Download LCD TV SERVICE MANUAL

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LCD TV
SERVICE MANUAL
CHASSIS : LP91J
MODEL : 26LK310/310Y 26LK310/310Y-TA
MODEL : 26LK311 26LK311-TB
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
P/NO : MFL62461531 (1104-REV01)
Printed in Korea
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION .................................................................9
TROUBLE SHOOTING ............................................................................14
BLOCK DIAGRAM...................................................................................17
EXPLODED VIEW .................................................................................. 18
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-2-
LGE Internal Use Only
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by
in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.
AC Volt-meter
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-3-
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
0.15uF
1.5 Kohm/10W
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1 Ω
*Base on Adjustment standard
LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
-4-
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-5-
LGE Internal Use Only
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
3. Test method
This spec sheet is applied to LCD TV used LP91J chassis.
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC
2. Specification
Each part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity : 65±10%
3) Power Voltage: Standard input voltage(100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
4. Electrical specification
4.1. Model Specification
No
Item
Specification
1.
Market
NON EU
2.
Broadcasting system
Remark
PAL/SECAM B/G/D/K,
PAL I/II, NTSC-M
3.
Available Channel
BAND
PAL
VHF/UHF
E2-C69
2~78
C1~C62
C1~C75
S21~S47
1~71
S1~S41
S2~S44
CATV
NTSC
China(DK) Australia(BG)
4.
Receiving system
Upper Heterodyne
5.
Video Input
PAL, SECAM, NTSC
22LK310/311 : Rear 1EA,
26/32LK310/311 : Rear 1EA, Side 1EA
6.
Component Input
Y/Cb/Cr, Y/ Pb/Pr
Rear
7.
RGB Input
RGB-PC, S/W Upgrade
Rear
8.
HDMI Input
HDMI-DTV, Only PCM MODE
26/32LK310/311 Rear 2EA
22LK310/311 Rear 1EA
9.
Audio Input (4EA)
PC Audio, Component, AV (2EA)
L/R Input (22LK310/311: AV Audio Input 1EA)
10.
RS-232C
Remote control, Commercial control
Rear
11.
USB Input (1EA)
Divx, MP3, JPEG
Only Side
Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-6-
LGE Internal Use Only
5. Component Video Input (Y, PB, PR)
Specification
No
Resolution
Remark
H-freq(kHz)
V-freq(Hz)
Pixel Clock(MHz)
1
720* 480
15.73
59.94
13.500
SDTV, DVD 480I(525I)
2
720* 480
15.75
60.00
13.514
SDTV, DVD 480I(525I)
3
720* 576
15.625
50.00
13.500
SDTV, DVD 576I(625I) 50 Hz
4
720* 480
31.47
59.94
27.000
SDTV 480P
5
720* 480
31.50
60.00
27.027
SDTV 480P
6
720* 576
31.25
50.00
27.000
SDTV 576P 50 Hz
7
1280* 720
44.96
59.94
74.176
HDTV 720P
8
1280* 720
45.00
60.00
74.250
HDTV 720P
9
1280* 720
37.50
50.00
74.25
HDTV 720P 50 Hz
10
1920* 1080
28.125
50.00
74.250
HDTV 1080I 50 Hz
11
1920* 1080
33.72
59.94
74.176
HDTV 1080I
12
1920* 1080
33.75
60.00
74.25
HDTV 1080I
13
1920* 1080
56.25
50
148.5
HDTV 1080P
14
1920* 1080
67.432
59.94
148.350
HDTV 1080P
15
1920* 1080
67.5
60.00
148.5
HDTV 1080P
6. RGB
(Analog PC, RGB-DTV - NOT SUPPORT)
Specification
No
Resolution
H-freq(kHz)
V-freq(Hz)
Proposed
Pixel Clock(MHz)
1
640* 350
31.468
70.09
25.17
EGA
2
720* 400
31.469
70.09
28.32
DOS
3
640* 480
31.469
59.94
25.17
VESA( VGA)
4
800* 600
37.879
60.317
40
VESA( SVGA)
5
1024* 768
48.363
60.004
65
VESA( XGA)
6
1280* 768
47.776
59.87
79.5
VESA( WXGA)
7
1360* 768
47.72
59.799
84.75
VESA( WXGA)
Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-7-
Remark
LGE Internal Use Only
7. HDMI input - PC
(Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable)
No
Resolution
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
1
640 x 480
31.469
59.94
25.17
VESA( VGA)
Proposed
2
800 x 600
37.879
60.317
40.00
VESA( SVGA)
3
1024 x 768
48.363
60.004
65.00
VESA( XGA)
4
1280 x 768
47.776
59.87
79.5
VESA( WXGA)
5
1360 x 768
47.72
59.799
84.62
VESA( WXGA)
6
1366 x 768
47.7
60.00
84.62
WXGA
7
1280 x 1024
63.595
60.00
108.875
SXGA
8
1920 x 1080
66.647
59.988
138.625
WUXGA
Remarks
8. HDMI input (DTV)
Specification
No
Resolution
H-freq(kHz)
Proposed
Remarks
V-freq(Hz)
Pixel Clock(MHz)
15.73
59.94
13.500
SDTV, DVD 480I(525I)
Spec. out
but display.
1
720 x 480
2
720 x 480
15.75
60.00
13.514
SDTV, DVD 480I(525I)
3
720 x 576
15.625
50.00
13.500
SDTV, DVD 576I(625I) 50 Hz
4
720 x 480
31.47
59.94
27
SDTV 480P
5
720 x 480
31.5
60.00
27.027
SDTV 480P
6
720 x 576
31.25
50.00
27
SDTV 576P
7
1280 x 720
44.96
59.94
74.176
HDTV 720P
8
1280 x 720
45
60.00
74.25
HDTV 720P
9
1280 x 720
37.5
50.00
74.25
HDTV 720P
10
1920 x 1080
28.125
50.00
74.25
HDTV 1080I
11
1920 x 1080
33.72
59.94
74.176
HDTV 1080I
12
1920 x 1080
33.75
60.00
74.25
HDTV 1080I
13
1920 x 1080
56.25
50.00
148.5
HDTV 1080P
14
1920 x 1080
67.432
59.94
148.350
HDTV 1080P
15
1920 x 1080
67.5
60.00
148.5
HDTV 1080P
16
1920 x 1080
27
24.00
74.25
HDTV 1080P
17
1920 x 1080
33.75
30.00
74.25
HDTV 1080P
Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-8-
LGE Internal Use Only
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV, LP91J
chassis.
(2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened.
2) Click the “Connect” button and confirm “Dialog Box”.
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
4) The input voltage of the receiver must keep 100-220 V,
50/60 Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.
(3) Download the EDID
- EDID datas are automatically download when adjusting
the Tool Option2
(4) ADC Calibration - RGB / Component
(4) Check SW Version.
3) Click the “Config.” button and Change speed I2C Speed
setting : 350 Khz ~ 400 Khz.
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input
4. PCB assembly adjustment method
4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
4) Read and write bin file.
Click “(1)Read” tab, and then load download file
(XXXX.bin) by clicking “Read”.
1
1
Filexxx.bin
Fi
Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-9-
LGE Internal Use Only
Filexxx.bin
5) Click “(2)Auto” tab and set as below.
6) Click “(3)Run”.
7) After downloading, you can see the “(4)Pass” message.
(3). Adjustment method
- The input methods are same as other chassis.(Use INSTART key on the Adjust remote control.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value
Caution : Don’t Press “IN-STOP” key after completing the
function inspection.
4.3. EDID Download method
Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID. If not possible, recommend that
connect the MSPG equipment.
There are two methods of downloading the EDID data.
4.1.2. Using the Memory Stick
* USB download : Service Mode
1) Insert the USB memory stick to the USB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message “Copy the file from the Memory”
4.3.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2 seconds.
4) After Finished the Download, Automatically DC Off -> On
4.3.2. 2nd Method
* Caution :
Must be checked that the tool option is right or not.
If tool option is wrong, HDMI EDID data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear “OK”, then complete.
5) If the TV is turn on, check the updated SW Version and tool
option.
4.2. Input tool option
Adjust tool option refer to the BOM.
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process
4.3.3. RS-232C command Method
(1) Command : AE 00 10
After Input Tool Option and AC off
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
* Caution
Don’t connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of EDID could be
failed.
(1) Profile : Must be changed the option value because being
different with some setting value depend on module
maker, inch and market.
(2) Equipment : adjustment remote control.
Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 10 -
LGE Internal Use Only
4.3.4. EDID data
(1) Analog(RGB): 128bytes>
0
1
2
3
4
5
6
7
4.4. ADC Calibration
8
9
A
B
C
D
E
F
0
00
FF
FF
FF
FF
FF
FF
00
1E
6D
01
00
01
01
01
01
10
01
15
01
03
08
46
27
78
0A
D9
B0
A3
57
49
9C
25
20
11
49
4B
A1
08
00
45
40
01
01
61
40
01
01
01
01
30
01
01
01
01
01
01
1B
21
50
A0
51
00
1E
30
48
88
40
35
00
BC
88
21
00
00
1C
0E
1F
00
80
51
00
1E
30
50
40
80
37
00
BC
88
21
00
00
18
00
00
00
FC
00
4C
60
47
20
54
56
0A
20
20
20
20
20
20
20
00
00
00
FD
70
00
3A
3F
1C
44
0F
00
0A
20
20
20
20
20
20
00
55
4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote control for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60 Hz 100 % Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
(2) HDMI 1 : 256Bytes
0
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
00
FF
FF
FF
FF
FF
FF
00
1E
6D
01
00
01
01
01
01
10
01
15
01
03
80
46
27
78
0A
D9
B0
A3
57
49
9C
25
20
11
49
4B
21
08
00
45
40
01
01
61
40
01
01
01
01
30
01
01
01
01
01
01
01
1D
00
72
51
D0
1E
20
6E
28
40
55
00
C4
8E
21
00
00
1E
1B
21
50
A0
51
00
1E
30
50
48
88
35
00
BC
77
21
00
00
1C
00
00
00
FC
00
4C
60
47
20
54
56
0A
20
20
20
20
20
20
20
00
00
00
FD
70
00
3A
3F
1C
44
0F
00
0A
20
20
20
20
20
20
01
C2
80
02
03
25
F1
4F
84
07
01
16
02
03
11
12
13
14
05
90
20
22
1F
10
23
09
07
07
83
01
00
00
68
03
0C
00
A0
10
00
80
1E
00
01
1D
00
80
51
D0
1C
20
40
80
35
B0
00
BC
88
21
00
00
1E
8C
0A
D0
8A
20
E0
2D
10
10
C0
3E
96
00
13
8E
21
00
00
18
8C
0A
A0
14
51
F0
16
D0
00
26
7C
43
00
C4
8E
21
00
00
98
01
1D
80
18
71
E0
1C
16
20
58
2C
25
00
C4
8E
21
00
00
9E
00
00
00
F0
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
2A
(3) HDMI 2 : 256Bytes
0
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
00
FF
FF
FF
FF
FF
FF
00
1E
6D
01
00
01
01
01
01
10
01
15
01
03
80
46
27
78
0A
D9
B0
A3
57
49
9C
25
20
11
49
4B
21
08
00
45
40
01
01
61
40
01
01
01
01
30
01
01
01
01
01
01
01
1D
00
72
51
D0
1E
20
6E
28
40
55
00
C4
8E
21
00
00
1E
1B
21
50
A0
51
00
1E
30
50
48
88
35
00
BC
77
21
00
00
1C
00
00
00
FC
00
4C
60
47
20
54
56
0A
20
20
20
20
20
20
20
00
00
00
FD
70
00
3A
3F
1C
44
0F
00
0A
20
20
20
20
20
20
01
C2
80
02
03
25
F1
4F
84
07
01
16
02
03
11
12
13
14
05
90
20
22
1F
10
23
09
07
07
83
01
00
00
68
03
0C
00
A0
20
00
80
1E
00
01
1D
00
80
51
D0
1C
20
40
80
35
B0
00
BC
88
21
00
00
1E
8C
0A
D0
8A
20
E0
2D
10
10
C0
3E
96
00
13
8E
21
00
00
18
8C
0A
A0
14
51
F0
16
D0
00
26
7C
43
00
C4
8E
21
00
00
98
01
1D
80
18
71
E0
1C
16
20
58
2C
25
00
C4
8E
21
00
00
9E
00
00
00
F0
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
1A
3) Press ADJ key on Remote control for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : Component” by using D/E
(CH +/-) and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear.
