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Download LPKF ProtoFlow S, User manual, ENG, v2.11
Transcript
USER MANUAL
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INTRODUCTION
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SM-901-3
®
ALPHA OM-338-CSP
ULTRA FINE FEATURE LEAD-FREE SOLDER PASTE
DESCRIPTION
ALPHA OM-338-CSP is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338CSP’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This
material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338-CSP yields
excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability
and high “through-put” applications.
Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of
deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338-CSP is
formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA OM-338-CSP’s capability of IPC Class III for
voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
*Although the appearance of these lead-free alloys will be different to that of tin-lead, with mechanical reliability equal to or greater than with that of tinlead or tin-lead-silver.
FEATURES & BENEFITS
x
x
x
x
x
x
x
x
x
Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as
0.24mm (0.096”) with 0.100mm (4mil) stencil thickness.
Excellent print consistency with high process capability index across all board designs.
Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput.
Wide reflow profile window with good solderability on various board / component finishes.
Excellent solder and flux cosmetics after reflow soldering
Reduction in random solderballing levels, minimizing rework and increasing first time yield
Meets highest IPC 7095 voiding performance classification of Class III.
Excellent reliability properties, halide-free material
Compatible with either nitrogen or air reflow
PRODUCT INFORMATION
Alloys:
SAC305 (96.5%Sn/3.0%Ag/0.5%Cu)
e1 alloys per JESD97 Classification
For other alloys, contact your local Cookson Electronics Sales Office.
Type 4.5
Powder Size:
Approximately 5% by (w/w)
Residues:
Packaging Sizes: 500 gram jars, 6”
Complies with RoHS Directive 2002/95/EC.
Lead Free:
APPLICATION
Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and
150mm/sec (6”/sec), with stencil thickness of 0.100mm (0.004”) to 0.150mm (0.006”), particularly when used in
conjunction with ALPHA® Stencils. Blade pressures should be 0.16-0.34 kg/cm of blade (0.9 -2Ibs/inch), depending
upon the print speed. The higher the print speed employed, the higher the blade pressure that is required. The reflow
process window will give high soldering yield with good cosmetics and minimized rework.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the
accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.
8-10-09
SAFETY
While the ALPHA OM-338-CSP flux system is not considered toxic, its use in typical reflow will generate a small
amount of reaction and decomposition vapors. These vapors should be adequately exhausted from the work area.
Consult the MSDS for additional safety information.
STORAGE
ALPHA OM-338-CSP should be stored in a refrigerator upon receipt at 0 to 10qC (32-50°F). ALPHA OM-338-CSP
should be permitted to reach room temperature before unsealing its package prior to use (see handling procedures on
page 2). This will prevent moisture condensation build up in the solder paste.
ALPHA OM-338-CSP TECHNICAL DATA
CATEGORY
CHEMICAL PROPERTIES
RESULTS
Activity Level
Halide Content
ROL-0 = J-STD Classification
Halide free (by titration). Passes Ag
Chromate Test
Copper Mirror Test
Pass
Pass, (No evidence of Corrosion)
Copper Corrosion Test
PROCEDURES/REMARKS
IPC J-STD-004
IPC J-STD-004
IPC J-STD-004
IPC J-STD-004
ELECTRICAL PROPERTIES
10
SIR (IPC 7 days @ 85q C/85% RH)
Pass,
> 1.9 x 10 ohms
SIR
Pass,
8.3 x 10 ohms
Pass,
Initial= 5.3 x 10 ohms
11
Final= 1.5 x 10 ohms
(Bellcore 96 hours @ 35qC/85%RH)
Electromigration
(Bellcore 96 hours @ 65qC/85%RH 10V 500 hours)
12
10
Using 88.3% Metal, Type #4.5 Powder.
PHYSICAL PROPERTIES
Color
Tack Force vs. Humidity
(t=8 hours)
IPC J-STD-004
8
{Pass 1 x 10 ohm min}
Bellcore GR78-CORE
11
{Pass 1 x 10 ohm min}
Bellcore GR78-CORE
{Pass=final > initial/10)
Clear, Colorless Flux Residue
Pass -Change of <1 g/mm2 over 24 hours
SAC 305, 405 alloy
IPC J-STD-005
at 25% and 75 % Relative Humidity
Pass -Change of <10% when stored at
JIS Z3284 Annex 9
o
Viscosity
Solderball
Stencil Life
Spread
Flux Tackiness Test
Slump
25r2 C and 50r10% relative humidity.
OM-338-CSP: 88.3% metal load designated
M14 for printing.
Acceptable (SAC 305 and SAC405 alloys)
IPC J-STD-005
Pass Class 2, 1 hour and 72 hour
DIN Standard 32 513, 4.4
> 8 hours
@ 50%RH, 23 C (74qF)
JIS-Z-3197: 1999 8.3.1.1
Pass
Pass
Pass
Pass
Pass
Malcom Spiral Viscometer; J-STD-005
o
DIN 32513 Talc Test
o
IPC J-STD-005 (10 min 150 C)
DIN Standard 32 513, 5.3
JIS-Z-3284-1994 Annex 8
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the
accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.
