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LCD TV
SERVICE MANUAL
CHASSIS : LP91A
MODEL : 26LH20R
26LH20R-MA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION................................................................11
TROUBLE SHOOTING ............................................................................16
BLOCK DIAGRAM...................................................................................19
EXPLODED VIEW .................................................................................. 20
SVC. SHEET ...............................................................................................
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
-2-
LGE Internal Use Only
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by
in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.
AC Volt-meter
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
To Instrument’s
exposed
METALLIC PARTS
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
-3-
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
0.15uF
1.5 Kohm/10W
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1 Ω
*Base on Adjustment standard
LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
-4-
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
-5-
LGE Internal Use Only
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
3. Test method
This spec sheet is applied to LCD TV used LP91A chassis.
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC
2. Specification
Each part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity : 65±10%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
4. Electrical specification
4.1 General Specification
No
Item
Specification
1
Screen Size
26” wide Color Display Module
2
Aspect Ratio
16:9
3
LCD Module
26” TFT WXGA LCD
4
Operating Environment
Temp.: 0 ~ 40 deg
Measurement
Remark
Resolution: 1366*768
HD
Humidity : 0 ~ 80 %
5
Storage Environment
Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6
7
Input Voltage
LDC Module
AC100-240V~, 50/60Hz
≤ 120 W
26” HD
HD
626 x 373 x 44.1
(Maker : LGD)
with inverter
0.1405 x 0.4215
12 EEFL
Coating
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
3H
-6-
LGE Internal Use Only
5. Chroma& Brightness (Optical)
5.1. LCD Module
the Color Coordinates check condition
- 50cm from the surface, Full White Pattern
- Picture mode Vivid
No.
Item
1.
Luminance
2.
VIew angle (R/L, U/D)
3.
Color Coordinates
Min.
Typ.
360
450
Max.
cd/m2
Unit
178/ 178
degree
Maker
Remark
(W/O PC mode)
White
RED
Green
Blue
4.
Contrast ratio
5.
Luminance Variation
Wx
Typ
0.279
Typ
Wy
-0.03
0.292
+0.03
Xr
0.637
Yr
0.333
Xg
0.290
Yg
0.607
Xb
0.145
Yb
0.061
700:1
LGD
CR > 10
LGD 26”(HD)
LC260WXN-SBA1
1000:1
LGD 26”(HD)
1.3
8. Component Video Input (Y, PB, PR)
Specification
No
Resolution
Remark
H-freq(kHz)
V-freq(Hz)
59.94
Pixel Clock(MHz)
1
720* 480
15.73
13.500
SDTV, DVD 480I( 525I)
2
720* 480
15.75
60.00
13.514
SDTV, DVD 480I( 525I)
3
720* 576
15.625
50.00
13.500
SDTV, DVD 576I( 625I) 50Hz
4
720* 480
31.47
59.94
27.000
SDTV 480P
5
720* 480
31.50
60.00
27.027
SDTV 480P
6
720* 576
31.25
50.00
27.000
SDTV 576P 50Hz
7
1280* 720
44.96
59.94
74.176
HDTV 720P
8
1280* 720
45.00
60.00
74.250
HDTV 720P
9
1280* 720
37.50
50.00
74.25
HDTV 720P 50Hz
10
1920* 1080
28.125
50.00
74.250
HDTV 1080I 50Hz,
11
1920* 1080
33.72
59.94
74.176
HDTV 1080I
12
1920* 1080
33.75
60.00
74.25
HDTV 1080I
13
1920* 1080
56.25
50
148.5
HDTV 1080P
14
1920* 1080
67.432
59.94
148.350
HDTV 1080P
15
1920* 1080
67.5
60.00
148.5
HDTV 1080P
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
-7-
LGE Internal Use Only
9. RGB
9.1 Analog PC, RGB- DTV –NOT SUPPORT
Specification
No
Resolution
H-freq(kHz)
Remark
V-freq(Hz)
Pixel Clock(MHz)
1
640* 350
31.468
70.09
25.17
EGA
2
720* 400
31.469
70.09
28.32
DOS
3
640* 480
31.469
59.94
25.17
VESA( VGA)
4
800* 600
37.879
60.317
40
VESA( SVGA)
5
1024* 768
48.363
60.004
65
VESA( XGA)
6
1280* 768
47.776
59.87
79.5
VESA( WXGA)
7
1360* 768
47.72
59.799
84.75
VESA( WXGA)
8
1280* 1024
63.668
59.895
109.00
XGA
Only FHD Model
9
1920* 1080
66.587
59.934
138.50
WUXGA(Reduced Blanking)
Only FHD Model
10. HDMI Input
10.1 PC –Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
640 x 480
31.469
59.94
25.17
VESA( VGA)
2
800 x 600
37.879
60.317
40.00
VESA( SVGA)
3
1024 x 768
48.363
60.004
65.00
VESA( XGA)
4
1280 x 768
47.776
59.87
79.5
VESA( WXGA)
5
1360 x 768
47.72
59.799
84.62
VESA( WXGA)
1
Resolution
Proposed
6
1366 x 768
47.7
60.00
84.62
WXGA
7
1280 x 1024
63.595
60.00
108.875
SXGA
8
1920 x 1080
66.647
59.988
138.625
WUXGA
Remark
10.2 DTV Mode
Specification
No
Resolution
H-freq(kHz)
Remark
V-freq(Hz)
Pixel Clock(MHz)
1
720 x 480
15.73
59.94
13.500
SDTV, DVD 480I(525I)
2
720 x 480
15.75
60.00
13.514
SDTV, DVD 480I(525I)
Spec. out
3
720 x 576
15.625
50.00
13.500
SDTV, DVD 576I(625I) 50Hz
but display.
4
720 x 480
31.47
59.94
27
SDTV 480P
5
720 x 480
31.5
60.00
27.027
SDTV 480P
6
720 x 576
31.25
50.00
27
SDTV 576P
7
1280 x 720
44.96
59.94
74.176
HDTV 720P
8
1280 x 720
45
60.00
74.25
HDTV 720P
9
1280 x 720
37.5
50.00
74.25
HDTV 720P
10
1920 x 1080
28.125
50.00
74.25
HDTV 1080I
11
1920 x 1080
33.72
59.94
74.176
HDTV 1080I
12
1920 x 1080
33.75
60.00
74.25
HDTV 1080I
13
1920 x 1080
56.25
50.00
148.5
HDTV 1080P
14
1920 x 1080
67.432
59.94
148.350
HDTV 1080P
15
1920 x 1080
67.5
60.00
148.5
HDTV 1080P
16
1920 x 1080
27
24.00
74.25
HDTV 1080P
17
1920 x 1080
33.75
30.00
74.25
HDTV 1080P
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
-8-
LGE Internal Use Only
11. Mechical spec.
No
Item
Min
Typ
Max
Unit
1.
C/ A + B/ C top gap
0.5
1
1.5
mm
2.
C/ A + B/ C side gap
0.5
1
1.5
mm
3.
C/ A + Deco Front gap( ONE SIDE).
0.8
1
1.2
mm
1) Gap between Front Frame /Back cover and Middle Cabinet
2) Gap between Front Frame /Middle Cabinet
Top View
Back Cover
"b
Middle Cabinet
"b
Front Frame
Gap b between Front Frame (Back cover) and Middle Cabinet
-> 0 † b † B (Side gap)
"b
Gap a between Front Frame and Middle Cabine
-> 0 † a † A (Side gap)
"a
Gap a between Front Frame and Middle Cabine
-> 0 † a † A (Left/ Right gap)
3) Gap between Back Cover and Side AV
Side View
Back View
Side AV
Back Cover
Gap f between Back Cover and Side AV
-> 0 † f † 1.0
Gap g between Back Cover and Side AV
-> 0 † g † 1.0
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
-9-
LGE Internal Use Only
4)Gap between Back Cover and Side AV
Side View
"h"
Control Braket
Back Cover
Gap h between Back Cover and Control Bracket
-> 0 † h † 0.8
*Active area
1. Active area of LCD PANEL is in bezel of cabinet
2. Interval between active area and bezel
|A-B|< 2.0 mm ,|C-D|< 2.0 mm
A:Interval between left of active area and bezel
B:Interval between right of active area and bezel
C:Interval between top of active area and bezel
D:Interval between bottom of active area and beze
C
Active Area
B
A
D
Bezel
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 10 -
LGE Internal Use Only
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV,
LP91A/B/C/D chassis.
(2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened
2) Click the “Connect” button and confirm “Dialog Box”
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 ±5 °C of temperature and 65±10% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) ADC Calibration – RGB / Component
(3) Input Tool-Option/Area option.
(4) Check SW Version.
4. PCB assembly adjustment method
4.1. Mstar Main S/W program download
3) Click the “Config.” button and Change speed I2C Speed
setting : 350Khz~400Khz
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
- LH20/ LH30
4) Read and write bin file.
Click “(1)Read” tab, and then load download
file(XXXX.bin) by clicking “Read”.
1
1
Filexxx.bin
Filexxx.
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 -
LGE Internal Use Only
5) Click “(2)Auto” tab and set as below
6) Click “(3)Run”.
7) After downloading, you can see the “(4)Pass” message.
4.2. Adjust tool/area option.
Adjust tool/area option refer to the BOM.
4.3. Adjust tool/area option.
Adjust tool/area option refer to the BOM.
4.4. EDID D/L method
Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data
4.1.2. Using the Memory Stick
* USB download : Service Mode
1) Insert the USB memory stick to the ISB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message “Copy the file from the Memory”
4.4.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2seconds.
