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Service Guide Specification 1. Model Description MODEL L1750S-SNN L1950S-SNN SUFFIX ANUSQG 2. LG BRAND Product Name FLATRON L1750S FLATRON L1950S 담 당 LEE H.J 05.01.06 KIM J.O 05.01.06 Part No. 3828TSL096P Printing Specification .ne t 1. Trim Size (Format) : 215mm x 280 mm jel 2. Printing Colors • Cover : LG COLORS • Inside : Black .w 3. Stock (Paper) • Cover : Snow White 150 g/㎡ • Inside : Snow White 100 g/㎡ Special Instructions //w (1) Origin Notification ww 4. Printing Method : 5. Bindery : Saddle stitch 6. Language : English 7. Number of pages : 28 ( Including blank 1page) 3. * LGEDI : Printed in Indonesia * LGESP : Printed in Brazil * LGENT : Printed in China 8 7 6 5 4 Changes * LGEWA : Printed in U.K. * LGEMX : Printed in Mexico * LGEIL : Printed in India htt p: 4. 3 2 1 REV. NO. 관 리 자 MM/DD/YY SIGNATURE CHANGE NO. CHANGE CONTENTS P/NO.3828TSL096P Total pages : 28pages English English English English English blank 2 3 4 …. ….. Rear cover Inside English English English English English …. 22 23 24 25 Rear Cover .ne Front cover Inside 26 htt p: //w ww .w jel Cover t Pagination sheet Website:http://biz.LGservice.com E-mail:http://www.LGEservice.com/techsup.html .ne t COLOR MONITOR SERVICE MANUAL CHASSIS NO. : CL-82 L1750S (L1750S-SNN.AN**QF) L1950S (L1950S-SNN.AN**QF) ( jel MODEL: ) **Same model for Service .w CAUTION htt p: //w ww BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. *To apply the Genesis ZAN3SL Chip. -1- //w htt p: t .ne jel .w ww CONTENTS SPECIFICATIONS ................................................... 2 PRECAUTIONS ....................................................... 3 TIMING CHART ....................................................... 7 DISASSEMBLY ....................................................... 8 BLOCK DIAGRAM ................................................... 9 DESCRIPTION OF BLOCK DIAGRAM...................10 ADJUSTMENT ...................................................... 12 SERVICE OSD ...................................................... 13 TROUBLESHOOTING GUIDE .............................. 14 WIRING DIAGRAM ............................................... 18 EXPLODED VIEW...................................................19 REPLACEMENT PARTS LIST ...............................21 SCHEMATIC DIAGRAM ......................................... 23 : 185(min), 250(Typ) 2-3. Contrast Ratio : 300(min), 450(Typ)-L1750S : 300(min), 500(Typ)-L1950S htt p: 2-2. Luminance 3. SIGNAL (Refer to the Timing Chart) 3-1. Sync Signal • Type : Separate Sync, SOG (Sync On Green) 3-2. Video Input Signal 1) Type 2) Voltage Level a) Color 0, 0 b) Color 7, 0 c) Color 15, 0 3) Input Impedance H/V SYNC VIDEO POWER CONSUMPTION LED COLOR jel MODE ON/ON ACTIVE POWER ON (NORMAL) less than 43 W-L1750S : R, G, B Analog : 0~0.71 V : 0 Vp-p : 0.467 Vp-p : 0.714 Vp-p : 75 Ω GREEN less than 45 W-L1950S STAND-BY OFF/ON OFF less than 1 W AMBER SUSPEND ON/OFF OFF less than 1 W AMBER DPMS OFF OFF/OFF OFF less than 1 W AMBER 6. ENVIRONMENT 6-1. Operating Temperature: 10°C~35°C (50°F~95°F) (Ambient) 6-2. Relative Humidity : 10%~80% (Non-condensing) 6-3. MTBF : 50,000 HRS wiht 90% Confidence level Lamp Life : 50,000 Hours (min) 7. DIMENSIONS (with TILT/SWIVEL) L1750S Width : 368 mm (14.49'') Depth : 230.5 mm (9.07'') Height : 389.2 mm (15.32'') L1950S Width Depth Height : 413 mm (16.26'') : 230.5 mm (9.07'') : 421.4 mm (16.59'') 8. WEIGHT (with TILT/SWIVEL) L1750S Net. Weight : 4.9 kg (10.80 lbs) Gross Weight : 6.5 kg (14.33 lbs) L1950S Net. Weight Gross Weight 3-3. Operating Frequency Horizontal : 30 ~ 83kHz Vertical : 56 ~ 75Hz 4. Max. Resolution Analog .ne 5-2. Power Consumption Right : +70° min., +80°(Typ) Bottom : -75°min., -85°(Typ) //w L1950S Left : -70° min., -80°(Typ) Top :+75° min., +85°(Typ) 5-1. Power : AC 100~240V, 50/60Hz , 1.0A ww 2. OPTICAL CHARACTERISTICS 2-1. Viewing Angle by Contrast Ratio ≥ 10 L1750S Left : -60° min., -70°(Typ) Right : +60° min., +70°(Typ) Top :+45° min., +60°(Typ) Bottom : -50°min., -60°(Typ) 5. POWER SUPPLY .w 1. LCD CHARACTERISTICS Type : TFT Color LCD Module Active Display Area : 17 inch diagonal-L1750S : 19 inch diagonal-L1950S Pixel Pitch : 0.264 (H) x 0.264 (V)-L1750S : 0.294 (H) x 0.294 (V)-L1950S Size : 358.5 (W) x 296.5 (H) x 17.0 (D)-L1750S : 404.2 (W) x 330 (H) x 22.0 (D)-L1950S Color Depth : 16.2M colors Electrical Interface : LVDS Surface Treatment : Hard-coating(3H), Anti-Glare Operating Mode : Normally White, Transmissive mode Backlight Unit : 4-CCFL(Cold Cathode Fluorescent Lamp) t SPECIFICATIONS : 1280 x 1024 / 75Hz -2- : 5.7 kg (12.57 lbs) : 7.9 kg (17.42 lbs) PRECAUTION WARNING FOR THE SAFETY-RELATED COMPONENT. WARNING • If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms. • Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire. t • Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee. BE CAREFUL ELECTRIC SHOCK ! .ne • There are some special components used in LCD monitor that are important for safety. These parts are marked on the schematic diagram and the replacement parts list. It is essential that these critical parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard. Leakage Current Hot Check Circuit TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT. • Must mount the module using mounting holes arranged in four corners. To Instrument's exposed METALLIC PARTS .w • Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen. jel AC Volt-meter ww • Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel. • Protect the module from the ESD as it may damage the electronic circuit (C-MOS). • Make certain that treatment person’s body are grounded through wrist band. //w • Do not leave the module in high temperature and in areas of high humidity for a long time. • The module not be exposed to the direct sunlight. htt p: • Avoid contact with water as it may a short circuit within the module. • If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.) CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation. -3- 1.5 Kohm/10W Good Earth Ground such as WATER PIPE, CONDUIT etc. SERVICING PRECAUTIONS .ne t Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) htt p: //w ww .w General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. d. Discharging the picture tube anode. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage. 4. Do not spray chemicals on or near this receiver or any of its assemblies. 5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 9. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. jel CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. -4- Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). .ne t "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. jel Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. .w General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500。F to 600。F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500。F to 600。F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500。F to 600。F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. //w ww c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. htt p: IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. -5- htt p: //w t ww .w 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. .ne At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges. jel Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. -6- TIMING CHART VIDEO A E D B SYNC .ne t C << Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >> 4 5 6 7 8 9 10 11 12 13 – H – V H + – V – H – V H – + V + H + V + H +/– V +/– H – V – H – V – H +/– V +/– H +/– 25.175 28.321 25.175 31.5 40.0 49.5 57.283 65.0 78.75 Total Period Video Active Time (E) (A) 31.469 800 640 70.09 449 350 31.468 900 720 70.08 31.469 449 800 400 640 59.94 525 37.5 840 75 37.879 500 1056 60.317 46.875 75.0 49.725 V +/– H + V + H + V + 100.0 92.978 108.0 135.0 Front Porch (C) Sync Duration (D) 16 96 jel + V Frequency Back Porch (F) 48 37 2 60 18 108 54 12 16 2 96 35 48 480 10 2 33 640 16 64 120 480 800 1 40 3 128 16 88 628 600 1 4 23 1056 800 16 80 160 625 600 1 3 21 1152 832 32 64 224 .w 3 H Dot Clock ww 2 Sync Polarity //w 1 H/V Sort 74.55 667 624 1 3 39 48.363 1344 1024 24 136 160 60.0 806 768 3 6 29 60.123 1312 1024 16 96 176 75.029 800 768 1 3 28 68.681 1456 1152 32 128 144 75.062 915 870 3 3 39 61.805 1504 1152 18 134 200 htt p: Mode 65.96 937 900 2 4 31 63.981 1688 1280 48 112 248 60.02 1066 1024 1 3 38 79.976 1688 1280 16 144 248 75.035 1066 1024 1 3 38 -7- Resolution 640x350 70Hz 720x400 70Hz 640x480 60Hz 640x480 75Hz 800x600 60Hz 800x600 75Hz 832x624 75Hz 1024x768 60Hz 1024x768 75Hz 1152x900 75Hz 1152x900 65Hz 1280x1024 60Hz 1280x1024 75Hz DISASSEMBLY #1 t #2 Disassembly Hinge Cover. #4 ww 1. Pull the front cover upward. 2. Then, let the all latches are separated. 3. Put the front face down. .w jel #3 .ne Remove the screws. Disassemble back cover #6 htt p: //w #5 Pell off Al-tape from panel. Remove the 6 screws from each up of metal frame. #7 #8 Remove the 4 screws from each side of metal frame Remove Al-tape from control pcb fix. -8- -9- Power + Inverter LIPS To Key Control D-Sub Analog(R/G/B) 1.8 V 3.3 V 5V ADC 5V BRT-CTL INV-CTL PLL + 5V MCU Regulator t Panel 5V LVDS Switch (System) MOD-ON 5V .ne 1.8 V 3.3 V jel EEPROM (System) LVDS Transmitter .w ww OSD Scaling gmZAN3SL //w htt p: BLOCK DIAGRAM DESCRIPTION OF BLOCK DIAGRAM 1. Video Controller Part. This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 135MHz. This part consists of the Scaler, ADC, LVDS transmitter. The Scaler gets the video signal converted analog to digital, interpolates input to 1280 X 1024 resolution signal and outputs 8-bit R, G, B signal to transmitter. .ne t 2. Power Part. This part consists of the one 3.3V regulator, and one 1.8V regulator to convert power which is provided 12V, 5V in Power board. 