OK
4.4.2. ADC Calibration - RGB
4.4.2.1. Method of Using External pattern
(1) Required Equipments
- Remote control for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60 Hz Horizontal Color Bar
signal into RGB. (MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on remote control for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : RGB” by using D/E(CH +/-)
and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear.
OK
Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 -
LGE Internal Use Only
4.4.2.1. Method of Using Internal pattern
(1) Apply model : 22/26/32LK310/311
(2) Process
1) Change the Input to RGB mode..
2) Press ADJ key on remote control for adjustment.
3) Enter Password number. Password is “0 0 0 0”.
4) Select “0. ADC calibration : RGB” by using D/E(CH +/-)
and press ENTER(A).
5) ADC adjustment is executed automatically .
6) When ADC adjustment is finished, this OSD appear.
5. PCB assembly adjustment method
5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Country’s Language and
signal Condition.
(2) Equipment : Adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use INSTART Key on the Adjust Remote control.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value.
OK
* Caution : No need to connect external input cable.
* Caution : Adjustment result is applied after SET Off/On.
5.2. Adjustment of White Balance
(For Automatic Adjustment)
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm
- Required Equipment
1) Remote control for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product LCD TV(ch : 9)
(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for Auto adjustment)
4.5. Check SW Version
(1) Method
1) Push In-star key on Adjust remote-control.
2) SW Version check
Check “SW VER : V3.xx”
MODEL :
32LK310
SW VER :
V3.04
Mod e : Hom e Use
ADC CAL.
RGB:
OK
Comp onent SD : OK
Comp onent HD : OK
Tool Option 1
Tool Option 2
Area Option
Option 1
RGB :
HDMI1 :
HDMI2 :
6
NG
NG
NG
816
4181
40
0
Option 2
System Con trol
System Con tro l 2
Power Off History
Davinci/Auto Test
Area Option
Lang. Group
UTT
5.2.1 Adjustment of White Balance (For automatic adjustment)
0
ETC
NTSC-ALL
* LP91J Support RS-232C & I2C Interface For ADC/DDC
Adjustment.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heatrun pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(WB 00 FF) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with aging
command (F3, 00, 00)
(4) Release the adjust mode of white balance
- Enter the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 12 -
LGE Internal Use Only
5.2.2. Adjustment of White Balance (for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit” key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter “0000” (Password)
6) Select “3. W/B ADJUST”
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on Adjustment remote control.
9) Adjust R/G/B Gain using F / G (VOL +/-) key on
Adjustment remote control.
10) Adjust three modes all (Cool/ Medium/ Warm) : Fix the
one of R/G/B gain and change the others
11) When adjustment is completed, Enter “COPY ALL”.
12) Exit adjustment mode using EXIT key on Adjustment
remote control.
- To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : Select Vivid and change Dynamic Contrast :
Off, Dynamic Colour : Off -> Picture Mode change ->
Vivid(User)
(If you miss the upper condition, the coordinates of W/B can
be lower than the spec.
* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
Coordinate
Mode
Temp
uv∆
0.273 ± 0.002
13,000 K
0.000
0.285 ± 0.002
0.293 ± 0.002
9,300 K
0.000
0.313 ± 0.002
0.329 ± 0.002
6,500 K
0.003
x
y
Cool
0.269 ± 0.002
Medium
Warm
- 22LK310/311(Small size inch’s color coordinate is different
from others, so use below table.)
Coordinate
Mode
x
y
Temp
uv∆
Cool
0.285 ± 0.002
0.293 ± 0.002
9,300 K
0.000
Medium
0.295 ± 0.002
0.305 ± 0.002
8,000 K
0.000
Warm
0.313 ± 0.002
0.329 ± 0.002
6,500 K
0.003
Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 13 -
LGE Internal Use Only
TROUBLESHOOTING
No power
(LED indicator off)
:
[A] PROCESS
Fail
Check 24V, 12V, 3.5V
of Power B/D
Check short of Main B/D
or Change Power B/D
Pass
Fail
Check Output of
IC1001, IC1003, IC1007
Check short of IC1001,
IC1003, IC1007
Fail
Re-soldering or Change defect
part of IC1001, IC1003, IC1007
Pass
Pass
Change IC1002, IC1008, Q1003
Fail
Check LED Assembly
Change LED Assembly
Pass
Check P400 Connector
No Raster
[B]: Process
Pass
Check LED status
On Display Unit
Fail
Repeat A PROCESS
Pass
Check Panel Link Cable
Or Module
Fail
Change Panel Link Cable
Or Module
Fail
Change Inverter Connector
Or Inverter
Pass
Check Inverter Connector
Or Inverter
Pass
Check Output of IC802
Fail
Change IC802
Pass
Check LVDS Cable
Fail
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Change Module
- 14 -
LGE Internal Use Only
No Raster on PC Signal
Pass
Check Input source Cable
And Jack
Pass
Check the Input/Output
Of J202
Fail
Re-soldering or
Change the defect part
Pass
Check the Input/Output
Of IC201
Fail
Re-soldering or
Change the defect part,
Check RGB EDID Data
Pass
Check the Input/Output
Of IC800
Fail
Re-soldering or
Change the defect part
Pass
Repeat [A], & [B] Process
No Raster on HDMI Signal
No Raster on COMMPONENT Signal
Pass
Pass
Check Input source
Cable And Jack
Check Input source
Cable And Jack
Pass
Pass
Check The Input/Output
Of JK101
Check the Input/Output
of JK301, JK302
Fail
Re-soldering or
Change the defect part
Check the Input/Output
of IC300, IC301
Fail
Re-soldering or
Change the defect part
Pass
Pass
Check the Input/Output
Of IC800
Fail
Re-soldering or
Change the defect part
Fail
Re-soldering or
Change the defect part
Check HDMI EDID Data
Re-download HDCP
Pass
Check the Input/Output
of IC800
Repeat [A], & [B] Process
