Download (Final Report)

ECE 477 Final Report
Spring 2006
4.3 Action Recommended
The project group feels that there is not any infringement because by not moving the image
sensor the processing is much simpler. There is no correction for the different image that will be
received after moving the image sensor in the project. This simplicity represents a substantial
change in the implementation. Also, by not moving the camera the functionality of the project is
different from the patented devices. The project can not view a moving object for as long as the
patented devices because of its fixed field of view. There is still some potential for infringement
because the differences between the project and the patented products could be argued obvious to
someone trained in the art. The project group recommends only moving the laser to avoid
infringing on existing patents. If the camera were to move with the laser there would be much
more of a chance for literal infringement.
5.0
Reliability and Safety Analysis
To better understand the overall reliability of the entire design without an exhaustive analysis
of each individual component, a focused approach is used to examine a few of the critical
components which are most likely to fail. Chosen based on complexity and operating
temperature, four devices are selected for this analysis and their failure rates will be quantified
by procedures developed by the United States Department of Defense and detailed in the MILHDBK-217F [9]. The selected components are summarized in Table 5.1 below.
Part Number
Description
Part Failure Rate (λp)
MTTF
MC9S12DP512
Microcontroller, 16-bit, 112
5.376 Failures/
186011.9048 Hours
pin SMT
106 Hours
(21.234 years)
Step Down DC-DC Converter,
5.868 Failures/
170415.8146 Hours
8 pin DIP
106 Hours
(19.454 years)
CMOS Image Sensor, 16-bit,
4.671 Failures/
214086.9193 Hours
48 pin SMT
106 Hours
(24.439 years)
24 Character LCD Display
2.92 Failures/
342465.7534 Hours
Controller, 8-bit, 80 pin SMT
106 Hours
(39.094 years)
LTC1174-5
OV6620
PC 1202-A
Table 5.1 – Selected Reliability Analysis Components
-10-