Download Digital Cordless Phone

ORDER NO. KM41108492CE
Telephone Equipment
Model No. KX-TG1711MEB
Caller ID Compatible
KX-TG1712MEB
KX-TGA171MEB
Digital Cordless Phone
B: Piano Black Version
(for Mexico)
KX-TGA171MEB
(Handset)
KX-TG1711MEB
(Base Unit)
(Charger Unit)
Configuration for each model
Model No
KX-TG1711
KX-TG1712
Base Unit
1 (TG1711)
1 (TG1711)
Handset
1 (TGA171)
2 (TGA171)
Charger Unit
1
© Panasonic System Networks Co., Ltd. 2011
Unauthorized copying and distribution is a violation
of law.
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
WARNING
This service information is designed for experienced repair technicians only and is not designed for use by the general
public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting
to service a product. Products powered by electricity should be serviced or repaired only by experienced professional
technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone
else could result in serious injury or death.
IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety. These parts are marked by
in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that
these cirtical parts should be replaced with manufacturer's specified parts to prevent shock, fire or other hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the
use of PbF and how it might be permissible to use Pb solder during service and repair work.
L When you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit.
L The illustrations in this Service Manual may vary slightly from the actual product.
2
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
TABLE OF CONTENTS
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P.C. Board--------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit) --------------------------- 8
4.3. Block Diagram (Handset)-------------------------------10
4.4. Circuit Operation (Handset)---------------------------- 11
4.5. Circuit Operation (Charger Unit) ---------------------- 11
4.6. Signal Route -----------------------------------------------12
5 Location of Controls and Components ------------------13
6 Installation Instructions ---------------------------------------13
7 Operating Instructions-----------------------------------------13
7.1. For Service Hint-------------------------------------------13
8 Service Mode -----------------------------------------------------14
8.1. Engineering Mode ----------------------------------------14
9 Troubleshooting Guide ----------------------------------------18
9.1. Troubleshooting Flowchart -----------------------------18
9.2. Troubleshooting by Symptom (Base Unit and
Charger Unit) ----------------------------------------------24
9.3. Troubleshooting by Symptom (Handset) -----------27
10 Disassembly and Assembly Instructions ---------------30
10.1. Disassembly Instructions -------------------------------30
10.2. How to Replace the Handset LCD -------------------33
11 Measurements and Adjustments---------------------------34
11.1. The Setting Method of JIG (Base Unit) -------------34
11.2. Adjustment Standard (Base Unit)---------------------36
11.3. Adjustment Standard (Charger Unit)-----------------37
11.4. The Setting Method of JIG (Handset) ---------------38
11.5. Adjustment Standard (Handset) ----------------------40
11.6. Things to Do after Replacing IC ----------------------41
11.7. RF Specification-------------------------------------------42
11.8. How to Check the Handset Speaker or
Receiver ----------------------------------------------------43
11.9. Frequency Table (MHz) ---------------------------------43
12 Miscellaneous ----------------------------------------------------44
12.1. How to Replace the Flat Package IC ----------------44
12.2. How to Replace the Shield Case ---------------------46
12.3. Terminal Guide of the ICs, Transistors, Diodes
and Electrolytic Capacitors-----------------------------48
13 Schematic Diagram ---------------------------------------------49
13.1. For Schematic Diagram---------------------------------49
13.2. Schematic Diagram (Base Unit) ----------------------50
13.3. Schematic Diagram (Handset) ------------------------51
13.4. Schematic Diagram (Charger Unit) ------------------52
14 Printed Circuit Board-------------------------------------------53
14.1. Circuit Board (Base Unit) -------------------------------53
14.2. Circuit Board (Handset) ---------------------------------55
14.3. Circuit Board (Charger Unit) ---------------------------57
15 Exploded View and Replacement Parts List -----------58
15.1. Cabinet and Electrical Parts (Base Unit) -----------58
15.2. Cabinet and Electrical Parts (Handset) -------------59
15.3. Cabinet and Electrical Parts (Charger Unit) -------60
15.4. Accessories ------------------------------------------------61
PAGE
15.5. Replacement Part List ---------------------------------- 62
3
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C).
• Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent solder
splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
remove all of the
excess solder
component
pin
component
slice view
solder
4
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials. The
following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
0.3 mm X 100 g
2.3.
0.6 mm X 100 g
1.0 mm X 100 g
Discarding of P.C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
5
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
3 Specifications
■ Standard:
DECT 6.0 (Digital Enhanced Cordless
Telecommunications 6.0)
■ Number of channels:
60 Duplex Channels
■ Frequency range:
1.92 GHz to 1.93 GHz
■ Duplex procedure:
TDMA (Time Division Multiple Access)
■ Channel spacing:
1,728 kHz
■ Bit rate:
1,152 kbit/s
■ Modulation:
GFSK (Gaussian Frequency Shift Keying)
■ RF transmission power:
Approx. 10 m W (average power per channel)
■ Voice coding:
ADPCM 32 kbit/s
■ Power source (AC Adaptor):
100-240 V AC, 50/60 Hz
Base unit: PNLV226Z
Charger: PNLV226Z
■ Power consumption
Base unit:
Standby: Approx. 0.6 W
Maximum: Approx. 3.3 W
Charger:
Standby: Approx. 0.1 W
Maximum: Approx. 2.2 W
■ Operating conditions:
0°C–40°C, 20%–80% relative air humidity (dry)
■ Dimensions:
Base unit: Approx. 100 mm x 96 mm x 53 mm
Handset : Approx. 47 mm x 30 mm x 159 mm
Charger: Approx. 72 mm x 76 mm x 43 mm
■ Mass (weight):
Base unit: Approx. 110 g
Handset: Approx. 130 g
Charger: Approx. 50 g
Note:
• Design and specifications are subject to change without notice.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on condition
• Analog telephone connection: Telephone Line
6
to AC
Adaptor
to
Tel_Line
B
A
Hook
Switch
Q2/3
7
IC4
2.6V
Regulator
IC2
3.3V
Regulator
Limit
resistor
R39
2.6V
Charge-
Charge+
COSIC
I/F
C26, R33, R200, C27, R34, R201
Bridge
Rect
D2
3.3V
Q1
Audio
B61
B60
B67
B62
B81
B82
IC1
EEPROM
DAT
SCL
CPU
Analog
Front
End
DSP
IC3
B14
B13
B24
B38
B23
XTAL
20.736MHz
X1
KX-TG1711/1712 BLOCK DIAGRAM (BASE UNIT)
COSIC
RF
2.6V
ANT1
ANT2
4.1.
J1
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
4 Technical Descriptions
Block Diagram (Base Unit)
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
4.2.
4.2.1.
Circuit Operation (Base Unit)
Outline
Base Unit consists of the following ICs as shown in Block Diagram (Base Unit) (P.7).
• DECT BBIC (Base Band IC): IC3 (career module)
- Handling all the audio, signal and data processing needed in a DECT base unit
- Controlling the DECT specific physical layer and radio section (Burst Module Controller section)
- ADPCM codec filter for speech encoding and speech decoding (DSP section)
- Echo-cancellation and Echo-suppression (DSP section)
- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)
- DTMF receiver (DSP section)
- Clock Generation for RF Module
- ADC, DAC, timer, and power control circuitry
- All interfaces (ex: RF module, EEPROM, LED, Analog Front End, etc.)
- PLL Oscillator
- Detector
- Compress/Expander
- First/Second Mixer
- Amplifier for transmission and reception
• EEPROM: IC1
- Temporary operating parameters (for RF, etc.)
• Additionally,
- Power Supply Circuit (+2.65V output)
- Crystal Circuit (20.736MHz)
- Charge Circuit
- Telephone Line Interface Circuit
4.2.2.
Power Supply Circuit
The power is supplied to the DECT BBIC, RF Module, EEPROM, Relay Coil, LED and Charge Contact from AC Adaptor as
shown in Fig.101. The power supply is as follows:
IC2
2.65V
F1
BBIC
IC3-VDDBAT
IC2
J2
AC Adaptor
EEP ROM
IC1
H/S
BBIC (IC301 Charge_start)
R39
CHARGE+
+
TP5
+
CHARGE-
TP6
Q101
L104
<Base Unit>
<Handset>
BATTERY
R102
<Fig.101>
8
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
4.2.3.
Telephone Line Interface
<Function>
• Bell signal detection
• Clip signal detection
• ON/OFF hook circuit
• Audio circuits
Bell & Clip (: Calling Line Identification Presentation: Caller ID) signal detection:
In the standby mode, Q3 is open to cut the DC loop current and decrease the ring load.
When ring voltage appears at the L1T and L1R leads (when the telephone rings), the signal is transferred as follows;
• A → C26 → R33 → R50, C70 → R16, R30 → R200 → LINEN [BELL & CLIP]
• B → C27 → R34 → R51, C71 → R19, R31 → R201 → LINEP [BELL & CLIP]
ON/OFF hook circuit:
In the standby mode, Q3 is open, and connected as to cut the DC loop current and to cut the voice signal. The unit is consequently
in an off-hook condition.
When IC3 detects a ring signal or press the TALK Key onto the handset, Q2 turns on and then Q3 turns on, thus providing an offhook condition (active DC current flow through the circuit) and the following signal flow is for the loop current.
• A → D2 → Q3 → Q1 → R9 → R10 → D2→ B [OFF HOOK]
Audio circuits:
Refer to Signal Route (P.12).
4.2.4.
Transmitter/Receiver
Base Unit and Handset mainly consist of RF Module and DECT BBIC.
Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency.
Signal Path:
*Refer to Signal Route (P.12).
4.2.4.1.
Transmitter Block
The voice signal input from the TEL LINE interface goes to DECT BBIC (IC3) as shown in Block Diagram (Base Unit) (P.7)
The voice signal passes through the analog part of IC3 where it is amplified and converted to a digital audio stream signal. The
burst switch controller processes this stream performing encryption and scrambling, adding the various other fields to produce
the GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc.
In IC3, the carrier frequency is changing, and frequency modulated RF signal is generated and amplified, and radiated from
antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation of Receiver Block.
4.2.4.2.
Receiver Block
The signal of 1.9 GHz band (1.881792 GHz ~ 1.897344 GHz) which is input from antenna is input to IC3 as shown in Block
Diagram (Base Unit) (P.7).
In IC3, the signal of 1.9 GHz band is demodulated, and goes to IC2 as GAP (Generic Access Profile) standard DECT frames. It
passes through the decoding section burst switch controller where it separates out the frame information and performs deencryption and de-scrambling as required. It then goes to the DSP section where it is turned back into analog audio. This is
amplified by the analog front end, and goes to the TEL LINE Interface.
4.2.5.
Pulse Dialling
During pulse dialing the hookswitch (Q3, Q4) is used to generate the pulses using the HOOK control signal, which is set high
during pulses. To force the line impedance low during the “pause” intervals between dial pulses, the PULSE_DIAL signal turns
on Q2.
9
BATTERY
Charge-
Charge+
MIC
Earpiese
(Speaker)
R102
Charge
circuit
Q101/102
2.4V
R102
Q103
Regulator
IC101
3.3V
3.3V
36
35
10
LCD
MAD4P
32
VDDDCDC
VDDBAT
SDRV
CHARGE
CHARGE
38
37
45
44
48
SCLK
EEPROM
(IC102)
CPU
Analog
Front
End
47
DATA
DSP
54
Q105
Q104
4
5
1
RINGER
BZ2
3.3V
ON SWITCH
2.4V
XTAL
20.736MHz
X101
KEYPAD
KX-TGA171 BLOCK DIAGRAM (HANDSET)
53
COSIC
IC103
RF
4.3.
2.4V
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
Block Diagram (Handset)
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
4.4.
4.4.1.
Circuit Operation (Handset)
Outline
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.10).
