Download Intel Celeron T1700

Contents
1
Introduction .............................................................................................................. 7
1.1
Terminology ....................................................................................................... 8
1.2
References ......................................................................................................... 9
2
Low Power Features ................................................................................................ 11
2.1
Clock Control and Low Power States .................................................................... 11
2.1.1 Core Low-Power States ........................................................................... 12
2.1.2 Package Low-Power States ...................................................................... 13
2.2
Low-Power FSB Features .................................................................................... 15
2.3
Processor Power Status Indicator (PSI#) Signal..................................................... 15
3
Electrical Specifications ........................................................................................... 17
3.1
Power and Ground Pins ...................................................................................... 17
3.2
FSB Clock (BCLK[1:0]) and Processor Clocking ...................................................... 17
3.3
Voltage Identification ......................................................................................... 17
3.4
Catastrophic Thermal Protection .......................................................................... 20
3.5
Reserved and Unused Pins.................................................................................. 20
3.6
FSB Frequency Select Signals (BSEL[2:0])............................................................ 21
3.7
FSB Signal Groups............................................................................................. 21
3.8
CMOS Signals ................................................................................................... 23
3.9
Maximum Ratings.............................................................................................. 23
3.10 Processor DC Specifications ................................................................................ 24
4
Package Mechanical Specifications and Pin Information .......................................... 29
4.1
Package Mechanical Specifications ....................................................................... 29
4.2
Processor Pinout and Pin List .............................................................................. 33
4.3
Alphabetical Signals Reference ............................................................................ 53
5
Thermal Specifications and Design Considerations .................................................. 61
5.1
Monitoring Die Temperature ............................................................................... 61
5.1.1 Thermal Diode ....................................................................................... 62
5.1.2 Thermal Diode Offset .............................................................................. 64
5.1.3 Intel® Thermal Monitor........................................................................... 65
5.1.4 Digital Thermal Sensor............................................................................ 66
5.1.5 Out of Specification Detection .................................................................. 67
5.1.6 PROCHOT# Signal Pin ............................................................................. 67
Datasheet
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