Download Texas Instruments DEM-DSD1796 User's Manual

Transcript
DEM-DSD1796/PCM1795/PCM1796/PCM1798
DSD1796/PCM1795/PCM1796/PCM1798 Evaluation Module
User's Guide
Literature Number: SLEU057A
September 2004 – Revised May 2009
2
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Contents
Preface ............................................................................................................................... 5
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2
2.1
2.2
2.3
2.4
2.5
................................................................................................................ 7
Functional Block Diagram .................................................................................................. 8
EVM Features ................................................................................................................ 8
System Requirements ....................................................................................................... 9
Electrostatic Discharge Warning ........................................................................................... 9
Function Control for DAI Interface Format ............................................................................... 9
Reset Operation.............................................................................................................. 9
SW006 Operation Control for DAC ...................................................................................... 10
Jumper Connection ........................................................................................................ 10
Demonstration Software ................................................................................................... 10
Description
............................................................. 11
DEM-DAI/ASDAC Printed Circuit Board Layout ........................................................................ 12
DEM-AS/CDAC Printed Circuit Board Layout .......................................................................... 15
DEM-DAI/ASDAC Schematics............................................................................................ 17
DEM-AS/CDAC Schematics .............................................................................................. 19
Component Lists ........................................................................................................... 20
2.5.1 DEM-AS/CDAC_96/98 Parts List................................................................................ 20
2.5.2 DEM-DAI/ASDAC_96/98 Parts List ............................................................................. 20
Schematics, PCB Layout, and Bill of Materials
Revision History ................................................................................................................. 22
Important Notices ............................................................................................................... 23
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Contents
3
www.ti.com
List of Figures
1-1
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
2-10
DEM-DSD1796/PCM1795/PCM1796/PCM1798 Block Diagram ...................................................... 8
DEM-DAI/ASDAC Silkscreen ............................................................................................. 12
DEM-DAI/ASDAC (Top View) ............................................................................................ 13
DEM-DAI/ASDAC (Bottom View)......................................................................................... 14
DEM-AS/CDAC Silkscreen ................................................................................................ 15
DEM-AS/CDAC (Top View) ............................................................................................... 15
DEM-AS/CDAC (Bottom View) ........................................................................................... 16
DEM-DAI/ASDAC Analog Section (Sockets for Daughterboard and Low-Pass Filter)............................ 17
DEM-DAI/ASDAC Connector and Regulator ........................................................................... 17
DEM-DAI/ASDAC Digital Section (Digital Audio Interface) ........................................................... 18
DEM-AS/CDAC ............................................................................................................. 19
List of Tables
1-1
1-2
2-1
2-2
4
Digital Audio Receiver Configuration ...................................................................................... 9
SW006 Options ............................................................................................................. 10
Bill of Materials ............................................................................................................. 20
Bill of Materials ............................................................................................................. 20
List of Figures
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Preface
SLEU057A – September 2004 – Revised May 2009
Read This First
About This Manual
This document provides the information needed to set up and operate the
DEM-DSD1796/PCM1795/PCM1796/PCM1798 EVM evaluation module, a test platform for the 24-bit,
192-kHz, sampling stereo DSD1796, PCM1795, PCM1796, and PCM1798 audio digital-to-analog
converters (DACs). For a more detailed description of these devices, refer to the specific device product
data sheet available from the Texas Instruments web site at http://www.ti.com.
How to Use This Manual
Throughout this document, the abbreviation EVM and the term evaluation module are synonymous with
the DEM-DSD1796/PCM1795/PCM1796/PCM1798 EVM. Unless specifically noted, the information
presented in this manual applies to the DSD1796, PCM1795, PCM1796, and PCM1798 audio stereo
DACs.
Chapter 1 describes the hardware setup guide for the EVM, including the necessary information required
to configure the EVM switches and jumpers for product evaluation. This chapter also explains how to use
the software provided with the DEM-DSD1796/PCM1795/PCM1796/PCM1798 EVM for controlling the
DAC.
Chapter 2 includes the EVM electrical schematics, printed circuit board (PCB) layouts, and the bills of
material for both the DEM-DSD1796/PCM1795/PCM1796/PCM1798, the DEM-AS/CDAC, and the
DEM-DAI/ASDAC.