4.4.2. 2nd Method
* Caution :
Must be checked that the tool option is right or not.
If tool option is wrong, hdmi edid data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear “OK”, then compele.
4) After Finished the Download, Automatically DC Off -> On
4.4.3. RS-232C command Method
(1) Command : AE 00 10
* Caution
Don’t connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of edid could be
failed.
5) Check The update SW Version.
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 12 -
LGE Internal Use Only
4.4.4. EDID data
(1) HD MODEL
<Analog(RGB): 128bytes>
4.5. ADC Calibration
4.5.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
<HDMI 1 : 256Bytes>
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : Component” by using D/E
(CH +/-) and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
<HDMI 2 : 256Bytes>
OK
4.5.2. ADC Calibration - RGB (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : RGB” by using D/E(CH +/-)
and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
OK
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 13 -
LGE Internal Use Only
4.6. Input Tool-Option, Area Option.
## TOOL Option, Area Option change and AC off
Before PCBA check, you have to change the Tool option,
Area option and have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
5.3. Connecting diagram of equipment for
measuring (For automatic adjustment)
4.6.1. Profile
: Must be changed the option value because being different
with some setting value depend on module maker, inch and
market
4.6.2. Equipment : adjustment remote control.
4.6.3. Adjustment method
The input methods are same as other chassis.(Use IN-START
Key on the Adjust Remocon.)
(If not changed the option, the input menu can differ the
model spec.)
* Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value
* Never push the IN-STOP KEY after completing the function
inspection.
* LP91A~D Support RS-232C & I2C DDC Communication-White
Balance Mode.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heatrun pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
4.7. Check SW Version
(1) Method
1) Push In-star key on Adjust remote-controller.
2) SW Version check
Check “SW VER : V3.xx” – LH20
(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with aging
command (F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5.3. Adjustment of White Balance (for Manual
adjustment)
5. White Balance adjstment
5.1. Overview
(1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
(2) Principle : To adjust the white balance without the
saturation, Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
(3) Adjustment mode : Three modes – Cool / Medium / Warm
5.2. Required Equipment
(1) Remote controller for adjustment
(2) Color Analyzer : CA100+ or CA-210 or same product LCD TV (ch:9)
(should be used in the calibrated ch by CS-1000)
(3) Auto W/B adjustment instrument(only for Auto adjustment)
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 14 -
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit” key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter “0000” (Password)
6) Select “3. W/B ADJUST”
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.
10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others
11) When adjustment is completed, Enter “COPY ALL”.
12) Exit adjustment mode using EXIT key on R/C.
LGE Internal Use Only
* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
Coordinate
Mode
Cool
x
y
0.276±0.002 0.283±0.002
Temp
uv∆
11000K
0.000
Medium
0.285±0.002 0.293±0.002
9300K
0.000
Warm
0.313±0.002 0.329±0.002
6500K
0.003
To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : User 1
Dynamic Contrast : Off
Dynamic Colour : Off
(If you miss the upper condition, the coordinates of W/B
can be lower than the spec.)
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
LGE Internal Use Only
TROUBLESHOOTING
No power
(LED indicator off)
:
[A] PROCESS
Fail
Check 24V, 12V, 5,2V
of Power B/D
Check short of Main B/D
or Change Power B/D
Pass
Fail
Check Output of
IC1001, IC1003, IC1007
Check short of IC1001,
IC1003, IC1007
Fail
Re-soldering or Change defect
part of IC1001, IC1003, IC1007
Pass
Pass
Change IC1002,, Q1003
Fail
Check LEDAssy
Change LEDAssy
Pass
Check P307 Connector
No Raster
[B]: Process
Pass
Check LED status
On Display Unit
Fail
Repeat A PROCESS
Pass
Check Panel Link Cable
Or Module
Fail
Change Panel Link Cable
Or Module
Fail
Change Inverter Connector
Or Inverter
Pass
Check Inverter Connector
Or Inverter
Pass
Check Output of IC802
Fail
Change IC802
Pass
Check LVDS Cable
Fail
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
Change Module
- 16 -
LGE Internal Use Only
No Raster on PC Signal
Pass
Check Input source Cable
and Jack
Pass
Check the Input/Output
Of J104
Fail
Re-soldering or
Change the defect part
Pass
Check the Input/Output
Of IC100
Fail
Re-soldering or
Change the defect part,
Check RGB EDID Data
Pass
Check the Input/Output
Of IC800
Fail
Re-soldering or
Change the defect part
Pass
Repeat [A], & [B] Process
No Raster on HDMI Signal
No Raster on COMMPONENT Signal
Pass
Pass
Check Input source
Cable And Jack
Check Input source
Cable And Jack
Pass
Pass
Check The Input/Output
Of JK101
Check the Input/Output
Of JK301, JK302, JK303
Fail
Re-soldering or
Change the defect part
Check the Input/Output
Of IC800
Fail
Re-soldering or
Change the defect part
Pass
Check the Input/Output
Of IC300, IC301, JK302
Pass
Fail
Re-soldering or
Change the defect part
Fail
Re-soldering or
