R418 0
READY
C
B
Q402 E
2SC3052
19_22_26"
R415 10K
19_22_26"
R414
10K
19_22_26"
+3.3V_MST
SUB_SCL
R406
4.7K
19_22_26"
+3.3V_MST
LED_R
B
C Q404
2SC3052
E IR-OUT
R429
10K
IR-OUT
+5VST_MST
R430 22
IR-OUT
IR_OUT
KEY2
KEY1
19_22_26"
19_22_26"
L401
BG1608B121F
19_22_26"
L400
BG1608B121F
C400
100pF
50V
C401
GND
100pF 19_22_26"
50V
KEY2
KEY1
3
2
1
SMAW200-03
19_22_26"
P404
CONTROL KEY
(19/22/26")
IR(19/22/26")
0
NON_19_22_26"
0.1uF NON_19_22_26"
16V R403
L407 120-ohm
+3.3V_MULTI_MST
NON_19_22_26"
NON_19_22_26" R417
0
ZD400
C406
47uF
16V
L404
120-ohm
C408
0.1uF
R421
4.7K
+3.3V_MST
NON_19_22_26"
+5VST_MST
NON_19_22_26"
C412
470pF
L402 120ohm
C403
C407
47pF
R404
10K
19_22_26"
R416 0
READY
C
R410 10K
19_22_26" B
Q401 E
19_22_26"
2SC3052
19_22_26"
L408
BG1608B121F
C405
100pF
50V
19_22_26"
READY
R413
0
5V_ST
GND
KEY2
KEY1
POWER_ON(LED_R_SMALL)
ST_3.3V(LED_B)
GND
IR
WARM_ST(LED_R_BIG)
GND
5V_ST
KEY2
KEY1
GND
SDA
SCL
C404
470pF
NON_19_22_26"
L406 120ohm
NON_19_22_26"
L403 120ohm
NON_19_22_26"
R420
4.7K
SUB_SDA
SUB_SCL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
9
7
6
5
4
3
2
1
19_22_26"
P405
13
12
11
10
9
8
7
6
5
4
3
2
1
12507WS-12L
P400
NON_19_22_26"
L411 500-ohm
NON_19_22_26"
L410 500-ohm
NON_19_22_26"
52
FHD
3
4
5
5
HD(26/32/37/42/47")
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
100
READY
R409
NON 22/27" FHD
R425 0
R431 0
NON 22/27" FHD
TXCO4-
TXCO4+
TXCO3-
TXCO3+
TXCLKO-
TXCLKO+
TXCO2+
TXCO2-
TXCO0+
TXCO0TXCO1+
TXCO1-
TXCE4-
TXCE4+
TXCE3-
TXCE3+
TXCLKE-
TXCLKE+
TXCE2-
TXCE2+
TXCE1-
8BIT(HD)
8BIT(FHD)
52 sharp
32 sharp
X
X
X
X
NON 22/27" FHD
R423 0
+3.3V_MULTI_MST
R424
0
VESA
R407
4.7K
JEIDA
R402
X
0
0
0
X
*8BIT(FHD):22/27"
R401
R402
0
8 B I T o r 5 2 s h a r p 10BIT(FHD) 4.7K
R401
4.7K
10BIT
+3.3V_MULTI_MST
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
9
10
8
7
8
7
6
2
4
6
1
3
TXCE0+
TXCE0TXCE1+
P402
FF10001-30
2
NON 22/27" FHD
R419 0
R422 0
NON 22/27" FHD
+5V_+12V_LCD
+5V_+12V_LCD
TXCE0+
TXCE0-
TXCE1+
TXCE1-
TXCE2+
TXCE2-
TXCLKE+
TXCLKE-
TXCE3+
TXCE3-
0
MSTAR
LVDS,CTR KEY
External VBR
E-DIM
OPC_OUT
OPC_OUTPUT
OPC_EABLE
C B
OPC_EN
OPC_ENABLE
E
Q400
RT1C3904-T112
R411
1K
OPC_ENABLE
OPC_ENABLE
R412
R405
READY
0
R435
470
OPC_ENABLE
+3.3V_MULTI_MST
TXCE0+
TXCE0-
TXCE1+
TXCE1-
TXCE2+
TXCE2-
TXCLKE+
TXCLKE-
TXCE3+
TXCE3-
P403
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
SMW200-28C
4
9
2008/12/16
HD(19/22")
+5V_+12V_LCD
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
PANEL WAFER
1
TF05-51S
P401
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
IR(Non 19/22/26)
CONTROL KEY(Non 19/22/26)
EAX56856904
H6 LCD MERCURY
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
READY
B
C503
0.1uF
50V
E
Q502
ISA1530AC1
C
R507
220
R506
220
120-ohm
L501
0
0 Ohm
L501-*1
C504
READY
C509
100uF 16V
+5V_TUNER
C506
100uF 16V
TV_MAIN
21
NTSC_TUNER
16
15
14
13
12
11
10
9
8
7
6
5
4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SHIELD
20 NC_9
SHIELD
18
17
20
MAIN_SIF
M_SCL
M_SDA
C505
100uF 16V
Near the pin
19 NC_8
R502
4.7K
