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Contents Contents 1. 2. 3. 4. 5. i Precaution........................................................................................................................................ 1 − 1 1.1. General After-Sales Service Precautions....................................................................................... 1 − 1 1.2. Safety Precautions ................................................................................................................... 1 − 2 1.3. Ground .................................................................................................................................. 1 − 3 1.4. Static Electricity Precautions...................................................................................................... 1 − 4 Introduction ..................................................................................................................................... 2 − 1 2.1. Product Features ...................................................................................................................... 2 − 1 2.2. Specification ........................................................................................................................... 2 − 2 2.3. Comparing product specifications ............................................................................................... 2 − 7 2.4. Function of Product.................................................................................................................. 2 − 8 2.5. New Technology / ability .......................................................................................................... 2 − 14 2.6. Hardware ............................................................................................................................... 2 − 21 2.7. Software ................................................................................................................................ 2 − 27 2.8. Bios Setup .............................................................................................................................. 2 − 29 2.9. HW & Option Materials ............................................................................................................ 2 − 34 Desassembly and Reassembly.............................................................................................................. 3 − 1 3.1. Main System........................................................................................................................... 3 − 1 3.2. TOP A’ssy .............................................................................................................................. 3 − 4 3.3. LCD A’ssy.............................................................................................................................. 3 − 6 Trouble shooting ............................................................................................................................... 4 − 1 4.1. General spec ........................................................................................................................... 4 − 1 4.2. Debugging Flow Chart.............................................................................................................. 4 − 2 4.3. Diagnosis application ............................................................................................................... 4 − 5 4.4. System Diagnosis .................................................................................................................... 4 − 7 4.5. Hardware Troubleshooting ........................................................................................................ 4 − 8 4.5.1. LCD ......................................................................................................................... 4 − 8 4.5.2. Problems related with Power ......................................................................................... 4 − 9 4.5.3. Others ....................................................................................................................... 4 − 11 4.6. CPU FAN Control.................................................................................................................... 4 − 14 4.7. Other..................................................................................................................................... 4 − 16 4.8. H/W Upgrade.......................................................................................................................... 4 − 17 System Wire Diagram ........................................................................................................................ 5 − 1 5.1. System Layout ........................................................................................................................ 5 − 1 5.2. System Component .................................................................................................................. 5 − 3 Copyright© 1995-2012 SAMSUNG. All rights reserved.