Download Lenovo Intel Xeon Processor L7445

Contents
1
Introduction .............................................................................................................. 9
1.1
Terminology ..................................................................................................... 11
1.2
State of Data .................................................................................................... 13
1.3
References ....................................................................................................... 13
2
Electrical Specifications ........................................................................................... 15
2.1
Front Side Bus and GTLREF ................................................................................ 15
2.2
Decoupling Guidelines ........................................................................................ 16
2.2.1 VCC Decoupling...................................................................................... 16
2.2.2 VTT Decoupling ...................................................................................... 16
2.2.3 Front Side Bus AGTL+ Decoupling ............................................................ 16
2.3
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 16
2.3.1 Front Side Bus Frequency Select Signals (BSEL[2:0]) .................................. 17
2.3.2 PLL Power Supply ................................................................................... 18
2.4
Voltage Identification (VID) ................................................................................ 18
2.5
Reserved, Unused, or Test Signals ....................................................................... 20
2.6
Front Side Bus Signal Groups .............................................................................. 20
2.7
CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 22
2.8
Test Access Port (TAP) Connection....................................................................... 22
2.9
Mixing Processors.............................................................................................. 23
2.10 Absolute Maximum and Minimum Ratings ............................................................. 23
2.11 Processor DC Specifications ................................................................................ 24
2.11.1 Flexible Motherboard Guidelines (FMB) ...................................................... 24
2.11.2 VCC Overshoot Specification ..................................................................... 33
2.11.3 Die Voltage Validation ............................................................................. 33
2.11.4 Platform Environmental Control Interface (PECI) DC Specifications................ 34
2.11.4.1 DC Characteristics..................................................................... 34
2.11.4.2 Input Device Hysteresis ............................................................. 35
2.12 AGTL+ FSB Specifications................................................................................... 35
2.13 Front Side Bus AC Specifications ......................................................................... 37
2.14 Processor AC Timing Waveforms ......................................................................... 41
3
Mechanical Specifications ........................................................................................ 51
3.1
Package Mechanical Drawing............................................................................... 51
3.2
Processor Component Keepout Zones................................................................... 54
3.3
Package Loading Specifications ........................................................................... 60
3.4
Package Handling Guidelines............................................................................... 61
3.5
Package Insertion Specifications.......................................................................... 61
3.6
Processor Mass Specifications ............................................................................. 61
3.7
Processor Materials............................................................................................ 61
3.8
Processor Markings............................................................................................ 62
3.9
Processor Pin-Out Coordinates ............................................................................ 63
4
Pin Listing ............................................................................................................... 65
4.1
Processor Pin Assignments ................................................................................. 65
4.1.1 Pin Listing by Pin Name ........................................................................... 65
4.1.2 Pin Listing by Pin Number ........................................................................ 73
5
Signal Definitions .................................................................................................... 81
5.1
Signal Definitions .............................................................................................. 81
6
Thermal Specifications ............................................................................................ 89
6.1
Package Thermal Specifications ........................................................................... 89
6.1.1 Thermal Specifications ............................................................................ 89
6.1.2 Thermal Metrology ................................................................................. 97
Intel® Xeon® Processor 7400 Series Datasheet
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