R505 47
R504 47
C508
10uF
16V
3
19
C507
82pF
READY
C502
27pF
C501
0.01uF
+5V_TUNER
2
1
NC_9
NC_8
NC_7
NC_6
SIF-OUT
A-OUT
NC_5
V-OUT
NC_4
MOPLL_AS
SCL
SDA
GND_2
NC_3
TP[3.3V_OPT]
RF_AGC
NC_2
+B[5V]
GND_1
NC_1
TAFT-H203F
TU500-*1
15 A-OUT
16 SIF-OUT
17 NC_6
18 NC_7
14 NC_5
L502
10uH
READY
9 SDA
10
PAL_TUNER SCL
C500
27pF
11 MOPLL_AS
12 NC_4
13 V-OUT
21
120-ohm
L500
6 TP[3.3V_OPT]
7 NC_3
8 GND_2
5 RF_AGC
3 +B[5V]
4 NC_2
1 NC_1
2 GND_1
TU500
TAFT-Z203D
EAX56856904
H6 LCD MERCURY
MSTAR
TUNER
5
9
2008/12/16
R624
READY
4
SPK_L+
C600
10uF
16V
C604
10uF
16V
6
7
VSS_IO
CLK_I
+1.8V_DVDD
C607
0.1uF
50V
C609
10uF 16V
14
12
AVDD_PLL
13
11
LFM
TEST0
10
AGND_PLL
DVDD_PLL
9
DGND_PLL
8
5
DVSS_1
VDD_IO
4
3
2
1
AD
RESET
VDR1A
BST1A
C611
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
3
SPK_L-
2
SMAW250-04
P600
+1.8V_DVDD
+1.8V_AVDD
C602
0.1uF
+3.3V_MULTI_MST
C608
R601 100 1uF
C606
1000pF
C605
C603
0.1uF
1000pF
C601
100pF
R600
3.3K
+1.8V_AVDD
I2S_MCLK
Q603
RT1C3904-T112
SPK_R+
0
0
R631
22KREADY
R627
E
SPK_R-
READY
10KB
1
MULTI_PW_SW
SW_RESET
R629
C
R630
10K
+3.3V_MST
+1.8V_DVDD
22000pF
PGND1A_2
56
MLB-201209-0120P-N2
0LCML00003B
C610
0.1uF
PGND1A_1
C642
10uF
35V
C615
0.1uF
C617
0.1uF
IC600
NTP-3100L
R602 R603
100 100
C638
33pF
50V
READY
+16V_NTP
C612
330uF 35V
C616
22000pF
C613
0.01uF
R604
3.3
Main AMP
55
L605
OUT1A_2
54
17
100
R676
SDATA
18
WCK
100
R677
120-ohm
OUT1A_1
53
READY
PVDD1A_2
52
+1.8V_AVDD
SDA
19
BCK
100
R678
120-ohm
PVDD1A_1
51
20
MLB-201209-0120P-N2
PVDD1B_2
50
21
SCL
15
PVDD1B_1
49
22
MONITOR_0
23
0LCML00003B
OUT1B_2
48
C639
33pF
50V
READY
C614
1uF
R673 0
C651
1000pF
50V
24
MONITOR_2
L606
OUT1B_1
47
25
FAULT
+1.8V
PGND1B_2
46
VDR2B
EAX56856904
H6 LCD MERCURY
PGND1B_1
45
MONITOR_1
I2S_SDO
I2S_WS
I2S_SCK
M_SDA
M_SCL
AMP_MUTE_HOTEL
DVSS_2
BST1B
44
26
R656 0
HOTEL_OPT
16
DVDD
VDR1B
43
27
BST2B
28
PGND2B_1
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
R611
12
VDR2A
BST2A
PGND2A_2
PGND2A_1
OUT2A_2
OUT2A_1
PVDD2A_2
PVDD2A_1
PVDD2B_2
PVDD2B_1
OUT2B_2
OUT2B_1
PGND2B_2
40
39
38
37
36
35
34
33
32
31
30
29
C626
0.1uF
+16V_NTP
R623
4.7K
R663
4.7K
C671
0.01uF
R625
3.3
R626
3.3
C672
0.01uF
R621
12
C634
390pF
1S
1F
EAP38319001
R654
12
C673
0.47uF
SPK_L-
R658 R653
12
12
C630
L607
390pF
2S DA-8580 2F
C669
0.1uF
C637
0.1uF
C629
0.1uF
C632
0.47uF
C625
22000pF
C624
1uF
MULTI_PW_SW
C623 22000pF
NC
41
1S
1F
EAP38319001
L603
2S DA-8580 2F
42
C618
1uF
C621
390pF
R610 R638
12
12
C619
390pF
R608
12
C643
0.1uF
C644
0.1uF
R667
4.7K
R628
4.7K
SPK_L-
SPK_L+
C647
0.01uF
R635
3.3
R671
3.3
C648
0.01uF
SPK_R-
SPK_R+
MNT_ROUT
B
C
E
B
AMP_MUTE_HOTEL
R613-* 12K
R614 5.6K
C631 33pF
R613 10K
NON_HOTEL_OPT
R609
1K
C633 33pF
R615 5.6K
GND 11
8
9
AUDIO
10
6
9
2008/12/16
6
SPK_R-_HOTEL
5
4
3
2
P601
12505WR-09A00
HOTEL_OPT
1
7
OUT3 8
SPK_R+_HOTEL
R619 0
HOTEL_OPT
R620 0
C636 HOTEL_OPT
0.1uF
HOTEL_OPT
+16V_NTP
7 OUT2
6 INPUT2- INPUT3- 9
5 INPUT2+ INPUT3+ 10
4 VCC
3 INPUT1+ INPUT4+ 12
2 INPUT1- INPUT4- 13
E
MSTAR N-EU
R612 200 B
HOTEL_OPT
AUDIO_R
R622
6.8K
C635
0.01uF
R618