• DECT BBIC (Base Band IC): IC103
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD)
- PLL Oscillator
- Detector
- Compress/Expander
- Amplifier for transmission and reception
• EEPROM: IC102
- Temporary operating parameters
4.4.2.
Power Supply Circuit/Reset Circuit
Circuit Operation:
When power on the Handset, the voltage is as follows;
~
BATTERY (2.2 V 2.6V)
D107
IC103 -VDDBAT
L103
The Reset signal generates R121, C186 and
4.4.3.
IC103-SDRV
IC101
R107
3.3V
2.6V.
Charge Circuit
Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
DC+ → F1 → R39 → CHARGE+ (Base) → CHARGE+ (Handset) → Q101 → L104 → BATTERY+... Battery...
BATTERY- → R102 → GND → CHARGE- (Handset)→ CHARGE- (Base) → GND → DC- (GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q101 of Handset.
Refer to Fig.101 in Power Supply Circuit (P.8).
4.4.4.
Battery Low/Power Down Detector
Circuit Operation:
“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
• Battery Low
Battery voltage: V (Batt) < 2.20V
The BBIC detects this level and “
” is displayed on LCD and “battery alarm” starts ringing.
• Power Down
Battery voltage: V (Batt) < 2.05V
The BBIC detects this level and power down.
4.5.
4.5.1.
Circuit Operation (Charger Unit)
Power Supply Circuit
The power supply is as shown.
F1
R1
J1
AC
AC Adaptor
11
TP2
5.5 V DC
TP1
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
4.6.
Signal Route
SIGNAL ROUTE
SIGNAL
ROUTE
IN
OUT
DTMF TONE
TEL OUT
(to Tel Line)
(BASE UNIT)
IC3 - H01P, H01N - R2 - C5 - Q1 - Q3 - D2
DTMF TONE
TEL IN
(from Tel Line)
(BASE UNIT)
A
D2 - Q3 - R12 - C15
CDL TX
(to Tel Line)
(HANDSET)
MIC
C105 - IC103 - MICP
R105 - C106 - IC103 - MICN
A
B
B
(BASE UNIT)
from HANDSET
ANT1 - C41
ANT2 - C39
R2 - C5 - Q1 - Q3 - D2
ANT to BASE UNIT
D6 - D801 - C820 - IC3 - RXI, RXIX - IC3 - H01P, H01N -
A
B
CDL RX
(from Tel Line)
(BASE UNIT)
A
D2 - Q3 - R12 - C15 - R14 - IC3 - LINEA - IC3 - POS, POX - C826 - D801 - D6
B
C39
-
ANT1 to HANDSET
C41
-
ANT2 to HANDSET
(HANDSET)
from BASE UNIT - ANTENNA - C149 - D803 - C820 - IC3 - RXI, RXIX
Caller ID
(from Tel Line)
(BASE UNIT)
A - C26 - R33 - R50 - R200 - IC3 - LINEN
B - C27 - R34 - R51 - R201 - IC3 - LINEP
12
IC103 - H01P - SPEAKER (+)
IC103 - H01N - SPEAKER (-)
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
5 Location of Controls and Components
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation Instructions
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
7 Operating Instructions
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
7.1.
For Service Hint
Items
Battery
Contents
You could use other rechargeable batteries sold in a market, but the unit is not guaranteed to work
properly.
The battery strength may not be indicated correctly if the battery is disconnected and connected again,
even after it is fully charged. In that case, by recharging the battery as mentioned in the Operating
Instructions, you will get a correct indication of the battery strength.
PIN Code
Base unit PIN
1 {j/OK}
2 { }: “Setup” i{j/OK}
3 { }: “Change PIN”i{j/OK}
4 Old PIN i Input Current PIN
5 New PIN i Input New PIN
6 Re-enter PIN i Input New PIN
7 Saved
8 {ic}
13
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
8 Service Mode
8.1.
Engineering Mode
8.1.1.
Base Unit
Important:
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
{MENU/OK}
{OFF} (off)
‫ޣ‬CLEAR‫(ޤ‬Clear)
Navigator key
{^} {V} {<} {>}
Dial keypad
H/S key operation
H/S LCD
1). Register a Handset to a Base Unit.
2). Press {MENU/OK} key.
Ringer Setup
w
3). Press "#004".
A is Address D is data
1
A:0000 D:00
w
4). Press "XXXX"(Address) ,
then press {MENU/OK} key.
D is current setting data
1
A:XXXX D:XX
w
5). Press "YY"(Data) ,
1
A:XXXX D:YY
then press {MENU/OK} key.
D is new setting data
w
6). Repeat from Step 4).
1
A:XXXX D:XX
w
If press {OFF} (Off) twice anytime, return to standby mode.
Note:
(*1) Refer to For Service Hint (P.13).
14
1
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
Frequency Used Items (Base Unit)
Note:
*: When you enter the address, please refer to the table below.
Desired Number (hex)
0
1
.
.
.
9
Input Keys
0
1
.
.
.
9
Desired Number (hex)
A
B
C
D
E
F
Input Keys
Press and keep 1
Press and keep 2
Press and keep 3
Press and keep 4
Press and keep 5
Press and keep 6
ex.)
Items (*2)
C-ID (FSK) sensitivity
Address
01 C1~ 01
C2
01 B7
Default Data
00 28
Frequency
ID
01 63~ 01 64
00 10~ 00 14
Given value
Given value
Bell length
PULSE Dial speed
(10PPS -> 20PPS)
015D~015E 05 5F(11sec)(*1) 01 77(3sec)
0129~012A 01 90(40msec) 00 C8(20msec)
(*3)
012B~012C 02 58(60msec) 01 2C(30msec)
(*3)
012D~012E 23 28(900msec)
11
(*3)
30(440msec)
C-ID (DTMF) sensitivity
34
New Data
(3dB up)
(6dB up)
00 A4
00 E7
(3dB up)
(6dB up)
38
3C
00 FA (2sec)
-
Remarks
When hex changes from “0028” to “00A4” or
“00E7”, gain increases by 3dB or 6dB.
When hex changes from “34” to “38” or “3C”, gain
increases by 3dB or 6dB.
Use these items in a READ-ONLY mode to confirm
the contents. Careless rewriting may cause serious
damage to the computer system.
This is time until bell stops ringing. (Unit:8ms)
This is pulse make time. (Unit:0.1ms)
-
This is pulse break time. (Unit:0.1ms)
-
This is inter-digit time in pulse mode.
(Unit:0.1ms)
(*1)
Bell length
PULSE Dial speed
(10PPS -> 20PPS)
055F(hex) = 1375(dec) → 1375 x 8msec = 11000msec(11sec)
0190(hex) = 400(dec) → 400 x 0.1msec = 40msec
0258(hex) = 600(dec) → 600 x 0.1msec = 60msec
2328(hex) = 9000(dec) → 9000 x 0.1msec = 900msec
(*2)
Items
C-ID (FSK) sensitivity
C-ID (DTMF) sensitivity
Frequency
ID
Bell length
Description
FSKGain_shiftgain
Foutgains:HPFilter Foutgains
Setting value of FREQ_TRIM_REG
ID
Time until it stops bell.
15
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
8.1.2.
Handset
Important:
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
{MENU/OK}
{OFF} (off)
‫ޣ‬CLEAR‫(ޤ‬Clear)
Navigator key
{^} {V} {<} {>}
Dial keypad
H/S key operation
H/S LCD
1). Press {MENU/OK} key.
Ringer Setup
w
2). Press "#003".
A is Address D is data
1
A:0000 D:00
w
3). Press "XXXX"(Address) ,
then press {MENU/OK} key.
D is current setting data
1
A:XXXX D:XX
w
4). Press "YY"(Data) ,
then press {MENU/OK} key.
1
A:XXXX D:YY
w
D is new setting data
5). Repeat from Step 3).
1
A:XXXX D:YY
w
If press {OFF} (Off) twice anytime, return to standby mode.
Note:
(*1) Refer to For Service Hint (P.13).
16
1
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
Frequency Used Items (Handset)
Note:
*: When you enter the address, please refer to the table in Note: (P.14) of Engineering Mode.
ex.)
Items (*2)
Sending level
Address
01 31
Default Data
07 (36 dB)
Receiving level
01 3D
01 3B
01 39
01 37
01 35
2A10 (-4.1dB)
9B93 (-6.5dB)
9995 (-8.4 dB)
99C2 (-11.4 dB)
9924 (-14.7dB)
New Data
06 (30 dB)
05 (24 dB)
04 (18 dB)
03 (12 dB)
(*1) This model has already been setting Max.
(*2)
Items
Sending level
Receiving level
Description
Analog Front End MIC Setting for Handset Mode
Analog Front End LSR Setting for Handset Mode
17
Remarks
(*1)
Volume 5
Volume 4
Volume 3... default setting
Volume 2
Volume 1
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
9 Troubleshooting Guide
9.1.
Troubleshooting Flowchart
Flow Chart
Power ON Base Unit
Not Work
Check Power
OK
No Bell
Bell
Bell Reception
OK
Link
Not Link
OK
Battery Charge
Not Charge
Check Battery Charge
OK
Check Link
Handset Voice Transmission
No Voice
Check Handset Transmission
OK
Handset Voice Reception
No Voice
Check Handset Reception
OK
DTMF dial
No Signal
Signal Route
OK
Caller ID Reception
No Signal
Cross Reference:
Check Power (P.19)
Bell Reception (P.23)
Check Battery Charge (P.20)
Check Link (P.21)
Check Handset Transmission (P.23)
Check Handset Reception (P.23)
Signal Route (P.12)
Check Caller ID (P.23)
18
Check Caller ID
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
9.1.1.
Check Power
9.1.1.1.
Base Unit
Is the AC Adaptor inserted into AC outlet? (Check AC Adaptor’s specification.)
NO
Is input of IC2 (pin3) about 5.5V?
Check F1 is not opened, C34, C35, C58, C60 is
not shorted.
YES
YES
Check AC Adaptor.
NO
Is the output voltage of IC2 (pin2) about 2.65V?
Check Power Supply Circuit.
YES
Is C48(RESETQ) High?
NO
Check Career PCB.
YES
Check X1, C23.
YES
Check Career PCB
Cross Reference
Power Supply Circuit (P.8)
9.1.1.2.
Handset
Is the battery inserted to Battery Holder?
YES
Is the voltage of battery between battery +
and battery 2.3V more?
NO
Check the battery and around Battery Holder are
not shorted.
YES
NO
Is the voltage of VDDDCDC2 about 3.3 V?
Check Power Supply Circuit/Reset Circuit.
YES
NO
Is C109 (VDDBAT) voltage about 2.3V more?
Cross Reference
Power Supply Circuit/Reset Circuit (P.11)
19
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
9.1.2.
Check Battery Charge
9.1.2.1.
Base Unit
Plug in the AC Power source.
Charge Handset on Base Unit.
Is the voltage of two charge contacts about
3.0 V and 0V from GND level?
NO
Check Power Supply Circuit of Base Unit.
OK
YES
Check Handset.
Check Charge Contacts at
Base Unit from mechanical point of view.
Cross Reference:
Power Supply Circuit (P.8)
9.1.2.2.
Handset
Is Check Power OK?
NO
Check Check Power (Handset).
YES
Is R101 (CDT) high at charge state?
NO
Check Charge Circuit.
Cross Reference:
Check Power (P.19)
Charge Circuit (P.11)
9.1.2.3.
Charger Unit
Plug in the AC Power source.
Charge Handset on Charger Unit.
Is the voltage of two charge contacts about
3.0 V and 0V from GND level?
NO
Check Power Supply Circuit of Charger Unit.
OK
YES
Check Handset.
Check Charge Contacts at Charger Unit
from mechanical point of view.
Cross Reference:
Power Supply Circuit (P.11)
20
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
9.1.3.
9.1.3.1.