Information About Cautions and Warnings
This document contains caution statements.
CAUTION
This is an example of a caution statement. A caution statement describes a
situation that could potentially damage your software or equipment.
The information in a caution or a warning is provided for your protection. Please read each caution and
warning carefully.
If You Need Assistance
If you have questions regarding either the use of this evaluation module or the information contained in the
accompanying documentation, please contact the Texas Instruments Product Information Center at (972)
644–5580 or visit the TI web site at www.ti.com.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can
radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable
protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user at his own expense is required to
take whatever measures may be required to correct this interference.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
I2S is a trademark of NXP Semiconductors.
TOSLINK is a trademark of Toshiba Corporation.
All other trademarks are the property of their respective owners.
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Read This First
5
Trademarks
www.ti.com
Trademarks
All trademarks are the property of their respective owners.
6
Read This First
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Chapter 1
SLEU057A – September 2004 – Revised May 2009
Description
The DEM-DSD1796/PCM1795/PCM1796/PCM1798 is an evaluation fixture for the DSD1796/PCM1795/
PCM1796/PCM1798 series of 24-bit, 192-kHz sampling stereo DACs. This EVM provides all necessary
connectors and circuitry for interfacing to audio test systems and commercial audio equipment.
Topic
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
..................................................................................................
Page
Functional Block Diagram ............................................................ 8
EVM Features ............................................................................. 8
System Requirements ................................................................. 9
Electrostatic Discharge Warning .................................................. 9
Function Control for DAI Interface Format ..................................... 9
Reset Operation.......................................................................... 9
SW006 Operation Control for DAC .............................................. 10
Jumper Connection ................................................................... 10
Demonstration Software ............................................................ 10
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Description
7
Functional Block Diagram
1.1
www.ti.com
Functional Block Diagram
Figure 1-1 illustrates the functional block diagram of the DEM-DSD1796/PCM1795/PCM1796/PCM1798
EVM.
I/V
5534a
CN003
Serial
Connector
S/PDIF IN
OPT
Coax
DAI
CS8414
BAL Amp
5534a
LchOUT
(4.5 VRMS)
BAL Amp
5534a
RchOUT
(4.5 VRMS)
I/V
5534a
DSDS1796
PCM1795
PCM1796
PCM1798
I/V
5534a
SW001-003
Mode Control
I/V
5534a
DEM-AS/CDAC Daughter Card
3.3-V
Regulator
+VCC
(5 V)
±AVCC
(±15 V)
Figure 1-1. DEM-DSD1796/PCM1795/PCM1796/PCM1798 Block Diagram
1.2
EVM Features
The DEM-DSD1796/PCM1795/PCM1796/PCM1798 series of stereo DACs consist of a DAI (S/PDIF)
section that uses a DSD1796/PCM1795/PCM1796/PCM1798 DAC section, a differential current/voltage
(I/V) section, and a balanced amplifier with a post-low-pass filter (LPF) section.
The DEM-DSD1796/PCM1795/PCM1796/PCM1798 requires a 5-V digital power supply for its digital
circuits, a 5-V analog power supply for the device itself, and a ±15-V analog power supply for the
balanced amplifier circuits.
The DAI section has both coaxial and optical inputs that are switch-selectable and capable of handling
sampling rates up to 96 kHz.
The DSD1796/PCM1795/PCM1796/PCM1798 accepts PCM audio data input at a sampling rate up to 192
kHz, or a 64-fS DSD signal input, as determined by functional control settings and jumper connections on
the board.
This evaluation fixture uses the DEM-DSD1796/PCM1795/PCM1796/PCM1798 demonstration board and
demonstration software for functional evaluation and operational control of the
DSD1796/PCM1795/PCM1796/PCM1798 DAC device.
8
Description
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
System Requirements
www.ti.com
1.3
System Requirements
The DEM-DSD1796/PCM1795/PCM1796/PCM1798 EVM has the following requirements:
• ±15-V analog power supply at AVCC+, AVCC–, and GND
• 5-V DAC power supply at VCC and GND
• S/PDIF input (sampling rate fS is up to 96 kHz) connected at the coaxial or optical connector
• RCA analog output connected at CN103 (Lch) and CN104 (Rch); analog full-scale output level is 4.5
VRMS.
