Download Samsung SCH-811 Specifications
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CDMA CELLULAR TELEPHONE SCH-811 SERVICE CDMA CELLULAR TELEPHONE Manual CONTENTS 1. General Introduction 2. Specification 3. Installation 4. NAM Programming 5. Product Support Tools 6. Troubleshooting 7. Exploded view and its Part List 8. Electrical Parts List 9. PCB diagrams 10. Block & circuit diagrams SAMSUNG PROPRIETARY-CONTENTS MAY CHANGE WITHOUT NOTICE ELECTRONICS Samsung Electronics Co.,Ltd. GH68-00398A 1999. 3. REV. 1.0 1. General Description The SCH-811 cellular phone functions as both analog cellular phone working in AMPS (Advanced Mobile Phone Service) mode and digital cellular phone working in CDMA (Code Division Multiple Access) mode. CDMA type digital mode applies DSSS (Direct Sequential Spread spectrum) mode which first came to be used in the military. The DSSS reduces channel cross talk and allow to use one frequency channel by multiple users in the same specific area, resulting in increase of channel capacity to about ten times compared to that of analog mode currently used. Soft/Softer Handoff, Hard Handoff, and Dynamic RF Power Control technologies are combined into this phone to reduce the call drop while usage. CDMA digital cellular network consists of MSO (Mobile Switching Office), BSC (Base Station Controller), BTS(Base Station Transmission System), and MS (Mobile Station). MS meets the specifications of the below: E IS-95A : Mobile Station-Base Station Compatibility Standard for Dual-Mode Wideband Spread Spectrum Cellular System E IS-96A : Speech Service Option 1 Standard for Dual-Mode Wideband Spread Spectrum Cellular Systems E IS-98A : Standards for Dual-Mode Wideband Spread Spectrum Cellular Mobile Station E IS-126 : Mobile Station Loopback Service Options Standard SCH-811 is composed of main handset, rapid charger, three batteries (1600 mAh, 1000 mAh, 550mAh), handsfree kit, car adaptor, and travel charger. Hands-Free Kit is designed to be operated in full-duplex mode taking turn-around delay between the phone and the system into account. SAMSUNG Proprietary-Contents may change without notice 1-1 2. Specification 2-1 General Frequency Range Transmitter Receiver Digital Mode : 824 ~ 849 MHz : 869 ~ 894 MHz Analog Mode 824 ~ 849 MHz 869 ~ 894 MHz Channel Spacing : 1.23 MHz 30kHz Number of Channels : 20 FA 832CHs Duplex Spacing : 45 MHz 45MHz Frequency Stability : ±2.5 ppm (-20ûC ~ +60ûC, -4ûF ~ +140ûF) Operating Temperature : -30ûC~+60ûC (-4ûF ~ +140ûF) Operating Voltage HHP : 3.6V DC (±10%) Hands-free : 13.7V DC (±10%) Size and Weight : 88.0 x 56.5 x 26.7/27.6/31.3 mm including slim battery : 117.3 g including standard battery : 145.2 g including extended battery : 160.5 g Operating Time Digital Mode Standby Time Talk Time 2-1 : up to 36 hours (with slim battery) : up to 65 hours (with standard battery) : up to 100 hours (with extended battery) : up to 75 min (with slim battery) : up to 150min (with standard battery) : up to 240min (with extended battery) SAMSUNG Proprietary-Contents may change without notice 2-2 Digital Mode Waveform Quality Time Reference Rx Sensitivity and Dynamic Range Tx Output Power Tx Frequency Deviation Occupied Band Width Tx Conducted Spurious Emission Minimum Tx Power Control Open Loop Power Control Standby Output Power Colsed Loop Tx Power Control Range SAMSUNG Proprietary-Contents may change without notice 0.944 or more ±1uS or less -104dBm, FER=0.5% or less -25dBm, FER=0.5% or less 320mW (25dBm) ±300Hz or less 1.32MHz 900KHz : -42dBc / 30KHz below 1.98MHz: -54dBc / 30KHz below below -50dBm -25dBm: -57.0dBm ~ -38.5dBm -65dBm: -17.5dBm ~ + 1.5dBm -104dBm: +18.0dBm ~ +30.0dBm below -61dBm Test1: ±24dB or less Test2: 0mS ~ 2.5mS Test3: ±24dB or more Test4: ±24dB or more Test5: ±24dB or more 2-2 2-3 ANALOG MODE TRANSMITTER RF output power Carrier ON/OFF conditions ÒONÓ Condition ÒOFFÓ Condition Compressor Compression Rate Attack Time Recovery Time Reference Input Preamphasis Maximum Freqency Deviation F3 of G3 Supervisory Audio Tone Signaling Tone Wideband Data Post Deviation Limiter Filter 3.0 ~ 5.9KHz 5.9 ~ 6.1KHz 6.1 ~ 15KHz Over 15KHz 0.6W (+2/-4dB) within ±3dB of specification output (in 2mS) below-60dBm (in 2mS) 2:1 3mS 13.5mS Input level for producing a nominal ±2.9KHz peak freqency deviation of transmitted carrier 6dB/OCT within 0.3 ~ 3KHz ±12KHz ±2KHz (±10%) ±8KHz (±10%) ±8KHz (±10%) above 40 LOG (F/3000) dB above 35 dB above 40 LOG (F/3000) dB above 28 dB Spectrum Noise Suppression For all modulation f0+20KHz ~ f0+45KHz For modulation by voice and SAT f0 +45KHz For modulation by WBD(without SAT) and ST (with SAT) f0+45KHz ~ f0+60KHz f0+60KHz ~ f0+90KHz f0+90KHz ~ 2f0 Harmonic and conducted Spurious Emissions 2-3 above 26 dB above 63 +10 LOG (PY) dB above 45 dB above 65 dB above 63 +10 LOG (PY) dB (where f0=carrier frequency PY=mean output power in watts) below 43 + 10 LOG (PY) dB SAMSUNG Proprietary-Contents may change without notice RECEIVER De-Emphasis Expander Expander Rate Attack Time Recovery Time Reference Input Sensitivity -6dB / OCT within 0.3 ~3KHz 1:2 within 3mS within 13.5mS output level to a 1000Hz tone from a carrier within ±2.9KHz peak frequency deviation 12dB SINAD / -116dBm Intermodulation Spurious Response Attenuation avove 65dB RSSI Range above 60dB Protection Against Spurious Response Interference above 60dB In Band Conducted Spurious Emission Transmit Band Receive Band Other Band below -60dBm below -80dBm below -47dBm Radiated Spurious Emission Frequency Range 25 ~ 70 MHz 70 ~ 130MHz 130 ~ 174 MHz 174 ~ 260 MHz 260 ~ 470 MHz 470 ~ 1GHz SAMSUNG Proprietary-Contents may change without notice Maximum Allowable EIRP -45dBm -41dBm -41 ~ -32dBm -32dBm -32 ~ -26dBm -21dBm 2-4 2-4 CDMA Debug Display Information (menu 8) IN IDLE MODE 1 2 3 Sxxxx 4 SIx T-xx x Dxxx Pxxx -xx 6 CHxxx 8 7 5 IN CONVERSATION MODE 9 10 TEx T-xx Pxxx REx 11 xx Dxxx x -xx 3 CHxxxx 1 : Sxxxxx : SID (System ldentification) toggle Nxxxxx : NID (Network Identification) toggle 2 : SIx : Slot cycle index (lowest between the system and the phone will be used) 3 : Handset Status : 0 - Acquisition 1 - Synchronization 2 - Paging (Idle) 3 - Traffic Initialization 4 - Traffic Mode 5 - Exit 4 : T-xx : Tx adjust, Value ranges from +63 ~ -63dB 5 : Dxxx : sector power in dBm 6 : -xx : Ec/Io 7 : Pxxx : PN offset 8 : CHxxxx : channel number 9 : TEx : Tx vocoder rate (8 is full rate, 1 is 1/8th rate) E : EVRC V : 13k or 8k 10 : REx : Rx vocoder rate (8 is full rate, 1 is 1/8th rate) 11 : xx : Walsh code used in traffic channel 2-5 SAMSUNG Proprietary-Contents may change without notice 2-5 FM Debug Display Information (menu 8) 1 4 SIDxxxxx 2 PWRx SATx 3 x RSSIxxx 5 CHxxxx 6 1 : SIDxxxxx : FM Home System ID 2 : PWRx : Power Level 0~7 3 : SATx : Supervisory Audio Tone code (0~3) 4 : x (Using Frequency Band) : A Band or B Band 5 : RSSIxxx : RSSI value 6 : CHxxx : Using Channel SAMSUNG Proprietary-Contents may change without notice 2-6 3. Installation 3-1 Installing a Battery Pack 1. To attach the battery pack after charging, align it with the phone about 1cm (1/2 inch away from its place so that the two arrows on the phone are seen, the battery charge contacts pointing downward. 2. Slide the battery pack upwards until it clicks firmly into position. The phone is now ready to be turned on. 3. To remove the battery pack, release it by pressing the button on the rear of the phone. 4. Slide the battery pack downward about 1cm (1/2inch and lift it away from the phone. Press this button to release the battery pack 3-1 SAMSUNG Proprietary-Contents may change without notice 3-2 For Desk Top Use 1. Choose a proper location to install the charger for Desk Top use. 2. Plug the power cord of the charger into an appropriate wall socket. When the power is connected correctly, the lamps turn on briefly. 3. To charge the battery pack, insert the battery pack into the rear slot of the charger. The lamp marked BAT on the front panel of the charger ights up red. 4. If you do not wish to use the phone while charging the battery, insert the phone with the battery pack attached into the front slot of the charger. The lamp marked PHONE on the front panel of the charger lights up red. SLIM BATTERY PACK STANDARD BATTERY PACK EXTENDED BATTERY PACK Figure 3-1 Charging the Phone and Battery item Model Name Desk Top Rapid Charger Service Part# DTC81 Slim Battery Pack BTI81AB Standard Battery Pack BTS81AB Extended Battery Pack BTE81AB GH43-00060A SPECIFICATIONS USING ÒDTC 81Ó Product Charging time (hours) Stand by time (hours) Talking time(min) Front Rear Digital Digital 2 2 36 75 Standard Battery Pack (Li-ion: 1000mAh) 2.5 4 65 150 Extended Battery Pack (Li-ion: 1600mAh) 3 5 100 240 Slim Battery Pack (Li-ion: 550mAh SAMSUNG Proprietary-Contents may change without notice 3-2 3-3 For Mobile Mount 3-3-1 Cradle 1. Choose a location where it is easy to reach and does not interfere with the driverÕs safe operation of the car. 2. Separate the two halves of the clamshell by removing the two large slotted screws. See the figure 3-2. 3. Drill holes and mount the lower half of the clamshell by using the screws. 4. Place the cradle onto the remaining half of the clamshell and assemble them by using the screws. 5. Reassemble the two halves of the clamshell together. Adjust the mounting angle and tighten the two slotted screws. CRADLE CLAM SHEEL MOUNT UPPER CELLULAR PHONE FIXED SCREW HANDS FREE BOX CLAM SHEEL MOUNT LOWER CAR 32 32 Figure 3-2 Cradle Installation 3-3-2 Hands-Free Box 1. Drill holes in a proper location for the hands-free box, attach the mounting bracket by using the screws. See the figure 3-3. 2. Install the hands-free box into the bracket. 3-3 SAMSUNG Proprietary-Contents may change without notice 3-3-3 Hands-Free Microphone 1. It is recommended to install the microphone where it is 30-45 cm (12-18inch away from the driver. Choose the location where is least susceptible to interference caused by external noise sources, ie, adjacent windows, radio speakers, etc. Normal place is the sun visor. 2. Once the microphone has been correctly positioned, connect the microphone wire to the MIC jack on the hands-free box. MOUNTING BRACKET Figure 3-3 Hands-Free Box 1 Installation SAMSUNG Proprietary-Contents may change without notice 3-4 3-3-4 Cables 1. Connect the cradle and the hands-free box with the data cable. See the figure 3-4. 2. Connect the antenna cable to the RF jack of the cradle. 3. Connect the power cable as follows: Connect the red wire to the battery (+) terminal, black wire to the vehicle chassis. Then connect the battery (-) terminal to the vehicle chassis. Connect the yellow wire to the switched side of the ignition switch, and then connect the white to the stereo mute wire from your vehicle stereo. 4. Connect the other end of the power cable to the PWR jack of the hands-free box. Notes: It is recommended to connect the power cable directly to the battery to avoid power noise. Make sure the connection, in the vehicle, between the battery (-) terminal and vehicle chassis is made correctly. Make sure the fuse having a proper capacity is used on the power cable. Make sure the cables do not pass over any sharp metal edge that may damage it. Micro Phone Yellow(Ignition) White(Stereo Mute) Red(Vehicle Battery) Black(GND) 3-5 SAMSUNG Proprietary-Contents may change without notice 4. NAM Programming NAM features can be programmed as follows: Notes: -If you enter the NAM program mode, each item shows the currently stored data. Go to the next item by pressing OK. -You can modify the data by entering a new data. -If you enter a wrong digit, press CLR to delete the last digit. Press and hold CLR to delete all digits. -To scroll items backwards or forwards, press the VOLUME button on the left side of the phone. 4-1 General Setup LCD Display Key in Function 47*869#08#9 1 -selects NAM programming -choose ÔGENERALÕ ESN E9031F77 Volume ▼ -Electronic Serial Number of the phone is displayed CAI version 3 Volumet -Common Air Interface version is displayed Volume ▼ -Vocoder Rate Volume ▼ -Station Class Mark displays the power class, transmission, slotted class, dual mode. NAM program 1:General 2:Setup NAM1 3:Setup NAM2 VOC13K/8K SO_VOICE_08K SCM 01101010 Lock Code 0000 Slot Mode Yes Slot Index 2 OK -store it. Pref NAM(1~4)... Digital pref 4-digit code OK Lock code, current ststus is displayed -to change, enter new code. -store it F or E OK Slot mode. ÔYesÕ indicates the slot mode. -changes the status. -store it. 0-7 Slot mode index. The higher, the longer sleeping time -to change, enter new one. F or E OK Preferred system selection for NAM(1~4). Up to four NAMs are allowed for the phone. This lists one of the four NAMs and allows you to program both the FM and CDMA settings. SAMSUNG Proprietary-Contents may change without notice 4-1 4-2 Setting Up NAM1 LCD Display Key in NAM Program 1:General 2:Setup NAM1 3:Setup NAM2 2 -Choose ÔSetup NAM1.