Check Link
Base Unit
Does Base Unit make link with Handset?
(Correct working unit)
YES
Base Unit is OK. Check Handset.
NO
Is VDD pin about 2.65V?
NO
Check around Power Supply Circuit.
YES
Is the RF clock (P1.0) oscillate: 10.368MHz in
Base Unit Test Mode?
Refer to Check Point...(E).
Check around X1 and adjust clock frequency.
Refer to Check Point...(E).
NO
YES
NO
(*1)
Is there CMD60 (: Dect Tester)?
YES
Does Base Unit make link with CMD60 in
Base Unit Test Mode?
Refer to Check Point...(H).
NO
YES
Is the NTP value OK?
Refer to Check Point...(H).
NO
YES
Is the modulation OK?
Refer to Check Point...(I).
NO
YES
Is the Frequency Offset OK?
Refer to Check Point...(J).
NO
Replace with a new Circuit Board.
YES
Is the Sensitivity Receiver OK?
Refer to Check Point...(K).
NO
YES
Is the Timing OK?
Refer to Check Point...(L).
NO
YES
Is the RSSI Level OK?
Refer to Check Point...(M).
NO
Cross Reference:
Power Supply Circuit (P.8)
Check Point (Base Unit) (P.24)
Note:
(*1) Refer to Troubleshooting by Symptom (Base Unit and Charger Unit) (P.24).
21
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
9.1.3.2.
Handset
Does Handset make link with Base Unit?
(Correct working unit)
YES
Handset is OK. Check Base Unit.
NO
NO
VDDBAT about 2.6 V?
Check around Power Supply Circuit/Reset Circuit.
YES
Is the RF clock (P1.0) oscillate: 10.368MHz
in Base Unit Test Mode?
Refer to Check Point...(H).
NO
Check around X101 and adjust clock frequency.
Refer to Check Point...(H).
YES
NO
(*1)
Is there CMD60 (: Dect Tester)?
YES
Does Base Unit make link with CMD60 in
Base Unit Test Mode?
Refer to Check Point...(I).
NO
YES
Is the NTP value OK?
Refer to Check Point...(I).
NO
YES
Is the modulation OK?
Refer to Check Point...(J).
NO
YES
Is the Frequency Offset OK?
Refer to Check Point...(K).
NO
Replace with the new Circuit Board.
YES
Is the Sensitivity Receiver OK?
Refer to Check Point...(L).
NO
YES
Is the Timing OK?
Refer to Check Point...(M).
NO
YES
Is the RSSI Level OK?
Refer to Check Point...(N).
NO
Cross Reference
Power Supply Circuit/Reset Circuit (P.11)
Check Point (Handset) (P.27)
Note:
(*1) Refer to Troubleshooting by Symptom (Handset) (P.27).
22
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
9.1.4.
Check Handset Transmission
Check MIC of Handset.
OK
Check CDL TX (HANDSET) in Signal Route.
Cross Reference:
Signal Route (P.12)
9.1.5.
Check Handset Reception
Check Handset Speaker in
How to Check the Handset Speaker or Receiver.
OK
Check CDL RX (HANDSET) in Signal Route.
Cross Reference:
How to Check the Handset Speaker or Receiver (P.43).
Signal Route (P.12)
9.1.6.
Check Caller ID
Check Caller ID in Signal Route.
Cross Reference:
Signal Route (P.12)
9.1.7.
9.1.7.1.
Bell Reception
Handset
When bell signal coming, is there bell sound signal
at R116 (P1.1) and R117 (TXD)?
NO
Check link in Check Link, and around Career module.
YES
When bell signal coming, is there bell sound signal
at D104 (between A and K)?
NO
Check around R114, D104, Q104, Q105.
YES
NO
Replace with the new BUZZER.
Does bell sound from BUZZER?
Cross Reference:
Telephone Line Interface (P.9)
Check Link (P.21)
How to Check the Handset Speaker or Receiver (P.43)
23
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
9.2.
Troubleshooting by Symptom (Base Unit and Charger Unit)
If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester
(*1) or not.
Remedy (*2)
Symptom
You have DECT Tester.
(Model Number : CMD60)
You don't have DECT Tester.
You cannot dial.
Check item (A)-(E).
Check item (A)-(E), (G)-(L).
You cannot hear the caller's voice.
Check item (A)-(D).
Check item (A)-(D), (G)-(I), (K).
You cannot use handset a little away from base unit
even if the handset is within range of the base unit.
-
Check item (G), (J).
The acoustic transmission level is high or low.
Check item (N).
Check item (N).
The acoustic reception level is high or low.
Check item (N).
Check item (N).
The unit does not link.
Check item (A)-(F).
Check item (A)-(L).
The unit cannot charge.
Check item (M).
Check item (M).
Note:
(*1) A general repair is possible even if you don’t have the DECT tester because it is for confirming the levels, such as Acoustic
level in detail.
(*2) Refer to Check Point (Base Unit) (P.24)
9.2.1.
Check Point (Base Unit)
Please follow the items below when BBIC or EEPROM is replaced.
Note:
After the measuring, suck up the solder of TP.
*: PC Setting (P.34) is required beforehand.
The connections of simulator equipment are as shown in Adjustment Standard (Base Unit) (P.36).
Items
(A) 2.65V
Confirmation
Adjustment
Point
Supply -
(B) VDDIO Confirmation
-
(C)* BBIC Confirmation
-
Procedure
1. Confirm that the voltage between VDD and GND is 2.65V ± 0.2V.
1. Confirm that the voltage between C24 and GND is 2.5 ± 0.3.
1. BBIC Confirmation (Execute the command “getchk”).
2. Confirm the returned checksum value.
Connection of checksum value and program number is shown below.
ex.)
(D)* BBIC Clock Adjustment P1.0
(Important)
CLK
1.
2.
3.
4.
(E)* Hookswitch Check with DC Characteristics
1.
2.
3.
4.
5.
6.
checksum value
0152
program number
DCM1EB
Execute the command “EnableClockOutput”.
Input Command “GetFreq”, then you can confirm the current value.
Check X’tal Frequency. (10.368 MHz ± 100 Hz).
If the frequency is not 10.368MHz ± 100Hz, adjust the frequency of CLK
executing the command “setfreq xx xx (where xx is the value)” so that the
reading of the frequency counter is 10.368000 MHz ± 5 Hz.
Connect J1 (Telephone Socket) to Tel-simulator which is connected with 600
Ω.
Set line voltage to 48V at on-hook condition and line current to 40mA at offhook condition of normal telephone.
Execute the command “hookoff”.
Confirm that the line current is 40mA ± 5mA.
Execute the command “hookon”.
Confirm that the line current is 0mA + 2mA.
24
Check or
Replace Parts
C58, C60, F1
C35, C34, IC2
C29, R35, R36
C28,
C103,
C11, C48, R17
IC3, X1, C22
C23, C17
IC3, X1, C22
C23, C17
IC3, X1, C22
C23, C17
IC3, C30, C31,
D2, Q3, R26,
R22, Q2, C45,
C21, R18, R15
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
Items
Adjustment
Point
(F)* DTMF Generator Check -
(G)* Transmitted
Confirmation
Power -
(H)* Modulation Check and ANT
Adjustment
(I)* Frequency Offset Check -
(J)* Sensitivity
Confirmation
Receiver -
(K)* Timing Confirmation
-
(L)* RSSI Level Confirmation -
(M) Charging Check
-
Procedure
1.
2.
3.
4.
5.
Connect J1 (Telephone Socket) to DTMF tester.
Execute the command “hookoff” and “dtmf_up”.
Confirm that the high frequency (1477.06Hz) group is -6.0 ± 2dBm.
Execute the command “dtmf_low”.
Confirm that the low frequency (852.05Hz) group is -8.0 ± 2dBm.
Check or
Replace Parts
IC3, R2, C4,
C5, R7, R9,
R10, C9, Q1,
R6, R12, D1,
Q3, R26, R22,
Q2, C45, C21,
R18, R15, D2,
C30, C31
IC3,
C813,
C807, C819,
C826, D801,
C817,
D6,
C39,
C38,
R802, C823,
C803,
C44,
C806, C802,
C804
Remove the Antenna before starting steps from 1 to 5.
1. Configure the DECT tester (CMD60) as follows;
<Setting>
• Test mode: FP
• Traffic Channel: 5
• Traffic Slot: 4
• Mode: Loopback
• PMID: 00000
2. Execute the command “testmode”.
3. Initiate connection from DECT tester. (“set up connect”)
4. Execute the command “ANT2”.
5. Confirm that the NTP value at ANT is 19dBm~25dBm.
Follow steps 1 to 3 of (G).
IC3,
C813,
4. Confirm that the B-Field Modulation is -350±50kHz/div, +350±50kHz/div using C807, C819,
data type Fig31.
C826, D801,
C817,
D6,
C39,
C38,
R802, C823,
C803,
C44,
C806, C802,
C804
Follow steps 1 to 3 of (G).
IC3,
C813,
4. Confirm that the frequency offset is -50kHz ~ +50kHz.
C807, C819,
C826, D801,
C817,
D6,
C39,
C38,
R802, C823,
C803,
C44,
C806, C802,
C804
Follow steps 1 to 3 of (G).
IC3,
C830,
4. Set DECT tester power to -84dBm.
C820, D801,
5. Confirm that the BER is < 1000ppm.
C817,
D6,
C39,
C38,
R801, C821,
C803,
C44,
C806, C802,
C804
Follow steps 1 to 3 of (G).
IC3,
C813,
4. Confirm that the Timing accuracy is < ± 2.0ppm.
C807, C819,
C826, D801,
C817,
D6,
C39,
C38,
R802, C823,
C803,
C44,
C806, C802,
C804
Follow steps 1 to 3 of (G).
IC3,
C813,
4. Set DECT tester power to -70dBm.
C807, C819,
5. Execute the command “readrssi”.
C826, D801,
6. Confirm: 25 < returned value < 43 (hex) (0E ± A (hex))
C817,
D6,
C39,
C38,
R802, C823,
C803,
C44,
C806, C802,
C804
1. Connect Charge Contact 12Ω/2W resistor between charge+ and charge-.
F1, C58, C60
2. Measure and confirm voltage across the resistor is 3.0V ± 0.2V.
R39, C61, C40
25
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
Items
(N)* Audio Check
9.2.2.
Adjustment
Point
-
Procedure
Check or
Replace Parts
1. Link with Handset which is connected to Line Simulator.
2. Set line voltage to 48V and line current to 50mA.
3. Input -45dBm(600Ω)/1kHz to MIC of Handset. Measure the Level at Line I/F
and distortion level.
4. Confirm that the level is -6.0 ± 3dBm and that the distortion level is < 5% at TEL
Line (600Ω Load).
5. Input -20dBm(600Ω)/1kHz to Line I/F. Measure the level at Receiver of
Handset and distortion level (*Receive volume set to third position from
minimum).
6. Confirm that the level is -21.0 ± 3dBm and that the distortion level is < 5% at
Receiver (150Ω Load).
Check Point (Charger Unit)
Items
(A) Charging Check
Adjustment
Point
-
Procedure
1. Connect Charge Contact 10Ω/2W resistor between charge+ and charge-.
2. Measure and confirm voltage across the resistor is 2.8V ± 0.3V.
Note:
After the measuring, suck up the solder of TP.
The connection of adjustment equipment are as shown in Adjustment Standard (Charger Unit) (P.37).
26
Check or
Replace Parts
R1, F1
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
9.3.
Troubleshooting by Symptom (Handset)
If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester
(*1) or not.
Remedy (*2)
Symptom
You don't have DECT Tester.
You have DECT Tester.
(Model Number : CMD60)
Battery strength is not indicated correctly by Battery icon.
Check item (A)-(C), (F)-(G).
Check item (A)-(C), (F)-(G).
You cannot hear the caller's voice.