6.8K
1 OUT1 LM324DOUT4 14
IC601
R617 SW_RESET
10K
HOTEL_OPT
C Q602
RT1C3904-T112
HOTEL_OPT
+3.3V_MULTI_MST
R616-* 12K
HOTEL_OPT
R616 10K
NON_HOTEL_OPT
Chinese Hotel Option
R606
4.7K
Q601
RT1C3904-T112
C622
0.1uF
C628
6800pF
MNT_R_AMP
R607
1K
+12V_AUDIO
C627
6800pF
MNT_L_AMP
R605
4.7K
E
+12V_AUDIO
MNT_LOUT
Q600
RT1C3904-T112
C620
0.1uF
C
HOTEL_OPT
AMP :GAIN X 4
+12V_AUDIO
4
3
2
1
VSS
A2
A1
A0
1K
0
4
3
2
1
1K
150
SDA
SCL
WP
VCC
2K
R886
22
22
R8000
10K
Q800
ISA1530AC1
B E
C
C870
47uF 25V
R885
220
R807
402
READY
R808
E B
C
Q801
ISA1530AC1
+12V_AUDIO
5
6
7
8
R813
R812
C803
0.01uF
R8028
4.7K
22
22
EEP_SDA
EEP_SCL
EEP_SDA
EEP_SCL
R888
C814
0.1uF
C8000
READY
1K
R853
D802
KDS181
MNT_VOUT_T
SW800
JTP-1127WEM
+5VST_MST
R810
68
R8041
C
B
E
47
Q802
RT1C3904-T112
R809
470
R8006
R8005
R817
4.7K
+3.3V_MULTI_MST
R8027
4.7K
+3.3V_MULTI_MST
100
C871
4.7uF
10V
READY
R887
33K
E
Q803
RT1C3904-T112
R855
10K
+5VST_MST
C
D803
KDS181
C812
4.7uF
+5VST_MST
C819
C815
C833
0.1uF
0.1uF
0.1uF
L800
120-ohm
C810
C838
SYS_RESET
MULTI_PW_SW
POWER_DET
RL_ON
MNT_L_AMP
MNT_R_AMP
SIDE_LIN
SIDE_RIN
MAIN_SIF
MNT_VOUT_T
TV_MAIN
COMP2_PR
SIDE_C
SIDE_Y
CVBS_VIN
SIDE_V
COMP2_PB
COMP2_Y
PC_R
PC_B
PC_G
0.01uF
0.1uF
C804/C805/C806:Close to IC
as close as possible
Q804
NON 19_22"
RT1C3904-T112
R8037
C B R8007 33K
E
NON 19_22"
0
NON 19_22"
2.2uF
16V
B
READY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RESET
R861
D801
KDS181
R8001
R8036
20K
19_22_26"
R860
R800
READY
0
SDA
SCL
WP
VCC
IC803
CAT24WC08W-T
5
6
7
8
P_24V_SMALL_15V
P_12V_SMALL_15V
MNT_VOUT
GAIN X 4
R8004
4.7K
HDCP EEPROM
VSS
A2
A1
A0
IC801
24LC256-I/SM
3 1
EEPROM
8 SO/SIO1 WP/ACC 9
SPI_DO
2
4
C841
0.1uF
0.1uF
2.2uF
2.2uF
100
100
100
100
C856
C861
R882
R881
R846
R847
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
1000pF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
C868
C869
C834
C836
C837
C826
C828
C835
C830
C800
C801
C831
C832
+1.2V_VDDC_MST
22K
0.01uF
R845
47
47
R875
R876
22K
0.01uF
47
47
47
R831
R857
R830
R842
C839
47
47
470
47
47
47
47
47
R832
R834
R835
R837
R804
R815
R897
R802
C829
C827
47
10
10
R891
R892
47
10
10
R880
R890
R836
10
10
10
10
10
10
R869
R871
R872
R873
R874
R879
R833
10
10
R859
R862
390
0.1uF
0.1uF
0.1uF
0.047uF
1000pF
0.047uF
0.047uF
0.047uF
10
10
10
10
R851
R854
R856
R858
R814
R803
R816
R818
R838
C866
10uF
R840
C804
C805
C806
47 C843
470 C846
47 C845
47 C847
47 C825
TMDS1_RX2TMDS1_RX2+
HPD_MST_1
TMDS1_RX1TMDS1_RX1+
TMDS2_RX2TMDS2_RX2+
TMDS1_RXCTMDS1_RXC+
TMDS1_RX0TMDS1_RX0+
TMDS2_RXCTMDS2_RXC+
TMDS2_RX0TMDS2_RX0+
HPD_MST_2
TMDS2_RX1TMDS2_RX1+
C867
0.1uF
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
POWER_SW
SYS_RESET
CEC_C
PC_VS
PC_HS
0
0
R8035
R8034
TXD
LED_R
100
100
R895
R849
IR
DSUB_SDA
RXD
100
100
R850
R8012
RXBCKN
RXBCKP
RXB0N
RXB0P
HOTPLUGB
RXB1N
RXB1P
AVDD_33_1
RXB2N
RXB2P
RXACKN
RXACKP
RXA0N
RXA0P
AVDD_33_2
RXA1N
RXA1P
GND_1
RXA2N
RXA2P
HOTPLUGA
REXT
VCLAMP
REFP
REFM
BIN1P
SOGIN1
GIN1P
RIN1P
BINM
BIN0P
GINM
GIN0P
SOGIN0
RINM
RIN0P
AVDD_33_3
GND_2
BIN2P
GIN2P
SOGIN2
