Download A700x family Secure authentication microcontroller

A700x family
NXP Semiconductors
Secure authentication microcontroller
5. Ordering information
Table 3.
Ordering information
Type number[1]
A7001agUA/...
Package
Name
Description
Version
FFC
8 inch wafer (sawn; 150 m thickness; on film frame carrier;
electronic fail die marking according to SECSII format)
not applicable
HVQFN32
plastic thermal enhanced very thin quad flat package; no leads,
32 terminals; body 5  5  0.85 mm
SOT617-1
A7002agUA/...
A7003agUA/...
A7004agUA/...
A7005agUA/...
A7006agUA/...
A7001agHN1/...
A7002agHN1/...
A7003agHN1/...
A7004agHN1/...
A7005agHN1/...
A7006agHN1/...
[1]
a = A or C, g = G, C or A, according to the A700x family type classification, see Section 1.2 “A700x family naming conventions”
5.1 Ordering options
Table 4 gives an overview of available A700x family product types
Table 5. shows JCOP features.
Table 4.
A700x family feature table
Product type[1] Operational
ambient
temperature
Free EEPROM data space
Transient Embedded OS
Heap
(RAM)
Interface option
A7001Cgpp(p)
25 C to +85 C
76.4 kB
3.2 kB
JCOP 2.4.2 R1
I2 C
A7002Cgpp(p)
40 C to +90 C
76.4 kB
3.2 kB
JCOP 2.4.2 R1
I2 C
A7003Cgpp(p)
25 C to +85 C
76.4 kB
3.2 kB
JCOP 2.4.2 R1
I2C, ISO/IEC 7816
A7004Cgpp(p)
40 C to +90 C
76.4 kB
3.2 kB
JCOP 2.4.2 R1
I2C, ISO/IEC 7816
A7005Cgpp(p)
25 C to +85 C
76.4 kB (MIFARE Config A)
3.2 kB
JCOP 2.4.2 R1
I2 C
75.4 kB (MIFARE Config B1)
ISO/IEC 7816
72.4 kB (MIFARE Config B2)
A7006Cgpp(p)
[1]
40 C to +90 C
76.4 kB (MIFARE Config A)
ISO/IEC 14443 A
3.2 kB
JCOP 2.4.2 R1
I2 C
75.4 kB (MIFARE Config B1)
ISO/IEC 7816
72.4 kB (MIFARE Config B2)
ISO/IEC 14443 A
g = G, C, or A; pp(p) = UA or HN1, according to the A700x family type classification, see Section 1.2 “A700x family naming conventions”
A700X_FAM_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 5 July 2013
202031
© NXP B.V. 2013. All rights reserved.
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