Download Texas Instruments Chipset TRF2436EVM User's Manual
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User's Guide SLWU038 – August 2006 TRF2436EVM This user’s guide provides an overview of the TRF2436 evaluation module (EVM) to get you started using the TRF2436EVM right away. It also provides a general description of the features and functions to be considered when using this module. 1 2 3 Contents Introduction .......................................................................................... 1 TRF2436EVM Operational Procedure ........................................................... 2 Physical Description ................................................................................ 3 List of Figures 1 2 3 4 Top Layer 1.......................................................................................... Ground Plane Layer 2.............................................................................. Power Plane Layer 3 ............................................................................... Bottom Layer 4 ...................................................................................... 4 4 5 5 List of Tables 1 1 Introduction 1.1 Purpose TRF2436EVM PARTS LIST ....................................................................... 6 The TRF2436 EVM provides a platform for evaluating the TRF2436 high-power, dual-band RF front-end under various signals, reference, and supply conditions. Use this document with the EVM schematic diagram supplied. Using the TRF2436EVM, you can rapidly evaluate the TRF2436 with a minimum of manual setup. 1.2 System Requirements Use the following equipment when evaluating the TRF2436EVM: • +3.3-V power supply, 800 mA. • Signal generator: Agilent ESG Series (with baseband I/Q modulation option for modulated testing) or equivalent. • Spectrum analyzer: Agilent PSA Series (with phase noise option) or equivalent. • Vector signal analyzer: Agilent 89600 Series for 802.16x modulated EVM testing or equivalent. 1.3 Power Requirements The demonstration board requires only one supply for proper operation. Connect +3.3 V at P1 and the return to P2. Always terminate active PA outputs before enabling the power supply. Voltage Limits Exceeding the maximum input voltages can damage EVM components. Undervoltage can cause improper operation of some or all of the EVM components. SLWU038 – August 2006 Submit Documentation Feedback TRF2436EVM 1 www.ti.com TRF2436EVM Operational Procedure 1.4 Hardware Configuration The TRF2436EVM can be set up in a variety of configurations to accommodate a specific mode of operation. Before starting an evaluation, decide on the configuration and make the appropriate connections or changes. The demonstration board comes with the following factory-set configuration: Jumper J10 installed between 1-2 Jumper J11 installed between 2-3 Jumper J12 installed between 1-2 Jumper J13 installed between 1-2 Jumper J14 installed between 1-2 LO input drive The TRF2436 has been designed to be driven with a differential LO input. A simple balun centered at ~2.6 GHz can be used to convert a single-ended input from an RF source to a differential pair