5V is provided for LCD panel and Micom. Also, 5V is converted 3.3V by regulator and 3.3V is converted 1.8V by regulator. Converted power is provided for IC in the main board. htt p: //w ww .w jel 3. MICOM Part. This part consists of EEPROM IC which stores control data, Reset IC and the Micom. The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each modes is stored in EEPROM. - 10 - LIPS Board Block Diagram 12V 50 ~ 60Hz EMI COMPONENTS HVDC INPUT RECTIFIER AND FILTER ENERGY TRANSFER 100KHz OUTPUT RECTIFIER AND FILTER 5V GND .ne t LINE 100 ~ 240V PWM CONTROL CIRCUIT SIGNAL COLLECTON PHOTO-COUPLER ISOLATION SECONDARY jel PRIMARY 12V High Voltage output ww .w INVERTER CIRCUIT Operation description_LIPS 1. EMI components. This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse. //w 2. Input rectifier and filter. This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor. htt p: 3. Energy Transfer. This part function is transfer the primary energy to secondary through a power transformer. 4. Output rectifier and filter. This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achive the dc output stablize, and also the over power protection is also monitor by this part. 5. Photo-Coupler isolation. This part function is to feed back the dc output changing status through a photo transistor to primary controller to achieve the stabilized dc output voltage. 6. Signal collection. This part function is to collect the any change from the dc output and feed back to the primary through photo transistor. - 11 - ADJUSTMENT Windows EDID V1.0 User Manual 2. EDID Read & Write 1) Run WinEDID.exe Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Don’t need setup Windows 2000, XP => Need to Port Setup. This program is available to LCD Monitor only. .ne t 1. Port Setup a) Copy “UserPort.sys” file to “c:\WINNT\system32\drivers” folder b) Run Userport.exe .w jel 2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button htt p: e) Click Start button. f) Click Exit button. //w ww c) Remove all default number d) Add 300-3FF - 12 - SERVICE OSD 1) Turn off the power switch at the front side of the display. 2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval. 3) The SVC OSD menu contains additional menus that the User OSD menu as described below. //w ww .w jel .ne t a) Auto Color : W/B balance and Automatically sets the gain and offset value. b) NVRAM INIT : EEPROM initialize.(24C08) c) CLEAR ETI : To initialize using time. d) AGING : Select Aging mode(on/off). e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually. f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually. g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only) i) MODULE : To select applied module. A 9 IBM Compatible PC 11 6 1 6 1 5 C 13 PARALLEL PORT 23 No RS 5V OFF 14 ON LE L F RA L PA 5V Power inlet (required) ON R 220 WE VG CS T PO S MO NI TO R B E 4.7K 74LS06 E ST Switch B F V-Sync On/Off Switch (Switch must be ON.) Figure 1. Cable Connection - 13 - 4.7K 4.7K 5V OFF YN A Power Select Switch (110V/220V) Power LED V-S Control Line C 1 25 2C tu se d htt p: Video Signal Generator 15 10 5 74LS06 TROUBLESHOOTING GUIDE 1. NO POWER NO POWER (POWER INDICATOR OFF) t CHECK J705 VOLTAGE PIN5, PIN6 (5V)? .ne 1 CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE NO YES CHECK U801 PIN 1& U803 PIN 3 VOLTAGE (5V) ? NO CHECK U801. jel 1 .w YES CHECK Q803 PIN 3(3.3V) & U803 PIN 4 (1.8V)? YES //w CHECK KEY CONTROL CONNECTOR