Download IBM Intel Xeon E5506
Transcript
Intel® Xeon® Processor 5500 Series Thermal/Mechanical Design Guide March 2009 Document Number:321323-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Xeon® processor 5500 series and LGA1366 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details. Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see www.intel.com. Intel and the Intel logo are trademarks of Intel Corporation in the U.S and other countries. * Other brands and names may be claimed as the property of others. Copyright © 2009, Intel Corporation. 2 Thermal/Mechanical Design Guide Contents 1 Introduction .............................................................................................................. 9 1.1 References ....................................................................................................... 10 1.2 Definition of Terms ............................................................................................ 10 2 LGA1366 Socket ...................................................................................................... 13 2.1 Board Layout .................................................................................................... 15 2.2 Attachment to Motherboard ................................................................................ 16 2.3 Socket Components........................................................................................... 16 2.3.1 Socket Body Housing .............................................................................. 16 2.3.2 Solder Balls ........................................................................................... 16 2.3.3 Contacts ............................................................................................... 17 2.3.4 Pick and Place Cover............................................................................... 17 2.4 Package Installation / Removal ........................................................................... 18 2.4.1 Socket Standoffs and Package Seating Plane.............................................. 18 2.5 Durability ......................................................................................................... 19 2.6 Markings .......................................................................................................... 19 2.7 Component Insertion Forces ............................................................................... 19 2.8 Socket Size ...................................................................................................... 19 2.9 LGA1366 Socket NCTF Solder Joints..................................................................... 20 3 Independent Loading Mechanism (ILM)................................................................... 21 3.1 Design Concept................................................................................................. 21 3.1.1 ILM Cover Assembly Design Overview ....................................................... 21 3.1.2 ILM Back Plate Design Overview ............................................................... 22 3.2 Assembly of ILM to a Motherboard....................................................................... 23 4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 27 4.1 Component Mass............................................................................................... 27 4.2 Package/Socket Stackup Height .......................................................................... 27 4.3 Socket Maximum Temperature ............................................................................ 27 4.4 Loading Specifications........................................................................................ 28 4.5 Electrical Requirements ...................................................................................... 28 4.6 Environmental Requirements .............................................................................. 29 5 Thermal Solutions ................................................................................................... 31 5.1 Performance Targets.......................................................................................... 31 5.1.1 25.5 mm Tall Heatsink ............................................................................ 33 5.2 Heat Pipe Considerations .................................................................................... 34 5.3 Assembly ......................................................................................................... 35 5.3.1 Thermal Interface Material (TIM) .............................................................. 36 5.4 Structural Considerations ................................................................................... 36 5.5 Thermal Design................................................................................................. 36 5.5.1 Thermal Characterization Parameter ......................................................... 36 5.5.2 Dual Thermal Profile ............................................................................... 37 5.6 Thermal Features .............................................................................................. 38 5.6.1 Fan Speed Control .................................................................................. 39 5.6.2 PECI Averaging and Catastrophic Thermal Management............................... 40 5.6.3 Intel® Turbo Boost Technology ................................................................ 40 5.7 Thermal Guidance ............................................................................................. 40 5.7.1 Thermal Excursion Power for 95 W Processor ............................................. 40 5.7.2 Thermal Excursion Power for 80 W Processor ............................................. 41 5.7.3 Absolute Processor Temperature .............................................................. 41 Thermal/Mechanical Design Guide 3 6 Quality and Reliability Requirements .......................................................................43 6.1 Test Conditions .................................................................................................43 6.2 Intel Reference Component Validation ..................................................................45 6.2.1 Board Functional Test Sequence ...............................................................45 6.2.2 Post-Test Pass Criteria.............................................................................45 6.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................46 6.3 Material and Recycling Requirements....................................................................46 A Component Suppliers ...............................................................................................47 A.1 Intel Enabled Supplier Information .......................................................................47 A.1.1 Intel Reference Thermal Solution ..............................................................47 A.1.2 Intel Collaboration Thermal Solution..........................................................47 A.1.3 Alternative Thermal Solution ....................................................................48 A.1.4 Socket and ILM Components ....................................................................49 B Mechanical Drawings ...............................................................................................51 C Socket Mechanical Drawings ....................................................................................79 D Heatsink Load Metrology..........................................................................................85 E Embedded Thermal Solutions ...................................................................................87 E.1 Performance Targets ..........................................................................................87 E.2 Thermal Design Guidelines ..................................................................................88 E.2.1 NEBS Thermal Profile ..............................................................................88 E.2.2 Custom Heat Sinks For UP ATCA ...............................................................89 E.3 Mechanical Drawings and Supplier Information ......................................................92 F Processor Installation Tool ......................................................................................97 Figures 1-1 2-1 2-2 2-3 2-4 2-5 2-6 2-7 3-1 3-2 3-3 3-4 4-1 5-1 5-2 5-3 5-4 5-5 6-1 B-1 B-2 B-3 B-4 B-5 B-6 4 Intel® Xeon® 5500 Platform Socket Stack ................................................................... 9 LGA1366 Socket with Pick and Place Cover Removed ....................................................13 LGA1366 Socket Contact Numbering (Top View of Socket) .............................................14 LGA1366 Socket Land Pattern (Top View of Board) .......................................................15 Attachment to Motherboard .......................................................................................16 Pick and Place Cover .................................................................................................17 Package Installation / Removal Features......................................................................18 LGA1366 NCTF Solder Joints ......................................................................................20 ILM Cover Assembly .................................................................................................22 Back Plate ...............................................................................................................23 ILM Assembly ..........................................................................................................24 Pin1 and ILM Lever ...................................................................................................25 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .................................30 1U Heatsink Performance Curves ................................................................................32 TTV Die Size and Orientation......................................................................................34 1U Reference Heatsink Assembly ................................................................................35 Processor Thermal Characterization Parameter Relationships ..........................................37 Dual Thermal Profile .................................................................................................38 Example Thermal Cycle - Actual profile will vary ...........................................................45 Board Keepin / Keepout Zones (Sheet 1 of 4)...............................................................52 Board Keepin / Keepout Zones (Sheet 2 of 4)...............................................................53 Board Keepin / Keepout Zones (Sheet 3 of 4)...............................................................54 Board Keepin / Keepout Zones (Sheet 4 of 4)...............................................................55 1U Reference Heatsink Assembly (Sheet 1 of 2) ...........................................................56 1U Reference Heatsink Assembly (Sheet 2 of 2) ...........................................................57 Thermal/Mechanical Design Guide B-7 1U Reference Heatsink Fin and Base (Sheet 1 of 2) ...................................................... 58 B-8 1U Reference Heatsink Fin and Base (Sheet 2 of 2) ...................................................... 59 B-9 Heatsink Shoulder Screw (1U, 2U and Tower) .............................................................. 60 B-10Heatsink Compression Spring (1U, 2U and Tower)........................................................ 61 B-11Heatsink Retaining Ring (1U, 2U and Tower) ............................................................... 62 B-12Heatsink Load Cup (1U, 2U and Tower)....................................................................... 63 B-132U Collaborative Heatsink Assembly (Sheet 1 of 2)....................................................... 64 B-142U Collaborative Heatsink Assembly (Sheet 2 of 2)....................................................... 65 B-152U Collaborative Heatsink Volumetric (Sheet 1 of 2) ..................................................... 66 B-162U Collaborative Heatsink Volumetric (Sheet 2 of 2) ..................................................... 67 B-17Tower Collaborative Heatsink Assembly (Sheet 1 of 2) .................................................. 68 B-18Tower Collaborative Heatsink Assembly (Sheet 2 of 2) .................................................. 69 B-19Tower Collaborative Heatsink Volumetric (Sheet 1 of 2) ................................................ 70 B-20Tower Collaborative Heatsink Volumetric (Sheet 2 of 2) ................................................ 71 B-211U Reference Heatsink Assembly with TIM (Sheet 1 of 2) .............................................. 72 B-221U Reference Heatsink Assembly with TIM (Sheet 2 of 2) .............................................. 73 B-232U Reference Heatsink Assembly with TIM (Sheet 1 of 2) .............................................. 74 B-242U Reference Heatsink Assembly with TIM (Sheet 2 of 2) .............................................. 75 B-25Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2) ......................................... 76 B-26Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2) ......................................... 77 C-1 Socket Mechanical Drawing (Sheet 1 of 4) ................................................................... 80 C-2 Socket Mechanical Drawing (Sheet 2 of 4) ................................................................... 81 C-3 Socket Mechanical Drawing (Sheet 3 of 4) ................................................................... 82 C-4 Socket Mechanical Drawing (Sheet 4 of 4) ................................................................... 83 D-1 Intel® Xeon® Processor 5500 Series Load Cell Fixture.................................................. 86 E-1 ATCA Heatsink Performance Curves ............................................................................ 88 E-2 NEBS Thermal Profile................................................................................................ 89 E-3 UP ATCA Thermal Solution......................................................................................... 90 E-4 UP ATCA System Layout ........................................................................................... 90 E-5 UP ATCA Heat Sink Drawing ...................................................................................... 91 E-6 ATCA Reference Heat Sink Assembly (Sheet 1 of 2) ...................................................... 93 E-7 ATCA Reference Heat Sink Assembly (Sheet 2 of 2) ...................................................... 94 E-8 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) ................................................... 95 E-9 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) ................................................... 96 F-1 Processor Installation Tool......................................................................................... 98 Thermal/Mechanical Design Guide 5 Tables 1-1 1-2 4-1 4-2 4-3 4-4 5-1 5-2 5-3 5-4 6-1 A-1 A-2 A-3 A-4 B-1 C-1 E-1 E-2 E-3 6 Reference Documents ...............................................................................................10 Terms and Descriptions .............................................................................................10 Socket Component Mass............................................................................................27 1366-land Package and LGA1366 Socket Stackup Height ...............................................27 Socket and ILM Mechanical Specifications ....................................................................28 Electrical Requirements for LGA1366 Socket ................................................................29 Boundary Conditions and Performance Targets .............................................................31 Performance Expectations for 25.5 mm Tall Heatsink.....................................................33 Fan Speed Control, TCONTROL and DTS Relationship ....................................................39 TCONTROL Guidance ...................................................................................................39 Heatsink Test Conditions and Qualification Criteria ........................................................43 Suppliers for the Intel Reference Thermal Solution ........................................................47 Suppliers for the Intel Collaboration Thermal Solution ...................................................48 Suppliers for the Alternative Thermal Solution ..............................................................48 LGA1366 Socket and ILM Components ........................................................................49 Mechanical Drawing List ............................................................................................51 Mechanical Drawing List ............................................................................................79 Boundary Conditions and Performance Targets .............................................................87 Embedded Heatsink Component Suppliers ...................................................................92 Mechanical Drawings List ...........................................................................................92 Thermal/Mechanical Design Guide Revision History Document Number Revision Number 321323 001 Description Revision Date Public Release March 2009 § Thermal/Mechanical Design Guide 7 8 Thermal/Mechanical Design Guide Introduction 1 Introduction This document provides guidelines for the design of thermal and mechanical solutions for 2-socket server and 2-socket Workstation processors in the Intel® Xeon® 5500 Platform. The processors covered include those listed in the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 and the follow-on processors. The design guidelines apply to the follow-on processors in their current stage of development and are not expected to change as they mature. The components described in this document include: • The processor thermal solution (heatsink) and associated retention hardware. • The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate. Processors in 1-socket Workstation platforms are covered in the Intel® Xeon® Processor 3500 Series Thermal/Mechanical Design Guide. Figure 1-1. Intel® Xeon® 5500 Platform Socket Stack Heatsink Socket and ILM Back Plate The goals of this document are: • To assist board and system thermal mechanical designers. • To assist designers and suppliers of processor heatsinks. Thermal profiles and other processor specifications are provided in the Datasheet. Thermal/Mechanical Design Guide 9 Introduction 1.1 References Material and concepts available in the following documents may be beneficial when reading this document. Table 1-1. Reference Documents Document Location European Blue Angel Recycling Standards Notes 2 Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 321321 1 Intel® Xeon® Processor 5500 Series Mechanical Model 321326 1 Intel® Xeon® Processor 5500 Series Thermal Model 321327 Entry-level Electronics Bay Specification 1 3 Notes: 1. Document numbers indicated in Location column are subject to change. See the appropriate Electronic Design Kit (EDK) for the most up-to-date Document number. 2. Available at http://www.blauer-engel.de 3. Available at http://ssiforum.oaktree.com/ 1.2 Definition of Terms Table 1-2. Terms and Descriptions (Sheet 1 of 2) Term 10 Description Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface. DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature. FSC Fan Speed Control IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. ILM Independent Loading Mechanism provides the force needed to seat the 1366-LGA land package onto the socket contacts. LGA1366 socket The processor mates with the system board through this surface mount, 1366-contact socket. PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. ΨCA Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (TCASE – TLA) / Total Package Power. Heat source should always be specified for Ψ measurements. ΨCS Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (TCASE – TS) / Total Package Power. ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS – TLA) / Total Package Power. TCASE The case temperature of the processor measured at the geometric center of the topside of the IHS. TCASE_MAX The maximum case temperature as specified in a component specification. TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits. Thermal/Mechanical Design Guide Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) Term Description TCONTROL TCONTROL is a static value below TCC activation used as a trigger point for fan speed control. TDP Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate. Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature. Thermal Profile Line that defines case temperature specification of a processor at a given power level. TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink. TLA The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. TSA The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc. § Thermal/Mechanical Design Guide 11 Introduction 12 Thermal/Mechanical Design Guide LGA1366 Socket 2 LGA1366 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for processors in the Intel® Xeon® 5500 Platform. The socket provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard. The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a 43x41 grid array with 21x17 grid depopulation in the center of the array and selective depopulation elsewhere. The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in Chapter 4. Figure 2-1. LGA1366 Socket with Pick and Place Cover Removed package socket cavity Thermal/Mechanical Design Guide 13 LGA1366 Socket BA AW AU AR AN AL AJ AG AE AC AA W U R N L J G E C A 41 40 39 38 37 36 35 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 BA 42 AY AW 43 AV AU T V Y AB AD AF AH AK AM R U W AA AC AE AG AJ AL AN 5 B D F H K M P T V Y AB AD AF AH AK AM P 6 A N AP AT AV AY AT 7 AR 8 AP 9 10 M 11 12 L 13 14 K 15 16 J 17 18 H 19 20 G 21 22 F 23 24 E 25 26 D 27 28 C 29 30 B 31 32 4 Thermal/Mechanical Design Guide 14 LGA1366 Socket Contact Numbering (Top View of Socket) Figure 2-2. LGA1366 Socket 2.1 Board Layout The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size is 18 mils. Note that there is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent. Figure 2-3. LGA1366 Socket Land Pattern (Top View of Board) A C B E D G F J H L K N M R P U T W V AA AC AE AG AJ AL AN AR AU AW BA Y AB AD AF AH AK AM AP AT AV AY 43 42 41 40 39 38 37 36 35 34 33 32 31 30 32 29 31 30 28 27 29 28 26 25 27 24 26 23 25 24 22 23 21 20 22 19 21 18 20 17 19 16 18 15 17 14 16 13 15 14 12 13 12 11 10 9 8 7 6 5 4 3 2 1 A C B Thermal/Mechanical Design Guide E D G F J H L K N M R P U T W V AA AC AE AG AJ AL AN AR AU AW BA Y AB AD AF AH AK AM AP AT AV AY 15 LGA1366 Socket 2.2 Attachment to Motherboard The socket is attached to the motherboard by 1366 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket. As indicated in Figure 2-4, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process. Figure 2-4. Attachment to Motherboard ILM LGA 1366 Socket 2.3 Socket Components The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to Appendix C for detailed drawings. 2.3.1 Socket Body Housing The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260 °C for 40 seconds (typical reflow/rework). The socket coefficient of thermal expansion (in the XY plane), and creep properties, must be such that the integrity of the socket is maintained for the conditions listed in the LGA1366 Socket Validation Reports. The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems. 2.3.2 Solder Balls A total of 1366 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard. The socket has the following solder ball material: • Lead free SAC (SnAgCu) solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy must be compatible with immersion silver (ImAg) motherboard surface finish and a SAC alloy solder paste. 16 Thermal/Mechanical Design Guide LGA1366 Socket The co-planarity (profile) and true position requirements are defined in Appendix C. 2.3.3 Contacts Base material for the contacts is high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.381 μm [15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel underplate. No contamination by solder in the contact area is allowed during solder reflow. 2.3.4 Pick and Place Cover The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions listed in the LGA1366 Socket Validation Reports without degrading. As indicated in Figure 2-5, the cover remains on the socket during ILM installation, and should remain on whenever possible to help prevent damage to the socket contacts. Cover retention must be sufficient to support the socket weight during lifting, translation, and placement (board manufacturing), and during board and system shipping and handling. The covers are designed to be interchangeable between socket suppliers. As indicated in Figure 2-5, a Pin1 indicator on the cover provides a visual reference for proper orientation with the socket. Figure 2-5. Pick and Place Cover ILM Installation Pin 1 Pick and Place Cover Thermal/Mechanical Design Guide 17 LGA1366 Socket 2.4 Package Installation / Removal As indicated in Figure 2-6, access is provided to facilitate manual installation and removal of the package. To assist in package orientation and alignment with the socket: • The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation. • The package substrate has orientation notches along two opposing edges of the package, offset from the centerline. The socket has two corresponding orientation posts to physically prevent mis-orientation of the package. These orientation features also provide initial rough alignment of package to socket. • The socket has alignment walls at the four corners to provide final alignment of the package. See Appendix F for information regarding a tool designed to provide mechanical assistance during processor installation and removal. . Figure 2-6. Package Installation / Removal Features orientation notch Pin1 triangle alignment walls access orientation post Pin1 chamfer 2.4.1 Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C. Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Section 4.2 for the calculated IHS height above the motherboard. 18 Thermal/Mechanical Design Guide LGA1366 Socket 2.5 Durability The socket must withstand 30 cycles of processor insertion and removal. The max chain contact resistance from Table 4-4 must be met when mated in the 1st and 30th cycles. The socket Pick and Place cover must withstand 15 cycles of insertion and removal. 2.6 Markings There are three markings on the socket: • LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm). • Manufacturer's insignia (font size at supplier's discretion). • Lot identification code (allows traceability of manufacturing date and location). All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard. LGA1366 and the manufacturer's insignia are molded or laser marked on the side wall. 2.7 Component Insertion Forces Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket. 2.8 Socket Size Socket information needed for motherboard design is given in Appendix C. This information should be used in conjunction with the reference motherboard keepout drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components. Thermal/Mechanical Design Guide 19 LGA1366 Socket 2.9 LGA1366 Socket NCTF Solder Joints Intel has defined selected solder joints of the socket as non-critical to function (NCTF) for post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. Figure 2-7 identifies the NCTF solder joints. . Figure 2-7. LGA1366 NCTF Solder Joints A C B E D G F J H L K N M R P U T W V AA AC AE AG AJ Y AL AN AR AU AW BA AB AD AF AH AK AM AP AT AV AY 43 42 41 40 39 38 37 36 35 34 33 32 31 30 32 29 31 30 28 27 29 28 26 25 27 26 24 23 25 24 22 23 21 20 22 19 21 20 18 17 19 16 18 15 17 16 14 13 15 14 12 13 12 11 10 9 8 7 6 5 4 3 2 1 A C B Note: E D G F J H L K N M R P U T W V AA AC AE AG AJ Y AL AN AR AU AW BA AB AD AF AH AK AM AP AT AV AY For platforms supporting the DP processor land C3 is CTF. § 20 Thermal/Mechanical Design Guide Independent Loading Mechanism (ILM) 3 Independent Loading Mechanism (ILM) The Independent Loading Mechanism (ILM) provides the force needed to seat the 1366-LGA land package onto the socket contacts. The ILM is physically separate from the socket body. The assembly of the ILM to the board is expected to occur after wave solder. The exact assembly location is dependent on manufacturing preference and test flow. Note: The ILM has two critical functions: deliver the force to seat the processor onto the socket contacts and distribute the resulting compressive load evenly through the socket solder joints. Note: The mechanical design of the ILM is integral to the overall functionality of the LGA1366 socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters. 3.1 Design Concept The ILM consists of two assemblies that will be procured as a set from the enabled vendors. These two components are ILM cover assembly and back plate. 3.1.1 ILM Cover Assembly Design Overview The ILM Cover assembly consists of four major pieces: load lever, load plate, frame and the captive fasteners. The load lever and load plate are stainless steel. The frame and fasteners are high carbon steel with appropriate plating. The fasteners are fabricated from a high carbon steel. The frame provides the hinge locations for the load lever and load plate. The cover assembly design ensures that once assembled to the back plate and the load lever is closed, the only features touching the board are the captive fasteners. The nominal gap of the frame to the board is ~1 mm when the load plate is closed on the empty socket or when closed on the processor package. When closed, the load plate applies two point loads onto the IHS at the “dimpled” features shown in Figure 3-1. The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints. Thermal/Mechanical Design Guide 21 Independent Loading Mechanism (ILM) Figure 3-1. ILM Cover Assembly Load Lever Captive Fastener (4x) Load Plate Frame 3.1.2 ILM Back Plate Design Overview The unified back plate for 2-socket server and 2-socket Workstation products consists of a flat steel back plate with threaded studs for ILM attach, and internally threaded nuts for heatsink attach. The threaded studs have a smooth surface feature that provides alignment for the back plate to the motherboard for proper assembly of the ILM around the socket. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors. An additional cut-out on two sides provides clearance for backside voltage regulator components. An insulator is preapplied. Back plates for processors in 1-socket Workstation platforms are covered in the Intel® Xeon® Processor 3500 Series Thermal/Mechanical Design Guide. 22 Thermal/Mechanical Design Guide Independent Loading Mechanism (ILM) Back Plate t -o ut Figure 3-2. Cu Threaded studs studs Threaded Clearance Clearance hole hole Threaded nuts 3.2 Assembly of ILM to a Motherboard The ILM design allows a bottoms up assembly of the components to the board. In step 1, (see Figure 3-3), the back plate is placed in a fixture. Holes in the motherboard provide alignment to the threaded studs. In step 2, the ILM cover assembly is placed over the socket and threaded studs. Using a T20 Torx* driver fasten the ILM cover assembly to the back plate with the four captive fasteners. Torque to 8 ± 2 inchpounds. The length of the threaded studs accommodate board thicknesses from 0.062” to 0.100”. Thermal/Mechanical Design Guide 23 Independent Loading Mechanism (ILM) . Figure 3-3. ILM Assembly Step 1: With socket body reflowed on board, and back plate in fixture, align board holes to back plate studs. 24 Step 2: With back plate against bottom of board, align ILM cover assembly to back plate studs. Thermal/Mechanical Design Guide Independent Loading Mechanism (ILM) As indicated in Figure 3-4, socket protrusion and ILM key features prevent 180-degree rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1 orientation with respect to the ILM lever. Figure 3-4. Pin1 and ILM Lever Protrusion ILM Key ILM Lever Pin 1 § Thermal/Mechanical Design Guide 25 Independent Loading Mechanism (ILM) 26 Thermal/Mechanical Design Guide LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications 4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications This chapter describes the electrical, mechanical, and environmental specifications for the LGA1366 socket and the Independent Loading Mechanism. 4.1 Component Mass Table 4-1. Socket Component Mass Component Socket Body, Contacts and PnP Cover ILM Cover ILM Back Plate for dual processor server products 4.2 Mass 15 gm 43 gm 100 gm Package/Socket Stackup Height Table 4-2 provides the stackup height of a processor in the 1366-land LGA package and LGA1366 socket with the ILM closed and the processor fully seated in the socket. Table 4-2. 1366-land Package and LGA1366 Socket Stackup Height Integrated Stackup Height (mm) From Top of Board to Top of IHS 7.729 ± 0.282 mm Notes: 1. This data is provided for information only, and should be derived from: (a) the height of the socket seating plane above the motherboard after reflow, given in Appendix C, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor EMTS. 2. This value is a RSS calculation. 4.3 Socket Maximum Temperature The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the temperature guidance may result in socket body deformation, or increases in thermal and electrical resistance which can cause a thermal runaway and eventual electrical failure. The guidance for socket maximum temperature is listed below: • Via temperature under socket < 96 °C Thermal/Mechanical Design Guide 27 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications 4.4 Loading Specifications The socket will be tested against the conditions listed in the LGA1366 Socket Validation Reports with heatsink and the ILM attached, under the loading conditions outlined in this chapter. Table 4-3 provides load specifications for the LGA1366 socket with the ILM installed. The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The socket body should not be used as a mechanical reference or load-bearing surface for thermal solutions. Table 4-3. Socket and ILM Mechanical Specifications Parameter Min Max Notes Static compressive load from ILM cover to processor IHS 470 N [106 lbf] 623 N [140 lbf] 3, 4 Heatsink Static Compressive Load 0 N [0 lbf] 266 N [60 lbf] 1, 2, 3 Total Static Compressive Load (ILM plus Heatsink) 470 N (106 lbf) 890 N (200 lbf) 3, 4 Dynamic Compressive Load (with heatsink installed) N/A 890 N [200 lbf] 1, 3, 5, 6 Pick and Place Cover Insertion / Removal force N/A 10.2 N [2.3 lbf] Load Lever actuation force N/A 38.3 N [8.6 lbf] in the vertical direction 10.2 N [2.3 lbf] in the lateral direction. Notes: 1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface. 2. This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits. 3. Loading limits are for the LGA1366 socket. 4. This minimum limit defines the compressive force required to electrically seat the processor onto the socket contacts. 5. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement. 6. Test condition used a heatsink mass of 550 gm [1.21 lb] with 50 g acceleration measured at heatsink mass. The dynamic portion of this specification in the product application can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this dynamic load. 4.5 Electrical Requirements LGA1366 socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated. 28 Thermal/Mechanical Design Guide LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications Table 4-4. Electrical Requirements for LGA1366 Socket Parameter Value Comment <3.9nH The inductance calculated for two contacts, considering one forward conductor and one return conductor. These values must be satisfied at the worst-case height of the socket. Mated loop inductance, Loop Mated partial mutual inductance, L Maximum mutual capacitance, C. NA <1 pF Bulk Resistance Increase Dielectric Withstand Voltage Insulation Resistance 4.6 The capacitance between two contacts 15.2 mΩ The socket average contact resistance target is derived from average of every chain contact resistance for each part used in testing, with a chain contact resistance defined as the resistance of each chain minus resistance of shorting bars divided by number of lands in the daisy chain. The specification listed is at room temperature and has to be satisfied at all time. Socket Contact Resistance: The resistance of the socket contact, solderball, and interface resistance to the interposer land. ≤ 100 mΩ The specification listed is at room temperature and has to be satisfied at all time. Socket Contact Resistance: The resistance of the socket contact, solderball, and interface resistance to the interposer land; gaps included. Socket Average Contact Resistance (EOL) Max Individual Contact Resistance (EOL) The inductance on a contact due to any single neighboring contact. ≤ 3 mΩ The bulk resistance increase per contact from 24 °C to 107 °C 360 Volts RMS 800 MΩ Environmental Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points. The reliability targets in this chapter are based on the expected field use environment for these products. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor dependent. A simplified process flow of this methodology can be seen in Figure 4-1. Thermal/Mechanical Design Guide 29 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications Figure 4-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology Establish the market/expected use environment for the technology Develop Speculative stress conditions based on historical data, content experts, and literature search Freeze stressing requirements and perform additional data turns Perform stressing to validate accelerated stressing assumptions and determine acceleration factors A detailed description of this methodology can be found at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf. § 30 Thermal/Mechanical Design Guide Thermal Solutions 5 Thermal Solutions This section describes a 1U reference heatsink, design targets for 2U and Tower heatsinks, performance expectations for a 25.5 mm tall heatsink, and thermal design guidelines for Intel® Xeon® Processor 5500 Series and the follow-on processors. 5.1 Performance Targets Table 5-1 provides boundary conditions and performance targets for 1U, 2U and Tower heatsinks. These values are used to generate processor thermal specifications and to provide guidance for heatsink design. Table 5-1. Boundary Conditions and Performance Targets Parameter Value Altitude, system ambient temp Sea level, 35oC TDP 60W 49oC TLA1 ΨCA 80W 49oC 130W, WS9 49oC 55oC 40oC 0.336 C/W 0.337 C/W 0.201 C/W 0.201oC/W Airflow3 9.7 CFM @ 0.20” dP 9.7 CFM @ 0.20” dP 9.7 CFM @ 0.20” dP 30 CFM @ 0.205” dP 30 CFM @ 0.205” dP System height (form factor)4 1U (EEB) 1U (EEB) 1U (EEB)5 2U (EEB) Pedestal (EEB) 90 x 90 x 64mm (2U)6,7 90 x 90 x 99mm (Tower)6 Heatsink volumetric Heatsink technology8 o 95W, Profile A 0.335 C/W 2 o 95W, Profile B o 90 x 90 x 27mm (1U)6 Cu base, Al fins o Cu/Al base, Al fins with heatpipes Notes: 1. Local ambient temperature of the air entering the heatsink. 2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1). 3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H2O. 4. Reference system configuration. Processor is downstream from memory in EEB (Entry-Level Electronics Bay). Ducting is utilized to direct airflow. 5. The 1U heatsink can also meet Profile B for the 95W processor in TEB (Thin Electronics Bay) under the following conditions: TLA = 40ºC, ΨCA = 0.275ºC/W, airflow = 16 CFM @ 0.344” dP (these TEB values are not used to generate processor thermal specifications). Processor is not downstream from memory in TEB. Ducting is utilized to direct airflow. 6. Dimensions of heatsink do not include socket or processor. 7. The 2U heatsink height (64mm) + socket/processor height (7.729 mm, Table 4-2) complies with 76.2 mm max height for EEB monoplanar boards (http://ssiforum.oaktree.com/). 8. Passive heatsinks. PCM45F thermal interface material. 9. WS = Workstation. Thermal/Mechanical Design Guide 31 Thermal Solutions For 1U reference heatsink, see Appendix B for detailed drawings. Table 5-1 specifies ΨCA and pressure drop targets at 9.7 CFM. Figure 5-1 shows ΨCA and pressure drop for the 1U heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph. Figure 5-1. 1U Heatsink Performance Curves For 2U and Tower heatsink, see Appendix B for volumetric drawings. Table 5-1 specifies ΨCA and pressure drop targets at 30 CFM. At airflows other than 30 CFM, ΨCA and pressure drop will differ between suppliers as their heatpipe and fin geometries will vary. 32 Thermal/Mechanical Design Guide Thermal Solutions 5.1.1 25.5 mm Tall Heatsink For the 25.5 mm tall heatsink, Table 5-2 provides guidance regarding performance expectations. These values are not used to generate processor thermal specifications. Table 5-2. Performance Expectations for 25.5 mm Tall Heatsink Parameter Value Altitude, system ambient temp Sea level, 35oC TDP 95W, Profile B o TLA1 ΨCA2 50 C 49oC 40oC 0.287oC/W 0.337oC/W 0.275oC/W 3 13.3 CFM @ 0.334” dP 10 CFM @ 0.210” dP 16 CFM @ 0.354” dP System height (form factor)4 SSI blade 1U (EEB) 1U (TEB) Airflow Heatsink volumetric Heatsink technology6 90 x 90 x 25.5mm (1U)5 Cu base, Al fins Notes: 1. Local ambient temperature of the air entering the heatsink. 2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1). 3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H2O. 4. Reference system configuration. Processor is downstream from memory in SSI blade and EEB (Entry-Level Electronics Bay), not in TEB (Thin Electronics Bay). Ducting is utilized to direct airflow. 5. Dimensions of heatsink do not include socket or processor. The 25.5 mm heatsink height + socket/processor height (7.729 mm, Table 4-2) complies with 33.5mm max height for SSI blade boards (http://ssiforum.oaktree.com/). 6. Passive heatsinks. Dow Corning TC-1996 thermal interface material. Thermal/Mechanical Design Guide 33 Thermal Solutions 5.2 Heat Pipe Considerations Figure 5-2 shows the orientation and position of the TTV die. The TTV die is sized and positioned similarly to the processor die. Figure 5-2. TTV Die Size and Orientation 45 Figure 1 - Side Views of Package with IHS (not to scale) Cache Cache Cache Cache Cache 42.5 13.2 Core 4 Core 3 Core Uncore 1.0 Core 2 Package CL Core 1 Die CL 19.3 NOT TO SCALE All Dimensions in mm 34 Thermal/Mechanical Design Guide Thermal Solutions 5.3 Assembly Figure 5-3. 1U Reference Heatsink Assembly 1U Reference Heatsink Captive Screw Thermal Interface Material: Honeywell PCM45F IHS: Integrated Heat Spreader Threaded Nut Reference Back Plate (Unified Back Plate) The assembly process for the 1U reference heatsink begins with application of Honeywell PCM45F thermal interface material to improve conduction from the IHS. Tape and roll format is recommended. Pad size is 35 x 35mm, thickness is 0.25mm. Next, position the heatsink such that the heatsink fins are parallel to system airflow. While lowering the heatsink onto the IHS, align the four captive screws of the heatsink to the four threaded nuts of the back plate. Using a #2 Phillips driver, torque the four captive screws to 8 inch-pounds. This assembly process is designed to produce a static load of 39 - 51 lbf, for 0.062" 0.100" board thickness respectively. Honeywell PCM45F is expected to meet the performance targets in Table 5-1 from 30 - 60 lbf. From Table 4-3, the Heatsink Static Compressive Load of 0 - 60 lbf allows for designs that vary from the 1U reference heatsink. Example: A customer’s unique heatsink with very little static load (as little as 0 lbf) is acceptable from a socket loading perspective as long as the TCASE specification is met. Compliance to Board Keepout Zones in Appendix B is assumed for this assembly process. Thermal/Mechanical Design Guide 35 Thermal Solutions 5.3.1 Thermal Interface Material (TIM) TIM should be verified to be within its recommended shelf life before use. Surfaces should be free of foreign materials prior to application of TIM. Use isopropyl alcohol and a lint free cloth to remove old TIM before applying new TIM. 5.4 Structural Considerations Mass of the 1U reference heatsink and the target mass for 2U and Tower heatsinks does not exceed 500 gm. From Table 4-3, the Dynamic Compressive Load of 200 lbf max allows for designs that exceed 500 gm as long as the mathematical product does not exceed 200 lbf. Example: A heatsink of 2-lb mass (908 gm) x 50 g (acceleration) x 2.0 Dynamic Amplification Factor = 200 lbf. The Total Static Compressive Load (Table 4-3) should also be considered in dynamic assessments. The heatsink limit of 500 gm and use of back plate have eliminated the need for Direct Chassis Attach retention (as used previously with the Intel® Xeon® processor 5000 sequence). Direct contact between back plate and chassis pan will help minimize board deflection during shock. Placement of board-to-chassis mounting holes also impacts board deflection and resultant socket solder ball stress. Customers need to assess shock for their designs as their heatsink retention (back plate), heatsink mass and chassis mounting holes may vary. 5.5 Thermal Design 5.5.1 Thermal Characterization Parameter The case-to-local ambient Thermal Characterization Parameter (ΨCA) is defined by: Equation 5-1.ΨCA = (TCASE - TLA) / TDP Where: TCASE TLA TDP = = = Processor case temperature (°C). For TCASE specification see the appropriate Datasheet. Local ambient temperature in chassis at processor (°C). TDP (W) assumes all power dissipates through the integrated heat spreader. This inexact assumption is convenient for heatsink design. TTVs are often used to dissipate TDP. Correction offsets account for differences in temperature distribution between processor and TTV. Equation 5-2.ΨCA = ΨCS + ΨSA Where: ΨCS = ΨSA = Thermal characterization parameter of the TIM (°C/W) is dependent on the thermal conductivity and thickness of the TIM. Thermal characterization parameter from heatsink-to-local ambient (°C/W) is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins. Figure 5-4 illustrates the thermal characterization parameters. 36 Thermal/Mechanical Design Guide Thermal Solutions Figure 5-4. Processor Thermal Characterization Parameter Relationships 5.5.2 Dual Thermal Profile Processors that offer dual thermal profile are specified in the appropriate Datasheet. Dual thermal profile helps mitigate limitations in volumetrically constrained form factors and allows trade-offs between heatsink cost and TCC activation risk. For heatsinks that comply to Profile B, yet do not comply to Profile A (1U heatsink in Figure 5-5), the processor has an increased probability of TCC activation and an associated measurable performance loss. Measurable performance loss is defined to be any degradation in processor performance greater than 1.5%. 1.5% is chosen as the baseline since run-to-run variation in a performance benchmark is typically between 1 and 2%. Thermal/Mechanical Design Guide 37 Thermal Solutions Figure 5-5. Dual Thermal Profile TCASE _MAX_B TEMPERATURE TCASE _MAX_A 1U Heatsink 40C 0W 2U Heatsink POWER TDP Compliance to Profile A ensures that no measurable performance loss will occur due to TCC activation. It is expected that TCC would only be activated for very brief periods of time when running a worst-case real world application in a worst-case thermal condition. A worst-case real world application is a commercially available, useful application which dissipates power above TDP for a thermally relevant timeframe. One example of a worst-case thermal condition is when the processor local ambient temperature is above the y-axis intercept for Profile A. 5.6 Thermal Features More information regarding processor thermal features is contained in the appropriate Datasheet. 38 Thermal/Mechanical Design Guide Thermal Solutions 5.6.1 Fan Speed Control There are many ways to implement fan speed control. Using processor ambient temperature (in addition to Digital Thermal Sensor) to scale fan speed can improve acoustics when DTS > TCONTROL. Table 5-3. Fan Speed Control, TCONTROL and DTS Relationship Condition 5.6.1.1 FSC Scheme DTS ≤ TCONTROL FSC can adjust fan speed to maintain DTS ≤ TCONTROL (low acoustic region). DTS > TCONTROL FSC should adjust fan speed to keep TCASE at or below the Thermal Profile specification (increased acoustic region). TCONTROL Guidance Factory configured TCONTROL values are available in the appropriate Dear Customer Letter or may be extracted by issuing a Mailbox or an RDMSR instruction. See the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 for more information. Due to increased thermal headroom based on thermal characterization on the latest stepping of Intel® Xeon® Processor 5500 Series production processors, customers have the option to reduce TCONTROL to values lower than the factory configured values. In some situations, use of reduced TCONTROL Guidance can reduce average fan power and improve acoustics. Implementation is optional. Alternately, the factory configured TCONTROL values can still be used. There are no plans to change Intel's specification or the factory configured TCONTROL values on individual processors. To implement this guidance, customers must re-write code to set TCONTROL to the reduced values provided in the table below. Table 5-4. TCONTROL Guidance TDP TCONTROL Guidance Comment 95W -10 Intel® Xeon® Processor 5500 Series with 2.93 GHz Max Core Frequency 95W -1 Intel® Xeon® Processor 5500 Series frequencies lower than 2.93 GHz 80W -1 Intel® Xeon® Processor 5500 Series 2.53 GHz or lower, except Embedded (NEBS) 60W -1 Intel® Xeon® Processor 5500 Series 2.26 GHz or lower, except Embedded (NEBS) Implementation of TCONTROL Guidance above maintains Intel standards of reliability (based on modeling of the Intel Reference Design). Implementation of TCONTROL of -1 may increase risk of throttling (Thermal Control Circuit activation). Increased TCC activation may or may not result in measurable performance loss. Thermal Profile still applies. If PECI >= TCONTROL Guidance, then the case temperature must meet the Thermal Profile. TCONTROL values for the follow-on processor are TBD but expected to be in the range of the factory configured TCONTROL values for Intel® Xeon® Processor 5500 Series. Regardless of TCONTROL values used in Intel® Xeon® Processor 5500 Series, BIOS needs to identify the processor type. For the follow-on processor, the fan speed control algorithm needs to use the follow-on processor's factory configured TCONTROL values. Thermal/Mechanical Design Guide 39 Thermal Solutions 5.6.2 PECI Averaging and Catastrophic Thermal Management By averaging DTS over PECI, thermal solution failure can be detected and a soft shutdown can be initiated to help prevent loss of data. Thermal data is averaged over a rolling window of 256mS by default (X=8): AVGN = AVGN-1 * (1 – 1/2X) + Temperature * 1/2X Using a smaller averaging constant could cause premature detection of failure. The Critical Temperature threshold generally triggers somewhere between PECI of -0.75 and -0.50. To avoid false shutdowns, initiate soft shutdown at -0.25. Since customer designs, boundary conditions, and failure scenarios differ, above guidance should be tested in the customer’s system to prevent loss of data during shutdown. 5.6.3 Intel® Turbo Boost Technology Intel® Turbo Boost Technology (Intel® TBT) is a new feature available on certain processor SKUs that opportunistically, and automatically, allows the processor to run faster than the marked frequency if the part is operating below its power, temperature and current limits. Heatsink performance (lower ΨCA as described in Section 5.5.1) is one of several factors that can impact the amount of Intel® TBT frequency benefit. Intel® TBT performance is also constrained by ICC, and VCC limits. Increased IMON accuracy may provide more Intel® TBT benefit on TDP limited applications, as compared to lower ΨCA, as temperature is not typically the limiter for these workloads. With Intel® TBT enabled, the processor may run more consistently at higher power levels (but still within TDP), and be more likely to operate above TCONTROL, as compared to when Intel® TBT is disabled. This may result in higher acoustics. With Intel® TBT enabled, processors with dual thermal profiles (described in Section 5.5.2, have greater potential for performance delta between Profile A and Profile B platforms, as compared to previous platforms. 5.7 Thermal Guidance 5.7.1 Thermal Excursion Power for 95 W Processor Under fan failure or other anomalous thermal excursions, Tcase may exceed Thermal Profile B for a duration totaling less than 360 hours per year without affecting long term reliability (life) of the processor. For more typical thermal excursions, Thermal Monitor is expected to control the processor power level as long as conditions do not allow the Tcase to exceed the temperature at which Thermal Control Circuit (TCC) activation initially occurred. Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below this Tcase level by TCC activation, then data integrity is not assured. At some higher threshold, THERMTRIP# will enable a shut down in an attempt to prevent permanent damage to the processor. Thermal Test Vehicle (TTV) may be used to check anomalous thermal excursion 40 Thermal/Mechanical Design Guide Thermal Solutions compliance by ensuring that the processor Tcase value, as measured on the TTV, does not exceed Tcase_max_B at the anomalous power level for the environmental condition of interest. This anomalous power level is equal to 75% of the TDP limit. 5.7.2 Thermal Excursion Power for 80 W Processor Under fan failure or other anomalous thermal excursions, Tcase may exceed the thermal profile for a duration totaling less than 360 hours per year without affecting long term reliability (life) of the processor. For more typical thermal excursions, Thermal Monitor is expected to control the processor power level as long as conditions do not allow the Tcase to exceed the temperature at which Thermal Control Circuit (TCC) activation initially occurred. Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below this Tcase level by TCC activation, then data integrity is not assured. At some higher threshold, THERMTRIP# will enable a shut down in an attempt to prevent permanent damage to the processor. Thermal Test Vehicle (TTV) may be used to check anomalous thermal excursion compliance by ensuring that the processor Tcase value, as measured on the TTV, does not exceed Tcase_max at the anomalous power level for the environmental condition of interest. This anomalous power level is equal to 75% of the TDP limit. 5.7.3 Absolute Processor Temperature Intel does not test any third party software that reports absolute processor temperature. As such, Intel cannot recommend the use of software that claims this capability. Since there is part-to-part variation in the TCC (thermal control circuit) activation temperature, use of software that reports absolute temperature can be misleading. See the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 for details regarding use of IA32_TEMPERATURE_TARGET register to determine the minimum absolute temperature at which the TCC will be activated and PROCHOT# will be asserted. § Thermal/Mechanical Design Guide 41 Thermal Solutions 42 Thermal/Mechanical Design Guide Quality and Reliability Requirements 6 Quality and Reliability Requirements 6.1 Test Conditions The Test Conditions provided in Table 6-1 address processor heatsink failure mechanisms only. Test Conditions, Qualification and Visual Criteria vary by customer; Table 6-1 applies to Intel requirements. Socket Test Conditions are provided in the LGA1366 Socket Validation Reports available from socket suppliers listed in Appendix A. Table 6-1. Heatsink Test Conditions and Qualification Criteria (Sheet 1 of 2) Assessment Min Sample Size Test Condition Qualification Criteria 1) Humidity Non-operating, 500 hours, +85°C and 85% R.H. No visual defects. As verified in wind tunnel: • Mean ΨCA + 3s + offset not to exceed value in Table 5-1. • Pressure drop not to exceed value in Table 5-1. 15 2) Board-Level UnPackaged Shock 50G+/-10%; 170+/-10% in/sec; 3 drops per face, 6 faces. No damage to heatsink base or pipe. No visual defects. As verified in wind tunnel: • Mean ΨCA + 2.54s + offset not to exceed value in Table 5-1. • Pressure drop not to exceed value in Table 5-1. 15 3) Board-Level UnPackaged Vibration 5 Hz @ 0.01 g2/Hz to 20 Hz @ 0.02 g2/Hz (slope up). 20 Hz to 500 Hz @ 0.02 g2/Hz (flat). Input acceleration is 3.13 g RMS. 10 minutes/axis for all 3 axes on all samples. Random control limit tolerance is ±3 dB. No damage to heatsink base or pipe. No visual defects. As verified in wind tunnel: • Mean ΨCA + 2.54s + offset not to exceed value in Table 5-1 • Pressure drop not to exceed value in Table 5-1 15 4) First Article Inspection Not Applicable Meet all dimensions on 5 samples. Meet all CTF dimensions on 32 additional samples with 1.33 Cpk (mean + 4s). If samples are soft-tooled, a hard tool plan must be defined. 37 5) Shipping Media: Packaged Shock Drop height determined by weight and may vary by customer; Intel requirement in General Supplier Packaging Spec. 10 drops (6 sides, 3 edges, 1 corner) No visual defects 1 box 6) Shipping Media: Packaged Vibration 0.015 g2/Hz @ 10-40 Hz, sloping to 0.0015 g2/Hz @ 500 Hz, 1.03 gRMS, 1 hour/axis for 3 axes No visual defects 1 box 7) Gravitational Evaluation Required for heatpipe designs. 3 orientations (0°, +90°, -90°) As verified in wind tunnel, mean ΨCA + 3s + offset not to exceed value in Table 5-1 Thermal/Mechanical Design Guide 15 43 Quality and Reliability Requirements Table 6-1. Heatsink Test Conditions and Qualification Criteria (Sheet 2 of 2) Assessment 8) Thermal Performance Test Condition Qualification Criteria Min Sample Size Using 1U heatsink and 1U airflow from Table 5-1: 1) TTV @ 95W (Profile B), Note 1. Using 2U heatsink and 2U airflow from Table 5-1: 2) TTV @ 95W (Profile A), Note 1. 3) TTV @ 80W. 4) TTV @ 60W. Using Tower heatsink and Tower airflow from Table 5-1: 5) TTV @ 130W, Note 1. 6) TTV @ 95W (Profile A). 7) TTV @ 80W. 8) TTV @ 60W. As verified in wind tunnel: 1) mean ΨCA+ 3s + offset not to exceed Table 5-1 value for 95W in 1U. 2-4) mean ΨCA + 3s + offset not to exceed Table 5-1 value for 2U. 5-8) mean ΨCA + 3s + offset not to exceed Table 5-1 value for Tower. 5 heatsinks X 8 tests by supplier. 9) Thermal Cycling Required for heatpipe designs. Temperature range at pipe in heatsink assembly: -25C to +100C for 500 cycles. Cycle time is 30 minutes per full cycle, divided into half cycle in hot zone and half in cold zone, with minimum 1min soak at each temperature extreme for each cycle. See Figure 6-1 for example profile. As verified in wind tunnel: • Mean ΨCA + 3s + offset not to exceed value in Table 5-1. • Pressure drop not to exceed value in Table 5-1. 15 10) Heat Pipe Burst Continuously raise oven temperature and record the burst/leak temperatures of fully assembled heatsinks No failures at minimum of 300C @ 20 minutes 11) Heatsink Mass Design Target < 500 g All samples < 550 g 12) Heatsink Load Design Targets: 0.062" board = 38.7 ± 7.2 lbf (Fmin = 31.5 lbf). 0.100" board = 51.4 ± 7.9 lbf (Fmax = 59.3 lbf). 44 Note 1: 30 heatsinks X 3 tests by Intel. 32 pipes 30 30 No samples < 30 lbf on 0.062" board. 5 highest load samples (from 0.062" test) < 60 lbf on 0.100" board Thermal/Mechanical Design Guide Quality and Reliability Requirements Figure 6-1. Example Thermal Cycle - Actual profile will vary 6.2 Intel Reference Component Validation Intel tests reference components both individually and as an assembly on mechanical test boards, and assesses performance to the envelopes specified in previous sections by varying boundary conditions. While component validation shows that a reference design is tenable for a limited range of conditions, customers need to assess their specific boundary conditions and perform reliability testing based on their use conditions. Intel reference components are also used in board functional tests to assess performance for specific conditions. 6.2.1 Board Functional Test Sequence Each test sequence should start with components (baseboard, heatsink assembly, and so on) that have not been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly and BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/Processor/memory test. 6.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. No significant physical damage to the heatsink and retention hardware. Thermal/Mechanical Design Guide 45 Quality and Reliability Requirements 2. Heatsink remains seated and its bottom remains mated flat against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. 3. No signs of physical damage on baseboard surface due to impact of heatsink. 4. No visible physical damage to the processor package. 5. Successful BIOS/Processor/memory test. 6. Thermal compliance testing to demonstrate that the case temperature specification can be met. 6.2.3 Recommended BIOS/Processor/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered. The testing setup should include the following components, properly assembled and/or connected: • Appropriate system baseboard. • Processor and memory. • All enabling components, including socket and thermal solution parts. The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. 6.3 Material and Recycling Requirements Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (for example, polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MILSTD-810E, Method 508.4 must be performed to determine material performance. Any plastic component exceeding 25 gm should be recyclable per the European Blue Angel recycling standards. The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS compliant. Lead-free and Pb-free: Lead has not been intentionally added, but lead may still exist as an impurity below 1000 ppm. RoHS compliant: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/pending exemption applies. Note: RoHS implementation details are not fully defined and may change. § 46 Thermal/Mechanical Design Guide Component Suppliers A Component Suppliers Various suppliers have developed support components for processors in the Intel® Xeon® 5500 Platform. These suppliers and components are listed as a convenience to customers. Intel does not guarantee quality, reliability, functionality or compatibility of these components. The supplier list and/or the components may be subject to change without notice. Customers are responsible for the thermal, mechanical, and environmental verification of the components with the supplier. A.1 Intel Enabled Supplier Information Performance targets for heatsinks are described in Section 5.1. Mechanical drawings are provided in Appendix B. Mechanical models are listed in Table 1-1. Heatsinks assemble to server back plate Table A-4. A.1.1 Intel Reference Thermal Solution The Intel reference thermal solutions has been verified to meet the criteria outlined in Table 6-1. Customers can purchase the Intel reference thermal solutions from the suppliers listed in Table A-1. Table A-1. Assembly Assembly, Heat Sink, 1U A.1.2 Suppliers for the Intel Reference Thermal Solution Component Description Supplier PN 1U URS Intel Reference Heatsink p/n E32409-001 27 mm 1U Aluminum Fin, Copper Base, includes TIM, 95W capable Fujikura HSA-8078 Rev A 1U URS SSI Blade Reference Heatsink p/n E39069-001 refers to E22056 Rev 02 + Snap Cover 25.5mm 1U Aluminum Fin, Copper Base, includes TIM and Snap Cover, 95W capable. Fujikura HSA-8083C Supplier Contact Info Fujikura America Yuji Yasuda [email protected] 408-748-6991 Fujikura Taiwan Branch Yao-Hsien Huang [email protected] 886(2)8788-4959 Intel Collaboration Thermal Solution The Intel collaboration thermal solutions are preliminary and may not be verified to meet the criteria outlined in Table 6-1. Customers can purchase the Intel collaboration thermal solutions from the suppliers listed in Table A-2. Thermal/Mechanical Design Guide 47 Component Suppliers Table A-2. Suppliers for the Intel Collaboration Thermal Solution Assembly Component Assembly, Heatsink, Intel® Xeon® Processor 5500 Series, 2U 2U URS Heatsink Assembly, Heatsink, Intel® Xeon® Processor 5500 Series, Pedestal Tower URS Heatsink Intel Collaboration Heatsink p/n E32410-001 Intel Collaboration Heatsink p/n E32412-001 Description Supplier PN Supplier Designed Solution with Intel-specified retention, includes TIM, 95W capable Foxconn pn 1A016500 Supplier Designed Solution with Intel-specified retention, includes TIM, 130W capable Chaun-Choung Technology Corp (CCI) pn 0007029401 Supplier Contact Info Foxconn Wanchi Chen (worldwide) [email protected] (408) 919-6135 Chaun-Choung Technology Corp (CCI) Monica Chih [email protected] +886 (2) 2995-2666 x1131 Harry Lin [email protected] 714 739-5797 A.1.3 Alternative Thermal Solution The alternative thermal solutions are preliminary and are not verified by Intel to meet the criteria outlined in Table 6-1. Customers can purchase the alternative thermal solutions from the suppliers listed in Table A-3. Table A-3. Assembly Assembly, Heat Sink, 1U Assembly Heatsink, Intel® Xeon® Processor 5500 Series, 1U Suppliers for the Alternative Thermal Solution Component 1U SSI Blade Alternative URS Heatsink 1U Alternative URS Heatsink Description Supplier PN Supplier Designed Solution, Cu base, Al fins, 95W capable TaiSol Corporation 1A1-9031000960-A Supplier Contact Info Supplier Designed Solution, Cu base, Al fins, includes TIM, 95W capable Thermaltake CL-P0484 Supplier Designed Solution, Cu base, Al fins, includes TIM, 95W capable CoolerMaster S1N-PJFCS-07-GP CoolerMaster Isaac Chu [email protected] +886 2 32340050 x11182 Supplier Designed Solution, Cu base, Al fins, includes TIM, 95W capable Aavid Thermalloy 050073 Aavid Thermalloy Chris Chapman [email protected] 603-223-1728 TaiSol Corporation Janice Chiu [email protected] +866-2-2656-2658 Thermaltake Sean Li [email protected] +886-2-26626501 EXT.235 George Lee [email protected] +886 (2) 2698-9888 x603 48 Thermal/Mechanical Design Guide Component Suppliers Table A-3. Assembly Assembly, Heatsink, Intel® Xeon® Processor 5500 Series, 2U Assembly, Heatsink, Intel® Xeon® Processor 5500 Series, Tower A.1.4 Suppliers for the Alternative Thermal Solution Component 2U Alternative URS Heatsink Tower Alternative URS Heatsink Description Supplier PN Supplier Designed Solution, Aluminum base, Cu insert, Al fins, heatpipes, includes TIM, 95W capable Asia Vital Components (AVC) SR40400001 Supplier Contact Info Supplier Designed Solution, Cu base, Al fins, heatpipes, includes TIM, 95W capable Thermaltake CL-P0486 Supplier Designed Solution, Cu base, Al fins, heatpipes, includes TIM, 95W capable CoolerMaster S2N-PJMHS-07-GP CoolerMaster Isaac Chu [email protected] +886 2 32340050 x11182 Supplier Designed Solution, Cu base, Al fins, heatpipes, includes TIM, 95W capable TaiSol Corporation 1A0-9041000960-A TaiSol Corporation Janice Chiu [email protected] +886-2-2656-3658 Supplier Designed Solution, Aluminum Extrusion, includes TIM, 80W capable Dynatron Corporation G520 Supplier Designed Solution, Al fins, heatpipes, 130W capable TaiSol Corporation 1A0-9051000960-A Supplier Designed Solution, Al fins, heatpipes, 130W capable Thermaltake CL-P0485 Asia Vital Components (AVC) David Chao [email protected] +886 (2) 2299-6930 x7619 Thermaltake Sean Li [email protected] +886-2-26626501 EXT.235 Dynatron Corporation Ian Lee [email protected] 510-498-8888 x137 TaiSol Corporation Janice Chiu [email protected] +886-2-2656-3658 Thermaltake Sean Li [email protected] +886-2-26626501 EXT.235 Socket and ILM Components The LGA1366 Socket and ILM Components are described in Chapter 2 and Chapter 3, respectively. Socket mechanical drawings are provided in Appendix C. Mechanical models are listed in Table 1-1. Table A-4. LGA1366 Socket and ILM Components Item Intel PN Foxconn Tyco ILM Cover Assembly D92428-002 PT44L12-4101 1939738-1 Server Back Plate D92433-002 PT44P12-4101 1981467-1 LGA1366 Socket D86205-002 PE136627-4371-01F 1939737-1 Julia Jiang [email protected] 408-919-6178 Billy Hsieh [email protected] +81 44 844 8292 Supplier Contact Info § Thermal/Mechanical Design Guide 49 Component Suppliers 50 Thermal/Mechanical Design Guide Mechanical Drawings B Mechanical Drawings Table B-1. Mechanical Drawing List Description Figure Board Keepin / Keepout Zones (Sheet 1 of 4) Figure B-1 Board Keepin / Keepout Zones (Sheet 2 of 4) Figure B-2 Board Keepin / Keepout Zones (Sheet 3 of 4) Figure B-3 Board Keepin / Keepout Zones (Sheet 4 of 4) Figure B-4 1U Reference Heatsink Assembly (Sheet 1 of 2) Figure B-5 1U Reference Heatsink Assembly (Sheet 2 of 2) Figure B-6 1U Reference Heatsink Fin and Base (Sheet 1 of 2) Figure B-7 1U Reference Heatsink Fin and Base (Sheet 2 of 2) Figure B-8 Heatsink Shoulder Screw (1U, 2U and Tower) Figure B-9 Heatsink Compression Spring (1U, 2U and Tower) Figure B-10 Heatsink Retaining Ring (1U, 2U and Tower) Figure B-11 Heatsink Load Cup (1U, 2U and Tower) Figure B-12 2U Collaborative Heatsink Assembly (Sheet 1 of 2) Figure B-13 2U Collaborative Heatsink Assembly (Sheet 2 of 2) Figure B-14 2U Collaborative Heatsink Volumetric (Sheet 1 of 2) Figure B-15 2U Collaborative Heatsink Volumetric (Sheet 2 of 2) Figure B-16 Tower Collaborative Heatsink Assembly (Sheet 1 of 2) Figure B-17 Tower Collaborative Heatsink Assembly (Sheet 2 of 2) Figure B-18 Tower Collaborative Heatsink Volumetric (Sheet 1 of 2) Figure B-19 Tower Collaborative Heatsink Volumetric (Sheet 2 of 2) Figure B-20 1U Reference Heatsink Assembly with TIM (Sheet 1 of 2) Figure B-21 1U Reference Heatsink Assembly with TIM (Sheet 2 of 2) Figure B-22 2U Reference Heatsink Assembly with TIM (Sheet 1 of 2) Figure B-23 2U Reference Heatsink Assembly with TIM (Sheet 2 of 2) Figure B-24 Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2) Figure B-25 Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2) Figure B-26 Thermal/Mechanical Design Guide 51 52 A B C D 8 7 6 5 8 BALL 1 POSITION 4 LINE REPRESENTS OF OUTERMOST ROWS AND COLUMNS OF SOCKET BALL ARRAY OUTLINE. FOR REFERENCE ONLY SOCKET BODY OUTLINE FOR REFERENCE ONLY 7 6 AS VIEWED FROM PRIMARY SIDE OF THE MOTHERBOARD 36.00 [1.417] SOCKET ILM HOLE PATTERN 41.66 [1.640] CENTERLINE OF OUTER SOCKET BALL ARRAY 47.50 [1.870] SOCKET BODY OUTLINE, FOR REFERENCE ONLY 80.00 [3.150] THERMAL RETENTION HOLE PATTERN 90.00 [3.543] MAX THERMAL RETENTION OUTLINE 5 44.70 [1.760] CENTERLINE OF OUTER SOCKET BALL ARRAY 49.90 [1.965] SOCKET BODY OUTLINE, FOR REFERENCE ONLY 61.20 [2.409] SOCKET ILM HOLE PATTERN 90.00 [3.543] MAX THERMAL RETENTION OUTLINE 4 80.00 [3.150] THERMAL RETENTION HOLE PATTERN 4 3 THIRD ANGLE PROJECTION UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES: .X # 0.0 Angles # 0.0 .XX # 0.00 .XXX # 0.000 3 D77712 SHT. 1 REV 02 7 FOR ADDITIONAL DETAILS. 7 ZONE 3: 3.0 MM MAX COMPONENT HEIGHT DATE 09/28/06 DATE 11/03/06 DATE FINISH DRAWN BY CHECKED BY J. WILLIAMS APPROVED BY MATERIAL 09/28/06 N. ULEN N. ULEN DATE DESIGNED BY 2 R SCALE: 3.000 D77712 1 DO NOT SCALE DRAWING SHEET 1 OF 4 REV 02 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 7 1 THURLEY & GAINESTOWN ENABLING KEEPIN / KEEPOUT SIZE DRAWING NUMBER D TITLE EASD / PTMI DEPARTMENT ZONE 6: 1.97 MM MAX COMPONENT HEIGHT, SOCKET CAVITY ZONE 5: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT, NO ROUTE ZONE ZONE 4: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT RETENTION MODULE OR HEAT SINK TOUCH ZONE 7 ZONE 2: 7.0 MM MAX COMPONENT HEIGHT ZONE 1: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT, SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE LEGEND, THIS SHEET ONLY 7 COMBINED COMPONENT AND SOLDER PASTE HEIGHT INCLUDING TOLERANCES AFTER REFLOW. 6. SEE SHEET 4 FOR REVISION HISTORY. SEE NOTE A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE OF THE MOTHERBOARD AS THE MAXIMUM HEIGHT. UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. ALL HEIGHT RESTRICTIONS ARE MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES. ALL ZONES DEFINED WITHIN THE 90 X 90 MM OUTLINE REPRESENT SPACE THAT RESIDES BENEATH THE HEAT SINK FOOTPRINT. 5. A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT DEFINED BY THAT ZONE. 4 BALL 1 LOCATION WITH RESPECT TO SOCKET BALL ARRAY IS FORMED BY INTERSECTION OF ROW A & COLUMN 1. MAXIMUM OUTLINE OF SOCKET SOLDERBALL ARRAY MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN (INNER PATTERN) FOR PROPER ILM & SOCKET FUNCTION. 