Change the defect part
Check HDMI EDID Data
Re-download HDCP
Pass
Check the Input/Output
Of IC800
Fail
Re-soldering or
Change the defect part
Pass
Repeat [A], & [B] Process
Repeat [A], & [B] Process
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
LGE Internal Use Only
No Raster On AV (Video, S-Video)Signal
No Signal On TV(RF) Signal
Pass
Pass
Check Input source
Cable And Jack
Check Input source
Cable And Jack
Pass
Pass
Check The Input/Output
Of JK101, JK201
Fail
Re-soldering or
Change the defect part
Check The Input/Output
Of TU500
Fail
Re-soldering or
Change the defect part
Pass
Pass
Check the Input/Output
Of IC800
Fail
Re-soldering or
Change the defect part
Check the Input/Output
Of IC800
Pass
Fail
Re-soldering or
Change the defect part
Pass
Repeat [A], & [B] Process
Repeat [A], & [B] Process
No Sound
Check The Input Sourse.
Fail
Change The Source Input.
Pass
Check The Input/Output
Of IC600.
Fail
Re-soldering or
Change the defect part.
Pass
Check The Speaker.
Fail
Change Speaker.
Pass
Check The Speaker Wire.
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 18 -
LGE Internal Use Only
RGB_PC
EEPROM
24C02
PC_Aud io _L/ R :7 00m Vrms
PC_R/ G/ B/ HS/ VS
EEPROM
24C02
HDM 2_SCL/ SDA
IR
HDMI_DATA_1
HDMI_DATA_2
PC_SCL/ SDA
PC_R/ G/ B/ HS/ VS
COMP2_Y/ Pb / Pr: 1/0. 7Vp p
MNT_OUT RIN
COMP1_LIN/
COMP2_LIN/ RIN
AV1_VIN: 1Vp p
AV1
AV11_LIN/ RIN :5 00m Vrms
- 19 -
MNT_OUT: 1Vp p
MNT_VOUT
AV1_LIN/ RIN
MNT_LOUT/ ROUT: 500m Vrm s
TU_MAIN
TUNER
AUDIO
AMP
SUB_SCL / SDA
SIF
RS232
MAIN SCALER
MNT_L/ R OUT
TU_MAIN
SIF
232C Driver
ST3232C
TXD / RXD :5V Dig it al
USB
Fo r D/ L
OUT_E_TX_A
OUT_E_TX_A–
OUT_E_TX_B
OUT_E_TX_B–
OUT_E_TX_C
OUT_E_TX_C–
OUT_E_TX_CLK
OUT_E_TX_CLK–
OUT_E_TX_D –
OUT_E_TX_
OUT_E_TX_E –
OUT_E_TX_
OUT_O_TX_A–
OUT_O_TX_A
OUT_O_TX_B
OUT_O_TX_B–
OUT_O_TX_C
OUT_O_TX_C–
OUT_O_TX_CLK–
OUT_O_TX_C
OUT_O_TX_D
OUT_O_TX_D–
OUT_O_TX_E
OUT_O_TX_E–
USB_DN/ PN
USB
HDMI3
DDR2( 512MB)
AV1_VIN
MNT_OUT
Tx/ Rx : – 15Vp p
EEPROM( 256K)
COMP1_Y/ Pb / Pr: 1/ 0. 7Vp p
COMP2_Y/ Pb /Pr
/
: 1/ 0. 7Vp p
Co mp 1_L/ R :5 00mVrms
Co mp 2_L/ R :5 00mVrms
TV
( RF)
Serial Flas h
( 8MByt e)
PC_Aud io _L/ R
Pr : 1/ 0. 7Vp p
COMP1_Y/ Pb / P
COMP1
COMP2
TX
HDMI1_SCL/
_
SDA
TMDS
EEPROM
24C02
HDMI3_SCL/ SDA
HDMI_DATA_3
IIS_OUT
LGE Internal Use Only
AV2
( Sid e AV)
L VDS c onnec tor
PC_Aud io
EEPROM
24C02
TMDS
TMDS
BLOCK DIAGRAM
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
HDMI1
HDMI2
SIDE_L/ SIDE_R :5 00mVrms
SIDE_V : 1Vp p
AV2_LIN/ RIN
AV2_VIN
PWM
NTP3100L
R_CH
L_CH
R_SPK_OUT
L_SPK_OUT
510
803
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
805
310
500
801
550
900
LGE Internal Use Only
LV1
540
530
200N
120
121
802
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by
in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
- 20 -
A10
A2
800
200
200T
804
400
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
300
R8028
4.7K
C815
0.1uF
EEP_SDA
C819
10
10
R891
R892
10
10
PC_B
PC_G
+3.3V_MULTI_MST
PC_R
390
0.1uF
0.1uF
0.1uF
0.047uF
1000pF
0.047uF
0.047uF
0.047uF
R833
47
C827
0.047uF
R836
47
C829
0.047uF
R832
R834
R835
R837
R804
R815
R897
R802
47
47
470
47
47
47
47
47
C826
C828
C835
C830
C800
C801
C831
C832
0.047uF
0.047uF
1000pF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
COMP2_PR
SIDE_C
SIDE_Y
CVBS_VIN
SIDE_V
EEP_SDA
TV_MAIN
+12V_AUDIO
C810
R831
R857
R830
47
47
47
C834
C836
C837
0.047uF
0.047uF
0.047uF
R875
R876
MAIN_SIF
SIDE_LIN
SIDE_RIN
MNT_VOUT_T
MNT_L_AMP
MNT_R_AMP
R810
68
R842
C839
R845
C841
0.01uF
MULTI_PW_SW
DDR2_A[6]
DDR2_A[4]
DDR2_A[2]
DDR2_A[0]
R867 1K
DDR2_CASZ
DDR2_RASZ
DDR2_ODT
DDR2_A[11]
DDR2_A[8]
DDR2_BA0
DDR2_BA1
DDR2_WEZ
0.1uF
0.1uF
1K
C863
R868
AR800
56
AR815
56
AR814
56
AR813
56
56
AR812
56
R852
TXD
RXD
EEP_SCL
EEP_SDA
RL_ON
I2S_SDO
I2S_SCK
KEY2
KEY1
TXD
LED_R
IR
DSUB_SDA
RXD
C844
I2S_WS
I2S_MCLK
PANEL_STATUS
DDR2_A[3]
DDR2_A[7]
DDR2_A[12]
DDR2_A[9]
DDR2_A[5]
DDR2_A[10]
DDR2_A[1]
POWER_SW
0.1uF
100
R829
0
READY
0
READY
100 R8022
100 R8021
100
100
R8016
R8017
C883
AVDD_MEMPLL
MVREF
A_ODT
A_RASZ
A_CASZ
A_MADR[0]
A_MADR[2]
A_MADR[4]
GND_15
A_MADR[6]
A_MADR[8]
A_MADR[11]
A_WEZ
A_BADR[1]
A_BADR[0]
A_MADR[1]
A_MADR[10]
AVDD_DDR_6
A_MADR[5]
A_MADR[9]
A_MADR[12]
A_MADR[7]
A_MADR[3]
A_MCLKE
VDDC_6
I2S_IN_WS/GPIO67
I2S_IN_BCK/GPIO68
I2S_IN_SD
I2S_OUT_MCK
I2S_OUT_WS
VDDP_5
GND_16
VDDC_7
I2S_OUT_BCK
I2S_OUT_SD
SPDIFO
UART2_RX/I2CM_SDA
UART2_TX/I2CM_SCK
UART1_RX/GPIO86
UART1_TX/GPIO87
GND_17
GND_18
USB0_DM
USB0_DP
SAR0
SAR1
SAR2
SAR3
AVDD_MPLL
XOUT
XIN
GPIO134
GPIO135
GPIO138
GPIO139
GPIO140
IRIN
HSYNC0
VSYNC0
HSYNC1
VSYNC1
HWRESET
GND_14
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
250
251
192
B_MCLKZ
2
191
B_MCLK
3
190
B_MDATA[5]
4
189
B_MDATA[2]
5
188
B_MDATA[0]
6
187
B_MDATA[7]
7
186
AVDD_DDR_5
AVDD_33_1
8
185
B_MDATA[13]
RXB2N
9
RXBCKP
RXB0N
RXB0P
HOTPLUGB
RXB1N
RXB1P
RXB2P
RXACKN
RXACKP
RXA0N
RXA0P
AVDD_33_2
RXA1N
RXA1P
GND_1
RXA2N
RXA2P
1
184
B_MDATA[10]
10
183
GND_13
11
182
B_MDATA[8]
12
181
B_MDATA[15]
13
180
AVDD_DDR_4
14
179
B_DDR2_DQSB[1]
15
178
B_DDR2_DQS[1]
16
177
GND_12
17
176
VDDP_4
18
175
AVDD_DDR_3
19
174
B_DDR2_DQSB[0]
20
173
B_DDR2_DQS[0]
21
172
GND_11
22
171
B_DDR2_DQM[0]
23
IC800-*1
LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ]
HOTPLUGA
REXT
VCLAMP
REFP
REFM
BIN1P
SOGIN1
GIN1P
RIN1P
BINM
BIN0P
GINM
GIN0P
SOGIN0
RINM
RIN0P
AVDD_33_3
GND_2
BIN2P
GIN2P
SOGIN2
RIN2P
CVBS6
CVBS5
CVBS4
CVBS3
CVBS2
CVBS1
VCOM1
CVBS0
VCOM0
AVDD_33_4
170
B_DDR2_DQM[1]
24
169
AVDD_DDR_2
25
168
B_MDATA[14]
26
167
B_MDATA[9]
27
166
GND_10
28
165
B_MDATA[12]
29
164
B_MDATA[11]
30
163
AVDD_DDR_1
31
162
B_MDATA[6]
32
161
B_MDATA[1]
33
160
GND_9
34
159
B_MDATA[3]
35
158
B_MDATA[4]
36
157
VDDC_5
37
156
VDDP_3
38
155
GPIO58
39
154
GPIO57
40
153
GPIO56
41
152
GPIO55
42
151
GPIO54
43
150
GPIO53
44
149
GPIO52
45
148
GPIO51
46
147
GND_8
47
146
GPIO152/I2C_OUT_SD3
48
145
GPIO151/I2C_OUT_SD2
49
144
GPIO150/I2C_OUT_MUTE
50
143
VDDC_4
51
142
GND_7
52
141
AVDD_LPLL
53
140
LVB0M
54
SIF0P 55
139
LVB0P
138
LVB1M
137
LVB1P
136
LVB2M
135
LVB2P
134
LVBCKM
133
LVBCKP
132
LVB3M
131
LVB3P
130
LVB4M
129
LVB4P
CVBSOUT
125
126
127
128
124
LVA1P
LVA0P
LVA1M
LVA0M
VDDP_2
110
112
113
114
115
116
117
118
119
120
121
122
123
111
SCZ
SDO
PWM0
PWM1
PWM2
PWM3
LVA4P
LVA3P
LVA2P
LVA4M
LVA3M
LVA2M
LVACKP
LVACKM
96
97
98
99
100
101
102
103
104
105
106
107
108
82
83
84
85
86
87
88
89
90
91
92
93
94
95
68
69
70
71
72
73
74
75
76
77
78
79
80
81
65
66
109
SDI
SCK
AUL2
AUL0
AUL3
56
57
58
59
60
61
62
63
64
AUL5
AUR5
AUVRM
AUL4
SIF0M
VDDC_1
AUOUTL2
AUOUTR2
67
GND_3
AUOUTL1
AUOUTR1
AUL1
LGE Internal Use Only
[MODE SELECTION]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
252
256
RXBCKN
253
R884
1K
READY
254
R883
1K
R889
1K
255
R811
1K
READY
CEC
+3.3V_MULTI_MST
AUR1
+3.3V_MULTI_MST
AUR2
RESET
D803
KDS181
R864
AUR3
R887
33K
SYS_RESET
R863
4.7K
AUR4
C812
4.7uF
100
HDMI_3
4.7K
AUR0
+5VST_MST
R888
C814
0.1uF
+1.2V_VDDC_MST
+3.3V_MULTI_MST
Q803
RT1C3904-T112
2.2uF E
16V
RXC0P
2
B
TXCE4TXCE4+
TXCE3TXCE3+
TXCLKETXCLKE+
TXCE2TXCE2+
TXCE1TXCE1+
TXCE0TXCE0+
RXC1P
R8000
10K
1K
C8000
READY
0.1uF
RXC2P
2K
R853
SW800
JTP-1127WEM
3 1
Q800
ISA1530AC1
B E
C
R886
R855
10K
C
C842
TXCO4TXCO4+
TXCO3TXCO3+
TXCLKOTXCLKO+
TXCO2TXCO2+
TXCO1TXCO1+
TXCO0TXCO0+
GND_6
+5VST_MST
POWER_DET
+5VST_MST
D802
KDS181
C870
47uF25V
CVBS_LIN
CVBS_RIN
150
1K
1K
RL_ON
C871
4.7uF
10V
READY
R885
100
100
100
100
22K
+3.3V_MULTI_MST
R893 4.7K
0.01uF
GND_4
0
R8036
20K
19_22_26"
R861
Q804
NON 19_22"
RT1C3904-T112
R8037
C B R8007 33K
E
NON 19_22"
0
4
R860
2.2uF
2.2uF
NON 19_22"
R8001
D801
KDS181
C856
C861
R882
R881
R846
R847
GND
R800
READY
0
0.1uF
0.1uF
1K
OPC_EN
C850
GND_5
P_24V_SMALL_15V
P_12V_SMALL_15V
22K
0.01uF
C868
C869
R8018
MUTE_LINE R865 4.7K
SUB_SCL
R866 4.7K
SUB_SDA
S_VIDEO_DET
PANEL_ON R819 3.3K
DISP_EN/VAVS_ON
SW_RESET
DDC_WP
RXC0N
220
R807
402
READY
47
47
100
RXC1N
R8041
C
B
E
47
Q802
RT1C3904-T112
1K
RXC2N
R808
MNT_VOUT
MNT_VOUT_T
R809
470
E
C B
Q801
ISA1530AC1
0.01uF
0.1uF
R8042
GPIO20
GAIN X 4
C848
R8038
AUVRP
R8006 22
0.1uF
COMP2_PB
COMP2_Y
EEP_SCL
DDR2_D[6]
DDR2_D[1]
DDR2_D[3]
DDR2_D[4]
AUVAG
R8005 22
AR810
56
VDDP_1
SDA
DDR2_D[14]
DDR2_D[9]
DDR2_D[12]
DDR2_D[11]
AUCOM
5
C838
SCL
DDR2_DQM0
DDR2_DQM1
AR809
56
VDDC_3
4
WP
DDR2_DQS0M
DDR2_DQS0P
VDDC_2
6
VCC
MST99A88ML(MATRIX BASIC)
0.1uF
RXCCKP
7
3
C865
0.01uF
DDR2_DQS1M
DDR2_DQS1P
C849
RXCCKN
2
C862
0.01uF
DDR2_D[13]
DDR2_D[10]
DDR2_D[8]
DDR2_D[15]
AR806
56
USB1_DP
A2
8
C860
0.01uF
0.1uF
USB1_DM
A1
VSS
R817
4.7K
1
IC800
C853
DDCA_CK
A0
C858
0.01uF
DDR2_D[0-15]
DDR2_MCLKZ
DDR2_MCLK
DDR2_D[5]
DDR2_D[2]
DDR2_D[0]
DDR2_D[7]
DDCA_DA
IC803
CAT24WC08W-T
R8004
4.7K
C879
0.01uF
MSTAR
R814
R803
R816
R818
R838
R840
C804
C805
C806
47 C843
470 C846
47 C845
47 C847
47 C825
0.1uF
HWRESET 256
CEC 255
VSYNC1 254
HSYNC1 253
VSYNC0 252
HSYNC0 251
IRIN 250
GPIO140 249
GPIO139 248
GPIO138 247
GPIO135 246
GPIO134 245
XIN 244
XOUT 243
AVDD_MPLL 242
SAR3 241
SAR2 240
SAR1 239
SAR0 238
USB0_DP 237
USB0_DM 236
GND_18 235
GND_17 234
UART1_TX/GPIO87 233
UART1_RX/GPIO86 232
UART2_TX/I2CM_SCK 231
UART2_RX/I2CM_SDA 230
SPDIFO 229
I2S_OUT_SD 228
I2S_OUT_BCK 227
VDDC_7 226
GND_16 225
VDDP_5 224
I2S_OUT_WS 223
I2S_OUT_MCK 222
I2S_IN_SD 221
I2S_IN_BCK/GPIO68220
I2S_IN_WS/GPIO67219
VDDC_6 218
A_MCLKE 217
A_MADR[3] 216
A_MADR[7] 215
A_MADR[12] 214
A_MADR[9] 213
A_MADR[5] 212
AVDD_DDR_6 211
A_MADR[10] 210
A_MADR[1] 209
A_BADR[0] 208
A_BADR[1] 207
A_WEZ 206
A_MADR[11] 205
A_MADR[8] 204
A_MADR[6] 203
GND_15 202
A_MADR[4] 201
A_MADR[2] 200
A_MADR[0] 199
A_CASZ 198
A_RASZ 197
A_ODT 196
MVREF 195
AVDD_MEMPLL
194
GND_14 193
R880
R890
TMDS1_RX2TMDS1_RX2+
HPD_MST_1
C804/C805/C806:Close to IC
as close as possible
HDCP EEPROM
C878
0.01uF
AR805
56
AVDD_AU
22
TMDS1_RX1TMDS1_RX1+
33
33
AVDD_DM
R813
EEP_SCL
10
10
10
10
10
10
R843
R844
B_MCLKZ 192
B_MCLK 191
B_MDATA[5] 190
B_MDATA[2] 189
B_MDATA[0] 188
B_MDATA[7] 187
AVDD_DDR_5 186
B_MDATA[13] 185
B_MDATA[10] 184
GND_13 183
B_MDATA[8] 182
B_MDATA[15] 181
AVDD_DDR_4 180
B_DDR2_DQSB[1] 179
B_DDR2_DQS[1] 178
GND_12 177
VDDP_4 176
AVDD_DDR_3 175
B_DDR2_DQSB[0] 174
B_DDR2_DQS[0] 173
GND_11 172
B_DDR2_DQM[0] 171
B_DDR2_DQM[1] 170
AVDD_DDR_2 169
B_MDATA[14] 168
B_MDATA[9] 167
GND_10 166
B_MDATA[12] 165
B_MDATA[11] 164
AVDD_DDR_1 163
B_MDATA[6] 162
B_MDATA[1] 161
GND_9 160
B_MDATA[3] 159
B_MDATA[4] 158
VDDC_5 157
VDDP_3 156
GPIO58 155
GPIO57 154
GPIO56 153
GPIO55 152
GPIO54 151
GPIO53 150
GPIO52 149
GPIO51 148
GND_8 147
GPIO152/I2C_OUT_SD3 146
GPIO151/I2C_OUT_SD2 145
GPIO150/I2C_OUT_MUTE 144
VDDC_4 143
GND_7 142
AVDD_LPLL 141
LVB0M 140
LVB0P 139
LVB1M 138
LVB1P 137
LVB2M 136
LVB2P 135
LVBCKM 134
LVBCKP 133
LVB3M 132
LVB3P 131
LVB4M 130
LVB4P 129
UART2_TX
R8027
4.7K
22
10
10
R869
R871
R872
R873
R874
R879
RXBCKN
RXBCKP
RXB0N
RXB0P
HOTPLUGB
RXB1N
RXB1P
AVDD_33_1
RXB2N
RXB2P
RXACKN
RXACKP
RXA0N
RXA0P
AVDD_33_2
RXA1N
RXA1P
GND_1
RXA2N
RXA2P
HOTPLUGA
REXT
VCLAMP
REFP
REFM
BIN1P
SOGIN1
GIN1P
RIN1P
BINM
BIN0P
GINM
GIN0P
SOGIN0
RINM
RIN0P
AVDD_33_3
GND_2
BIN2P
GIN2P
SOGIN2
RIN2P
CVBS6
S-VIDEO
CVBS5
CVBS4
CVBS3
CVBS2
CVBS1
VCOM1
CVBS0
VCOM0
AVDD_33_4
CVBSOUT
GND_3
SIF0P
SIF0M
VDDC_1
AUL5
AUR5
AUVRM
AUOUTL2
AUOUTR2
AUOUTL1
AUOUTR1
UART2_RX
SDA
R812
R859
R862
TMDS2_RX2TMDS2_RX2+
TMDS1_RXCTMDS1_RXC+
TMDS1_RX0TMDS1_RX0+
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
HOTPLUGC
5
SCL
10
10
10
10
DDCDB_CK
4
C803
0.01uF
WP
R851
R854
R856
R858
DDCDC_CK
6
VCC
TMDS2_RXCTMDS2_RXC+
TMDS2_RX0TMDS2_RX0+
HPD_MST_2
TMDS2_RX1TMDS2_RX1+
DDCDC_DA
7
3
C864
0.01uF
DDCDA_CK
2
C877
0.01uF
+1.2V_VDDC_MST
DDCDB_DA
VSS
8
L802
120-ohm
DDCDA_DA
A2
0.1uF
HDMI_1
A1
C833
+3.3V_MULTI_MST
1
C859
0.01uF
+1.8V_DDR
AUL0
AUR0
AUL1
AUR1
AUL2
AUR2
AUL3
AUR3
AUCOM
AUL4
AUR4
GND_4
AUVRP
AUVAG
AVDD_AU
GND_5
VDDC_2
DDCA_CK
DDCA_DA
DDCDA_CK
DDCDA_DA
DDCDB_CK
DDCDB_DA
GPIO20
VDDP_1
VDDC_3
UART2_RX
UART2_TX
DDCDC_CK
RXCCKN
RXCCKP
DDCDC_DA
RXC0N
RXC0P
GND_6
RXC1N
RXC1P
AVDD_DM
RXC2N
RXC2P
HOTPLUGC
USB1_DM
USB1_DP
SCK
SDI
SDO
SCZ
PWM0
PWM1
PWM2
PWM3
LVA4P
LVA4M
LVA3P
LVA3M
LVACKP
LVACKM
LVA2P
LVA2M
LVA1P
LVA1M
LVA0P
LVA0M
VDDP_2
HDMI_2
EEPROM
A0
C857
0.01uF
+3.3V_MULTI_MST
65
66
67
68
69
70
71
72
73
Close to IC
74
PC_AUD_L
with width trace
75
PC_AUD_R
C809 10uF 16V
76
C813 0.1uF
77
78
C818 1000pF
79
C820 4.7uF
C840 0.01uF
L801
80
120-ohm
81
82
R894
0
DSUB_SCL
83
R899
0
DSUB_SDA
84
R8023
100
DDC_SCL1
85
R8024
100
DDC_SDA1
86
R8025
100
DDC_SCL2
87
R8026
100
DDC_SDA2
READY
88
R8033
0
POWER_DET
89
C882
0.1uF
90
R806
0
91
M_SDA
R870
0
92
M_SCL
R8039 100 HDMI3_SIDE
93
DDC_SCL3
R801
10 HDMI3_SIDE 94
TMDS3_RXCHDMI3_SIDE 95
R805
10
TMDS3_RXC+
R8040 100HDMI3_SIDE
96
DDC_SDA3
R820
10 HDMI3_SIDE 97
TMDS3_RX0HDMI3_SIDE
98
R821
10
TMDS3_RX0+
99
R822
10 HDMI3_SIDE 100
TMDS3_RX1R823
10 HDMI3_SIDE 101
TMDS3_RX1+
C876 0.01uF
102
R841
10 HDMI3_SIDE 103
TMDS3_RX2R848
10 HDMI3_SIDE 104
TMDS3_RX2+
105
HPD_MST_3
106
R826
0
USB_DN
107
USB PART USB_DP
R827
0
108
SPI_CLK
109
AR818
SPI_DI
33
110
SPI_DO
111
SPI_CZ
112
113
114
I-DIM
115
E-DIM
116
117
118
119
120
121
122
123
124
125
126
127
128
L800
120-ohm
READY
IC801
24LC256-I/SM
C866
10uF
DDC_WP
2.2uF
2.2uF
2.2uF
2.2uF
0.1uF
2.2uF
2.2uF
8 SO/SIO1 WP/ACC 9
SPI_DO
C867
0.1uF
R828
C
B
E
10K
Q805 READY
RT1C3904-T112
2.2uF
2.2uF
R878
4.7K
R824
R825
GND 10
X801
12MHz
7 CS
C802
C873
C874
C875
C808
C821
C822
SPI_CZ
R839
1M
NC_5 11
C823
C824
R877
4.7K
100
100
NC_6 12
6 NC_4
+3.3V_MULTI_MST
+3.3V_MULTI_MST
+1.2V_VDDC_MST
+1.8V_DDR
+1.8V_DDR
+3.3V_MULTI_MST
100
100
5 NC_3
SPI_DI
R850
R8012
NC_7 13
R895
R849
NC_8 14
4 NC_2
Close to IC as close as possible
I2S_OUT
SYS_RESET
CEC_C
PC_VS
PC_HS
SI.SIO015
3 NC_1
SPI_CLK
0
0
2 VCC
R8003
10K
R8035
R8034
SCLK 16
+3.3V_MST
C811
0.1uF
COMP2_L
COMP2_R
1 HOLD
R8020
10K
+3.3V_MST
DDR2_CKE
4.7K
R8010 4.7K R8011 +3.3V_MULTI_MST
R896
4.7K R898
4.7K
+3.3V_MULTI_MST
Small_HD
Small_HD
Non_Small_FHD
Small_FHD
R898-*2
R8010-*3
R896-*2
R8011-*3
4.7K
4.7K
4.7K
4.7K
100Hz
Non_Small_HD
100Hz
Apollo
DDR2_A[0-12]
R8010-*2
R8011-*2
R898-*1
R896-*1
4.7K
4.7K
4.7K
4.7K
Small_FHD
Non_Small_FHDApollo
Apollo
R8010-*1
R8011-*1
4.7K
4.7K
+5VST_MST
Small_FHD
Non_Small_HD
R8011
X
4.7K
4.7K
X
4.7K
4.7K
** Small HD : 19/22/26 Inch
** Non Small FHD : Normal(non 100Hz) FHD Model
+3.3V_MULTI_MST
C807
0.01uF
R8010
4.7K
4.7K
X
4.7K
4.7K
X
C816 20pF
IC802
MX25L6405DMI-12G
SERIAL FLASH 64M
R898
X
X
X
4.7K
4.7K
4.7K
C817 20pF
R896
Small HD
4.7K
Small FHD (27) 4.7K
Non Small HD
4.7K
Non Small FHD
X
Apollo
X
X
100HZ
SCHEMATIC DIAGRAM
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
*H/W OPTION
DDR2_D[0-15]
V_REF
1K
R907
+1.8V_DDR
1K
R908
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
DDR2_D[0-15]
C904
C905
0 . 0 1 u F 1000pF
C918
0.1uF
50V
V_REF
Close to DDR2 IC
IC900
HYB18TC512160B2F-2.5
DDR2_A[0-12]
VREF
J2
A0
M8
A1
M3
A2
M7
A3
N2
A4
N8
A5
N3
A6
N7
A7
P2
A8
P8
A9
DDR2_A[10]
P3
A10/AP
DDR2_A[11]
M2
A11
DDR2_A[12]
P7
A12
R2
DDR2_A[0]
DDR2_A[1]
DDR2_A[2]
DDR2_A[3]
DDR2_A[4]
DDR2_A[5]
DDR2_A[6]
DDR2_A[7]
DDR2_A[8]
DDR2_A[9]
BA0
DDR2_BA0
BA1
DDR2_BA1
R906
150
DDR2_MCLK
DDR2_MCLKZ
DDR2_CKE
READY
DDR2_DQM0
DDR2_DQM1
56
L3
C2
DQ9
D7
DQ10
DDR2_D[10]
D3
DQ11
DDR2_D[11]
D1
DQ12
DDR2_D[12]
D9
DQ13
DDR2_D[13]
B1
DQ14
DDR2_D[14]
B9
DQ15
DDR2_D[15]
A1
VDD5
E1
VDD4
J9
VDD3
VDD2
VDD1
L8
A9
VDDQ10
K7
C1
VDDQ9
L7
C3
VDDQ8
WE
K3
C7
VDDQ7
C9
VDDQ6
E9
VDDQ5
G1
VDDQ4
G3
VDDQ3
G7
VDDQ2
G9
VDDQ1
A3
VSS5
E3
VSS4
J3
VSS3
F7
B7
B3
R904
LDQS
56
E8
UDQS
A8
NC4
L1
NC5
R3
NC6
R7
NC1
A2
NC2
E2
NC3
R8
VSSDL
VDDL
J7
J1
N1
VSS2
P9
VSS1
B2
VSSQ10
B8
VSSQ9
A7
VSSQ8
D2
VSSQ7
D8
VSSQ6
E7
VSSQ5
F2
VSSQ4
F8
VSSQ3
H2
VSSQ2
H8
VSSQ1
C919
10uF
10V
DDR2 MEMORY
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DDR2_D[8]
DDR2_D[9]
Close to DDR2 IC
+1.8V_DDR
C901
0.01uF
C902
0.01uF
C903
0.01uF
C906
0.01uF
C907
0.01uF
C908
0.01uF
C909
0.01uF
C910
0.01uF
C911
0.01uF
C912
0.01uF
C913
0.01uF
C914
0.01uF
C915
0.01uF
C916
0.01uF
C917
0.01uF
K9
CAS
UDQS
DDR2_D[7]
+1.8V_DDR
R1
UDM
C900
0.01uF
50V
C8
DQ8
K2
56
+1.8V_DDR
DDR2_D[6]
F9
DQ7
CKE
F3
R905
56
DDR2_D[5]
F1
DQ6
M9
LDM
DDR2_DQS0M
DDR2_DQS1M
DDR2_D[4]
H9
DQ5
L2
R902
R903
56
DDR2_D[3]
H1
DQ4
J8
LDQS
R901
56
DDR2_D[2]
H3
DQ3
DDR2
DDR2_DQS0P
DDR2_DQS1P
DDR2_D[1]
DQ2
K8
CS
R900
DDR2_D[0]
DQ1
H7
CK
RAS
DDR2_RASZ
DDR2_CASZ
DDR2_WEZ
DQ0
G2
CK
ODT
DDR2_ODT
G8
+16V_NTP
C1006
68uF
35V
L1012
MLB-201209-0120P-N2
C1001
0.1uF
50V
C1046
0.01uF
P_12V_SMALL_15V
+12V_AUDIO
C1002
47uF 25V
120-ohm
P1001
FM20020-24
5.2V
10
5.2V
GND
11
12
GND
14
12V
12V
GND
24V
4
13
16
15
17
18
GND
C1008
0.01uF
C1011
0.01uF
IC1001
BD9130EFJ-E2
*ST 5V->3.3V
GND
ADJ
24V
NC
19
20
Inverter ON
A.Dim
21
22
Error Out
NC
23
24
PWM Dim
VCC
+5V_MULTI
ITH
IC1007
AP2121N-3.3TRE1
25
26"
C1003
10uF
16V
GND
8
9
6
120-ohm
Power ON
3
7
5.2V
+5VST_MST
VIN
3
2
MAX 300mA
1
C1004
10uF
16V
VOUT
C1053
0.01uF
C1052
10uF16V
GND
C1017
10uF
16V
+3.3V_MST
C1034
1uF 25V
READY
R1008
12K
GND
1
8
2
7
3
6
4
5
EN
PVCC
PGND
MAX 2A
C1012
560pF
50V
NON 19_22"
2
Power ON
GND
3
4
GND
GND
5
6
GND
5.2V
7
8
5.2V
5.2V
9
10
5.2V
GND
11
12
GND
12V
13
14
12V
R1
INPUT 3
C1054
0.1uF
R1013
0
2 OUTPUT OUT:3.3V
C1028
100uF16V
MAX 3A
1
15V
AP1117EG-13
IN
3 MAX 1A 2
OUT
C1015
0.1uF
50V
16
24V
17
18
24V
NC
19
20
Inverter ON
A.Dim
21
22
Error Out
24
PWM Dim
GND
P_24V_SMALL_15V
GND
5V
5V
R1
ADJ/GND
NC
A.Dim
+1.8V_DDR
120-ohm
C1022 C1023
0.1uF
10uF
50V
6.3V
C1037
1uF 25V
READY
R1007
56
1%
DDR2, Vref
+1.8V
NTP,AUDIO DSP
2
V0 = 1.25*(1+(R2/R1))
3
4
5
6
**Switch 12V:P12V
**Switch 5V:5V_MULTI -> 1.8V
P_5V
7
10
P_12V_SMALL_15V
L1006
L1005
120-ohm
120-ohm
19/22"(HD)/22"(FHD)/32"(Sharp) 26/27/32(LPL)/37/42/47/52"
8
R1049
33K
C1027
68uF
35V
READY
Close to Q1003
Inverter_ON
9
PWM_Dim
R1004
120
5%
PANEL_ON
Q1003
SI4925BDY
EBK32753101
C1056
1uF25V
R1065
33K NON 19_22"
S1
R1065-*1
19_22" 10K C
R1048 10K
B
Q1001
RT1C3904-T112
R1020
E
10K
11
P_5V
8
1
7 D1_1
S2 3
6 D2_2
G2
5
4
L1007
MLB-201209-0120P-N2
D1_2
G1 2
C1005
0.1uF
0LCML00003B R1050
2.2K
+5V_+12V_LCD
R1051
2.2K
R1052
2.2K
C1009
100uF16V
C1010
0.01uF
D2_1
+5V_MULTI
C1019
C1021
10uF 16V 0.01uF
C1048
1uF
R1070
22K
R1054 4.7K
NON SHARP 32&52",AUO
25V
R1053
C1043
0
0.47uF
SHARP 52",AUO
NON SHARP 52",AUO
R1001 0
NON CMO 57"
R1069
1.6K
PANEL_STATUS
POWER_SW
R1068
10K
C
B
+5V_MULTI
R1064 0
R1040 0
CMO 57"
R1041
0
CMO 57"
R1039
0
CMO 32,42,47
R1042
0
R1043 0
NON CMO 32,42,47,57
R1002
10K
C1045
2.2uF 16V R1044-*1
100
DC_DIM PWM_DIM
*SHARP32":DC DIMMING
+5V_MULTI
R1005
1.2K
R1046
3K
3
R1047 10K
1 2 Q1002
2SC3875S
R1044 1K
DC_DIM
LED Block
+5VST_MST
Q1004
RT1C3904-T112
E
R1014
0
CMO 32,42,47,57
R1059
10K
NON 19_22"
R1075
1K
R1
OPC_OUT
R1022
1K
OPC_ENABLE
R10450
CMO 32,42,47,57
**OPC_ENABLE : USE LGD Module
C1044
2.2uF 16V
19_22"
D1001
I-DIM
L1008
CIC21J501NE
P_12V_SMALL_15V
R2
R1058
5.6K
FB 1
C1032
560pF
50V
MAX 3A
C1030
10uF
25V
C1031
10uF
25V
8 EN/SYNC
GND2
7 SW_2
IN 3
6 SW_1
BS 4
C1025
0.1uF
16V
C1038
1uF 25V
READY
+5V_USB
R1018
2K
NON 19_22"
+5V_MULTI
L1009 3.6uH
19_22"
R1015 10
19_22"
R1024
10
5 VCC
C1035
1uF 25V
0
C1020
10uF
16V
R1056
10
+5V_MULTI
R1012
0
NON 19_22"
C1000
10uF
16V
C1024
0.1uF
50V
READY
S2A 50V
R1011
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
READY
IC1006
MP2212DN
R1057
30K
L1010
MLB-201209-0120P-N2
+5V_TUNER
OUT:5V
+5V_MULTI
C1026
100uF
16V
E-DIM
R1079
10K
D1002
SAM2333
V0 = 0.8*(1+(R1/R2))
R1023
0
NON (CMO 32,42,47,57, SHARP 32")
OPC_DISABLE
R1076
1K
OPC_ENABLE
R1021
1K
OPC_DISABLE
**DC-DC CONVERTER
12V->5V_TUNER/USB
DISP_EN/VAVS_ON
C1029
0.1uF
50V
C1033
0.1uF
50V
Small(19_22")
R1016
4.7K
3
R1017 10K
12
19_22"
Q1005
2SC3875S
19_22"
RL_ON
POWER
NC
NON_19_22_26"
L1013
MLB-201209-0120P-N2
OUT:1.85V
1
C1016
10uF
10V
1
+3.3V_MULTI_MST
IC1002
ADJ/GND
RL_ON
15V
15
23
OUT:1.27V
+1.2V_VDDC_MST
C1036
1uF 25V
READY
SMAW200-11
NON 19_22"
P_12V_SMALL_15V
GND
NC
R2
C1018
10uF
16VR1010
3.3K
1%
R2
GND
P_24V_SMALL_15V
0
P1002
3
R1003 10K
12
NON 19_22"
Q1000
2SC3875S
P_5V
R1073
19_22"
R1000
2.2K
1/4W
5%
1
R1074
0
NC
19_22"
P_12V_SMALL_15V
C1014
0 . 1 u FC1013
16V 10uF
16V
IC1003
AZ1085S-3.3TR/E1
P_5V
P_5V
R1078
3.3
READY
C1055
2200pF
50V
READY
V0 = 0.8*(1+(R2/R1))
P1000
FW20020-24S
R1077 0
READY
10K
R1006
L1002
2.2uH
SW
R1009
2K
2
1
5
5.2V
**5V_MULTI->3.3V->1.2V
+5VST_MST
1/10W 1/10W
1%
NC
GND
GND
C1007
0.01uF
L1001
P_5V
.
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
L1000
CIC21J501NE
EAM58113401
P_24V_SMALL_15V
IC601
+1.8V
HOTEL_OPT
L606
Q600
RT1C3904-T112
+1.8V_AVDD
0LCML00003B
L605
READY
120-ohm
C642
10uF
35V
C615
0.1uF
R604
3.3
C617
0.1uF
+1.8V_DVDD
C619
390pF
C621
390pF
R610 R638
12
12
C632
0.47uF
C669
0.1uF R623
4.7K
MULTI_PW_SW
MNT_L_AMP
R614 5.6K
R626
3.3
C671
0.01uF
0
R631
22KREADY
R627
0
+3.3V_MULTI_MST
+1.8V_AVDD
VDR1B
C622
0.1uF
1
42
NC
2
41
VDR2A
3
40
BST2A
AD
4
39
PGND2A_2
DVSS_1
5
38
PGND2A_1
VSS_IO 6
37
OUT2A_2
36
OUT2A_1
35
PVDD2A_2
C605
C603
0.1uF
1000pF
C601
100pF
R600
3.3K
+1.8V_AVDD
C600
10uF
16V
C602
0.1uF
VDD_IO
8
IC600
NTP-3100L
34
PVDD2A_1
33
PVDD2B_2
32
PVDD2B_1
12
31
OUT2B_2
13
30
OUT2B_1
TEST0 14
29
PGND2B_2
DGND_PLL
9
AGND_PLL
10
LFM
11
AVDD_PLL
DVDD_PLL
NON_HOTEL_OPT
HOTEL_OPT
Main AMP
6 INPUT2- INPUT3- 9
MNT_ROUT
7 OUT2
B
E
R606
4.7K
C624
1uF
R622
6.8K
R616-*12K
C
OUT3 8
R609
1K
C628
6800pF
C625
22000pF
SPK_R+
R658 R653
12
12
C630
L607
390pF
2S DA-8580 2F
+16V_NTP
C634
390pF
C626
0.1uF
C629
0.1uF
R621
12
C644
0.1uF
C648
R628 0.01uF
4.7K
R671
3.3
C673
1S
1F 0.47uF
EAP38319001
R654
12
AUDI
I2S_MCLK
GND 11
5 INPUT2+ INPUT3+ 10
R615 5.6K
R616 10K
BST1A
7
4 VCC
SPK_L-
MNT_R_AMP
RESET
CLK_I
3 INPUT1+ INPUT4+ 12
C635
0.01uF
SPK_L-
C618
1uF
VDR1A
C608
R601 100 1uF
C606
1000pF
2 INPUT1- INPUT4- 13
+12V_AUDIO
R625
3.3
Q601
RT1C3904-T112
R624
READY
C631 33pF
C633 33pF
BST1B
PGND1B_1
1S
1F
EAP38319001
R613 10K
R618
6.8K
43
PGND1B_2
OUT1B_1
OUT1B_2
L603
2S DA-8580 2F
NON_HOTEL_OPT
SPK_L+
C672
0.01uF
READY
SW_RESET
R607
1K
R605
4.7K
+12V_AUDIO
44
45
46
47
48
49
PVDD1A_1
PVDD1B_1
PVDD1A_2
OUT1A_1
OUT1A_2
PGND1A_1
PVDD1B_2
50
51
52
53
E
Q603
RT1C3904-T112
54
PGND1A_2
R630
10K
C
10KB
R629
C616
22000pF
22000pF
55
C611
C637 R663
0.1uF 4.7K
1 OUT1 LM324DOUT4 14
C627
6800pF
MNT_LOUT
R608 R611
12
12
+3.3V_MST
R613-*12K
B
E
C612
330uF35V
C613
0.01uF
MLB-201209-0120P-N2
0LCML00003B
C
C620
0.1uF
+16V_NTP
120-ohm
MLB-201209-0120P-N2
56
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
AMP :GAIN X 4
+12V_AUDIO
C643
0.1uF
R667
4.7K
R635
3.3
C647
0.01uF
SPK_R-
C614
1uF
100
100
R677
R678
R602 R603
100 100
R656 0
HOTEL_OPT
100
R676
C610
0.1uF
R673 0
C651
1000pF
50V
28
PGND2B_1
27
BST2B
26
VDR2B
25
FAULT
23
22
24
MONITOR_2
MONITOR_1
MONITOR_0
+1.8V_DVDD
C609
10uF16V
21
SCL
20
SDA
19
BCK
17
15
18
WCK
DVDD
SDATA
C607
0.1uF
50V
DVSS_2
C604
10uF
16V
16
+1.8V_DVDD
C623 22000pF
MULTI_PW_SW
Chinese Hotel Option
+16V_NTP
SPK_R-
1
SPK_R+
2
SPK_L-
3
SPK_L+
4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
I2S_SDO
I2S_WS
I2S_SCK
M_SDA
M_SCL
AMP_MUTE_HOTEL
P600
SMAW250-04
C638
33pF
50V
READY
R620 0
C636 HOTEL_OPT
0.1uF
HOTEL_OPT
2
3
AUDIO_R
C639
33pF
50V
READY
P601
12505WR-09A00
HOTEL_OPT
1
+3.3V_MULTI_MST
4
HOTEL_OPT
AMP_MUTE_HOTEL
R612 200 B
HOTEL_OPT
R617 SW_RESET
10K
HOTEL_OPT
C Q602
RT1C3904-T112
HOTEL_OPT
E
R619 0
5
6
7
SPK_R+_HOTEL
8
SPK_R-_HOTEL
9
10
LGE Internal Use Only
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
TU500-*1
TAFT-H203F
TU500
TAFT-Z203D
1
1 NC_1
2
+5V_TUNER
2 GND_1
3 +B[5V]
4 NC_2
5 RF_AGC
3
Near the pin
C501
0.01uF
C508
10uF
16V
C505
100uF16V
C506
100uF16V
4
C509
100uF16V
5
L500
120-ohm
6
NTSC_TUNER
READY
6 TP[3.3V_OPT]
7 NC_3
8 GND_2
L502
10uH
READY
15 A-OUT
16 SIF-OUT
17 NC_6
18 NC_7
8
9
+5V_TUNER
R504 47
M_SDA
R505 47
M_SCL
C502
27pF
10
L501
L501-*1
120-ohm
C503
0.1uF
50V
R506
220
R507
220
11
0
0 Ohm
C504
READY
12
TV_MAIN
13
E
B
R502
4.7K
14
Q502
ISA1530AC1
C
15
C507
82pF
READY
16
17
MAIN_SIF
18
19
19 NC_8
20 NC_9
21
SHIELD
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
20
21
SHIELD
GND_1
+B[5V]
NC_2
RF_AGC
TP[3.3V_OPT]
NC_3
GND_2
SDA
SCL
MOPLL_AS
NC_4
V-OUT
NC_5
A-OUT
SIF-OUT
NC_6
NC_7
NC_8
NC_9
TUNER
9 SDA
10
PAL_TUNER SCL
C500
27pF
11 MOPLL_AS
12 NC_4
13 V-OUT
14 NC_5
7
NC_1
SW_HPD : USE SW HPD (Default)
MST_HPD : USE MST HPD
+5V_MULTI
+5V_MULTI
+5V_HDMI_3
+5V_HDMI_2
IC301
CAT24C02WI-GT3
C
R301
10K
B
E
A0
A1
A2
22
VSS
1
8
2
7
3
4
6
5
R314
1K
HPD_MST_3
Q302C
2SC3875S
R312
10K
IC302
CAT24C02WI-GT3
B
E
R327 100
SCL
R304 100
SDA
R305 100
R309 R311
10K 10K
C301
0.01uF
A0
A1
DDC_WP
A2
JACK_GND
20
VSS
19 HPD
19
D302
KDS184S
RT1C3904-T112
VCC
WP
A1
D301
KDS184S
A2
+5V_HDMI_3
R303
1K
RT1C3904-T112
A1
Q301
HPD_MST_2
A2
+5V_HDMI_2
C
2SC3875S
C
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
OPTION
1
8
2
7
3
4
6
5
VCC
WP
R329 100
SCL
R317 100
SDA
R318 100
R319 R320
10K 10K
C300
0.01uF
DDC_WP
18+5V_POWER
18
17DDC/CEC_GND
17
DDC_SDA2
DDC_SCL2
JP301
16
15
JP300
14
CEC
TMDS2_RXCTMDS2_RXC+
TMDS2_RX0TMDS2_RX0+
TMDS2_RX1TMDS2_RX1+
TMDS2_RX2TMDS2_RX2+
13
12
11
10 CLK+
9 DATA08 DATA0_SHIELD
7 DATA0+
6 DATA15 DATA1_SHIELD
4 DATA1+
3 DATA22 DATA2_SHIELD
1 DATA2+
20JACK_GND
16 SDA
15 SCL
JP304
DDC_SDA3
DDC_SCL3
JP305
14 NC
13 CEC
12 CLK11 CLK_SHIELD
10 CLK+
9 DATA08 DATA0_SHIELD
7 DATA0+
6 DATA15 DATA1_SHIELD
4 DATA1+
3 DATA22 DATA2_SHIELD
1 DATA2+
CEC
TMDS3_RXCTMDS3_RXC+
TMDS3_RX0TMDS3_RX0+
TMDS3_RX1TMDS3_RX1+
TMDS3_RX2TMDS3_RX2+
.
HDMI
21
KJA-ET-0-0032
JK303
JK302
QJ41193-CFEE1-7F
+5V_MULTI
+5V_HDMI_1
Q300C
R300
10K
IC300
CAT24C02WI-GT3
B
+3.3V_MST
A1
R302
1K
D300
KDS184S
C
HPD_MST_1
A2
+5V_HDMI_1
RT1C3904-T112
E
2SC3875S
A0
A1
A2
22
VSS
1
8
2
7
3
6
4
5
VCC
WP
R331 100
SCL
R306 100
SDA
R307 100
R308 R310
10K 10K
C302
0.01uF
DDC_WP
19
18
17
JP302
16
15
JP303
14
13
12
11
10 CLK+
9 DATA08 DATA0_SHIELD
7 DATA0+
6 DATA15 DATA1_SHIELD
4 DATA1+
3 DATA22 DATA2_SHIELD
1 DATA2+
TMDS1_RX2+
20JACK_GND
21
JK301
QJ41193-CFEE1-7F
CEC
TMDS1_RXCTMDS1_RXC+
TMDS1_RX0TMDS1_RX0+
TMDS1_RX1TMDS1_RX1+
TMDS1_RX2-
.
DDC_SDA1
DDC_SCL1
Q303
BSS83
CEC_READY
D
B
S
G
R315
68K
CEC_READY
D303
MMBD301LT1G
30V
CEC_READY
R313
0
R316
56K
CEC_READY
CEC_C
CEC
D304
CDS3C30GTH
30V CEC_READY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LGE Internal Use Only
JK100
PPJ226-01
9A [GN]1P_CAN
4A [GN]O-SPRING_A
3A [GN]CONTACT_A
COMP2_Y
ZD102
SD05
SD05
ZD103
R109
75
ZD101
SD05
R108
75
ZD100
SD05
R107
75
D101
30V
R104
220K
D100
30V
R100
220K
ZD104
SD05
R110
75
9B [BL]1P_CAN
8B [BL]C-LUG_A
COMP2_PB
9C [RD]1P_CAN_1
8C [RD]C-LUG_A
COMPONENT1
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
COMPONENT1, AV1, MNT_OUT[JACK PACK TYPE D] : JK100
COMP2_PR
9D [WH]1P_CAN
8D [WH]C-LUG_A_1
R114
9E[RD]1P_CAN_2
10K
COMP2_L
R118
12K
4E[RD]O-SPRING_A_1
3E [RD]CONTACT_A_1
9F [YL]2P_CAN
R102 75
MNT_VOUT
5J
6J
10K
COMP2_R
R117
12K
4F [YL]O-SPRING_A
16V 100uF C102
C100
MUTE_LINE
Q100
RT1C3904-T112
POP NOISE
C103
100pF
READY
C
B E
R105 0
HOTEL_OPT
R106 0
NON_HOTEL_OPT
SPK_R+_HOTEL
MNT_ROUT
16V 10uF C101
R101 0
HOTEL_OPT
AUDIO_R
MUTE_LINE
POP NOISE
7K
D102
30V
NON_HOTEL_OPT
8G [WH]C-LUG_A_2
9H [RD]2P_CAN
[RD]O-SPRING_B
5L
4H [RD]O-SPRING_A_2
[RD]CONTACT_B
6L
3H [RD]CONTACT_A_2
R115 10K
D104
30V
R111
220K
D105
30V
R112
220K
R119
12K
R116 10K
CVBS_LIN
CVBS_RIN
R120
12K
D103
30V
NON_HOTEL_OPT
C
B
Q101
RT1C3904-T112E
S-VIDEO(China Model)
S-VIDEO
JK101
PSJ014-01
D107
30V
C-LUG1
SIDE_C
R122
75
S-VIDEO
+3.3V_MULTI_MST
1
C-LUG2
R123
10K
2
GND
0-SPRING
6
S_VIDEO_DET
3
C-LUG3
4
5
7
C-LUG4
C104
OPT
READY
D106
30V
SHIELD
LGE Internal Use Only
ZD106
SD05
ZD107
SD05
SIDE_Y
R121
75
S-VIDEO
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT1
16V 10uF
CVBS_VIN
SD05
ZD105
AV1
[WH]C-LUG_B
MNT_LOUT
3F [YL]CONTACT_A
9G [WH]2P_CAN
R103 0
HOTEL_OPT
SPK_R-_HOTEL
MNT_OUT
[YL]O-SPRING_B
[YL]CONTACT_B
R113
ADUC30S03010L_AMODIODE
+5V_MULTI
JK200
JK202
KCN-DS-1-0088