Check item (A)-(C), (H).
Check item (A)-(C), (H)-(K), (M).
You cannot use handset a little away from base unit
even if the handset is within range of the base unit.
-
Check item (I), (L).
Does not link between base unit and handset.
Check item (A)-(C), (H).
Check item (A)-(C), (H)-(N).
The Audio level is high or low.
Check item (O).
Check item (O).
Note:
(*1) A general repair is possible even if you don’t have the DECT tester because it is for confirming the levels, such as Acoustic
level in detail.
(*2) Refer to Check Point (Handset) (P.27)
9.3.1.
Check Point (Handset)
Please follow the items below when BBIC or EEPROM is replaced.
Note:
After the measuring, suck up the solder of TP.
*: PC Setting (P.38) is required beforehand.
The connections of simulator equipment are as shown in Adjustment Standard (Handset) (P.40).
Items
(A) Battery
Confirmation
(B) VDDDCDC2
Confirmation
Adjustment
Point
Supply -
Supply -
(C)* BBIC Confirmation
-
Procedure
Check or
Replace Parts
1. Confirm that the consumption current is < 200mA, that is, there is no short C143, R102,
circuit.
L104
C140,
L103,
IC101
C141, R201,
C102, C135,
C120, C131
C803, C825,
C110, C802,
C804, C148,
D107, C109,
R121, C186
1. Confirm that the voltage between VDDDCDC2 and GND is 3.3V ± 0.3V.
IC103, C140,
L103,
R107,
IC101, C141,
R201, C102,
C135, C120
1. BBIC Confirmation (Execute the command “getchk”).
IC103, X101,
2. Confirm the returned checksum value.
C122, C123,
Connection of checksum value and program number is shown below.
C127
ex.)
checksum value
program number
011B
(D) Charge Control Check & Charge Current Monitor
Check
1.
2.
3.
4.
(E)* Charge Detection (OFF) Check
1. Stop supplying 6V to TP5(+) and TP6(-).
2. Execute the command “charge”.
3. Confirm that the returned value is 00 (hex).
DCN2EA
Apply 6V between TP5(+) and TP6(-) with current limit of PSU to 250mA.
Confirm that the charge current is ON/OFF.
SW to decrease current limit of PSU to 75mA.
Confirm that the charge current is stable.
27
C101,
R101,
Q101,
C142,
IC103
C101,
R101,
Q101,
C142,
IC103
C160,
C161,
Q102,
R108,
C160,
C161,
Q102,
R108,
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
Items
Adjustment
Point
(F)* Battery Monitor Check & Adjustment (Important)
(G) Battery
Low Confirmation (Important)
(H)* BBIC Clock Adjustment P1.0
(Important)
CLK
(I)* Transmitted
Confirmation
Power ANT
(J)* Modulation Check
ANT
(K)* Frequency
Confirmation
Offset -
(L)* Sensitivity
Confirmation
Receiver -
(M)* Timing Confirmation
-
(N)* RSSI Level Confirmation -
Procedure
Check or
Replace Parts
1. Apply 2.3V ± 0.005V between BATTERY (+) and BATTERY (-) with DC power. IC103, D107,
2. Execute the command “deactmac” to stabilize the value.
C148, C109
3. Then, execute the command “readbatt”. The returned value is XX.
4. Confirm that XX is between 98 and A7.
98 < XX < A7 (Hex)
(If XX is out of range, change BBIC)
1. Apply 2.40V between BATTERY (+) and BATTERY (-).
IC103, D107,
2. Confirm that there is no Speaker sound (Battery low alarm).
C148
3. Apply 2.2V between BATTERY(+) and BATTERY(-).
C109, R121,
4. Confirm that there is Speaker sound (Battery low alarm).
C186
R114,
C114,
D104
Q104, Q105,
R116,
R117,
BUZZER
1. Apply 2.6V between BATTERY (+) and BATTERY (-) with DC power.
C127, C122,
2. Execute the command “EnableClockOutput”.
C123, X101
3. Input Command “sfr", then you can confirm the current value.
4. Check X’tal Frequency. (10.368 MHz ± 100 Hz).
5. If the frequency is not 10.368 MHz ± 100 Hz, adjust the frequency of CLK
executing the command “setfreq xx xx (where xx is the value)” so that the
reading of the frequency counter is 10.368000 MHz ± 5 Hz.
Note:
* How to de-registration (link to base unit)
1) Push handset: menu → # → 1 → 3 → 1
2) Push handset: 0 → 0 → 0 → 0
3) Select handset you want to de-regist.
After push OK.
Register to it on Base Unit after measurement.
Remove the Antenna before starting steps from 1 to 5.
IC103, C813,
1. Configure the DECT tester (CMD60) as follows;
C807, C819,
<Setting>
C826, D803,
• Test mode: PP
C817, C149,
• RFPI: 0102030405
R802, C823,
• Traffic Channel: 5
C131, C803,
• Traffic Slot: 4
C825, C110,
• Mode: Loopback
C802, C804
2. Execute the command “testmode”.
3. Initiate connection from DECT tester.
4. Confirm that the NTP value at ANT is -19dBm ~ 25dBm.
Follow steps 1 to 4 of (I).
IC103, C813,
4. Confirm that the B-Field Modulation is 340kHz/div ~ 402kHz/div using data C807, C819,
type Fig31.
C826, D803,
C817, C149,
R802, C823,
C131, C803,
C825, C110,
C802, C804
Follow steps 1 to 4 of (I).
IC103, C813,
4. Confirm that the frequency offset is -50kHz ~ +50kHz.
C807, C819,
C826, D803,
C817, C149,
R802, C823,
C131, C803,
C825, C110,
C802, C804
Follow steps 1 to 4 of (I).
IC103, C815,
4. Set DECT tester power to -85dBm.
C830, C820,
5. Confirm that the BER is < 1000ppm.
C821, R801,
D803, C817,
C149
Follow steps 1 to 4 of (I).
IC103, C815,
4. Confirm that the Timing accuracy is < ± 2.0ppm.
C830, C820,
C821, R801,
D803, C817,
C149
Follow steps 1 to 4 of (I).
IC103, C815,
4. Set DECT tester power to -70dBm.
C830, C820,
5. Execute the command “readrssi”.
C821, R801,
6. Confirm: 9 < returned value < 13 (hex) (0E ± 5 (hex))
D803, C817,
C149
28
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
Items
(O) Audio
Check
Confirmation
Adjustment
Point
and -
Procedure
1.
2.
3.
4.
Link to BASE which is connected to Line Simulator.
Set line voltage to 48V and line current to 40mA.
Input -45dBm/1KHz to MIC and measure Line output level.
Confirm that the level is -6.0 ± 3dBm and that the distortion level is < 5% at TEL
Line (600Ω Load).
5. Input -20dBm/1KHz to Line I/F and measure Receiving level at SP+ and SP-.
6. Confirm that the level is -21.0 ± 3dBm and that the distortion level is < 5% at
Receiver. (vol = middle, 150Ω Load)
29
Check or
Replace Parts
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
10 Disassembly and Assembly Instructions
10.1. Disassembly Instructions
10.1.1. Base Unit
2 screws
Remove the 2 screws to remove
the cabinet cover.
Cabinet cover
ԙ
Insert a plastic card. (Ex. Used SIM card etc.)
between the cabinet body
and the cabinet cover, then
pull it along the gap to open
the cabinet.
Cabinet body
plastic card
Cabinet cover
Ԛ Remove the solders to remove
the main P.C. board.
Main P.C. board
Ԛ solders
30
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
10.1.2. Handset
Ԙ 2 screws
Remove the 2 screws.
Insert a plastic card.
(Ex. Used SIM card etc.)
between the cabinet body
and the cabinet cover, then
pull it along the gap to open
the cabinet.
Cabinet body
Cabinet cover
Likewise, open the other
side of the cabinet.
Remove the cabinet cover
by pushing it upward.
Cabinet cover
Screw
Remove the solders.
Solders
Remove the screw to remove
the main P. C. board.
Main P.C.board
31
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
10.1.3. Charger Unit
Ԙ Screw
Ԙ Remove the screw to remove
the cabinet cover.
ԙ Solders
ԙ Remove the solders to remove
the 2 charge terminals.
2 charge terminals
32
Main P.C. board
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
10.2. How to Replace the Handset LCD
P. C. board
Vertical Interval
Tolerance
Peel off the FFC (Flexible Flat Cable) from
the LCD, in the direction of the arrow. Take
care to ensure that the foil on the P.C. board
is not damaged.
0.2 mm
Horizontal Interval
Tolerance
0.2 mm
If interval tolerance between center lines
is less than 0.2 mm, it is o.k.
New LCD
OK
Fit the heatseal of a new LCD.
NG
(Inclined)
Tip of Soldering Iron
(Part No. PQZZ430PIR)
Rubber of Soldering Iron
(Part No. PQZZ430PRB)
Heatweld with the tip of the soldering
iron about 5 to 8 seconds
(in case of 60W soldering iron).
NG
(Vertical interval tolerance is
more than 0.2 mm.)
NG
(Horizontal interval tolerance is
more than 0.2 mm.)
33
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
11 Measurements and Adjustments
11.1. The Setting Method of JIG (Base Unit)
11.1.1.
Preparation
11.1.1.1. Equipment Required
• DECT tester: Rohde & Schwarz, CMD 60 is recommended.
• Frequency counter: it must be precise to be able to measure 1Hz (precision; ±4ppm).
Hewlett Packard, 53131A is recommended.
• DC power: it must be able to output at least 1A current under 9V.
• Digital multi-meter (DMM): it must be able to measure voltage and current.
• Oscilloscope
11.1.1.2. JIG and PC
Note:
*: If you have the JIG Cable for TCD500 series
(PQZZ1CD505E), change the following values of
resistance. Then you can use it as a JIG Cable for both
TCD300 and TCD500 series. (It is an upper compatible JIG
Cable.)
• Serial JIG
PQZZ1CD300E*
• PC which runs in DOS mode
• Batch file CD-ROM for setting: PNZZTG1711ME
Resistor
R2
R3
R4
R7
11.1.2.
Old value (kΩ)
22
22
22
4.7
New value (kΩ)
3.3
3.3
4.7
10
PC Setting
11.1.2.1. Connections
Connect the AC adaptor to J2 (base unit).
Serial JIG to the Serial Port of PC.
Connect the Clip cable GND.
Connect the Clip cable TXD and RXD.
1 AC adaptor
4 RXD (red)
2
4 TXD (yellow)
RXD
To Serial Port
(com port 1*)
3 GND (black)
TXD
GND
PC
Base Unit
Note:
*: Comport names may vary depending on what your PC calls it.
34
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
11.1.2.2. Batch file Setting
1. Insert the Batch file CD-ROM into CD-ROM drive and
copy PNZZTG***** folder to your PC (example: D drive).
<Example for Windows>
2. Open a window of MS-DOS mode.
On your computer, click [Start], select Programs
(All Programs for Windows XP/Windows Server 2003),
then click
MS-DOS Prompt. (for Windows 95/Windows 98)
Or
Accessories-MS-DOS Prompt. (for Windows Me)
Or
Command Prompt. (for Windows NT 4.0)
Or
Accessories-Command Prompt.
(for Windows 2000/Windows XP/Windows Server 2003)
3. At the DOS prompt, type "D:" (for example) to select the
drive, then press the Enter key.
4. Type "CD 㪳PNZZTG*****", then press the Enter key.
<Example: correct setting>
5. Type "CTE open com X", then press the Enter key
(X: COM port number used for the serial connection on your PC).
6. Type "READID", then press the Enter key.
䊶If any error messages appear, change the port number or
䇭check the cable connection.
䊶If any value appear, go to next step.