Fail
Re-soldering or
Change the defect part
Pass
Repeat [A], & [B] Process
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
LGE Internal Use Only
No Raster On AV (Video, S-Video)Signal
No Signal On TV(RF) Signal
Pass
Pass
Check Input source
Cable And Jack
Check Input source
Cable And Jack
Pass
Pass
Check The Input/Output
of JK102
Fail
Re-soldering or
Change the defect part
Check The Input/Output
Of TU500
Pass
Check the Input/Output
of IC800
Fail
Re-soldering or
Change the defect part
Fail
Re-soldering or
Change the defect part
Pass
Fail
Re-soldering or
Change the defect part
Check the Input/Output
of IC800
Pass
Pass
Repeat [A], & [B] Process
Repeat [A], & [B] Process
No Sound
Check The Input Sourse
Fail
Change The Source Input
Pass
Check The Input/Output
Of IC600
Fail
Re-soldering or
Change the defect part
Pass
Check The Speaker
Fail
Change Speaker
Pass
Check The Speaker Wire
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 16 -
LGE Internal Use Only
REAR
HDMI2
(JK302)
HDMI1
(JK301)
USB(SVC)
(JK205)
RS-232C
(JK200)
RGB-PC
(JK202)
PC-SOUND
(JK203)
COMPONENT / AV1
Audio out (JK102)
- 17 -
TUNER
(TU500)
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
TU500
HDMI3
(JK303)
DDC_SCL1/SDA1
DDC_SCL2/SDA2
IC201
EEPROM DSUB_SCL/SDA
24C02
EEPROM
24C02
IC300
EEPROM
24C02
IC301
EEPROM DDC_SCL3/SDA3
24C02
IC302
IR & LED (P201)
M_SCL/SDA
COMPONENT_L/R : 500mVrm s
AV_LIN/RIN : 500mVrm s
Controller
ST3232CDR
IC200
USB
(JK204)
COMPONENT_Y/Pb/Pr : 1/0.7Vpp
AV_VIN : 1Vpp
RXD/TXD
TMDS
AV2
(JK201)
TXCE0
TXCE1±
TXCE2±
TXCE3±
TXCE4±
TXCLKE±
TXCLKO±
TXCO0±
TXCO1±
TXCO2±
TXCO3±
TXCO4±
DDR2_BA0/1
DDR2_MCLK
DDR2_CKE
DDR2_WEZ
DDR2_ODT
DDR2_DQS0 ±
DDR2_DQS1 ±
DDR2_DQM0/1
TU_MAIN
COMP_Y/Pb/Pr
COMP_LIN/RIN
AV_VIN
AV_LIN/RIN
SIDE_VIN
SIDE_LIN/RIN
(IC800)
(LGE4767A)
PC_AUD_L/R
PC_R/G/B
PC_VS/HS
I2S_MCLK
I2S_SDO
I2S_WS
I2S_SCK
MAIN SCLAER
Matri x
TXD/RXD
USB DN/DP
HDMI_DATA2
HDMI_DATA1
HDMI_DATA0
IC802
RL_ON/IDISP_EN
E-DIM
LIPS
R_CH
L_CH
NTP3200L
IC600
DDR2 SDRAM
(512M Byte)
IC900
EEPROM
(24LC256)
IC801
EEPROM
HDCP
(24WC08)
IC803
Serial Flash
(MX25L64)
PANEL_STATUS
M_SCL/SDA
EEP_SCL/SDA
EEP_SCL/SDA
SPI_CLK/DI
SPI_CZ/DO
FHD LVDS connector
OPC_OUT
SPK_L
SPK_R
P401
P402
P403
HD LVDS conn ector
SIDE
BLOCK DIAGRAM
LGE Internal Use Only
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
910
810
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 18 -
A5
A2
510
300
A21
500
A10
120
122
200
550
900
530
800
540
LV1
521
400
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by
in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
LGE Internal Use Only
EAX64045802
LP91J
COMPONENT / AV IN / AV AUDIO OUT
NON_AUDIO_OUT
AUDIO_OUT
JK102
JK101
PPJ238-01
PPJ239-03
6C
[RD1]E-LUG
6H
[RD1]E-LUG
5C
[RD1]O-SPRING
5H
[RD1]O-SPRING_2
4C
[RD1]CONTACT
4H
[RD1]CONTACT_2
5B
[WH1]O-SPRING
5G
[WH1]O-SPRING_2
4A
[YL1]CONTACT
4F
[YL1]CONTACT_1
5A
[YL1]O-SPRING
5F
[YL1]O-SPRING_1
6A
6H
[YL1]E-LUG
[RD2]E-LUG
7F
5E
R116
[RD2]O-SPRING_2
7E
R112
220K
D104
30V
R111
220K
R120
12K
CVBS_LIN
10K
R119
12K
P_12V_SMALL_15V
ZD104
SD05
ZD105
SD05
[YL1]E-LUG-S
GAIN X 4
CVBS_VIN
R110
75
E
C
[RD1]O-SPRING_1
B
ISA1530AC1
Q101
R105
470
C
E
R123
C101
1K
C103
5600pF
50V
R122
0
10uF
16V
MNT_ROUT
JP101
B
B
RT1C3904-T112
Q102
R106
47
MNT_VOUT_T
R101
220
Q104
C
E
[RD1]E-LUG-S
C
E
RT1C3904-T112
R102
402
READY
MUTE_LINE
POP NOISE
B
R103
68
Q103
4H
[RD2]CONTACT
5G
[WH2]O-SPRING
RT1C3904-T112
5D
[WH1]O-SPRING
R124
ZD107
30V
5F
CVBS_RIN
10K
R115
ZD106
30V
5H
D105
30V
[RD2]O-SPRING_1
6D
C102
1K
C104
5600pF
50V
C
[WH1]E-LUG
B
[RD2]E-LUG-S
6N
[RD2]E-LUG
5E
[BL2]O-SPRING
5N
[RD2]O-SPRING_2
MNT_LOUT
Q106
RT1C3904-T112
E
C
E
7F
10uF
16V
R125
0
MUTE_LINE
POP NOISE
B
Q105
RT1C3904-T112
AUDIO_OUT OPTION BLOCK
R113
D100
30V
7E
[BL2]E-LUG-S
4N
R100
220K
10K
COMP2_R
R117
12K
[RD2]CONTACT
JP102
R121
4D
[GN2]CONTACT
5M
75
[WH2]O-SPRING
5D
[GN2]O-SPRING
5L
[RD2]O-SPRING_1
6D
[GN2]E-LUG
7L
[RD2]E-LUG-S
5K
[BL2]O-SPRING
7K
[BL2]E-LUG-S
4J
[GN2]CONTACT
5J
[GN2]O-SPRING
6J
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
[GN2]E-LUG
R114
D101
30V
R104
220K
ZD100
SD05
R107
75
ZD101
SD05
R108
75
ZD102
SD05
ZD103
SD05
R109
75
10K
COMP2_L
R118
12K
COMP2_PR
COMP2_PB
COMP2_Y
LK310
INPUT1
2010/11/22
1
9
LGE Internal Use Only
EAX64045802
LP91J
PC
RS-232C
JK202
JK200
SPG09-DB-009
SPG09-DB-010
6630TGA004Q
+3.5V_MST
1
6
6
IC200
ST3232CDR
C203
0.1uF
16V
C1+
1
16
VCC
V+
C1-
C2+
2
15
3
14
R202
4
13
C2-
V-
T2OUT
C202
0.1uF
16V
R2IN
5
12
6
11
7
10
8
9
11
RED
GND
7
2
T1OUT
DDC_DATA
12
8
R203
8
IR_OUT
T1IN
BLUE
9
+3.5V_MST
9
R204
4.7K
R205
4.7K
10
10
RXD
TXD
R208
ZD201
SD05
GND_1
5
R215
4.7K
68
C211
68pF
50V
PC_VS
SYNC_GND
5
DDC_CLOCK
15
DSUB_SCL
D209
30V
DDC_GND
16
PC_HS
R213
75
V_SYNC
14
C213
68pF
50V
R214
4.7K
ZD200
SD05
PC_B
D210
30V
NC
4
R2OUT
R207
68
H_SYNC
13
4
T2IN
D204
30V
PC_G
R212
75
D208
30V
BLUE_GND
3
D201
30V
R1OUT
DSUB_SDA
GREEN
3
R1IN
PC_R
R211
75
D207
30V
GREEN_GND
7
D200
30V
100
C201
0.1uF
16V
GND_2
1
2
100
C200
0.1uF
16V
RED_GND
SHILED
R200
0
SIDE AVSIDE_AV
JK201
PPJ235-01
+5V_MULTI
PC EDID
[RD]E-LUG
5C
[RD]O-SPRING
4C
SIDE_AV
R225
D205
30V
SIDE_AV
SIDE_RIN
10K
READY
A0
R228
12K
SIDE_AV
R222
220K
A0
1
8
A1
2
7
SIDE_AV
R224
D206
30V
SIDE_AV
10K
READY
VSS
SIDE_LIN
R226
12K
SIDE_AV
R223
220K
[YL]CONTACT
3A
SIDE_AV
4A
[YL]O-SPRING
5A
[YL]E-LUG
3
6
4
5
ZD202
5.6B
ZD203
5.6B
SIDE_AV
R219
4.7K
VCC
R220
4.7K
R221
4.7K
C205
0.01uF
2
7
3
6
4
5
WP
R216
100
SCL
R217
100
SDA
R218
100
DDC_WP
DSUB_SCL
DSUB_SDA
WP
SCL
VSS
[WH]O-SPRING
4B
8
READY
A2
A2
1
ENKMC2838-T112
D211 A1
C
A2
VCC
A1
[RD]CONTACT
3C
RGB_EEPROM_CATAL
IC201
CAT24C02WI-GT3
RGB_EEPROM_RENESAS
IC201-*1
R1EX24002ASAS0A
SDA
SIDE_V
R227
75
SIDE_AV
PC SOUND
JK203
PEJ027-01
3
6A
**
7A
C214
100uF
16V
0
REAR_USB
JK205
KJA-UB-0-0037
OCP_READY