Õ Setup NAM1 1:Phone # 2:FM 3:CDMA 1 -Choose ÔPhone #Õ Phone number OK -directory number -to change, enter new one. -store it. Phone number OK -Phone number currently used. -to change, enter new one. -store it. 2 -Choose ÔPhone #Õ ID number OK System ID for home, current ststus is displayed. -to change, enter new one. -store it. Channel number OK Current 1st paging channel. -to change, enter new one. -store it. ID number OK Acquisition system ID 1, current status is displayed. -to change, enter new one. -store it. ID number OK Acquisition system ID2, current status is displayed. -to change, enter new one. -store it. Phone # 1234567890 Mobile ID # 1234567890 Setup NAM1 1:Phone # 2:FM 3:CDMA FM HOME SID 4369 FM 1st Chn 333 FM Acq SID1 4 FM Acq SID2 0 FM LockSID 1 0 Auto Reg 4-2 ID number OK Function Lock system ID 1, current status is displayed. -to change, enter new one. -store it. FM Registration, current status is displayed. -changes the status. SAMSUNG Proprietary-Contents may change without notice LCD Display Yes Key in F or E OK ÔYESÕ to enable, ÔNOÕ to disable. -store it. F or E OK Preferred system selection, current status is displayed. -changes the system. ÔYESÕ to enable, ÔNOÕ to disable. -store it. F or E OK Current Access Overload Class. -changes the system. -store it. 3 -choose ÔCDMAÕ number OK IMSI Moble Country Code, current code is displayed. -to change, enter new one. -store it. number OK IMSI Mobile Network Code, current code is displayed. -to change, enter new one. -store it. F or E OK Preferred system selection, current system is displayed. -changes the system. -store it. class number OK CDMA Access Overload Class, current status is displayed. -to change, enter new one. -store it. channel number OK Preferred channel currently used under system A -to change, enter new one. -store it. channel number OK Preferred channel currently used under system B -to change, enter new one. -store it. channel number OK Second channel currently used under system A -to change, enter new one. -store it. FM preq... A only FM ACCOLC 0 Setup NAM1 1:Phone # 2:FM 3:CDMA IMSI_MCC 000 IMSI_MNC 00 CDMA pref.. A only CDMA ACCOLC 0 Pchn Sys A 779 Pchn Sys B 779 Schn Sys A 738 Function SAMSUNG Proprietary-Contents may change without notice 4-3 LCD Display Schn Sys B 738 CD Acq SID 1 0 CD lockSID 1 0 CDMA Home SID Yes CDMA fSID Yes CDMA fNID Yes Key in channel number OK Second channel currently used under system B -to change, enter new one. -store it. ID number OK 1st Acquisition system ID, current status is displayed. -to change, enter new one. -store it. ID number OK 1st lock system ID,current status is displayed. -to change, enter new one. -store it. F or E OK CDMA Home system ID, current status is displayed -changes the status. -store it. F or E OK CDMA foreign SID, current status is displayed. -changes the system. -store it. F or E OK CDMA foreign NID, current status is displayed. -changes the system. -store it. number OK first SID written in the list, current status is displayed. -to change, enter new one. -store it. number OK first NID written in the list, current status is displayed. -to change, enter new one. -store it. number OK 2nd SID written in the list, current status is displayed. -to change, enter new one. -store it. number OK 2nd NID written in the list, current status is displayed. -to change, enter new one. -store it. number OK 3rd SID written in the list, current status is displayed. -to change, enter new one. -store it. number OK 3rd SID written in the list, current status is displayed. -to change, enter new one. -store it. SID #1 2222 NID #1 1 SID #2 2222 NID #2 2 SID #3 2222 NID #3 3 4-4 Function SAMSUNG Proprietary-Contents may change without notice LCD Display SID #4 2222 NID #4 15 Key in number OK number OK Setup NAM1 1:Phone # 2:FM 3:CDMA Function 4th SID written in the list, current status is displayed. -to change, enter new one. -store it. 4th NID written in the list, current status is displayed. -to change, enter new one. -store it. LCD returns to the NAM1 setup mode. 4-3 Setting Up NAM2,3,4 The NAM2,3,4 setup program is the same as Ô4-2 Setting Up NAM1Õ. SAMSUNG Proprietary-Contents may change without notice 4-5 5. Product Support Tools 5-1 General IMPORTANT INFORMATION Purpose The Product Support Tool (PST) offers you the ability to interface with the SAMSUNG CDMA telephone using a PC. With this tool you can program the phones network system requirements and functionality, swap phone data, and download software upgrades. This document supports UniPST version 1.xx. NOTE: This software must be executed in the Windows95/98 mode. EQUIPMENT REQUIRED Make sure you have the following equipment setup: 1. Minimum PC configuration: 586 CPU, 16MB RAM, Windows95/98, 5MB of disk space free for software upgrade. 2. PST Software with appropriate cable (DM Cable for SAMSUNG CDMA phone). 3. Serial Port (16550 Serial Interface Card). 4. POWER SUPPLY (3.8V) OR BATTERY INSTALLATION Software 1.Insert the PST floppy disk into drive (A:\). 2.Create an appropriate directory on the C:\ drive for PST software, Execute Setup.exe file, The installation program creates folder and task bar on the windows95/98 start bar. SAMSUNG CDMA Phone The serial port should be configured to COM1 or COM2. Use the following procedure to connect the phone, cable, and PC . Plug the female end of the DM Cable into the 16550 card. Pull the black rubber connector away from the socket at the base of the phone. Plug the special connector on the cable into the socket at the base of the phone. 5-1 SAMSUNG Proprietary-Contents may change without notice 5-2. PST (Product Support Tool) 5-2-1 Getting Started MAIN MENU SCREEN 1. At the Windows95/98, Double Click ÒUniPst.exeÓ. 2. The Main Menu Screen will be displayed. The Main Menu Screen shows the basic tasks that are available. CAUTION: DO NOT attempt to program phone with a low battery. PST SETUP UniPst supports SAMSUNG CDMA portable telephone. You can select serial port COM1 or COM2. 5-2-2 Operation Procedure Service Programming The Service Programming screens enable you to set and change the service activation parameters of the phones. These items can be changed individually or as a group via the ÒEdit ItemsÓ Property Sheet of the PST. There are several pages on the Service Programming Property Sheet (See below Figure). Read Data from File Click ÒopenÓ icon to select the name of a file whose extension is ÒmmcÓ. The values will be read from the named file, and will initialize the parameter values seen on the Service programming screen Read Data from Phone Click Read from the Phone icon to upload the current programmable parameters of the phone. The values are read from the phone, so the phone must have the power ON and be properly connected to the PST. NOTE: To actually view the data you need to go to the Edit Items screens. Edit Items Click this icon to edit Number Assignment Module (NAM) items or UI items. There are two types of screens: 1. Parameters associated with a particular Number Assignment Module (NAM) 2. UI items settings Phone Book Click this icon to edit Phone Book. While you edit cell, you can use <Enter> and < UP , DOWN,LEFT,LIGHT Arrow> and <SPACE> key. If you want to edit phone number or name , you must move rectangle box to cell where you want to edit , Write it down . if <UP and DOWN Arrow> key is pressed, the cursor moves to next cell or previous cell. SAMSUNG Proprietary-Contents may change without notice 5-2 Save Data to File Click this icon to save the current parameters to a file. Once you enter a filename, Click <OK> button to write all current parameters to that file. This way the same information can be downloaded into multiple phones. Write to Phone Click this icon to write the selected parameter values to the phone. Writing the selected values to the phone may take up to a minute. If there are dependencies in a field you can make all the changes in the proper fields and download the information all together. If you intend to use this ÒWrite to PhoneÓ feature, it is recommended that you do a ÒRead Data from PhoneÓ first, and then make the changes, so that nothing gets inadvertently overwritten. NOTE: DO NOT TOUCH THE PHONE WHILE WRITING IS IN PROGRESS. Software Download and Upgrade Screen To begin a software upgrade or download, perform the following steps: 1. From the main menu screen choose DOWNLOAD MODE? Click open icon to choose a BIN file of the new software to be loaded. Choose the appropriate BIN file, then Click <Open> (see below figure). 2. Click Download? to begin downloading the file. You will notice various messages and a progress bar that informs the user what percentage of the downloading has already occurred. 3.Click Mode Select box, then Select SERVICE MODE?to return to the Service Mode Screen. NOTE: DO NOT POWER OFF WHILE THE PHONE IS BEING DOWNLOADED! 5-3 SAMSUNG Proprietary-Contents may change without notice 5-3 TEST PROCEDURE 5-3-1 Configuration of Test Spectrum Analyzer RF In HP8924C RF In/Out Audio Audio Out In Directional Coupler To A-Out Test Jig To A-In DC Power Supply (+3.93V) ❈ CAUTION : Because there is the loss (0.33V at FM Max Power) of the test jig and Data cable, youÕd better input 3.93V to the DC Power Supply to use 3.6V (Battery normal voltage) at Cellular phone Items needed to purchase from SAMSUNG ITEMS RF test Cable Test cable DM Cable Test JIG (RF Interface Pack AssÕy) PARTS # GH39-0002A GH39-30516A GH39-30525A GH80-10502A SAMSUNG Proprietary-Contents may change without notice REMARK Including 1. Power Cable(Black,Red) 2. 9-pin RS232 data Cable 5-4 5-3-2 List of Equipment - DC Power Supply - Test Jig - Test Cable - CDMA Mobile Station Test Set - Spectrum Analyzer(include CDMA Test Mode) HP8924C, HP83236A, CMD-80, etc HP8596E TEST JIG AUDIO SELECT LEFT: AUDIO IN RIGHT: AUDIONOFF DC POWER INPUT PORT CHANGE VOLTAGE LEVEL BY MODEL (3.8VDC) RED: + BLACK: GND UP: AUTO POWER ON DOWN: NOT USE AUTO DB25 CONNECTOR CPMMECT TO DB25 CONNECTOR OF TEST CABLE A-IN - DC3.8v + TO_PC T E S T D89 CONNECTOR CONNECT TO IBM PC SERIAL PORT HHP I/F TEST JIG P A C K TO_HP TO A-OUT TO A-IN BJ11 CONNECTOR CONNECT TO HP SERIAL PORT PROBE NOT USED CONNECT TO AUDIO OUT PORT OF TEST EQUIPMENT (USE BNC CABLE) CONNECT TO AUDIO IN PORT OF TEST EQUIPMENT (USE BNC CABLE) TEST CABLE 5-5 SAMSUNG Proprietary-Contents may change without notice TEST CABLE CONNECTIONS 1 MHC 172 2 RF CABLE (1.4 dB Loss) 3 BNC CONNECTOR (RF) 4 PLUG CONNECT TO SCH-811 5 DATA CABLE 6 Dsub 25PIN CONNECTOR (DATA) Dsub 25 PIN CONNECTOR PIN DESCRIPTION (TEST CABLE 1, BACK SIDE) DATA DESCRIPTION Dsub CONN. PIN NO. DATA DESCRIPTION Dsub CONN. PIN NO. V_F 12,21 DP_RX_DATA 8 DGND 2,4,6,13,19 HP_PWR 9 BATT 15,16,22 RI 10 C_F 3,20 CD 11 TX_AUDIO 5 RTS 14 DP_TX_DATA 7 CTS 17 RX_AUDIO 1 DTR 18 15 14 1 17 16 2 3 19 18 4 5 21 20 6 7 SAMSUNG Proprietary-Contents may change without notice 23 22 8 9 25 24 10 11 12 13 5-6 5-4. CONVERSION TABLE OF FREQUENCY vs CHANNEL TYPE CHANNEL CONVERSION EQUATION REMARK TX 1 ² N² 799 F=0.03 ✕ N + 825.00 FREQUENCY 990 ²N²1023 F=0.03 ✕ (N-1023) + 825.00 N ; CH NUMBER RX 1 ²N² 799 F=0.03 ✕ N + 870.00 F ; FREQUENCY FREQUENCY 990 ²N²1023 F=0.03 ✕ (N-1023) + 870.00 Change to Test Mode A. To change the phoneÕs state from Normal Mode to Test Mode, You should enter the following keys. Ò*759#813580Ò B. The command Ò0 1Ó is Suspend. C. To finish the Test Mode, You should enter the command Ò0 2Ó. * Note: Make sure to change to ÒDigital onlyÓ or ÒAnalog onlyÓ mode in NAM1, EST MODE. (Refer to 4. NAM Programming) Channel Selection and Tx Power Output Level Control 1. Digital Mode (CDMA) A. Enter to Test Mode ( * 7 5 9 # 8 1 3 5 8 0 ). B. Ò0 1Ó : Suspend. C. Ò0 9 0 3 6 3 #Ó : Set to Ô0363Õ channel. D. Ò0 7Ó : Carrier On. E. Ò3 4Ó : Spread spectrum to 1.23MHz band width. F. Ò7 1 2 7 5 #Ó : Output RF power level setting. Ò275Ó means AGC level and AGC level range is from 0 to 511. 2. Analog Mode ( FM ) A. Enter to Test Mode ( * 7 5 9 # 8 1 3 5 8 0 ). B. Ò0 1Ó : Suspend. C. Ò4 6Ó : Vocoder initial to Analog mode. D. Ò0 9 0 3 8 3 #Ó : Set to Ô0383Õ channel. E. Ò0 7Ó : Carrier On. F. Ò7 2 2 7 5 #Ó : Output RF power level setting. Ò275Ó means AGC level and AGC level range is from 0 to 511. G. Ò1 0 2Ó : RF Power level control, 2(0~7) means power level . 5-7 SAMSUNG Proprietary-Contents may change without notice 5-5 TEST COMMAND TABLE Command No. Signal. Name Description 01(1F,0,0) T_SUSPEND_I Terminate the normal mode, enter to the test mode. 02(3F,0,0) T_RESTART_I Terminate the test mode, enter to the normal mode. 03(FD,0,0) T_SAVE_VAL_I Save value in EEPROM. (Only for Auto test). 04(1D,0,1) T_GET_MODE_I Get mode CDMA or FM (Only for Auto test). 05(1C,1,0) T_SET_MODE_I Set mode CDMA or FM. (Only for Auto test). 06(1E,0,0) T_WRITE_NV_I Write an EEPROM item (one of the NV items) 07(81,0,0) T_CARRIERON_I Turn the carrier on. 08(82,0,0) T_CARRIEROFF_I Turn the carrier off 09(83,4,0) T_LOADSYN_I Set the synthesizer to the channel specified by ch_data. 10(84,1,0) T_PWRLEVEL_I Set the RF power level. 11(85,0,0) T_RXMUTE_I Mute the receive-audio signal. 12(86,0,0) T_RXUNMUTE_I Unmute the receive-audio signal. 13(87,0,0) T_TXMUTE_I Mute the transmit-audio signal. 14(88,0,0) T_TXUNMUTE_I Unmute the transmit-audio signal. 15(89,1,0) T_VOC_ESEC_I Echo canceller ON/OFF 16(8F,0,0) T_ST_ON_I Transmit a continuous Signaling Tone(ST). 17(90,0,0) T_ST_OFF_I Stop transmit a continuous Signaling Tone. 19(93,0,0) T_INDEX_DECR_I Index dn Key. 20(9E,3,0) T_LNA_GAIN_WR_I Write LNA gain. 22(91,96,96) T_SNDNAM_I1) Display and send NAM information. 23(95,3,4) T_SNDVERSION_I Display and return s/w version . 24(9F,7,8) T_SNDESN_I Display and return ESN . 25(92,0,0) T_BACKLIGHT_ON_I Turn on the backlight 26(93,0,0) T_BACKLIGHT_OFF_I Turn off the backlight 27(96,0,0) T_LAMP_ON_I Turn on the LAMP 28(97,0,0) T_LAMP_OFF_I Turn off the LAMP 29(9A,5,0) T_REBUILD_I Rebuild EEPROM 30(9D,16,0) T_PLINE_I Display and return production line information. 32(A0,1,0) T_SAT_ON_I* Enable the transmission of SAT. 33(A1,0,0) T_SAT_OFF_I* Disable the transmission of SAT. 34(A2,0,0) T_CDATA_I Transmit continuous 5-word Reverse CTL CH message. 35(A3,3,0) T_VOLUME_UP_I Increase value of the last command (Only for autotest) 36(A4,3,0) T_VOLUME_DOWN_I Decrease value of the last command (Only for autotest) 38(A6,3,0) T_VOC_ENC_OFFSET_I Vocoder ENC offset. 39(A7,3,0) T_VOC_DEC_OFFSET_I Vocoder DEC offset. (OP,AB,RB) 2) 2) 1) 1) 2) SAMSUNG Proprietary-Contents may change without notice 5-8 Command No. Signal. Name Description 40(A8,4,0) T_VOC_CDMA_UNITY _GAIN_I Vocoder CDMA unity gain. 41(A9,0,0) T_VOC_FM_HFRX_UPGAIN_I Vocoder FM hfrx upgain. 42(AA,1,0) T_DTMFON_I Activate dtmf generator with keycode. 43(AB,0,0) T_DTMFOFF_I Deactivate DTMF generator. 44(B0,0,0) T_COMPANDORON_I Enable the compressor and expandor. 45(B1,0,0) T_COMPANDOROF_I Diable the compressor and expandor. 46(B2,0,0) T_FM_VCLINE_I* Enter Analog voice channel state. 47(B3,0,0) T_FM_AUD_GAIN_I FM audio gain. 48(B4,0,0) T_VIBRATOR_ON_I Active A Vibrator. 49(B5,0,0) T_VIBRATOR_OFF_I Inactive A Vibrator. 50(B6,0,4) T_BATT_TYPE_I Batt type. 51(B7,1,1) T_BBA_I BBA supplier. 52(B9,2,2) T_HW_VERSION_I HW version. 53(BA,3,0) T_CARRIER_I Target Carrier option (Banner). 54(BB,1,0) T_VOC13K_I Target Service option (8K/13K). 55(AC,1,0) T_EXT_AUDIO_I External Audio Path ON/OFF. 56(AD,0,0) T_LOOP_BACK_I Loopback ON. 57(BC,0,0) T_MIC_ON_I Mic path on. 58(BD,0,0) T_MIC_OFF_I Mic path off. 59(BE,0,0) T_ALLPATH_I 60(BF,3,0) T_FM_TX_GAIN_I (OP,AB,RB) 2) Set Rx Path, TX Path Unmute to Earpiece. FM Tx Audio Gain Control. 2)3) 61(C0,3,0) 2)3) T_FM_RX_GAIN_I FM Rx Audio Gain Control. 62(C1,3,0) T_DTMF_VOL_TX_I FM Tx DTMF Gain control. 63(C2,3,0) T_TX_LIMITER_I 64(C3,3,0) T_FM_SAT_LEVEL_I 65(C4,3,0) T_FM_FREQ_SGAIN_I FM Tx Master Gain Control. 66(C5,3,0) T_FM_ST_GAIN_I FM TX ST Gain Control. 67(C6,3,6) T_READ_BATT_I Reads low batt. Value in Standby or Talk mode. 68(C8,0,3) T_VBATT1_I Set the low battery position in the standby. 