RIN2P
CVBS6
S-VIDEO
CVBS5
CVBS4
CVBS3
CVBS2
CVBS1
VCOM1
CVBS0
VCOM0
AVDD_33_4
CVBSOUT
GND_3
SIF0P
SIF0M
VDDC_1
AUL5
AUR5
AUVRM
AUOUTL2
AUOUTR2
AUOUTL1
AUOUTR1
Close to IC
with width trace
HDMI_2
0.1uF
KEY2
KEY1
0
0 READY
READY
R8016
R8017
100
100
R824
R825
C816 20pF
C817 20pF
X801
12MHz
R839
1M
+3.3V_MULTI_MST
10uF 16V
0.1uF
1000pF
4.7uF
C809
C813
C818
C820
HDMI_1
GND
100
C883
TXD
RXD
EEP_SCL
EEP_SDA
RL_ON
I2S_SDO
I2S_SCK
R8022
R8021
100
100
I2S_WS
I2S_MCLK
PANEL_STATUS
R829
0.1uF
C844
MST99A88ML(MATRIX BASIC)
IC800
R863
R864
4.7K
4.7K
HDMI_3
+3.3V_MULTI_MST
R867 1K
R884
1K
READY
R883
1K
100
0.01uF
C850
DDR2_D[13]
DDR2_D[10]
DDR2_D[8]
DDR2_D[15]
R8018
DDR2_D[6]
DDR2_D[1]
DDR2_D[3]
DDR2_D[4]
DDR2_D[14]
DDR2_D[9]
DDR2_D[12]
DDR2_D[11]
1K
DDR2_A[6]
DDR2_A[4]
DDR2_A[2]
DDR2_A[0]
AR815
56
AR813
56
AR812
56
DDR2_CKE
56
DDR2_A[11]
DDR2_A[8]
DDR2_BA1
DDR2_WEZ
AR814
56
1
2
3
4
5
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
R893 4.7K
AUOUTR1
AUOUTL1
AUOUTR2
AUOUTL2
AUVRM
AUR5
AUL5
VDDC_1
SIF0M
SIF0P
GND_3
CVBSOUT
AVDD_33_4
VCOM0
CVBS0
VCOM1
CVBS1
CVBS2
CVBS3
CVBS4
CVBS5
CVBS6
RIN2P
SOGIN2
GIN2P
BIN2P
GND_2
AVDD_33_3
RIN0P
RINM
SOGIN0
GIN0P
GINM
BIN0P
BINM
RIN1P
GIN1P
SOGIN1
BIN1P
REFM
REFP
VCLAMP
REXT
HOTPLUGA
21
22
23
24
25
26
27
28
29
30
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
MSTAR
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
C858
0.01uF
C859
0.01uF
B_DDR2_DQS[0]
B_DDR2_DQSB[0]
AVDD_DDR_3
VDDP_4
GND_12
B_DDR2_DQS[1]
B_DDR2_DQSB[1]
AVDD_DDR_4
B_MDATA[15]
B_MDATA[8]
GND_13
B_MDATA[10]
B_MDATA[13]
AVDD_DDR_5
B_MDATA[7]
B_MDATA[0]
B_MDATA[2]
B_MDATA[5]
B_MCLK
B_MCLKZ
TXCE4TXCE4+
TXCE3TXCE3+
TXCLKETXCLKE+
TXCE2TXCE2+
TXCE1TXCE1+
TXCE0TXCE0+
TXCO4TXCO4+
TXCO3TXCO3+
TXCLKOTXCLKO+
TXCO2TXCO2+
TXCO1TXCO1+
TXCO0TXCO0+
+3.3V_MULTI_MST
DDR2_D[0-15]
C864
0.01uF
+1.8V_DDR
C857
0.01uF
+1.2V_VDDC_MST
LVB4P
LVB4M
LVB3P
LVB3M
LVBCKP
LVBCKM
LVB2P
LVB2M
LVB1P
LVB1M
LVB0P
LVB0M
AVDD_LPLL
GND_7
VDDC_4
GPIO150/I2C_OUT_MUTE
GPIO151/I2C_OUT_SD2
GPIO152/I2C_OUT_SD3
GND_8
GPIO51
GPIO52
GPIO53
GPIO54
GPIO55
GPIO56
GPIO57
GPIO58
VDDP_3
VDDC_5
B_MDATA[4]
B_MDATA[3]
GND_9
B_MDATA[1]
B_MDATA[6]
AVDD_DDR_1
B_MDATA[11]
B_MDATA[12]
GND_10
B_MDATA[9]
B_MDATA[14]
AVDD_DDR_2
B_DDR2_DQM[1]
B_DDR2_DQM[0]
GND_11
C862
0.01uF
C878
0.01uF
C865
0.01uF
C879
0.01uF
7
9
2008/12/16
C860
0.01uF
C877
0.01uF
Close to IC as close as possible
IC800-*1
LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ]
RXA2P
RXA2N
GND_1
RXA1P
RXA1N
AVDD_33_2
RXA0P
RXA0N
RXACKP
RXACKN
RXB2P
RXB2N
AVDD_33_1
RXB1P
RXB1N
HOTPLUGB
RXB0P
RXB0N
RXBCKP
RXBCKN
OPC_EN
MUTE_LINE R865 4.7K
SUB_SCL
R866 4.7K
SUB_SDA
S_VIDEO_DET
PANEL_ON R819 3.3K
DISP_EN/VAVS_ON
SW_RESET
DDC_WP
AR810
56
AR809
56
DDR2_DQM0
DDR2_DQM1
DDR2_DQS0M
DDR2_DQS0P
DDR2_DQS1M
DDR2_DQS1P
AR806
56
DDR2_MCLKZ
DDR2_MCLK
DDR2_D[5]
DDR2_D[2]
DDR2_D[0]
DDR2_D[7]
AR805
56
MSTAR N-EU
0.1uF
1K
C842
0.1uF
C848
0.1uF
C849
R8042
0.1uF
C853
R8038
33
33
R843
R844
[MODE SELECTION]
R889
1K
R811
1K
READY
+3.3V_MULTI_MST
192
191