ROUTINE IS U201 PIN88 VOLTAGE REPEATED AS PULSE SHAPE ? htt p: 2 CHECK 5VR LINE (OPEN CHECK) ww NO NO YES CHECK IIC LINE CONNECTION (U501, U502) CHECK U201 VCC, XTAL, RESET Waveforms 1 J705-#5, 6 / U801-#1/U803-#3 2 U201-#88 - 14 - NO PROBLEM 2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS NO RASTER (OSD IS NOT DISPLAYED) J705 PIN5, PIN 6 5V? NO t CHECK LIPS .ne 1 YES 4 NO J705 PIN9 2.5V? YES .w NO CHECK MICOM INV ON/OFF PORT. (U501 PIN9) jel 3 YES NO LIPS htt p: //w CHECK PULSE AS CONTACTING SCOPE PROBE TO CAUTION LABEL. (CONTACT PROBE TO CAUTION LABEL. CAN YOU SEE PULSE AT YOUR SCOPE? 1. CONFIRM BRIGHTNESS OSD CONTRL STATE. 2. CHECK MICOM DIM-ADJ PORT(U501 PIN41) ww J705 PIN10 5V? YES REPLACE CCFL LAMP IN THE LCD MODULE Waveforms 1 J705-#5, 6 / U801-#1/U803-#3 3 4 J705-#9 J705-#9 Inverter Off Inverter On Micom Port check Micom Port check J705 Inverter output J705 Inverter output - 15 - 3. NO RASTER (OSD IS NOT DISPLAYED) – gmZAN3SL NO RASTER (OSD IS NOT DISPLAYED) NO U201 POWER PINS 3.3V? t CHECK U803, U801 U201 PIN88 OSCILLATE AS 12MHZ? YES U501 PIN43 IS 64KHz H-SYNC? PIN44 IS 60Hz V-SYNC? IS PULSE APPEARED AT SIGNAL PINS? NO //w YES .w 6 CHECK CONNECTION LINE FROM U201 TO U501 ww 5 1. CHECK PIN88 SOLDERINGCONDITION 2. CHECK X501 3. TROUBLE IN U201 NO jel 2 .ne YES U501 PIN8 5V? NO CHECK 5VR LINE htt p: YES TROUBLE IN CABLE OR LCD MODULE Waveforms 2 U201-#88 5 6 U501-#43 - 16 - U501-#44 4. NO RASTER (OSD IS DISPLAYED) – gmZAN3SL U201 POWER PIN99(1.8V) PIN33(3.3V)? t NO RASTER (OSD IS DISPLAYED) .ne NO CHECK U803, U801 CHECK R,G,B INPUT? U201 PIN 70,74,77 //w YES ww YES CHECK H-SYNC INPUT U201 PIN 95? 1. CHECK PC 2. CHECK SIGNAL CABLE & D-SUB CONNECTOR LINE .w NO jel YES CHECK H-SYNC LINE (D-SUB→U501→U201 PIN95) NO CHECK V-SYNC LINE (D-SUB→U501→U201 PIN96) htt p: CHECK V-SYNC INPUT U201 PIN 96? NO YES TROUBLE IN LCD MODULE - 17 - WIRING DIAGRAM Connector Ass’y P/N htt p: //w ww .w jel .ne t 6631T11012W or 6631T11020W Connector Ass’y P/N: 6631T20023A or 6631T20034M - 18 - Connector Ass’y P/N: 6631T11017X-L1750S 6631T11017Y-L1950S - 19 - 110 020 050 040 //w htt p: 010 070 080 090 t .ne jel .w ww 060 EXPLODED VIEW 030 100 EXPLODED VIEW PARTS LIST Ref. No. Part No. 010 3091TKL143N CABINET ASSEMBLY, L1750S BRAND L122 SILVER PC+ABS,89483 TCO03 US-VER 3091TKL143R CABINET ASSEMBLY, L1750S BRAND L122 SILVER PC+ABS TCO03+12MS FLATRON N-C/SKD 3091TKL144N CABINET ASSEMBLY, L1950S BRAND L123 SILVER PC+ABS,89483 TCO03 3091TKL144Q CABINET ASSEMBLY, L1950S BRAND L123 SILVER PC+ABS 12MS+TCO03, US N-C/SKD 6304FLP110B LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5N5 LG PHILPS TFT COLOR PART NUMBER CHANGE FOR COST COMPENSATION 050 060 LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5K2 LG PHILPS TFT COLOR TI D-IC,250NITS,SXGA,LVDS or 6304FLP110A LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5N5 LG PHILPS TFT COLOR LPL NJ,250NITS,SXGA,LVDS or 6304FLP160A LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5KS LG PHILPS TFT COLOR NEC D-IC,250NITS,SXGA,LVDS LCD(LIQUID CRYSTAL DISPLAY), LM190E03-B4K1 LG PHILPS TFT COLOR 20T,TN,250NITS,SXGA,LVDS LCD(LIQUID CRYSTAL DISPLAY), LM190E03-B4N2 LG PHILPS TFT COLOR B4K1 LPL NJ,20T,TN,250NITS,SXGA,LVDS BACK COVER ASSEMBLY, L1750S L100 PC+ABS 9930(BK) US-VER 3809TKL100G BACK COVER ASSEMBLY, L1750S L100 PC+ABS 