Download Goodram 1GB PC-5300
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www.goodram.com GR 667 S2 64 MEMORY MODULE SPECIFICATION L5 1G GOODRAM SPEED / DATA TRANSFER 667MHz / PC2-5300 MODULE TYPE DDR2 SO-DIMM MODULE DATA WIDTH 64 CAS LATENCY 5 MODULE DENSITY 1GB professional memory for everyone DDR II MODULE PART NUMBERING SYSTEM PIN 200 5 4 3 PIN 199 667MHz (2x333MHz) | PC2-5300 533MHz (2x266MHz) | PC2-4200 400MHz (2x200MHz) | PC2-3200 PIN 42 CAS Latency PIN 41 OPERATING FREQUENCY PIN 1 GR667S264L5/1G DDR2 SDRAM SODIMM 1GB 64 64Mx8 16 2 2 NO NO 200 PIN 1,8V YES 128 BYTES 7,8 ms 30,00 16,20 PART NUMBER MODULE TYPE MODULE DENSITY MODULE DATA WIDTH DRAM CHIP ORAGNIZATION NUMBER OF DRAM CHIPS NUMBER OF MODULE RANKS NUMBER OF MODULE SIDES REGISTERED ECC SUPPORT PIN COUNT SUPPLY VOLTAGE SSTL_18 COMPATIBLE PROGRAMMED SPD MEMORY MAX AVG PERIODIC REFRESH INTERVAL PIN 2 FEATURES 4,01 DYNAMIC PARAMETERS FOR 667MHz f1 ,7 8 15 ns 15 ns 7 ns 45 ns 60 ns 105 ns 8 PCB TYPE BOARD DIMENSIONS BOARD THICKNESS DRAM PACKAGE INFORMATION CONTACT PADS (PIN) R0 ,5 2,00 PCB DETAILS 3,48 DDR2 SDRAM SODIMM 67,56 x 30mm ± 0,1mm 1,27mm ± 0,13mm FBGA, x8bit GOLD PLATED GOODRAM logo and GOODDRIVE logo are registered trademarks of Wilk Elektronik S.A. All other trademarks and logos are the property of their respective owners. All products and specifications are subject to change without notice. Rev. 04.12.2007 1 67,56 RAS# TO CAS# DELAY, tRCD ROW PRECHARGE TIME, tRP ROW ACTIVE TO ROW ACTIVE DELAY, tRRD ACTIVE TO PRECHARGE TIME, tRAS ACTIVE TO ACTIVE / AUTO REFRESH TIME, tRC AUTO REFRESH TO ACTIVE / AUTO REFRESH, tRFC DEVICE CYCLE TIME, tCK MAX 6,00 20,00 Wilk Elektronik S.A. Poland, 43-174 £aziska Górne, ul. Miko³owska 42 tel.: 0-32/ 736 90 00, fax: 0-32/ 736 90 01 www.wilk.com.pl l www.goodram.com © Wilk Elektronik S.A. 2007 www.goodram.com MEMORY MODULE SPECIFICATION SPD CONFIGURATION BYTE DESCRIPTION HEX DEC 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 Number of Serial PD Bytes written during module production Total number of Bytes in Serial PD device Fundamental Memory Type (FPM, EDO, SDRAM …) Number of Row Addresses on this assembly Number of Column Addresses on this assembly Number of DIMM Banks Data Width of this assembly Data Width of this assembly Voltage Interface Level of this assembly SDRAM Cycle time at Maximum Supported CAS Latency (CL), CL=X SDRAM Access from Clock DIMM configuration type (Non-parity, Parity or ECC) Refresh Rate/Type Primary SDRAM Width Error Checking SDRAM Width SDRAM Device Attributes: Minimum Clock Delay, Back-to-Back RCA SDRAM Device Attributes: Burst Lengths Supported SDRAM Device Attributes: Number of Banks on SDRAM Device SDRAM Device Attributes: CAS Latency SDRAM Device Attributes: CS Latency SDRAM Device Attributes: Write Latency/DIMM Type Information SDRAM Module Attributes SDRAM Device Attributes: General Minimum Clock Cycle at CL = X - 0.5 Maximum Data Access Time (tAC) from Clock at CL = X - 0.5 Minimum Clock Cycle at CL = X - 1 Maximum Data Access Time (tAC) from Clock at CL = X - 1 Minimum Row Precharge Time (tRP) Minimum Row Active to Row Active delay (tRRD) Minimum RAS to CAS delay (tRCD) Minimum Active to Precharge Time (tRAS) Module Bank Density Address and Command Input Setup Time Before Clock Address and Command Input Hold Time After Clock Data Input Setup Time Before Clock Data Input Hold Time After Clock Write recovery time (tWR) Internal write to read command delay (tWTR) Internal read to precharge command delay (tRTP) Memory Analysis Probe Characteristics Extension of Byte 41 tRC and Byte 42 tRFC SDRAM Device Minimum Active to Active/Auto Refresh Time (tRC) SDRAM Device Minimum Auto Refresh to Active/Auto Refresh (tRFC) SDRAM Device Maximum device cycle time (tCKmax) SDRAM Device Maximum skew between DQS and DQ signals (tDQSQ) DDR SDRAM Device Maximum Read Data Hold Skew Factor (tQHS) Reserved for future use SDRAM Device Attributes - DDR SDRAM DIMM Height Reserved for future use Reserved for future use Reserved for future use Reserved for future use Reserved for future use Reserved for future use Reserved for future use Reserved for future use Reserved for future use Reserved for future use Reserved for future use Reserved for future use Reserved for future use Reserved for future use SPD Revision Checksum for Bytes 0-62 0x80 0x08 0x08 0x0E 0x0A 0xA1 0x40 0x00 0x05 0x30 0x45 0x00 0x82 0x08 0x00 0x00 0x0C 0x04 0x38 0x00 0x04 0x00 0x03 0x3D 0x50 0x50 0x60 0x3C 0x1E 0x3C 0x2D 0x80 0x20 0x27 0x10 0x17 0x3C 0x1E 0x1E 0x00 0x00 0x3C 0x69 0x80 0x18 0x22 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x11 0xB2 128 8 8 14 10 161 64 0 5 48 69 0 130 8 0 0 12 4 56 0 4 0 3 61 80 80 96 60 30 60 45 128 32 39 16 23 60 30 30 0 0 60 105 128 24 34 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 17 178 64-255 Manufacturer’s specific data GOODRAM logo and GOODDRIVE logo are registered trademarks of Wilk Elektronik S.A. All other trademarks and logos are the property of their respective owners. All products and specifications are subject to change without notice. Rev. 04.12.2007 Wilk Elektronik S.A. Poland, 43-174 £aziska Górne, ul. Miko³owska 42 tel.: 0-32/ 736 90 00, fax: 0-32/ 736 90 01 www.wilk.com.pl l www.goodram.com © Wilk Elektronik S.A. 2007 professional memory for everyone