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
0.1uF
C863
B_MCLKZ
B_MCLK
B_MDATA[5]
B_MDATA[2]
B_MDATA[0]
B_MDATA[7]
AVDD_DDR_5
B_MDATA[13]
B_MDATA[10]
GND_13
B_MDATA[8]
B_MDATA[15]
AVDD_DDR_4
B_DDR2_DQSB[1]
B_DDR2_DQS[1]
GND_12
VDDP_4
AVDD_DDR_3
B_DDR2_DQSB[0]
B_DDR2_DQS[0]
GND_11
B_DDR2_DQM[0]
B_DDR2_DQM[1]
AVDD_DDR_2
B_MDATA[14]
B_MDATA[9]
GND_10
B_MDATA[12]
B_MDATA[11]
AVDD_DDR_1
B_MDATA[6]
B_MDATA[1]
GND_9
B_MDATA[3]
B_MDATA[4]
VDDC_5
VDDP_3
GPIO58
GPIO57
GPIO56
GPIO55
GPIO54
GPIO53
GPIO52
GPIO51
GND_8
GPIO152/I2C_OUT_SD3
GPIO151/I2C_OUT_SD2
GPIO150/I2C_OUT_MUTE
VDDC_4
GND_7
AVDD_LPLL
LVB0M
LVB0P
LVB1M
LVB1P
LVB2M
LVB2P
LVBCKM
LVBCKP
LVB3M
LVB3P
LVB4M
LVB4P
1K
R868
DDR2_A[3]
DDR2_A[7]
DDR2_A[12]
DDR2_A[9]
DDR2_A[5]
DDR2_A[10]
DDR2_A[1]
R852
DDR2_CASZ
DDR2_RASZ
DDR2_ODT
AR800
56
DDR2_BA0
256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
HWRESET
CEC
VSYNC1
HSYNC1
VSYNC0
HSYNC0
IRIN
GPIO140
GPIO139
GPIO138
GPIO135
GPIO134
XIN
XOUT
AVDD_MPLL
SAR3
SAR2
SAR1
SAR0
USB0_DP
USB0_DM
GND_18
GND_17
UART1_TX/GPIO87
UART1_RX/GPIO86
UART2_TX/I2CM_SCK
UART2_RX/I2CM_SDA
SPDIFO
I2S_OUT_SD
I2S_OUT_BCK
VDDC_7
GND_16
VDDP_5
I2S_OUT_WS
I2S_OUT_MCK
I2S_IN_SD
I2S_IN_BCK/GPIO68
I2S_IN_WS/GPIO67
VDDC_6
A_MCLKE
A_MADR[3]
A_MADR[7]
A_MADR[12]
A_MADR[9]
A_MADR[5]
AVDD_DDR_6
A_MADR[10]
A_MADR[1]
A_BADR[0]
A_BADR[1]
A_WEZ
A_MADR[11]
A_MADR[8]
A_MADR[6]
GND_15
A_MADR[4]
A_MADR[2]
A_MADR[0]
A_CASZ
A_RASZ
A_ODT
MVREF
AVDD_MEMPLL
GND_14
AUL0
AUR0
AUL1
AUR1
AUL2
AUR2
AUL3
AUR3
AUCOM
AUL4
AUR4
GND_4
AUVRP
AUVAG
AVDD_AU
GND_5
VDDC_2
DDCA_CK
DDCA_DA
DDCDA_CK
DDCDA_DA
DDCDB_CK
DDCDB_DA
GPIO20
VDDP_1
VDDC_3
UART2_RX
UART2_TX
DDCDC_CK
RXCCKN
RXCCKP
DDCDC_DA
RXC0N
RXC0P
GND_6
RXC1N
RXC1P
AVDD_DM
RXC2N
RXC2P
HOTPLUGC
USB1_DM
USB1_DP
SCK
SDI
SDO
SCZ
PWM0
PWM1
PWM2
PWM3
LVA4P
LVA4M
LVA3P
LVA3M
LVACKP
LVACKM
LVA2P
LVA2M
LVA1P
LVA1M
LVA0P
LVA0M
VDDP_2
M_SDA
M_SCL
DDC_WP
65
AUL0
R828
C
B
E
10K
Q805 READY
RT1C3904-T112
66
R878
4.7K
67
GND 10
68
7 CS
74
AUL4
SPI_CZ
69
AUL1
AUR0
+3.3V_MULTI_MST
HWRESET
70
AUL2
AUR1
NC_5 11
CEC
256
71
AUL3
AUR2
NC_6 12
VSYNC1
254
255
72
AUR3
6 NC_4
75
AUR4
5 NC_3
76
GND_4
R877
4.7K
77
AUVRP
+3.3V_MULTI_MST
AUVAG
C823
2.2uF
65
CVBS_LIN
66
C824
2.2uF
CVBS_RIN
67
68
69
C802
2.2uF
COMP2_L
70
C873
2.2uF
COMP2_R
71
C874
2.2uF
72
C875
2.2uF
73
C808
0.1uF
74
C821
2.2uF
PC_AUD_L
75
C822
2.2uF
PC_AUD_R
76
77
78
79
C840
0.01uF
L801
80
120-ohm
81
82
R894
0
DSUB_SCL
83
R899
0
DSUB_SDA
84
R8023
100
DDC_SCL1
85
R8024
100
DDC_SDA1
86
R8025
100
DDC_SCL2
87
R8026
100
DDC_SDA2
88
R8033
0 READY
POWER_DET
89
C882
0.1uF
90
R806
0
91
R870
0
92
R8039
100 HDMI3_SIDE
93
DDC_SCL3
R801
10 HDMI3_SIDE 94
TMDS3_RXCR805
10 HDMI3_SIDE 95
TMDS3_RXC+
R8040 100 HDMI3_SIDE
96
DDC_SDA3
R820
10 HDMI3_SIDE 97
TMDS3_RX0R821
10 HDMI3_SIDE 98
TMDS3_RX0+
99
R822
10 HDMI3_SIDE 100
TMDS3_RX1R823
10 HDMI3_SIDE 101
TMDS3_RX1+
C876 0.01uF
102
R841
10 HDMI3_SIDE 103
TMDS3_RX2R848
10 HDMI3_SIDE 104
TMDS3_RX2+
105
HPD_MST_3
106
R826
0
USB_DN
107
USB PART USB_DP
R827
0
108
SPI_CLK
109
AR818