to provide a differential LO to the EVM through SMA connectors J3 and J4. The 2436 will function if driven single-ended, but it is not designed to operate in this condition, nor has it been evaluated in this condition. To drive the LO single-ended, connect an RF source to the LOP SMA (J3) and terminate the LON SMA (J4) input with 50 Ω. Filtering The TRF2436EVM is provided with no filtering. The mixer output, PA input/LNA output, and RF input/output pins are brought out directly to SMA connectors on the EVM. Filtering may be incorporated by: • Connecting an external filter to RFANTA (J6) for filtering after the PA in TX mode or before the LNA in RX mode. • Connecting an external filter between the MFA (J8) and RFA (J9) jacks for filtering between the mixer and PA/LNA stages 2 TRF2436EVM Operational Procedure 2.1 TX Operation 1. Connect +3.3 V to P1 and ground to P2 but do not turn on. 2. Connect differential LO source to LOP/LON jacks (or use external balun). Set the appropriate frequency and power level between 0 to +4 dBm. Remember that for A-band operation, the LO input frequency is doubled inside the TRF2436; so, the LO should be set to half the frequency desired at the mixer LO port. 3. Connect an IF source to the IF port. Set to 374 MHz with a typical power level of –20 dBm. 4. Set ABSEL (J12) to a logic high 1. 5. Set TR (J13) to a logic high 1. 6. Set PA_B SEL (J11) to a logic low 0. 7. Set PA_A SEL (J10) to logic high 1. 8. RXDGC = don’t care 9. For mixer stage measurement: a. Terminate RFA (J9) and RFANTA (J6) into 50 Ω. b. Connect a spectrum analyzer to MFA (J8). c. Turn on the 3.3-V power supply (~300 mA to 320 mA). d. Observe the output of the mixer stage on a spectrum analyzer. 10. For PA stage measurement: a. Terminate IF (J7) and MFA (J8) into 50 Ω. b. Apply an RF to RFA (J9). c. Connect a spectrum analyzer to RFANTA (J6). d. Turn on the power supply. e. Observe the PA output on a spectrum analyzer. 2 TRF2436EVM SLWU038 – August 2006 Submit Documentation Feedback www.ti.com Physical Description 2.2 RX Operation 1. Set TR (J13) to logic 0. 2. Set PA_A SEL (J10) to logic 0. 3. Connect a differential LO source to the LOP/LON SMAs (or use an external balun). Set the LO to an appropriate frequency, with the power level between 0 to +4 dBm. Remember that for A-band operation, the LO input frequency is doubled inside the TRF2436; so, the LO should be set to half the frequency desired at the mixer LO port. 4. For mixer stage measurement: a. Terminate RFA (J9) and RFANTA (J6) into 50 Ω. b. Connect an RF source to MFA (J8). Set to a desired RF frequency and typical power level of –20 dBm. c. Connect a spectrum analyzer to the IF (J7) output. d. Turn on the 3.3-V power supply (~90 mA). e. Observe the IF output on a spectrum analyzer (374 MHz). 5. For LNA stage measurement: a. Terminate IF (J7) and MFA (J8) into 50 Ω. b. Connect an RF source to RFANTA (J6). Set to a desired frequency and typical power level of –40 dBm. c. Connect a spectrum analyzer to RFA (J9). d. Turn on the power supply. e. Observe the LNA output on a spectrum analyzer. f. Use jumper J14 (RXDGC) to select between LNA high (pins 2-3) and low gain (pins 1-2) modes. 