Download Intel Pentium 4 641

Contents
Contents
1
Introduction.................................................................................................................................... 9
1.1
1.2
2
Electrical Specifications ............................................................................................................. 13
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
3
Package Mechanical Specifications ................................................................................... 33
3.1.1 Package Mechanical Drawing ............................................................................... 33
3.1.2 Processor Component Keep-Out Zones................................................................ 37
3.1.3 Package Loading Specifications ............................................................................ 37
3.1.4 Package Handling Guidelines................................................................................ 37
3.1.5 Package Insertion Specifications ........................................................................... 38
3.1.6 Processor Mass Specification................................................................................ 38
3.1.7 Processor Materials ............................................................................................... 38
3.1.8 Processor Markings ............................................................................................... 38
3.1.9 Processor Land Coordinates ................................................................................. 39
Land Listing and Signal Descriptions ....................................................................................... 41
4.1
4.2
5
FSB and GTLREF............................................................................................................... 13
Power and Ground Lands................................................................................................... 13
Decoupling Guidelines........................................................................................................ 13
2.3.1 VCC Decoupling .................................................................................................... 14
2.3.2 FSB GTL+ Decoupling........................................................................................... 14
2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 14
Voltage Identification .......................................................................................................... 15
2.4.1 Phase Lock Loop (PLL) Power and Filter .............................................................. 17
Reserved, Unused, FC and TESTHI Signals...................................................................... 18
FSB Signal Groups ............................................................................................................. 19
GTL+ Asynchronous Signals ..............................................................................................20
Test Access Port (TAP) Connection ................................................................................... 21
FSB Frequency Select Signals (BSEL[2:0]) ....................................................................... 21
Absolute Maximum and Minimum Ratings ......................................................................... 22
Processor DC Specifications ..............................................................................................22
VCC Overshoot Specification ............................................................................................. 29
2.12.1 Die Voltage Validation ........................................................................................... 30
GTL+ FSB Specifications....................................................................................................30
Package Mechanical Specifications .......................................................................................... 33
3.1
4
Terminology ........................................................................................................................ 10
1.1.1 Processor Packaging Terminology ........................................................................ 10
References ......................................................................................................................... 11
Processor Land Assignments ............................................................................................. 41
Alphabetical Signals Reference .......................................................................................... 64
Thermal Specifications and Design Considerations................................................................ 73
5.1
5.2
Datasheet
Processor Thermal Specifications ...................................................................................... 73
5.1.1 Thermal Specifications .......................................................................................... 73
5.1.2 Thermal Metrology ................................................................................................. 77
Processor Thermal Features ..............................................................................................77
5.2.1 Thermal Monitor..................................................................................................... 77
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