D213
C
AC
A
IC202
AP2191SG-13
1
1
2
USB_DN
USB_DL_N
2
USB_DP
USB_DL_P
3
3
1
7
2
R_SPRING
5
T_SPRING
PC_AUD_L
R234
10K
7B
B_TERMINAL2
6B
T_TERMINAL2
L200
IN_1
D203
30V
CDS3C30GTH
R232
220K
R236
12K
120OHM
OCP_READY
6
3
IN_2
R209
1K
4
FLG
5
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
8
+3.5V_MULTI
OUT_1
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
4
R238
510
GND
OCP_READY
OCP_READY
5
READY
ZD205
30V
R235
12K
OCP_READY
OUT_2
READY
ZD204
30V
R231
220K
R237
500
NC
4
R230
0
REAR_USB
USB DOWN STREAM
USB_DL_P
B_TERMINAL1
D202
30V
CDS3C30GTH
Non_OCP
L201
C212
220uF
16V
SIDE_USB
KJA-UB-4-0004
JK204
USB_DL_N
R233
10K
+5V_USB
Close to SIDE_USB
C210
10uF
6.3V
REAR_USB
R229
0
PC_AUD_R
T_TERMINAL1
1A Design
It’s possibel to 27~47ohm
USB
E_SPRING
5
4
OCP_READY
OCP_READY
OCP_READY
R210
4.7K
C208
0.1uF
50V
C209
10uF
16V
EN
LK310
INPUT2
2010/11/22
2
9
LGE Internal Use Only
EAX64045802
LP91J
OPTION
HDMI2_EEPROM_RENESAS
IC301-*1
R1EX24002ASAS0A
A2
VCC
8
2
7
3
6
WP
A0
SCL
A1
+5V_MULTI
VSS
4
SDA
5
+5V_HDMI_2
A2
VSS
+5V_HDMI_2
HPD_MST_2
B
A0
1
A1
A2
SHIELD
20
VSS
HPD
VCC
8
2
7
3
6
4
5
WP
R327
100
SCL
R304
100
SDA
R305
100
R309 R311
10K 10K
R302
1K
C301
0.01uF
R300
10K
B
E
DDC_WP
VSS
19
DDC_SDA2
DDC_SCL2
JP300
TMDS2_RX0+
TMDS2_RX1-
6 DATA15 DATA1_SHIELD
4 DATA1+
TMDS2_RX1+
TMDS2_RX2-
3 DATA22 DATA2_SHIELD
1 DATA2+
HPD
TMDS2_RX2+
YKF45-7058V
JK302
A2
VSS
8
2
7
3
6
4
5
R314
R312
RT1C3904-T112
2SC3875S
B
2
7
3
6
4
5
VCC
WP
R331
100
SCL
R306
100
SDA
R307
100
R308 R310
10K 10K
C302
0.01uF
DDC_WP
JP302
DDC_SDA1
DDC_SCL1
JP303
CEC
TMDS1_RXCTMDS1_RXC+
TMDS1_RX0TMDS1_RX0+
TMDS1_RX1TMDS1_RX1+
TMDS1_RX2TMDS1_RX2+
WP
+5V_MULTI
SCL
+5V_HDMI_3
SDA
D302
KDS184S
C
HDMI3_EEPROM_CATAL
IC302
CAT24C02WI-GT3
1K
D300
KDS184S
VCC
A2
+5V_HDMI_3
1
+5V_HDMI_1
A1
A1
5
JK301
YKF45-7058V
HDMI3_EEPROM_RENESAS
IC302-*1
R1EX24002ASAS0A
C
8
16 SDA
3 DATA2DATA2_SHIELD
2
DATA2+
1
A0
SDA
17 DDC/CEC_GND
11 CLK_SHIELD
CLK+
10
DATA09
DATA0_SHIELD
8
DATA0+
7
DATA16
DATA1_SHIELD
5
DATA1+
4
8 DATA0_SHIELD
7 DATA0+
+5V_MULTI
SCL
18 +5V_POWER
13 CEC
12 CLK-
TMDS2_RXC+
TMDS2_RX0-
9 DATA0-
4
1
15 SCL
14 NC
CEC
TMDS2_RXC-
10 CLK+
A0
A2
SHIELD
11 CLK_SHIELD
HPD_MST_3
2SC3875S
A1
JP301
12 CLK-
6
HDMI1_EEPROM_CATAL
IC300
CAT24C02WI-GT3
Q300C
20
14 NC
CEC
13
3
WP
RT1C3904-T112
18 +5V_POWER
17 DDC/CEC_GND
16 SDA
15 SCL
7
+5V_HDMI_1
HPD_MST_1
E
19
D301
KDS184S
C
HDMI2_EEPROM_CATAL
IC301
CAT24C02WI-GT3
1K
C
R301
10K
2
VCC
A2
R303
8
A1
A2
2SC3875S
Q301
RT1C3904-T112
1
MST_HPD : USE MST HPD
A1
1
A1
C
A0
SW_HPD : USE SW HPD (Default)
HDMI1_EEPROM_RENESAS
IC300-*1
R1EX24002ASAS0A
Q302
10K
E
A0
A1
1
8
2
7
3
6
4
5
VCC
R319
10K
WP
R329
100
SCL
R317
100
SDA
R318
100
JACK_GND
A2
20
VSS
19
HPD
18
+5V_POWER
17
DDC/CEC_GND
16
SDA
15
SCL
14
NC
13
CEC
12
CLK-
11
CLK_SHIELD
10
CLK+
9 DATA08 DATA0_SHIELD
7 DATA0+
6 DATA15 DATA1_SHIELD
4 DATA1+
3 DATA22 DATA2_SHIELD
1 DATA2+
R320
10K
C300
0.01uF
25V
DDC_WP
+3.3V_MST
R315
68K
READY
JP304
DDC_SDA3
DDC_SCL3
JP305
CEC
TMDS3_RXCTMDS3_RXC+
TMDS3_RX0TMDS3_RX0+
TMDS3_RX1-
Q303
BSS83
READY
G
D
B
S
D303
MMBD301LT1G
30V
READY
R316
56K
READY
CEC_C
R313
0
CEC
D304
CDS3C30GTH
30V READY
TMDS3_RX1+
TMDS3_RX2TMDS3_RX2+
KJA-ET-0-0032
JK303
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LK310
HDMI
2010/11/22
3
9
LGE Internal Use Only
EAX64045802
LP91J
PANEL WAFER
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,
+5V_+12V_LCD
51P_FFC_WAFER_FHD
P401
TF05-51S
P402
FF10001-30
P403
FF10001-30
SMALL_NC5
SMALL_NC1
SMALL_NC2
SMALL_OPC_OUT
26_32INCH_HD_WAFER
1
+5V_+12V_LCD
HD_normal
R425 0
1
2
1
3
2
4
3
3
5
4
4
6
5
7
6
19_22INCH
HD_NOT AUO_IPS
R414
0
2
5
NON_Small CMO
TXCE3-
6
TXCE3+
7
R432
0
7
8
9
R435
10
R436
0
8
NON CMO 42FHD
IR
FHD BRIDING
L400
500-ohm
FHD BRIDING
ZD400
5.6B
0
NON CMO 42FHD
TXCE0+
AUO/SHARP 42FHD
TXCE0-
AUO/SHARP 42FHD
TXCE1+
11
R426
12
R427
0
0
13
SUB_SCL
14
FHD BRIDING
L401
500-ohm
+3.3V_MST
SUB_SDA
FHD BRIDING
ZD401
5.6B
R406
4.7K
R409
4.7K
NON_19_22INCH
L405
120ohm
NON_19_22INCH
NON_19_22INCH
C403
470pF
50V
C400
470pF
50V
26_32INCH
26_32INCH
C407
0.1uF
C408
0.1uF
TXCE2-
TXCLKE+
19
TXCLKE-
20
TXCE3+
21
1
2
26
R437
27
R428
28
R429
0
NON CMO 42FHD
120-ohm
C404
47uF
16V
SDA
TXCO0+
0
AUO/SHARP 42FHD
AUO/SHARP 42FHD
+3.3V_MULTI_MST
3
4
R400
10K
KEY1
READY
R404
0
6
7
KEY2
C405
100pF
50V
5V_ST
120ohm
C
LED_B/LG_LOGO
10
11
12
GND
ZD402
5.6B
READY
C402
47pF
50V
120ohm
IR
READY
C406
0.1uF
50V
IR-OUT
R412
10K
LED_R/BUZZ
IR-OUT
R407
10K
C
B
13
10K
IR-OUT
R401
.
B
47K
E
R420
4.7K
R419
TXCE2+
20
26inch AUO : OPEN
26inch SHARP : Pull down
VESA
0
21
TXCE1-
22
0
R415
JEIDA
23
R421
0
24
+5V_+12V_LCD
TXCE1+
TXCE0-
25
25
26
26
27
27
28
28
29
29
SMALL_NC3
30
30
SMALL_NC4
TXCE0+
SMALL_OPC_EN
31
31
SMALL_OPC_EN
SMALL_NC3
SMALL_NC4
+3.3V_MULTI_MST
R438
OPC_ENABLE
0
R422
470
42
OPC_ENABLE
R417
43
R416
44
IR_OUT
OPC_OUT
0
E-DIM
READY
C
E
R423
0
R424
OPC_EABLE
OPC_EN
B
1K
External VBR
45
IR-OUT
2SC3052
Q403
OPC_ENABLE
RT1C3904-T112
Q404 OPC_ENABLE
OPC_OUTPUT
0
OPC_ENABLE
22
IR-OUT
R410
R418
TXCE2-
19
+3.3V_MULTI_MST
NON CMO 42FHD
IR-OUT
R413
TXCLKE+
18
TXCO4-
41
+3.5V_MST
TXCE0+
TXCO4+
40
+3.5V_MST
ST_3.3V
19
TXCO3-
39
9
TXCE0-
TXCO3+
38
L403
18
TXCLKO-
36
IR
TXCLKE-
17
TXCLKO+
35
GND
37
8
16
34
SUB_SCL
10K
TXCE1+
0
TXCO2-
33
R405
E
16
TXCO2+
32
B
Q400
2SC3052
15
24
31
L407
5
TXCE1-
LVDS_SEL
TXCO1-
30
TXCE3+
14
15
HD_normal
TXCO1+
29
GND
TXCE3-
13
TXCE2+
23
TXCO0-
0
SMALL_OPC_OUT
12
TXCE2-
22
READY
R433
4.7K
NON CMO FHD
R434
0
25
FHD
L406
SCL
SMALL_NC2
11
21
+3.3V_MULTI_MST
TXCE4-
24
+3.5V_MST
10
OPC_ENABLE
TXCE4+
23
12507WR-12L
TXCLKE+
20
TXCE3-
22
P400
10
17
18
KEY2
SMALL_NC1
14
17
KEY1
9
13
TXCE2+
16
NON_19_22INCH
L404
120ohm
TXCLKE-
12
15
SMALL_NC5
9
11
TXCE1-
8
46
C IR-OUT
2SC3052
E Q401
R431
47
0
+3.3V_MULTI_MST
