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Thermaltake Xeon 1U Solution High Performance Cooler Intel Xeon 1U Active Solution P/N: A1934 Application for Intel Xeon up to 2.8GHz ReverFlow Fan All Copper Bundle with RM SPECIFICATION Fan Dimension : Heatsink Dimension : Rated Voltage : Started Voltage : Rated Current : Power Input : Fan Speed : Max. Air Flow : Max. Air Pressure: Noise : Bearing Type : Life Expectation : Connector : FEATURES: 70x70x10 mm 89x63.3x12.7 mm 12V 7V 0.45 A 5.40 W 4800 ±10%RPM 30.5 CFM 4.49 mmH2O 36 dBA 1 Ball 1 Sleeve 40,000 Hours 3 Pin - All copper heat sink, Tiny Fin Technology - Different to conventional fan, revised flow. Special design to have much air intake from the internal server. - Bundle with retention module -Tool-free clip, easy installation DIMENSION THERMAL PERFORMANCE CHIP TEMPERATURE(Tc) RISE ABOVE AMBIENT -℃ 50 40 30 20 10 0 0 10 20 30 40 50 60 70 HEAT DISSIPATED - WATTS 2 Unit: mm www.thermaltake.com [email protected] . REVISION A. 2003.10