Rev. 8-10-09
ALPHA OM-338-CSP Processing Guidelines
STORAGE-HANDLING
PRINTING
xRefrigerate to guarantee stability @
0-10qC (32-50qF)
xShelf life of refrigerated paste is six
months.
xPaste can be stored for 2 weeks at
o
room temperatures up to 25 C (77qF)
prior to use.
xWhen refrigerated, warm-up of paste
container to room temperature for up to 4
o
o
hours. Paste must be t19 C (66 F)
before processing. Verify paste
temperature with a thermometer to
o
o
ensure paste is at 19 C (66 F) or greater
before setup. Printing can be performed
o
o
at temperatures up to 29 C (84 F).
xDo not remove worked paste from stencil
and mix with unused paste in jar. This will
alter rheology of unused paste.
xThese are starting recommendations and
all process settings should be reviewed
independently.
REFLOW (See Figure
#1)
STENCIL: Recommend Cookson
Electronics ALPHA CUT or ALPHA
FORM stencils @ 0.100mm - 0.150
mm (4-6 mil) thick for 0.4 - 0.5 mm
(0.016” or 0.020”) pitch. Stencil
design is subject to many process
variables. Contact your local
Cookson Electronics stencil site for
advice.
SQUEEGEE: Metal (recommended)
PRESSURE: 0.16-0.34 kg/cm of
squeegee length (0.9-2.0 lbs./inch).
SPEED: 25 to 200mm per second (1
to 8 inches per second).
PASTE ROLL: 1.5-2.0 cm diameter
and make additions when roll
reaches 1-cm (0.4”) diameter (min).
Max roll size will depend upon blade
“Exceeding the maximum diameter
may cause curtaining (sticking to the
squeegee when it is lifted from the
stencil).”
ATMOSPHERE: Clean-dry air
or nitrogen atmosphere.
PROFILE (SAC Alloys):
A straight ramp profile @
o
0.8qC to 1.7 C per second
ramp rate is recommended
(TAL 35-90 sec and peak
o
1.
232-250 C)
Higher
density assemblies may
require preheating within
the profile and may be
accomplished as follows:
Ramp @ 0.8-1.7qC/sec. to 135160qC.
Ramp from 130qC to liquidus
-
-
over 60-90 seconds.
Ramp from 150qC to liquidus
over 30-60 seconds.
Time above liquidus = 35-90
seconds
Ramp down to R.T. @ 3 to 7qC
per second (fast ramp down is
recommended)
CLEANING
ALPHA OM-338-CSP residue is
designed to remain on the board
after reflow. If reflowed residue
cleaning is required, ALPHA BC2200 aqueous cleaner is
recommended. For solvent
cleaning, agitation for 5 min in
the following cleaners is
recommended:
- ALPHA SM-110E
TM
- Bioact SC-10E
- Kyzen Micronox MX2501
Misprints and stencil cleaning
may be done with ALPHA SM110E, ALPHA SM-440, ALPHA
TM
BC-2200 and Bioact SC-10E
cleaners.
Note 1: Refer to component and
board supplier data for thermal
properties at elevated temperatures.
Lower peak temperatures require
longer TAL for improved joint
cosmetics.
BioactTM and Hydrex™ are registered trademarks of Petroferm, Inc.
Figure #1 – Reflow Envelope
Profiles Tested
250
Temperature
200
150
100
50
12
0
15
0
18
0
21
0
24
0
27
0
30
0
33
0
36
0
39
0
42
0
45
0
48
0
51
0
54
0
90
60
30
0
0
Time (Secs)
Profile 1
Profile 10
Profile 2
Profile 12
Profile 3
Profile 13
Profile 4
Profile 5
Profile 7
Profile 8
221
Profile 9
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the
accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.
Rev. 8-10-09
LPKF d.o.o., Polica 33, SI-4202 Naklo, Slovenia, EU
Tel.: +386 592 08 800, Fax: +386 592 08 820
E-mail: [email protected], Web: www.lpkf.si
VAT Reg. No.: SI14682931
DECLARATION OF CONFORMITY
according to Machinery Directive (MD), (2006/42/EC)
We hereby confirm that the machine:
LPKF ProtoFlow S,
a drawer type microprocessor controlled programmable table top reflow oven for SMT soldering
and similar temperature treatments,
is a machine according to the EU Machinery Directive (MD), (2006/42/EC).
The LPKF ProtoFlow S also complies with the requirements of the following EC directives:
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and standards:
(1
(1
(1
EN 60204
CE approval symbol is atached to the machines in accordance with Machinery Directive.
Manufactured by:
LPKF Laser & Elektronika d.o.o.
3ROLFD
4202 Naklo
Slovenia
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