+3.3V_MST
C204
0.1uF
V+
C200
0.1uF
16 VCC
C201
0.1uF
C1- 3
14 T1OUT
13 R1IN
C2-
5
12
6
11 T1IN
7
10 T2IN
T2OUT
R2IN 8
100
R204
4.7K
C
A
AC
C
A
AC
ENKMC2837-T112
D212
PC_B
ZD200
SD05
R208
68
ZD201
SD05
GND_1
10
C213
68pF
R214
4.7K
V_SYNC
14
5
RXD
TXD
R213
75
NC
4
D204
ADUC30S03010L_AMODIODE
R207
68
BLUE
10
30V
H_SYNC
13
9
9
R205
4.7K
R212
75
BLUE_GND
4
+3.3V_MST
9 R2OUT
PC_G
GREEN
3
IR_OUT
IR_OUT
DSUB_SDA
DDC_DATA
8
8
D201
ADUC30S03010L_AMODIODE
30V
R1OUT
R211
75
GREEN_GND
12
3
R203
PC_R
RED
7
2
ENKMC2837-T112
D211
C
GND_2
11
2
7
AC
RED_GND
1
100
D200
ADUC30S03010L_AMODIODE
30V
C2+ 4
VC202
0.1uF
R202
15 GND
2
6
6
A
1
C1+ 1
C207
0.1uF
6630TGA004K
IC200
ST3232CDR
C203
0.1uF
C206
0.1uF
KCN-DS-1-0089
ENKMC2837-T112
D210
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
PC
RS-232C (CI ITEM)
R215
4.7K
C211
68pF
PC_HS
PC_VS
SYNC_GND
5
DSUB_SCL
DDC_CLOCK
15
DDC_GND
16
ADUC30S03010L_AMODIODE
30V
D209
SHILED
SIDE AV
JK201
4A [YL]O_SPRING
5A[YL]CONTACT
JK203
PEJ024-01
SIDE_V
5.6B
ZD202
3
R227
75
5.6B
ZD203
6A
7A
3B[WH]C_LUG
10K
R224
D206
30V
SIDE_LIN
R226
R223
220K
10K
R225
D205
30V
SIDE_RIN
R228
12K
R222
220K
R237 0
Non_OCP
+5V_USB
OCP_READY
220uF
C212 16V
SIDE_USB
Pin to Pin with
EAN43439401
3
USB_DP USB_DL_P
2
1
D208
30V
READY
UB01123-4HHS-4F
R201
0
D207
30V
READY
4
It’s possibel to 27~47ohm
R200
USB_DN USB_DL_N
0
5
REAR_USB
2
1
0
C
AC
REAR_USB
JK205
C210 10uF6.3V
1A Design
3
KJA-UB-4-0004
0
R230
5 4
USB_DL_P
USB DOWN STREAM
USB_DL_N
USB DOWN STREAM
100uF
C214 16V
**
R_SPRING
5
T_SPRING
R235
12K
PC_AUD_L
R234
7B
B_TERMINAL2
6B
T_TERMINAL2
8
SHIELD_PLATE
2C[RD]U_CAN
L201 500
4
R231
220K
D203
30V
CDS3C30GTH
R232
220K
R236
12K
READY
5C[RD]CONTACT
Close to SIDE_USB
D202
30V
CDS3C30GTH
B_TERMINAL1
10K
4C[RD]O_SPRING
JK204
R233
12K
READY
2B[WH]U_CAN
REAR_USB
R229
PC_AUD_R
T_TERMINAL1
10K
2A [YL]U_CAN
USB
E_SPRING
IC202 OCP_READY
MIC2009YM6-TR
6 VOUT
OCP_READY
R206
160
VIN 1
5 ILIMIT
GND 2
4 FAULT/
ENABLE 3
R209
1K
OCP_READY
PC EDID
+5VST_MST
IC201
CAT24C02WI-GT3
A
KDS226
D213
R238
510
OCP_READY
L200
120OHM
OCP_READY
R210
4.7K
OCP_READY
C208
0.1uF
OCP_READY
A0
A1
C209
10uF
OCP_READY
A2
VSS
1
8
2
7
3
6
4
5
R219
4.7K
VCC
R220
4.7K
R221
4.7K
C205
0.01uF
READY
WP
R216
100
SCL
R217
100
SDA
R218
100
DDC_WP
DSUB_SCL
DSUB_SDA
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT2
PC SOUND
PPJ218-01
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
PANEL WAFER
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO
1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
TF05-51S
IR(Non 19/22/26)
CONTROL KEY(Non 19/22/26)
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO
1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
+5V_+12V_LCD
P401
+5V_+12V_LCD
+5V_+12V_LCD
P402
P403
SMW200-28C
FF10001-30
1
1
1
2
2
3
3
4
4
5
5
6
6
2
3
4
5
L411 500-ohm
NON_19_22_26"
L410 500-ohm
NON_19_22_26"
SUB_SCL
HD(26/32/37/42/47")
7
SUB_SDA
R420
4.7K
NON_19_22_26"
L403 120ohm
+3.3V_MST
8
R421
4.7K
KEY1
L406 120ohm
C404
470pF
C412
470pF
KEY2
NON_19_22_26"
C408
0.1uF
NON_19_22_26"
9
10
10
12
13
C411
0.1uF
NON 22/27" FHD
R419 0
R422 0
NON 22/27" FHD
+5VST_MST
3
4
5
6
C406
47uF
16V
ZD402
8
9
11
12
TXCE4-
24
KEY2
FHD
IR
5V_ST
25
26
27
+5VST_MST
GND
+5VST_MST
WARM_ST(LED_R_BIG)
ZD400
IR
L402 120ohm
C403
C407
47pF
+3.3V_MULTI_MST
10
TXCE4+
23
GND
POWER_ON(LED_R_SMALL)
0.1uF
READY
+3.3V_MST
R426 47K
IR-OUT
NON_19_22_26"
NON_19_22_26" R417
0
L407 120-ohm
ST_3.3V(LED_B)
C414
R427
10K
IR-OUT
R400
B
0
R429
10K
IR-OUT
R428 10K
IR-OUT
B
C
29
30
R430 22
IR-OUT
IR_OUT
23
33
12
E Q405
2SC3052
IR-OUT
TXCE1+
15
16
TXCE2-
17
TXCE2+
18
TXCE0TXCE0+
19
TXCE1-
20
TXCE1+
22
TXCE0-
23
TXCE0+
24
25
25
R401 R402
R402
0
8 B I T o r 5 2 s h a r p10BIT(FHD)4.7K X
8BIT(HD)
8BIT(FHD)
52 sharp
32 sharp
X
X
X
X
0
0
0
X
*8BIT(FHD):22/27"
26
+3.3V_MULTI_MST
26
27
27
28
29
28
R435
470
OPC_ENABLE
30
31
R405
READY
0
R411
1K
OPC_EABLE
C B
OPC_EN
OPC_ENABLE
E
Q400
RT1C3904-T112
OPC_ENABLE
TXCLKO+
35
OPC_OUTPUT
TXCLKO-
36
37
38
OPC_OUT
TXCO3+
R412
TXCO3-
OPC_ENABLE
0
HD(19/22")
E-DIM
External VBR
TXCO4+
39
TXCO4-
40
.
14
TXCE1-
34
R403
13
TXCLKE+
24
R401
4.7K
10BIT
TXCO2+
TXCO2-
32
READY
0.1uFNON_19_22_26"
16V
TXCO0+
TXCO0TXCO1+
TXCO1-
11
TXCLKE-
21
22
+3.3V_MULTI_MST
31
C Q404
E 2SC3052
IR-OUT
0
NON_19_22_26"
13
NON 22/27" FHD
R425 0
R431 0
NON 22/27" FHD
TXCE2+
21
TXCE3-
22
KEY1
20
TXCE3+
21
GND
19
TXCLKE-
20
28
7
18
10
TXCE3+
TXCE2-
17
TXCLKE+
9
TXCE3-
41
42
43
44
45
46
+3.3V_MULTI_MST
47
48
IR(19/22/26")
19_22_26"
P405
50
51
1
2
3
4
5
6
7
8
KEY1
R409
100
R407
4.7K
JEIDA
R424
0
VESA
READY
READY
R413
0
52
KEY2
GND
5V_ST
+3.3V_MULTI_MST
GND
IR
LED_B
LED_R
19_22_26"
L408
BG1608B121F
C405
100pF
50V
19_22_26"
9
.
NON 22/27" FHD
R423 0
49
19_22_26"
L405
BG1608B121F
C402
100pF
50V
19_22_26"
R404
10K
19_22_26"
R416 0
READY
R410 10K
19_22_26"
19_22_26" C B
Q401 E
2SC3052
CONTROL KEY
(19/22/26")
SUB_SCL
+3.3V_MST
R414
10K
19_22_26"
19_22_26"
P404
+3.3V_MST
SMAW200-03
19_22_26"
L400
BG1608B121F
R406
4.7K
19_22_26"
C
Q402 E
2SC3052
19_22_26"
B
LGE Internal Use Only
R418 0
READY
R415 10K
19_22_26"
KEY1
KEY1
L401
BG1608B121F
LED_R
KEY2
KEY2
19_22_26"
19_22_26" C400
100pF
50V
C401
GND
100pF19_22_26"
50V
1
2
3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LVDS/ CTR KEY
2
16
TXCE2-
19
L404
120-ohm
8
TXCLKE+
14
18
SCL
ZD401
13
15
17
SDA
12
TXCE2+
16
P400
12507WS-12L
7
TXCLKE-
11
15
NON_19_22_26"
1
TXCE0+
TXCE0TXCE1+
TXCE1-
14
NON_19_22_26"
6
TXCE3+
8
9
11
NON_19_22_26"
NON_19_22_26"
7
TXCE3-
P/NO : MFL60021514
Feb., 2009
Printed in Korea