• PC connected to printer connector CN003 for demonstration software operation (if necessary)
• Appropriate test module:
– DEM-PCM1795: for PCM1795
– DEM-PCM1796: for PCM1796
– DEM-DSD1796: for DSD1796
– DEM-PCM1798: for PCM1798
1.4
Electrostatic Discharge Warning
Many of the components on the DEM-DSD1796/PCM1795/PCM1796/PCM1798 EVM are susceptible to
damage by electrostatic discharge (ESD). Customers are advised to observe proper ESD handling
precautions when unpacking and handling the EVM, including the use of a grounded wrist strap at an
approved ESD workstation.
CAUTION
Failure to observe ESD handling procedures may result in damage to EVM
components.
1.5
Function Control for DAI Interface Format
SW001, SW002, and SW003 are switches for controlling the audio interface format of the DAI receiver
CS8414. The default audio interface format of the DSD1796/PCM1795/PCM1796/PCM1798 is I2S™
format. Table 1-1 lists the digital audio receiver configuration parameters.
Table 1-1. Digital Audio Receiver Configuration
SW002
SW003
Receiver Output Data
Format
L
L
L
16- to 24-bit left–justified
L
H
L
16- to 24-bit l2S
SW001
1.6
H
L
H
16-bit right-justified (or
standard)
L
H
H
18-bit right-justified (or
standard)
Reset Operation
Pressing the SW004 pushbutton initiates a reset operation of the CS8414.
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Description
9
SW006 Operation Control for DAC
1.7
www.ti.com
SW006 Operation Control for DAC
Switch SW006 is the register set and reset control for the PCM1796 and DSD1796. The RESET section of
the switch must be set to H except to perform a reset operation. Table 1-2 shows the options for SW006.
Table 1-2. SW006 Options
1.8
SW006 RESET
Function
H
Normal operation (default)
L
Reset operation
Jumper Connection
JP001 selects the normal or inverted BCK signal for 24-bit left-justified or other formats (I2S); the default
position is I2S.
1.9
Demonstration Software
Demonstration software is provided to control the PCM1796/DSD1796 internal register using a PC that is
running the Microsoft® Windows® operating system. This software uses a printer cable to connect the PC
to the DEM-PCM/DSD1796 connector CN003.
The demonstration software includes a total of five files in the DEM1796 directory of the supplied CD.
These files are:
• DEM1796.exe
• DEM1796.ini
• Vbrjp200.dll
• Ver.dll
• Inpout.dll
To load the software, first copy these files to a convenient directory (folder), such as:
C:\DEM1796
Then, change the printer-port address in the DEM1796.ini initialization file to:
&H378, &H278, or &H3BCO
Most PCs use &H378 as the default printer-port address.
10
Description
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Chapter 2
SLEU057A – September 2004 – Revised May 2009
Schematics, PCB Layout, and Bill of Materials
This chapter provides the DEM-DAI/ASDAC and the DEM-AS/CDAC printed circuit boards and
schematics. The bill of materials (BOM) is included for component and manufacturer reference.
Note:
Board layouts are not to scale. These are intended to show how the board is laid out; they
are not intended to be used for manufacturing DEM-DAI1753/54/55 EVM PCBs.
Topic
2.1
2.2
2.3
2.4
2.5
..................................................................................................
DEM-DAI/ASDAC Printed Circuit Board Layout .............................
DEM-AS/CDAC Printed Circuit Board Layout ................................
DEM-DAI/ASDAC Schematics .....................................................
DEM-AS/CDAC Schematics ........................................................
Component Lists.......................................................................
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Page
12
15
17
19
20
Schematics, PCB Layout, and Bill of Materials
11
DEM-DAI/ASDAC Printed Circuit Board Layout
2.1
www.ti.com
DEM-DAI/ASDAC Printed Circuit Board Layout
Figure 2-1 through Figure 2-3 illustrate the printed circuit board (PCB) layout for the DEM-DAI/ASDAC.