3 Physical Description This section describes the physical characteristics and PCB layout of the EVM and lists the components used on the module. SLWU038 – August 2006 Submit Documentation Feedback TRF2436EVM 3 www.ti.com Physical Description 3.1 PCB Layout The EVM is constructed on a 4-layer, 3.6-inch × 3.6-inch, 0.042-inch thick PCB using Polycad 370 Turbo/HR material. Figure 1 through Figure 4 show the PCB layout for the EVM. Figure 1. Top Layer 1 Figure 2. Ground Plane Layer 2 4 TRF2436EVM SLWU038 – August 2006 Submit Documentation Feedback www.ti.com Physical Description Figure 3. Power Plane Layer 3 Figure 4. Bottom Layer 4 SLWU038 – August 2006 Submit Documentation Feedback TRF2436EVM 5 www.ti.com Physical Description 3.2 Part List Table 1 lists the parts used in constructing the EVM. Table 1. TRF2436EVM PARTS LIST QTY 3.3 Ref Value Part Number Note 1 C1 470pF GRM033R71C471KD 1 C2 10pF GRM1555C1H100JZ 1 C3 5600pF C0402C562K3RACT 7 C4 C6 C11 C15 C17 C24 C33 0.01µF GRM155R71E103KA 12 C5 C9 C12–C14 C16 C19 C20 C22 C25 C26 C31 100pF GRM1555C1H101JD 3 C7 C8 C18 10µF ECJ-4YB1A106K 3 C10 C23 C29 1000pF GRM155R71H102KA 2 C21 C32 1.2pF 04025A1R2BAT2A 1 C28 0.1µF ECJ-0EB1A104K 2 FL1 FL2 Filter, 2400–2484MHz DFCB22G44LBJAA DNI 2 FL3 FL4 Filter, 5597.5MHz DFCB35G59LAHAA DNI 1 FL5 Filter Block, DC power BNX002-01 9 J1–J9 MXB SMA 142-0701-841 5 J10–J14 PA_A SEL 54201-S08-3 4 L1 R3 R4 R31 3 L2 L3 L7 27Ω at 100MHz EXC-ML16A270U 4 L6 L8 L10 L12 120Ω at 100MHz BLM15AG102SN1D 2 L9 L11 33nH LQW15AN33NJ00D 1 P1 +3.3V_IN ST-351A 1 P2 PSG ST-351B 2 Q1 Q3 IRLML6401 IRLML6401 2 Q2 Q4 MMST2222A MMST2222A-7 8 R1 R2 R6 R7 R35–R38 TRACE GAP, NO PART 1 R5 634 ERJ-2RKF6340X 9 R8–R13 R15 R32 R33 10K ERJ-2GEJ103X 7 R16–R18 R24 R25 R28 R29 1K ERJ-2GEJ102X 4 R20–R23 200 ERJ-2RKF2000X 1 R26 750 ERJ-2GEJ751X 1 R27 2K POT 3214W-1-202E 1 R30 5.1K ERJ-2GEJ512X 1 T1 ADT4-1T ADT4-1T 6 TP1–TP6 T POINT R 5015 1 U1 TRF2436 TRF2436 2 U2 U3 MMDT3906 MMDT3906-7 1 U4 MMDT3904 MMDT3904-7 DNI DNI Schemtic Drawing The schematic drawing for the TRF2436EVM appears on the following page. 6 TRF2436EVM SLWU038 – August 2006 Submit Documentation Feedback 3 MXB SMA 3 1 RFB SMA 3 J2 RFB_SMA 1 J1 MXB_SMA 1 D 2 2 4 2 5 TRACE GAP, NO PART R1 2 FL1 1 MXB 1 D TRACE GAP, NO PART IN OUT 2 R2 RFB 2 1 Filter, 2400-2484 MHz DFCB22G44LBJAA_DNI DNI 50 OHM ABSEL 100 OHM T1 VDD 1 50 OHM 50 OHM 1 FL4 2MXA 1 IN OUT 2 RFA 1 R7 634 C3 5600 pF 2 1 3 1 J6 1 R35 2 C2 10pF RFANTB SMA 2 RFANTA SMA TRACE GAP, NO PART FL3 1FANTA 1 2 IN OUT 2FANTA_S 2 R36 1 Filter, 5597.5MHz DFCB35G59LAHAA_DNI DNI BCIN C4 0.01uF B 2 Filter, 5597.5MHz DFCB35G59LAHAA_DNI DNI MXA_SMA R5 1 R38 Filter, 2400-2484 MHz DFCB22G44LBJAA_DNI DNI BYPOUT C1 470pF 2 TRACE GAP, NO PART TRACE GAP, NO PART R6 BCOUT 2 FANTB_S OUT 50 OHM 2 C16 100pF 1 1 2 B C15 .01uF RFANTA 2 4 50 OHM 1FANTB 1 IN TRACE GAP, NO PART 2 3 L1 DNI RFANTB TRACE GAP, NO PART J5 FL2 1 5 V+LNABA R37 2 DETP DETN 2 IF SMA 2 30 29 28 27 26 25 24 23 22 21 1 IF_SMA 50 OHM 6 TRF 2436 V+PA1A V+GEN V+PA2A PABCA V+PA3A 1 1 V+PA3B DETP DETN RFANTB V+LNABA RFANTA GND2 GND1 BYPOUT BYPIN TRACE GAP, NO PART TP2 11 12 13 14 15 16 17 18 19 20 2 