9930(BK) ANALOG US-VER E-C/SKD 3809TKL101E BACK COVER ASSEMBLY, L1950S L101 BRAND PC+ABS 9930(BK) US-VER 3809TKL101F BACK COVER ASSEMBLY, L1950S L101 BRAND PC+ABS 9930(BK) US-VER E-C/SKD 3043TKK227A TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BODY 3043TKK227C TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BODY A-C/SKD 3043TKK227B TILT SWIVEL ASSEMBLY, L1950S - TILT STAND BODY. 3043TKK227D TILT SWIVEL ASSEMBLY, L1950S - TILT STAND BODY B-C/SKD 3043TKK228A TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BASE 3043TKK228B TILT SWIVEL ASSEMBLY, LX 50S - TILT STAND BASE A-C/SKD 4951TKS199A METAL ASSEMBLY, FRAME MAIN L1750 LPL-A5 KUMI 4951TKS199B METAL ASSEMBLY, FRAME MAIN L1750 A-C/SKD 4951TKS200A METAL ASSEMBLY, FRAME MAIN L1950 LPL-E03 TN/AUO-EN04-V2 KUMI 6871TPT282C 100 110 METAL ASSEMBLY, FRAME MAIN L1950 LPL-E03 TN/AUO-EN04-V2 A-C/SKD PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 1720 DOCKING,2PIN,450V POWER TOTAL LIEN CHANG PB FREE-L1750S PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 19INCH TN & 1720 DOCKING,2PIN,450V POWER TOTAL LIEN CHANG PB FREE & ANALOG-L1950S MAIN TOTAL ASSEMBLY, L1750SN LPL ZAN3SL BRAND CL-66 htt p: 090 3313TL7087A jel 3809TKL100E 6871TPT282Q 080 .ne 6304FLP142A or 6304FLP184A 4951TKS200C 070 t or 6304FLP194A .w 040 LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5K6 LG PHILPS TFT COLOR LVDS SXGA OKI GATE D-IC ww 030 or 6304FLP086A //w 020 Description 3313TL7087E MAIN TOTAL ASSEMBLY, L1750SN LPL ZAN3SL MX C/SKD BRAND CL-82 LF 3313TL9078A MAIN TOTAL ASSEMBLY, L1950SN LPL ZAN3SL BRAND CL-66 3313TL9078E MAIN TOTAL ASSEMBLY, L1950SN LPL ZAN3SL MX C/SKD BRAND CL-82 LF 4951TKS203A METAL ASSEMBLY, REAR SHIELD LX50 KUMI 4951TKS203B METAL ASSEMBLY, REAR SHIELD LX50 KUMI A-C/SKD 3550TKK740A COVER, L1750 BACK DOOR BRAND 3550TKK740B COVER, L1750 BACK DOOR BRAND A-C/SKD 3550TKK741A COVER, L1950 BACK DOOR BRAND 3550TKK741B COVER, L1950 BACK DOOR BRAND A-C/SKD 6871TST798A PWB(PCB) ASSEMBLY,SUB, L1750 CONTROL TOTAL BRAND KEY 6871TST798C PWB(PCB) ASSEMBLY,SUB, L1750 CONTROL TOTAL BRAND MX C/SKD LF 6871TST911A PWB(PCB) ASSEMBLY,SUB, L1950 CONTROL TOTAL BRAND KEY 6871TST911C PWB(PCB) ASSEMBLY,SUB, L1950 CONTROL TOTAL BRAND MX C/SKD LF - 20 - REPLACEMENT PARTS LIST CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS, READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL. * NOTE : S SAFETY Mark AL ALTERNATIVE PARTS MAIN BOARD CAPACITORS DATE: 2004. 12. 17. DESCRIPTION / SPECIFICATION C832 C833 C834 0CE107EF628 0CK105CD56A 0CC102CK41A "100UF KMG,RD 16V 20% FM2.5 T" 1UF 1608 10V 10% R/TP X7R-L1950S 1000PF 1608 50V 5% R/TP NP0-L1950S DIODEs D701 D702 D706 ZD701 ZD702 ZD703 ZD704 ZD705 ZD711 0DS226009AA 0DS226009AA 0DS226009AA 0DZKE00138A 0DZKE00138A 0DZKE00138A 0DZKE00138A 0DZKE00138A 0DZKE00138A .w 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y "10UF SHL,SD 50V 20% BULK FL" 3PF 1608 50V 0.25 PF R/TP NP 18PF 1608 50V 5% R/TP NP0 0.01UF 1608 50V 10% R/TP B(Y 1UF 1608 10V 10% R/TP X7R 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y 100PF 1608 50V 5% R/TP NP0 100PF 1608 50V 5% R/TP NP0 68PF 1608 50V 5% R/TP NP0 68PF 1608 50V 5% R/TP NP0 1UF 1608 10V 10% R/TP X7R 0.01UF 1608 50V 10% R/TP B(Y 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R 0.01UF 1608 50V 10% R/TP B(Y 0.1UF 1608 50V 10% R/TP X7R-L1750S 