**OPC_ENABLE : USE LGD Module
+3.3V_MULTI_MST
SHARP 42FHD
48
SHARP 42FHD
R442
4.7K
49
READY
R439
50
R444
51
AUO FHD
R443
0
0
NON AUO 42FHD
0
READY
R440
4.7K
READY
R441
0
52
+3.5V_MST
+3.5V_MST
R403
10K
L402
C401
100pF
50V
R411
4.7K
120ohm
C
R408
B
Q402
2SC3052
E
10K
R434
R443 R421
R423
R444 R431 R442 R420 R416 R417 R418 R438 R429 R428 R437 R433 R427 R426 R436 R435
LED_R
51 47 46 45 44
READY
R402
0
CONTROL KEY
19_22INCH
P404
12507WR-03L
19_22INCH
L408
KEY1
L409
KEY2
KEY1
KEY2
19_22INCH
19_22INCH
C409
100pF
50V
19_22INCH
C410
100pF
50V
GND
43 42 41 28 27 26 25 12 11 10
9
SHARP 32INCH FHD
O
X
X
X
VESA
X
X
X
O
O
O
O
R434
O
O
O
O
IPS 32INCH FHD
O
X
X
X
VESA
X
X
X
O
X
X
O
R434
X
X
O
O
SHARP 32INCH FHD
1
2
3
4
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LK310
LVDS,CTR KEY
2010/11/22
4
9
LGE Internal Use Only
EAX64045802
LP91J
PAL_TUNER
TU500
TAFJ-Z001D
1
NC_1
2
NC_2
3
+B[5V]
Near the pin
READY
C501
0.01uF
50V
4
RF_AGC
5
MOPLL_AS
6
SCL
C508
10uF
16V
C505
100uF
16V
+5V_TUNER
READY
C506
100uF
16V
R500
0
TU500-*1
READY
L500
TAFJ-H001F
120-ohm
R504
47
C502
27pF
50V
7
8
SDA
R505
C500
27pF
50V
47
M_SCL
1
2
M_SDA
NC_3
3
+5V_TUNER
4
9
SIF
10
NC_4
R501
0
MAIN_SIF
C503
0.1uF
50V
R506
220
R507
220
11
12
VIDEO
GND
5
6
READY
C504
50V
TV_MAIN
7
E
READY
L502
10uH
READY
C507
82pF
50V
R502
4.7K
8
ISA1530AC1
Q502
B
C
9
10
13
11
12
SHIELD
NC_1
NC_2
+B[5V]
RF_AGC
MOPLL_AS
SCL
SDA
NC_3
SIF
NC_4
VIDEO
GND
13
SHIELD
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LK310
TUNER
2010/11/22
5
9
LGE Internal Use Only
EAX64045802
LP91J
+1.8V
L606
+16V_NTP
120-ohm
MLB-201209-0120P-N2
+1.8V_AVDD
0LCML00003B
C615
0.1uF
50V
C642
10uF
35V
L605
C617
0.1uF
50V
C612
68uF
35V
R604
3.3
C640
68uF
35V
P600
SMAW250-H04R
120-ohm
C613
0.01uF
50V
+1.8V_DVDD
MLB-201209-0120P-N2
0LCML00003B
L608
MLB-201209-0120P-N2
R608
12
R611
12
C619
390pF
1S
C621
390pF
R610
12
+3.3V_MST
C611
EAP61008401
C669
0.1uF
R625
3.3
R623
4.7K
C671
0.01uF
SPK_R+
2
SPK_L-
3
SPK_L+
4
L609
SPK_L-
VDR1B
BST1B
PGND1B_1
C632
0.47uF
1
43
44
45
OUT1B_1
OUT1B_2
PVDD1B_1
PGND1B_2
46
47
48
50
49
PVDD1A_1
PVDD1A_2
OUT1A_1
PVDD1B_2
51
52
53
OUT1A_2
54
PGND1A_1
PGND1A_2
56
Q603
E RT1C3904-T112
55
[EP]GND
C
10KB
R626
3.3
SPK_R-
C618
1uF
R630
10K
R629
R638
12
1F
SPK_L+
C672
0.01uF
R663
4.7K
MLB-201209-0120P-N2
C616
22000pF
22000pF
C637
0.1uF
L603
2S AD-9060 2F
READY
SW_RESET
MULTI_PW_SW
R624
0
R631
47K
READY
R627
BST1A
1
VDR1A
2
RESET
3
42
NC
41
VDR2A
40
BST2A
AUDIO_OUT_OP AMP_BCD
IC601-*1
AS324MTR-E1
READY
C608
1uF
R601 100
0
C606
1000pF
I2S_MCLK
+3.3V_MULTI_MST
+1.8V_AVDD
C603
1000pF
C601
100pF
C605
0.1uF
+1.8V_AVDD
C600
10uF
16V
C602
0.1uF
OUT1
AD
4
39
PGND2A_2
DVSS_1
5
38
PGND2A_1
VSS_IO
6
37
OUT2A_2
CLK_I
7
36
OUT2A_1
VDD_IO
8
35
PVDD2A_2
DGND_PLL
34
PVDD2B_2
32
PVDD2B_1
12
31
OUT2B_2
13
30
OUT2B_1
14
29
PGND2B_2
11
AVDD_PLL
DVDD_PLL
Main AMP
C624
1uF
IN1-
C625
22000pF
IN1+
L610
MLB-201209-0120P-N2
VCC
SPK_R+
R658 R653
12
12
C630
L607
390pF
2S AD-9060 2F
+16V_NTP
PVDD2A_1
33
10
LF
TEST0/GND
IC600
NTP-3200L
9
AGND_PLL
R600
3.3K
THERMAL
57
C634
390pF
C626
0.1uF
C629
0.1uF
1S
1F
C644
0.1uF
R628
4.7K
R654
12
IN2+
R671
3.3
C673
0.47uF
IN2-
OUT2
EAP61008401
R621
12
C648
0.01uF
C643
0.1uF
R667
4.7K
R635
3.3
C647
0.01uF
1
14
2
13
3
12
4
11
5
10
6
9
7
8
OUT4
IN4-
IN4+
GND
IN3+
IN3-
OUT3
L611
MLB-201209-0120P-N2
SPK_R-
+1.8V_DVDD
C609
10uF 16V
C614
1uF
C610
0.1uF
28
AMP :GAIN X 4
PGND2B_1
26
27
BST2B
VDR2B
25
FAULT
24
MONITOR_2
23
MONITOR_1
21
22
MONITOR_0
SCL
20
SDA
18
17
19
BCK
WCK
SDATA
DVSS_2
15
C607
0.1uF
50V
DVDD
C604
10uF
16V
16
+1.8V_DVDD
C623 22000pF
C620
0.1uF
16V
Q601
100
R602 R603
100 100
B
MULTI_PW_SW
C622
6800pF
50V
MNT_LOUT
R605
4.7K
1 OUT1
R606
1K
RT1C3904-T112
E
R678
100
R677
R676
100
C
R673 0
C651
1000pF
50V
AUDIO_OUT_OP AMP_AUK
IC601
+12V_AUDIO
S324
OUT4 14
R607
10K
C627
33pF
50V
2 INPUT1-
INPUT4- 13
3 INPUT1+
INPUT4+ 12
R609
6.8K
R612
5.6K
I2S_SDO
I2S_WS
I2S_SCK
M_SDA
M_SCL
MNT_L_AMP
+12V_AUDIO
4 VCC
GND 11
C628
0.01uF
50V
C638
33pF
50V
READY
C639
33pF
50V
READY
R613
5.6K
MNT_R_AMP
C635
+12V_AUDIO
5 INPUT2+
INPUT3+ 10
6 INPUT2-
INPUT3- 9
33pF
50V
R614
10K
R615
6.8K
C631
0.1uF
16V
Q602
C
E
RT1C3904-T112
7 OUT2
R617
1K
B
OUT3 8
MNT_ROUT
R616
4.7K
C633
6800pF
50V
AUDIO_OUT OPTION BLOCK
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LK310
AUDIO
2010/11/22
6
9
LGE Internal Use Only
+3.3V_MULTI_MST
MNT_VOUT_T
C868
C869
0.1uF
0.1uF
SIDE_LIN
SIDE_RIN
C856
C861
2.2uF
2.2uF
MNT_L_AMP
MNT_R_AMP
R882
R881
R846
R847
100
100
100
100
R875
R876
MAIN_SIF
B
E
POWER_DET
R885
+3.5V_MST
R855
10K
MULTI_PW_SW
DDR2_CASZ
DDR2_RASZ
DDR2_ODT
DDR2_BA0
DDR2_BA1
DDR2_WEZ
DDR2_CKE
R867 1K
DDR2_A[11]
DDR2_A[8]
DDR2_A[3]
DDR2_A[7]
DDR2_A[12]
DDR2_A[9]
DDR2_A[5]
DDR2_A[10]
DDR2_A[1]
DDR2_A[6]
DDR2_A[4]
DDR2_A[2]
DDR2_A[0]
0.1uF
1K
0.1uF
C863
C844
AR800
56
AR815
56
AR814
56
AR813
56
56
AR812
56
R868
+3.3V_MULTI_MST
0.1uF
100
C883
R829
100 R8022
100 R8021
0
0 READY
READY
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
GND_15
A_MADR[6]
A_MADR[8]
A_MADR[11]
A_WEZ
A_BADR[1]
A_BADR[0]
A_MADR[1]
A_MADR[10]
AVDD_DDR_6
A_MADR[5]
A_MADR[9]
A_MADR[12]
A_MADR[7]
A_MADR[3]
A_MCLKE
VDDC_6
I2S_IN_WS/GPIO67
I2S_IN_BCK/GPIO68
I2S_IN_SD
I2S_OUT_MCK
I2S_OUT_WS
VDDP_5
GND_16
VDDC_7
I2S_OUT_BCK
I2S_OUT_SD
SPDIFO
UART2_RX/I2CM_SDA
UART2_TX/I2CM_SCK
UART1_RX/GPIO86
UART1_TX/GPIO87
GND_17
GND_18
USB0_DM
USB0_DP
SAR0
SAR1
SAR2
SAR3
AVDD_MPLL
XOUT
XIN
GPIO134
GPIO135
GPIO138
GPIO139
GPIO140
IRIN
HSYNC0
VSYNC0
HSYNC1
VSYNC1
CEC
A_MADR[4]
201
202
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
B_MDATA[7]
186
AVDD_DDR_5
185
B_MDATA[13]
184
B_MDATA[10]
183
GND_13
182
B_MDATA[8]
181
B_MDATA[15]
13
180
AVDD_DDR_4
14
179
B_DDR2_DQSB[1]
15
178
B_DDR2_DQS[1]
16
177
GND_12
17
176
VDDP_4
GND_1
18
175
AVDD_DDR_3
RXA2N
19
RXA0N
RXA0P
RXA1N