69(C9,0,3) T_VBATT2_I 70(CA,3,0) T_WRITE_BATT_I 71(D1,3,0) T_CDMA_TXADJ_I Change pdm TX AGC in CDMA. 72(D2,3,0) T_FM_TXADJ_I Change pdm TX AGC in FM. 73(D3,1,0) T_SET_PA_R0_I 74(D4,4,0) T_OFF_PA_R0_I 75(D5,0,3) T_READ_RSSI_I Read a RSSI. 77(D7,0,3) T_READ_TEMP_I Read Temp. 78(D8,0,3) T_RXRAS_AUTO_I Adjust RXRAS from 8924C. 79(D9,1,0) T_BUZZER_ON_I2) Buzzer On at DTMF 0 key 80(DA,0,0) T_BUZZER_OFF_I Buzzer off 5-9 2)3) FM Tx Limiter Gain Control. 2)3) FM Tx SAT level Control. 2)3) 2)3) 2)3) 1) 3) Set the low battery position in the talking. 3) 3)3) 2) 2) 2) Write low battery Level Value to NVM. Set TX power Amp ctrl R0. Off TX power Amp ctrl R0. 3) SAMSUNG Proprietary-Contents may change without notice Command No. Signal. Name Description 81(E3,0,0) T_VOC_PCMLPON_I Play a PCM LOOP BACK. 82(E4,0,0) T_VOC_PCMLPOFF_I Play off a PCM LOOP BACK. 85(E7,0,0) T_SPEAKER_ON_I Turn on the speaker path. 86(E8,0,0) T_SPEAKER_OFF_I Turn off the speaker path. 87(E9,0,0) T_FM_LOOP_TEST_I Play a PCM FM loopback. 88(EA,0,0) T_TRK_ADJ_I3) FM TRK_LO_ADJ control. 89(EB,0,0) T_CD_TRK_ADJ_I3) CDMA TRK_LO_ADJ control. 92(F2,3,0) T_TXRAS_ADJ_I TXRAS adj = TX RAS offset array. 93(F3,3,0) T_RXRAS_ADJ_I RXRAS adj = RX RAS offset array. 94(F4,4,0) T_HW_CHANFLAT_T H/W Channel Flatness. 95(F5,4,0) T_SW_CHANFLAT_T S/W Channel Flatness. 96(F6,3,0) T_CH_FLATNESS_I Set 22dBm Channel Deviation 10 POINT. 97(F7,3,0) T_FM_TX_PWR_I Set FM PWR LEVEL 2~7 (OP,AB,RB) 1) ==> The AB (Input Argument Byte Number) values of these commands are used only in the manual test. In automatic test mode, the AB is regarded as 0. 2) ==> You can assign the value for these commands. If the AB value is assigned without argument, the test is achieved with the value stored in EEPROM. 3) ==> After you get a desired test value by performing these commands, if you want to save the value in EEPROM, use T-SAVE-VAL-I command to store the test value into the corresponding position. * OP : Operation Command Number AB : Input Argument Byte Number RB : Return Byte Number SAMSUNG Proprietary-Contents may change without notice 5-10 6. Troubleshooting 6-1 Logic Section 6-1-1 No Power Press End button U105 pin 1=VBAT? No Check the signal from the battery terminal to U 105 pin 1. No Check U105 and its neighboring circuits. No Check U106 and its neighboring circuits. No Check U107 and its neighboring circuits. Yes U106 pin 1 input =3.7V? Yes U106 pin 5 output =3.7V? Yes U107 pin 5 output =3.7V? Yes END 6-1 SAMSUNG Proprietary-Contents may change without notice 6-1-2 Abnormal Initial Operation (Normal +3.3V source) Press END button TCXO CLK applied to U401 pin 26? No Check TCXO output, R400 and C400. Replace if required. No Check U401 and its meighboring circuit. Replace if required. No Check U109, MSM and its neighboring circuits. No Check ‘H’ level input from J104 pin 17 to U401 pin 79. replace if required. No Check Q125 and its neighboring circuit. Replace if required. No Check the LCD pins and its neighboring circuit. Replace if required. Yes TCXO CLK signal output from U401 pin 29? Yes RAM-CS signal output from U109 pin 44? Yes CHIPX8 CLK signal output from U401 pin 52? Yes Alert LED ON? Yes Normal initial display on LCD? Yes END SAMSUNG Proprietary-Contents may change without notice 6-2 6-1-3 Abnormal Backlight Operation Press and button on the phone ‘H’ level output from U101 L7 to J105 pin 19? No Check U101 L7. Replace if required No Check FPC. Replace if required No Check U139, L201, Q139 and its neighboring circuits. Replace if required No Check EL. Replace if required Yes ‘H’ level input to U139 pin 4,5? Yes Normal U139 operation? Yes Normal EL? Yes EL ON 6-3 SAMSUNG Proprietary-Contents may change without notice 6-1-4 Abnormal Key Data input Check initial status Scanning signals output from U101, C5, B4, D5, A5 C6, A5, D6 No Check U101 No Replace the key pad assembly Yes Check U101 A2, A3, C4, B5, E5 Yes Check J103 Yes Normal key data input? Yes END SAMSUNG Proprietary-Contents may change without notice 6-4 6-1-5 Abnormal Key tone Press and key Waveform output from U102 pin 14, 15, 16 No Check U102 pin 14, 15, 16. Replace if required. No Check U102, pin 2, 3 and its neighboring circuits. Replace if required. No Check U102, R250 and C108, FPC. Replace if required. No Check SPK. Replace if required. Yes Waveform output from U102 pin 2, 3? Yes Waveform applied to SPK(+), (-)? Yes normal key tone? Yes END 6-5 SAMSUNG Proprietary-Contents may change without notice 6-1-6 Abnormal Alert Tone Abnormal alert tone CLK waveform output from U101, N7, P7? No Check U101 N7, P7. Replace if required. No Check U102 pin 17, and its neighboring circuits. Replace if required No Check Q120, Q121, R128. Replace if required. No Connect the buzzer correctly. Yes CLK waveform output from U102 pin 17? Yes CLK waveform applied to Buzz? Yes Is the buzzer connection correct? Yes Check the buzzer and replace if required SAMSUNG Proprietary-Contents may change without notice 6-6 6-2 Receiver Section 6-2-1 FM mode Start FM mode No Check FM 12dB SINAD OK? No Check LNA in/output OK? Check Duplexer & LNA power Gain: +16dB Yes Yes Check RF amp in/output OK? Gain: +17dB Yes Yes Check mixer in/output OK? No Gain(FM): -8dB Check 1st local & mixer power OK? No Check PLL (U306) & VCO output 969.96MHz local: -4~0dBm VCO_OUTPUT: -10dBm Yes No Check IF filter soldering Check IF filter in/output OK? Loss: -5dB Yes Yes No Check AGC amp in/output OK? Gain: +, -45dB Check 2nd local & AGC control voltage OK? No Check PLL & BBA #80 170.76MHz Yes RF Rx FM OK BBA INPUT: -54dBm 6-7 SAMSUNG Proprietary-Contents may change without notice 6-2-2 CDMA Mode Start CDMA mode Normal CDMA SVC & ROAM? No Check CDMA RX path Setup CDMA call OK? No Check Transmitter No Yes Measure CDMA FER Yes Normal CDMA RF? SAMSUNG Proprietary-Contents may change without notice 6-8 6-3 Transmitter Section Check Tx No O.K Check Tx PLL Check U403 Tx IF level O.K CDMA: -20dBm Check U403 Local Input level CDMA: -5~3dBm SPAN 5MHz Tx VCO:260.76MHz IF:130.38MHz Yes O.K Check Tx Power level No Check U403 Out level O.K CDMA: -16~15dBm 6-9 Check U404 RF Out level O.K CDMA: 0~1dBm Check U407 Pout level CDMA: 24~26dBm SAMSUNG Proprietary-Contents may change without notice 6-4 Desk-Top Rapid Charger Plug_in Check LED state (RED>GRN>YEL) Check BAT-Contact. Check Voltage of C3, C2. (about 330V) Check F1, BD1, U1 Check Battery. Check component the secondary D30, D20, U22, U23, U24, U25, U26. Blank of Front. Check BAT-Contact. Check Battery. Check C30 Blank of Rear Check BAT-Contact. Check Battery. Check C40. Check Voltage of C41.(5V) Check U25. LED blink? (Yellow) Check Voltage of C22. (about 4.5V) Check U26. Check Voltage of C22. (about 4.5V) LED blink? (RED>GRN>YEL) Check LD1, LD2 Check component the secondary D30, D20, U22, U23, U24, U25, U26. SAMSUNG Proprietary-Contents may change without notice 6-10 6-5 Hands-Free Kit 1 Start Ignition Check Phone Power ON/OFF Check Charger Circuit Auto Power ON Handset Hook ON/OFF Check Handset Mode Battery Check Hands Free Mode Charging current and voltage check according to battery type In conversation mode, volume adijustment, mute on/off, calibration check Full Charging check Auto power off according to lgnition status Charging LED Check Handsfree off with the phone powered off or removed 6-11 SAMSUNG Proprietary-Contents may change without notice 7. Exploded View and its Parts List 7-1 Cellular phone Exploded View 1 2 20 3 21 5 22 4 6 23 24 7 25 26 8 12 9 10 27 29 13 28 11 30 14 15 31 32 16 33 17 49 18 19 34 35 39 36 37 40 38 41 43 42 44 45 46 47 48 SAMSUNG Proprietary-Contents may change without notice 7-1 7-2 Cellular phone Parts List No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 7-2 Description PMO-DECORATION MPR-TAPE DECORATION LABEL(M) LOGO BADGE PCL PMO-FOLDER UPPER SCREW-MACHINE MCT-SHIELD GASKET LCD ASSÕY MPR-SPONGE LCD MPR-TAPE EAR PIECE MPR-TAPE VIBRATIOR NPR-BRACKET FOLDER R PPR-PC SHEET LCD MEC-HINGE ASSY ICT-MAGNET NPR-BRACKET FOLDER L PMO-FOLDER LOWER MPR-TAPE WINDOW LCD PCT-WINDOW LCD PPR-WINDOW BOHO PMO-HINGE DUMMY RMO-REFLECTOR LED PMO-FRONT COVER RMO-KEY PAD LOGIC BOARD RMO-HOLDER MIC RMO-CONNECTOR COVER NPR-SHIELD STRIP(C) NPR-SHIELD STRIP(A) NPR-SHIELD MSM CAN PMO-SHIELD COVER NNPR-SHIELD DUPLEX CA RMO-HOLDER BUZZER PMO-MOBILE CAP NPR-SHIELD TAPE RF NPR-GROUND PLATE PMO-KNOB VOLUME RMO-EAR JACK COVER PMO-REAR COVER NPR-BRACKET ANT ANTENNA SPRING-LOCKER PMO-LOCKER BATT SCREW-MACHINE SCREW-MACHINE LABEL(R) MAIN SLIM BATTERY STANDARD BATTERY EXTENDED BATTERY RF BOARD SEC code GH72-00264C GH74-10772A GH68-00365C GH72-00285A 601-000876 GH74-00011A GH96-00798A GH74-10774A GH74-00005A GH74-10776A GH71-10726A GH72-10545A GH75-11337A GH70-00009A GH71-10722A GH72-41804A GH74-10775A GH72-00283A GH72-10001A GH72-00067A GH72-41801A GH72-41800A GH73-00080A GH41-00019A GH73-40708A GH73-40704A GH71-00006A GH71-00004A GH71-00008A GH72-41799A GH71-00009A GH73-40735A GH73-40705A GH74-00027A GH71-00010A GH72-41787A GH73-40734A GH72-41806A GH71-10742A GH42-00002A GH61-70054A GH72-00068A 6001-001140 6001-000876 GH68-00368A GH41-00020A QÕTY Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1 1 1 3 1 1 1 1 1 1 1 1 4 1 1 1 1 1 1 SAMSUNG Proprietary-Contents may change without notice 7-3 Desk-Top Rapid charger Exploded View 1 2 4 6 3 5 7 8 9 10 11 SAMSUNG Proprietary-Contents may change without notice 7-3 7-4 Desk-Top Rapid charger Parts List No Description SEC. CODE QÕTY 1 Case. upper 1 2 Hook-plate 2 3 SCREW 4 4 Battery housing 1 5 SCREW 1 6 Power cord 1 7 PCB 1 8 Case. Lower 1 9 SCREW 4 10 BUM PON 4 11 Label 1 TYPE A B C D SEC. CODE Remark A ISRAEL B Brazil C China D Hong Kong 7-4 Remark SAMSUNG Proprietary-Contents may change without notice 7-5 Hands-free Kit 1 Exploded View 1 2 3 4 5 6 7 SAMSUNG Proprietary-Contents may change without notice 7-5 7-6 Hands-free Kit 1 Parts List No Description SEC. CODE QÕTY 1 Case. upper 1 2 SCREW 3✕5Y 1 3 PCB 1 4 Case. Lower 1 5 SCREW 3✕12Y 4 6 Sponge 2 7 Label 1 7-6 Remark SAMSUNG Proprietary-Contents may change without notice 7-7 Speaker Exploded View 6 7 4 3 9 8 5 2 1 SAMSUNG Proprietary-Contents may change without notice 7-7 7-8 Speaker Parts List No Description SEC. CODE QÕTY 1 Case. Front 1 2 Speaker 1 3 Case. Rear 1 4 Bolt 2 5 HEX. NUT 2 6 Hamdle 1 7 Speaker wire 1 8 Screw 4 9 Label 1 7-8 Remark SAMSUNG Proprietary-Contents may change without notice 7-9 Cradle Exploded View 1 2 4 3 6 5 7 9 8 7 10 11 12 16 13 14 15 17 SAMSUNG Proprietary-Contents may change without notice 7-9 7-10 Cradle Parts List No Description SEC. CODE QÕTY 1 Cover Top 1 2 Holder Socket 1 3 Spring rock 2 4 Locker 1 5 Locker 1 6 Eject-A 1 7 Efect Spring 2 8 Frame 1 9 Eject-B 1 10 Screw 6 11 PCB 1 12 SCREW 4 13 Cover Bottom 1 14 Screw 2 15 Label 1 16 I/F coil cord 1 17 Data coil cord 1 7-10 Remark SAMSUNG Proprietary-Contents may change without notice 7-11 Main packing Exploded View 1 2 8 4 6 5 3 7 SAMSUNG Proprietary-Contents may change without notice 7-11 7-12 Main packing Parts List No PART NAME CODE NO QÕTY 1 CUSHION DUMMY MANUAL 1 2 MAIN SET 1 3 DTC81 1 4 EXT BATT 1 5 HOLSTER 1 6 STD BATT 1 7 MAIN CUSHION 1 8 MAIN GIFT BOX 1 7-12 Remark SAMSUNG Proprietary-Contents may change without notice 7-13 Hands-Free Kit 1 packing Exploded View 1 3 2 4 7 6 5 8 9 10 SAMSUNG Proprietary-Contents may change without notice 7-13 7-14 Hands-Free Kit 1 packing Parts List No Description SEC. CODE QÕTY 1 User manual 1 2 User manual 1 3 External speaker 1 4 Cradle 1 5 install Bracket for cradle 1 6 External Mic 1 7 Hands-free Box 1 8 install Bracket for hands-free Box 1 9 Power cable 1 10 Unit Box 1 7-14 Remark SAMSUNG Proprietary-Contents may change without notice 8. Electrical Parts List 8-1 Main Part List Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 1 - SCREW-MACHINE “CH,+,M1.7,L2,ZPC(BLK),SWRCH18” 6001-000876 1 - SCREW-MACHINE “BH,STAR,M2,L4,CBLACK,SM20C,-” 6001-001140 1 REAR-COVER ANTENNA-SCH800 “-,824~894MHZ,0DBD,50OHM” GH42-00002A 1 - BATTERY-STD ENG(B) “3.6V,1000MAH,-,1CMA,4.1V” GH43-00057A 1 - LABEL(R)-MAIN SCH811 “SCH-811,POLYESTER T0.05,37X28,-,SIL” GH68-00368A 1 - LABEL(P)-7PI “SCH-200F,ART,PI7,100G,BLK” GH68-10680A 1 - LABEL(P)-MS BAR CODE “SCH-1900,ART,100X155,T0.1,WHT” GH68-11057A 1 - LABEL(R)-BARCODE BOX “SCH-1011,POLYESTER,61X71,T0.1,” GH68-30937A 1 - LABEL(R)-BAR CODE “SP-D300,PR,34X6.5,T0.1,WHT” GH68-30963A 1 - PCT-WINDOW LCD SCH811P “SCH-811,-,BLK,-,-” GH72-00283A 1 WINDOW-LCD PPR-TAPE WINDOW BOHO “SCH-100,VINYL TAPE,TRP,-,-” GH72-10001A 1 - PMO-KEY VOLUME “SPH7000,PC+ELASTOMER,BLK,-,-” GH72-41787A 1 SCREW BOSS RPR-GROUND GASKET “SPH-7000,SI RUBBER,®™7*T0.4,GRY,-” GH73-00005A 1 - RMO-CONNECTOR COVER “SPH7000,URETAN,18.2X4.0XT5.8,B” GH73-40704A 1 - RMO-MOBILE CAP “SPH7000,URETHAN,5.2X4.2XT5.0,B” GH73-40705A 1 - RMO-EAR JACK COVER “SCH-800,URETHAN,5.0X11XT5.0,BL” GH73-40734A 1 SPEAKER MPR-SPONGE SPEAK “SCH-800,FOAM,®™8.5XT0.4,BLK,-” GH74-00012A 1 FPC-CABLE MPR-SPONGE MIC “SH-800,SPONGE,7X7.5X3,BLK,-” GH74-10526A 1 - MEC-SHIELD COVER “SCH-800B,SEC,TRP” GH75-00022A 2 SHIELD-COVER NPR-SHIELD STRIP(A) “SCH-800B,C5210-1/2H,T0.1,-” GH71-00004A 2 SHIELD-COVER NPR-SHIELD STRIP(C) “SCH-800B,C5210-1/2H,T0.1,-” GH71-00006A 2 SHIELD-COVER NPR-SHIELD MSM CAN “SCH-800B,C5210-1/2H,T0.1,-” GH71-00008A 2 SHIELD-COVER NPR-SHIELD DUPLEX CAN “SCH-800B,C5210-1/2H,T0.1,-” GH71-00009A 2 SHIELD-COVER PMO-SHIELD COVER “SCH-800,PC,TRP,-,-” GH72-41799A 2 SHIELD-COVER MPR-SPONGE MSM “SPH-7000,PVC FOAM,10X10XT0.5,WHT,-” GH74-00002A 2 SHIELD-COVER MPR-SPONGE SAW FILTER “SCH-800B,PE SPONGE,15X5.8XT0.5,WHT,-” GH74-00014A 2 SHIELD-COVER MPR-SPONGE TCXO “SCH-800B,PE SPONGE,9.0X7.0XT0.5,WHT,-” GH74-00015A 1 - MEC-HOLSTER 811B “SCH-811,PCL,BLK” GH75-00144A 2 - SPRING-CLAMP “SCH-811,PW1(KSD 3556),-,-,-,-” GH61-00005A 2 - IPR-E RING “SCH-811,STS304 W2,0.3,-” GH70-00023A 2 - ICT-PIN CLAMP “SCH-811,STS304 W2,PI1.9X20,-” GH70-00024A 2 - PMO-HOLSTER CRADLE 811B “SCH-811,PC,BLK,-,-” GH72-00282A 2 - PMO-HOLSTER CLAMP 811B “SCH-811,PC,BLK,-,-” GH72-00284A 1 - MEC-HANGER “SCH-811,PCL,BLK” GH75-00157A 1 - PBA MAIN-SCH810 LOGIC “SCH-810,SAMSUNG,BRAZ,LOGIC,-,-,-” GH92-00758A 2 D107 DIODE-SWITCHING “MCL4148,100V,200mA,LL-34,TP” 0401-001052 2 D109 DIODE-RECTIFIER “UPS5819,40V,1.0A,SMT,TP” 0402-001207 2 D101 DIODE-TVS “SM05,6V/1mA,300,SOT-23” 0406-001005 2 D103 DIODE-TVS “SM05,6V/1mA,300,SOT-23” 0406-001005 2 D130 DIODE-TVS “SM05,6V/1mA,300,SOT-23” 0406-001005 SAMSUNG Proprietary-Contents may change without notice 8-1 Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 D111 DIODE-TVS “SMS05C,6V,300W,SOT-23-6” 0406-001051 2 D112 DIODE-TVS “SMS05C,6V,300W,SOT-23-6” 0406-001051 2 D128 DIODE-TVS “SMS05C,6V,300W,SOT-23-6” 0406-001051 2 D129 DIODE-TVS “SMS05C,6V,300W,SOT-23-6” 0406-001051 2 D135 DIODE-TVS “SMS05C,6V,300W,SOT-23-6” 0406-001051 