Download Kinetix 6000M Integrated Drive

Chapter 2
Planning the Kinetix 6000M System Installation
The following items limit the number of IDM units that can be used in a system.
1. The IDM unit control power load, which consists of three load sources:
• internal load (constant)
• parking brake load
• digital input loading.
These items also affect the total control power load:
• The cable lengths between IDM units
• IDM units with brakes and their location in the daisy chain
• IDM units that use digital inputs.
2. The continuous and intermittent load on the DC bus of all AM modules
and IDM units.
IMPORTANT
The Kinetix 6000 or Kinetix 6200 IAM module supplying DC bus power to the
IDM units should be sized to support all IDM units that are connected to the
power rail. Motion Analyzer software (version 6.000 or later) sizing analysis
accounts for control power and DC bus power.
3. The total number of axes that are connected in the safe-off circuit.
IPIM Module Design
Guidelines
Use the information in this section when designing your enclosure and planning
to mount your system components.
For online product selection and system configuration tools, including
AutoCAD (DXF) drawings of the product, refer to 
http://www.rockwellautomation.com/en/e-tools.
System Mounting Requirements
• To comply with UL and CE requirements, the Kinetix 6000M power
interface module must be part of a Kinetix 6000 or Kinetix 6200 system
that is enclosed in a grounded conductive enclosure offering protection as
defined in standard EN 60529 (IEC 529) to IP2X such that they are not
accessible to an operator or unskilled person. A NEMA 4X enclosure
exceeds these requirements providing protection to IP66.
• The panel that you install inside the enclosure for mounting your system
components must be on a flat, rigid, vertical surface that is not subjected to
shock, vibration, moisture, oil mist, dust, or corrosive vapors.
• Size the enclosure so as not to exceed the maximum ambient temperature
rating. Consider heat dissipation specifications for all components.
• Use high-frequency (HF) bonding techniques to connect the modules,
enclosure, machine frame, and motor housing, and to provide a lowimpedance return path for high-frequency (HF) energy and reduce
electrical noise.
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Rockwell Automation Publication 2094-UM003B-EN-P - February 2015