Download Specification for Production - Panasonic Industrial Devices Europe

CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
Wireless M-Bus Module PAN7550
Thema
CUSTOMER PART NUMBER
PANASONIC PART NUMBER
PAN7550
ENW59620(2)xyCF
No.
REV.
DS-7550-0868-102
D
PAGE
Seite
15 of 27
DATE
13.03.2010
Datum
18. LABELING DRAWING
Kennzeichnung des Moduls durch Label
This label is suitable for reflow soldering and designed for the engineering sample status.
Information in the 2D-Barcode are the date code in the format Year-Month-Day [6 signs, here
081211], serial number [7 signs, here 0000000], ordering number [8 signs; without ENW and F,
please refer also to chapter 25], the identifier for the hardware release [2 signs, here yy], the
identifier for the software release [2 signs, here zz] and the ES, separated by a semicolon.
ES stands for Engineering Samples, please refer to chapter General Information.
In mass production status, the ES will be eliminated.
The point on the label (below left) is the identifier for pin 1 of the module.
As a summary:
xy
Number 9 and 10 from the ordering code, please refer to chapter 25
yy
Identifier for the hardware version
zz
Identifier for the software version
19. MECHANICAL REQUIREMENTS
Mechanische Anforderungen
No.
Item
Punkt
1
Solderability
Lötfähigkeit
2
Resistance to
soldering heat
Limit
Grenzwerte
More than 75% of the soldering area shall be
coated by solder
Mehr als 75% der Lötfläche soll mit Lötpaste
bedeckt sein.
Must satisfy electrical requirements and not
have mechanical damage
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
EUROPE GmbH
APPROVED
genehmigt
Condition
Bedingung
Reflow soldering with
recommendable temperature
profile
Please refer to chapter 15.2.
CHECKED
geprüft
DESIGNED
erstellt