2 D104 DIODE-ARRAY “DA204U,20V,100mA,C2-3,SC-70,TP” 0407-000102 2 D102 DIODE-ARRAY “KDS226,80V,300mA,C2-3,SOT-23,T” 0407-000122 2 Q124 TR-SMALL SIGNAL “2SA1576,PNP,200MW,SOT-323,TP,180-390” 0501-000162 2 Q107 TR-SMALL SIGNAL “2SC4081,NPN,200mW,UMT,TP,180-3” 0501-000218 2 Q119 TR-SMALL SIGNAL “MMBT2222A,NPN,225mW,SOT-23,TP,” 0501-000457 2 Q121 TR-SMALL SIGNAL “MMBT2222A,NPN,225mW,SOT-23,TP,” 0501-000457 2 Q123 TR-SMALL SIGNAL “MMBT2222A,NPN,225mW,SOT-23,TP,” 0501-000457 2 Q106 TR-DIGITAL “RN1104,NPN,100MW,47K/47K,SSM,TP” 0504-000168 2 Q125 TR-DIGITAL “RN1104,NPN,100MW,47K/47K,SSM,TP” 0504-000168 2 Q126 TR-DIGITAL “RN1104,NPN,100MW,47K/47K,SSM,TP” 0504-000168 2 Q101 TR-DIGITAL “RN2104,PNP,100MW,47K/47K,SSM,TP” 0504-000172 2 Q120 TR-DIGITAL “RN2104,PNP,100MW,47K/47K,SSM,TP” 0504-000172 2 Q103 FET-SILICON “SI3443DV,P,-20V,+-3.5mA,65mohm” 0505-001165 2 Q104 FET-SILICON “SI6803DQ,N/P,20/-20V,+-2.5/+-2” 0505-001185 2 D120 LED “CHIP,Y-GRN,0.8x1.1mm,570nm” 0601-001094 2 D121 LED “CHIP,Y-GRN,0.8x1.1mm,570nm” 0601-001094 2 D122 LED “CHIP,Y-GRN,0.8x1.1mm,570nm” 0601-001094 2 D123 LED “CHIP,Y-GRN,0.8x1.1mm,570nm” 0601-001094 2 D124 LED “CHIP,Y-GRN,0.8x1.1mm,570nm” 0601-001094 2 D125 LED “CHIP,Y-GRN,0.8x1.1mm,570nm” 0601-001094 2 D126 LED “CHIP,Y-GRN,0.8x1.1mm,570nm” 0601-001094 2 D127 LED “CHIP,Y-GRN,0.8x1.1mm,570nm” 0601-001094 2 D110 LED “CHIP,RED/GRN,3x2.5mm,660/570nm” 0601-001130 2 U114 IC-CMOS LOGIC “7W04,INVERTER,SSOP,8P,110MIL,T” 0801-000301 2 U116 IC-CMOS LOGIC “7S32,OR GATE,SOT-25,5P,63MIL,S” 0801-000796 2 U111 IC-CMOS LOGIC “7S04,INVERTER,SOT-25,5P,63MIL,” 0801-002192 2 U112 IC-TTL “4W53,MUX/DEMUX,SOP,8P,110MIL,S” 0803-003010 2 U115 IC-DSP “16272,16BIT,TQFP,64P,400MIL,27” 0904-001280 2 U104 IC-EEPROM “24C256,32Kx8BIT,SOP,8P,200MIL,” 1103-001131 2 U110 IC-FLASH MEMORY “29LV800,1Mx8BIT,SON,46P,-,100n” 1107-001062 2 U109 IC-ETC. MEMORY “1306,524Kx16BIT,SOP,48P,400MIL” 1109-001081 2 U103 IC-VOLTAGE COMP. “75W56,SSOP,8P,110MIL,DUAL,7V,C” 1202-001022 2 U108 IC-RESET “809,SOP,3P,-,PLASTIC,-0.3/6V,4” 1203-000392 2 U107 IC-VOLTAGE REGULATOR “5205,SOT-23,5P,59MIL,PLASTIC,3” 1203-001256 2 U105 IC-PWM CONTROLLER “9161,SOP,16P,-,PLASTIC,1.455/1” 1203-001434 8-2 SAMSUNG Proprietary-Contents may change without notice Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 U106 IC-VOLTAGE REGULATOR “5219,SOT-23,5P,63MIL,PLASTIC,3” 1203-001518 2 U102 IC-ENCODER/DECODER “ST5092TQFPTR,QFP,44P,-,PLASTIC” 1204-001375 2 U101 IC-DATA COMM./GEN. “MSM2300,PBGA,196P,590MIL,PLAST” 1205-001517 2 R113 R-CHIP “2Kohm,5%,1/16W,DA,TP,1005” 2007-000137 2 R105 R-CHIP “100ohm,5%,1/16W,DA,TP,1005” 2007-000138 2 R106 R-CHIP “100ohm,5%,1/16W,DA,TP,1005” 2007-000138 2 R129 R-CHIP “100ohm,5%,1/16W,DA,TP,1005” 2007-000138 2 R130 R-CHIP “100ohm,5%,1/16W,DA,TP,1005” 2007-000138 2 R131 R-CHIP “100ohm,5%,1/16W,DA,TP,1005” 2007-000138 2 R137 R-CHIP “100ohm,5%,1/16W,DA,TP,1005” 2007-000138 2 R188 R-CHIP “100ohm,5%,1/16W,DA,TP,1005” 2007-000138 2 “R103,R108,R224” R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R104 R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R116 R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R117 R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R125 R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R128 R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R181 R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R183 R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R230 R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R102 R-CHIP “2.2Kohm,5%,1/16W,DA,TP,1005” 2007-000141 2 R114 R-CHIP “2.7Kohm,5%,1/16W,DA,TP,1005” 2007-000142 2 R100 R-CHIP “4.7Kohm,5%,1/16W,DA,TP,1005” 2007-000143 2 R149 R-CHIP “4.7Kohm,5%,1/16W,DA,TP,1005” 2007-000143 2 R217 R-CHIP “4.7Kohm,5%,1/16W,DA,TP,1005” 2007-000143 2 R221 R-CHIP “4.7Kohm,5%,1/16W,DA,TP,1005” 2007-000143 2 R222 R-CHIP “4.7Kohm,5%,1/16W,DA,TP,1005” 2007-000143 2 R223 R-CHIP “4.7Kohm,5%,1/16W,DA,TP,1005” 2007-000143 2 R144 R-CHIP “6.8Kohm,5%,1/16W,DA,TP,1005” 2007-000146 2 R120 R-CHIP “10Kohm,5%,1/16W,DA,TP,1005” 2007-000148 2 R136 R-CHIP “10Kohm,5%,1/16W,DA,TP,1005” 2007-000148 2 R182 R-CHIP “10Kohm,5%,1/16W,DA,TP,1005” 2007-000148 2 R184 R-CHIP “10Kohm,5%,1/16W,DA,TP,1005” 2007-000148 2 R185 R-CHIP “10Kohm,5%,1/16W,DA,TP,1005” 2007-000148 2 R187 R-CHIP “10Kohm,5%,1/16W,DA,TP,1005” 2007-000148 2 R124 R-CHIP “15Kohm,5%,1/16W,DA,TP,1005” 2007-000151 2 R139 R-CHIP “15Kohm,5%,1/16W,DA,TP,1005” 2007-000151 2 R101 R-CHIP “20Kohm,5%,1/16W,DA,TP,1005” 2007-000152 2 R107 R-CHIP “22Kohm,5%,1/16W,DA,TP,1005” 2007-000153 2 R132 R-CHIP “22Kohm,5%,1/16W,DA,TP,1005” 2007-000153 SAMSUNG Proprietary-Contents may change without notice 8-3 Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 R150 R-CHIP “22Kohm,5%,1/16W,DA,TP,1005” 2007-000153 2 R189 R-CHIP “22Kohm,5%,1/16W,DA,TP,1005” 2007-000153 2 R211 R-CHIP “22Kohm,5%,1/16W,DA,TP,1005” 2007-000153 2 R215 R-CHIP “22Kohm,5%,1/16W,DA,TP,1005” 2007-000153 2 R216 R-CHIP “22Kohm,5%,1/16W,DA,TP,1005” 2007-000153 2 R155 R-CHIP “24Kohm,5%,1/16W,DA,TP,1005” 2007-000154 2 “R145,C162” R-CHIP “47Kohm,5%,1/16W,DA,TP,1005” 2007-000157 2 R210 R-CHIP “47Kohm,5%,1/16W,DA,TP,1005” 2007-000157 2 R138 R-CHIP “56Kohm,5%,1/16W,DA,TP,1005” 2007-000159 2 R111 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R134 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R135 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R146 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R147 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R148 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R151 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R172 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R173 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R174 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R175 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R176 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R177 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R178 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R190 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R109 R-CHIP “120Kohm,5%,1/16W,DA,TP,1005” 2007-000163 2 R152 R-CHIP “150Kohm,5%,1/16W,DA,TP,1005” 2007-000164 2 R153 R-CHIP “150Kohm,5%,1/16W,DA,TP,1005” 2007-000164 2 R154 R-CHIP “200Kohm,5%,1/16W,DA,TP,1005” 2007-000165 2 R186 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R115 R-CHIP “1.5Kohm,5%,1/16W,DA,TP,1005” 2007-000242 2 R127 R-CHIP “33Kohm,5%,1/16W,DA,TP,1005” 2007-000775 2 R214 R-CHIP “39Kohm,5%,1/16W,DA,TP,1005” 2007-000831 2 R133 R-CHIP “470ohm,5%,1/16W,DA,TP,1005” 2007-000932 2 R250 R-CHIP “4.7ohm,5%,1/16W,DA,TP,1005” 2007-001284 2 “R212,R225” R-CHIP “33ohm,5%,1/16W,DA,TP,1005” 2007-001292 2 R168 R-CHIP “51ohm,5%,1/16W,DA,TP,1005” 2007-001298 2 R169 R-CHIP “51ohm,5%,1/16W,DA,TP,1005” 2007-001298 2 R170 R-CHIP “51ohm,5%,1/16W,DA,TP,1005” 2007-001298 2 R171 R-CHIP “51ohm,5%,1/16W,DA,TP,1005” 2007-001298 2 R218 R-CHIP “150ohm,5%,1/16W,DA,TP,1005” 2007-001306 8-4 SAMSUNG Proprietary-Contents may change without notice Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 R220 R-CHIP “150ohm,5%,1/16W,DA,TP,1005” 2007-001306 2 R122 R-CHIP “1.2Kohm,5%,1/16W,DA,TP,1005” 2007-001319 2 R213 R-CHIP “13KOHM,5%,1/16W,DA,TP,1005” 2007-007015 2 R110 R-CHIP “43KOHM,5%,1/16W,DA,TP,1005” 2007-007101 2 R141 R-CHIP “100Kohm,1%,1/16W,DA,TP,1005” 2007-007107 2 R123 R-CHIP “10Kohm,1%,1/16W,DA,TP,1005” 2007-007142 2 R142 R-CHIP “68Kohm,1%,1/16W,DA,TP,1005” 2007-007589 2 C167 “C-CERAMIC,CHIP” “1.5nF,10%,50V,X7R,TP,1005,-” 2203-000138 2 C103 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C105 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C106 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C121 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C122 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C130 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C152 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C154 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C156 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C100 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C116 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C118 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C119 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C127 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C158 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C159 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C164 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C170 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C182 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C183 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C184 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C185 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C133 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C151 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C153 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C160 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C102 “C-CERAMIC,CHIP” “220pF,10%,50V,X7R,TP,1005,-” 2203-000585 2 C104 “C-CERAMIC,CHIP” “470pF,10%,50V,X7R,TP,1005,-” 2203-000940 2 C120 “C-CERAMIC,CHIP” “470pF,10%,50V,X7R,TP,1005,-” 2203-000940 2 C123 “C-CERAMIC,CHIP” “470pF,10%,50V,X7R,TP,1005,-” 2203-000940 2 C135 “C-CERAMIC,CHIP” “470pF,10%,50V,X7R,TP,1005,-” 2203-000940 2 C187 “C-CERAMIC,CHIP” “470pF,10%,50V,X7R,TP,1005,-” 2203-000940 SAMSUNG Proprietary-Contents may change without notice 8-5 Level 2 Design LOC DESCRIPTIONS SEC.CODE “C-CERAMIC,CHIP” “47pF,5%,50V,NPO,TP,1005,-” 2203-000995 2 “C191,C192,C193,C194” “C-CERAMIC,CHIP” “47pF,5%,50V,NPO,TP,1005,-” 2203-000995 2 “C195,C196,C198” “C-CERAMIC,CHIP” “47pF,5%,50V,NPO,TP,1005,-” 2203-000995 2 C199 “C-CERAMIC,CHIP” “47pF,5%,50V,NPO,TP,1005,-” 2203-000995 2 “C201,C202” “C-CERAMIC,CHIP” “47pF,5%,50V,NPO,TP,1005,-” 2203-000995 2 “C205,C206” “C-CERAMIC,CHIP” “47pF,5%,50V,NPO,TP,1005,-” 2203-000995 2 “C207,C208,C209,C210” “C-CERAMIC,CHIP” “47pF,5%,50V,NPO,TP,1005,-” 2203-000995 2 C101 “C-CERAMIC,CHIP” “8.2nF,10%,16V,X7R,TP,1005,-” 2203-001210 2 C109 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C111 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C112 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C115 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C126 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C128 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C129 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C132 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C134 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C137 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C155 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 “C161,C163,C211” “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C169 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C171 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C181 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 “C197,C200” “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C220 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C221 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C222 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C139 “C-CERAMIC,CHIP” “1uF,+80-20%,10V,Y5V,TP,1608,-” 2203-005065 2 C117 “C-TA,CHIP” “1uF,20%,10V,GP,TP,2012,2,0” 2404-001017 2 C180 “C-TA,CHIP” “1uF,20%,10V,GP,TP,2012,2,0” 2404-001017 2 C108 “C-TA,CHIP” “33uF,20%,6.3V,GP,TP,3528,-” 2404-001032 2 C125 “C-TA,CHIP” “33uF,20%,6.3V,GP,TP,3528,-” 2404-001032 2 C131 “C-TA,CHIP” “100uF,20,6,LZ,TP,7343,-” 2404-001057 2 C110 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 C136 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 C138 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 L105 INDUCTOR-SMD “1uH,10%,0.8x1.6x0.8mm” 2703-000300 2 L101 INDUCTOR-SMD “10uH,20%,4.45x6.6x2.92mm” 2703-001563 2 X101 RESONATOR-CERAMIC “27MHz,0.5%,TP,3.2x2.1x1.5” 2802-001090 2 X102 RESONATOR-CERAMIC “27MHz,0.5%,TP,3.2x2.1x1.5” 2802-001090 8-6 “C186,C188,C190” ITEMS SAMSUNG Proprietary-Contents may change without notice Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 S1 SWITCH-REED “100VDC,0.5A,1mS,1mS” 3409-001039 2 J105 CONNECTOR-FPC/FC/PIC “22P,0.5mm,SMD-A,SN” 3708-001295 2 J110 CONNECTOR-SOCKET “18P,1R,0.5mm,SMD-A,AUF” 3710-001429 2 J104 CONNECTOR-HEADER “NOWALL,60P,2R,0.5mm,SMD-S,AUF” 3711-004027 2 J102 JACK-AC POWER “2P,2.6PI,AU,BLK,NO” 3722-001172 2 - PCB-SCH811 LOG “SCH-811,-,8,0.8T,118X138MM” GH41-00019A 2 VOL_KEY UNIT-VOLKEY “SCH-800,KBSCH800B,KEYPAD,FPC,-,-,-” GH59-00004A 2 MIC ASS’Y ELA ETC-MIC “SPH-7000,SAMSUNG,KORA,MICROPHO” GH96-01156A 1 - PBA MAIN-SCH810 RF “SCH-810,SAMSUNG,BRAZ,RF,-,-,-” GH92-00759A 2 D400 DIODE-VARACTOR “1SV279,15V,3nA,USC,TP” 0405-001035 2 D401 DIODE-VARACTOR “1SV279,15V,3nA,USC,TP” 0405-001035 2 D402 DIODE-VARACTOR “1SV279,15V,3nA,USC,TP” 0405-001035 2 D403 DIODE-VARACTOR “1SV279,15V,3nA,USC,TP” 0405-001035 2 D310 DIODE-ARRAY “DAN202U,80V,100mA,CA2-3,SC-70,” 0407-000115 2 D300 DIODE-PIN “BAR63-02W,50V,100mA,SCD-80,TP” 0409-001016 2 D301 DIODE-PIN “BAR63-02W,50V,100mA,SCD-80,TP” 0409-001016 2 Q402 TR-SMALL SIGNAL “2SA1576,PNP,200MW,SOT-323,TP,180-390” 0501-000162 2 Q300 TR-SMALL SIGNAL “2SC4081,NPN,200mW,UMT,TP,180-3” 0501-000218 2 U309 TR-SMALL SIGNAL “AT-32011,NPN,200mW,SOT-143,TP,” 0501-002060 2 Q302 TR-SMALL SIGNAL “BFP420,NPN,160MW,SOT-343,TP,50-150” 0501-002096 2 D302 TR-SMALL SIGNAL “BCR400W,NPN,-,SOT-343,TP,-” 0501-002205 2 Q301 TR-SMALL SIGNAL “BFP196W,NPN,700MW,SOT-343,TP,100” 0501-002240 2 Q401 TR-DIGITAL “RN1102,NPN,100MW,10K/10K,SSM,TP” 0504-000167 2 Q303 TR-DIGITAL “RN1104,NPN,100MW,47K/47K,SSM,TP” 0504-000168 2 U408 FET-SILICON “SI3443DV,P,-20V,+-3.5mA,65mohm” 0505-001165 2 U301 IC-ANALOG SWITCH “SW395TR,SPDP,SOT-26,6P,-,DUAL,” 1001-001048 2 U409 IC-ANALOG MULTIPLEX “MAX4524EUB-T,TTL/CMOS,SOP,10P,” 1001-001080 2 U404 IC-PREAMP “01037,SOP,6P,59MIL,SINGLE,-,PL” 1201-001175 2 U310 IC-CASCODE AMP “0916,SOT-143,4P,-,-,2.7V,-,6Vd” 1201-001248 2 U407 IC-POWER AMP “23124,LCC,8P,-,SINGLE,-,PLASTI” 1201-001259 2 U402 IC-AGC AMP “3222,SOP,-,-,SINGLE,-,PLASTIC,” 1201-001261 2 U314 IC-OP AMP “821,SOT23-5,5P,63MIL,SINGLE,-,” 1201-001348 2 U405 IC-OP AMP “821,SOT23-5,5P,63MIL,SINGLE,-,” 1201-001348 2 U406 IC-OP AMP “821,SOT23-5,5P,63MIL,SINGLE,-,” 1201-001348 2 U303 IC-RF AMP “2617,SSOP,16P,150MIL,DUAL,3V/V” 1201-001366 2 U304 IC-VOLTAGE REGULATOR “5205,SOT-23,5P,59MIL,PLASTIC,3” 1203-001256 2 U311 IC-VOLTAGE REGULATOR “5205,SOT-23,5P,59MIL,PLASTIC,3” 1203-001256 2 U312 IC-VOLTAGE REGULATOR “5205,SOT-23,5P,59MIL,PLASTIC,3” 