J7 100 OHM V+IF V+IFP V+IFN 3 ADT4-1T LOADJA LOP LON IFP IFN MXB ABSEL V+LOB LOADJA LOP LON IFP IFN MXA L+LOA V+PA3B C 2 3 1 2 3 4 5 6 7 8 9 10 BACK TXGADJB LOADJB TR RXDGC RFB RSVD1 V+PA1B PABCB BCIN V+PA2B U1 R4 DNI V+IF V+IFP V+IFN RFA V+PA1A V+GEN V+PA2A PABCA V+PA3A BCOUT 1 LON SMA 1 1 C14 100pF 2 DNI 41 40 39 38 37 36 35 34 33 32 31 2 1 C R3 1 1 50 OHM TP1 1 J4 LOADJB TR RXDGC 50 OHM 3 VDD 2 50 OHM LOP SMA 2 1 RFA_SMA 2 V+PA1B PABCB BCIN V+PA2B 3 J3 1 A 1 A J8 J9 3 MXA SMA 2 2 3 RFA SMA Title Engineer: M. ARNOLD Drawn By: L. NGUYEN Size B Date: 5 4 3 2 TRF2436 Evaluation Module Document Number Monday, April 17, 2006 Rev TRF2436EVM-SCH Sheet 1 1 A of 3 5 4 3 2 1 2 2 2 D VDD 27 OHM @ 100MHz C8 10uF TP3 GND Filter Block, DC power Murata BNX002-01 GND V+PA2A 1 VDD 1 C11 .01uF C10 1000pF IRLML6401 Q2 1 2 3 R9 1 Q1 2 2 2 3 27 OHM @ 100MHz C9 100pF R8 10K 2 L3 1 PSG C7 10uF 10K MMST2222A C12 V+PA3A 2 1 1 2 R32 10K 100pF 2 C13 100pF J10 PA_A SEL 1 PSG 1 1 PSG CB CG2 CG1 C6 .01uF C5 100pF 3 B BLK 1 1 1 L2 D P2 V+PA1A 2 3.3V_IN 2 +3.3V_IN 1 FL5 RED 1 1 VDD CG3 P1 1 VDD C C VDD VDD 2 3 C23 1000pF VDD 1 C24 .01uF Q4 R11 1 Q3 IRLML6401 2 2 3 1 1 2 C22 100pF 1 2 C32 1.2pF 27 OHM @ 100MHz 1 V+PA2B V+LNABA 1 2 1 C31 100pF 1 2 120 ohm @ 100MHz R10 10K 2 L7 V+IF C21 1.2pF VDD 2 L12 2 L6 C20 100pF C18 10uF TP4 VDD 120 ohm @100MHz 2 1 2 C17 .01uF C19 100pF 2 VDD V+GEN 1 C28 .1uF 1 V+PA1B 120 ohm @ 100MHz 1 L10 1 2 3 10K MMST2222A B C29 2 2 5 MIL trace V+IFP 5 MIL trace V+IFN 33nH L11 1 1000pF R33 10K 2 VDD 2 100pF C26 100pF 120 ohm @100MHz B 1 1 1 L9 PA_B SEL C25 V+PA3B L8 J11 LOADJB 33nH LOADJA R31 DNI R30 5.1K A A Title Size B Date: 5 4 3 2 TRF2436 Evaluation Module Document Number Rev TRF2436EVM-SCH Thursday, April 13, 2006 Sheet 1 2 A of 3 5 4 3 2 VDD 1 VDD VDD D 1 D R13 10K R15 10K 2 R12 10K .01uF C33 J12 1 2 3 ABSEL J13 ABSEL 1 2 3 TR R16 1K TR 1 2 3 J14 R17 1K RXDGC R18 1K RXDGC C C VDD VDD R20 200 R21 200 TP6 TP5 PABCA R22 200 R23 200 PABCB U2 U3 E1 C1 E1 C1 B1 B2 B1 B2 C2 E2 C2 E2 B B MMDT3906 MMDT3906 C1 B2 E2 B1 C2 VDD E1 R24 1K R25 1K U4 MMDT3904 R26 750 R28 1K R27 2K POT R29 1K A A Title Size B Date: 5 4 3 2 TRF2436 Evaluation Module Document Number Rev TRF2436EVM-SCH Thursday, April 13, 2006 Sheet 1 3 A of 3 EVALUATION BOARD/KIT IMPORTANT NOTICE Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/or safety programs, please contact the TI application engineer or visit www.ti.com/esh. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. FCC Warning This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. EVM WARNINGS AND RESTRICTIONS It is important to operate this EVM within the input voltage range of 0 V to 3.3 V and the output voltage range of 0 V to 3.3 V. Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions concerning the input range, please contact a TI field representative prior to connecting the input power. Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 85°C. The EVM is designed to operate properly with certain components above 85°C as long as the input and output ranges are maintained. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch. 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