Figure 2-1. DEM-DAI/ASDAC Silkscreen
12
Schematics, PCB Layout, and Bill of Materials
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
DEM-DAI/ASDAC Printed Circuit Board Layout
www.ti.com
Figure 2-2. DEM-DAI/ASDAC (Top View)
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Schematics, PCB Layout, and Bill of Materials
13
DEM-DAI/ASDAC Printed Circuit Board Layout
www.ti.com
Figure 2-3. DEM-DAI/ASDAC (Bottom View)
14
Schematics, PCB Layout, and Bill of Materials
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
DEM-AS/CDAC Printed Circuit Board Layout
www.ti.com
2.2
DEM-AS/CDAC Printed Circuit Board Layout
Figure 2-4 through Figure 2-6 illustrate the PCB layout for the DEM-AS/CDAC.
Figure 2-4. DEM-AS/CDAC Silkscreen
Figure 2-5. DEM-AS/CDAC (Top View)
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Schematics, PCB Layout, and Bill of Materials
15
DEM-AS/CDAC Printed Circuit Board Layout
www.ti.com
Figure 2-6. DEM-AS/CDAC (Bottom View)
16
Schematics, PCB Layout, and Bill of Materials
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
DEM-DAI/ASDAC Schematics
www.ti.com
2.3
DEM-DAI/ASDAC Schematics
The schematic for the sections of the DEM-DAI/ASDAC are shown in Figure 2-7 through Figure 2-9.
VCC1
(NC)
C101
10uF
/16V
RST
MDO
MUTE
VCC
VDD
GND
VDD
GND
GND
(NC)
GND
(NC)
RESET
(NC)
MDO
(NC)
MDI
VOUTL
MC
MC
VOUTL+
ML
ML
GND
AGND
AGND
GND
SCLK
C105 8200pF
VCC
MDI
CLKO
R109 200
CN102
XB 3 7 20
CN101
XB 3 7 20
VDD
D_SCLK
VOUTR
CLKO/D_BCK
VOUTR+
P_SCLK
C102
10uF
/16V
AVCC
BCK
P_BCK
AVCC+
LRCK
P_LRCK
(NC)
DATA
P_DATA
GND
DSD_L
GND
U101
NJM5534
C103
0.027uF
R103
220
R107
180
R111
200
AVCC+
C109
10uF
/16V
7
2
6
3
R113
100
4
C107
8200pF
CN103
RCA pj
C111
10uF
/16V
AVCC
AVCC
AVCC+
R110 200
C106 8200pF
(NC)
DSD_R
R105
180
R101
220
R106
180
R102
220
U102
NJM5534
C104
0.027uF
R104
220
D SCLK
R108
180
R112
200
D BCK
AVCC+
2
C110
10uF
/16V
7
6
3
C108
8200pF
CN104
RCA pj
R114
100
4
C112
10uF
/16V
AVCC
DSD R
DSD L
Figure 2-7. DEM-DAI/ASDAC Analog Section (Sockets for Daughterboard and Low-Pass Filter)
VCC2
CN057
Banana
Jack
(Black)
CN056
Banana
Jack
(Red)
CN058
VCC1
CN055
Banana
Jack
(Black)
VDD
CN054
Banana
Jack
(Red)
CN053
Banana
Jack
(Blue)
CN052
Banana
Jack
(Gray)
CN051
Banana
Jack
(Orange)
AVCC+
U051
REG1117 3.3
2 OUT
IN 3
GND
1 C055
0.1uF
C058
0.1uF
C057
100uF
/16V
C051
0.1uF
C052
100uF
/16V
C053
100uF
/16V
C054
100uF
/16V
AVCC
C056
10uF
/16V
Figure 2-8. DEM-DAI/ASDAC Connector and Regulator
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Schematics, PCB Layout, and Bill of Materials
17
DEM-DAI/ASDAC Schematics
www.ti.com
VDD
1
18
CN003
57LE 40360 7700(D3)
19
36
C014
0.1 uF
U006
74VHC244
SW006
DSS104 1
1
VCC
2
19
2
[MDO]
3
18
3
[MDI]
4
17
5
16
6
15
7
14
8
13
4
[MC]
[ML]
RA001
47k x5
VCC2
CN002
FFC 2BMEP1
U002
2
3