7. Type "DOSKEY", then press the Enter key.
C: >Documents and Settings>D:
D: >>CD >PNZZTG*****
D: >PNZZTG***** >CTE open com X
D: >PNZZTG*****>READID
00 52 4F A8 A8
D: >PNZZTG*****>DOSKEY
D: >PNZZTG*****>
<Example: incorrect setting>
C: >Documents and Settings>D:
D: >>CD >PNZZTG*****
D: >PNZZTG***** >CTE open com X
D: >PNZZTG*****>READID
ReadID
ReadIPUI Error: read access failed
D: >PNZZTG*****>
Note:
• “*****” varies depending on the country.
11.1.2.3. Commands
See the table below for frequently used commands.
Command name
readid
writeid
setfreq
hookoff
hookon
Getchk
Function
Read ID (RFPI)
Write ID (RFPI)
adjust Frequency of RFIC
off-hook mode on Base
on-hook mode on Base
Read checksum
Example
Type “readid”, and the registered ID is read out.
Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E 98” is written.
Type “setfreq nn nn”.
Type “hookoff”.
Type “hookon”.
Type “getchk”.
35
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
11.2. Adjustment Standard (Base Unit)
When connecting the simulator equipment for checking, please refer to below.
11.2.1.
Bottom View
AF
OSC
OSC
OSC
AF
OSC
AF VOLT
METER
600
SP
BELL
Simulator
L1R
Call - ID
Simulator
L1T
MIC
6.3 V 47 F
LOOP
Simulator
AF VOLT
METER
150
Dummy Handset
DTMF
Tester
A
TEL
DC
YLW
BLK
BRN
RED
GRY PUR
ANT
GND
TP3
DECT Tester
CTS60
L1T
L1R
DCM
DCP
PC
RXD
P1.0
TXD
GND
RXD
TXD
GND
Serial
JIG
LINE_DC
DC_IN
DC_IN
VDD
TP4
GND
GND
2W
VDD
12
CHARGE-
CHARGE+
GND
LINE_DC
GND
CLK
Charge
Charge+
Frequency
Digital
Digital
Digital
Counter
Volt Meter
Volt Meter
Volt Meter
Note:
(A) - (O) is referred to Check Point (Base Unit) (P.24)
36
DC POWER
DC 6.5V
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
11.3. Adjustment Standard (Charger Unit)
When connecting the simulator equipment for checking, please refer to below.
11.3.1.
Bottom View
Digital
Volt Meter
/2 W
Charge+
Charge-
12
PNLB1922Z
PbF
F1
3.0A
-IG
A
Note:
(A) is referred to Check Point (Charger Unit) (P.26)
37
(GND)
DC POWER
DC 5.5 V
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
11.4. The Setting Method of JIG (Handset)
11.4.1.
Preparation
11.4.1.1. Equipment Required
• DECT tester: Rohde & Schwarz, CMD 60 is recommended.
• Frequency counter: it must be precise to be able to measure 1Hz (precision; ± 4ppm).
Hewlett Packard, 53131A is recommended.
• DC power: it must be able to output at least 1A current under 2.4V for Handset.
• Digital multi-meter (DMM): it must be able to measure voltage and current.
• Oscilloscope
11.4.1.2. JIG and PC
Note:
*: If you have the JIG Cable for TCD500 series
(PQZZ1CD505E), change the following values of
resistance. Then you can use it as a JIG Cable for both
TCD300 and TCD500 series. (It is an upper compatible JIG
Cable.)
• Serial JIG
PQZZT1CD300E*
• PC which runs in DOS mode.
• Batch file CD-ROM for setting: PNZZTG1711ME
Resistor
R2
R3
R4
R7
11.4.2.
Old value (kΩ)
22
22
22
4.7
New value (kΩ)
3.3
3.3
4.7
10
PC Setting
11.4.2.1. Connections
Connect the DC Power or Battery to BATTERY(+) and BATTERY(-) (Handset).
Serial JIG to the Serial Port of PC.
Connect the Clip cable GND.
Connect the Clip cable TXD and RXD.
4 RXD (red)
2
4 TXD (yellow)
3 GND (black)
RXD TXD
1
BATTERY
+
BATTERY -
GND
VBAT
DC Power
or Battery
To Serial Port
(com port 1*)
PC
Handset P. C. board
Note:
*: Comport names may vary depending on what your PC calls it.
38
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
11.4.2.2. Batch file Setting
1. Insert the Batch file CD-ROM into CD-ROM drive and
copy PNZZTG***** folder to your PC (example: D drive).
<Example for Windows>
2. Open a window of MS-DOS mode.
On your computer, click [Start], select Programs
(All Programs for Windows XP/Windows Server 2003),
then click
MS-DOS Prompt. (for Windows 95/Windows 98)
Or
Accessories-MS-DOS Prompt. (for Windows Me)
Or
Command Prompt. (for Windows NT 4.0)
Or
Accessories-Command Prompt.
(for Windows 2000/Windows XP/Windows Server 2003)
3. At the DOS prompt, type "D:" (for example) to select the
drive, then press the Enter key.
4. Type "CD 㪳PNZZTG*****", then press the Enter key.
<Example: correct setting>
5. Type "CTE open com X", then press the Enter key
(X: COM port number used for the serial connection on your PC).
6. Type "READID", then press the Enter key.
䊶If any error messages appear, change the port number or
䇭check the cable connection.
䊶If any value appear, go to next step.
7. Type "DOSKEY", then press the Enter key.
C: >Documents and Settings>D:
D: >>CD >PNZZTG*****
D: >PNZZTG***** >CTE open com X
D: >PNZZTG*****>READID
00 52 4F A8 A8
D: >PNZZTG*****>DOSKEY
D: >PNZZTG*****>
<Example: incorrect setting>
C: >Documents and Settings>D:
D: >>CD >PNZZTG*****
D: >PNZZTG***** >CTE open com X
D: >PNZZTG*****>READID
ReadID
ReadIPUI Error: read access failed
D: >PNZZTG*****>
Note:
• “*****” varies depending on the country.
11.4.2.3. Commands
See the table below for frequently used commands.
Command name
rdeep
Function
Read the data of EEPROM
readid
writeid
setfreq
Getchk
wrteep
Read ID (RFPI)
Write ID (RFPI)
adjust Frequency of RFIC
Read checksum
write eeprom
Example
Type “rdeep 00 00 10”, and the data from address “00 00” to “10” is read
out.
Type “readid”, and the registered ID is read out.
Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E 98” is written.
Type “setfreq nn nn”.
Type “getchk”.
Type “wrteep 01 23 45”. “01 23” is address and “45” is data to be written.
39
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
11.5. Adjustment Standard (Handset)
When connecting the simulator equipment for checking, please refer to below.
11.5.1.
Component View
AF Volt
Meter
AF
OSC
JOINT1
ANT-Short
cam10
cam9
ANT1
ANT-Short-GND
cam11
PbF
ANT
cam4
C149
ANT
GND
LOOP
Simulator
C152
TP12
600
Receiver
C150
C151
TP13
REVBZ1
BLUE
/GRN
D104
YLW
C114
R114
C113
Q104
Q105
R116
C823
C131
C807
REV+
C821
C830
C804
C815
C110
D106
C803
C802
C826
C819
D105 C813
R113
C817
D803
C820
C825
AF
Volt Meter
150
TP2+
C112 TP1D103
C170 D102
R170
R171
R117
Dummy Base
Unit
DECT Tester
CMD60
R112
C162
R802
C120
IC103
C123
C108
R801
C105
C121
RF-SHIELD
C127
X101
R105 C106
1 C122
C119
C129
C126
C107
C128
R121 C186 C124
C111
Q103
VDDDCDC2 C115 C116
C163
GND
TP22
C125
IC102
TP17
C147
C135
C109
P1.0
Frequency
Counter
D107
GND
C102
R201
Q201
C141
1
Q102
R101
C160
R108
Q101
R122
TP23
PNLB1930Z -LV
KX-TGA161R
Battery +
RXD
TXD
VBAT GND
cam12
BATTERY+
BATTERYMIC+ MIC-
Battery -
C101
TP5
C100
TP5
MIC+
R230
MIC-
Charge+
TP6
C117
MIC+
TP6
TP23
BAT
GND
BATT Low Check
2.3V
R102
C144
L103
DC 6V
TALK Key
C142
R107
C140
L104
C143
DC Power
2.30V - 2.60V
TP22
C148
BAT
C161
IC101
4
TP17
Power Key
P1.0
C103 C104
4.7k
+3.3V
Digital
Volt Meter
Charge-
A
MIC-
6.3V 47 F
AF
Generator
Note:
(A) - (O) is referred to Check Point (Handset) (P.27)
40
RXD
TXD
Serial JIG
GND
PC
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
11.6. Things to Do after Replacing IC
Cautions:
Since this page is common to each country, it may not apply to some models in your country. The contents below are the
minimum adjustments required for operation.
11.6.1.
Base Unit
Before doing the following adjustment, be sure to do PC Setting (P.34) in The Setting Method of JIG (Base Unit).
IC
Programs for Voice processing, interface for RF and
EEPROM
EEPROM Adjustment parameter data
(country version batch file, default batch file, etc.)
Necessary Adjustment
1. Clock adjustment: Refer to Check Point (D). (*1)
BBIC
1. Default batch file: Execute the command “DefaultEEP”.
2. Country version batch file: Execute the command
“TG16XX_FP_ROM2_xx_yyy.bat”. (*2)
3. Clock adjustment: Refer to Check Point (D). (*1)
Note:
(*1) Refer to Check Point (Base Unit) (P.24)
(*2) xx: country code, yyy: revision number
“xx” and “yyy” vary depending on the country version. You can find them in the batch file, PQZZ- mentioned in JIG and PC
(P.34).
11.6.2.
Handset
Before doing the following adjustment, be sure to do PC Setting (P.38) in The Setting Method of JIG (Handset).
BBIC
EEPROM
IC
Programs for Voice processing, interface for RF
and EEPROM
Adjustment parameter data
(country version batch file, default batch file, etc.)
Necessary Adjustment
1. Clock adjustment: Refer to Check Point (H). (*3)
2. 4.0 V setting and battery low detection: Refer to Check Point (A),
(F) and (G). (*3)
1. Default batch file: Execute the command “Default”.
2. Melody Initialize batch file; Execute the Command "Melody_008".
3. Country version batch file: Execute the command
"TG16XX_PP_xx_yyy.bat".
4. Clock adjustment: Refer to Check Point (H). (*3)
5. 4.0 V setting and battery low detection: Refer to Check Point (A),
(F) and (G). (*3)
Note:
(*3) Refer to Check Point (Handset) (P.27)
(*4) xx: country code, yyy: revision number
“xx” and “yyy” vary depending on the country version. You can find them in the batch file, PQZZ- mentioned in JIG and PC
(P.38).
41
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
11.7. RF Specification
11.7.1.
Base Unit
Item
TX Power
Modulation
Frequency Offset
RX Sensitivity
Timing Accuracy
RSSI Level
Value
More than 14 dBm ~ 26 dBm
340 kHz/div ~ 402 kHz/div
-50 kHz ~ +50 kHz
< 1000 ppm
< ± 2.0 ppm
0E hex ± A hex
Refer to -. *
Check Point (Base Unit) (G)
Check Point (Base Unit) (H)
Check Point (Base Unit) (I)
Check Point (Base Unit) (J)
Check Point (Base Unit) (K)
Check Point (Base Unit) (L)
*: Refer to Check Point (Base Unit) (P.24)
11.7.2.
Handset
Item
TX Power
Modulation
Frequency Offset
RX Sensitivity
Timing Accuracy
RSSI Level
Value
More than 19 dBm ~ 25 dBm
340 kHz/div ~ 402 kHz/div
-50 kHz ~ +50 kHz
< 1000 ppm
< ± 2.0 ppm
0E hex ± 5 hex
**: Refer to Check Point (Handset) (P.27)
42
Refer to -. **
Check Point (Handset) (I)
Check Point (Handset) (J)
Check Point (Handset) (K)
Check Point (Handset) (L)
Check Point (Handset) (M)
Check Point (Handset) (N)
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
11.8. How to Check the Handset Speaker or Receiver
1. Prepare the digital voltmeter, and set the selector knob to ohm meter.
2. Put the probes at the speaker terminals as shown below.
Is the value between
(+) terminal and (–) terminal about 150Ω?
YES
NO
OK
NG
Replace the new
speaker.
Handset speaker
Digital Voltmeter
11.9. Frequency Table (MHz)
Channel 0
Channel 1
Channel 2
Channel 3
Channel 4
Ch. (hex)
00
01
02
03
04
TX/RX Frequency (MHz)
1928.448
1926.720
1924.992
1923.264
1921.536
43
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
12 Miscellaneous
12.1. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
12.1.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity → 0.82.
Type → RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4)
12.1.2. How to Remove the IC
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
44
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
12.1.3. How to Install the IC
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
12.1.4. How to Remove a Solder Bridge
1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
45
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
12.2. How to Replace the Shield Case
12.2.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608°F ± 68°F (320°C ± 20°C)
12.2.2. Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
12.2.3. How to Remove the Shield Case
Note:
If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.
1. Cut the case along perforation.
2. Remove the cut part.
3. Cut the four corners along perforation.
4. Remove the reminds by melting solder.
46
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
12.2.4. How to Install the Shield Case
Note:
• If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.
• Shield case’s No. : PNMC1040Z
1. Put the shield case.
2. Solder the surroundings.
47
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
12.3. Terminal Guide of the ICs, Transistors, Diodes and Electrolytic
Capacitors
12.3.1. Base Unit
4
1
4
1
C
(Reverse View)
5
8
1
1
2
59
B
44
43
E
3
16
17
PNWITG1611EH
28
27
PNLP2245Z
C0DBEYY00102
B1AAJC000010
B1ACGP000008
B1ABCE000009
B1ABDM000001
Cathode
Cathode
Anode
PQVDRLZ20A
Anode
B0EDER000009
B0DDCD000001
12.3.2. Handset
4
C
1
1
(Reverse View)
5
8
1
59
43
16
17
PNWIGA161EXR
44
28
27
PNLP2247Z
654
B
E
3
1 2
B1ADGE000012
PSVTDTC143X
B1ABGE000011
Cathode
Cathode
Anode
Anode
DA2J10100L
B0JCMC000006
B3ADB0000064
B0DDCD000001
48
2SC4081R
MTM767200LBF
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
13 Schematic Diagram
13.1. For Schematic Diagram
13.1.1. Base Unit (Schematic Diagram (Base Unit))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. This schematic diagram may be modified at any time with the development of new technology.
13.1.2. Handset (Schematic Diagram (Handset))
Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagrams may be modified at any time with the development of new technology.
13.1.3. Charger Unit (Schematic Diagram (Charger Unit))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. This schematic diagram may be modified at any time with the development of new technology.
49
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
13.2. Schematic Diagram (Base Unit)
1 1 2
1k 0.22u
*SA1
C
C
C58
DCIN +
0.1u
C60
10p
NC
C
DCP
10p
C29
DCM
DCIN -
C
C
C40
C61
0.1u
CL14
Charge +
VDDPA/RF
C
C
2
1
2 C X1
3
NC
10p
C43
*C41
C39
10p
NC
C37
C42
10p
2
1
3
D6
10p
C38
C817
10p
3
10p
D801
C826
C
C
2
1
C
1.2p
C819
C813
3p
C807
C
R43 330
NC
C803
100n
10p
C
C
C
C
C820
1p
C C
C825
VDDPA/RF
C
C
1p
R44 330
2
4
C
R802
C
330 R801
330
3
C
10p
SW1
C
C823
10p
3
20.736M
6
1
2p
1
C
VDDPA/RF
C
10p
4
C23
23
22
21
20
19
18
17
/4
C821
Shield
C22
C
C
69
70
71
72
73
POS 61
POX 60
100n
C44
C7 100n
43
42
41
40
C1063p
39
C105NC
38
R200 330
37 C109NCR201 330
36
C104NC
35
C10310p
34
33
32
31
30
29
28
VDDPA1
VVCO/VDDRF/VDDPLL
VDDBRF
RXI
RXIX
PY4/ANT2
PY3/ANT1
C C12 100n
5
64 VDDIO
63 VDDE2
62 VDDE1
*IC3
1
2
C17 100n 3
4
5
6
7
8
9
10
11
12
13
14
15
16
C11 10p
R17
100k
GND12
GND13
GND14
GND15
GND16
C830
C
27
26
25
24
GND11
GND10
GND9
GND8
C806
TXD
RXD
GND1
68
67
66
65
4.7u
P1.0
GND4
GND3
GND2
GND1
C815
NC
C
HO1P
HO1N
P0_0/PWM
I2DAT
I2CLK
SUPEEP
MTSR
SCLK
P1_0
P1_1
TXD
RXD
VDDBAT
RESETQ
SDRV
SENSE
C802
SCL 6
SDA 5
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
IC3
C
C
/4
C
C804
100n
3 A2
4 VSS
C48 100n
C
VCC 8
WP 7
ANT_1
TP4
1 2
ANT_2
TP3
2 1
C
VANA
MAD4N
MAD4P
NC/MAD2P
MICS/LINEA
MICN/LINEN
MICP/LINEP
CDT
CHARGESTART
VDDDCDC
PL22/R2
PL21/DRON
PL20/TONE/PWM
GND7
GND6
GND5
IC1
1 A0
2 A1
C
ONSW
VCORE
VOSC
VSSOS
XTAL
LOAD
RXON
TXON
PX0/RTS
PX1/CTS
PX2
PX3
PX4
PY0
PY1
PY2
C110 NC
C1115p
VDDA
2.5Vdc
CL13
Charge -
0.9p
C
16
C34
C59
ADJ
1
!
F1
3A
J101
DC_IN
3p
VDD
C
2 OUT1 IN 3
4 OUT2
180
R35
C
C
+5.5V
IC2
200
C
VDD
2.65Vdc
R36
C28 100u16
NC
C25
220k
180k
180k
R31
10p
C
SA2
NC
+2.65VDC
10
NC
R39
680p
*P101
K2.2
820k 10n
100u
C35
R34 C27
NC
C73
C18
R53
*SA3
1 2
NC
*R37 *D4
10p
C
0
NC
2
*D3 *C32
680p
L1T
L1R
22k
820k 10n
R51
220k
R19
R16
R30
C30
R33 C26
NC
C72
VDDA
+2.5VDC
680p
NC
R52
330k
C71
C C C
C31
*R29
R50
330k
C70
33k
NC
C
C
C16
*R20 39k
NC
*R25
C
*R21
2.2k
C108
C C C
*C57 NC
*R15
NC
NC
*C56 NC
*R24
C
3
E
10k
*R28
C
C
C
2
4
C
680p
R22
NC
NC
*C45
R18
10k
*C21
100n
100
C
10
*R32
K
NC
*D1
NC
*D7
D2
1
*R27
*Q4 C
680 B
Q2
C107
C
470n
56
C9
1M
0.1u
R5
820k
C
+60V DC ON-HOOK
+10V DC OFF-HOOK
E
100k
A
15n
C
*C15
560p
C14
C
*R8
C
*C6
*Q3
B R26
C
R14
3.3k
R10
K0.22u
C4
*R12
100k
C
NC
*C13
1u
R13
C5
NC
*R11
22
C10
C8
R7
R9
NC
*D10
13k
22k
*R6
10u
NC
*C3
*C1
*C50
100
Q1
C
R2
LINE_DC
C
150
NC
*R3
750
*R4
C
+0V DC ON-HOOK
+0.7V DC OFF-HOOK
+0V DC ON-HOOK
+9.8V DC OFF-HOOK
2.7k
+0V DC ON-HOOK
+9.8V DC OFF-HOOK
C
NC: No Components
KX-TG1711/1712ME SCHEMATIC DIAGRAM (Base Unit_Main)
50
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
13.3. Schematic Diagram (Handset)
L104
C
2
Q102
10p
56
NC
CHARGE-
C161
1
C100
C101 0.1u
10p
C160
R101 3.3k
E
B
D 6
G
4.7u
A2 5
S
C140
A1 4
3
IC101
CHARGE+
TP6
NC
C147
6.3
C135
220u
R107
TP5
Q101
7
CN2
8
CN2
9
CN2
C150 K1u
10 CN2
C151
11 CN2
1
C817
0.9p
ANT
2
1
3
D803
2
10p
C807
1.5p
C819
G
G
10p
C823
C821
G
0.5p
10p
G
220u
6.3
100n
C131
5p
C803
C825
C110
1u
C802
4.7u
0.8p
C815
1.2p
C127
100n
C126
100n
100n
C152 K1u
G
G
20.736M
3
1
1P
VDDDCDC2
VDDIO
G
C820
2
1
TP22
1
2
SIGN170
2
1
DN
PAUSE
2
TALK
10p
1
2
1
CLEAR
2
1
2
1
3
REDIAL
2
1
2
2
1
NC
CN2
R802
G
10p
G
G
VDDPA
G G
C826
390
12
C113
6
23
22
21
20
19
18
17
G
G
POS 61
POX 60
390
R801
VDDC
A K
D104
CN2
R114
CN2
5
G
VDDPA
64 VDDIO
63 VDDE2
62 VDDE1
C804 100n
VDDPA1
VVCO/VDDRF/VDDPLL
VDDBRF
RXI
RXIX
PY4/ANT2
PY3/ANT1
C122 C123
10p
4
G
69
70
71
72
73
IC103
X101
C114
CN2
+1.5VDC
1k
3
2
SW1
POWER
R117
CN2
1k
CN2
2
R116
1
C109 6.3 100u
C148
BAT
1
27
26
25
24
G
TP17
D107
GND4
GND3
GND2
GND1
GND12
GND13
GND14
GND15
GND16
GND11
GND10
GND9
GND8
C830
VDDBAT
VDDIO
68
67
66
65
C813
3.3p
HO1P
HO1N
P0_0/PWM
I2DAT
I2CLK
SUPEEP
MTSR
SCLK
P1_0
P1_1
TXD
RXD
VDDBAT
RESETQ
SDRV
SENSE
C124
100n
R121
C186 1000p
C125 NC
100k
WP 7
VCC 8
2 A1
1 A0
C107
VANA
MAD4N
MAD4P
NC/MAD2P
MICS/LINEA
MICN/LINEN
MICP/LINEP
CDT
CHARGESTART
VDDDCDC
PL22/R2
PL21/DRON
PL20/TONE/PWM
GND7
GND6
GND5
D103
D102
SDA 5
SCL 6
IC102
4 VSS
3 A2
10p
44
45
46
47
48
49
50
51
52
53
54
55
56
57
VDD
58
DCDC2 59
P1.0
C163
GND RXD
TXD
10p
+2.85V
DC
G
1
ONSW
2
VCORE
3
VOSC
4
VSSOS
5
XTAL
6
LOAD
7
RXON
8
TXON
9
PX0/RTS
10
PX1/CTS
11
PX2
12
PX3
13
PX4
14
PY0
15
PY1
16
PY2
100p
NC
C149
10p
ANT1
IC103
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
10p
C162
C116
C111
NC
10p
C170
C112
2
C115 100p
NC
R171
G
C120 10p
C128
100n
C129
100n
G
R170
TP1-
ANT-Short
10p
B
Q103
ANT-Short-GND
C121
120
120
R112 *D105
R113 *D106
+2.5VDC
C
10u R105 2.2k
C106 100n
C119 NC
C105
100n
C108 NC
10p
VDDDCDC1
E
Receiver
TP2+
1
+
G
LCD Back Light LED
MIC33
R230
C117
MIC+
1
2
-
K
NC
*Q201
R122
MIC
L103
10u
C1414.7u
C102
3.3k
R108
+3.3VDC
0
6.3 220u
C104 NC
*R201
1u
C142
100m
10k
R102
VDDDCDC1
VDDDCDC2
VDDDCDC2
C103 NC
VDDBAT
VBAT
NC
C144
BATTERY-
5.6n
10p
C143
BATTERY+
1
1
2
1
2
1
BZ1
1
TP13
2
1
UP
PHONEBOOK
TP12
BUZZER
2
2
1
6
2
1
2
1
9
CID
2
1
2
4
5
2
1
8
2
7
MENU/OK
1
Q104
TP23
K1u
2
FLASH
1
2
#
1
2
0
1
2
*
12 CN2
13 CN2
Q105
14 CN2
15 CN2
LCD
Shield
16 CN2
5
6
1
4
2
3
G
NC: No Components
KX-TGA171 SCHEMATIC DIAGRAM (Handset_Main)
51
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
13.4. Schematic Diagram (Charger Unit)
!
1
F1
R1
TP1
6.8 (2W)
2
J1
TP2
G
SCHEMATIC DIAGRAM (Charger Unit)
52
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
14 Printed Circuit Board
14.1. Circuit Board (Base Unit)
14.1.1. Component View
+2.65V DC
SW1
C37
C39
C815
1
C25
C813
C830
C820
C44
C806
C802
C804
C819
C803
C826
C807
C825
X1
C22
R44 R43 R802R801 C23 C17 C12
RF-SHIELD
IC3
C48
R17
C11
D3 D4
C60
C58
IC1
1
C108
C30
C1
C50
R20 R24
D2
P101
C32
ON-Hook: +60V DC
OFF-Hook: +10V DC
2
R11
C10
C59
C34
R39
R28
R37
C3
R29 R32
Q3
R26
C27
SA3
SA1
SA2
C31
Q4
C56
R25
C104 C107
C57 R21
R201
C110
R31
C18
R53
R19 R51
C26
R34
R16 C71
C73
C103
R50 R52
C111 C7
R22
R33
C109 R200
C21
C70 C16
R30
R27
R8
C9 R2
C45
R15
C72
C105
R18
C4
C106
C5
Q1
R5
Q2
C8
R14 C6
R6
R7
C15
R10
R9
R3 D1 D10
C14
D7
R13
R12 R4
IC2
C29 C13
F1
C35
C61
53
C821
D801
C823
C817
D6
C43
R35
1
3A
C38
C42
C41
C28
PbF
C40
PNLB1929Z -LV
KX-TG16
R36
1
A
KX-TG1711/1712 CIRCUIT BOARD (Base Unit_Main (Component View))
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
14.1.2. Bottom View
TXD
GND
TXD
GND
DC_IN
RXD
RXD
TP4
TP3
ANT
for JIG
VDD
VDD
+2.65V DC
Charge
Charge+
P1.0
DCP
P1.0 CLK
10.368MHz
L1R
L1R
Charge +
BRN
RED
DC
GRY PUR
DCM
Charge -
TEL
LINE_DC
L1T
YLW
BLK
L1T
Line DC
0V: ON-Hook
+9.8V: Off-Hook
A
KX-TG1711/1712 CIRCUIT BOARD (Base Unit_Main (Bottom View))
54
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
14.2. Circuit Board (Handset)
14.2.1. Component View
JOINT1
ANT-Short
cam10
cam9
ANT1
ANT-Short-GND
cam4
cam11
PbF
C149
ANT
ANT
C152
TP12
Receiver
C150
C151
TP13
BZ1
BLUE
/GRN
D104
YLW
C114
R114
C113
Q104
TP2+
C112 TP1D103
C170 D102
R170
R171
R117
Q105
R116
C823 C817
C131
D803
C820
C825
C807
C821
C830
C804
C815
C110
D106
C803
C802
C826
C819
D105 C813
R113
REVREV+
R112
C162
R802
C120
IC103
C123
C108
R801
C105
C121
RF-SHIELD
C127
X101
R105 C106
1 C122
C119
C129
C126
C107
C128
R121 C186 C124
C111
Q103
+3.3VDC
P1.0 CLK
10.368MHz
RESET
VDDDCDC2 C115 C116
C163
P1.0
TP17
C103 C104
TP22
C125
IC102
C147
C135
C109
D107
C102
R201
Q201
C141
1
4
C148
BAT
C161
Q102
R101
C160
R108
Q101
C142
R107
R122
IC101
R102
C144
TP23
L103
PNLB1930Z -LV
KX-TGA161R
C140
L104
C143
RXD TXD
RXD
TXD for JIG
GND
VBAT GND
cam12
BATTERY+
BATTERY-
BATTERY+
BATTERYMIC+ MIC-
C101
MIC+
TP5
C100
C117
MIC-
MIC+
Charge+
MIC-
TP6
R230
Charge-
A
KX-TGA171 CIRCUIT BOARD (Handset_Main (Component View))
55
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
14.2.2. Bottom View
CN2
PHONEBOOK
MENU/OK
PAUSE
UP
TALK
CID
SW1
REDIAL
CLEAR
FLASH
DN
2
3
4
5
6
7
8
9
0
#
MIC-
MIC+
1
A
KX-TGA171 CIRCUIT BOARD (Handset_Main (Bottom View))
56
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
14.3. Circuit Board (Charger Unit)
14.3.1.
Component View
R1
J1
A
CIRCUIT BOARD (Charger Unit (Component View))
14.3.2. Bottom View
-IG
3.0A
PNLB1922Z
PbF
F1
A
CIRCUIT BOARD (Charger Unit (Bottom View))
57
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
15 Exploded View and Replacement Parts List
15.1. Cabinet and Electrical Parts (Base Unit)
1
2
3
4
PCB1
E1
5
6
A
7
Ref.No.
Figure
A
2.6 x 8mm
58
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
15.2. Cabinet and Electrical Parts (Handset)
*STICK TO THE CENTER.
CUSHION RUBBER
*STICK IT ALONG
THIS LINE.
B
E104
106
105
E101(*1) E102
104
103
101
E105
E106
107
102
E103
E107
MIC100
E108
PCB100
E109
109
108
113
111
(*2)
112(*3)
107
B
110
Battery cover
Ref.No.
Figure
Spacer (No.112)
B
Ǿ2˜8
Stick it between
ribs.
mm
Put it in the center.
Note:
(*1) This cable is fixed by attaching. Refer to How to Replace the Handset LCD (P.33).
(*2) The rechargeable Ni-MH battery HHR-4MRT is available through sales route of Panasonic.
(*3) Attach the spacer (No. 112) to the exact location described above.
59
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
15.3. Cabinet and Electrical Parts (Charger Unit)
200
200-1
PCB200
200-2
200-3
B
Ref.No.
Figure
200-4
B
Ǿ2˜8
mm
60
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
15.4. Accessories
A1
P1, P2 (*1)
A2
Note:
(*1) The illustration differs from the actual gift box.
61
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
15.5. Replacement Part List
15.5.1.2. Main P.C.Board Parts
Note:
(*1) When replacing IC1, IC3, make the adjustment using
PNZZTG1711ME. Refer to Base Unit (P.41) of Things to Do
after Replacing IC.
(*2) When removing E1, use special tools (ex. Hot air
disordering tool).
1. RTL (Retention Time Limited)
Note:
The “RTL” marking indicates that its Retention Time is
Limited.
When production is discontinued, this item will
continue to be available only for a specific period of
time.
This period of time depends on the type of item, and
the local laws governing parts and product retention.
At the end of this period, the item will no longer be
available.
2. Important safety notice
Components identified by the
mark indicates special
characteristics important for safety. When replacing any
of these components, only use specified manufacture’s
parts.
3. The S mark means the part is one of some identical parts.
For that reason, it may be different from the installed part.
4. ISO code (Example: ABS-94HB) of the remarks column
shows quality of the material and a flame resisting grade
about plastics.
5. RESISTORS & CAPACITORS Unless otherwise
specified; All resistors are in ohms (.) k=1000., M=1000 k.
All capacitors are in MICRO FARADS (µF)p=µµF
*Type & Wattage of Resistor
Safety
IC1
IC2
IC3
Q1
Q2
Q3
Q4
D1
D2
D6
D801
SA1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R11
R12
R14
R15
R16
R17
R18
R19
R20
R21
R22
R26
R27
R28
R29
R30
R31
R33
R34
R35
R36
R37
R39
R43
R44
R50
R51
R200
R201
R801
R802
D3
D4
Type
ERC:Solid
ERDS:Carbon
ERJ:Chip
ERX:Metal Film
ERG:Metal Oxide
ER0:Metal Film
Wattage
10,16:1/8W 14,25:1/4W
12:1/2W
*Type & Voltage Of Capacitor
Type
PQ4R:Chip
ERS:Fusible Resistor
ERF:Cement Resistor
1:1W 2:2W 3:3W
ECFD:Semi-Conductor
ECCD,ECKD,ECBT,F1K,ECUV:Ceramic
ECQS:Styrol
ECQE,ECQV,ECQG:Polyester
ECUV,PQCUV,ECUE:Chip ECEA,ECST,EEE:Electlytic
ECQP:Polypropylene
ECQMS:Mica
Voltage
ECSZ Type
ECQ Type ECQG
ECQV Type
1H:50V
0F:3.15V
05:50V
2A:100V
1A:10V
1:100V
2E:250V
1V:35V
2:200V
2H:500V
0J:6.3V
Others
0J :6.3V
1A :10V
1C :16V
1E,25:25V
1V :35V
50,1H:50V
1J
:16V
2A
:100V
15.5.1. Base Unit
15.5.1.1. Cabinet and Electrical Parts
Safety
Ref.
No.
1
2
3
4
5
6
7
Part No.
PNKM1189Y1
K2ECYZ000001
PQJJ1T039M
PNLA1062Z
PNJT1063Z
PNKF1138Z1
PQHA10023Z
Part Name & Description Remarks
CABINET BODY
JACK, DC
JACK, MODULAR
ANTENNA
CHARGE TERMINAL
CABINET COVER
RUBBER PARTS, FOOT
CUSHION
Ref.
No.
PCB1
ABS-HB
PS-HB
62
Part No.
Part Name & Description Remarks
PNWPG1611MEH MAIN P.C.BOARD ASS'Y
(RTL)
(ICs)
PNWITG1611EH IC (EEPROM) (*1)
C0DBEYY00102 IC
PNLP2245Z
IC (COB) (*1)
(TRANSISTORS)
B1AAJC000010 TRANSISTOR(SI)
B1ABDM000001 TRANSISTOR(SI)
B1ACGP000008 TRANSISTOR(SI)
B1ABCE000009 TRANSISTOR(SI)
(DIODES)
PQVDRLZ20A
DIODE(SI)
B0EDER000009 DIODE(SI)
B0DDCD000001 DIODE(SI)
B0DDCD000001 DIODE(SI)
(VARISTOR)
PQVDDSS301L VARISTOR (SURGE
ABSORBER)
(RESISTORS)
ERJ2GEJ101
100
ERJ3GEYJ751 750
ERJ3GEYJ151 150
ERJ3GEYJ105 1M
ERJ3GEYJ223 22k
ERJ3GEYJ104 100k
ERJ3GEYJ824 820k
ERJ12YJ220
22
ERJ12YJ560
56
ERJ3GEYJ332 3.3k
ERJ3GEYJ133 13k
ERJ2GEJ101
100
ERJ2GEJ222
2.2k
ERJ2GEJ224
220k
ERJ2GEJ104
100k
ERJ2GEJ103
10k
ERJ2GEJ224
220k
ERJ3GEYJ393 39k
ERJ3GEYJ333 33k
PQ4R10XJ272 2.7k
ERJ3GEYJ104 100k
ERJ2GEJ681
680
ERJ2GEJ103
10k
PQ4R18XJ100 10
ERJ2GEJ184
180k
ERJ2GEJ184
180k
ERJ3GEYJ824 820k
ERJ3GEYJ824 820k
ERJ2RKF1800 180
ERJ2RKF2000 200
ERJ12YJ223U 22k
ERG2SJ100E
10
ERJ2GEJ331
330
ERJ2GEJ331
330
ERJ2GEJ334
330k
ERJ2GEJ334
330k
ERJ2GEJ331
330
ERJ2GEJ331
330
ERJ2GEJ331
330
ERJ2GEJ331
330
PQ4R18XJ102 1k
ERJ8GEY0R00 0
(CAPACITORS)
S
!S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
Safety
Ref.
