Download LCD TV SERVICE MANUAL

Internal Use Only
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Europe/Africa
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LCD TV
SERVICE MANUAL
CHASSIS : LP81A
MODEL : 32LF15R
32LF15R-MA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
P/NO : MFL41394480 (0904-REV00)
Printed in Korea
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ......................................................................... 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING ........................................................................... 13
BLOCK DIAGRAM.................................................................................. 18
EXPLODED VIEW .................................................................................. 19
SVC. SHEET ...............................................................................................
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-2-
LGE Internal Use Only
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by
in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.
AC Volt-meter
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-3-
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
0.15uF
1.5 Kohm/10W
LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
-4-
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-5-
LGE Internal Use Only
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
3. Test method
This specification is applied to LP81A chassis.
(1) Performance : LGE TV test method followed
(2) Demanded other specification
Safety
: CE, IEC Specification
EMC
: CE, IEC
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature : 25 ± 5°C(77 ± 9°F), CST : 40 ± 5°C
(2) Humidity : 65% ± 10%
(3) Power : Standard input voltage (100-240V~, 50/60Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
4. General Specification(LCD Module)
Item
Display Screen Device
Aspect Ratio
LCD Module
Operating Environment
Specification
Measurement
Result
Remark
26” wide Color Display Module
Resolution:1366X768
32” wide Color Display Module
Resolution:1366X768
16:9
26” TFT WXGA LCD
26” HD MAKER : LGD
32” TFT WXGA LCD
32” HD MAKER : LGD
1) Temp. : 0 ~ 40 deg
LGE SPEC
2) Humidity : 0 ~ 85%
Storage Environment
1) Temp. : -20 ~ 60 deg
2) Humidity : 0 ~ 85 %
Input Voltage
AC100-240V~, 50/60Hz
Power Consumption
Power on (Blue) : LF15R
≤ 110W
26” HD
≤ 160W
32” HD
St-By (Red)
≤ 1.0 W
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Volume: 1/8 volume of sound distortion point
-6-
LGE Internal Use Only
5. Model Specification(NON EU)
Item
Specification
Remark
Market
NON EU, CHINA
Broadcasting system
PAL SECAM B/G/D/K, PAL I/II, NTSC-M
Available Channel
BAND
PAL
NTSC
VHF/UHF
E2~C69
2~78
CATV
S1~S47
1~71
China(DK)
Australia(BG)
VHF/UHF
C1~C62
C1~C75
CATV
S1~S41
S2~S44
Receiving system
Upper Heterodyne
Video Input (1EA)
PAL, SECAM, NTSC
AV Output (1EA)
PAL, SECAM, NTSC
Rear, Audio Out (8Ω) for commercial china
Component Input (1EA)
Y/Cb/Cr, Y/ Pb/Pr
Rear
HDMI Input (1EA)
HDMI-DTV, Only PCM MODE
Audio Input (2EA)
Component (1EA), AV (1EA)
Rear
L/R Input
6. Component Video Input (Y, PB, PR)
Resolution
H-freq(kHz)
V-freq.(kHz)
Pixel clock(MHz)
720*480
15.73
59.94
13.500
SDTV, DVD 480I(525I)
720*480
15.75
60.00
13.514
SDTV, DVD 480I(525I)
720*576
15.625
50.00
13.500
SDTV, DVD 576I(625I) 50Hz
720*480
31.47
59.94
27.000
SDTV 480P
720*480
31.50
60.00
27.027
SDTV 480P
720*576
31.25
50.00
27.000
SDTV 576P 50Hz
1280*720
44.96
59.94
74.176
HDTV 720P
1280*720
45.00
60.00
74.250
HDTV 720P
1280*720
37.50
50.00
74.25
HDTV 720P 50Hz
1920*1080
28.125
50.00
74.250
HDTV 1080I 50Hz,
1920*1080
33.72
59.94
74.176
HDTV 1080I
1920*1080
33.75
60.00
74.25
HDTV 1080I
1920*1080
56.25
50
148.5
HDTV 1080P
1920*1080
67.432
59.94
148.350
HDTV 1080P
1920*1080
67.5
60.00
148.5
HDTV 1080P
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-7-
Proposed
LGE Internal Use Only
7. HDMI input (DTV)
Resolution
H-freq.(kHz)
V-freq.(kHz)
Pixel clock(MHz)
Proposed
720*480
15.73
59.94
13.500
SDTV, DVD 480I(525I)
720*480
15.75
60.00
13.514
SDTV, DVD 480I(525I)
720*576
15.625
50.00
13.500
SDTV, DVD 576I(625I) 50Hz
720*480
31.47
59.94
27
SDTV 480P
720*480
31.5
60
27.027
SDTV 480P
720*576
31.25
50
27
SDTV 576P
1280*720
44.96
59.94
74.176
HDTV 720P
1280*720
45
60
74.25
HDTV 720P
1280*720
37.5
50
74.25
HDTV 720P
1920*1080
28.125
50
74.25
HDTV 1080I
1920*1080
33.72
59.94
74.176
HDTV 1080I
1920*1080
33.75
60
74.25
HDTV 1080I
1920*1080
56.25
50
148.5
HDTV 1080P
1920*1080
67.432
59.94
148.350
HDTV 1080P
1920*1080
67.5
60.00
148.5
HDTV 1080P
1920*1080
27
24
74.25
HDTV 1080P
1920*1080
33.75
30
74.25
HDTV 1080P
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-8-
Remark
Spec. out but display
LGE Internal Use Only
ADJUSTMENT INSTRUCTION
2) Click the connect button and confirm “Dialog Box”.
1. Application Range
This spec. sheet is applied all of the 26/32” LCD TV, LP81A
chassis (HURRICANE 5) by manufacturing LG TV Plant all
over the world.
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25±5°C of temperature and 65±10% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100-220V,
50/60Hz.
5) The receiver must be operated for about 5 minutes prior to the
adjustment when module is in the circumstance of over 15º.
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15ºC for 2
hours.
In case of keeping module is in the circumstance of below 20ºC, it should be placed in the circumstance of above
15ºC for 3 hours.
3) Click the Config button and Change speed
E2PROM Device setting : over the 350Khz
3. PCB assembly adjustment method
3.1. Mstar Main S/W program download
(1) Preliminary steps
1) Download method 1 (PCB Assy)
- HD
4) Read and write bin file
Click “(1)Read” tab, and then load download
file(XXXX.bin) by clicking “Read”.
(1)
f i l ex x x .bi n
2) Connect the download jig to D-sub jack
(2) Download steps
1) Execute ‘ISP Tool’ program in PC, then a main window
will be opened
5) Click “Auto(2)” tab and set as below
6) click “Run(3)”.
7) After downloading, check “OK(4)” message.
(2)
f i l ex x x .bi n
(4) .......... OK
Double click
(3)
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-9-
LGE Internal Use Only
3.2. Auto color balance(ADC)-Component
(1) Method of Auto Component Color Balance
1) Convert to Component in Input-source
2) Input the Component (Which has 720p@60Hz 100%
Color Bar YPbPr signal into Component.
(MSPG-925F Model: 217/ Pattern: 65)
4. EDID (The Extended Display Identification Data )
/DDC (Display Data Channel) download
* Caution
Use the proper signal cable for EDID Download
4.1. EDID DOWNLOAD
* Caution:
- Never connect HDMI & D-SUB Cable at the same time.
- Use the proper cables below for EDID Writing
For HDMI EDID
3) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)
0x00 0x02 instruction
(2) Confirmation
1) We confirm whether “0xF3 (offset), 0xF4 (gain)” address
of EEPROM “0xBC” is “0xAA” or not.
2) If “0xF3”, “0xF4” address of EEPROM “0xBC” isn’t
“0xAA”, we adjust once more.
3) We can confirm the ADC values from “0x06~0x0B”
addresses in a page “0xBC”.
* Manual ADC process using Service Remocon. After
enter Service Mode by pushing “ADJ” key, execute
“Auto-RGB” by pushing “_” key at “Auto-RGB”.
* EDID Data
Item
Condition
Data
Manufacturer ID
GSM
1E6D
Version
Digital : 1
01
Revision
Digital :3
03
<HDMI 1 : 256bytes>
The data is same without Physical address
3.3. TOOL Option, Area Option
(1) Profile : Must be changed the option value because being
different with some setting value depend on module maker,
inch and market.
(2) Equipment : adjustment remote control.
(3) Adjustment method
The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.)
(If not changed the option, the input menu can differ the
model spec.)
* Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value
* Before PCBA check, you have to change the Tool option, Area
option and have to AC off/on. (Plug out and in)
* After Tool Option/ Area Option change, you have to AC power off.
* Never push the IN-STOP KEY after completing the function
inspection.
-> Physical address(F) : HDMI 1 -> 10
- Detail EDID Options are below (A, B, C, D, E, F)
A. Product ID
Model
Name
3.4. Check SW Version
HD
(1) Method
1) Push In-start key on Adjust remote-control.
2) Check “Main V3.xx”
Product ID
Dec
Hex
EDID table
4018(A)
9CF5
F59C
4018(D)
9CF6
F69C
B. Serial No: Controlled on production line
C. Month, Year: Controlled on production line:
ex) Monthly: ‘09 ‘09
Year: ‘2007 -> ‘11’
D. Model Name(Hex):
Model name
Model Name(HEX)
LG TV
00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
E. Checksum: Changeable by total EDID data
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 10 -
LGE Internal Use Only
3) Enter the adjust mode of white balance
- Enter the white balance adjustment mode with aging
command(F3, 00, FF)
4.2. HDCP SETTING
(High-Bandwidth Digital Contents Protection)
* Before HDCP Download, you have to Set the Configuration
that CMD delay.
-> Configuration -> Option-> I2C delay(Write Byte : 0.5 ms,
Read Byte : 0.5ms, Read CMD Byte : 0.5ms)
* Change the DDC -> After Write Data delay Time 20ms ,also
Change the After Send Read Command delay Time 20ms.
* Check the Communication Clock -> 45KHz.
* Luminance min value is 200cd/m2≥ in the cool mode (For LCD)
4.4. Adjustment of White Balance
(1) Connect D-sub Signal Cable to D-Sub Jack
(2) Input HDCP key with HDCP-key- in-program
(3) HDCP Key value is stored on EEPROM(AT24C64) which
is From “0x80” addresses of 0xA0 page
(4) AC off/ on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925
(5) HDCP Key value is different among the sets.
4.3. Adjustment of White Balance
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to C0 and decrease the others.
- Adjustment mode : Two modes - Cool and Warm
(Medium data is automatically calibrated by the Cool data)
* Required Equipment
1) Remote controller for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product (ch:9)
3) Auto W/B adjustment instrument(only for Auto adjustment)
(1) Connecting diagram of equipment for measuring (For
Automatic Adjustment
1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time
heat-run mode when pushing the power on by power
only key
- Maintain the DDC adjustment mode with same
condition of Heat-run (Maintain after AC off/on in status
of Heat-run pattern display)
2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by
off/on in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and
release DDC adjust mode
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 -
(for Manual adjustment)
(1) Adjustment mode : Two modes (Cool and Warm)
(Medium data is automatically calibrated by the Cool data)
(2) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000(LCD : CH9, PDP : CH10)
(3) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(4) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit” key.
3) Change to the AV mode by remote control.(Push frontAV or Input key)
4) Input external pattern(85% white pattern)
5) Push the ADJ key two times (entering White Balance
mode)
6) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on R/C.
7) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.
8) Adjust two modes (Cool and Warm)
(Fix the one of R/G/B and change the others)
9) When adjustment is completed, Exit adjustment mode
using EXIT key on R/C.
* CASE
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
1) Decrease the R, G.
(2) x, y < target
1) First decrease the B gain,
2) Decrease the one of the others.
(3) x > target, y < target
1) First decrease B, so make y a little more than the target.
2) Adjust x value by decreasing the R
(4) x < target, y > target
1) First decrease B, so make x a little more than the target.
2) Adjust x value by decreasing the G
- Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
Mode
Color coordinate
Temp
∆uv
X
Y
Cool
0.276±0.002
0.283±0.002
11,000K 0.000
Warm
0.313±0.002
0.329±0.002
6,500K
0.003
To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : User 1
XD : Manual – XD Contrast : Off, XD Colour : Off
(If you miss the upper condition, the coordinates of W/B can
be lower than the spec.)
LGE Internal Use Only
** DDC Command set **
Adjustment
CMD(HEX) ADR
Aging On/Off
F3
00
Input select
F4
00
VALUE
FF/00
(3) E2PROM Data Read
1) Signal TABLE
detail
FF : ON / OO : OFF
Delay 150ms
0x10 : TV
0x20 : AV1
0x21 : AV2
128 Bytes
0x40 : Component1
R GAIN
16
00 - C0
GAIN adjustment
G GAIN
18
00 - C0
CSM COOL
B GAIN
1A
00 - C0
R GAIN
16
G GAIN
18
B GAIN
1A
R GAIN
16
G GAIN
18
B GAIN
1A
CSM mode
F2
AUTO ADC
F1
00
01
2) COMMAND SET
Adjustment contents CMD(hex) ADH(hex) ADL(hex)
00 - C0
GAIN adjustment
00 - C0
CSM NORMAL
EEPROM READ
A0
A2
00 - C0
02
E7
00 - C0
GAIN adjustment
00 - C0
CSM WARM
A4
00
COOL
A6
01
NORMAL
02
WARM
00 - C0
00
00
0, 1, 2
0: Offset adjustment
Details
0
0-Page 0~7F Read
80
0-Page 80~FF Read
0
1-Page 0~7F Read
80
1-Page 80~FF Read
0
2-Page 0~7F Read
80
2-Page 80~FF Read
0
3-Page 0~7F Read
80
3-Page 80~FF Read
* Purpose : To read(84h) the appointment Address of E2PROM
by 128(80h)-byte
1: Gain adjustment
2: Offset and Gain adjustment
EEPROM Read
E7
00
00
EEPROM read
EEPROMWrite
E8
00
data
EEPROM write
5. DDC command protocol
5.1. Signal TABLE
VAL
5.2. E2PROM Data Write
(1) Signal TABLE
Delay 20m
LEN : 84h+Bytes
CMD : E8h
ADH : E2PROM Slave Address (A0,A2,A4,A6), Not 00h
(Reserved by BufferToEEPROM)
ADL : E2PROM Sub Address(00~FF)
Data : Write data
Delay : 20ms
(2) Command Set
Adjustment contents
EEPROM WRITE
CMD(hex)
E8h
LEN
94
(84+n)h
Details
16-Byte Write
n-byte Write
* Purpose
1) EDID write : 16-byte by 16-byte, 8 order (128-byte)
write(TO “00 – 7F” of “EEPROM).
2) FOS Default write : 14-mode data write
(SyncFlags, HPeriodH, HPeriodL, VtotalH, VtotalL,
SrcHTotalH, SrcHTotalL, SrcHStartH, SrcHStartL,
SrcVStartH, SrcVStartL, HsyncPhase).
3) Random Data write : write the appointment Address of
E2PROM.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 12 -
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 13 -
HDMI
RGB in
(D/L)
Comp in
AV out
AV in
RF
(Tuner)
EDID NVM
CVBS OUT
LINE IN
SIF IN
CVBS IN
x0.55
LINE OUT
x0.55
DDC/HDP/CEC TMDS351PAG
HDMI MUX
TMDS(HDMI in)
DDC
LINE IN
Y/Pb/Pr IN
LINE_MUTE
LINE IN
TUNER_I2C
CVBS IN
MC74HC4066
Audio SW
x4
LINE IN
LINE_MUTE
LINE OUT
TMDS(HDMI in)
DDC/HPD
[HDMI MUX, direct JACK to MAIN IC]
HDMI_SEL
DSUB_DDC
AUDIO_SW
LM324
X4 AMP
DDR MEM
Mstar
Romeo
LGE6891CD
LVDS
I2S OUT
SW_RESET
DISPLAY MODULE
NTP3000A
Digital
Audio AMP
PART_I2C
SERIAL
PART_I2C FLASH
MAIN NVM
TROUBLESHOOTING
LGE Internal Use Only
1. No power
(1) Symptom
1) It is not discharged minutely from module.
2) Light does not come into the front LED.
(2) Check process
Is the power cord
plugged in?
No
Plug in the power cord.
Yes
Are the line filter and
PSU connected?
No
Connect the cable to SC100
Yes
Is the fuse of PSU
normal? (F101)
No
Replace the fuse.
Yes
Is it connected
that PSU and P1100
in Main B/D?
No
Connect a cable P1100.
Yes
After all cables connect is removed to PSU, the
AC voltage marking is authorized on manual.
When ST-BY 5V is not operated. replace PSU.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 14 -
LGE Internal Use Only
2. No Raster
(1) Symptom
1) No OSD and image occur at screen.
2) It maintains the condition where the front LED is green.
(2) Check process
Does
minute discharge
at Module?
No
Is output the normality
Low/High voltage except
Stand-by 5V?
No
Is the inverter
/ VaVs on?
Replace the
Power board.
Yes
Yes
Is the link cable
normal?
Check the LCD Module
No
Reconnect Panel line cable.
(HD : P403)
Yes
Is the IC801’s
output normal?
No
Replace the VSC.
3. Unusual display from RF mode
Is
video output of the
Tuner normal? (Check
TU500_Pin13)
No
Is the
input voltage
normal?(Check
Pin3)
No
Yes
Yes
Is the I2C communication normal?
(Check Pin9, Pin10)
No
Check the power.
Check the Tuner.
Block A
Is the LVDS
Cable connected?
well
No
Cable inserts well.
Yes
Change the IC(IC801)
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
LGE Internal Use Only
4. Unusual display from rear AV mode.
Is video input of
the A/V Jack normal?
(Check R8044)
No
Check the input source.
Yes
Same as Block A.
5. Unusual display from component 2 model
Is video
input of the Component
Jack normal? (Check
R8030/32/33)
No
Check the input source.
Yes
Change IC801.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 16 -
LGE Internal Use Only
6. No Sound
(1) Symptom
1) LED is green
2) Screen display but sound is not output.
(2) Check process
No
All input(mode)
is no sound.
Is the speaker
on it menu?
Yes
Only HDMI is
no sound.
Set on speaker
in menu.
Yes
No
Download the
EDID data.
Is the speaker
cable normal?
Yes
Only AV/COM2/PC
input is no sound.
No
No
Check the Speaker
cable.
Yes
No
Is the output of
IC600 normal?
No
Replace IC600.
Yes
Check the signal after
IC600 refer to circuit
diagram.
Yes
Is IC801 operated
normality?
Replace IC801.
Yes
No
Only RF is no sound.
No
Check the Tuner In/Out.
Is IC601 operated
normality?
No
Replace IC601.
Yes
Replace Main B/D.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 18 -
( TU500)
RF
( JK101)
COMP IN
( JK200)
MNT_OUT
( JK200)
AV IN
( JK104)
RGB
( SVC Only)
( JK301)
HDMI
( DTV Only)
( IC601)
AMP
GAIN X 4
( IC801)
LGE6891DD
DDR
( IC900)
DDC
( IC802)
24C64
EEPROM
RL_ON/ SELECT/
DIMMING/ SYNC
SW_RESET / IIC_PART
I2S
MUTE_MAIN / AC_DET
AMP_MUTE_HOTEL
( P403)
LCD
( LVDS)
DUAL FET
SWITCH
( IC803)
SPI_D
LVDS_PWR_12V/ RL_ON
MX25L1605
SF- ROM( 16M)
SPI_CZ/ CLK
( P1100)
PSU
SPK 2CH
/ SPK_HOTEL
MNT_5V/ AC_DET
/ SC_RST
( IC600)
NTP3000
Dig it al AMP
TXCO[ 0: 4] / TXCE[ 0: 4] / TXCLKO / TXCLKE
MADR[ 0: 11]
MDATA[ 0: 15]
TMDS/ DDC/ HPD_SINK
HDMI_SEL/ HDMI_IIC
( IC302)
TMDS
Mux
MNT_LR_OUT
TV_MAIN/ MAIN_SIF
IIC_SYS
SECAM_L
AM_AUDIO
SIF
COMP_LR
MNT_VOUT( AMP : GAIN X 4)
/ MUTE_LINE
COMP Y/Pb/ Pr
AUDIO_R
CVBS_VIN
CVBS_L/ RIN
IIC_DSUB
HDMI_5V_DET( HPD) / HPD_MST
TMDS/ DDC/ HPD_S/ W
DDC
( IC300)
24C64
EEPROM
+ 12V
BLOCK DIAGRAM
LGE Internal Use Only
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
A2
910
550
900
300
500
510
122
200
120
801
802
800
805
803
804
530
821
540
521
LV1
400
A10
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by
in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 19 -
LGE Internal Use Only
D1102
S2A
50V
+5VST_MST
C1117
4.7uF
C1102
0.1uF
NC_2
VIN
EN
NC_1
4
3
2
1
C1100
220uF
16V
C1103
0.01uF
C1101
0.1uF
C1104
C1107
22uF
10uF
D1100
16V
16V
MBR230LSFT1G
30V
L1101
22uH
C1106
0.01uF
R1102
47
4
3
2
1
C1109
100uF16V
R1106
18K
(8)
5
6
7
GND
FB
COMP
RUN
R1110
12K
R1111
59K
OUT:UNDER 7.22V
8
R2
C1152
10uF
V0 = 0.8(R1+R2) / R2
R1
R1120
7.5K
C1113
2700pF
50V
C1112
0.1uF
12V->5V_TUNER
C1108
0.01uF
LX
VIN
BST
SS
R1197
0
SHARP 52",AUO
90V
D1103
MBRS190T3G
C1128
100uF16V
0
R1115
IC1103
OUTPUT
3
2
2
IC1107
OUTPUT
3
1
OUTPUT
3
2
1
R1194
330
USB
C1151
100uF
16V
USB
R1166
3.3K
1%
C1118
100uF
16V
ADJ/GND
+5V_USB
C1119
100uF
16V
+5V_TUNER
L1108
120OHM
READY
+5V_MULTI
MBW3216-501TF
L1109
1%
R1195
110
1%
+5V_USB
ADJ/GND
USB
1%
R1124
330
R1123
110
1%
ADJ/GND
AZ1117H-ADJTRE1(EH11A)
INPUT
C1120
0.1uF
USB
C1115
0.1uF
INPUT
AZ1117H-ADJTRE1(EH11A)
IC1104
1
AZ1117H-ADJTRE1(EH11A)
INPUT
P1100
SMAW200-24C
3
2
MAX 1A 1
OUTPUT
INPUT
R1
ADJ/GND
AZ1117H-ADJTRE1(EH11A)
IC1101
R1105
0
B
Q1106
RT1C3904-T112
+5V_ST
E
C
1/10W
5%
R1139-*1 100
DC_DIM
C1125
2.2uF
25VPWM_DIM
1/10W
5%
DC_DIM
R1139
1K
R1135 10K
1%
C1110
100uF
16V
R1137
365
1%
R1128
10K
P_5V
B
C1111
0.1uF
B
R1141
33K
R1140
33K
Q1107
RT1C3904-T112
+5V_MULTI
E
C
R1131
1.6K
C1124
1uF
R1134
10K
R1130
22K
+2.5V_VDDM_MST
20mA
110mA
OUT:2.6V
R2
R1144 402
RL_ON
PANEL_ON
P_5V
E
C
IC1105
IC1108
2
3
R1
D1_2
5%
C1155
47uF
16V
R1169
OPT
R1170 0
R2
C1153
100uF
16V
C1156
0.1uF
5%
R1168 0
4
R1167
OPT
G2
C1154
0.1uF
5
D2_1
6 D2_2
8
S2 3
R2
Q1101
SI4925BDY
EBK32753101
7 D1_1
1
2
G1
S1
L1103
0.1uF
C1131
0.1uF
1
C1132
0.01uF
IC1106
OUTPUT
3
2
1
TW9910 block
MSTAR
POWER
C1148
0.1uF
C1150
0.01uF
+16V_NTP
L1107
C1145
47uF
16V
R1150
OPT
ADJ/GND
P_5V
+5VST_MST
+5V_ST
VCC_LCD
C1123
0.1uF
11
11
2008/01/08
+1.8V
C1147 *NTP.USB,TW9910
0.1uF
R1151 0
5%
+3.3V_SDRAM
C1149
100uF
16V
R1163
0
UBW2012-121F
+5V_MULTI
C1134
0.01uF
C1146
0.01uF
*12V AUDIO and PANEL
L1112
+12V
MBW3216-501TF
+12V
EAM30764101 C1144
0.01uF
AZ1117H-1.8TRE1(EH13A)
INPUT
+3.3V_HDMI_SW
0.1uF
USB
C1130
R1154
2.2K
C1140
0.1uF
+3.3V
*3.3V_NTP,TW9910,ETC.
C1133
10uF16V
R1149
0
R1148
16V
22uF
USB
C1129
C1142
0.1uF
R1153
2.2K
C1138
220uF
16V
C1139
0.1uF
L1106
UBW2012-121F
EAM38769505
C1137
47uF25V
C1141
100uF
16V
R1152
2.2K
+3.3V_USB
C1135 EAM38769505
L1105
UBW2012-121F
EAM38769505
C1136
0.1uF
MBW3216-501TF
USB
P_5V
P_12V
C1122
0.1uF
L1104
UBW2012-121F
P_16V
SWITCH 5V->3.3V->1.8V
2
MAX 1A 1
R1
ADJ/GND
ADJ/GND
MAX 1A 1
AZ1117H-3.3
OUTPUT
INPUT
3
AZ1117H-3.3
OUTPUT
INPUT
Q1100
RT1C3904-T112
C1126
1uF 25V
+12V
READY
R1190
1.2K
+5V_MULTI
D1106
SAM2333
READY
*SHARP 32" : DC DIMMING
E_DIMMING
DISP_EN
AC_RST
+5V_ST
R1184
10K
AC_DET
R1129
10K READY
R1196 10K
R1138
4.7K
3
Q1102
2
2SC3875S 1
R1133
10K
+5V_ST
READY
R1189
10K
+5V_ST
LED Block
SWITCH VCC_LCD:12V or 5V
5V:5V_PULLUP,5V_MULTI
R1185 0 CMO 32,42,47
R1186 0 CMO 57"
CMO 32,42,47,57
R1103 0
R1188
0
READY
READY
C1121
0.47uF
SWITCH 5V->DDR 2.5V
+5V_MULTI
OUT:1.25V
+1.2V_VDDC_MST
5%
R1165
51
*Applied to SIF,HDMI,ADC,MPLL,AUD
+3.3V_MULTI_MST
+3.3V_MST
ST 5V->3.3V->1.2V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+12V
L1100
MBW3216-501TF
C1105
100uF
16V
5 NC_3
6 VO
7
ADJ
8 GND
DCDC_7.22V_PIP
IC1100
SC4215ISTRT
I_DIMMING
R1192
1K
R1122
4.7K
NOT SHARP 32&52",AUO
NOT (CMO 32,42,47,57, SHARP 32")
R1183 0
C1116
2.2uF
25V
R1191
0
CMO 32,42,47,57
READY
R1155 0
RL_ON
C1114
0.47uF
NOT SHARP 52",AUO
IC1102
MP2355DN-LF-Z
equal to 220uF pad size
DC-DC CONVERTER
+5VST_MST
PANEL_STATUS
NOT CMO 57"
R1127 0
P_5V
P_12V
2
4
6
8
10
12
14
16
18
20
22
24
120OHM
L1110
1
3
5
7
9
11
13
15
17
19
21
23
32 Sharp
UBW2012-121F
R1197 R1122 C1114 R1127 R1183 R1155 R1103 R1185 R1186 R1187 R1104
Sharp 52"
O
X
O
O
O
X
X
X
X
X
X
AUO
O
O
O
X
O
X
X
X
X
X
X
CMO 32/42/47
4.7K 0.47uF O
X
X
X
X
O
O
X
O
X
X
CMO 57"
X
X
O
O
O
O
4.7K 0.47uF X
Sharp 32"
X
O
X
X
X
X
X
X
X
X
X
the Rest(w/CMO26")
X
O
O
X
X
X
X
4.7K 0.47uF O
X
R1107
5.6K
16V
P_16V
GND
12V
P_12V
GND
5V
P_5V
5V
GND
R1125 0
R1126
2.7K
AGND
ACD
Inverter ON
R1187
PWM Dim R1132 0 R1104 0 CMO 57" 0
NOT CMO 32,42,47,57
SYNC
120OHM
L1111
16V
GND
12V
GND
5V
5V
GND
GND
Error out
Power ON
A.Dim
Select
NOT 32 Sharp
UBW2012-121F
*PANEL OPTION
USB
READY
P_16V
READY
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
READY
EAX40043809
MSTAR LP81A
SCHEMATIC DIAGRAM
LGE Internal Use Only
R1004
100
R1006
4.7K
R1001
4.7K
PIP_V
+1.8V_AVD
C1001 0.01uF
R1000
75
0.1uF
0.1uF
0.1uF
C1003
C1004
C1002
100
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SW_RESET
READY
100
SCLK
YMUX1
YGND
YMUX2
YMUX3
AVD_1
NC_1
TMODE
RSTB
PDN
SDAT
12
11
10
9
8
7
TW9910
+1.8V_AVD
R1009
25
26
27
28
29
30
33
34
35
36
IC1000
32
6 TW9910DANA2-GR 31
5
4
3
2
14
AVS_1
R1002
AVS_2
R1003
17
SCL_Part
SDA_Part
18
NC_2
+3.3V
1
READY
MAX 1A
19
VSS_1
VDDE_1
+1.8V_AVD
C1010
47uF16V
20
VS
+3.3V
AVD_2
13
YMUX0
0.1uF
C1006
21
HS
C1000
0.1uF
27MHz
R1005 1M
X1000
C1015 120OHM
0.1uF
20pF
L1000
UBW2012-121F
C1007 22pF
15
CIN0
C1008 0.1uF
16
0.1uF
C1009
22
MPOUT
+1.8V
C1014
23
CLKX2
EAX40043809
MSTAR LP81A
R1007
0
XTO
48
XTI
47
VSSE_2
46
VD[0]/SIAD0
45
VD[1]
44
NC_4
43
VSS_2
42
VD[2]
41
VD[3]
40
VD[4]
39
VD[5]
38
VD[6]
37
24
VSSE_1
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
DEC_656[3]
DEC_656_CLK
51
C1013
10pF
READY
TW9909
MSTAR
DEC_656[7]
VD[15]
C1011
0.1uF
+3.3V
DEC_656[6]
VD[14]
VDDE_2
DEC_656[5]
VD[13]
VD[12]
VD[11]
DEC_656[4]
DEC_656[2]
VDD
AR1001 51
DEC_656[1]
VD[10]
NC_3
DEC_656[0]
VD[9]
AR1000
51
VD[8]
VD[7]
DEC_656[0-7]
10 11
2008/01/08
DEC_656[0-7]
+1.8V_AVD
C1012 0.01uF
C1005 22pF
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
MADR[0-11]
MADR[0]
MADR[1]
MADR[2]
MADR[3]
MADR[4]
MADR[5]
MADR[6]
MADR[7]
MADR[8]
MADR[9]
MADR[10]
MADR[11]
MDATA[0-15]
AR903
56
1/16W
MADR[10]
C900
0.1uF
MADR[0]
MADR[1]
MADR[2]
MADR[3]
MADR[4]
MADR[5]
MADR[6]
MADR[7]
MADR[8]
MADR[9]
MADR[10]
MADR[11]
SBA1
SBA0
RASZ
CASZ
WEZ
UDQM
MADR[3]
MADR[2]
MADR[1]
MADR[0]
MADR[10]
MADR[3]
MADR[2]
MADR[1]
MADR[0]
DQ6
MDATA[15]
C901
0.1uF
C905
0.1uF
DQ5
MDATA[14]
DQS1
VDDQ_2
MDATA[13]
VDD_3
A3
A2
A1
A0
A10/AP
BA1
BA0
NC_4
CS
RAS
CAS
WE
LDM
NC_3
VDD_2
A13/NC_2
LDQS
VDDQ_3
NC_1
DQ7
VSSQ_2
DQ4
DQ3
MDATA[12]
C904
0.1uF
DQ2
MDATA[11]
VSSQ_1
DQ1
MDATA[10]
C903
0.1uF
DQ0
VDDQ_1
VDD_1
MDATA[9]
C902
0.1uF
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
13
14
55
56
57
58
59
60
61
62
63
64
65
66
12
11
10
9
8
7
6
5
4
3
2
1
IC900
HYB25DC256163CE-4
MDATA[8]
AR902
56
1/16W
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MADR[0-11]
MDATA[0-15]
#9.DDR
EAX40043809
MSTAR LP81A
C906
0.1uF
VSS_1
A4
A5
A6
A7
A8
A9
A11
A12/NC_5
NC_6
CKE
CK
CK
UDM
VSS_2
VREF
NC_7
UDQS
VSSQ_3
NC_8
DQ8
VDDQ_4
READY
C907
1000pF
R905
150
R906
1K
MADR[4]
MADR[5]
MADR[6]
MADR[7]
MADR[8]
MADR[9]
MADR[11]
MADR[4]
MADR[5]
MADR[6]
MADR[7]
MADR[8]
MADR[9]
MADR[11]
CKE
MCLKZ
MCLK
LDQM
DQS0
2008/01/08
9 11
DDR
+2.5V_VDDM_MST
MSTAR
** MULTI ITEM
MAIN - QIMONDA : EAN41788501
SUB - HYNIX : EAN31729202
R903
150
R909
1K
MDATA[1]
DQ10
MDATA[0]
MDATA[2]
VSSQ_4
DQ9
MDATA[3]
DQ11
DQ12
C909
0.1uF
MDATA[4]
AR900
56
1/16W
MDATA[5]
DQ13
C908
0.1uF
MDATA[6]
DQ14
VDDQ_5
MDATA[7]
VSSQ_5
AR901
56
1/16W
DQ15
VSS_3
+2.5V_VDDM_MST
MDATA[0-15]
R8000
0
CVBS0
VCOM0
48
49
50
64
63
62
61
60
59
58
57
56
55
54
53
52
51
C
E
3
R8007
68
1608
RT1C3904-T112
Q802
MNT_VOUT_T
B
R8006
470
R8010
HDMI_C-
HPD_MST_1
TV_MAIN
SIDE_V
CVBS_VIN
SIDE_Y
SIDE_C
PC_VS
PC_HS
PC_R
PC_G
PC_B
COMP1_Pr
COMP1_Y
COMP1_Pb
HDMI_SCL
HDMI_SDA
HDMI_2+
HDMI_2-
HDMI_1+
HDMI_1-
R8081
0
R8014
75
GAIN X 4
PIP_V
2SA1530A-T112-1R
MSTAR Recommand
: over 8V
C
E
R8018
R8016 100
33K
TW9910 block
DCDC_7.22V_PIP
0.1uF
C808
22
22
R8055
R8056
C818
C819
47
47
47
47
47
47
47
R8039
R8033
R8034
R8035
R8036
R8037
R8038
47
47
47
47
47
47
47
R8043
R8044
R8045
R8046
R8047
47
R8013
R8042
47
R8011
R8041
47
47
R8012
R8017
R870
402
R8020
402
E
C
R8060
100
R8051
68
1608
PIP_VOUT
Q805
RT1C3904-T112
B
R8050
470
VCOM0
0.047uF
0.1uF
CVBS0
C833
10uF
16V
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
R8064
1M
16V
0.1uF
C880
120HZ: H
Normal: L
R8091
4.7K
R8090
4.7K
READY
+3.3V_MST
SW_L/R: COMP2_L/R or SIDE_L/R
C834 C835
4.7uF 0.1uF
SIF1P
AVDD_SIF
SIP0P
GND_61
CVBSOUT0
CVBSOUT1
AVDD_33_58
VCOM1
0.047uF
0.047uF
CVBS1
0.047uF
CVBS3
CVBS2
HWRESET
KDS181
Y1
C1
RIN2P
0.047uF
AC_RST
TW9910 block
C824
0.1uF
50V
C832
C831
C830
C829
C828
BIN2P
GIN2P
SOGIN2
C0
0.047uF
Y0
0.047uF
VSYNC2
0.047uF
1000pF
GND_40
VSYNC0
HSYNC0
0.047uF
0.047uF
C823
4.7K
C822
C827
SOGIN0
GIN0P
VCOM2
BIN0P
VCOM3
RIN1P
GIN1P
SOGIN1
BIN1P
REFM
REFP
VCLAMP
VSYNC1
HSYNC1
DDCDA_CK
C821
C825
REXT
DDCDA_DA
C820
C826
RXA2P
HPLUGA
RIN0P
0 . 0 4 7 u F AVDD_33_39
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
1000pF
0.047uF
R8181
D802
R8019
100
47
47
0.1uF
C817
C816
C815
C814
C813
C812
C811
47
R8032
C810
C809
0.1uF
390
R8054
RXA2N
GND_17
RXA1P
RXA1N
AVDD_33_14
RXA0P
RXA0N
GND_11
RXACKP
RXACKN
DDCDB_CK
DDCDB_DA
HPLUGB
RXB2P
RXB2N
GND_3
RXB1P
RXB1N
1
0READY
READY
R8023
0
0READY
22
READY
R8052
R8031
C855
0
0
0READY
0READY
R8028
R8027
+3.3V_MULTI_MST
R8022
0READY
READY
READY
READY
R8053
22
47
+3.3V_MULTI_MST
Q804
B
+3.3V_MST
R8002
RESET_+3.3V_MST
0
0.1uF
C807
R8048
TW9910 block
R8049
R8008RESET_+5VST_MST
0
+5VST_MST
MAIN_SIF
PIP_VOUT
0.1uF
C806
47
0.1uF
C805
R8029
R8026
R8025
R8024
R8030
+3.3V_MULTI_MST
HDMI_0+
+3.3V_MULTI_MST
HDMI_0-
HDMI_C+
MNT_VOUT_T
C800
4.7uF
10V
D801
KDS181
READY
C804
0.1uF
+3.3V_MULTI_MST
0
MCLKZ
MCLK
BADR[1]
BADR[0]
RASZ
GND_134
VDDM_135
AVDD_MEMPLL
CASZ
WEZ
MADR[0]
MADR[1]
MADR[2]
MADR[3]
MADR[4]
MADR[5]
MADR[6]
MADR[7]
VDDM_147
GND_148
VDDC_149
MADR[8]
MADR[9]
MADR[10]
MADR[11]
AD[0]
AD[1]
AD[2]
AD[3]
AD[4]
AD[5]
AD[6]
AD[7]
WRZ
RDZ
ALE
VDDP_165
GND_166
SCK
SDI
CSZ
SDO
SAR0
SAR1
SAR2
SAR3
PWM0
PWM1
DDCR_DA
DDCR_CK
DDCA_DA
DDCA_CK
INT
IRIN
VDDP_183
GND_184
VDDC_185
GPIOB[4]
GPIOB[5]
GPIOB[6]
NC_189
NC_190
PWM2
PWM3
CVBS_V
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R868
402
E
C
D800
1N4148W
100V
R8004
402
1%
B
Q801
1
5
READY
SW800
TMUE312GAB
+5V_ST 2
4
COMP2_Y
COMP2_Pb
R8021
READY
COMP2_Pr
100
HPD_MST_2
NON_EU OPTION
SIF1P
AVDD_SIF
SIP0P
GND_61
CVBSOUT0
CVBSOUT1
AVDD_33_58
GAIN X 4
MNT_VOUT
2SA1530A-T112-1R
DCDC_7.22V_PIP
C1
C0
Y1
Y0
CVBS3
CVBS2
CVBS1
44
45
46
47
65
SIFM
VCOM1
40
41
42
43
66
GND_66
BIN2P
35
36
37
38
39
67
31
AUVRADP
AUVRADN
32
68
33
69
34
71
AUL0
RIN2P
XIN
AVDD_MPLL
RXBCKN
72
AUR0
GIN2P
XOUT
249
250
251
252
70
AUVREF
27
73
AUL1
28
76
AUL2
29
74
AUR1
30
75
AUCOM
23
77
SOGIN2
DI[12]
DI[13]
HWRESET
78
AUL3
AUR2
GND_40
DI[11]
245
246
247
248
79
AUR3
24
80
AUMONO
25
81
26
82
AUOUTL3
HSYNC0
DI[8]
DI[9]
DI[10]
83
AUOUTL2
AUOUTR3
VSYNC0
DI[6]
DI[7]
VDDC_240
84
AUOUTR2
VSYNC2
DI[3]
VDDP_235
DI[4]
85
REFP
GND_241
241
242
243
244
86
AUOUTL1
REFM
DI[5]
237
238
239
240
87
AUOUTL0
AUOUTR1
RIN0P
DI[2]
233
234
235
236
88
AUOUTR0
RIN1P
89
GPIOF[0]
BIN0P
90
GPIOF[1]
BIN1P
91
GPIOF[2]
GIN0P
92
GPIOF[3]
GIN1P
93
GPIOF[4]
VCOM3
94
GPIOF[5]
19
95
GPIOF[6]
VCOM2
IVSYNC
DI[0]
DI[1]
96
GPIOF[7]
SOGIN0
GPIOE[0]
ICLK
IDE
GPIOF[8]
SOGIN1
GND_222
GPIOE[3]
97
HSYNC1
IHSYNC
229
230
231
232
98
VSYNC1
GPIOE[1]
225
226
227
228
99
GPIOF[9]
VCLAMP
VDDP_221
221
222
223
100
GND_100
VDDP_99
DDCDA_CK
GPIOE[2]
224
VDDC_101
AVDD_33_39
LVB0M
220
101
20
103
21
104
MDATA[15]
22
105
GND_105
MDATA[14]
18
106
IC801-*1
LGE6891DD
HD
LVB1P
LVB1M
LVB0P
107
MDATA[13]
REXT
LVBCKP
LVBCKM
LVB2P
108
VDDM_108
MDATA[12]
RXA2P
NC_209
NC_210
LVB3P
109
MDATA[11]
HPLUGA
LVB3M
212
213
214
215
110
DDCDA_DA
15
16
17
LVB2M
216
217
218
219
102
DQS[1]
113
GND_113
112
MDATA[8]
RXA1P
GND_208
208
209
210
211
111
MDATA[9]
MDATA[10]
RXA1N
11
12
114
RXA2N
RXB0N
RXB0P
13
115
GND_17
AVDD_33_254
254
255
256
14
124
RXA0P
VDDP_194
NC_195
195
126
UDQM
RXA0N
125
LDQM
DQS[0]
GND_11
116
MDATA[7]
AVDD_33_14
RXBCKP
253
10
9
8
7
6
5
4
3
2
1
LVA0P
LVA0M
VDDP_207
117
MDATA[6]
RXB2P
LVA2P
LVA2M
LVA1P
118
MDATA[5]
RXB1P
LVA3P
LVA3M
LVACKP
119
MDATA[4]
GND_3
LVA1M
204
205
206
207
120
MDATA[3]
RXB2N
LVACKM
200
201
202
203
121
MDATA[2]
RXB1N
NC_196
196
197
198
122
MDATA[1]
VDDM_114
HPLUGB
VDDC_193
193
194
127
MVREF
128
MCLKE
199
123
MDATA[0]
VDDM_119
RXACKP
RXB0P
256
65
SIFM
RXACKN
RXB0N
255
66
GND_66
2.2uF
C839
DDCDB_CK
AVDD_33_254
254
67
AUL0
2.2uF
C840
0.1uF
C881
+3.3V_MULTI_MST
RXBCKN
RXBCKP
253
68
AUVREF
2.2uF
DDCDB_DA
C803
20pF
C838
AVDD_MPLL
251
252
69
71
AVDD_AU
2.2uF
AVDD_AU
READY
0.1uF
0.1uF
C801
0.1uF
C882
XIN
250
70
AUVRADP
1uF
XOUT
249
72
AUCOM
0.1uF
COMP2_L
0.1uF
DI[13]
HWRESET
248
AUL2
2.2uF
C842
COMP2_R
C837
HDMI2_5V_DET
DI[12]
246
247
AUR2
2.2uF
C843
SW_L
C844
C845
C846
PC_AUD_L
C836
HWRESET
20pF
HDMI1_5V_DET
C841
DI[11]
245
73
AUR0
HDMI_SEL2
76
X800
14.31818MHz
AUVRADN
+3.3V_MULTI_MST
HDMI3_5V_DET
100
DI[10]
244
77
74
AUL1
R8065
DI[9]
243
78
AUL3
2.2uF
C847
SW_R
I2S_DIN
GND_241
DI[8]
242
79
AUR3
75
AUR1
100
R8066
HDMI_SEL1
100
R8015
I2S_CLK_IN
AUMONO
2.2uF
C848
PC_AUD_R
I2S_WS_IN
R8174
4.7K
R8173
4.7K
READY
+3.3V_MST
R8099
10K
+3.3V_MST
FHD
C860
0.1uF
R8106
READY
R8105
1K
PWM0
+3.3V_MST
R8108
1K
R8110
1K
R8112
READY
R8111
R8109
R8107
3.3K
READY
READY
PWM1
PWM2
PWM3
<Mode Selection>
C861
0.1uF
C863
0.1uF
FLASH_WP
FLASH_WP_ZORAN
R8005
R8067
C864
0.1uF
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
MCLKZ
MCLK
BADR[1]
BADR[0]
RASZ
GND_134
VDDM_135
AVDD_MEMPLL
CASZ
WEZ
MADR[0]
MADR[1]
MADR[2]
MADR[3]
MADR[4]
MADR[5]
MADR[6]
MADR[7]
VDDM_147
GND_148
VDDC_149
MADR[8]
MADR[9]
MADR[10]
MADR[11]
AD[0]
AD[1]
AD[2]
AD[3]
AD[4]
AD[5]
AD[6]
AD[7]
WRZ
RDZ
ALE
VDDP_165
GND_166
SCK
SDI
CSZ
SDO
SAR0
SAR1
SAR2
SAR3
PWM0
PWM1
DDCR_DA
DDCR_CK
DDCA_DA
DDCA_CK
INT
IRIN
VDDP_183
GND_184
VDDC_185
GPIOB[4]
GPIOB[5]
GPIOB[6]
NC_189
NC_190
PWM2
PWM3
C867
0.1uF
C869
C868
R8134
R8135
0.1uF
0.1uF
C871
C872
C873
C877
0.1uF
C876
0.1uF
C875
10uF
16V
0.1uF
100
100
100
39
39
100
100
100
100
100
R8145
R8146
R8147
R8148
R8149
R8150
R8151
R8152
R8153
R8154
C879
10uF
16V
C878
1000pF
PWM1
RX_MPEG
SW_RESET
CEC_C
DISP_EN
R8137
MADR[11]
MADR[10]
100
R8185
2.2K
RL_ON
3.3K
LG60
R8182
0
SDA_Part
SCL_Part
R8179
100
+3.3V_MST
LED_G
R8063
4.7K
+5V_ST_SW
8BIT
R8062
10BIT
4.7K
+3.3V_MST
H/W OPTION #2
Insert all except LG60:R8188
R8176
0
R8175
0
SI
SCLK
HOLD#
VCC
8 11
+3.3V_MST
+2.5V_VDDM_MST
+1.2V_VDDC_MST
+2.5V_VDDM_MST
DEC_656[0-7]
AUDIO_SW
DEC_656_CLK
MDATA[0-15]
DQS1
DQS0
LDQM
UDQM
CKE
MCLKZ
MCLK
SBA1
SBA0
RASZ
CASZ
WEZ
MADR[0-11]
C883
2.2uF
25V
NOT LG60
R8188
SCL_LED
MUTE_LINE
SDA_LED
FHD
HD
R8070
4.7K
USE LG50_60_70
+3.3V_MST
R867
4.7K
R865
4.7K
+3.3V_MST
H/W OPTION #1
8
5
6
7
8
2008/01/08
L509
MBW3216-501TF
R8167
1K
SDA
SCL
WP
IC803
+3.3V_MST
4
3
2
1
MSTAR
R8163
1K
MADR[0]
MADR[1]
MADR[2]
MADR[3]
MADR[4]
MADR[5]
MADR[6]
MADR[7]
MADR[8]
MADR[9]
5
6
7
VCC
MPEG UART
EYEQ_RESET
4
3
2
1
R8184
2.2K
USE LG50_60_70
SPI_CLK
SPI_DI
SPI_CZ
SPI_DO
KEY2
MPEG_RESET
KEY1
I_DIMMING
SDA_Part
E_DIMMING
SCL_Part
DSUB_SDA
DSUB_SCL
PANEL_STATUS
IR
PWM0
A2
A1
A0
GND
TX_MPEG
AC_DET
WP#
GND
IC802
AT24C64AN-10SU-2.7
LED_R/PWM
LED_R_PWM_Big
E
R8061
0
READY
C
RT1C3904-T112
SO
R8172
100
MX25L1605AM2C-15G
CS#
R8171
100
SPI_CZ
SPI_DO
DON’T USE(156,157)
Q803
B
R8187
10K
+3.3V_MST
MSTAR N-EU
100
100
R8144
R8003
100
100
AR800
R8143
100
100
AR801
AR802
R8140
100
READY
100
READY
1K
R8142
100
100
R8168
R8139
R8169
0
100
100
100
R8132
1K
LPL_CMO
R8131
LG60
NOT LG60
USE LG50_60_70 R8086
C870
0.1uF
0
100
0
0
R8123
0
R8121
R8120
R8122
100
R8118
100
R8117
+3.3V_MULTI_MST
R8178
0.1uF
0.1uF
100
100
R8116
100
100
R866
100
R8126
R8115
R8127
PWM2
PWM3
+3.3V_MST
10K
100
READY
R8001
0
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-
TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
IC801
LGE6991DD
86
0.1uF
VDDC_240
240
241
80
83
I2S_SDO
87
R8074
DI[7]
239
81
AUOUTL3
AUOUTL2
I2S_SCK
DEC_656[0]
C850
DI[6]
238
82
AUOUTR3
5.1K
100
0.1uF
C852
VDDP_235
89
GPIOF[0]
R8077
R8075
100
R8082
DI[3]
235
90
GPIOF[1]
DEC_656[1]
DI[4]
R8085
DI[2]
234
91
GPIOF[2]
DEC_656[2]
TXCE3-
SDA_TUNER
92
GPIOF[3]
DEC_656[3]
TXCE2-
0
GPIOF[4]
DEC_656[4]
DI[5]
I2S_WS
100
93
DEC_656[5]
470pF
C853
TXCE1-
H/W OPTION #3
94
GPIOF[5]
#8. MSTAR
GPIOF[6]
DEC_656[6]
22KREADY
470pF
R8088
TXCLKE-
EAX40043809
MSTAR LP81A
95
TXCE0-
R8079
IVSYNC
230
I2S_MCLK
IHSYNC
229
96
TXCE0+
SCL_TUNER
R8092
IDE
228
R8095
ICLK
227
97
GPIOF[7]
READY
HPD_MST_2
FLASH_WP
GPIOE[1]
225
98
GPIOF[8]
237
R8087
233
88
AUOUTL0
10K
AUOUTR1
1000pF
AUOUTR0
MNT_L_AMP
85
AUOUTL1
S_VIDEO_DET
GPIOE[2]
224
99
GPIOF[9]
100
100
C849 2 . 2 u F
R8072
5.1K
CVBS_LIN
105
GND_105
R8080
0
100 RS232C
TXD
100 RS232C
RXD
RS232C
100
PANEL_ON
0
R8058
R8057
0
HPD_MST_3
READY
GPIOE[3]
223
GND_100
VDDP_99
236
READY
MDATA[13]
MDATA[13]
0.1uF
GND_222
222
100
TXCO1-
106
100
100
MNT_R_AMP
84
AUOUTR2
100
TXCO2-
LVBCKM
214
107
C859
VDDP_221
221
101
DEC_656[7]
102
DQS[1]
TXCO0-
MDATA[12]
R8089
DI[0]
DI[1]
232
R8076
103
MDATA[15]
MDATA[15]
TXCO0+
MDATA[12]
R8094
GPIOE[0]
226
READY
R8084
22K
R8078
READY
TXCO3-
LVB0M
220
TXCO4+
LVB0P
219
TXCO4TXCO3+
LVB1M
218
TXCLKO-
LVB1P
217
TXCO1+
LVB3M
108
VDDM_108
NC_210
212
109
GND_208
208
113
LVB3P
211
110
TXCE4TXCE3+
GND_113
NC_209
210
111
MDATA[11]
MDATA[11]
TXCE4+
MDATA[8]
TXCLKO+
LVB2P
LVB2M
216
104
MDATA[14]
MDATA[14]
3.3K
0.1uF
C862
VDDP_207
207
114
LVA0P
206
115
MDATA[7]
LVA0M
205
116
MDATA[6]
VDDM_114
TXCLKE+
MDATA[5]
LVA1P
203
118
MDATA[4]
TXCE2+
LVACKM
201
120
MDATA[3]
MDATA[3]
LVA2P
200
121
MDATA[2]
MDATA[2]
LVACKP
199
122
MDATA[1]
MDATA[1]
LVA2M
202
119
VDDM_119
MDATA[4]
TXCE1+
LVA3M
198
123
MDATA[0]
MDATA[0]
LVA3P
197
TXCO2+
LVBCKP
213
209
112
MDATA[9]
MDATA[10]
MDATA[10]
MDATA[9]
3.3K
R8158
R8157
0.1uF
C865
124
10K
R8102
0.1uF
C866
DQS[0]
NC_195
196
125
LDQM
NC_196
195
126
UDQM
VDDP_194
194
127
MVREF
VDDC_193
193
128
MCLKE
LVA1M
204
117
MDATA[5]
MDATA[6]
MDATA[7]
MDATA[8]
C802
0.1uF
231
C851
R8073
2.2K
R8183
SPK-N
2.2K
READY
R8071
CVBS_RIN
AM_AUDIO
MADR[0-11]
215
VDDC_101
C854
DDR SDRAM
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SPI_DI
SPI_CLK
JP701
P701
USB
JP703
JP702
RAMADD[0-3]
R701
27
R700
27
1A Design
RAMADD[4-9]
**
DUPRD0
RAMADD[11]
READY
R702
5.1K
External F/W Download
READY
R741
0
16V
100uF
R706
4.7K
+3.3VDDP
16V
C709 :EMI Solution
USB_DP
USB_DN
50V
R707
56
C709
5pF
IPCLK
READY
R703
5.1K
50V
L715
MBW3216-501TF
C722 C723
IC704
HY57V641620FTP
C724
10uF
placed as close to Connector as possible.