0.01UF 1608 50V 10% R/TP B(Y "100UF KMG,RD 16V 20% FL BULK" "100UF KMG,RD 16V 20% FM2.5 T"-C/SKD 0.01UF 1608 50V 10% R/TP B(Y 0.01UF 1608 50V 10% R/TP B(Y "100UF KMG,RD 16V 20% FL BULK" "100UF KMG,RD 16V 20% FM2.5 T"-C/SKD "100UF KMG,RD 16V 20% FL BULK"-C/SKD - 21 - KDS226 TP KEC SOT-23 80V 30 KDS226 TP KEC SOT-23 80V 30 KDS226 TP KEC SOT-23 80V 30 KDZ5.6V KEC R/TP USC 0.2W 5. KDZ5.6V KEC R/TP USC 0.2W 5. KDZ5.6V KEC R/TP USC 0.2W 5. KDZ5.6V KEC R/TP USC 0.2W 5. KDZ5.6V KEC R/TP USC 0.2W 5. KDZ5.6V KEC R/TP USC 0.2W 5. ICs U201 U501 U502 U801 U803 Q502 ww //w 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CK103CK51A 0CE106CK610 0CC030CK01A 0CC180CK41A 0CK103CK51A 0CK105CD56A 0CK103CK51A 0CK103CK51A 0CC101CK41A 0CC101CK41A 0CC680CK41A 0CC680CK41A 0CK105CD56A 0CK103CK51A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK103CK51A 0CK104CK56A 0CK103CK51A 0CE107EF610 0CE107EF628 0CK103CK51A 0CK103CK51A 0CE107EF610 0CE107EF628 0CE107EF610 htt p: C204 C205 C206 C207 C208 C210 C213 C214 C215 C216 C217 C218 C219 C220 C221 C222 C223 C224 C225 C226 C227 C231 C232 C233 C234 C503 C504 C506 C507 C508 C701 C708 C709 C717 C718 C720 C721 C727 C732 C733 C734 C735 C801 C803 C819 C820 C820 C821 C829 C831 C831 C832 PART NO. *S *AL LOC. NO. t DATE: 2004. 12. 17. DESCRIPTION / SPECIFICATION .ne PART NO. jel *S *AL LOC. NO. 0IPRPGN016B 0IZZTSZ594A 0ISG240860B 0IPMGKE011A 0IPMGSG019A 0IKE704200H "GMZAN3SL-BD-LF GENESIS 128P," L1750SN ZAN3SL MICOM ASSY -L1750S "M24C08WMN6T(P),LF SGS-THOMSO" KIA78D33F KEC DPAK R/TP 3.3V "LD1117S18TR,LF STM SOT223 R/" KIA7042AP TO-92 TP 4.2 VOLT TRANSISTOR Q503 Q504 Q505 Q703 Q704 Q803 Q804 U802 0TR390409AE 0TR390409AE 0TR390409AE 0TR390609FA 0TR390609FA 0TR127309AA 0TR390409AE 0TFVI80023A FAIRCHILD KST3904(LGEMTF) TP FAIRCHILD KST3904(LGEMTF) TP FAIRCHILD KST3904(LGEMTF) TP KST3906-MTF TP SAMSUNG SOT2 KST3906-MTF TP SAMSUNG SOT2 KTA1273-Y(KTA966A) TP KEC TO-L1750S FAIRCHILD KST3904(LGEMTF) TP-L1750S VISHAY SI3865DV R/TP TSOP-6-L1950S RESISTORs R201 R202 R203 R208 R209 R210 R211 R213 R214 R220 R221 R222 R506 R508 R514 R515 0RJ1000D677 0RJ1000D677 0RJ1000D677 0RJ1200D677 0RJ1200D677 0RJ1200D677 0RJ1000D677 0RJ0000D677 0RJ0000D677 0RJ0000D677 0RJ0000D677 0RJ1004D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 100 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 120 OHM 1/10 W 5% 1608 R/TP 120 OHM 1/10 W 5% 1608 R/TP 120 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 1000000 OHM 1/10 W 5% 1608 R 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP R821 R822 R823 R824 DATE: 2004. 12. 17. DESCRIPTION / SPECIFICATION 0RJ0472D677 0RJ0472D677 0RJ0000D677 0RJ0000D677 47 OHM 1/10 W 5% 1608 R/TP 47 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 6212AA2004A HC-49U TXC 12.0MHZ +/- 30 PP X501 CONTROL BOARD C1 C2 LED1 R1 R2 R3 R4 R5 SW1 SW2 SW3 SW4 SW5 ZD1 ZD2 t OTHERs .ne 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 3.3K OHM 1/10 W 5% 1608 R/TP 3.3K OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 470 OHM 1/10 W 5% 1608 R/TP 470 OHM 1/10 W 5% 1608 R/TP 33 OHM 1/10 W 5% 1608 R/TP 33 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 1.5K OHM 1/10 W 5% 1608 R/TP-L1750S 47000 OHM 1/10 W 5% 1608 R/T-L1950S 4.7K OHM 1/10 W 5% 1608 R/TP 10K OHM 1/10 W 5% 1608 R/TP 75 OHM 1/10 W 5% 1608 R/TP 75 OHM 1/10 W 5% 1608 R/TP 75 