C005
10uF C006
/16V 0.1uF
4
5
6
U001
TORX173
7
3 (TORX179P)
8
C002 0.01uF
9
10
C003
10uF
/16V
11
C001
0.01uF
12
13
14
28
VERF
C
Cd/F1
Ce/F2
Cc/F0
SDATA
CS8414
(L001)
C004
0.1uF
CN001
RCA pj
Cb/E2
Ca/E1
ERF
M1
M0
C0/E0
VD+
VA+
AGND
DGND
RXP
FILT
RXN
MCK
26
2
25
3
12
C007
4
11
23 C008 10uF
22 0.1uF /16V
5
10
21
7
24
SCK
M3
CS12/FCK
SEL
U
CBL
6
EXT
17
0.1 uF
17
5
16
6
15
7
14
8
13
[DATA] 9
12
[e-DATA]
(FIL001) (C016)
3 IN OUT 2 0.1uF
VCC
4
[LRCK]
10
GND
[e-DATA]
[e-LRCK]
14
13
3
12
4
11
5
10
6
9
GND
8
CN006
XB 3 7 20
C017
10uF
/16V
[SCLK]
[BCK]
[LRCK]
SW001
FT1D 2M
SW002
SW003
FT1D 2M FT1D 2M
[SCLK]
JP001
FFC-4BMEP1
[DATA]
[BCK]
[BCK(INV)]
[LRCK]
[DATA]
11
GND
U005
74VHC244
1
C012
10uF
/16V
[BCK]
20
18
[e-LRCK]
SW004
FP1F 2M
8
VCC
2
19
[BCK]
R004
470
0.1 uF
74VHC14
1
15
3
[e-BCK]
13
9
GND
C010
U003
R002
470
16
2
[SCLK]
D001
1SS133
14
18
C009
0.068uF
1
[e-SCLK]
ML
19
M2
C013
VCC
7
[e-BCK]
MC
20
FSYNC
FT2D 2M
0.1 uF
74HCT32
1
SW005
R001
75
C011
U004
27
DAI select
INT(CS8414)
[e-SCLK]
MDI
R003
47k
1
2 456
MDO
11
GND
CN007
XB-3-7-20
1
RST
12
9
10
C018
10uF
/16V
20
[RST ]
JP002
AGND
FFC
2BMEP1
SCLK
BCK
LRCK
(C015)
100uF/16V
DATA
DSD-L
24
(CN004)
FFC 48BMEP1
1
DSD-R
D-BCK
D-SCLK
48
25
Figure 2-9. DEM-DAI/ASDAC Digital Section (Digital Audio Interface)
18
Schematics, PCB Layout, and Bill of Materials
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
DEM-AS/CDAC Schematics
www.ti.com
2.4
DEM-AS/CDAC Schematics
Figure 2-10 shows the schematic for the sections of the DEM-AS/CDAC.
C011
R005
Vcc1
2
GND
GND
RESET
MDO
MDI
MC
ML
AGND
D_SCLK
CLKO/D_BCK
P_SCLK
DSD_R
P_BCK
P_LRCK
P_DATA
DSD_L
(R001)
C009
0.1uF
U001
DSD1796
1
2
3
4
5
C002 6
0.1uF 7
8
9
10
C001
11
10uF/16V 12
13
14
VCC2L
DSDR
AGND3L
DBCK
IOUTL
IOUTL+
PDATA/DFD/PDI AGND2
PBCK
VCC1
SCKI
VCOML
DGND
VCOMR
VDD
IREF
MS
AGND1
MDI
IOUTR
MC
MDO
RST
(R003)
(R004)
IOUTR+
AGND3R
VCC2R
C004
0.1uF
28
27
26
25
24
C007
23
0.1uF
22
21 R002
20
10k
19
18
17
16
15
C003
10uF
/16V
U003
NJM5534
3
5
C016
22pF
4
R009
820
C018
10uF/16V
C019
2700pF
8
820
C021
U004
NJM5534
C016
Jumper
3
5
C020
22pF
C023
(R008)
R010
2
U005
NJM5534
3
5
C024
22pF
VCC
VCC
GND
GND
(NC)
(NC)
(NC)
(NC)
VOUTL
VOUTL+
GND
GND
VOUTR
VOUTR+
(NC)
AVCC
AVCC+
(NC)
10uF
7 /16V
6
8
4
2
(R007)
C013
10uF/16V
C017
10uF
7 /16V
6
2
C006
10uF
/16V
C005
10uF
/16V
6
3
8
4
5
C010
C012
C014
Jumper
22pF
10uF/16V
C015 2700pF
R006
DSDL
PLRCK/WDCK
C008
10uF
/16V
Vcc1
820
7
U002
NJM5534
(NC)
MUTE
VDD
VDD
2700pF
GND
GND
C022
10uF/16V
2700pF
820
C025
10uF
7 /16V
6
8
4
C026
10uF/16V
Figure 2-10. DEM-AS/CDAC
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Schematics, PCB Layout, and Bill of Materials
19
Component Lists
2.5
www.ti.com
Component Lists
2.5.1 DEM-AS/CDAC_96/98 Parts List
Table 2-1 lists the bill of materials for the DEM-AS/CDAC_96/98.