SPI_DI
33
110
SPI_DO
111
SPI_CZ
112
113
114
I-DIM
115
E-DIM
116
117
118
119
120
121
122
123
124
125
126
127
128
+1.2V_VDDC_MST
A_MADR[11]
+1.8V_DDR
A_MADR[8]
204
205
L802
120-ohm
XOUT
78
+3.3V_MULTI_MST
82
NC_7 13
83
4 NC_2
89
SPI_DI
93
NC_8 14
94
SI.SIO0 15
97
3 NC_1
98
2 VCC
103
+3.3V_MULTI_MST
105
I2S_OUT
107
C811
0.1uF
108
SPI_CLK
110
SCLK 16
111
SCZ
SDO
1 HOLD
99
RXC0P
C807
0.01uF
80
GND_5
+3.3V_MULTI_MST
100
GND_6
RXC0N
+1.8V_DDR
101
RXC1P
RXC1N
R8003
10K
A_MCLKE
104
RXC2P
RXC2N
+3.3V_MST
90
VDDP_1
R8020
10K
81
VDDC_2
+3.3V_MST
UART2_RX/I2CM_SDA
91
VDDC_3
** Small HD : 19/22/26 Inch
** Non Small FHD : Normal(non 100Hz) FHD Model
109
SDI
SCK
USB1_DP
IC802
MX25L6405DMI-12G
84
DDCA_CK
SERIAL FLASH 64M
85
DDCA_DA
4.7K
R8010 4.7K R8011 +3.3V_MULTI_MST
R896
4.7K R898
4.7K
+3.3V_MULTI_MST
Small_HD
Non_Small_FHD
Small_HD
Small_FHD
R898-*2
R8010-*3
R896-*2
R8011-*3
4.7K
4.7K
4.7K
4.7K
100Hz
Non_Small_HD
Apollo
DDR2_A[0-12]
100Hz
R8010-*2
R8011-*2
R898-*1
R896-*1
4.7K
4.7K
4.7K
4.7K
Small_FHD
Non_Small_FHD Apollo
Apollo
R8010-*1
R8011-*1
4.7K
4.7K
Small_FHD
+5VST_MST
Non_Small_HD
AVDD_MPLL
242
243
79
AVDD_AU
R8010 R8011
X
4.7K
4.7K 4.7K
X
4.7K
4.7K
X
4.7K 4.7K
X
4.7K
SPDIFO
229
230
92
UART2_TX
UART2_RX
R898
X
X
X
4.7K
4.7K
4.7K
A_MADR[3]
216
217
106
USB1_DM
HOTPLUGC
R896
4.7K
4.7K
4.7K
X
X
X
95
RXCCKP
RXCCKN
DDCDC_CK
Small HD
Small FHD (27)
Non Small HD
Non Small FHD
Apollo
100HZ
86
DDCDB_CK
DDCDA_CK
*H/W OPTION
73
AUCOM
115
PWM3
112
PWM0
113
PWM1
114
PWM2
116
LVA4P
118
LVA3P
122
LVA2P
124
LVA1P
126
LVA0P
88
GPIO20
117
LVA4M
119
LVA3M
123
LVA2M
125
LVA1M
127
LVA0M
128
VDDP_2
120
LVACKP
121
LVACKM
102
AVDD_DM
96
DDCDC_DA
EAX56856904
H6 LCD MERCURY
XIN
244
GPIO134
245
GPIO135
246
GPIO138
247
GPIO139
248
GPIO140
249
IRIN
250
HSYNC0
251
VSYNC0
252
HSYNC1
253
UART2_TX/I2CM_SCK
231
UART1_RX/GPIO86
232
UART1_TX/GPIO87
233
GND_17
234
GND_18
235
USB0_DM
236
USB0_DP
237
SAR0
238
SAR2
240
SAR3
241
VDDC_6
218
I2S_IN_WS/GPIO67
219
I2S_IN_BCK/GPIO68
220
I2S_IN_SD
221
I2S_OUT_MCK
222
I2S_OUT_WS
223
VDDP_5
224
GND_16
225
VDDC_7
226
I2S_OUT_BCK
227
I2S_OUT_SD
228
A_WEZ
206
A_BADR[1]
207
A_BADR[0]
208
A_MADR[1]
209
A_MADR[10]
210
AVDD_DDR_6
211
A_MADR[5]
212
A_MADR[9]
213
A_MADR[12]
214
A_MADR[7]
215
GND_14
193
AVDD_MEMPLL
194
MVREF
195
A_ODT
196
A_RASZ
197
A_CASZ
198
A_MADR[0]
199
A_MADR[2]
200
A_MADR[4]
201
GND_15
202
A_MADR[6]
203
SAR1
239
87
DDCDB_DA
DDCDA_DA
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
DDR2_A[0-12]
DDR2_D[0-15]
C905
1000pF
C918
0.1uF
50V
V_REF
+1.8V_DDR
DDR2_DQS0M
DDR2_DQS1M
DDR2_DQM0
DDR2_DQM1
DDR2_DQS0P
DDR2_DQS1P
DDR2_RASZ
DDR2_CASZ
DDR2_WEZ
DDR2_ODT
DDR2_MCLK
DDR2_MCLKZ
DDR2_CKE
DDR2_BA1
DDR2_BA0
READY
R906
150
R901
56
R903
56
56
VDDL
VSSDL
NC3
NC2
NC1
NC6
NC5
NC4
UDQS
LDQS
UDM
LDM
UDQS
LDQS
WE
CAS
RAS
CS
ODT
CKE
CK
CK
BA1
BA0
A12
A11
J2
J1
J7
R8
E2
A2
R7
R3
L1
A8
E8
B3
F3
B7
F7
K3
L7
K7
L8
K9
K2
K8
J8
L3
L2
R2
P7
M2
P3
P8
P2
N7
N3
N8
N2
M7
M3
M8
H8
H2
F8
F2
E7
D8
D2
A7
B8
B2
P9
N1
J3
E3
A3
G9
G7
G3
G1
E9
C9
C7
C3
C1