1203-001256 2 U300 IC-MIXER “CMY210,SOP,6P,-,PLASTIC,3 TO 6” 1205-001249 2 U401 IC-DATA COMM./GEN. “Q5312I-3S2,QSOP,80P,138mm,PLAS” 1205-001451 SAMSUNG Proprietary-Contents may change without notice 8-7 Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 U403 IC-MIXER “RF2628,MSOP,8P,190MIL,PLASTIC,” 2 U306 IC-PLL “LMX2332LSLB,CSP,20P,-,PLASTIC,” 1209-001197 2 U313 THERMISTOR-NTC “10Kohm,5%,3650K,-,TP” 1404-001040 2 U410 THERMISTOR-NTC “10Kohm,5%,3650K,-,TP” 1404-001040 2 R325 R-CHIP “2Kohm,5%,1/16W,DA,TP,1005” 2007-000137 2 R321 R-CHIP “100ohm,5%,1/16W,DA,TP,1005” 2007-000138 2 R394 R-CHIP “100ohm,5%,1/16W,DA,TP,1005” 2007-000138 2 R305 R-CHIP “220ohm,5%,1/16W,DA,TP,1005” 2007-000139 2 R307 R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R309 R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R330 R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R426 R-CHIP “1Kohm,5%,1/16W,DA,TP,1005” 2007-000140 2 R443 R-CHIP “2.2Kohm,5%,1/16W,DA,TP,1005” 2007-000141 2 R315 R-CHIP “5.1Kohm,5%,1/16W,DA,TP,1005” 2007-000144 2 R440 R-CHIP “5.1Kohm,5%,1/16W,DA,TP,1005” 2007-000144 2 R324 R-CHIP “6.2Kohm,5%,1/16W,DA,TP,1005” 2007-000145 2 R451 R-CHIP “6.2Kohm,5%,1/16W,DA,TP,1005” 2007-000145 2 R411 R-CHIP “10Kohm,5%,1/16W,DA,TP,1005” 2007-000148 2 R412 R-CHIP “10Kohm,5%,1/16W,DA,TP,1005” 2007-000148 2 R417 R-CHIP “10Kohm,5%,1/16W,DA,TP,1005” 2007-000148 2 R438 R-CHIP “10Kohm,5%,1/16W,DA,TP,1005” 2007-000148 2 R306 R-CHIP “12Kohm,5%,1/16W,DA,TP,1005” 2007-000149 2 R441 R-CHIP “12Kohm,5%,1/16W,DA,TP,1005” 2007-000149 2 R452 R-CHIP “12Kohm,5%,1/16W,DA,TP,1005” 2007-000149 2 R444 R-CHIP “20Kohm,5%,1/16W,DA,TP,1005” 2007-000152 2 R310 R-CHIP “47Kohm,5%,1/16W,DA,TP,1005” 2007-000157 2 R322 R-CHIP “47Kohm,5%,1/16W,DA,TP,1005” 2007-000157 2 R401 R-CHIP “47Kohm,5%,1/16W,DA,TP,1005” 2007-000157 2 R402 R-CHIP “47Kohm,5%,1/16W,DA,TP,1005” 2007-000157 2 R435 R-CHIP “47Kohm,5%,1/16W,DA,TP,1005” 2007-000157 2 R333 R-CHIP “56Kohm,5%,1/16W,DA,TP,1005” 2007-000159 2 R395 R-CHIP “68Kohm,5%,1/16W,DA,TP,1005” 2007-000160 2 R308 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R332 R-CHIP “100Kohm,5%,1/16W,DA,TP,1005” 2007-000162 2 R331 R-CHIP “1Mohm,5%,1/16W,DA,TP,1005” 2007-000170 2 R425 R-CHIP “1Mohm,5%,1/16W,DA,TP,1005” 2007-000170 2 C444 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 C445 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 L353 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R314 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 8-8 1205-001535 SAMSUNG Proprietary-Contents may change without notice Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 R316 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R320 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R327 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R329 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R396 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R398 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R406 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R407 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R408 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R416 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R418 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R419 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R437 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R445 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R446 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R450 R-CHIP “0ohm,5%,1/16W,DA,TP,1005” 2007-000171 2 R300 R-CHIP “10ohm,5%,1/16W,DA,TP,1005” 2007-000172 2 R303 R-CHIP “10ohm,5%,1/16W,DA,TP,1005” 2007-000172 2 R311 R-CHIP “10ohm,5%,1/16W,DA,TP,1005” 2007-000172 2 R313 R-CHIP “10ohm,5%,1/16W,DA,TP,1005” 2007-000172 2 R319 R-CHIP “10ohm,5%,1/16W,DA,TP,1005” 2007-000172 2 R400 R-CHIP “10ohm,5%,1/16W,DA,TP,1005” 2007-000172 2 R439 R-CHIP “1.5Kohm,5%,1/16W,DA,TP,1005” 2007-000242 2 R421 R-CHIP “270Kohm,5%,1/16W,DA,TP,1005” 2007-000636 2 R442 R-CHIP “39Kohm,5%,1/16W,DA,TP,1005” 2007-000831 2 R424 R-CHIP “430Kohm,5%,1/16W,DA,TP,1005” 2007-000899 2 R422 R-CHIP “560Kohm,5%,1/16W,DA,TP,1005” 2007-001025 2 R302 R-CHIP “24ohm,5%,1/16W,DA,TP,1005” 2007-001290 2 R427 R-CHIP “51ohm,5%,1/16W,DA,TP,1005” 2007-001298 2 R399 R-CHIP “150ohm,5%,1/16W,DA,TP,1005” 2007-001306 2 R301 R-CHIP “200ohm,5%,1/16W,DA,TP,1005” 2007-001308 2 R328 R-CHIP “910ohm,5%,1/16W,DA,TP,1005” 2007-001317 2 R410 R-CHIP “1.8Kohm,5%,1/16W,DA,TP,1005” 2007-001320 2 R423 R-CHIP “1.8Kohm,5%,1/16W,DA,TP,1005” 2007-001320 2 R334 R-CHIP “36Kohm,5%,1/16W,DA,TP,1005” 2007-001335 2 R317 R-CHIP “16OHM,5%,1/16W,DA,TP,1005” 2007-003006 2 R318 R-CHIP “16OHM,5%,1/16W,DA,TP,1005” 2007-003006 2 R420 R-CHIP “20OHM,5%,1/16W,DA,TP,1005” 2007-003010 2 R428 R-CHIP “20OHM,5%,1/16W,DA,TP,1005” 2007-003010 2 R335 R-CHIP “43KOHM,5%,1/16W,DA,TP,1005” 2007-007101 SAMSUNG Proprietary-Contents may change without notice 8-9 Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 R405 R-CHIP “300ohm,1%,1/16W,DA,TP,1005” 2007-007133 2 R409 R-CHIP “39Kohm,1%,1/16W,DA,TP,1005” 2007-007134 2 R403 R-CHIP “1.2Kohm,1%,1/16W,DA,TP,1005” 2007-007137 2 R404 R-CHIP “10Kohm,1%,1/16W,DA,TP,1005” 2007-007142 2 R449 R-CHIP “10Kohm,1%,1/16W,DA,TP,1005” 2007-007142 2 R448 R-CHIP “11.3Kohm,1%,1/16W,DA,TP,1005” 2007-007491 2 C303 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C310 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C311 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C315 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C316 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C326 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C337 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C341 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C342 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C344 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C349 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C350 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C362 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C363 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C365 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C367 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C369 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C370 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C373 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C393 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C400 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C410 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C416 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C426 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C428 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C432 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C434 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C448 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C454 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 L304 “C-CERAMIC,CHIP” “100pF,5%,50V,NPO,TP,1005,-” 2203-000233 2 C343 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C356 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C359 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C366 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 8-10 SAMSUNG Proprietary-Contents may change without notice Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 C371 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C372 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C378 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C381 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C382 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C387 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C404 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C415 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C421 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C427 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C435 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C438 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C439 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C440 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C442 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C443 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C450 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C452 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C456 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C458 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C464 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C468 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C470 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C471 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C472 “C-CERAMIC,CHIP” “10nF,10%,16V,X7R,TP,1005,-” 2203-000254 2 C322 “C-CERAMIC,CHIP” “10pF,0.5pF,50V,NPO,TP,1005,-” 2203-000278 2 C383 “C-CERAMIC,CHIP” “10pF,0.5pF,50V,NPO,TP,1005,-” 2203-000278 2 C403 “C-CERAMIC,CHIP” “10pF,0.5pF,50V,NPO,TP,1005,-” 2203-000278 2 C418 “C-CERAMIC,CHIP” “18pF,5%,50V,NPO,TP,1005,-” 2203-000425 2 C301 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C320 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C323 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C327 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C361 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C407 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C409 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C419 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C422 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C423 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C424 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 SAMSUNG Proprietary-Contents may change without notice 8-11 Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 C425 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C430 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C431 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C437 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C449 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C455 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C457 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C459 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C463 “C-CERAMIC,CHIP” “1nF,10%,50V,X7R,TP,1005,-” 2203-000438 2 C345 “C-CERAMIC,CHIP” “1pF,0.25pF,50V,NPO,TP,1005,-” 2203-000466 2 C346 “C-CERAMIC,CHIP” “1pF,0.25pF,50V,NPO,TP,1005,-” 2203-000466 2 C329 “C-CERAMIC,CHIP” “220pF,10%,50V,X7R,TP,1005,-” 2203-000585 2 C305 “C-CERAMIC,CHIP” “22pF,5%,50V,NPO,TP,1005,-” 2203-000628 2 C351 “C-CERAMIC,CHIP” “3.9nF,10%,50V,X7R,TP,1005,-” 2203-000725 2 C319 “C-CERAMIC,CHIP” “33pF,5%,50V,NPO,TP,1005,-” 2203-000812 2 C391 “C-CERAMIC,CHIP” “33pF,5%,50V,NPO,TP,1005,-” 2203-000812 2 C401 “C-CERAMIC,CHIP” “39pF,5%,50V,NPO,TP,1005,-” 2203-000854 2 C402 “C-CERAMIC,CHIP” “39pF,5%,50V,NPO,TP,1005,-” 2203-000854 2 C321 “C-CERAMIC,CHIP” “3pF,0.25pF,50V,NPO,TP,1005,-” 2203-000870 2 C324 “C-CERAMIC,CHIP” “3pF,0.25pF,50V,NPO,TP,1005,-” 2203-000870 2 C338 “C-CERAMIC,CHIP” “3pF,0.25pF,50V,NPO,TP,1005,-” 2203-000870 2 C508 “C-CERAMIC,CHIP” “3pF,0.25pF,50V,NPO,TP,1005,-” 2203-000870 2 C318 “C-CERAMIC,CHIP” “4.7nF,10%,25V,X7R,TP,1005,-” 2203-000885 2 C328 “C-CERAMIC,CHIP” “4.7nF,10%,25V,X7R,TP,1005,-” 2203-000885 2 C332 “C-CERAMIC,CHIP” “4.7nF,10%,25V,X7R,TP,1005,-” 2203-000885 2 C340 “C-CERAMIC,CHIP” “4.7nF,10%,25V,X7R,TP,1005,-” 2203-000885 2 C357 “C-CERAMIC,CHIP” “4.7nF,10%,25V,X7R,TP,1005,-” 2203-000885 2 C360 “C-CERAMIC,CHIP” “4.7nF,10%,25V,X7R,TP,1005,-” 2203-000885 2 C376 “C-CERAMIC,CHIP” “4.7nF,10%,25V,X7R,TP,1005,-” 2203-000885 2 C379 “C-CERAMIC,CHIP” “4.7nF,10%,25V,X7R,TP,1005,-” 2203-000885 2 C384 “C-CERAMIC,CHIP” “4.7nF,10%,25V,X7R,TP,1005,-” 2203-000885 2 C390 “C-CERAMIC,CHIP” “4.7nF,10%,25V,X7R,TP,1005,-” 2203-000885 2 C395 “C-CERAMIC,CHIP” “4.7nF,10%,25V,X7R,TP,1005,-” 2203-000885 2 C398 “C-CERAMIC,CHIP” “4.7nF,10%,25V,X7R,TP,1005,-” 2203-000885 2 C325 “C-CERAMIC,CHIP” “470pF,10%,50V,X7R,TP,1005,-” 2203-000940 2 C333 “C-CERAMIC,CHIP” “470pF,10%,50V,X7R,TP,1005,-” 2203-000940 2 C334 “C-CERAMIC,CHIP” “470pF,10%,50V,X7R,TP,1005,-” 2203-000940 2 C368 “C-CERAMIC,CHIP” “470pF,10%,50V,X7R,TP,1005,-” 2203-000940 2 C388 “C-CERAMIC,CHIP” “470pF,10%,50V,X7R,TP,1005,-” 2203-000940 2 C405 “C-CERAMIC,CHIP” “470pF,10%,50V,X7R,TP,1005,-” 2203-000940 8-12 SAMSUNG Proprietary-Contents may change without notice Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 C461 “C-CERAMIC,CHIP” “470pF,10%,50V,X7R,TP,1005,-” 2203-000940 2 C446 “C-CERAMIC,CHIP” “47pF,5%,50V,NPO,TP,1005,-” 2203-000995 2 C462 “C-CERAMIC,CHIP” “47pF,5%,50V,NPO,TP,1005,-” 2203-000995 2 C312 “C-CERAMIC,CHIP” “4pF,0.25pF,50V,NPO,TP,1005,-” 2203-001017 2 C353 “C-CERAMIC,CHIP” “56pF,5%,50V,NPO,TP,1005,-” 2203-001072 2 C411 “C-CERAMIC,CHIP” “68pF,5%,50V,NPO,TP,1005,-” 2203-001153 2 C412 “C-CERAMIC,CHIP” “68pF,5%,50V,NPO,TP,1005,-” 2203-001153 2 C304 “C-CERAMIC,CHIP” “7pF,0.5pF,50V,NPO,TP,1005,-” 2203-001201 2 C441 “C-CERAMIC,CHIP” “8.2nF,10%,16V,X7R,TP,1005,-” 2203-001210 2 “C302,L306” “C-CERAMIC,CHIP” “8pF,0.5pF,50V,NPO,TP,1005,-” 2203-001259 2 C386 “C-CERAMIC,CHIP” “33nF,10%,16V,Y5V,TP,1005,1.0mm” 2203-001416 2 C300 “C-CERAMIC,CHIP” “47nF,10%,16V,Y5V,TP,1005,1.0mm” 2203-001432 2 C314 “C-CERAMIC,CHIP” “47nF,10%,16V,Y5V,TP,1005,1.0mm” 2203-001432 2 C331 “C-CERAMIC,CHIP” “47nF,10%,16V,Y5V,TP,1005,1.0mm” 2203-001432 2 C336 “C-CERAMIC,CHIP” “47nF,10%,16V,Y5V,TP,1005,1.0mm” 2203-001432 2 C355 “C-CERAMIC,CHIP” “47nF,10%,16V,Y5V,TP,1005,1.0mm” 2203-001432 2 C429 “C-CERAMIC,CHIP” “47nF,10%,16V,Y5V,TP,1005,1.0mm” 2203-001432 2 C307 “C-CERAMIC,CHIP” “5pF,0.25pF,50V,X7R,TP,1005,1.0” 2203-001437 2 C309 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C313 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C339 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C354 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C364 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C380 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C417 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C420 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C436 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C451 “C-CERAMIC,CHIP” “100nF,+80-20%,16V,Y5V,TP,1005,” 2203-005061 2 C413 “C-CERAMIC,CHIP” “6pF,0.1pF,50V,NPO,TP,1005,-” 2203-005382 2 C408 “C-TA,CHIP” “1uF,20%,10V,GP,TP,2012,2,0” 2404-001017 2 C467 “C-TA,CHIP” “33uF,20%,6.3V,GP,TP,3528,-” 2404-001032 2 C317 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 C347 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 C348 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 C358 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 C374 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 C375 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 C396 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 C399 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 C414 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 SAMSUNG Proprietary-Contents may change without notice 8-13 Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 C460 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 C465 “C-TA,CHIP” “10uF,20%,6.3V,GP,TP,2012,-” 2404-001064 2 C453 “C-TA,CHIP” “4.7uF,20%,6.3V,GP,TP,2012,-” 2404-001086 2 C385 “C-TA,CHIP” “3.3uF,20%,6.3V,GP,TP,2012,-” 2404-001087 2 C389 “C-TA,CHIP” “3.3uF,20%,6.3V,GP,TP,2012,-” 2404-001087 2 C447 “C-TA,CHIP” “3.3uF,20%,6.3V,GP,TP,2012,-” 2404-001087 2 C498 “C-TA,CHIP” “3.3uF,20%,6.3V,GP,TP,2012,-” 2404-001087 2 C499 “C-TA,CHIP” “3.3uF,20%,6.3V,GP,TP,2012,-” 2404-001087 2 C352 “C-TA,CHIP” “220nF,20%,20V,GP,TP,2012,-” 2404-001092 2 L315 INDUCTOR-SMD “470nH,10%,0.8x1.6x0.8mm” 2703-000213 2 L316 INDUCTOR-SMD “470nH,10%,0.8x1.6x0.8mm” 2703-000213 2 L312 INDUCTOR-SMD “390nH,10%,0.8x1.6x0.8mm” 2703-000297 2 L403 INDUCTOR-SMD “1uH,10%,0.8x1.6x0.8mm” 2703-000300 2 L310 INDUCTOR-SMD “100nH,5%,1.6x0.8x0.8mm” 2703-001172 2 L400 INDUCTOR-SMD “33nH,5%,1.6x0.8x0.8mm” 2703-001174 2 L307 INDUCTOR-SMD “18nH,5%,1.6x0.8x0.8mm” 2703-001189 2 L313 INDUCTOR-SMD “120nH,10%,1.6x0.8x0.8mm” 2703-001220 2 L305 INDUCTOR-SMD “39nH,5%,1.6x0.8x0.8mm” 2703-001285 2 L319 INDUCTOR-SMD “8.2nH,10%,1x0.5x0.5mm” 2703-001408 2 L320 INDUCTOR-SMD “8.2nH,10%,1x0.5x0.5mm” 2703-001408 2 L323 INDUCTOR-SMD “8.2nH,10%,1x0.5x0.5mm” 2703-001408 2 L351 INDUCTOR-SMD “12nH,10%,1x0.5x0.5mm” 2703-001409 2 L410 INDUCTOR-SMD “12nH,10%,1x0.5x0.5mm” 2703-001409 2 L402 INDUCTOR-SMD “68nH,5%,1.8x1.12x1.02mm” 2703-001514 2 L404 INDUCTOR-SMD “120nH,5%,1.7x1.14x1.02mm” 2703-001546 2 L405 INDUCTOR-SMD “120nH,5%,1.7x1.14x1.02mm” 2703-001546 2 L301 INDUCTOR-SMD “47nH,5%,1.0x0.5x0.5mm” 2703-001595 2 L303 INDUCTOR-SMD “47nH,5%,1.0x0.5x0.5mm” 2703-001595 2 L322 INDUCTOR-SMD “5.6nH,10%,1.0x0.5x0.5mm” 2703-001708 2 L406 INDUCTOR-SMD “33nH,5%,1.0x0.5x0.5mm” 2703-001723 2 L407 INDUCTOR-SMD “22nH,5%,1x0.5x0.5mm” 2703-001727 2 L308 INDUCTOR-SMD “15nH,5%,1x0.5x0.5mm” 2703-001730 2 L350 INDUCTOR-SMD “15nH,5%,1x0.5x0.5mm” 2703-001730 2 L302 INDUCTOR-SMD “6.8nH,5%,1x0.5x0.5mm” 2703-001734 2 L330 INDUCTOR-SMD “6.8nH,5%,1x0.5x0.5mm” 2703-001734 2 L311 INDUCTOR-SMD “100nH,2%,2.29x1.73x1.52mm” 2703-001743 2 U307 OSCILLATOR-VCO “954MHz,-,-,TP,3.3V,6.4mA” 2806-001146 2 U305 OSCILLATOR-VCTCXO “19.68MHZ,2.5PPM,10KOHM//10PF,TP,3V,2MA” 2809-001225 2 F302 FILTER-SAW “85.38MHz,0.630MHz,0.3MHz/0.3dB” 2904-001128 2 F304 FILTER-SAW “967MHz,25MHz,967MHz/0.5dB,TP,9” 2904-001133 8-14 SAMSUNG Proprietary-Contents may change without notice Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 2 F400 FILTER-SAW “836.5MHz,25MHz,+-25MHz/0.9dB,T” 2 F301 FILTER-SAW “881.5MHz,25MHz,+-25MHz/0.9dB,T” 2904-001136 2 F401 FILTER-SAW “836.50MHz,-,849MHz/1dB,TP,849M” 2904-001138 2 F300 FILTER-DUPLEXER “881.5MHz,836.5MHz,4/2.7dB,TP,8” 2909-001077 2 BUZZ BUZZER-MAGNETIC “88dB,3.6V,90mA,2.731KHz,TP” 3002-001062 2 L300 CORE-FERRITE “AB,1.6x0.8x0.8mm,-,-” 3301-001105 2 L309 CORE-FERRITE “AB,1.6x0.8x0.8mm,-,-” 3301-001105 2 L317 CORE-FERRITE “AB,1.6x0.8x0.8mm,-,-” 3301-001105 2 L321 CORE-FERRITE “AB,1.6x0.8x0.8mm,-,-” 3301-001105 2 L325 CORE-FERRITE “AB,1.6x0.8x0.8mm,-,-” 3301-001105 2 L326 CORE-FERRITE “AB,1.6x0.8x0.8mm,-,-” 3301-001105 2 L328 CORE-FERRITE “AB,1.6x0.8x0.8mm,-,-” 3301-001105 2 L409 CORE-FERRITE “AB,1.6x0.8x0.8mm,-,-” 3301-001105 2 J301 CONNECTOR-COAXIAL “SMC,JACK,100mohm,50ohm,0.5dB” 3705-001163 2 J300 CONNECTOR-SOCKET “60P,2R,0.5mm,SMD-S,AUF” 3710-001390 2 U308 RF POWER SPLITTER “2WAY,955-979MHz,12dB,-,TP” 4709-001080 2 - PCB-SCH811 RF “SCH-811,-,6,0.8T,118X90MM” GH41-00020A 2 PBA MAIN RF RMO-HOLDER BUZZER “SCH-800,CR RUBBER,11x9xT3.5,BL” GH73-40735A 1 - MEA FRONT-SCH811B “SCH-800,PCL,ISRL,-,-,-,-” GH97-00918A 2 FOLDER ASSY SCREW-MACHINE “CH,+,M1.7,L2,ZPC(BLK),SWRCH18” 6001-000876 2 FRONT-COVER PMO-HINGE DUMMY “SCH-800,PC,BLK,-,-” GH72-00067A 2 - PMO-DECORATION B(CHNA) “SGH-800,ABS,B/PEL,-,-” GH72-00264C 2 WINDOW-LCD PPR-TAPE WINDOW BOHO “SCH-100,VINYL TAPE,TRP,-,-” GH72-10001A LABEL(M)-LOGO BADGE PCL SCH-811 BLK GH68-00365A “SCH-811,-,-,BLK,-” GH73-00080A 2 2904-001135 2 - RMO-KEY PAD HEBREW 2 FRONT-COVER RMO-HOLDER MIC “SPH7000,SI RUBBER,PI8.0,T5.0,B” GH73-40708A 2 SPEAKER MPR-SPONGE SPEAK “SCH-800,FOAM,®™8.5XT0.4,BLK,-” GH74-00012A 2 FOLDER-UPPER MPR-DECO BOHO VINYL “SCH-800,VINYL,27X32.5X0.2,TRP,-” GH74-00084A 2 - MEC-FOLDER UPPER 811B “SCH-811,PCL,BLK” GH75-00139A 3 - PMO-FOLDER UPPER 811B “SCH-811,PC,BLK,-,-” GH72-00285A 3 - MCT-SHIELD GASKET “SCH-800B,GASKET(SHIELD),30X34XT0.7,GRY,-” GH74-00011A 3 - MPR-TAPE UPPER “SCH-800B,TESA 983,8X8XT0.15,TRP,-” GH74-00031A 3 - MPR-TAPE DECORATION “SCH-800,TESA4965,16.9x23xT0.2,” GH74-10772A 2 - MEC-FOLDER LOWER 811B “SCH-811,PCL,BLK” GH75-00143A 3 - NPR-BRACKET FOLDER “SPH7000,C5210S-1/2H,T0.5,NI” GH71-10722A 3 - NPR-BRACKET FOLDER R “SPH7000,C5210S-1/2H,T0.5,NI” GH71-10726A 3 - PMO-EARPIECE 811B “SCH-811,PC,BLK,-,-” GH72-00281A 3 - PPR-PC SHEET LCD “SCH-800,PC SHEET T0.6,BLK,-,-” GH72-10545A 3 - PMO-FOLDER LOWER “SCH-800,PC,BLK,-,LEXAN SP-1210” GH72-41804A 3 - MPR-TAPE EAR PIECE “SCH-800,FOAM TAPE,5X4XT0.4,BLK,-” GH74-00005A SAMSUNG Proprietary-Contents may change without notice 8-15 Level Design LOC ITEMS DESCRIPTIONS SEC.CODE 3 - MPR-SPONGE EAR PIECE “SCH-800B,PE SPONGE,8X11XT0.5,WHT,-” GH74-00029A 3 - MPR-SPONGE LCD “SCH-800,SPONGE,41.5x38xT1.0,BL” GH74-10774A 3 - MPR-TAPE WINDOW LCD “SCH-800,TESA4965,41.5X38XT0.2,” GH74-10775A 3 - MPR-TAPE VIBRATOR “SCH-800,TESA4965,PI13xT0.2,TRP” GH74-10776A 3 - MEC-HINGE “SCH-800,SEC,BLK” GH75-11337A 4 HINGE SPRING-HINGE “SPH7000,PW2,PI5.0,D0.7,L11.2,-” GH61-70056A 4 HINGE HINGE-CAM “SPH7000,ACETAL,BLK” GH61-80004A 4 HINGE HINGE-SHAFT “SPH7000,ACETAL,BLK” GH61-80005A 4 HINGE HINGE-HOUSING “SCH-800,PC(LEXAN SP-1210R),BLK” GH61-80007A 4 HINGE-ASSY ICT-MAGNET “SCH-800B,ALLOY(AL+NI+CO),(3X15)T1.0,NTR” GH70-00009A 2 - MEC-FRONT COVER “SCH-800,SEC,BLK” GH75-11334A 3 FRONT-COVER PMO-FRONT COVER “SCH-800,PC,BLK,-,LEXAN SP-1210” GH72-41800A 3 FRONT-COVER PMO-REFLECTOR LED “SCH-800,ACRYL,M/WHT,-,-” GH72-41801A 2 - ELA HOU-LCD ASS’Y “SCH-811,SAMSUNG,-,LCD+MOTOR+SPKER,-,-,-” GH96-00798A 1 - MEA REAR-SCH800 “SCH-800,SEC,KOR,BLK,-,-,-” GH97-01432A 2 REAR-COVER LABEL(R)-QUALCOMM “SCH-100F,VINYL,12X6,0.12,TRP” GH68-30846A 2 REAR-COVER MPR-SHIELD TAPE “SCH-800B,CLOTH(SHIELD),30X8XT0.1,GRY,-” GH74-00027A 2 - MEC-REAR COVER “SCH-800,SEC,BLK” GH75-11338A 3 REAR-COVER SPRING-LOCKER “SPH7000,PW2,PI.8,D0.2,4.4,-” GH61-70054A 3 REAR COVER NPR-GROUND PLATE “SCH-800B,C5210-3/4H,T0.1,-” GH71-00010A 3 REAR-COVER NPR-BRACKET ANT “SCH-800,C2801S-1/4H,T0.5,AU(0.” GH71-10742A 3 REAR-COVER PMO-LOCKER BATT “SCH-800,PC,BLK,-,-” GH72-00068A 3 REAR-COVER PMO-REAR COVER “SCH-800,PC,BLK,-,LEXAN SP-1210” GH72-41806A 1 - PAA MAIN-PACKING 811 PCL “SCH-811,PCL,ISRL,-,-,-,-” GH99-02153A 2 - BAG-PE “PE,T0.06,150X300,-” GA69-30508A 2 - PAC-SILICAGEL “SiO2,50x40,5,SKP-816H” GA69-90502A 2 - BAG-LDPE “PELD,T0.06,100X260,SP-RM928” GG69-30517A 2 - LABEL(P)-SHIPPING 811 PCL “SCH-811,CRAFT-PAPER 100G,250X180,-,BRN” GH68-00386A 2 - BOX(P)-MAIN GIFT BOX 811 IS “-,SCH-811,-,171X220X94,-” GH69-00169A 2 - CUSHION-MAIN 811 “SCH-811,-,165X223X90” GH69-00170A 2 - CUSHION—DUMMY MANUAL “SCH-811,SW5,124X208” GH69-00185A 2 - BOX(P)-MASTER MAIN “SPRINT,SCH-2000,DW-3,498X355X2” GH69-11133A 2 - CUSHION-PAD MAIN “SCH-2000,DW-3,483X340XT7” GH69-20666A 2 - CUSHION-PAD SIDE “SCH-2000,DW-3,340X230XT7” GH69-20667A 2 - BAG-STD BATT. “PE,T0.06,70X170,SCH-1011” GH69-30503A 2 - BAG-MANUAL “PP,T0.06,125*280,SCH-1011” GH69-30518A 8-16 SAMSUNG Proprietary-Contents may change without notice 8-2 Desk-top charger part List No Design LOC DESCRIPTIONS SEC CODE 1 C7, C8 Y-CAP 2, 2nF, 20%, 250V 2201-001004 2 C1 X-CAP 100nF, 20%, 250V 2301-001092 3 C2, C3 CAP-FELECTRONIC 10uF, 400V, 85°C 10x16 2401-00 4 C21, C332 CAP-FELECTRONIC 680uF, 16V, 105°C 10x13 2401-003090 5 C23, C33 CAP-FELECTRONIC 220uF, 16V, 85°C 6x11 2401-000804 6 C36 CAP-FELECTRONIC 47uF, 16V, 85°C 5x7 2401-00 7 C6, C41 CAP-FELECTRONIC 10uF, 50V, 105°C 5x11 2401-00 9 F1 FUSE 250VAC, 2A 5x15 BLACK-TUBING 10 LD1, LD2 LED RED/GRN-DUAL 3 (ROUND) 11 BD1 DIODE-BRIDGE 600V, 1A 0402-000003 12 D2, D3 DIODE-FR 1000V, 1A 0402-000012 13 D21, D31, D32 DIODE-SCHOTKY 40V, 1A 0402-000358 14 D30 DIODE-FR 200V, 1.5A/2A 0402-000205 15 D20 DIODE-SCHOTKY 60V, 5A 0402-000467 16 TH1 THERMISTER 5Ω, 10Ø 1404-000128 17 D1 TRANSIENT VOLTAGE 160V, 600W 18 U1 SUPPESSOR TO-220, 700V, 1A 0505-00 19 U26 IC-pemto 35V, 1.5A, DIP-8P 1203-000391 20 U21 IC-SWITCHING 5V, 100mA, TO-92 1203-000542 21 PC1 IC-VOLTAGE REGULATER 120-180%, 200mW 0604-001098 REMARKS 8 3601-001125 0601-00 0402-000124 1404-001083 0403-001028 DIP-4P, ST 0604-000191 22 R21 PHOTO-OOUPLER 51Ω, 2W, 5% 2003-000327 23 R15, R16 R-METAL OXIDE 1/2W, 4.7MΩ, 5% 2009-001039 24 R51 R-SURGE 10KΩ, 25°C 1404-000215 1404-001014 25 VR1, VR2 R-NTC 1KΩ, 1/10W, 30% TOP, TP 2103-000210 26 TNR1 R-SEMIFIX 470V, 2500A, 300V, 3000A 1405-000001 1405-000193 27 J01-15 VARISTOR 0.6*52mm, SDACW 28 R26, R27, R45, R16 WIRE-NO SHEATH 1Ω, 1/4W, 1%, TP 29 R35, R52 R-METAL FILM 47KΩ, 1/8W, 5%, TP 30 R33, R47 R-CARBON FILM 4.7KΩ, 1/8W, 1%, TP 31 CHT009 R-METAL FILM CHT09, 0.8mA, EE1916 ML26-00274A 32 LF1 S/W TRANS UU1014-V, 22mH(MIN) ML29-00023K 33 L22 LINE-FILTER 120uH, 10X5, 0, 40 34 L21 COIL-CHOKE(TROIDAL) 7uH 5X7,5 ML27-00252A 35 C25 COIL-CHOKE (DRUM) 2012, 104K, X7R, 50V 2203-000206 SAMSUNG Proprietary-Contents may change without notice 3811-000545 ML27-00 8-17 No Design LOC DESCRIPTIONS 35 SEC CODE REMARKS 2203-000204 36 C4, C23, C24 CAP-CHIP 2012, 474Z, Y5V, 50V 2203-000922 37 C44 CAP-CHIP 2012, 474K, X7R, 50V 2203-000985 2203-000979 38 C34 CAP-CHIP 2012, 101J, NPO, 50V 2203-002278 39 C5, C7 CAP-CHIP 2012, 103K, X7R, 50V 2203-001458 40 C28, C30, C33, C42, CAP-CHIP 2012, 104Z, Y52, 50V 2203-000192 2203-001604 C43, C45 41 C26 CAP-CHIP 2012, 224K, X7R, 25V 42 U25 u-com u-com, 8bit, SOP-32P 0903-001148 43 U22 IC-OP AMP 28V, 150pA, DUAL 1201-000166 SOP-8P 1201-000167 36V, 1mA, DUAL 1202-000188 SOP-8P 1202-000104 2203-000575 44 U23, U24 IC-COMPERATER 1202-000187 45 Q23 46 Q21, Q22, Q24 47 FET-DUAL 12V, 5A, 0.05 P-CHANNEL SO-8P TR-PNP SOT-23, 60V, 600mA 0501-000462 D33 DIODE-ULTRA HIGH SPEED SOT-23, 80V, 100mW 0407-000114 49 R24, R44 R-CHIP 2012, 620Ω, 1% 2007-000 50 R25 R-CHIP 2012, 680Ω, 1% 2007-000 51 R28, R31, R32, R48, R63 R-CHIP 2012, 10KΩ, 1% 2007-000297 52 R36, R53 R-CHIP 2012, 470KΩ, 1% 2007-000922 53 R34, R51 R-CHIP 2012, 150KΩ, 1% 2007-000 54 R40, R49 R-CHIP 2012, 12KΩ, 1% 2007-000352 55 R61 R-CHIP 2012, 27KΩ, 1% 2007-00 56 R23, R43, R60 R-CHIP 2012, 91Ω, 1% 57 R64, R65, R66, R7 R-CHIP 2012, 470Ω, 1% 2007-00 58 R41 R-CHIP 2012, 4.7KΩ, 1% 2007-000868 59 R37, R54 R-CHIP 2012, 2.4KΩ, 1% 2007-00508 61 R38, R55, R69, R70 R-CHIP 2012, 47KΩ, 5% 2007-000 62 R1, R2 R-CHIP 2012, 10Ω, 5% 2007-000 63 R29, R47 R-CHIP 2012, 2.2KΩ, 5% 64 R30, R42, R68 R-CHIP 2012, 1KΩ, 5% 2007-000 65 R4 R-CHIP 2012, 750Ω, 5% 2007-000 66 R22 R-CHIP 2012, 180Ω, 5% 2007-000 67 R3 R-CHIP 2012, 5.6Ω, 5% 2007-000 0505-001180 48 2007-001677 60 8-18 2007-000493 SAMSUNG Proprietary-Contents may change without notice No DESCRIPTIONS Design LOC SEC CODE REMARKS 68 69 B1, B2 CHIP-BEAD 3x4, CHIP-BEAD 3301-000329 70 CN21 BAIT-CONNENTOR- 4P, 3.0mm ML74-001411 FRONT, REAR 30x9x10 CONNECTOR-C/B 3.9mm, 3(2)P CASE ASS’Y-COVER COVER (1) 71 CON1 72 3711-000203 ML72-00 GATE LABEL (1) BATT HOUSING (1) BATT LOCKER (1) TH+M3x8, BLK (1) 73 CASE ASS’Y-BOTTOM BOTTOM (1), BOMPON (4) ML72-00 74 LABEL, DTC81 30x50x0.15 ML68-0 SCREW-TAP PH+, 2.6x12, BLK 76 PCB-MAIN DTC81 FR-1, loz, 125x64x1.2 77 PWR-CORD 75 (BOTTBM) ML60-00001A ML41-00 ML39-00 78 (U1) HEAT-SINK(U1) 15x13x5x1.0 ML62-00133A 79 (U1) SCREW-TAP)U1) PH+, M3x6 6001-000563 ADHESIVE-SEALANT DC739, 40RTV 0201-001029 80 0201-000303 81 VINIL SACK 170x350x0.05, WHITE 82 SOLDER-WIRE KR-19, S60A, D1.0 83 ALCOHL (CH3)2CHOM 0204-000429 84 FLUX-SOLDER 920-CFX MF02-00020A 0202-000178 0202-000193 0202-000226 85 SOLDER-WIRE D3, 0, Sn60% SAMSUNG Proprietary-Contents may change without notice ML74-00113A 8-19 8-3 Hands-Free Kit Part List No Design LOC DESCRIPTIONS 1 UPPER C/D FOR CRADLE 2 LOWER C/D FOR CRADLE 3 FRAME FOR CRADLE 4 HOLDER SOCKET FOR CRADLE 5 LOCKER FOR CRADLE 6 EJECTOR FOR CRADLE 7 SPRING LOCK FOR CRADLE 8 SPRING EJECT FOR CRADLE 9 HOLDER C/D FOR CRADLE 10 COVER GATE FOR CRADLE 11 SCREW #2 BT 2.6x6B 12 SCREW BM 3x6B 13 SCREW #2 BT 2x8Y 14 CASE CONN UPPER FOR CONNECTOR JACK 15 CASE CONN LOWER FOR CONNECTOR JACK 16 BUTTON PUSH FOR CONNECTOR JACK 17 CURL CORD ASS'Y FOR CONNECTOR JACK 18 CONNECTOR FOR CONNECTOR JACK 19 SPRING PLATE FOR CONNECTOR JACK 20 CABLE DATA ASS'Y HIROCE 15P 21 SCREW #2 FT2x6B 22 CASE UPPER CONTROL BOX CASE 23 CASE LOWER CONTROL BOX CASE 24 BRACKET INSTALL CONTROL BOX CASE 25 RIVET CONTROL BOX CASE 26 HEAT SINK CONTROL BOX CASE 27 SCREW #2 PS 3x6 Y 28 SCREW #2 PS 3x12 B 29 CASE UPPER MICROPHONE 30 CASE LOWER MICROPHONE 31 SPRING FIXING MICROPHONE 32 SCREW #1 FT 2x8 B 33 CABLE MIC 1P+1SCHIELD WIRE+PLUG 34 CUSHION MIC. MICROPHONE 35 MIC CONDENSOR CMP-68(NP) 36 CABLE POWER 4P, RED-BLK-YLW-WHITE 37 LABEL FOR CRADLE 38 LABEL FOR CONTROL BOX 39 LABEL FOR SPEAKER 40 LABEL BAR CODE FOR SERIAL NO. 8-20 SEC. CODE REMARKS SAMSUNG Proprietary-Contents may change without notice No Design LOC DESCRIPTIONS 41 LABEL BAR CODE FOR PRODUCT 42 MANUAL 4-COLOR PRINT 43 POLYBAG 15x27, PE 44 POLYBAG 6x9, PE 45 CABLE TIE 80mm 46 POWER LOG ø6 47 SCREW #1 BT4x16B 48 SCREW PM 4x6B 49 BOX ACCESSORY FOR ACCESSORY ASS'Y 50 UNIT BOX FOR PACKING 51 PACKING PAD FOR PACKING 52 OUTER BOX FOR PACKING 53 CASE FRONT FOR EXTERNAL SPEAKER 54 CASE REAR FOR EXTERNAL SPEAKER 55 HANDLE SPEAKER FOR EXTERNAL SPEAKER 56 BOLT FOR FIXING HANDLE 57 HEX. NUT WITH WASHER 58 SPEAKER LEEWON 9050F 59 SPEAKER WIRE 2P 60 SCREW #1 PT 3x12B 61 LABEL 62 LABEL 3 SORTS SAMSUNG Proprietary-Contents may change without notice SEC. CODE REMARKS 8-21 No Design LOC DESCRIPTION 1 ZD201, ZD202 ZENER DIODE 5.1V 0.5W - DIP 2 ZD1 TVS DIODE P6KE33 - DIP 3 D5, D7, D101, D102 DIODE 1N4148 - DIP 4 D1, D2, D3 DIODE 1N5818 - DIP 5 D100 DIODE SDS7000 - CHIP 6 R278 RESISTOR CH2012 1ohm-J 5% 7 R9 RESISTOR CH2012 91oohm-F 1% 8 R8 RESISTOR CH2012 8.2K-F 1% 9 R3, R13, R131 RESISTOR CH2012 100ohm-J 5% 10 R51, R52, R139, R272 RESISTOR CH2012 220ohm-J 5% 11 R279 RESISTOR CH2012 270ohm-J 5% 12 R137, R138 RESISTOR CH2012 330ohm-J 5% 13 R31, R32, R225, R251, R257, RESISTOR CH2012 1K-J 5% SEC. CODE REMARKS R270 14 R132 RESISTOR CH2012 1.8K-J 5% 15 R213, R217, R228, R229, RESISTOR CH2012 2.2K-J 5% R230, R231 16 R271 RESISTOR CH2012 2.4K-J 5% 17 R1, R7, R112 RESISTOR CH2012 2.7K-J 5% 18 R18 RESISTOR CH2012 3K-J 5% 19 R12 RESISTOR CH2012 3.9K-J 5% 20 R38, R110, R113, R117, RESISTOR CH2012 4.7K-J 5% R119, R268 R275 21 R57, R233, R248 RESISTER CH2012 5.1K-J 5% 22 R5, R10, R17, R20, R23,R27 RESISTER CH 2012 10K-J 5% R30, R33, R41, R44 R45, R46, R55, R56, R100. R104, R108, R109, R111, R115, R116, R120, R122, R123, R124, R135, R201, R202, R203, R204, R205, R207, R208, R210, R211, R212, R215, R252, R253, R254, R255, R258, R260, R266, R270, R274, R276, R114 23 R269 RESISTER CH 2012 560 ohm-J 5% 24 R102 RESISTER CH 3216 10K-J 5% 25 R43 RESISTER CH 3216 12K-J 5% 26 R54, R267 RESISTER CH 3216 10K-J 5% 8-22 SAMSUNG Proprietary-Contents may change without notice No 27 Design LOC DESCRIPTIONS R19, R128, R266 RESISTER CH 2012 12K-J 5% 28 R24 RESISTER CH 2012 15K-J 5% 29 R106, R107, R121, R127, R277 RESISTER CH 2012 18K-J 5% 30 R16, R126 RESISTER CH 2012 22K-J 5% 31 R40, R222, R223, R224 RESISTER CH 2012 27K-J 5% 32 R4, R21, R37, R101, R105 RESISTER CH 2012 33K-J 5% SEC.CODE REMARKS R136, R140, R259, R273 33 R133, R134 RESISTER CH 2012 47K-J 5% 34 R227 RESISTER CH 2012 56K-J 5% 35 R216, R226 RESISTER CH 2012 68K-J 5% 36 R36, R42, R53, R103, R125, RESISTER CH 2012 82K-J 5% R129 R141, R214, R261 37 R26 RESISTER CH 2012 100K-J 5% 38 R39 RESISTOR CH 2012 220K-J 5% 39 R29 RESISTOR CH 2012 1M-J 5% 40 R14 RESISTOR CH 2012 5.6K-J 5% 41 R50 RESISTOR 0.1 ohm/1W-F-DIP 42 L6 RESISTOR 22 ohm/1W-J-DIP 43 VR1 VAR. RESISTOR 0.2 ohm/1W-J-DIP 44 C255, C256 ELEC. CAPACITOR MVR32 5K 45 C257 ELEC. CAPACITOR 0.47UF/50V (5*11)85˚C 46 C15, C204, C205, C206, C259 ELEC. CAPACITOR 2.2UF/16V (5*11)85˚C 47 C104 ELEC. CAPACITOR 10UF/16V (5*11)85˚C 48 C106 ELEC. CAPACITOR 10UF/25V (5*11)85˚C 49 C258 ELEC. CAPACITOR 22UF/35V (5*11)85˚C 50 C207 ELEC. CAPACITOR 47UF/16V (5*11)85˚C 51 C1 ELEC. CAPACITOR 100UF/35V (6.3*11)85˚C 52 C7, C18, C23, C29, C40, ELEC. CAPACITOR 470UF/16V (8*11.5)85˚C C43, C45, C260 53 C4 ELEC. CAPACITOR 470UF/35V (10*18)85˚C 54 C221 TAN. CAPACITOR 4.7UF/16V (5*11)85˚C 55 C32, C101, C105, C107 CERAMIC CAPACITOR CH 2012 B330P-J (330) C108, C109, C110, C111, C112, C111133,, C114, C115, C1116, C117, C118, C119, C201, C202, C215. C216, C217 56 C17 CERAMIC CAPACITOR CH 2012 B470P-K (471) 57 C5, C25, C209, C218, C222, CERAMIC CAPACITOR CH2012 B102-K (102) SAMSUNG Proprietary-Contents may change without notice 8-23 DESIGN LOC No DESCRIPTION SEC. CODE REMARKS C223, C261 58 C250 CERAMIC CAPACITOR CH 2012 B152-K (152) 59 C100 CERAMIC CAPACITOR CH 2012 B103-K (103) 60 C219, C220 CERAMIC CAPACITOR CH 2012 B472-K (472) 61 C2, C3, C6, C13, C14, C16, C22, CERAMIC CAPACITOR CH 2012 B104-Z (104) C24, C26, C30, C31, C41, C42, C44,C46, C103, C120, C121, C2224, C226, C228, C237, C238, C239, C241, C242, C243, C244, C245, C246, C247, C248, C249, C251, C252, C253, C254, R209 62 C208, C213 CERAMIC CAPACITOR CH 2012 B105-Z (105) 63 C263 CERAMIC CAPACITOR CH 3216 B104-Z (104) 64 C262 CERAMIC CAPACITOR CH 2012 B224-Z (224) 65 L2 INDUCTOR (COIL) 220UH (18ø ) 66 L4 INDUCTOR (COIL) 220UH (13ø ) 67 L1 INDUCTOR (COIL) 10UH 68 L3 INDUCTOR (COIL) 20UH 69 J100 CONNECTOR-DATA 20P (RP13A-12RC-20PB) 70 J201 MIC JACK TC38-001-01 71 J203 FOR SPEAKER CONNECTOR-SPEAKER LAD-1140-02 (2 PIN) 72 J1 CONNECTOR-POWERR LAD-1140-04 (4 PIN) 73 Q20, Q21 TRANSISTOR B772-DIP 74 Q1, Q2, Q6, Q11, Q12, Q13, Q14, TRANSISTOR KST2222A - CHIP Q15, Q16, Q100, Q101, Q102, Q103, Q104, Q105, Q107, Q108, Q109, Q110, Q208 75 Q3, Q8, Q106, Q202 TRANSISTOR KST2907A - CHIP 76 Q4, Q5 FET IRF9540 OR 2SJ176 - DIP 77 BT201 X-TAL I2.288Mhz - DIP 78 BT100 RESONATOR 3.58Mhz - DIP 79 U201, U207 IC LM358 - CHIP 80 U202 IC AD1845 - CHIP 81 U204 IC ADSP-2176 - CHIP 82 U205 IC 74111C14D - CHIP 83 U206 IC 93C66 - CHIP 84 U208 IC HEF4051B - CHIP 85 U100 IC PIC6C73 - CHIP 86 U1 IC NJM2360 OR KA34063 - CHIP 8-24 SAMSUNG Proprietary-Contents may change without notice No DESIGN LOC DESCRIPTIONS 87 U4 IC LM2576 - DIP 88 U2 IC LM7805 - CHIP 89 U3 IC LP2951CM 90 U5 IC LM3403 - CHIP 91 U101 IC LM2904 - CHIP 92 S201 SWITCH TACT SWITCH 93 U209 IC TDA1905 - DIP 94 P.C.B No REMARKS SEC. CODE REMARKS SEC. CODE REMARKS MAIN PCB SCH 811 DESIGN LOC DESCRIPTIONS 1 MIC ASS'Y CMP-68 2 SPEAKER ASS'Y 4 ohm 5W 3 POWER CABLE 4 PIN POWER CABLE ASS'Y No SEC. CODE DESIGN LOC DESCRIPTIONS 1 RESISTOR CH 2012 330 ohm-J 5% 2 RESISTOR CH 2012 2.2K-J 5% 3 RESISTOR CH 2012 1K-J 5% 4 CONNECTOR WAFER 13 PIN 2mm PITCH ANGLE 5 CONNECTOR WAFER 15 PIN 2mm PITCH ANGLE 6 PHOTO INT. SG215 - DIP 7 THERMOSTOR C103JF4C (10K 1%) 8 LED (LED TACK) KARG138 (5 , 3 COLOR) 9 COILD CORD CABLE 13 PIN 2mm PITCH ANGLE 10 DATA CABLE 15 PIN 2mm PITCH ANGLE 11 P.C.B SUB PCB SCH-811 SAMSUNG Proprietary-Contents may change without notice 8-25 8-4 Travel charger No DESIGN LOC DESCRIPTIONS 1 U2 IC OPTP 2 U1 IC PWM P/S TOP222P 3 U4 IC V.REF TO -92 KA431AZ SEC. CODE REMARKS LTV817V TLP621GRH TL431ACLP KIA431 4 D1, 2, 3, 4 DIODE REC 1N4007 5 D21 DIODE SCHOTKY SR560 SR560 6 D7, 20 DIODE SW RLS4148 7 D5 T.V.S DIODE P6KE160A P6KE1600A 8 D6 DIODE UF 9 D24 DIODE ZENER RLZJ4.3 10 LED LED CONNECTOR 352111-0310 11 LED 12 MOV1 UF40007 UF4007 ALL-153GW VARISTOR D62Z0V300RA65 M.O.V TNR12G471K RG06P102 13 VR1 SEMI-FIXEED RES 14 L1, 2 INDUCCTOR 15 PTF1 SGH500 TRANS 16 L20 CHOKE ASS'Y 17 R4, 5 SURGE RESISTOR PPSR0.5W 18 C1, 2 CAP EL SHL400V10UF 19 C22 CAP EL KMF16V330UF 20 C21 CAP EL AG10V1000UF 21 C4, 20, 24 CAP EL 1SK1C476M05007 22 C8 CE. CAP 440DL472 23 C3 CE. CAP ECSL3A220K06BS5 24 C6 MY. CAP S/M2A152J 25 TH THERMISTOR FTG-310H37 26 F1 MICRO FUSE MST 27 SK2 CONN. HEADER 5267-04A 28 Q7 S.S. TR KTA1273 29 R2 CHIP RESI MCR18EZHJ6R2 30 R14, 15, 16 CHIP RESI MCR18EZHF1R0 31 JP1, 2, 3 CHIP RESI MCR18EZHJ0R0 SCH500 SDE472M CR180R0JM 8-26 SAMSUNG Proprietary-Contents may change without notice DESIGN LOC DESCRIPTIONS 32 R66, 67 CHIP RESI 33 JP4, 5 CHIP RESI MCR10EZHJORO 34 R57 CHIP RESI MCR10EZHF1501 SEC. CODE REMARKS MCR18EZHJ511 CR18511JM CR10150FM 35 R58 CHIP RESI MCR10EZHF2201 CR102201FM 36 R17 CHIP RESI MCR10EZHJ470 CR10470JM 37 R1 CHIP RESI MCR18EZHJ103 CR18103JM 38 R59 CHIP RESI MCR10EZHJ102 39 C23 CHIP CAPACITOR CM21COG331J50AT 40 C5 CHIP CAPACITOR CM316Y5V224Z50AT 41 C25, 26, 27, 28, 29, 30 CHIP CAPACITOR CM21Y5V104Z50AT 42 U3 IC HYBRID AH1504F 43 MICOM IC PIC16C711 44 P.C.B TC30 45 AC PLUG ASS'Y 46 PLUG TERMINAL 47 CONTACT TERMINAL 48 CONTACT TERMINAL 49 CASE BOTTOM 50 CASE TOP 51 SCREW 52 SCREW 53 OUTPUT CABLE ASS'Y 54 LABEL 55 CARTON BOX 56 MAIN BOARD 57 CARD BOARD(A) 58 CARD BOARD(B) 59 PAD 60 VINYL SACK AXR324100201 SAMSUNG Proprietary-Contents may change without notice 8-27 8-5 CLA Parts List No Design LOC DESCRIPTIONS SEC CODE REMARKS MAIN SMD ASS'Y 1 C6, C9 CERAMIC CAPACITOR CL21B04JBNCS/0.1U 2 C3 CERAMIC CAPACITOR CL21B103JBNCS/0.01U 3 C5, C10 CERAMIC CAPACITOR CL21B224JBNCS/0.22U 4 D7 CHIP DIODE KDS181 5 D5, D6 CHIP DIODE KDS184 6 R21 CHIP RESISTOR RC1608J102CS/1K OHM 7 R111, R12, R22, R34 CHIP RESISTOR RC1608J104CS/100K OHM 8 R31 CHIP RESISTOR RC1608J134CS/130K OHM 9 R33 CHIP RESISTOR RC1608J182CS/1.8K OHM 10 R15 CHIP RESISTOR RC1608J222CS/2.2K OHM 11 R29 CHIP RESISTOR RC1608J272CS/2.7K OHM 12 R35 CHIP RESISTOR RC1608J304CS/300K OHM 13 R13 CHIP RESISTOR RC1608J333CS/33K OHM 14 R14 CHIP RESISTOR RC1608J335CS/3.3M OHM 15 R5 CHIP RESISTOR RC1608J392CS/3.9K OHM 16 R16, R17 CHIP RESISTOR RC1608J431CS/430 OHM 17 R27 CHIP RESISTOR RC1608J432CS/4.3K OHM 18 R6, R24 CHIP RESISTOR RC1608J562CS/5.6K OHM 19 R7, R18, R19, R20, CHIP RESISTOR RC1608J912CS/9.1K OHM R26, R28, R30, R32 20 Q3, Q5, Q7, Q9, Q10, Q11 CHIP TRANSISTOR KSR1104/NPN 21 Q4, Q8 CHIP TRANSISTOR KSR2104 22 Q1, Q6 CHIP TRANSISTOR KTA1504 INSERT ASS'Y 23 J1 7 PIN CONNECTOR GILS-7P-S2T2-EF 24 L1 CHOKE COIL RF-300/300UH 25 D2, D4 SCHOTTKY DIODE 1N5819 26 D1 TRANSIENT DIODE P6KE36A 27 U4 DIODE KA431 28 C7 ELECT CAPACITOR CESSL1C100MAAT/10U16V 105˚C 29 C2, C4 ELECT CAPACITOR CESSL1C331MAAT/330U16V 105˚C 30 C1 ELECT CAPACITOR CESSX1V101MAAT/100U35V 105˚C 31 F1 FUSE 250V/2A 32 U1 ADJUST REGULATOR I.C. LM2576T-ADJ 33 U2 O.P AMP KA358D 34 U3 O.P AMP(14P) KA324D 35 LED 1, 2 DUALL COLOR LED LAMP SAM3270 36 R4 CARBON FILM RESISTOR 0.5 OHM 11/2W 37 R2 CARBON FILM RESISTOR 11K OHM 1/4W 8-28 SAMSUNG Proprietary-Contents may change without notice No Design LOC DESCRIPTIONS 38 R1 CARBON FILM RESISTOR 470 OHM 1/4W 39 R3 CARBON FILM RESISTOR 680 OHM 1/4W 40 VR1 V. RESISTOR 1K OHM/VOLUME/GF06P 41 CURL CORD ASS'Y 7 PIN/MQ179 42 CLA PCB FR-4 (T=1.6) 43 OUTER GND 1.68PIE/25MM 44 WIREJUMPER PC/BLACK 45 UPPER COVER PC/BLACK 46 LOWER COVER PC/BLACK 47 FUSE COVER CLA OUTER SPRING 48 OUTER SPRING CLA POWER CONTACT 49 POWER CONTACT CLA 50 SPRING FUSE HOLDER/CLA 51 FUSE HOLDER FUSE PLATE/CLA 52 FUSE PLATE TAPPING SCREW +PH (2.6x14-2S) BLACK 53 UPPER+LOWER NAME LABEL CLA010A SEC. CODE REMARKS ELECTRIC ASS’Y PACKING ASS’Y 54 HANISHELLL 55 OUT BOX CARTON BOX 56 CURRUGATED PAD CLA CORRUGATED PAD 57 CLA SPONGE SAMSUNG Proprietary-Contents may change without notice 8-29 9. PCB Diagrams 9-1 Cellular Phone 9-1-1 Main PCB - LOGIC B'D 9-1 Cellular Phone 9-1-2 Main PCB - LOGIC B'D 9-1 Cellular Phone 9-1-3 Main PCB - RF B'D 9-1-4 LCD FPC 9-2 Desk-Top rapid Charger PCB Top View Bottom View 9-3 Hands-Free kit 1 PCB Top View Bottom View 9-4 Cradle 1 PCB Top View 9-5 TC PCB Top View Bottom View 9-6 CLC PCB Top View Bottom View Main Block Diagram SCH - 811 BLOCK DIAGRAM 3.6V BATTERY DC/DC 550mAh 1000mAh 1600mAh Regulator 3.3V Regulator 3.3AV Regulator 3.3BBA Regulator 3.3VT Regulator 3.3VRC 3.7V CONV. COMBINATION MEMORY 8M FLASH + 2M SRAM FLASH MEMORY 8M FLASH EEPROM 256K BITS 1st RF 2nd RF SAW FILTER Driver Amp SAW FILTER 130.38 MHz IF AGC AMP I PA D/A CONV. USER INTERFACE 80186 16BIT CPU Q & 824~894 MHz Filter PLL & VCO DUPLEXER 10-1 LCD & KEY Interleaver MOD. & Encoder Vocoder A/D CONV. 1ST LO SYNTH & (966.87+/12.5 MHz) MIC PCM CODEC & Filter SPK VCO RF SAW FILTER RF AMP IF BPF DEMOD IF AGC AMP A/D CONV. I LNA Q 869~894 MHz 85.38 MHz Deinterleaver & Decoder EXT Vocoder I/F & EVRC Filter FM DATA PROCESSOR FM AUDIO PROCESSOR 10-2 Desk-Top rapid Charger Block Diagram C-C Input Line Rectifier Rectifier Filter & Flate & Flate Filter C-V FET-S/W Control Front-out 4.2V/0.8A Snubber u-com Rectifier & Flate Reference Switch | LED Over-voltage protection Display LED-controller Controller charging control O.C.P O.V.P | Thermal protection Feedback Buck Converter Filter C-C C-V Control FET-S/W Rear-out 4.2V/0.4A 10-3 Hands-Free kit 1 Block Diagram STABILITY CIRCUIT POWER (10V~28V) POWER CONTROL REGULATOR 5V (RESET CIRCUIT) DC/DC REGULATOR CURRENT DETECTOR VOLTAGE/ CURRENT FEEDBACK IGNITION MICOM CRADLE DATA COMMUNICATION EEPROM DSP Tx AMP CALIBRATION CODEC Rx AMP MICROPHONE VOLUME CONTROL AUDIO AMP SPEAKER 10-4 Travel Charger Block Diagram 1 2 3 4 5 6 7 8 9 10 11 12 14 13 15 16 A A R105 CD FM_CLK FM_STB FM_RX_QD FM_RX_ID 100 MSM 100 +3.3V : E6, F5, J5, K6, E9, F10, J10, K9 R182 R181 DGND : E7, E8, F6, F7, F8, F9, G5, G6, C106 100pF 100pF 10K C151 1000pF C152 100pF R183 Q_OFFSET +3.3V C104 2.2K C103 220pF 1K +3.3V 470pF 1000pF +3.3V C183 C184 C185 0.01uF 0.01uF 0.01uF 0.01uF P10 A12 U102 6 5 17 26 +3.3V R117 1K VCC VCCP VLR+ VLR- VCCA BZ GND GNDP GNDA LO B11 19 16 15 14 18 42 C115 + C117 C116 21 8 36 0.01uF 0.1uF 1U/10V(R) TP1 M10 1K R120 +3.3V 2 1 F MMBT2222A A0 A1 A2 GND VCC NC SCL SDA R124 8 7 6 5 R121 15K 24LC256 B5 C7 A7 A8 C8 B9 C9 D9 MUX_CTL SCL SDA D110 3 C208 R218 2 1 4 3 150 C207 SVC_LED 2 R216 22K C119 1 0.01uF SML-020MLT C162 R126 ALT_LED OPEN M4 R129 DP_TX_DATA DP_RX_DATA 1 100 P5 R130 V_DC M3 470 M5 C123 C122 C121 TP2 N5 1U/10V A6 JACK_S A3 L101 Q103 6 5 4 BATT D1 D2 D3 D4 S G 1 2 3 + C125 33U/6.3V(B) 1 2 3 4 5 6 7 8 C127 0.01uF 100K R136 10K Q104 1UF VDD VS LL_ DR DMAX_SS DS COMP PGND UVLOSET FB NI COSC VREF ROSC GND ENABLE 1 2 3 4 (1608) 16 15 14 13 12 11 10 9 D1 S1 S1-1 G1 D2 S2 S2-2 G2 100K 8 7 6 5 C129 R150 C132 100U/6.3V(B) 0.1uF 0.1uF 3 1 DTC144EE 4 5 +3.3AV VCC INB INA OUTGND 4 1 2 3 4 ADC_IN0 1 DGND1 DGND2 DGND3 DGND4 R145 47K 6.8K D104 DA204UT R146 100K 100K V_F R122 R123 1.2K 10K(1%) LRS1306 C211 0.1uF D124 3 R230 2 DSP_RESET_ D126 25 26 19 23 31 30 28 X102 SSR27.00B-C15 CKO TDO M12 P8 L7 52 9 63 21 27 D +3.3V TC4W53F PCM_DOUT R213 13K C181 H2 R225 33 R212 33 IMD_CTL ADC_SEL1 ADC_SEL0 ADC_IN0 TRK_LO_ADJ 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 0 MODE_SEL _IDLE _SLEEP CHIPX8 C166 R222 OPEN BUZZ_ OPEN VBAT VBAT R190 C_RX_QD(3) C_RX_QD(2) C_RX_QD(1) C_RX_QD(0) C_RX_ID(3) C_RX_ID(2) C_RX_ID(1) C_RX_ID(0) TX_CLK _TX_CLK CHIPX8 PA_ON 100K C164 U111 4 C_RX_ID(3) C_RX_ID(2) C_RX_ID(1) C_RX_ID(0) MUX_CTL V_DC ADC_EN ADC_DATA ADC_CLK TX_IQ_D(7) TX_IQ_D(6) TX_IQ_D(5) TX_IQ_D(4) TX_IQ_D(3) TX_IQ_D(2) TX_IQ_D(1) TX_IQ_D(0) 8 7 6 5 LED_ON R221 OPEN L2 H1 H4 E U112 COMMON VDD CH0 INH CH1 VEE A VSS Q123 C2 B1 C1 F4 F3 F2 F1 C J104 +3.3V G4 G3 G2 G1 14 51 10 1 _PCS6 J2 J1 H3 J4 K1 K2 J3 L1 IBF2_PIBF IBF1 DO1 11 TCK TMS RSTB TRST CKI2 CKI TDI 1 2 3 4 CO_DIN MMBT2222A 1K L11 2 TCXO_4 TC7S04F C_RX_QD(3) C_RX_QD(2) C_RX_QD(1) C_RX_QD(0) 0.01uF PLL_CLK PLL_DATA PLL_EN SYN_EN RX_AGC_ADJ 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 F +3.3V TX_AGC_ADJ LOCK ADC_EN ADC_DATA ADC_CLK Q_OFFSET I_OFFSET G FM_RX_ID FM_RX_QD FM_CLK FM_STB TCXO_4 TX_IQ_D(7) TX_IQ_D(6) TX_IQ_D(5) TX_IQ_D(4) TX_IQ_D(3) TX_IQ_D(2) TX_IQ_D(1) TX_IQ_D(0) _TX_CLK SPK- TX_CLK H HEADER30X2 SPK+ +3.3V A10 D1 M2 LCD_CS D130 SM05 _SLEEP _IDLE 4.7K MODE0 MODE1 MODE2 B2 C3 D4 I_OFFSET D3 Q_OFFSET D2 2 1 4 5 6 D129 D111 CD RI D135 RTS KEY_0 V_F KEY_1 C_F 1 2 3 SMS05C UP F4 DOWN F1 F2 F3 SMS05C SEND CLR J110 100K 100K END/P 1 2 3 4 5 6 RX_AUDIO DGND C_F DGND TX_AUDIO DGND DP_RX_DATA DP_TX_DATA HP_PWR RI CD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 V_F DGND RTS BATT BATT CTS DTR DGND C_F V_F BATT 3 2 4 5 KEY_2 J103 R173 D125 +3.3V R211 22K M14 L12 N14 R175 D123 CO_DOUT 9 NC1 36 NC2 IACK OBE2_POBE OBE1 18 TRAP 12 INT1 13 INT0 7 DI1 EL_EN 100K D122 _LWR _RD N12 3 C133 D121 NC U115 DSP1627SS 58 OCK2_PCSN 57 DO2_PSTAT 56 SYNC2_PBSEL 55 ILD2_PIDS 53 OLD2_PODS _PCS6 C156 100pF V_DC R174 D120 OLD1 OCK1 ICK1 ILD1 SYNC1 SADD1 DOEN1 C170 C171 0.01uF 0.1uF J105 0.1uF 1000pF 5 C158 0.01uF MBM29LV800T R189 22K N13 R172 BATT 2 3 4 5 62 