RXA1P
174
B_DDR2_DQSB[0]
20
173
B_DDR2_DQS[0]
21
172
GND_11
22
171
B_DDR2_DQM[0]
23
170
B_DDR2_DQM[1]
24
169
AVDD_DDR_2
25
168
B_MDATA[14]
BIN1P
26
167
B_MDATA[9]
27
166
GND_10
RXA2P
REXT
REFP
REFM
28
165
B_MDATA[12]
29
164
B_MDATA[11]
30
163
AVDD_DDR_1
31
162
B_MDATA[6]
32
161
B_MDATA[1]
GIN0P
33
160
GND_9
SOGIN0
34
159
B_MDATA[3]
GIN1P
RIN1P
BINM
BIN0P
GINM
35
158
B_MDATA[4]
36
157
VDDC_5
37
156
VDDP_3
38
155
GPIO58
39
154
GPIO57
GIN2P
40
153
GPIO56
SOGIN2
41
152
GPIO55
RINM
RIN0P
AVDD_33_3
GND_2
BIN2P
42
151
GPIO54
43
150
GPIO53
44
149
GPIO52
45
148
GPIO51
46
147
GND_8
CVBS2
47
146
GPIO152/I2C_OUT_SD3
CVBS1
48
145
GPIO151/I2C_OUT_SD2
RIN2P
CVBS6
CVBS5
CVBS4
CVBS3
49
144
GPIO150/I2C_OUT_MUTE
50
143
VDDC_4
51
142
GND_7
52
141
AVDD_LPLL
53
140
LVB0M
54
139
LVB0P
SIF0P
55
138
LVB1M
SIF0M
56
137
LVB1P
VCOM1
CVBS0
VCOM0
AVDD_33_4
CVBSOUT
GND_3
111
112
113
114
115
116
110
SDO
SCZ
PWM0
PWM1
PWM2
PWM3
LVA4P
102
103
104
105
106
107
109
108
SCK
SDI
RXC2N
RXC2P
AVDD_DM
USB1_DM
USB1_DP
HOTPLUGC
95
96
98
99
97
RXC0N
RXC0P
GND_6
RXC1N
RXC1P
RXCCKP
DDCDC_DA
GPIO20
VDDP_1
VDDC_3
RXCCKN
UART2_RX
UART2_TX
DDCDC_CK
100
LVB4P
101
129
88
64
89
LVB4M
AUOUTR1
90
LVB3P
130
91
LVB3M
131
92
LVBCKP
132
93
LVBCKM
133
94
LVB2P
134
80
LVB2M
135
AUL5
AUR5
AUVRM
81
136
62
63
VDDC_1
82
57
58
59
60
61
AUOUTR2
AUOUTL1
AUOUTL2
MSTAR
250
B_MDATA[0]
187
8
9
10
11
12
RXB2N
RXB2P
SOGIN1
VCLAMP
LK310
251
HWRESET
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
252
B_MDATA[2]
188
1
RXACKN
RXACKP
HOTPLUGA
[MODE SELECTION]
253
B_MDATA[5]
189
RXB1N
RXB1P
READY
R808
4.7K
254
B_MCLK
190
6
7
RXB0N
3 OUT
255
B_MCLKZ
191
4
5
RXBCKN
RXBCKP
AVDD_33_2
READY
R807
0
256
192
2
3
RXB0P
HOTPLUGB
AVDD_33_1
83
R884
1K
READY
84
R889
1K
Only Divx
IC800-*1
85
R883
1K
86
R811
1K
READY
87
READY
2
GND
+3.3V_MULTI_MST
73
VCC 1
READY
C841
0.22uF
16V
READY
C839
2.2uF 10V
IC804
KIA7427F
SYS_RESET
C814
0.1uF
50V
R864
74
RESET
R887
33K
R863
4.7K
75
100
D803
KDS181
4.7K
M_SDA
M_SCL
R888
10uF 16V
0.1uF
1000pF
4.7uF
C812
4.7uF 10V
C809
C813
C818
C820
+3.5V_MST
4
Close to IC
with width trace
2
R852
I2S_WS
I2S_MCLK
PANEL_STATUS
TXD
RXD
EEP_SCL
EEP_SDA
RL_ON
I2S_SDO
I2S_SCK
KEY2
KEY1
C817 20pF
C816 20pF
LED_R
TXD
HDMI_3
+3.3V_MST
JTP-1127WEM
76
+1.2V_VDDC_MST
E
SW800
77
READY
C8000
2.2uF
16V
RT1C3904-T112
Q803
78
1 3
B
79
1K
66
C
R853
TXCE3TXCE3+
TXCLKETXCLKE+
TXCE2TXCE2+
TXCE1TXCE1+
TXCE0TXCE0+
67
D802
KDS181
C870
47uF
25V
TXCE4TXCE4+
68
150
0
R8036
20K
0.1uF
69
1K
C842
70
R860
TXCO0+
2.2uF
2.2uF
KDS181
D801
0
R8001
R8000
10K
E
P_24V_SMALL_15V
P_12V_SMALL_15V
C
B
1K
0.01uF
TXCO0-
71
R861
READY
R800
C855
AUDIO_OUT OPTION BLOCK
TXCO1+
203
2K
22K
TXCO1-
204
R886
ISA1530AC1
Q800
R8009
TXCO2+
72
Q804
RT1C3904-T112
TXCO2-
65
C871
4.7uF
10V
26_32INCH
22K
0.01uF
TXCO3+
TXCLKO+
C823
C824
READY
R8008
C854
TXCO3TXCLKO-
AUL4
33K
TXCO4+
AUR4
R8007
0
TXCO4-
AUR0
R8037
C
0.01uF
AUL1
26_32INCH
C850
CVBS_LIN
CVBS_RIN
RL_ON
26_32INCH
47
47
R893 4.7K
OPC_EN
GND_14
0.047uF
0.047uF
0.047uF
AVDD_MEMPLL
1uF
C834
C836
C837
MVREF
C810
47
47
47
A_ODT
TV_MAIN
R831
R857
R830
1K AUDIO_OUT
A_RASZ
CVBS_VIN
SIDE_V
R8038
A_CASZ
COMP2_PR
0.047uF
0.047uF
1000pF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
117
EEP_SDA
C826
C828
C835
C830
C800
C801
C831
C832
118
22
47
47
470
47
47
47
47
47
119
R8006
R832
R834
R835
R837
R804
R815
R897
R802
120
SDA
0.1uF
COMP2_PB
COMP2_Y
LVA4M
EEP_SCL
LVA3P
22
AUR1
5
R8005
AUL2
4
C838
SCL
READY
R809 4.7K
+3.3V_MST
R810 1K AUDIO_OUT
MUTE_LINE R865 4.7K
SUB_SCL
R866 4.7K +3.3V_MULTI_MST
SUB_SDA
R845 4.7K
OLP
READY
PANEL_ON R819
3.3K
DISP_EN/VAVS_ON
SW_RESET
DDC_WP
AUR2
6
0.1uF
AUL3
3
C848
A_MADR[0]
0.047uF
A_MADR[2]
C829
193
47
194
R836
WP
AUR3
7
AUL0
VSS
2
VCC
AUCOM
A2
8
DDR2_D[6]
DDR2_D[1]
DDR2_D[3]
DDR2_D[4]
GND_4
A1
1
AR810
56
195
0.047uF
196
C827
197
47
124
R833
AUVRP
A0
R817
4.7K
AUVAG
R8004
4.7K
DDR2_D[14]
DDR2_D[9]
DDR2_D[12]
DDR2_D[11]
125
PC_R
IC803
CAT24WC08W-T
AR809
56
126
+3.3V_MULTI_MST
LGE4765A (Matrix basic_NON_SRS)
DDR2_DQM0
DDR2_DQM1
127
PC_B
PC_G
DDR2_DQS0M
DDR2_DQS0P
128
390
0.1uF
0.1uF
0.1uF
0.047uF
1000pF
0.047uF
0.047uF
0.047uF
0.1uF
LVA1P
R814
R803
R816
R818
R838
R840
C804
C805
C806
47 C843
470 C846
47 C845
47 C847
47 C825
0.1uF
IC800
C849
LVA1M
10
10
C804/C805/C806:Close to IC
as close as possible
HDCP EEPROM
POWER_SW
R891
R892
LVA0P
C819
TMDS1_RX2TMDS1_RX2+
HPD_MST_1
DDR2_DQS1M
DDR2_DQS1P
LVA0M
EEP_SDA
10
10
DDR2_D[13]
DDR2_D[10]
DDR2_D[8]
DDR2_D[15]
LVA3M
22
R880
R890
AR806
56
GND_5
R813
EEP_SCL
C865
0.01uF
0.1uF
VDDC_2
SDA
22
TMDS1_RX1TMDS1_RX1+
C853
DDCA_CK
5
R812
C862
0.01uF
VDDP_2
0.1uF
C860
0.01uF
DDR2_D[0-15]
DDR2_MCLKZ
DDR2_MCLK
DDR2_D[5]
DDR2_D[2]
DDR2_D[0]
DDR2_D[7]
DDCA_DA
4
SCL
R8028
4.7K
C858
0.01uF
AR805
56
AVDD_AU
6
R8027
4.7K
33
33
DDCDA_CK
3
C803
0.01uF
WP
R843
R844
DDCDA_DA
7
10
10
10
10
10
10
192
191
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
DDCDB_CK
GND
2
VCC
TMDS2_RX2TMDS2_RX2+
TMDS1_RXCTMDS1_RXC+
TMDS1_RX0TMDS1_RX0+
R869
R871
R872
R873
R874
R879
B_MCLKZ
B_MCLK
B_MDATA[5]
B_MDATA[2]
B_MDATA[0]
B_MDATA[7]
AVDD_DDR_5
B_MDATA[13]
B_MDATA[10]
GND_13
B_MDATA[8]
B_MDATA[15]
AVDD_DDR_4
B_DDR2_DQSB[1]
B_DDR2_DQS[1]
GND_12
VDDP_4
AVDD_DDR_3
B_DDR2_DQSB[0]
B_DDR2_DQS[0]
GND_11
B_DDR2_DQM[0]
B_DDR2_DQM[1]
AVDD_DDR_2
B_MDATA[14]
B_MDATA[9]
GND_10
B_MDATA[12]
B_MDATA[11]
AVDD_DDR_1
B_MDATA[6]
B_MDATA[1]
GND_9
B_MDATA[3]
B_MDATA[4]
VDDC_5
VDDP_3
GPIO58
GPIO57
GPIO56
GPIO55
GPIO54
GPIO53
GPIO52
GPIO51
GND_8
GPIO152/I2C_OUT_SD3
GPIO151/I2C_OUT_SD2
GPIO150/I2C_OUT_MUTE
VDDC_4
GND_7
AVDD_LPLL
LVB0M
LVB0P
LVB1M
LVB1P
LVB2M
LVB2P
LVBCKM
LVBCKP
LVB3M
LVB3P
LVB4M
LVB4P
DDCDB_DA
A2
8
C879
0.01uF
USB
A1
1
HDMI_1
A0
10
10
RXBCKN
RXBCKP
RXB0N
RXB0P
HOTPLUGB
RXB1N
RXB1P
AVDD_33_1
RXB2N
RXB2P
RXACKN
RXACKP
RXA0N
RXA0P
AVDD_33_2
RXA1N
RXA1P
GND_1
RXA2N
RXA2P
HOTPLUGA
REXT
VCLAMP
REFP
REFM
BIN1P
SOGIN1
GIN1P
RIN1P
BINM
BIN0P
GINM
GIN0P
SOGIN0
RINM
RIN0P
AVDD_33_3
GND_2
BIN2P
GIN2P
SOGIN2
RIN2P
CVBS6
CVBS5
CVBS4
CVBS3
CVBS2
CVBS1
VCOM1
CVBS0
VCOM0
AVDD_33_4
CVBSOUT
GND_3
SIF0P
SIF0M
VDDC_1
AUL5
AUR5
AUVRM
AUOUTL2
AUOUTR2
AUOUTL1
AUOUTR1
198
C815
+3.3V_MULTI_MST
R859
R862
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
199
0.1uF
10
10
10
10
200
C833
R851
R854
R856
R858
121
C867
0.1uF
TMDS2_RXCTMDS2_RXC+
TMDS2_RX0TMDS2_RX0+
HPD_MST_2
TMDS2_RX1TMDS2_RX1+
122
C866
10uF
120-ohm
C878
0.01uF
+1.2V_VDDC_MST
123
L800
MAIN_EEPROM_ATMEL
IC801
AT24C256C-SSHL-T
C864
0.01uF
LVA2P
+3.3V_MULTI_MST
EEPROM
L802
120-ohm
LVA2M
Small HD : 19/22/26 Inch
Non Small FHD : Normal(non 100Hz) FHD Model
LGD Joker : LF Series (10BIT FHD, LED ON/OFF)
O/S Joker : LF Series (8BIT FHD, LED ON/OFF)
Small FHD (22"): 8BIT,LED ON/OFF
26" FHD : 10BIT,LED ON/OFF
C877
0.01uF
+1.8V_DDR
LVACKP
**
**
**
**
**
**
READY
C859
0.01uF
+3.3V_MULTI_MST
LVACKM
DDC_WP
R8016
R8017
SPI_DO
8 SO/SIO1 WP#/SIO2 9
R828
C
B
E
10K
Q805 READY
RT1C3904-T112
100
100
GND 10
R824
R825
7 CS#
C857
0.01uF
+1.8V_DDR
X801
12MHz
SPI_CZ
R878
4.7K
R8010 R8011
4.7K
X
4.7K 4.7K
X
4.7K
4.7K
X
4.7K 4.7K
X
4.7K
4.7K
X
4.7K 4.7K
X
4.7K
R839
1M
NC_6 11
I2S_OUT
100
100
6 NC_5
+3.3V_MULTI_MST
R898
X
X
X
4.7K
4.7K
4.7K
4.7K
4.7K
4.7K
+1.8V_DDR
C851
0.1uF
IR
DSUB_SDA
RXD
R896
Small HD
4.7K
Small FHD (22") 4.7K
Non Small HD
4.7K
LGD Joker
4.7K
26" FHD
4.7K
O/S Joker
4.7K
Non Small FHD
X
Apollo
X
100HZ
X
R8003
10K
Closed IC
C811
0.1uF
*H/W OPTION
SPI_DI
+3.3V_MST
R850
R8012
NC_7 12
R8010-*4
4.7K R8011-*4 4.7K
26" FHD
LGD Joker
R8010-*5 4.7K R8011-*5
4.7K
26" FHD
O/S Joker
R8020
10K
0
100
100
5 NC_4
R898-*4 4.7K
26" FHD
R898-*5 4.7K
O/S Joker
+3.3V_MST
Close to IC as close as possible
+1.2V_VDDC_MST
+3.5V_MST
SYS_RESET
CEC_C
PC_VS
PC_HS
SPI_CLK
DDR2_A[0-12]
R8002
R895
R849
NC_8 13
R877
4.7K
R898-*3 4.7K
LGD Joker
R896-*5 4.7K
O/S Joker
NC_9 14
4 NC_3
+3.3V_MULTI_MST
R896-*3 4.7K
LGD Joker
4.7K
100Hz
R8011-*2 4.7K
4.7K
Apollo
Non_Small_FHD
R8010-*3 4.7K R8011-*3 4.7K
Non_Small_HD
Small_FHD
0
0
SCLK 16
SI/SIO0 15
3 NC_2
R8010-*2
R8035
R8034
2 VCC
R898-*2 4.7K
Apollo
R8011-*1
4.7K
Apollo
256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
1 NC_1/SIO3
R896-*2 4.7K
Small_FHD
R896-*4 4.7K
26" FHD
+3.3V_MULTI_MST
C807
0.01uF
R8010-*1
HDMI_2
SERIAL FLASH 64M
R898-*1 4.7K
100Hz
HWRESET
CEC
VSYNC1
HSYNC1
VSYNC0
HSYNC0
IRIN
GPIO140
GPIO139
GPIO138
GPIO135
GPIO134
XIN
XOUT
AVDD_MPLL
SAR3
SAR2
SAR1
SAR0
USB0_DP
USB0_DM
GND_18
GND_17
UART1_TX/GPIO87
UART1_RX/GPIO86
UART2_TX/I2CM_SCK
UART2_RX/I2CM_SDA
SPDIFO
I2S_OUT_SD
I2S_OUT_BCK
VDDC_7
GND_16
VDDP_5
I2S_OUT_WS
I2S_OUT_MCK
I2S_IN_SD
I2S_IN_BCK/GPIO68
I2S_IN_WS/GPIO67
VDDC_6
A_MCLKE
A_MADR[3]
A_MADR[7]
A_MADR[12]
A_MADR[9]
A_MADR[5]
AVDD_DDR_6
A_MADR[10]
A_MADR[1]
A_BADR[0]
A_BADR[1]
A_WEZ
A_MADR[11]
A_MADR[8]
A_MADR[6]
GND_15
A_MADR[4]
A_MADR[2]
A_MADR[0]
A_CASZ
A_RASZ
A_ODT
MVREF
AVDD_MEMPLL
GND_14
IC802
MX25L6445EMI-10G
R896-*1 4.7K
Non_Small_HD
4.7K R8011
Small_FHD
AUL0
AUR0
AUL1
AUR1
AUL2
AUR2
AUL3
AUR3
AUCOM
AUL4
AUR4
GND_4
AUVRP
AUVAG
AVDD_AU
GND_5
VDDC_2
DDCA_CK
DDCA_DA
DDCDA_CK
DDCDA_DA
DDCDB_CK
DDCDB_DA
GPIO20
VDDP_1
VDDC_3
UART2_RX
UART2_TX
DDCDC_CK
RXCCKN
RXCCKP
DDCDC_DA
RXC0N
RXC0P
GND_6
RXC1N
RXC1P
AVDD_DM
RXC2N
RXC2P
HOTPLUGC
USB1_DM
USB1_DP
SCK
SDI
SDO
SCZ
PWM0
PWM1
PWM2
PWM3
LVA4P
LVA4M
LVA3P
LVA3M
LVACKP
LVACKM
LVA2P
LVA2M
LVA1P
LVA1M
LVA0P
LVA0M
VDDP_2
EAX64045802
LP91J
+3.3V_MULTI_MST
4.7K
R8010
Small_HD
R898
4.7K
Non_Small_FHD
65
66
67
68
C802
2.2uF
69
COMP2_L
C873
2.2uF
70
COMP2_R
C874
2.2uF
71
C875
2.2uF
72
C808
0.1uF
73
C821
2.2uF
74
PC_AUD_L
C822
2.2uF
75
PC_AUD_R
76
77
78
C840
0.01uF
79
L801
80
120-ohm
81
R894
0
82
DSUB_SCL
R899
0
83
DSUB_SDA
R8023
100
84
DDC_SCL1
R8024
100
85
DDC_SDA1
R8025
100
86
DDC_SCL2
R8026
100
87
DDC_SDA2
R8033
0 READY
88
POWER_DET
C882
0.1uF
89
90
R806
0
91
R870
0
92
R8039
HDMI3_SIDE
100
93
DDC_SCL3
R801
10 HDMI3_SIDE
94
TMDS3_RXCR805
10 HDMI3_SIDE
95
TMDS3_RXC+
R8040 100 HDMI3_SIDE
96
DDC_SDA3
HDMI3_SIDE
R820
10
97
TMDS3_RX0R821
10 HDMI3_SIDE
98
TMDS3_RX0+
99
R822
10 HDMI3_SIDE
100
TMDS3_RX1HDMI3_SIDE
R823
10
101
TMDS3_RX1+
C876 0.01uF
102
R841
10 HDMI3_SIDE
103
TMDS3_RX2R848
10 HDMI3_SIDE
104
TMDS3_RX2+
105
HPD_MST_3
R826
0
106
USB_DN
PART USB_DP
R827
0
107
108
SPI_CLK
AR818
109
SPI_DI
33
110
SPI_DO
111
SPI_CZ
112
113
114
I-DIM
115
E-DIM
116
117
118
119
120
121
122
123
124
125
126
127
128
R896
4.7K
Small_HD
2010/11/22
7
9
LGE Internal Use Only
EAX64045802
LP91J
DDR2
DDR2_D[0-15]
DDR2_D[0-15]
V_REF
1K
R908
1K
R907
+1.8V_DDR
C904
0.01uF
C905
1000pF
C918
0.1uF
C920
2.2uF
16V
V_REF
Close to DDR2 IC
IC900
K4T51163QI-HCF7
DDR2_A[0-12]
VREF
DDR2_A[0]
A0
DDR2_A[1]
J2
M8
A1
DDR2_A[2]
M3
A2
DDR2_A[3]
M7
A3
N2
DDR2_A[4]
A4
DDR2_A[5]
N8
A5
N3
DDR2_A[6]
A6
DDR2_A[7]
N7
A7
DDR2_A[8]
P2
A8
DDR2_A[9]
P8
A9
DDR2_A[10]
P3
A10/AP
DDR2_A[11]
M2
A11
P7
DDR2_A[12]
A12
DDR2_BA0
BA0
L2
BA1
L3
DDR2_BA1
R906
150
DDR2_MCLK
DDR2_MCLKZ
DDR2_CKE
READY
DDR2_ODT
DDR2_RASZ
DDR2_CASZ
DDR2_WEZ
DDR2_DQS0P
DDR2_DQS1P
DDR2_DQM0
DDR2_DQM1
DQ0
DDR2_D[0]
G2
DQ1
DDR2_D[1]
H7
DQ2
DDR2_D[2]
H3
DQ3
DDR2_D[3]
H1
DQ4
DDR2_D[4]
H9
DQ5
DDR2_D[5]
F1
DQ6
DDR2_D[6]
F9
DQ7
DDR2_D[7]
C8
DQ8
C2
DQ9
D7
DQ10
DDR2_D[10]
D3
DQ11
DDR2_D[11]
D1
DQ12
DDR2_D[12]
D9
DQ13
DDR2_D[13]
B1
DQ14
DDR2_D[14]
B9
DQ15
DDR2_D[15]
VDD_5
E1
VDD_4
CK
J8
J9
VDD_3
K8
M9
VDD_2
CKE
K2
R1
VDD_1
ODT
K9
CS
L8
A9
VDDQ_10
RAS
K7
C1
VDDQ_9
CAS
L7
C3
VDDQ_8
WE
K3
C7
VDDQ_7
C9
VDDQ_6
E9
VDDQ_5
G1
VDDQ_4
G3
VDDQ_3
G7
VDDQ_2
G9
VDDQ_1
LDQS
56
UDQS
F7
B7
R902
LDM
56
F3
UDM
B3
R904
LDQS
E8
A3
VSS_5
56
UDQS
A8
E3
VSS_4
J3
VSS_3
N1
VSS_2
P9
VSS_1
B2
VSSQ_10
B8
VSSQ_9
A7
VSSQ_8
D2
VSSQ_7
DDR2_DQS0M
DDR2_DQS1M
R903
56
R905
56
NC_4
L1
NC_5
R3
NC_6
R7
NC_1
A2
NC_2
E2
NC_3
R8
D8
+1.8V_DDR
VSSDL
VDDL
C900
0.01uF
50V
J7
J1
DDR2_D[8]
DDR2_D[9]
+1.8V_DDR
A1
CK
R900
R901
56
R2
G8
Close to DDR2 IC
+1.8V_DDR
C901
0.01uF
C902
0.01uF
C903
0.01uF
C906
0.01uF
C907
0.01uF
C908
0.01uF
C909
0.01uF
C910
0.01uF
C911
0.01uF
C912
0.01uF
C913
0.01uF
C914
0.01uF
C915
0.01uF
C916
0.01uF
C917
0.01uF
VSSQ_6
E7
VSSQ_5
F2
VSSQ_4
F8
VSSQ_3
H2
VSSQ_2
H8
VSSQ_1
C919
10uF
10V
DDR2 MEMORY
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LK310
DDR2
2010/11/22
8
9
LGE Internal Use Only
EAX64045802
LP91J
500
19_22INCH
R1010
C1046
0.01uF
50V
C1058
0.1uF
50V
C1045
10uF
16V
C1057
0.01uF
50V
C1011
0.01uF
50V
+16V_NTP
L1004
P_3.5V
26_32INCH
120-ohm
IC1001
BD9130EFJ-E2
+3.5V_MST
1
0
ADJ
2
26_32INCH
R1000
4.7K
26_32INCH
R1001
4.7K
26_32INCH
P1000
FW20020-24S
READY
R1004
RL_ON
2
10K
P_12V_SMALL_15V
C1075
47uF
25V
C1076
0.01uF
50V
2SC3875S
Q1000
Power on
1
1
24V
3
2
GND
5
3
P_24V_SMALL_15V
GND
3.5V
P_3.5V
P_12V_SMALL_15V
2
24V
15V
4
24V
6
GND
8
GND
GND
7
4
3.5V
9
10
5
3.5V
11
6
GND
13
7
GND
15V
GND
ITH
12V
17
9
12V
19
10
12V
21
11
GND/P-Dim2
23
12
3.5V
GND
14
GND
6
OUT:1.27V
L1002
2.2uH
SW
R1043
12K
GND
4
5
R1078
3.3
PGND
C1014
0.1uF
16V
READY
MAX 2A
R1045
2K
R1
R1053
3.3K
C1018
10uF
16V
C1013
10uF
16V
C1055
2200pF
50V
R2
IC1002
AP1117EG-13
P_3.5V
C1015
0.1uF
50V
INVERTER_ON
INV ON
EXCEPT_BIGCMO
R1029
100
PWM_Dim
A-Dim
1
R1
ADJ/GND
22
P-Dim
NC
24
Error out
0
2SC3052
Q1002
R1047
B
10K
C
R1015
0
C1054
0.1uF
50V
DISP_EN/VAVS_ON
IC1007
MP20045DQ-LF-Z
+3.5V_MULTI
EP[GND]
C1070
2.2uF
10V
VIN_2
VOUT_1
10K
C1044
2.2uF
10V
0
C1068
2.2uF
10V
I-DIM
R1080
1%
R1063
12K
READY
C1069
100pF
50V
VOUT_2
1
2
8
EN
R1066
4.7K
PG
R1073
47K
3
6
19_22INCH
READY
R1040
4.7K
0
NTP,AUDIO DSP
+1.8V
R1077
120
4
5
R1022
1
READY
C1073
0.1uF
50V
C1074
1uF
25V
C1051
10uF
6.3V
R1079
56
NTP,AUDIO DSP
POWER_SW
10K
FB
closed IC1007
READY
C1028
100uF
16V
R1067
100K
R1064
10K
READY
BIG_LGD/SHARP FHD
R1035
+1.8V
GND
1%
+3.3V_MULTI_MST
R1084
0
DDR2, Vref
OUT:1.85V
R1
R2
R1081
READY
7
BIG_AUO
R1034
0
R1072
0
ADJ/GND
READY
+3.5V_MST
BIG_LGD
C1077
10uF
6.3V
READY
R1076
0
1
VIN_1
R1033
R1055
56
IN 3 MAX 1A 2 OUT
E
19_22INCH
R1032
0
LD1002
SAM2333
C1022
10uF
6.3V
120-ohm
BIG_CMO
R1031
0
R1005
1.2K
120-ohm
C1037
1uF
25V
IC1008
AP1117EG-13
100
NON_19_22INCH
+3.5V_MULTI
1
+1.8V_DDR
READY
C1023
0.1uF
50V
R1016
READY
L1010
BIG_CMO
R1030
R1071
R2
L1013
R1054
120
R1046
3.3K
OPT
R1037
6.8K
A_Dim
V0 = 1.25*(1+(R2/R1))
OUT:1.85V
+3.5V_MULTI
OLP
+1.2V_VDDC_MST
C1036
1uF
25V
C1016
10uF
10V
GND
20
3
C1060
560pF
50V
19_22INCH
R1028
0
18
7
IN 3 MAX 1A 2 OUT
3.5V
16
2
V0 = 0.8*(1+(R2/R1))
26_32INCH
LED Block
R1044
PVCC
READY
P_24V_SMALL_15V
12
8
EN
READY
C1017
10uF
16V
C1059
10uF
16V
P_24V_SMALL_15V
3.5V
OLP
15
8
+12V_AUDIO
26_32INCH
1
READY
R1002
10K
+3.5V_MULTI
AUDIO_OUT
SMAW200-12
R1006
100K
+3.5V_MST
AUDIO_OUT
19_22INCH
P1001
3
R1003
L1012
VCC
120-ohm
0
26_32INCH
1
10K
AUDIO_OUT
9
2SC3875S
Q1005
C1043
68uF
35V
THERMAL
+3.5V_MST
3
**5V_MULTI->3.3V->1.2V
L1003
P_24V_SMALL_15V
+3.3V_MULTI_MST
READY
ZD1002
3.6V
C1062
10uF
6.3V
C1063
0.1uF
50V
R8043
470K
PANEL_STATUS
READY
R1082
0
<OS MODULE PIN MAP>
BIG_NON_AUO
R1021
PIN No
LGD
CMO(09)
AUO
SHARP
IPS
SMALL
18
INV_ON
A-DIM
INV_ON
INV_ON
INV_ON
INV_ON
20
V4:VBR-A
V5:VBR-A
0
R1017
**Switch 12V:P12V **Switch 3.5V:3.5.V_MULTI
BIG_AUO/IPS
NC
SHARP HD
Err_out Err_out
0
Err_out PWM_DIM
R1083
0
R1023
0
OPT
C1008
0.1uF
16V
E-DIM
NON_OPC
R1038
1K
OPT
C1012
1uF
25V
NON_OPC
R1060
6.2K
PWM_DIM PWM_DIM
24
Err_out
INV_ON
NC
PWM_DIM
NC
A-DIM
PWM_DIM
GND
PWM_DIM
NC
R1039
1K
P_12V_SMALL_15V
19_22INCH
L1005
120-ohm
OPC_OUT
HD_OPC
22
+5V_MULTI
HD_OPC
26_32INCH
L1006
120-ohm
R1075
6.2K
26_32INCH
R1065
19_22INCH
33K
R1065-*1
Close to Q1003
R1048
G2
B
10K
Q1001
E RT1C3904-T112
R1020
10K
*ST 3.5V->3.3V
IC1005
MP20045DQ-LF-Z
S2
S1
P_3.5V
EP[GND]
1
8
L1007
D2_2
10K
C
PANEL_ON
Q1003
AO4813
EBK60706901
C1056
1uF
25V
R1049
33K
READY
C1027
68uF
35V
G1
2
7
3
6
4
5
D2_1
VIN_2
VOUT_1
+3.3V_MST
READY
ZD1000
3.6V
C1053
0.01uF
50V
C1065
2.2uF
10V
C1052
10uF
16V
1%
R1041
12K
READY
C1066
100pF
50V
VOUT_2
1
2
3
6
4
5
GND
FB
R1068
POWER_SW
B
C1021
0.01uF
50V
R1050
2.2K
R1051
2.2K
C1009
100uF
16V
R1052
2.2K
C1010
0.01uF
50V
READY
C1061
100uF
16V
+3.5V_MULTI
READY
ZD1001
3.6V
C1048
1uF
25V
R1070
22K
PG
7
C1019
10uF
16V
D1_1
EN
8
9
C1067
2.2uF
10V
READY
L1011
120-ohm
THERMAL
+3.5V_MST
120-ohm
D1_2
R1061
4.7K
VIN_1
+5V_+12V_LCD
C1005
0.1uF
50V
R1069
1.6K
C
RT1C3904-T112
Q1004
10K
E
R1062
100K
1%
R8044
470K
C1033
0.1uF
16V
READY
C1038
1uF
25V
C1040
0.1uF
50V
VIN 2
C1003
0.1uF
50V AGND
3
FB 4
7 LX_1
3A
+3.5V_MULTI
R1013
10K
C1034
0.1uF
16V
6 EN
5 COMP
C1006
10uF
16V
R1014
R1
5%
R1009
1.5K
C1072
0.1uF
16V
C1007
0.1uF
50V
VIN 2
C1032
0.1uF
50V AGND
3
FB 4
R1007
51K
C1050
2200pF
C1020
10uF
16V
C1031
10uF
25V
7 LX_1
3A
5 COMP
C1064
0.1uF
16V
R1058
9.1K
C1004
100pF
50V
1
OUT 2
+5V_TUNER
+3.5V_MULTI
R1057
10K
6 EN
C1024
2200pF
1%
C1047
0.1uF
16V
R1011
24K
R1
5% R1012
51K
R2
C1039
0.1uF
50V
OPT
C1035
100pF
50V
R1018
10K
1%
C1042
100uF
16V
R1019
110
R1027
330
OUT
9.1K
5%
C1071
10uF
16V
C1030
10uF
25V
1
L1000
500
R1026
330
ADJ/GND
3.6uH
R1025
110
3.6uH
L1008
500
2
+5V_MULTI
NR8040T3R6N
L1001
8 LX_2
NR8040T3R6N
L1009
8 LX_2
PGND 1
3 IN
C1029
10uF
16V
IC1006
AOZ1073AIL
IC1003
AOZ1073AIL
PGND 1
C1002
10uF
25V
C1026
10uF
16V
P_12V_SMALL_15V
P_12V_SMALL_15V
C1001
10uF
25V
C1025
10uF
16V
ADJ/GND
V0 = 0.8*(1+(R1/R2))
OUT:6.8V
IC1004
AP1117EG-13
**DC-DC CONVERTER
*12V -> 5V_MULTI
V0 = 0.8*(1+(R1/R2))
IC1000
AP1117EG-13
**DC-DC CONVERTER
**12V->TUNER 5V
3 IN
R1042
10K
R2
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
R1008
10K
READY
C1049
0.1uF
16V
1%
LK310
POWER
+5V_USB
C1041
100uF
16V
2010/11/22
9
9
LGE Internal Use Only