3. SOCKET KEEP OUT DIMENSIONS SHOWN FOR REFERNCE ONLY PLEASE REFER TO THE SOCKET B KEEPOUT / KEEPIN DRAWING FOR EXACT DIMENSIONS 2. PRIMARY DIMENSIONS STATED IN MILLIMETERS. [BRACKATED] DIMENSIONS STATED IN INCHES 1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. NOTES: DWG. NO A B C D Figure B-1. THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. Mechanical Drawings Board Keepin / Keepout Zones (Sheet 1 of 4) Thermal/Mechanical Design Guide A B C D 8 7 6 8 5.00 [0.197 ] 85.00 [3.346 ] 3X 80.00 [3.150 ] 77.90 [3.067 ] 2X 72.50 [2.854 ] 2X 70.600 [2.7795 ] 62.39 [2.456 ] BALL 1 4 49.40 [1.945 ] 30.600 [1.205 ] 29.90 [1.177 ] 9.900 [0.3898 ] 2X 9.400 [0.3701 ] 2X 7.50 [0.295 ] 2X 0.00 [0.000 ] 3.30 [0.130 ] 7 67.70 [2.665 ] 58.000 [2.2835 ] 47.15 [1.856 ] 32.85 [1.293 ] 22.000 [0.8661 ] 19.17 [0.755 ] BALL 1 4 9.60 [0.378 ] 12.30 [0.484 ] 6 AS VIEWED FROM PRIMARY SIDE OF THE MOTHERBOARD (DETAILS) 2X 72.50 [2.854 ] 2X 7.50 [0.295 ] 2X 0.00 [0.000 ] 5.00 [0.197 ] Thermal/Mechanical Design Guide 5 5 2X 80.00 [3.150 ] SEE DETAIL A 4 4X 6.00 [0.236 ] NO ROUTE COPPER PAD ON SURFACE 4 3 EASD / PTMI DEPARTMENT 3 0.150 R DETAIL A SCALE 6.000 [ 3.80 ] NPTH D77712 SHT. 2 4X 0.159 6.00 [0.236 ] [ 4.03 02 +0.06 -0.03 +0.002 -0.001 THERMAL RETENTION MOUNTING HOLES 4X REV 7 ZONE 3: 3.0 MM MAX COMPONENT HEIGHT 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 2 D SCALE: 3.000 D77712 7 ] NPTH 1 1 DO NOT SCALE DRAWING SHEET 2 OF 4 SIZE DRAWING NUMBER ZONE 6: 1.97 MM MAX COMPONENT HEIGHT, SOCKET CAVITY ZONE 5: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT, NO ROUTE ZONE ZONE 4: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT RETENTION MODULE OR HEAT SINK TOUCH ZONE 7 ZONE 2: 7.0 MM MAX COMPONENT HEIGHT ZONE 1: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT, SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE LEGEND, THIS SHEET ONLY +0.06 -0.03 +0.002 -0.001 SOCKET ILM MOUNTING HOLES 4X DWG. NO REV 02 A B C D Figure B-2. THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. Mechanical Drawings Board Keepin / Keepout Zones (Sheet 2 of 4) 53 85.00 [3.346 ] A B C D 8 7 6 5 8 (90.00 ) [3.543] 8X 7 6.00 [0.236 ] (72.20 ) [2.843] DESKTOP BACKPLATE KEEPIN SHOWN FOR REFERENCE ONLY 70.50 [2.776 ] 6 9.50 [0.374 ] 47.15 [1.856 ] 5 AS VIEWED FROM SECONDARY SIDE OF THE MOTHERBOARD (DETAILS) (90.00 ) [3.543] (47.00 ) [1.850] 32.85 [1.293 ] 85.00 [3.346 ] 54 4 4 0.00 [0.000 ] 85.00 [3.346 ] 75.00 [2.953 ] 62.83 [2.474 ] 49.40 [1.945 ] 30.60 [1.205 ] 17.17 [0.676 ] 5.00 [0.197 ] 0.00 [0.000 ] 5.00 [0.197 ] 3 EASD / PTMI DEPARTMENT 3 R D77712 SHT. 3 REV 02 7 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 2 D SCALE: 3.000 D77712 1 1 DO NOT SCALE DRAWING SHEET 3 OF 4 SIZE DRAWING NUMBER ZONE 9: NO COMPONENT PLACEMENT & NO ROUTE ZONE ZONE 8: 1.8 MM MAX COMPONENT HEIGHT ZONE 7: NO COMPONENT PLACEMENT, STIFFENING PLATE CONTACT AREA LEGEND, THIS SHEET ONLY DWG. NO REV 02 A B C D Figure B-3. THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. Mechanical Drawings Board Keepin / Keepout Zones (Sheet 3 of 4) Thermal/Mechanical Design Guide 5.00 [0.197 ] Thermal/Mechanical Design Guide 7 6 5 8 7 6 5 4 DEPARTMENT R DATE ADDED ISO VIEW OF SECONDARY SIDE MOVED ISO VEWS TO SHEET 4 MODIFIED BACKSIDE HEIGHT RESTRICTIONS FOR NEW BACKPLATE GEOMETRY ADDED NOTE 5 DETAILING HEIGHT RESTRICTION NOMENCLATURE REMOVED TOLERANCE BLOCK VALUES, SEE NOTE 5 UPDATED ZONE 1 KEEPOUT ON SHEETS 1 & 2 TO ALLOW MORE SOCKET LEVER ARM ACCESS, LEFT SIDE OF ZONE PRODUCTION RELEASE ZONE 6 HEIGHT FROM 1.8MM --> 1.97MM ADDED NOTE 7 J K 01 02 3 EASD / PTMI 2 REVERTED SOCKET SOLDERBALL ARRAY X DIRECTION SIZE AND POSITION TO REV G. 40.64 --> 41.66 (ARRAY WIDTH) 19.67 --> 19.17 (ARRAY POSITION) SOLDERBALL ARRAY OUTLINE REPRESENTS THE CENTERLINE OF THE OUTER BALL ROWS/COLS I SCALE: 2.500 D MOVED REVISION HISTORY TABLE TO SHEET 4 CORRECTED SOCKET SOLDERBALL ARRAY & POS 41.66 --> 40.64 (ARRAY SIZE) 44.85 --> 44.70 (ARRAY SIZE) 62.43 --> 62.39 (ARRAY POSITION) 19.17 --> 19.67 (ARRAY POSITION) ADDED TOPSIDE CU PAD CALLOUT FOR ILM HOLES SEE DETAIL A, SHEET 2 H D77712 02/24/09 08/02/07 02/27/07 02/06/07 01/22/07 01/19/07 01/12/07 12/18/06 11/30/06 11/03/06 - APPROVED 1 1 DO NOT SCALE DRAWING SHEET 4 OF 4 SIZE DRAWING NUMBER REMOVED 3.0 MM HEIGHT RESTRICTION ZONE TO THE LEFT AND RIGHT OF SOCKET OUTLINE 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 CORRECTED ILM HOLE DIAMETER. WAS SHOWING RADIUS VALUE. 1.9 --> 3.8 UPDATED BACKPLATE HOLE DIAMTER SIZE FOR DT COMPATIBILITY. DIAMETER 4.0 --> 4.03 G UPDATED SOCKET KEEPIN OUTLINE TO REFLECT RECENT CHANGES. SEE KEEPIN ZONE 1 OUTLINE, SHEETS 1 & 2. 10/27/06 09/29/06 10/05/06 02 M.B COMPONENT HEIGHT RESTRICTION CHANGED FROM 2.5MM TO 7MM ADDED ADDITION KO FOR RM, SHEET 1 DRAWING RE-DO, ADDED BALL PATTERN, SOCKET BODY, BALL 1, BACKSIDE WINDOW, GENERAL DRAWING CLARIFICATIONS. DESCRIPTION REV ORIGINAL RELEASE 4 F E D C SHT. REVISION HISTORY D77712 REV C D 02 A SECONDARY SIDE 3D HEIGHT RESTRICTION ZONES SHT 1 SHT 4 SHT 4 SHT 3 1C6 2D6 1C6 1B5 2B8 2D6 2D4 2C1 2D3 A - B REV ZONE DWG. NO A ALL ZONES, SEE NOTE 5 THIS HEIGHT REPRESENTS AN ARBITRARY MOTHERBOARD THICKNESS 3 B PRIMARY SIDE 3D HEIGHT RESTRICTION ZONES 4 B C D 8 Figure B-4. THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. Mechanical Drawings Board Keepin / Keepout Zones (Sheet 4 of 4) 55 Mechanical Drawings Figure B-5. 56 1U Reference Heatsink Assembly (Sheet 1 of 2) Thermal/Mechanical Design Guide Mechanical Drawings Figure B-6. 1U Reference Heatsink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide 57 Mechanical Drawings Figure B-7. 58 1U Reference Heatsink Fin and Base (Sheet 1 of 2) Thermal/Mechanical Design Guide Mechanical Drawings Figure B-8. 1U Reference Heatsink Fin and Base (Sheet 2 of 2) Thermal/Mechanical Design Guide 59 60 A B C D 8 7 6 5 8 [ 5 DETAIL C SCALE 40.000 7 DETAIL A SCALE 40.000 DETAIL B SCALE 40.000 0.35 [0.014 ] ] 0.5 X 45 ALL AROUND +0.05 0 +0.001 0.025 -0.000 0.64 R0.20 [0.008 ] C B 6 SEE DETAIL A CRITICAL INTERFACE FEATURE: THIS SHOULDER MUST BE SQUARE SEE DETAIL SEE DETAIL 4X 0.72 MIN. [0.028 ] A A 6 TYPE 1, CROSS RECESSED #2 DRIVER 6 5 6 18.50 [0.728 ] 13.50 0.13 [0.532 0.005 ] 11.00 0.13 [0.433 0.005 ] 0.00 [0.000 ] 3.50 [0.138 ] 2X 4.06 0.17 [0.160 0.006 ] 5 5 5 7 4 2.00 0.32 [0.079 0.012 ] 4 (5.60 ) [0.220 ] 6 SECTION A-A 6.00 [0.236 ] 7.00 [0.276 ] 3.90 0 -0.10 -0.003 ] [0.154 +0.000 3 THIRD ANGLE PROJECTION UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES: .X .5 Angles 1.0 .XX 0.25 .XXX 0.127 2.93 0.06 5 [0.115 0.002 ] MAJOR DIA, M3 x 0.5 TOLERANCE CLASS 6G (13.50 ) [0.532 ] 2.00 [0.079 ] 3 - SHT. REV 03 FINISH MATERIAL 2 SEE NOTES DATE APPROVED BY SEE NOTES 02/14/07 W. SCHULZ DATE 02/12/07 02/12/07 DATE DATE CHECKED BY DRAWN BY N. ULEN DESIGNED BY 7 N. ULEN 5 M3 X 0.5 EXTERNAL THREAD 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 REV 1 DO NOT SCALE DRAWING SHEET 1 OF 1 03 SCALE: 1 D D89880 SCREW, SHOULDER, M3 X 0.5 R - APPROVED SIZE DRAWING NUMBER TITLE EASD / PTMI DEPARTMENT PER ASME B18.6.3-1998 INSPECT SHAFT DIAMETER IN THESE LOCATIONS 7 4. 5 3. 2. 6 1 THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE. PRIMARY DIMENSIONS STATED IN MILLIMETERS. [BRACKETED] DIMENSIONS STATED IN INCHES. MATERIAL: 18-8 STAINLESS STEEL; AISI 303, 304, 305; JIS SUS304; OR EQUIVALENT. MINIMUM TENSILE STRENGTH = 60,000 PSI. TORQUE TO FAILURE SHALL BE NO LESS THAN 20 IN-LBF. CRITICAL TO FUNCTION DIMENSION 09/08/08 12/18/07 07/13/07 05/15/07 04/27/07 03/22/07 02/12/07 DATE 1. NOTES: ADDED MAJOR SCREW DIA AS CTF 03 UPDATED SHAFT INSPECTION CRITERIA ADDED NOTE 7 ADDED SHOULDER NOTE PRODUCTION RELEASE INCREASED THREAD LENGTH TO 5MM 02 ADDED CTF 01 A3 SEC A-A NOTES B6 D UPDATED NOTE 3 AND ADDED NOTE 4. SCREW LENGTH INCREASED BY 1.0 MM. B3 1 REDUCED SHAFT DIAMETER TO 3.9, ADDED TOLERANCE. E-RING GROOVE DEPTH CHANGED TO 0.35 ADDED PHILLIPS HEAD DETAILS PER ASME B18.6.2-1998 SUPPLIER FEEDBACK C B DESCRIPTION REVISION HISTORY D89880 A B3 B8 B5 REV DWG. NO ZONE A B C D Figure B-9. THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. Mechanical Drawings Heatsink Shoulder Screw (1U, 2U and Tower) Thermal/Mechanical Design Guide Mechanical Drawings Figure B-10. Heatsink Compression Spring (1U, 2U and Tower) Thermal/Mechanical Design Guide 61 Mechanical Drawings Figure B-11. Heatsink Retaining Ring (1U, 2U and Tower) 62 Thermal/Mechanical Design Guide Mechanical Drawings Figure B-12. Heatsink Load Cup (1U, 2U and Tower) Thermal/Mechanical Design Guide 63 Mechanical Drawings Figure B-13. 2U Collaborative Heatsink Assembly (Sheet 1 of 2) 64 Thermal/Mechanical Design Guide Mechanical Drawings Figure B-14. 2U Collaborative Heatsink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide 65 Mechanical Drawings Figure B-15. 2U Collaborative Heatsink Volumetric (Sheet 1 of 2) 66 Thermal/Mechanical Design Guide Mechanical Drawings Figure B-16. 2U Collaborative Heatsink Volumetric (Sheet 2 of 2) Thermal/Mechanical Design Guide 67 Mechanical Drawings Figure B-17. Tower Collaborative Heatsink Assembly (Sheet 1 of 2) 68 Thermal/Mechanical Design Guide Mechanical Drawings Figure B-18. Tower Collaborative Heatsink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide 69 Mechanical Drawings Figure B-19. Tower Collaborative Heatsink Volumetric (Sheet 1 of 2) 70 Thermal/Mechanical Design Guide Mechanical Drawings Figure B-20. Tower Collaborative Heatsink Volumetric (Sheet 2 of 2) Thermal/Mechanical Design Guide 71 72 A B C D 8 7 6 5 8 5 7 6 2 5 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. 4 4 1 PART NUMBER 3 THIRD ANGLE PROJECTION UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES: .X # 0.5 Angles # 1.0 $ .XX # 0.25 .XXX # 0.127 ITEM NO E32409 QTY D85003 1 1 PCM-45F 2 TOP 1 3 SHT. DESCRIPTION 1 REV 01 REVISION HISTORY E32409 12/14/07 DATE 12/14/07 DATE FINISH D. LLAPITAN APPROVED BY MATERIAL 2 SEE NOTES DATE SEE NOTES 12/14/07 DATE DRAWN BY N. ULEN 12/14/07 CHECKED BY DATE N. ULEN DESCRIPTION R APPROVED 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 1 SCALE: 1.500 1 DO NOT SCALE DRAWING SHEET 1 OF 2 E32409 REV 01 ASSEMBLY, HEAT SINK, THURLEY 1U WITH TIM SIZE DRAWING NUMBER D TITLE EASD / PTMI DEPARTMENT PARTS LIST ASSEMBLY, HEAT SINK, THURLEY, 1U WITH TIM HEAT SINK, CU BASE, AL FINS, 1U TIM, 0.250x35x35MM, HONEYWELL (SEE NOTE 9) HONEYWELL PCM-45F THERMAL INTERFACE MATERIAL, WITH CLEAR PROTECTIVE LINER REMOVABLE BY HAND. LINER ORIENTATION AND REMOVAL DIRECTION NON-CRITICAL. SEE PARTS LIST, ITEM 2. CLEAR PROTECTIVE LINER NOT SHOWN IN THIS VIEW. THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X MAGNIFICATION. NA NA CRITICAL TO FUNCTION DIMENSION. "RECOMMENDED SCREW TORQUE: 8 IN-LBF" THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. PRIMARY DIMENSIONS STATED IN MILLIMETERS, [BRACKETED] DIMENSIONS STATED IN INCHES. CRITICAL TO FUNCTION DIMENSION. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR SOLVENTS AFTER FINAL ASSEMBLY. PART NUMBER AND TORQUE SPEC MARK. PLACE PART NUMBER AND TORQUE SPEC IN ALLOWABLE AREA, EITHER SIDE OF PART WHERE SHOWN. BELOW PART NUMBER CALLOUT, PLACE THE FOLLOWING TEXT: PRODUCTION RELEASE DESIGNED BY 9 6. 7. 8 5 3. 4. 2. 1. NOTES: 01 REV DWG. NO ZONE A B C D Mechanical Drawings Figure B-21. 1U Reference Heatsink Assembly with TIM (Sheet 1 of 2) Thermal/Mechanical Design Guide Thermal/Mechanical Design Guide A B C D 8 7 6 5 8 7 6 SEE NOTE 9 27.5 #0.5 [1.08 #0.01 ] 27.5 #0.5 [1.08 #0.01 ] 35.0 #1.0 [1.38 #0.03 ] 4 5 PROTECTIVE LINER NOT SHOWN. INSTALL PER MANUFACTURER'S RECOMMENDATION. SEE PARTS LIST, SHEET 1, ITEM 2 4 THERMAL INTERFACE APPLICATION THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. 35.0 #1.0 [1.38 #0.03 ] 3 EASD / PTMI DEPARTMENT 3 R 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 DWG. NO 2 2 SCALE: 1.500 D SHT. REV E32409 01 1 1 DO NOT SCALE DRAWING SHEET 2 OF 2 SIZE DRAWING NUMBER E32409 REV 01 A B C D Mechanical Drawings Figure B-22. 1U Reference Heatsink Assembly with TIM (Sheet 2 of 2) 73 74 A B C D 8 7 6 5 8 7 6 5 5 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. 2 4 4 PART NUMBER 3 THIRD ANGLE PROJECTION UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES: .X # 0.5 Angles # 1.0 $ .XX # 0.25 .XXX # 0.127 ITEM NO E32410 1 QTY D93127 2 TOP 1 PCM-45F 1 1 3 SHT. DESCRIPTION 1 REV 01 REVISION HISTORY E32410 DATE 12/14/07 SEE NOTES 2 SEE NOTES FINISH 12/14/07 D. LLAPITAN MATERIAL DATE CHECKED BY DATE 12/14/07 N. ULEN - DATE DRAWN BY - 12/14/07 APPROVED BY DATE N. ULEN DESCRIPTION R APPROVED 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 1 SCALE: 1.500 1 DO NOT SCALE DRAWING SHEET 1 OF 2 E32410 REV 01 ASSEMBLY, HEAT SINK, THURLEY, 2U TALL WITH TIM SIZE DRAWING NUMBER D TITLE EASD / PTMI DEPARTMENT PARTS LIST ASSEMBLY, HEAT SINK, THURLEY, 2U TALL WITH TIM HEAT SINK, 2U TALL TIM, 0.250x35x35MM, HONEYWELL (SEE NOTE 9) HONEYWELL PCM-45F THERMAL INTERFACE MATERIAL, WITH CLEAR PROTECTIVE LINER REMOVABLE BY HAND. LINER ORIENTATION AND REMOVAL DIRECTION NON-CRITICAL. SEE PARTS LIST, ITEM 2. CLEAR PROTECTIVE LINER NOT SHOWN IN THIS VIEW. THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X MAGNIFICATION. NA NA CRITICAL TO FUNCTION DIMENSION. "RECOMMENDED SCREW TORQUE: 8 IN-LBF" THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. PRIMARY DIMENSIONS STATED IN MILLIMETERS, [BRACKETED] DIMENSIONS STATED IN INCHES. CRITICAL TO FUNCTION DIMENSION. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR SOLVENTS AFTER FINAL ASSEMBLY. PART NUMBER AND TORQUE SPEC MARK. PLACE PART NUMBER AND TORQUE SPEC IN ALLOWABLE AREA, EITHER SIDE OF PART WHERE SHOWN. BELOW PART NUMBER CALLOUT, PLACE THE FOLLOWING TEXT: PRODUCTION RELEASE DESIGNED BY 9 6. 