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Package Mechanical Specifications
9
Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FCLGA10) package that
interfaces with the baseboard via an LGA2011-0 land FCLGA10 socket. The package
consists of a processor mounted on a substrate land-carrier. An integrated heat
spreader (IHS) is attached to the package substrate and core and serves as the mating
surface for processor component thermal solutions, such as a heatsink. Figure 9-1
shows a sketch of the processor package components and how they are assembled
together. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product
Families Thermal/Mechanical Design Guide for complete details on the LGA2011-0 land
FCLGA10 socket.
The package components shown in Figure 9-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Figure 9-1.
Processor Package Assembly Sketch
IHS
Die
TIM
Substrate
Capacitors
LGA2011-0 Socket
System Board
Note:
1.
Socket and baseboard are included for reference and are not part of processor package.
9.1
Package Mechanical Drawing
The package mechanical drawings are shown in Figure 9-2 and Figure 9-3. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1. Package reference with tolerances (total height, length, width, and so forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
237