Download DATASHEET TiWi-uB2 Bluetooth Module

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Transcript 
TiWi-uB2 Module
DATASHEET
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
The information in this document is subject to change without notice.
330-0100-R1.2
Copyright © 2012-2014 LSR
Page 21 of 33
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