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TSUPREM-4 User’s Manual
Tutorial Examples
default value of one atmosphere is used), and the final pressure is given by
P.FINAL. Note that ramp rates could also have been specified in degrees/minute
or atmospheres/minute, using the T.RATE and P.RATE parameters, respectively.
$ TSUPREM-4 -- Example 1, Part B
$ Bipolar active device region: Field oxide, base, and emitter
$ Read structure
INITIALIZE IN.FILE=S4EX1AS
$ Grow the
DIFFUSION
DIFFUSION
DIFFUSION
DIFFUSION
DIFFUSION
field oxide
TEMP=800
TIME=20
TEMP=1000 TIME=10
TEMP=1100 TIME=50
TEMP=1100 TIME=10
TEMP=1100 TIME=60
DRYO2
STEAM
DRYO2
T.FINAL=1000
T.FINAL=1100
PRESSURE=5
PRESSURE=5
T.FINAL=800
P.FINAL=5
P.FINAL=1
$ Remove nitride and pad oxide
ETCH
NITRIDE ALL
ETCH
OXIDE
ALL
$ Implant the boron base
IMPLANT
BORON DOSE=2E13
ENERGY=100
$ Implant the phosphorus emitter
IMPLANT
PHOSPHORUS DOSE=1E15
ENERGY=50
$ Anneal to activate base and emitter regions
DIFFUSION TEMP=1000 TIME=12 DRYO2
$ Plot results
SELECT
Z=LOG10(BORON) TITLE=”Active Region” LABEL=LOG(CONCENTRATION)
PLOT.1D
BOTTOM=13 TOP=21 RIGHT=5 LINE.TYP=5 COLOR=2
SELECT
Z=LOG10(PHOSPHORUS)
PLOT.1D
^AXES ^CLEAR LINE.TYP=4 COLOR=4
SELECT
Z=LOG10(ARSENIC)
PLOT.1D
^AXES ^CLEAR LINE.TYP=2 COLOR=3
SELECT
Z=LOG10(ANTIMONY)
PLOT.1D
^AXES ^CLEAR LINE.TYP=3 COLOR=3
$ Label the impurities
LABEL
X= 2.0 Y=15.1
LABEL
X=-1.0 Y=19.5
LABEL
X= 0.3 Y=15.8
LABEL
X= 2.0 Y=18.4
LABEL=Boron
LABEL=Phosphorus
LABEL=Arsenic
LABEL=Antimony
$ Print the layer information
SELECT
Z=DOPING
PRINT.1D
X.V=0 LAYERS
Figure 4-4
Listing of input file s4ex1b.inp, showing statements for simulating
the field oxide, base, and emitter region processing for a bipolar
transistor
The third diffusion step does a 50-minute oxidation in steam, at a pressure of 5
atmospheres. Steps four and five ramp down the pressure, then the temperature.
The remaining process steps are similar to those performed in the first part. The
nitride and oxide are removed, and the base and emitter are implanted.
4-10
Confidential and Proprietary
Draft 7/21/00
S4 2000.2