A9
R1
M9
J9
E1
A1
B9
B1
D9
D1
D3
D7
C2
C8
F9
F1
H9
H1
H3
H7
G2
G8
VSSQ1
VSSQ2
VSSQ3
VSSQ4
VSSQ5
VSSQ6
VSSQ7
VSSQ8
VSSQ9
VSSQ10
VSS1
VSS2
VSS3
VSS4
VSS5
VDDQ1
VDDQ2
VDDQ3
VDDQ4
VDDQ5
VDDQ6
VDDQ7
VDDQ8
VDDQ9
VDDQ10
VDD1
VDD2
VDD3
VDD4
VDD5
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
DDR2 MEMORY
C919
10uF
10V
R905
56
R904
56
R902
56
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
VREF
IC900
HYB18TC512160B2F-2.5
DDR2_D[0-15]
A10/AP
V_REF
R900
C900
0.01uF
50V
DDR2_A[12]
DDR2_A[11]
DDR2_A[10]
DDR2_A[9]
DDR2_A[8]
DDR2_A[7]
DDR2_A[6]
DDR2_A[5]
DDR2_A[4]
DDR2_A[3]
DDR2_A[2]
DDR2_A[1]
DDR2_A[0]
Close to DDR2 IC
C904
0.01uF
+1.8V_DDR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DDR2
EAX56856904
H6 LCD MERCURY
1K
R907
1K
R908
+1.8V_DDR
DDR2_D[15]
DDR2_D[14]
DDR2_D[13]
DDR2_D[12]
DDR2_D[11]
DDR2_D[10]
DDR2_D[9]
DDR2_D[8]
DDR2_D[7]
DDR2_D[6]
DDR2_D[5]
DDR2_D[4]
DDR2_D[3]
DDR2_D[2]
DDR2_D[1]
DDR2_D[0]
C901
0.01uF
C902
0.01uF
C903
0.01uF
C906
0.01uF
Close to DDR2 IC
+1.8V_DDR
C907
0.01uF
C909
0.01uF
C910
0.01uF
DDR2
MSTAR
C908
0.01uF
C911
0.01uF
C912
0.01uF
C913
0.01uF
C914
0.01uF
C916
0.01uF
C917
0.01uF
8
9
2008/12/16
C915
0.01uF
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
NC
24V
GND
12V
GND
5.2V
5.2V
GND
GND
NC
R1005
1.2K
R1002
10K
5.2V
5
26"
23
21
19
17
15
13
11
9
7
25
2
24
22
20
18
16
14
12
10
8
6
4
Power ON
PWM Dim
24
R10450
CMO 32,42,47,57
R1043 0
NON CMO 32,42,47,57
R1042
0
R1041
0
CMO 57"
R1064
0
PWM Dim
Error Out
120-ohm
L1001
120-ohm
L1012
MLB-201209-0120P-N2
+5VST_MST
OPC_ENABLE
R1021
1K
OPC_DISABLE
R1075
1K
OPC_DISABLE
R1076
1K
NON 19_22"
R1022
1K
OPC_ENABLE
OPC_OUT
E-DIM
DISP_EN/VAVS_ON
+12V_AUDIO
+16V_NTP
NC
NC
5V
5V
GND
GND
15V
15V
RL_ON
C1053
0.01uF
PANEL_STATUS
11
10
C1044
2.2uF 16V
R1079
10K
I-DIM
R1023
0
NON (CMO 32,42,47,57, SHARP 32")
R1014
0
CMO 32,42,47,57
A.Dim
PWM_Dim
9
8
7
6
5
4
3
2
1
SMAW200-11
P1002
19_22"
+3.3V_MST
C1034
1uF 25V
READY
+5VST_MST
C1011
0.01uF
C1001
0.1uF
50V
Inverter_ON
C1052
10uF 16V
C1008
0.01uF
C1007
0.01uF
C1046
0.01uF
R1001 0
NON CMO 57"
3
R1003 10K
12
NON 19_22"
Q1000
2SC3875S
R1000
2.2K
P_24V_SMALL_15V
**OPC_ENABLE : USE LGD Module
C1045
2.2uF 16V R1044-*1
100
DC_DIM PWM_DIM
R1044 1K
DC_DIM
R1039
0
CMO 32,42,47
3
R1047 10K
1 2 Q1002
2SC3875S
R1046
3K
+5V_MULTI
VOUT
NON 19_22"
P_5V
GND
3
2
MAX 300mA
1
P_12V_SMALL_15V
P_5V
IC1007
AP2121N-3.3TRE1
VIN
R1054 4.7K
NON SHARP 32&52",AUO
25V
R1053
C1043
0
0.47uF
SHARP 52",AUO
NON SHARP 52",AUO
R1040 0
CMO 57"
C1003
10uF
16V
C1002
47uF 25V
C1006
68uF
35V
*ST 5V->3.3V
P_5V
P_12V_SMALL_15V
*SHARP32":DC DIMMING
Inverter ON
24V
GND
12V
GND
5.2V
5.2V
GND
GND
NON_19_22_26"
23
22
20
19
21
18
16
14
12
10
8
6
4
2
17
15
13
11
9
7
5
3
1
Power ON
Error Out
Inverter ON
24V
GND
12V
GND
5.2V
5.2V
GND
GND
P1000
FW20020-24S
NC
A.Dim
NC
24V
GND
12V
GND
1
3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D1002
SAM2333
+5V_MULTI
NC
A.Dim
+5VST_MST
LED Block
P_24V_SMALL_15V
P_12V_SMALL_15V
P_5V
R1077 0
READY
NC
5.2V
GND
GND
P1001
FM20020-24
.
L1000
CIC21J501NE
EAM58113401
R1074
0
P_24V_SMALL_15V
1/4W
5%
EAX56856904
H6 LCD MERCURY
19_22"
C1004
10uF
16V
C1017
10uF
16V
C1012
560pF
50V
R1008
12K
4
3
2
1
MAX 2A
5
6
7
8
PGND
SW
PVCC
EN
R1073
0
INPUT 3
C1054
0.1uF
R1068
10K
R1020
10K
R1048
R1049
33K
B
R1069
1.6K
R1070
22K
E
C
C1048
1uF
Q1004
RT1C3904-T112
P_5V
P_12V_SMALL_15V
L1008
CIC21J501NE
0
NON 19_22"
R1012
S2A 50V
19_22"
D1001
C1030
10uF
25V
R2
R1
C1056
1uF 25V
R1065
33K NON 19_22"
R1065-*1
19_22" 10K C
10K
B
Q1001
RT1C3904-T112
E
C1027
68uF
35V
READY
Close to Q1003
**DC-DC CONVERTER
12V->5V_TUNER/USB
POWER_SW
PANEL_ON
P_12V_SMALL_15V
1
2
1
G2
4
S2 3
G1
S1
Q1003
SI4925BDY
EBK32753101
R1057
30K
C1031
10uF
25V
R1058
5.6K
C1032
560pF
50V
BS 4
IN 3
GND2
FB 1
R2
C1018
10uF
16VR1010
3.3K
1%
R1009
2K
D1_2
5
D2_1
6 D2_2
7 D1_1
8
0
R1011
MAX 3A
IC1006
MP2212DN
5 VCC
6 SW_1
7 SW_2
8 EN/SYNC
R1059
10K
NON 19_22"
R1
C1035
1uF 25V
1
C1029
0.1uF
50V
R1007
56
1%
C1022
10uF
6.3V
R1013
0
R1004
120
5%
MSTAR
C1033
0.1uF
50V
C1000
10uF
16V
POWER
R1024
10
+5V_MULTI
L1009 3.6uH
C1024
0.1uF
50V
READY
R1056
10
+5V_MULTI
READY
R1051
2.2K
OUT:5V
R1050
2.2K
R2
R1
OUT:1.85V
C1023
0.1uF
50V
C1020
10uF
16V
R1052
2.2K
19_22"
R1015 10
C1025
0.1uF
16V
19_22"
+5V_USB
+5V_TUNER
+5V_MULTI
9
9
2008/12/16
RL_ON
Small(19_22")
3
R1017 10K
12
19_22"
Q1005
2SC3875S
R1016
4.7K
+5V_MULTI
19_22"
DDR2, Vref
NTP,AUDIO DSP
+1.8V
+5V_+12V_LCD
L1010
MLB-201209-0120P-N2
C1010
0.01uF
C1038
1uF 25V
READY
C1009
100uF16V
120-ohm
C1037
1uF 25V
READY
+1.8V_DDR
+3.3V_MULTI_MST
OUT:1.27V
+1.2V_VDDC_MST
L1013
MLB-201209-0120P-N2
C1036
1uF 25V
READY
V0 = 1.25*(1+(R2/R1))
OUT
ADJ/GND
3 MAX 1A 2
0LCML00003B
C1026
100uF
16V
R1018
2K
NON 19_22"
IC1002
AP1117EG-13
L1007
MLB-201209-0120P-N2
C1015
0.1uF
50V
IN
C1019
C1021
10uF 16V 0.01uF
C1005
0.1uF
C1016
10uF
10V
C1028
100uF 16V
2 OUTPUT OUT:3.3V
ADJ/GND
MAX 3A
V0 = 0.8*(1+(R1/R2))
L1006
L1005
120-ohm
120-ohm
19/22"(HD)/22"(FHD)/32"(Sharp) 26/27/32(LPL)/37/42/47/52"
P_5V
C1014
0 . 1 u F C1013
10uF
16V
16V
IC1003
AZ1085S-3.3TR/E1
R1078
3.3
READY
C1055
2200pF
50V
READY
L1002
2.2uH
10K
R1006
V0 = 0.8*(1+(R2/R1))
GND
ITH
VCC
IC1001
BD9130EFJ-E2
**Switch 12V:P12V
**Switch 5V:5V_MULTI -> 1.8V
+5V_MULTI
ADJ
**5V_MULTI->3.3V->1.2V
1/10W
1%
1/10W
P/NO : MFL60021513
Jan., 2009
Printed in Korea