OHM 1/10 W 5% 1608 R/TP 470 OHM 1/10 W 5% 1608 R/TP 1K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 470 OHM 1/10 W 5% 1608 R/TP 100 OHM 1/10 W 5% 1608 R/TP 68 OHM 1/10 W 5% 1608 R/TP 68 OHM 1/10 W 5% 1608 R/TP 10K OHM 1/10 W 5% 1608 R/TP 10K OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 68 OHM 1/10 W 5% 1608 R/TP 68 OHM 1/10 W 5% 1608 R/TP 2K OHM 1/10 W 5% 1608 R/TP 2K OHM 1/10 W 5% 1608 R/TP 4.7 OHM 1/10 W 5% 1608 R/TP 0 OHM 1/10 W 5% 1608 R/TP 10K OHM 1/10 W 5% 1608 R/TP-L1750S 390 OHM 1/10 W 5% 1608 R/TP-L1750S 390 OHM 1/10 W 5% 1608 R/TP-L1750S 390 OHM 1/10 W 5% 1608 R/TP-L1750S 390 OHM 1/10 W 5% 1608 R/TP-L1750S 22K OHM 1/10 W 5% 1608 R/TP-L1950S 560 OHM 1/10 W 5% 1608 R/TP-L1950S 47 OHM 1/10 W 5% 1608 R/TP 47 OHM 1/10 W 5% 1608 R/TP 47 OHM 1/10 W 5% 1608 R/TP 47 OHM 1/10 W 5% 1608 R/TP 47 OHM 1/10 W 5% 1608 R/TP 47 OHM 1/10 W 5% 1608 R/TP 47 OHM 1/10 W 5% 1608 R/TP 47 OHM 1/10 W 5% 1608 R/TP PART NO. 0CK104CK56A 0CK104CK56A 0DLLT0208AA 0RJ4701D677 0RJ4701D677 0RJ2001D677 0RJ2001D677 0RJ4701D677 6600TR1002A 6600TR1002A 6600TR1002A 6600TR1002A 6600TR1002A 0DZ560009GB 0DZ560009GB 0.1UF 1608 50V 10% R/TP X7R 0.1UF 1608 50V 10% R/TP X7R LITEON LTST-C155KGJSKT R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP 2K OHM 1/10 W 5% 1608 R/TP 2K OHM 1/10 W 5% 1608 R/TP 4.7K OHM 1/10 W 5% 1608 R/TP SKQGACE010 J-ALPS NON 12V 50 SKQGACE010 J-ALPS NON 12V 50 SKQGACE010 J-ALPS NON 12V 50 SKQGACE010 J-ALPS NON 12V 50 SKQGACE010 J-ALPS NON 12V 50 "BZT52C5V6S-(F),LF DIODES R/T" "BZT52C5V6S-(F),LF DIODES R/T" jel 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ0000D677 0RJ3301D677 0RJ3301D677 0RJ1000D677 0RJ1000D677 0RJ4701D677 0RJ4701D677 0RJ4700D677 0RJ4700D677 0RJ0332D677 0RJ0332D677 0RJ1000D677 0RJ1000D677 0RJ1501D677 0RJ4702D677 0RJ4701D677 0RJ1002D677 0RJ0752D677 0RJ0752D677 0RJ0752D677 0RJ4700D677 0RJ1001D677 0RJ4701D677 0RJ4701D677 0RJ0000D677 0RJ4700D677 0RJ1000D677 0RJ0682D677 0RJ0682D677 0RJ1002D677 0RJ1002D677 0RJ0000D677 0RJ4701D677 0RJ4701D677 0RJ0000D677 0RJ0682D677 0RJ0682D677 0RJ2001D677 0RJ2001D677 0RJ0471D677 0RJ0000D677 0RJ1002D677 0RJ3900D677 0RJ3900D677 0RJ3900D677 0RJ3900D677 0RJ2202D677 0RJ5600D677 0RJ0472D677 0RJ0472D677 0RJ0472D677 0RJ0472D677 0RJ0472D677 0RJ0472D677 0RJ0472D677 0RJ0472D677 *S *AL LOC. NO. ww .w DATE: 2004. 12. 17. DESCRIPTION / SPECIFICATION htt p: R516 R518 R520 R521 R522 R523 R534 R535 R537 R541 R542 R543 R544 R545 R547 R548 R549 R555 R557 R560 R560 R561 R566 R701 R703 R706 R708 R709 R716 R717 R720 R721 R722 R723 R724 R726 R727 R737 R744 R747 R769 R775 R779 R780 R781 R782 R803 R805 R806 R807 R809 R810 R811 R812 R813 R814 R815 R816 R817 R818 R819 R820 PART NO. //w *S *AL LOC. NO. - 22 - SCHEMATIC DIAGRAM 1. SCALER 2 U201-#88 .ne jel .w ww //w htt p: L1750S/L1950S ZAN3SL t #1 2 - 23 - jel t .ne L1750S/L1950S MICOM 5 6 1.5K(17") - 24 - #2 .w U501-#43, 44 ww 6 //w 5 htt p: 2. MICOM 390 1 390 390 - 25 - t .ne jel .w L1750S/L1950S POWER 1 390 ww #3 J707-#5,6/U801-#1/U803-#3 //w 1 htt p: 3. POWER 15K - 26 - t .ne jel L1750S/L1950S CONNECTOR & JACKS .w #4 3 4 1 ww J707-#5,6/U801-#1/U803-#3 J707-#2 Inverter Off Micom Port check J705 Inverter output J707-#2 //w 1 3 4 Inverter On Micom Port check J705 Inverter output htt p: 4. CONNECTOR & JACKS t .ne jel .w ww //w htt p: P/NO : 3828TSL096P Dec. 2004 Printed in Korea