Table 2-1. Bill of Materials
Qty
RefDes
11
C001, C003, C008,
C013, C014, C017,
C018, C021, C022,
C025, C026
2
C002, C007
2
C004, C009
2
0
Item
Value
Mfr Part No
10 µF/16 V
ROA–16V100M
ELNA
Film capacitor
0.1 µF
AMFF0050J104
Nissei
Chip film capacitor
0.1 µF
ECHU1C104JB
Matsushita
C005, C006
AL ELE capacitor
10 µF/16 V
ROA-16V100M
ELNA
C010, C027
Film capacitor
0.1 µF
AMFF0050J104
Nissei
4
C011, C015, C019,
C023
Film capacitor
2700 pF
APSF0100J272
Nissei
4
C012, C016, C020,
C024
Ceramic capacitor
22 pF
RPE131CH220J50
Murata
1
R001
Resistor
47 kΩ
SN14C2C–47kΩF
KOA
1
R002
Resistor
10 kΩ
SN14C2C–10kΩF
KOA
2
R003, R007
Resistor
4.7 kΩ
SN14C2C–4.7kΩF
KOA
Not mounted
6
R004, R005, R006,
R008, R009, R010
Resistor
820Ω
SN14C2C–820ΩF
KOA
R004, R008 not
mounted
1
U001
DAC
28-pin,
SSOP
DSD1796
TIJ
8-pin, SOP
NJM5534M
JRC
AL ELE capacitor
Manufacturer
Remarks
Jumper connection
Not mounted
PCM1796
PCM1798
4
U002, U003, U004,
U005
Op amp
2.5.2 DEM-DAI/ASDAC_96/98 Parts List
Table 2-2 lists the bill of materials for the DEM-DAI/ASDAC_96/98.
Table 2-2. Bill of Materials
20
Qty
RefDes
2
C001, C002
Item
Value
Mfr Part No
0.01 µF
AMFF0050J103
Nissei
7
C003, C005, C007,
C109, C110, C111,
C112
AL ELE capacitor
10 µF/16 V
ROA-16V100M
ELNA
6
C004, C006, C008,
C016, C051, C058
Film capacitor
0.1 µF
AMFF0050J104
Nissei
1
C009
5
C010, C011, C013,
C014, C055
Film capacitor
0.068 µF
AMFF0050J683
Nissei
Ceramic capacitor
0.1 µF
RPE132F104Z50
Murata
1
C012
AL ELE capacitor
10 µF/16 V
SME16VB10M
ELNA
5
C015, C052, C053,
C054, C057
AL ELE capacitor
100 µF/16 V
ROA-16V101M
ELNA
1
C056
Tantalum capacitor
10 µF/16 V
DN1C100M1S
NEC
2
C101, C102, C017,
C018
AL ELE capacitor
10 µF/16 V
R3A-16V100M
ELNA
Nissei
Film capacitor
2
C103, C104
Film capacitor
0.027 µF
APSF0100J273
4
C105, C106, C107,
C108
Film capacitor
8200 pF
APSF0100J822
1
L001
Inductor
Schematics, PCB Layout, and Bill of Materials
Manufacturer
Remarks
C016 not mounted
C015 not mounted
C017, C108 not
mounted
Not mounted
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
Component Lists
www.ti.com
Table 2-2. Bill of Materials (continued)
Qty
RefDes
1
FIL001
Filter
Item
Value
Mfr Part No
Manufacturer
1
CN003
L-type connector
57LE40360-7700(D3)
Yamaichi
1
CN004
48-pin connector
FFC-48BMEP1
Yamaichi
3
CN002, CN058,
JP002
2-pin connector
FFC-2BMEP1
Yamaichi
1
CN104
RCA connector (red)
LPR6520-0802
SMK
1
CN103
RCA connector
(white)
LPR6520-0803
SMK
1
CN001
RCA connector
(yellow)
LPR6520-0804
SMK
1
CN051
Banana jack (yellow)
T-45(Yellow)
Honda
1
CN052
Banana jack (green)
T-45(Green)
Honda
1
CN053
Banana jack (blue)
T-45(Blue)
Honda
2
CN054, CN056
Banana jack (red)
T-45(Red)
Honda
2
CN055, CN057
Banana jack (black)
T-45(Black)
Honda
4
CN101, CN102,
CN006, CN007
Connector 20-pin
XB-3-7-20
MAC8
1SS133
ROHM
1
D001
Diode
1
JP001
4-pin connector
1
R001
Resistor
75 Ω
SN14C2C-75ΩF
KOA
1
R003
Resistor
47 kΩ
SN14C2C-47kΩF
KOA
2
R002, R004
Resistor
470 Ω
SN14C2C-470ΩF
KOA
4
R101–R104
Resistor
220 Ω
SN14C2C-220ΩF
KOA
4
R105–R108
Resistor
180 Ω
SN14C2C-180ΩF
KOA
4
R109–R112
Resistor
200 Ω
SN14C2C-200ΩF
KOA
2
R113, R114
Resistor
100 Ω
SN14C2C-100ΩF
KOA
1
RA001
Resitor array
47 kΩ × 5
M6-1-473J
BI
1
U001
TOSLINK™
connector
TORX179P
Toshiba
1
U002