61 60 3 C155 0.1uF 22 VSS1 25 VSS2 +3.3V VOL_KEY 10U/6.3V(R) 7 R210 47K AD(15) AD(14) AD(13) AD(12) AD(11) AD(10) AD(9) AD(8) AD(7) AD(6) AD(5) AD(4) AD(3) AD(2) AD(1) AD(0) 37 36 35 34 C_RX_QD(0:3) 1 2 3 SCAN_0 KEY_3 SCAN_1 R149 23 18 16 14 35 33 31 29 19 17 15 13 34 32 30 28 VEC3_IOBIT4 VEC2_IOBIT5 VEC1_IOBIT6 VEC0_IOBIT7 7 8 9 * 0 H D127 NNYG101TS R177 C167 100K 1500P J LCD_CONN_22 C161 0.1U C222 0.1U C200 C202 C198 C197 C163 100K I 47P 0.1U 47P 47P 0.1U 47P 47P 47P 47P 47P 47P 47P 47P 47P 470P 47P C201 Engineer: CDMA2 Drawn by: JB-KIM R&D CHK: IFCON 100K 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 LCD_CS _RESET A(1) DGND AD(7) D112 AD(6) AD(5) 1 SMS05C AD(4) AD(3) AD(2) AD(1) AD(0) 6 DGND +3.3V +3.3V SPK+ SPKMOTOR EL_EN 0.1U C194 C192 C190 C196 C187 C188 C186 C191 C195 C193 C199 K COMPANY NAME Address City Size: A3 TITLE: R178 R168 51 V_F_CON R169 51 R170 51 R171 51 B R188 2 0.01uF 10K 0 _RD _LWR _RAM_CS 12 37 RY_BY* 21 _BYTE 11 _RESET +3.3V R186 _RESET VCC DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 24 _OE 26 _CE 10 _WE R187 TX_IQ_D(0:7) SCAN_0 SCAN_1 SCAN_2 SCAN_3 SCAN_4 SCAN_5 SCAN_6 V_DC Q101 DTA144EE C118 GND A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 1 TC7W04FU R176 1 3 31 _SWE 44 _SCE 9 _SOE _FRP _RESET 0.1U R148 100K AD(15) AD(14) AD(13) AD(12) AD(11) AD(10) AD(9) AD(8) AD(7) AD(6) AD(5) AD(4) AD(3) AD(2) AD(1) AD(0) 100 4.7K 2SC4081BR 27 A(19) A(18) A(17) A(16) A(15) A(14) A(13) A(12) A(11) A(10) A(9) A(8) A(7) A(6) A(5) A(4) A(3) A(2) A(1) R185 10K 38 39 20 3 2 1 4 5 6 7 8 40 41 42 43 46 45 44 27 +3.3AV 29 C_RX_ID(0:3) R147 +3.3V K 11 _KEYSENSE4 + C138 MIC5205-3.3BM5 C221 R144 Q107 LCD_CS _SLEEP _IDLE GPIO7 5 VIN VOUT GND CONT BYP C137 TC7S32FU 3 C_RX_QDATA3 C_RX_QDATA2 C_RX_QDATA1 C_RX_QDATA0 _RFR +3.3AV 150K 2 _CTS 10U/6.3V(R) R153 HP_PWR C_RX_IDATA3 C_RX_IDATA2 C_RX_IDATA1 C_RX_IDATA0 470pF R142 68K(1%) 1 2 3 _GP_WR GPIO_INT1 C135 0.1U U107 U116 GPIO17 + C136 MIC5219-3.3BM5 C220 R141 100K(1%) 0.1uF TX_IQDATA7 TX_IQDATA6 TX_IQDATA5 TX_IQDATA4 TX_IQDATA3 TX_IQDATA2 TX_IQDATA1 TX_IQDATA0 TAMN1 5 VIN VOUT GND CONT BYP 28 _RD _FOE _ROM_CS 26 _FCE _LWR 10 _FWE M11 R223 1 150K 15K C128 CHIPX8 TCXO_4 TX_CLK _TX_CLK 2 +3.3V U106 1 2 3 R152 A(19) A(18) A(17) A(16) A(15) A(14) A(13) A(12) A(11) A(10) A(9) A(8) A(7) A(6) A(5) A(4) A(3) A(2) A(1) A(0) U114 U110 MSM2300BGA RESET_ VCC GND MAX809S C130 100pF R139 R135 100K GPIO_28 GPIO22 ADC_ENABLE ADC_DATA ADC_CLK U108 RN1104 R138 J _DT_R GPIO21 ON_SW_SENSE 2 22K SI9161 56K _PCS6 GPIO20 Q106 3 UPS5819 + C131 _ROM_CS _RAM_CS _EEPROM_CS GPIO13 R151 V_DC D109 SI6803 _LWR TMS TCK TDO TDI _TRST GPIO14 GPIO15 GPIO16 M6 GPIO19 P9 GPIO_INT0 +3.3V C139 U105 R134 PS_HOLD DC_DC_CON 10uH MCL4148 0.1uF SI3443 I D107 R137 100 C126 _HWR M9 _RESIN P11 RESOUT 33K SMS05C VBAT WDOC_STB P4 DP_TX_DATA L5 DP_RX_DATA 470pF 100pF 100pF 470pF C120 R127 +3.3V 4 C210 47P C180 _RD 5 2 FR2S2025-052500 22K 3 2 6 S1 R215 3 22K M8 R133 1 Q124 2SA1576 R132 +3.3V 100 D128 39K 1 R131 DTR CTS R214 D11 C12 B13 B14 D12 C13 E10 C14 E12 D13 E11 D14 F12 E13 E14 F11 G12 F14 F13 G14 _WP_ROM RTS WDOG_EN 100 IMD_CTL U114 TC7W04FU +3.3V 2 XTAL_OUT L9 GPIO_INT2 P2 PDM1 P3 PDM2 REED_SW 2 47P 47K BATT 4.7K DTC144EE C209 P6 R217 Q125 3 47P +3.3V SVC_LED 47P 150 R220 G A9 N6 DTC144EE XTAL_IN B6 GPIO8 D7 GPIO9 B7 GPIO10 B8 GPIO11 D8 GPIO12 Q126 +3.3V MOTOR OPEN SSR27.00B-C15 1K PLL_DATA PLL_CLK PLL_EN V_F_CON ADC_SEL0 ADC_SEL1 SYN_EN PLL_DATA PLL_CLK PLL_EN V_F_CON ADC_SEL0 ADC_SEL1 SYN_EN MODE_SEL H N11 R125 DTA144EE 1K L10 X101 U104 3 R128 2 P12 10K +3.3V 3 Q121 M13 P13 K10 N7 GPIO24 N10 GPIO_INT4 N4 RINGER L6 GPIO18 SEND_END RX_AUDIO BUZZ_ A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 B12 PCM_SCS B10 AUX_PCM_CLK C10 AUX_PCM_SYNC D10 AUX_PCN_DIN A11 AUX_PCM_DOUT +3.3AV 41 E 1 2 3 4 PCM_CLK M7 GPIO23 P7 GPIO25 N8 GPIO26 L8 GPIO27 MODE_SEL DSP_RESET_ ST5092TQ Q120 PCM_SYNC +3.3V R116 1 PCM_DOUT 1 C169 0.1uF SPK+ SPK- VFR+ VFR- C11 Q119 MMBT2222A 47 45 42 40 37 35 33 30 46 43 41 39 36 34 32 29 I_O15 I_O14 I_O13 I_O12 I_O11 I_O10 I_O9 I_O8 I_O7 I_O6 I_O5 I_O4 I_O3 I_O2 I_O1 I_O 6 3 2 20 10 24 25 1 2 0.1uF R155 R113 5.6K 1M CO CI CS CCLK 38 MIC3+ 37 MIC3- C112 1SS226 R250 4.7 DX DR FX MCLK 31 MIC2+ 30 MIC2- C168 0.1uF D102 A13 34 MIC1+ 33 MIC1- 3 12 FVPP 14 _FWP 5 OPEN 0.1uF 13 SVCC 38 FVCC 3 C204 OPEN C111 FA18 FA17 SA17_FA16 SA16_FA15 SA15_FA14 SA14_FA13 SA13_FA12 SA12_FA11 SA11_FA10 SA10_FA9 SA9_FA8 SA8_FA7 SA7_FA6 SA6_FA5 SA5_FA4 SA4_FA3 SA3_FA2 SA2_FA1 SA1_FA0 SA0 4 + C203 47P 1UH(X) 10U/6.3V(R) C109 0.1uF C205 47P L105 1.5K + C110 6 2.7K +3.3AV TX_AUDIO C206 R115 +3.3AV 100K 5 R114 R111 C108 PCM_DIN 4 2 4 5 3 1 GPIO_INT3 1 TC75W56FU 33U/6.3V(B) D _WP_ROM CO_DOUT PCM_SYNC PCM_CLK PCM_DOUT CO_DIN SEND_END JACK_S 2 8 1 7 4 VCC AOUT BOUT GND 15 16 48 1 2 3 4 5 6 7 8 17 18 19 20 21 22 23 25 24 A(19) A(18) A(17) A(16) A(15) A(14) A(13) A(12) A(11) A(10) A(9) A(8) A(7) A(6) A(5) A(4) A(3) A(2) A(1) A(0) AD(15) AD(14) AD(13) AD(12) AD(11) AD(10) AD(9) AD(8) AD(7) AD(6) AD(5) AD(4) AD(3) AD(2) AD(1) AD(0) 3 AA+ B+ B- SMS05C 2 3 5 6 G11 G13 H14 H13 H12 H11 J14 J13 J12 J11 K14 K13 K12 K11 L14 L13 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 U103 R109 120K R110 43K J102 R112 OPEN 0.1uF R224 1K U109 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 VDDA IOBIT3_PB7 IOBIT2_PB6 IOBIT1_PB5 IOBIT0_PB4 SADD2_PB3 DOEN2_PB2 DI2_PB1 CK2_PB0 VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSSA C134 D101 SM05 SYNTH_LOCK PA_ON PA_R0 RA_R1 LNA_RANGE TRK_LO_ADJ TX_AGC_ADJ RX_AGC_ADJ 39 40 41 42 44 45 46 47 C5 B4 D5 A4 C6 A5 D6 200K R108 1K BATT K4 L4 L3 N1 N2 N3 K3 M1 +3.3AV LNA_GAIN ALE NMI MIC +3.3V FM_RX_CLK E2 FM_RX_STB E1 FM_RX_QDATA E3 FM_RX_IDATA E4 U101 AD(7) AD(6) AD(5) AD(4) AD(3) AD(2) AD(1) AD(0) PCM_CLK PCM_SYNC A(0:19) 1 8 17 22 33 43 49 59 32 C182 WSYMCLK_GPIO29 N9 MASKDATA_GPIO30 K5 22K 4.7K R154 AD(0:15) 100pF R107 A2_KEYSENSE0 C4_KEYSENSE1 B3_KEYSENSE2 E5_KEYSENSE3 J111 +3.3V 100pF 20K 8200pF C100 0.01uF +3.3V C154 10K STOP R103 R102 C102 R101 C101 R100 C153 1K 15 1K TRK_LO_ADJ TX_AGC_ADJ RX_AGC_ADJ C C159 0.01uF R184 PA_ON B C160 1000P I_OFFSET 1K G7, G8, G9, G10, H5, H6, H7, H8, H9, H10, J6, J7, J8, J9, K7, K8 R104 VDD1 VDD2 VDD3 VDD4 VDD5 VDD6 VDD7 VDD8 VDD9 C105 LOCK +3.3V 6 16 20 24 38 48 50 54 64 R106 RI KEY_0 LED_ON DOC CTRL CHK: 100K KEY_1 SCH-811 LOGIC KEY_2 MFG ENGR CHK: 16 1 12 A L L Changed by: Date Changed: CDMA2 1 2 3 4 5 6 7 8 9 10 11 1999.02.12 12 Time Changed: 9:02:31 am 13 REV: QA CHK: 14 Drawing Number: 15 Page: 1 16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A A +3.3VRC C340 100P R332 3 R334 1 2 4 36K + 5 R335 43K C355 0.047U U314 LMV821 R333 56K C389 BLM11A102S 3.3U/6.3V(R) 1 C300 0.047U C398 4700P 3 C301 1000P Q300 2SC4081BR IMD_CTL 100P F300 DFA0836G0881A 4 10 TXOUTPUT C304 7P D R323 OPEN R330 1K L305 39N(X) R325 2K L304 100P C307 5P 4 Q301 BFP196W C311 100P L306 8P C321 R305 1 C316 100P C312 L350 3 15N(W) Q302 BFP420 2 2 OUT ~OUT C388 470P L312 390N(X) 9 4 C327 10 5 1000P C397 OPEN 6 7 8 _FMIF NC IFCON GND1 GND2 GND3 GND4_IFCON L315 OPEN 470N(X) 10 RXIF C333 470P R326 OPEN 9 _RXIF D C334 470P C335 OPEN OPEN(X) F303 SAFC85.380ME35X 100K +3.3VRC C C330 RF2617 L314 R308 47N(W) 5 8 3 6 11 12 RX_AGC_ADJ 1K 13 14 15 _CDIF VCC1 VCC2 4 FMIF VCC3 4700P MODE_SEL R309 16 2 C328 1 2 3 C323 1000P 7 CDIF IN_SEl GC L313 120N(X) SW395 1 6 G1G2G3G4G5G6 B L316 470N(X) +3.3VRC C339 0.1UF R301 R300 C337 100P C342 100P U310 2 L322 5.6N(W) U309 R321 100 C345 1 V_DC CTL BYP GND 2 10uF/6.3V(R) 2 F 10uF/6.3V(R) 4 C356 0.01UF R310 47K G _SLEEP C357 4700P C346 1P U306 LMX2332L +3.3VRC C393 100P VCC 19 20 C349 100P OUT GND1 GND2 GND3 GND4 GND5 3 C347 10U/6.3(R) VT 4 R318 16 1 R316 0 C351 2 5 6 7 8 3900P C350 100P R317 16 4 R314 0 C353 56P R315 5.1K J300 PLL_CLK PLL_DATA PLL_EN SYN_EN RX_AGC_ADJ 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 C352 0.22U/6.3(R) U311 C354 C382 0.1U 0.01UF +3.3BBA +3.3V 3 TX_AGC_ADJ LOCK ADC_EN ADCDATA ADCCLK Q_OFFSET I_OFFSET VOUT CTL VIN BYP GND 2 1 R327 0 C386 0.033U C384 4 4700P R328 910 5 3 6 8 13 16 DO_RF _RX_IN GND1 _IFIN IFIN GND2 GND3 DOIF GND4 GND5 C362 100P TCO-555 3 OUT VC GND GND1 GND2 1 2 5 6 TRK_LO_ADJ H C381 0.01U VCC 4 L328 R399 BLM11A102S 150 +3.3BV C365 C366 100P 0.01U C348 10U/6.3V(R) I C383 10P PLL_CLK PLL_EN PLL_DATA C387 C367 C369 C370 0.01UF 100P 100P 100P TCXO +3.3VRC U313 NTH5G36B103J01TE C385 3.3U/6.3V(R) C378 0.01UF R322 47K 1 +3.3VT U312 C374 MIC5205-3.3BM5 1 V_DC RXIFMDATA RXQFMDATA FM_CLK RXFMSTB TCXO_4 TXD(7) TXD(6) TXD(5) TXD(4) TXD(3) TXD(2) TXD(1) TXD(0) U305 C363 100P R313 10 7 RX_IN TCXO_IN RX_IF_IN R329 0 VDC_R RX_IF_DO 2 14 15 17 1 18 11 12 10 9 MIC5205-3.3BM5 5 VIN VOUT 5 10U/6.3V(R) 2 C372 0.01U C373 100P J TEMPO C371 0.01U R324 6.2K C375 10uF/6.3V(R) C379 4700P 4 BYP BUZZ_ 4 2 BUZZ GND 2 CTL 3 _IDLE K Engineer: CDMA2 Drawn by: JB-KIM 3 C376 4700P 1 RXQD(3) RXQD(2) RXQD(1) RXQD(0) RXID(3) RXID(2) RXID(1) RXID(0) TXCLK TXCLK_ CHIPX8 PA_ON VIN C317 R320 0 U307 VC-3R3A30-0967 L321 BLM11A102S H BUZZ_ V_DC V_DC VBAT VBAT VOUT 4 6 R319 10 MRFIC0916 MODE_SEL _IDLE _SLEEP L325 BLM11A102S 5 C396 10U/6.3V(R) 1P 4 1 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 C359 0.01UF L309 BLM11A102S MIC5205-3.3BM5 C399 100P U308 STH-01R IMD_CTL ADC_SEL1 ADC_SEL0 ADC_IN0 TRK_LO_ADJ L317 BLM11A102S C360 4700P 10 C341 AT-32011 3 C361 1000P 3 4 2 L320 8.2N(W) TX_1ST_LO VDC_R U304 C358 10U/6.3V(R) 3 100P G 1 R311 L318 OPEN(W) C344 C380 0.1U R395 68K 1 E +3.3VRC C395 4700P 3 4 5 6 C343 0.01UF C336 0.047U 2 R394 100 L319 8.2N(W) F304 FAR-F5CE-967M00-K286 C338 3P 1 2 C313 0.1U DTC144EE 3 MODE_SEL R396 0 +3.3VRC Q303 R393 OPEN 200 10 ANT K ~IN C332 4700P U303 C324 C325 3P 470P 5 1 v2 out2 L303 C305 22P F J 6 3 2 4 OUT 2 gnd in IN 2 3 4 7 8 9 +3.3VRC L307 18N(X) I 5 1000P 3 v1 out1 1 C508 3P L353 0N(W) G4 6 G3 5 G2 4 G1 3 IN 1 E 1 U300 CMY210 4 C320 6 L323 8.2N(W) 5 12N 4P 10 L311 100N(CY) U301 3P 4 L351 J301 MHC-173 C322 10P 15N(W) 1K 220 33P C368 470P L308 C315 100P R307 F302 FB_G953 3 1 C306 OPEN D301 BAR63-02W F301 FAR-F5CE-881M50-D233 1 2 6.8N(W) 2 L302 6.8N(W) C319 L330 C303 100P 1 C308 OPEN C391 33P C302 8P D300 BAR63-02W C326 100P C310 0 C C331 0.047U L310 R306 12K 100N(X) R398 L326 BLM11A102S C314 0.047U R303 10 C318 4700P C309 0.1U R302 27 2 4 D302 BCR400W C390 4700P L301 47N(W) C329 220P L300 VP VP1 B - VCC VCC1 MODE_SEL 100K +3.3VRC DATA EN CLK FOLD RX_AGC_ADJ R331 1M C364 0.1U D310 DAN202U VDC_R COMPANY NAME Address City R&D CHK: 16 1 12 A SCH-811 RX MFG ENGR CHK: HEADER30X2 Size: A3 TITLE: DOC CTRL CHK: L L Changed by: Date Changed: CDMA2 1 2 3 4 5 6 7 8 9 10 11 1999.02.12 12 Time Changed: 9:02:31 am 13 QA CHK: REV: 14 Drawing Number: 15 Page: 1 16 1 2 3 6 5 4 7 8 9 10 12 11 13 14 15 16 A A U409 4 U401 Q5312I-3S2 64 +3.3BV RXIFMDATA TCXO 63 RXQFMDATA 61 +3.3V TXVCO_T1 RXFMSTB 62 FMCLK 38 5 +3.3BV6 +3.3BV1 10 +3.3BV2 14 51 +3.3BV7 +3.3BV3 48 21 68 TXCLK +3.3BV4 +3.3BV8 49 23 71 TXCLK_+3.3BV5 +3.3BV9TXVCO_T2 75 ADCENA 74 ADCDATA 73 ADCCLK FM_MOD 52 CHIPX8 29 TCXO_4 C TXCLK TXCLK_ ADC_EN ADCDATA ADCCLK CHIPX8 TCXO_4 R447 OPEN TXD(0:7) 47 46 45 44 43 42 41 40 TXD(7) TXD(6) TXD(5) TXD(4) TXD(3) TXD(2) TXD(1) TXD(0) D E PD_OUT TXIQ7 TXIQ6 TXIQ5 TXIQ4 TXIQ3 TXIQ2 TXIQ1 TXIQ0 RXID(0:3) RXID(3) RXID(2) RXID(1) RXID(0) RXQD(3) RXQD(2) RXQD(1) RXQD(0) RXQD(0:3) 56 55 54 53 60 59 58 57 F LOCK _SLEEP MODE_SEL _IDLE I_OFFSET Q_OFFSET G C443 0.01U RXI3 RXI2 RXI1 RXI0 RXQ3 RXQ2 RXQ1 RXQ0 PD_ISET RXVCO_OUT C444 0 C445 0 C403 6P(1%) R404 10K(1%) 0 R409 39K(1%) R405 300(1%) R445 0 C470 0.01U R448 11.3K(1%) C471 0.01U C R408 0 C406 OPEN R410 1.8K R400 C400 10 100P TCXO C407 1000P D C408 1U/10V(R) C410 80 TEMPO C405 2200P R407 19 VBAT 10K(1%) 2 NO3 GND 47K RX_IF_IN GND4 GND5 GND6 GND7 GND8 GND9 GND10 GND11 2 RXVCO_T1 1 28 GND12 4 30 GND13 37 9 GND14 13 39 GND15 20 50 GND16 3 22 67 GND17RXVCO_T2 25 72 GND18 27 C411 R411 68P 10K L402 68N(COI,X) D402 1SV279 C413 6P(1%) RX_IF_DO E D403 1SV279 +3.3VT R412 10K C412 68P R450 0 Q402 C460 10UF R416 0 2SA1576 L403 1UH(X) R417 10K PSV C417 0.1U C419 1000P U402 C442 0.01U NO2 NO1 VCC C420 0.1U C447 3.3U/6.3V(R) C448 100P C421 0.01U 7 F C499 C446 47P C431 1000P C429 0.047uF 3.3U/6.3V(R) C432 L407 100P 22N(TX) R427 51 L406 33N(TX) PA_ON LOCK SLEEP_ FM_ IDLE_ I_OFFSET Q_OFFSET TXIF C422 12 1 1000P TXIF_ R423 1.8K 2 C423 11 OUTX IF_IN IN_INX OUT 5 C468 0.01U R418 0 6 R419 0 U404 C416 1000P 3 GND GCTL U403 L404 120N(X) 8 C424 CXA3222N 2 IF- VCC 1000P 33 NC1 34 NC2 65 NC3 66 NC4 L405 120N(X) RFOUT C425 1000P R446 0 C427 C426 0.01U 100P 1 4 R425 1M 7 2 5 C450 1000P 0.01U C418 18P R444 1 F401 12N(TX) FAR-F5CE-836M50-K205 C461 470P R440 5.1K C462 47P R437 0 + 3 - 2 4 8 C498 3.3U/6.3V(R) C451 0.1U 5 C452 0.01uF C453 4.7uF C409 1000P U408 6 5 4 4 U405 LMV821 R441 12K - 2 VBAT U406 LMV821 D1D2 D3D4 S G 1 5 7 1 2 3 L409 38 68 C439 0.01U C465 10U/6.3V(R) 23 C436 0.1U VREF PIN I VDD1 VDD2 GND4 GND1 9 GND2 GND3 POUT 6 TXOUTPUT C495 OPEN J C435 0.01U C433 OPEN 2 SI3443DV R435 47K +3.3BV C434 100P U407 RI23124U 3 C497 OPEN 4 3 H TX_1ST_LO 5 + C441 8200P G R428 20 L410 +3.3VT 1 20K 3 C438 0.01U R443 2.2K R442 39K C440 0.01U TX_AGC TX_AGC_ADJ 1 GN01037B C430 1000P R421 270K LO_BYPASS 6 GND0 3 GND1 LO 560K 1 C428 100P IF+ R422 TX_AGC FAR-F5CE-836M50-D232 8 R424 430K 51 C449 R420 20 F400 RF2628 +3.3V I 6 RF_IN VDD1 4 VAGC 2 GND1 5 GND2VDD2 100P R426 1K C454 100P J C496 OPEN Q401 DTC114EE PA_ON TX_AGC +3.3BBA BLM11A102S C467 K B ADC_IN0 R449 1 MAX4524 R402 C402 39P R403 10K 5 0 D401 1SV279 16 15 3 47K D400 1SV279 R406 39P L400 33N ADC_SEL1 8 R401 100P 31 GND0 32 GND1 35 GND2 36 GND3 H C401 ADC_SEL0 6 NO0 4 24 77 79 78 70 69 COM ADDB 17 +3.3BBA 7 ADDA 26 18 10 INHIBIT V+ 2 RXIF _RXIF RXIFMDATA RXQFMDATA RXFMSTB FM_CLK 9 76 ADCIN 8 RSSI 1 B 7 RXIF 6 RXIF_ 33UF/6.3V C455 C456 C459 C404 C463 C464 1000P 0.01U 1000P 0.01U 1000P 0.01U +3.3VRC C414 14 C457 C458 1000P 0.01U C437 1000P U410 NTH5G36B103J01TE 10U/6.3V(R) 1 2 C415 0.01UF R451 6.2K R439 1.5K R452 12K K Engineer: CDMA2 Drawn by: JB-KIM R&D CHK: R438 10K C472 0.01U COMPANY NAME Address City Size: A3 TITLE: DOC CTRL CHK: SCH-811 TX MFG ENGR CHK: 16 1 12 A L L Changed by: Date Changed: CDMA2 1 2 3 4 5 6 7 8 9 10 11 1999.02.12 12 Time Changed: 9:02:31 am 13 QA CHK: REV: 14 Drawing Number: 15 Page: 2 16 10-5 Main Circuit Diagram (1/3) Main Circuit Diagram (2/3) Main Circuit Diagram (3/3) LCD FPC Circuit Diagram 10-7 Hands-Free kit 1 Circuit Diagram (data) Hands-Free kit 1 Circuit Diagram (audio) Car Adaptor 1 Circuit Diagram 10-8 Cradle 1 Circuit Diagram 10-9 Travel Charger Circuit Diagram 10-10 CLC (Cigarette Lighter Charger) Circuit Diagram