Download EM1

EM1 Data Sheet - 2008-07-31
Embedded Solutions
Technical Data
CPU
n PowerPC®
o MPC5200
o Up to 400MHz
Front Connections
n One USB 1.1 (Series A)
n Two Ethernet (RJ45 or D-Sub)
n One RS232 UART COM1(RJ45 or D-Sub)
Memory
n 2x16KB L1 data and instruction cache integrated in MPC5200
n Up to 256MB SDRAM system memory
o Soldered
o DDR
o 64MHz memory bus frequency
n Up to 1GB soldered NAND Flash (and more), FPGA-controlled
n 16MB additional SDRAM, FPGA-controlled, e.g. for video
data and NAND Flash firmware
n Up to 8MB boot Flash
n 2MB battery-backed SRAM, or: 128KB non-volatile FRAM
n Serial EEPROM 8kbits for factory settings
FPGA
n Standard factory FPGA configuration:
o Main bus interface
o 16Z070_IDEDISK - IDE controller for NAND Flash
o 16Z043_SDRAM - Additional SDRAM controller (16MB; 1MB
used for graphics)
o 16Z023_IDENHS - IDE controller (PIO mode 0;
non-hot-swap)
o 16Z044_DISP - Display controller (800 x 600,
60Hz/70Hz, 6-bit RGB)
o 16Z031_SPI - SPI touch panel controller
o 16Z025_UART - UART controller (controls COM10..COM13)
o 16Z034_GPIO - GPIO controller (6 lines)
n The FPGA offers the possibility to add customized I/O
functionality. See FPGA.
Mass Storage
n Parallel IDE (PATA)
o One port for hard-disk drives
o Available via I/O connector
o FPGA-controlled
n Up to 1GB soldered ATA NAND Flash (and more),
FPGA-controlled
2
PCI Interface
n 32-bit, 32-MHz PCI interface at PCI-104 connector J1
n Compliant with PCI Specification 2.2
n Support of 4 external masters
Graphics
n Available via I/O connector
n FPGA-controlled
Miscellaneous
n Real-time clock
n Power supervision and watchdog
I/O
n USB
o One USB 1.1 port
o Series A connector at front panel
o OHCI implementation
o Data rates up to 12Mbits/s
n Ethernet
o One 10/100Base-T Ethernet channel
o Second Ethernet channel can be implemented through
update of FPGA
o Two RJ45 or one D-Sub connector at front panel
n One RS232 UART (COM1)
o RJ45 or D-Sub connector at front panel
o Data rates up to 115.2kbits/s
o 512-byte transmit/receive buffer
o Handshake lines: CTS, RTS
n CAN bus
o Two CAN bus channels
o 2.0 A/B CAN protocol
o Data rates up to 1 Mbit/s
o Connection via on-board connectors
o External transceivers using SA-Adapters™
n Further I/O depending on FPGA configuration
Electrical Specifications
n Supply voltage/power consumption:
o +5V (-2%/+5%), 10mA max., only for USB
o +3.3V (-2%/+5%), 1A typ.
n MTBF: 232,000h @ 40°C (derived from MIL-HDBK-217F)
Mechanical Specifications
n Dimensions: conforming to ESM™ specification (PCB: 149mm
x 71mm), Type I-S
n Weight: 90g (w/o heat sink)
Environmental Specifications
n Temperature range (operation):
o -40..+85°C
o Airspeed: min. 2 m/s
n Temperature range (storage): -40..+85°C
n Relative humidity (operation): max. 95% non-condensing
n Relative humidity (storage): max. 95% non-condensing
n Altitude: -300m to + 3,000m
n Shock: 15g/11ms
n Bump: 10g/16ms
n Vibration (sinusoidal): 2g/10..150Hz
n Conformal coating on request
®