Digital audio I/F
receiver IC
CS8414-CS
Cirrus Logic
1
U003
Logic IC
TC74VHC14F
TI
1
U004
Logic IC
TC74HCT32AF
TI
2
U005, U006
Logic IC
TC74VHC244F
TI
1
U051
2
U101, U102
3
SW001, SW002,
SW003
1
SW004
1
SW005
1
SW006
4
—
3
JP101–JP103
FFC-4BMEP1
REG1117-3.3
TI/BB
IC socket, DIP 8-pin
100-008-000
3M
FT1D-2M
Fujisoku
Push switch
FP1F-2M
Fujisoku
DIP switch (‫)ײ‬
FT2D-2M
Fujisoku
DIP switch (‫)״‬
DSS104
Fujisoku
Spacer
AR-325B
Nakao
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
CN006, CN007 not
mounted
Yamaichi
Regulator IC
DIP switch
Remarks
Not mounted
Schematics, PCB Layout, and Bill of Materials
21
Revision History
www.ti.com
Revision History
Changes from Original (September, 2004) to A Revision .............................................................................................. Page
•
•
Updated document format to current standards....................................................................................... 5
Added PCM1795 to devices relevant to this user guide ............................................................................. 5
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
22
Revision History
SLEU057A – September 2004 – Revised May 2009
Submit Documentation Feedback
EVALUATION BOARD/KIT IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES
ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have
electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete
in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental
measures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit does
not fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling
(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER
AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and all
appropriate precautions with regard to electrostatic discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY
INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or
services described herein.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/or
safety programs, please contact the TI application engineer or visit www.ti.com/esh.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used.
FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES
ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radio
frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are
designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may
be required to correct this interference.
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of ±15 V and the output voltage range of ±15 V.
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions
concerning the input range, please contact a TI field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.
Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,
please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than +55°C. The EVM is designed to operate
properly with certain components above +55°C as long as the input and output ranges are maintained. These components include but are
not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified
using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,
please be aware that these devices may be very warm to the touch.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated