Download 8106 type ME Data Sheet

Table of Contents
1
SYSTEM DESCRIPTIONS ..................................................................................................................................... 6
1.1
1.2
1.3
1.4
2
MECHANICAL SPECIFICATIONS ..................................................................................................................... 8
2.1
2.2
2.3
2.4
3
DC/RF CHARACTERISTICS FOR IEEE 802.11B ..................................................................................................... 14
DC/RF CHARACTERISTICS FOR IEEE 802.11G ..................................................................................................... 15
DC/RF CHARACTERISTICS FOR IEEE 802.11N ..................................................................................................... 16
ENVIRONMENTAL SPECIFICATIONS ........................................................................................................... 17
5.1
5.2
6
TYPICAL POWER CONSUMPTION........................................................................................................................... 13
RF SPECIFICATIONS .......................................................................................................................................... 14
4.1
4.2
4.3
5
MODULE DIMENSION .............................................................................................................................................. 8
MODULE TOP AND SIDE VIEW ................................................................................................................................. 8
MODULE FOOTPRINT (TOP VIEW) ............................................................................................................................ 9
MODULE PIN-OUT................................................................................................................................................. 10
DC ELECTRICAL SPECIFICATIONS .............................................................................................................. 13
3.1
4
APPLICATIONS ........................................................................................................................................................ 6
MODULE SUMMARY ............................................................................................................................................... 6
BLOCK DIAGRAM ................................................................................................................................................... 7
ACRONYMS............................................................................................................................................................. 7
ABSOLUTE MAXIMUM RATINGS ............................................................................................................................ 17
RECOMMENDED OPERATING CONDITIONS ............................................................................................................ 17
APPLICATION INFORMATION........................................................................................................................ 18
6.1 EXTERNAL DIGITAL INTERFACES .......................................................................................................................... 18
6.1.1
Reference connection for UART host interface .......................................................................................... 18
6.1.2
Reference connection for the SPI host interface ........................................................................................ 19
6.2 RECOMMENDED HOST (CUSTOMER) CIRCUIT BOARD PCB PATTERN ..................................................................... 20
6.3 HOST PCB LAYOUT RECOMMENDATIONS ............................................................................................................. 20
6.4 MODULE LOCATION ............................................................................................................................................. 21
6.4.1
Location in x-y plane .................................................................................................................................. 22
6.4.2
Location in z-plane ..................................................................................................................................... 22
7
ASSEMBLY INFORMATION ............................................................................................................................. 23
7.1
8
LEAD-FREE SOLDERING REFLOW PROFILE ............................................................................................................. 23
PACKAGING AND MARKING INFORMATION ............................................................................................ 24
8.1
8.2
CARRIER TAPE DIMENSIONS ................................................................................................................................. 24
MODULE MARKING INFORMATION ....................................................................................................................... 24
9
ORDERING INFORMATION ............................................................................................................................. 25
10
ROHS DECLARATION ........................................................................................................................................ 25
11
REGULATORY INFORMATION ....................................................................................................................... 25
11.1
11.2
11.3
11.4
11.5
11.6
FCC NOTICE (USA) ........................................................................................................................................ 25
FCC LABELING REQUIREMENTS ...................................................................................................................... 26
RF EXPOSURE .................................................................................................................................................. 26
IC NOTICE (CANADA) ...................................................................................................................................... 26
IC LABELING REQUIREMENTS ......................................................................................................................... 27
CE NOTICE (EUROPE) ...................................................................................................................................... 27
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SN8200 User Manual and Datasheet v1.2