7. 8 5 3. 4. 2. 1. NOTES: 01 REV DWG. NO ZONE A B C D Mechanical Drawings Figure B-23. 2U Reference Heatsink Assembly with TIM (Sheet 1 of 2) Thermal/Mechanical Design Guide Thermal/Mechanical Design Guide A B C D 8 7 6 5 8 7 6 SEE NOTE 9 27.5 #0.5 [1.08 #0.01 ] 27.5 #0.5 [1.08 #0.01 ] 35.0 #1.0 [1.38 #0.03 ] 4 5 PROTECTIVE LINER NOT SHOWN. INSTALL PER MANUFACTURER'S RECOMMENDATION. SEE PARTS LIST, SHEET 1, ITEM 2. 4 THERMAL INTERFACE APPLICATION THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. 35.0 #1.0 [1.38 #0.03 ] 3 EASD / PTMI DEPARTMENT 3 R 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 DWG. NO 2 2 SCALE: 1.500 D SHT. REV E32410 01 1 1 DO NOT SCALE DRAWING SHEET 2 OF 2 SIZE DRAWING NUMBER E32410 REV 01 A B C D Mechanical Drawings Figure B-24. 2U Reference Heatsink Assembly with TIM (Sheet 2 of 2) 75 76 A B C D 8 7 6 5 8 7 6 5 5 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. 4 4 2 PART NUMBER 3 THIRD ANGLE PROJECTION UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES: .X # 0.5 Angles # 1.0 $ .XX # 0.25 .XXX # 0.127 ITEM NO E32412 1 QTY D85009 2 TOP 1 PCM-45F 9 6. 7. 8 5 3. 4. 2. PRODUCTION RELEASE SHT. DESCRIPTION 1 REV 01 REVISION HISTORY E32412 8 IN-LBF" SEE NOTES 2 SEE NOTES FINISH 12/14/07 D. LLAPITAN MATERIAL DATE CHECKED BY DATE 12/14/07 N. ULEN - DATE DRAWN BY - 12/14/07 N. ULEN APPROVED BY DATE DESIGNED BY DESCRIPTION R APPROVED 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 1 SCALE: 1.500 1 DO NOT SCALE DRAWING SHEET 1 OF 2 E32412 REV 01 ASSEMBLY, HEAT SINK, THURLEY, TOWER WITH TIM SIZE DRAWING NUMBER D TITLE EASD / PTMI DEPARTMENT PARTS LIST ASSEMBLY, HEAT SINK, THURLEY, TOWER WITH TIM HEAT SINK, THURLEY, TOWER DATE 12/14/07 TIM, 0.250x35x35MM, HONEYWELL (SEE NOTE 9) HONEYWELL PCM-45F THERMAL INTERFACE MATERIAL, WITH CLEAR PROTECTIVE LINER REMOVABLE BY HAND. LINER ORIENTATION AND REMOVAL DIRECTION NON-CRITICAL. SEE PARTS LIST, ITEM 2. CLEAR PROTECTIVE LINER NOT SHOWN IN THIS VIEW. THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X MAGNIFICATION. NA NA CRITICAL TO FUNCTION DIMENSION. "RECOMMENDED SCREW TORQUE: THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. PRIMARY DIMENSIONS STATED IN MILLIMETERS, [BRACKETED] DIMENSIONS STATED IN INCHES. CRITICAL TO FUNCTION DIMENSION. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR SOLVENTS AFTER FINAL ASSEMBLY. PART NUMBER AND TORQUE SPEC MARK. PLACE PART NUMBER AND TORQUE SPEC IN THE ALLOWABLE AREA. BELOW PART NUMBER CALLOUT, PLACE THE FOLLOWING TEXT: 01 REV DWG. NO ZONE NOTES: 1. 1 1 3 A B C D Mechanical Drawings Figure B-25. Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2) Thermal/Mechanical Design Guide Thermal/Mechanical Design Guide A B C D 8 7 6 5 8 7 6 SEE NOTE 9 27.5 #0.5 [1.08 #0.01 ] 5 PROTECTIVE LINER NOT SHOWN. INSTALL PER MANUFACTURER'S RECOMMENDATION. SEE PARTS LIST, SHEET 1, ITEM 2. THERMAL INTERFACE APPLICATION 27.5 #0.5 [1.08 #0.01 ] 35.0 #1.0 [1.38 #0.03 ] THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. 4 35.0 #1.0 [1.38 #0.03 ] 4 3 EASD / PTMI DEPARTMENT 3 R 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 DWG. NO 2 2 SCALE: 1.500 D SHT. REV E32412 01 1 1 DO NOT SCALE DRAWING SHEET 2 OF 2 SIZE DRAWING NUMBER E32412 REV 01 A B C D Mechanical Drawings Figure B-26. Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2) § 77 Mechanical Drawings 78 Thermal/Mechanical Design Guide Socket Mechanical Drawings C Socket Mechanical Drawings Table C-1 lists the mechanical drawings included in this appendix. Table C-1. Mechanical Drawing List Drawing Description Figure Number “Socket Mechanical Drawing (Sheet 1 of 4)” Figure C-1 “Socket Mechanical Drawing (Sheet 2 of 4)” Figure C-2 “Socket Mechanical Drawing (Sheet 3 of 4)” Figure C-3 “Socket Mechanical Drawing (Sheet 4 of 4)” Figure C-4 Thermal/Mechanical Design Guide 79 Socket Mechanical Drawings Figure C-1. 80 Socket Mechanical Drawing (Sheet 1 of 4) Thermal/Mechanical Design Guide Socket Mechanical Drawings Figure C-2. Socket Mechanical Drawing (Sheet 2 of 4) Thermal/Mechanical Design Guide 81 Socket Mechanical Drawings Figure C-3. 82 Socket Mechanical Drawing (Sheet 3 of 4) Thermal/Mechanical Design Guide Socket Mechanical Drawings Figure C-4. Socket Mechanical Drawing (Sheet 4 of 4) § Thermal/Mechanical Design Guide 83 Socket Mechanical Drawings 84 Thermal/Mechanical Design Guide Heatsink Load Metrology D Heatsink Load Metrology To ensure compliance to max socket loading value listed in Table 4-3, and to meet the performance targets for Thermal Interface Material in Section 5.3, the Heatsink Static Compressive Load can be assessed using the items listed below: • HP34970A DAQ • Omegadyne load cell, 100 lbf max (LCKD-100) • Test board (0.062") with ILM & back plate installed • 8 in-lbf pneumatic driver • Heatsink • Gainestown Load Cell Fixture (Figure D-1) Thermal/Mechanical Design Guide 85 Heatsink Load Metrology Figure D-1. Intel® Xeon® Processor 5500 Series Load Cell Fixture § 86 Thermal/Mechanical Design Guide Embedded Thermal Solutions E Embedded Thermal Solutions This section describes the LV processors and Embedded reference heatsinks for NEBS (Network Equipment Building Systems) compliant ATCA (Advanced Telecommunications Computing Architecture) systems. These LV processors are good for any form factor that needs to meet NEBS requirements. E.1 Performance Targets Table E-1 provides boundary conditions and performance targets for 1U and ATCA heatsinks. These values are used to generate processor thermal specifications and to provide guidance for heatsink design. Table E-1. Boundary Conditions and Performance Targets Parameter Value 40o Altitude, system ambient temp Nominal/Short-term Sea level, TDP 60 W TLA1,4 51.9/66.9o ΨCA2 System height (form factor) Heatsink volumetric Heatsink technology5 3 Value C/55C Sea level, 40o C/55C 38 W 50/65o C C 0.302o C/W 0.532o C/W 1U (EEB) or ATCA ATCA 1U (90 x 90 x 27) or Custom ATCA (90 x 90 x 13mm + heat exchanger) ATCA (90 x 90 x 13 mm) Cu base, Cu fins Notes: 1. Local ambient temperature of the air entering the heatsink. 2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1). 3. Reference system configuration. In a single wide ATCA blade the 60 W processor should be used in single socket only and the 38 W processor can be used in dual socket. 4. Local Ambient Temperature written 50/65o C means 50o C under Nominal conditions but 65o C is allowed for Short-Term NEBS excursions. 5. Passive heatsinks with TIM. 6. See Section 5.1 for standard 1U solutions that do not need to meet NEBS. Thermal/Mechanical Design Guide 87 Embedded Thermal Solutions Detailed drawings for the ATCA reference heatsink can be found in Section E.3. Table E-1 above specifies ΨCA and pressure drop targets and Figure E-1 below shows ΨCA and pressure drop for the ATCA heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph. ATCA Heatsink Performance Curves 2.5 2 ΔP = 1.3e-04CFM2 +1.1e-02CFM 2 1.6 1.2 1 0.8 0.5 0.4 Ψca, C/W 1.5 Mean Ψca = 0.337 + 1.625 CFM -0.939 0 0 5 10 15 20 25 ΔP, inch water Figure E-1. 0 30 35 CFM Through Fins Other LGA1366 compatible thermal solutions may work with the same retention. E.2 Thermal Design Guidelines E.2.1 NEBS Thermal Profile Processors that offer a NEBS compliant thermal profile are specified in the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1. NEBS thermal profiles help relieve thermal constraints for Short-Term NEBS conditions. To help reliability, processors must meet the nominal thermal profile under standard operating conditions and can only rise up to the Short-Term spec for NEBS excursions (see Figure E-2). The definition of Short-Term time is clearly defined for NEBS Level 3 conditions but the key is that it cannot be longer than 360 hours per year. 88 Thermal/Mechanical Design Guide Embedded Thermal Solutions Figure E-2. NEBS Thermal Profile \ Thermal Profile 90 Short-term Thermal Profile may only be used for short term excursions to higher ambient temperatures, not to exceed 360 hours per year Tcase [C] 80 70 Short-Term Thermal Profile Tc = 0.302 * P + 66.9 Nominal Thermal Profile Tc = 0.302* P + 51.9 60 50 40 0 5 10 15 20 25 30 35 40 45 50 55 60 Power [W] Notes: 1.) The thermal specifications shown in this graph are for reference only. See the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 for the Thermal Profile specifications. In case of conflict, the data in the datasheet supersedes any data in this figure. 2.) The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not require NEBS Level 3 compliance. 3.) The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating temperatures, not to exceed 360 hours per year as compliant with NEBS Level 3. 4.) Implementation of either thermal profile should result in virtually no TCC activation. 5.) Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the ShortTerm Thermal Profile for a duration longer than the limits specified in Note 3 above, do not meet the processor thermal specifications and may result in permanent damage to the processor. E.2.2 Custom Heat Sinks For UP ATCA The Embedded specific 60W SKU is targeted for NEBS compliant 1U+ systems and UP ATCA configurations with custom thermal solutions. In order to cool this part in a single wide ATCA slot, a custom thermal solution will be required. Since solutions like this will be very configuration specific, this heat sink was not fully designed with retention and keep-out definitions. In order to cool the additional power of a 60W processor in ATCA, the heat sink volume was increased. The assumption was that the heat sink could not grow wider because of VR and Memory placement, so a Remote Heat Exchanger (RHE) was used. The RHE is attached to the main heat sink with a heat pipe. The RHE gives additional convective surface area and gives the thermal solution access to more air. Samples of the following design were ordered and tested for thermal performance only. Flotherm analysis shows that the following design can cool an LGA1366 TTV in an ATCA blade at 30CFM. The heat sink Ψca would be 0.50C/W at 55C ambient which falls below the thermal profile for the 60W processor. Thermal/Mechanical Design Guide 89 Embedded Thermal Solutions Figure E-3. UP ATCA Thermal Solution Notes: Thermal sample only, retention not production ready. Figure E-4. UP ATCA System Layout Notes: Heat sink should be optimized for the layout. 90 Thermal/Mechanical Design Guide Embedded Thermal Solutions § Figure E-5. UP ATCA Heat Sink Drawing Thermal/Mechanical Design Guide 91 Embedded Thermal Solutions E.3 Mechanical Drawings and Supplier Information See Appendix B for retention and keep out drawings. The part number below represent Intel reference designs for a DP ATCA heatsink. Customer implementation of these components may be unique and require validation by the customer. Customers can obtain these components directly from the supplier below. Table E-2. Embedded Heatsink Component Suppliers Assembly Assembly, Heat Sink, Nehalem-EP, ATCA Component ATCA Reference heatsink Description Supplier PN ATCA Copper Fin, Copper Base Fujikura HSA-7901 Intel P/N E65918-001 Table E-3. Fujikura America Ash Ooe [email protected] 408-748-6991 Fujikura Taiwan Branch Yao-Hsien Huang [email protected] 886(2)8788-4959 Mechanical Drawings List Parameter 92 Supplier Contact Info Value ATCA Reference Heat Sink Assembly (Sheet 1 of 2) Figure E-6 ATCA Reference Heat Sink Assembly (Sheet 2 of 2) Figure E-7 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) Figure E-8 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) Figure E-9 Thermal/Mechanical Design Guide Embedded Thermal Solutions § Figure E-6. ATCA Reference Heat Sink Assembly (Sheet 1 of 2) Thermal/Mechanical Design Guide 93 Embedded Thermal Solutions § Figure E-7. 94 ATCA Reference Heat Sink Assembly (Sheet 2 of 2) Thermal/Mechanical Design Guide Embedded Thermal Solutions § Figure E-8. ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) Thermal/Mechanical Design Guide 95 Embedded Thermal Solutions § Figure E-9. ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) § 96 Thermal/Mechanical Design Guide Processor Installation Tool F Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal. Contact the supplier for availability: Billy Hsieh [email protected] +81 44 844 8292 Thermal/Mechanical Design Guide 97 Processor Installation Tool Figure F-1. Processor Installation Tool § 98 Thermal/Mechanical Design Guide