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Download LPC122x - NXP Semiconductors
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LPC122x NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Footprint information for reflow soldering of LQFP64 package SOT314-2 Hx Gx P2 Hy (0.125) P1 Gy By Ay C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.500 P2 Ax Ay Bx By 0.560 13.300 13.300 10.300 10.300 C D1 D2 1.500 0.280 0.400 Gx Gy Hx Hy 10.500 10.500 13.550 13.550 sot314-2_fr Fig 28. Reflow soldering of the LQFP64 package LPC122X Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 26 August 2011 © NXP B.V. 2011. All rights reserved. 55 of 61