No.
C3
C4
C5
C6
C7
C9
C11
C12
C13
C14
C15
C16
C17
C18
C22
C23
C26
C27
C28
C29
C30
C31
C32
C34
C35
C38
C39
C40
C41
C42
C44
C48
C58
C60
C61
C70
C71
C103
C106
C111
C802
C803
C804
C806
C807
C813
C817
C819
C820
C821
C823
C825
C826
C830
Part No.
P101
F1
10
0.22
1
0.1
0.1
0.47
10p
0.1
0.015
560p
0.1
10p
0.1
10p
2
10p
0.01
0.01
100
10p
680p
680p
0.22
100
2.2
10p
10p
0.1
10p
10p
10p
0.1
0.1
10p
3
680p
680p
10p
3
5
4.7
0.1
0.1
0.1
10p
3p
0.9p
1.2p
1p
10p
10p
10p
10p
1p
(OTHERS)
PNMC1040Z
CASE,MAGNETIC
SHIELD(*2)
D4DAY220A022 THERMISTOR (POSISTOR)
K5H302Y00003 FUSE
X1
SW1
H0J207500006 CRYSTAL OSCILLATOR
EVQPF108K
PUSH SWITCH
E1
Safety
Part Name & Description Remarks
ECEA1HKA100
ECJ0EB0J224K
ECUV1A105KBV
ECUE1C104KBQ
ECUE1A104KBQ
ECUV1C474KBV
ECUE1H100DCQ
ECUE1A104KBQ
ECUE1C153KBQ
ECUE1H561KBQ
ECUV1C104KBV
ECUE1H100DCQ
ECUE1A104KBQ
ECUE1H100DCQ
ECUE1H2R0CCQ
ECUE1H100DCQ
F0C2E103A148
F0C2E103A148
F2A1C101B060
ECUE1H100DCQ
F1B2H681A070
F1B2H681A070
ECQE2224KF
F2A1C101B060
PQCUV1A225KB
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1C104KBQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1A104KBQ
ECUE1C104KBQ
ECUE1H100DCQ
ECUE1H3R0CCQ
ECUE1H681KBQ
ECUE1H681KBQ
ECUE1H100DCQ
ECUE1H3R0CCQ
ECUE1H5R0CCQ
F1H0J4750004
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1H100DCQ
F1G1H3R0A480
F1G1HR90A480
F1G1H1R2A480
F1G1H1R0A480
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
F1G1H1R0A480
S
Part No.
PNGP1139Y1
PNYE1050Z
PNKM1187Y1
PNHS1001Z
PQHS10467Z
L0AD02A00042
PNYE1042Z
PNBC1354Z1
PNJK1107R
PNJC1018Z
PNKF1136Z1
PNHS1079Z
PNKK1053Z1
Part Name & Description Remarks
SPEAKER
SPACER, CUSHION LCD
BUTTON, NAVIGATOR KEY
KEYBOARD SWITCH
BATTERY TERMINAL
CABINET COVER
SPACER, BATTERY
LID, BATTERY
ABS-HB
ABS-HB
ABS-HB
15.5.2.2. Main P.C.Board Parts
Safety
Ref.
No.
PCB100
IC102
IC103
Q101
Q102
Q103
Q104
Q105
IC101
D104
D105
D106
D107
D803
L103
L104
D102
D103
Part Name & Description Remarks
R101
R102
R105
R107
R108
R112
R113
R114
R116
R117
R121
R122
R201
R230
R801
R802
PANEL, LCD
TAPE, DOUBLESIDED
CABINET BODY
RECEIVER NET
SPEAKER NET
C101
C102
C105
C106
C107
15.5.2.1. Cabinet and Electrical Parts
Ref.
No.
101
102
103
104
105
Part No.
Note:
(*1) Reconfirm the model No. written on the handset’s name
plate when replacing PCB100. Because the model No. of
the optional handset may differ from the included handset.
(*2) When replacing IC102, IC103, make the adjustment
using PNZZTG1711ME. Refer to Handset (P.41) of Things
to Do after Replacing IC or X'tal.
(*3) When removing E106, use special tools (ex. Hot air
disordering tool).
(*4) When replacing the handset LCD, See How to
Replace the Handset LCD (P.33).
15.5.2. Handset
Safety
Ref.
No.
106
107
108
109
110
111
112
113
PMMA-HB
ABS-HB
63
Part No.
Part Name & Description Remarks
PNWPGA171LFR MAIN P.C.BOARD ASS'Y
(RTL) (*1)
(ICs)
PNWIGA161EXR IC (EEPROM) (*2)
PNLP2247Z
IC (COB) (*2)
(TRANSISTORS)
B1ADGE000012 TRANSISTOR(SI)
2SC4081R
TRANSISTOR(SI)
PSVTDTC143X TRANSISTOR(SI)
B1ABGE000011 TRANSISTOR(SI)
B1ABGE000011 TRANSISTOR(SI)
MTM767200LBF TRANSISTOR(SI)
(DIODES)
DA2J10100L
DIODE(SI)
B3ADB0000064 DIODE(SI)
B3ADB0000064 DIODE(SI)
B0JCMC000006 DIODE(SI)
B0DDCD000001 DIODE(SI)
(COILS)
G1C100MA0395 COIL
PQLQR2M5N6K COIL
(VARISTORS)
D4ED16R80001 VARISTOR
D4ED16R80001 VARISTOR
(RESISTORS)
ERJ2GEJ332
3.3k
ERJ6RSJR10V 0.1
ERJ2GEJ222
2.2k
ERJ2GEJ560X 56
ERJ2GEJ332
3.3k
ERJ2GEJ121
120
ERJ2GEJ121
120
ERJ8GEYJ120 12
ERJ2GEJ102
1k
ERJ2GEJ102
1k
ERJ2GEJ104
100k
ERJ2GEJ103
10k
ERJ3GEY0R00 0
ERJ2GEJ330
33
ERJ2GEJ391
390
ERJ2GEJ391
390
(CAPACITORS)
ECUE1C104KBQ 0.1
EEE0JA221WP 220
ECUE1A104KBQ 0.1
ECUE1A104KBQ 0.1
PQCUV0J106KB 10
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
KX-TG1711MEB/KX-TG1712MEB/KX-TGA171MEB
Safety
Ref.
No.
C109
C110
C111
C112
C114
C115
C116
C117
C120
C121
C122
C123
C124
C126
C127
C128
C129
C131
C135
C140
C141
C142
C143
C148
C149
C150
C151
C152
C160
C161
C162
C163
C186
C802
C803
C804
C807
C813
C815
C817
C819
C820
C821
C823
C825
C826
C830
Part No.
EEE0JA101WR
ECUE0J105KBQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H101JCQ
ECUE1H101JCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H010CCQ
ECUE1H100DCQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
EEE0JA221WP
EEE0JA221WP
PQCUV0J475MB
PQCUV0J475MB
ECUE0J105KBQ
ECUE1H100DCQ
ECUE1A104KBQ
ECUE1H100DCQ
ECUV1C105KBV
ECUV1C105KBV
ECUV1C105KBV
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1E102KBQ
F1H0J4750004
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1H100DCQ
F1G1H3R3A480
F1G1HR80A480
F1G1HR90A480
F1G1H1R5A480
F1G1HR50A480
ECUE1H100DCQ
ECUE1H100DCQ
F1G1H5R0A480
ECUE1H100DCQ
F1G1H1R2A480
MIC100
E101
L0CBAY000053
L5DYBYY00022
E102
E103
E104
E105
E106
PNHR1394Z
PNHX1383Z
PNHR1393Z
PQHG10729Z
PNMC1040Z
E107
E108
E109
X101
BZ1
PNVE1011Z
PNJT1059Z
PNJT1060Z
H0J207500007
L0DACA000024
Safety
Part Name & Description Remarks
100
1
10p
10p
10p
100p
100p
10p
10p
10p
1p
10p
0.1
0.1
0.1
0.1
0.1
220
220
4.7
4.7
1
10p
0.1
10p
1
1
1
10p
10p
10p
10p
0.001
4.7
0.1
0.1
10p
3.3p
0.8p
0.9p
1.5p
0.5p
10p
10p
5p
10p
1.2p
(OTHERS)
MICROPHONE
LIQUID CRYSTAL DISPLAY
(*4)
TRANSPARENT PLATE, LCD
COVER, LCD
GUIDE, LCD
RUBBER PARTS, RECEIVER
CASE,MAGNETIC SHIELD
(*3)
BATTERY TERMINAL
CHARGE TERMINAL (L)
CHARGE TERMINAL (R)
CRYSTAL OSCILLATOR
BUZZER
Ref.
No.
200-1
200-2
200-3
200-4
Part No.
PNKM1204Z1
PNJT1087Z
PNKF1150Z1
PQHA10023Z
Part Name & Description Remarks
CABINET BODY
CHARGE TERMINAL
CABINET COVER
RUBBER PARTS, FOOT
CUSHION
PS-HB
PS-HB
15.5.3.2. Main P.C.Board Parts
Safety
S
Ref.
No.
PCB200
J1
R1
F1
Part No.
Part Name & Description Remarks
PNWPTGA161CH PC BOARD W/COMPONENT
(RTL)
(JACK)
K2ECYB000001 JACK/SOCKET
(RESISTOR)
ERG2SJ100E
10
(FUSE)
K5H302Y00003 FUSE
15.5.4. Accessories
Note:
You can download and refer to the Operating Instructions
(Instruction book) on TSN Server.
Safety
Ref.
No.
A1
A2
P1
P2
Part No.
PNLV226Z
Part Name & Description Remarks
AC ADAPTOR
PQJA10075Z
CORD, TELEPHONE
PNPK3399005Z GIFT BOX (for KXTG1711MEB)
PNPK3400004Z GIFT BOX (for KXTG1712MEB)
15.5.5. Screws
Safety
Ref.
No.
A
B
Part No.
XTB26+8GFJ
XTB2+8GFJ
Part Name & Description Remarks
TAPPING SCREW
TAPPING SCREW
15.5.6. Fixtures and Tools
Note:
(*1) See The Setting Method of JIG (Base Unit) (P.34),
and The Setting Method of JIG (Handset) (P.38).
(*2) When replacing the Handset LCD, see How to
Replace the Handset LCD (P.33)
PMMA-HB
Safety
Ref.
No.
Part No.
Part Name & Description Remarks
PNZZTG1711ME BATCH FILE CD-ROM (*1)
PQZZ430PIR
TIP OF SOLDERING IRON
(*2)
PQZZ430PRB
RUBBER OF SOLDERING
IRON (*2)
PQZZ1CD300E JIG CABLE (*1)
ABS-HB
ABS-HB
15.5.3. Charger Unit
15.5.3.1. Cabinet and Electrical Parts
Safety
Ref.
No.
200
Part No.
PNLC1023ZB
Part Name & Description Remarks
T.I
KXTG1711MEB
KXTG1712MEB
KXTGA171MEB
CHARGER UNIT ASS'Y
without NAME PLATE
(RTL) (for KXTG1712MEB)
64