Capacitors on VBUSA should be
R704
1K
R708
180
SFCLK
SFDI
+3.3V_SDRAM
RAMDAT[8-15]
1/10W
5%
R705
1K
1/10W
5%
ZORAN SRAM Board F/W Download
For Initial Download
It’s possibel to 27~47ohm
DEC_656[0] DUPTD0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
5
4
3
+3.3VDDP
R740
0
READY
RAMDAT[0-7]
R709
1K
ILIMIT
VOUT
4
5
6
VIN
1
3
2
ENABLE
GND
SO
GND
WP#
SFDI
IC705
MIC2009YM6-TR
READY
L716
OPT
FAULT/
FLASH_WP_ZORAN
4
3
2
C725
0.1uF
5
+5V_USB
120OHM
L712
RAMADD[0-11]
18pF
18pF
RAMADD[0]
RAMADD[8]
RAMADD[10]
RAMADD[9]
RAMADD[11]
RAMADD[2]
RAMADD[6]
RAMADD[1]
RAMADD[7]
RAMADD[4]
RAMADD[3]
RAMADD[5]
C719
C720
R715
12MHz
6.19K
X702
75
R714
SFCLK
USB_DP
USB_DN
75
75
R712
R713
75
16V
C710
22uF
SFDO
SFDI
R711
UBW2012-121F
+5V_MULTI
SFCS
UBW2012-121F
120OHM
L718
UBW2012-121F
READY
120OHM
L717
SFDO
SFCLK
* R715 Recommendation is 6.19k 1%
to meet USB2.0 HS cert
OCP_EN
SI
6 SCLK
7 HOLD#
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
RAMBA[1]
RAMBA[0]
RAMCS
RAMRAS
RAMCAS
RAMWE
RAMDQM
IPCLK
C715
C714
16V
16V
47uF
C716
0.1uF
C717
0.1uF
1%
R726
15K
OCP_EN
DEC_656_CLK
DEC_656[0-7]
50V
C734
0.1uF
DEC_656[0] : DUPTD0
UBW2012-121F
Connect to Main IC(CCIR656 Interface)
+3.3VDDA
C712
0.1uF
L714
120OHM
0
TOP SIDE!
16V
DEC_656[6]
102
1
READY
DEC_656[5]
101
2
1
DEC_656[4]
100
3
2
KJA-UB-4-0004
DEC_656[3]
99
R717
96
7
2
3
5 4
DEC_656[2]
98
4
0
0
97
6
5
R716
4.7K
90
JP700
VSS1
DEC_656[1]
95
8
0.1uF
5%
1/10W
DEC_656[0]
94
9
R718
R719
93
22
0
11
+3.3VDDP
RAMDAT[11]
RAMDAT[12]
L713
89
14
0
0
0
0
0
91
12
10K
R710
120OHM
88
DEC_656[7]
UBW2012-121F
83
20
C713
0.1uF
86
17
8 VCC
85
18
R744
R725
92
IC707
10
22uF
84
19
1
79
80
23
CS#
78
25
24
SFCS
82
21
+1.8V
81
22
+3.3VDDP
+1.8VDDA
+1.8VDDC
77
26
READY
C754
10nF
50V
76
27
L711
75
120OHM
74
28
UBW2012-121F C711
R729
22uF
200
73
30
29
+3.3V_USB
C726
0.1uF
50V
+3.3VDDA
+1.8VDDC
C738
0.1uF
50V
C729
0.1uF
50V
+1.8VDDC
C737
0.1uF
50V
C728
0.1uF
50V
C749
0.1uF
50V
C739
0.1uF
50V
C730
0.1uF
50V
C750
0.1uF
50V
C740
0.1uF
50V
C731
0.1uF
50V
C751
0.1uF
50V
C741
0.1uF
50V
C732
0.1uF
50V
C752
0.1uF
50V
C742
0.1uF
50V
R728
R739
MSTAR N-EU
USB/MPEG DEC
0
1/10W
5%
RAMDAT[0-15]
R738
150
0
ZORAN I2C strobe ready
R727
1K
READY
R742
4.7K
R737
R735
R736
R734
75
75
75
75
+3.3VDDP
C753
0.1uF
50V
C743
0.1uF
50V
C744
0.1uF
50V
I2S_DIN
TX_MPEG
RX_MPEG
I2S_WS_IN
I2S_CLK_IN
L719
C746
7
11
2008/01/08
MLF2012A2R7JT000 C755
READY
220pF
50V
READY
22pF
22pF
X703
27MHz
C745
* R732 Video Output Level Reference
MPEG_RESET
DUPRD0
R743
4.7K
READY
+3.3VDDP
R733
390
* Analog Video Option
* R732 Video Output Level Reference
Originally 392 ohm 1%
+3.3VDDA
+1.8VDDA +3.3VDDP
50V
C736
0.1uF
50V
C727
0.1uF
50V
C748
0.1uF
RAMDAT[0]
RAMDAT[15]
RAMDAT[1]
RAMDAT[14]
RAMDAT[2]
RAMDAT[13]
RAMDAT[3]
RAMDAT[12]
RAMDAT[4]
RAMDAT[11]
RAMDAT[5]
RAMDAT[10]
RAMDAT[6]
RAMDAT[9]
RAMDAT[7]
RAMDAT[8]
39
40
41
42
43
44
45
46
47
48
49
51
50
52
53
54
55
56
57
58
59
60
61
62
63
64
50V
C747
0.1uF
C735
0.1uF
50V
+3.3VDDP
+1.8VDDA
72
31
+3.3VDDP
71
32
+3.3VDDP
70
33
IC703_USB
67
IC703
MX25L1605AM2C-15G
69
1
RAMADD[8]
66
37
JK700
12505WS-04A00
RAMADD[9]
68
35
34
DEBUG TEST OPTION
A6
RAMDAT[15]
65
38
36
EAX40043809
MSTAR LP81A
RAMADD[4]
RAMADD[5]
29
26
28
27
VDD3
RAMADD[6]
RAMADD[7]
25
A4
A3
30
A5
A2
32
A7
31
24
A1
RAMADD[3]
RAMADD[2]
RAMADD[1]
23
A0
RAMADD[0]
A8
33
A11
35
A9
34
21
BA1
20
BA0
22
A10/AP
RAMADD[10]
RAMBA[1]
RAMBA[0]
NC1
36
CKE
37
CLK
38
UDQM
39
16
WE
17
CAS
19
CS
RAMCS
RAMRAS
18
RAS
RAMCAS
RAMDAT[8]
DQ8
42
VSS2
41
NC2
40
LDQM
14
VDD2
13
DQ7
RAMDAT[7]
15
RAMWE
RAMDQM
VDDQ3
43
RAMDAT[9]
RAMDAT[10]
45
10
DQ9
44
11
DQ6
12
VSSQ2
VSSQ3
46
DQ11
47
8
DQ4
9
VDDQ2
DQ10
DQ5
RAMDAT[6]
RAMDAT[5]
DQ12
48
7
RAMDAT[13]
RAMDAT[2]
DQ3
RAMDAT[4]
RAMDAT[3]
DQ13
50
VDDQ4
49
6
RAMDAT[14]
51
VSSQ4
52
DQ15
53
VSS3
54
DQ14
RAMDAT[1]
VSSQ1
DQ2
5
DQ1
4
VDDQ1
3
DQ0
2
VDD1
1
RAMDAT[0]
R732
R720
R721
R722
R723
R724
USB
87
16
15
ZR36966PQCG-XD
13
220K
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
USB DOWN STREAM
LGE Internal Use Only
C605
0.1uF
C607
0.1uF
C609
16V 10uF
C667
33pF
50V
READY
SW_L
2.2uF R612
680K
R634
4.7K
C663 2.2uF
R630
680K
R629
680K
+5V_MULTI
C662
R611
680K
+5V_MULTI
C610
0.1uF
+1.8V_DVDD
14
12
AVDDPLL
NC_1
11
LFM
13
10
AGNDPLL
DVDDPLL
9
DGNDPLL
8
R602
100
IC600
NTP3000A
R603
100
XB
YB
YA
XA
C668
33pF
50V
READY
C616
22000pF
PGND2A_2
PGND2A_1
OUT2A_2
OUT2A_1
PVDD2A_2
PVDD2A_1
PVDD2B_2
PVDD2B_1
OUT2B_2
OUT2B_1
PGND2B_2
39
38
37
36
35
34
33
32
31
30
29
0
BST2A
Q608
2SA1530A-T112-1R
R606
C651
1000pF
50V
VDR2A
40
7
6
5
4
3
2
1
8
9
10
11
12
13
14
B
100
R651
XC
YC
YD
AC_DET
R623
4.7K
C636
0.1uF
1S
1F
EAP38319001
SPK_L-
C643 R627
0.1uF 4.7K
C640
0.47uF
C644 R628
0.1uF 4.7K
L610
UBW2012-121F
EAM38769505
C638
0.01uF
R626
3.3
R625
3.3
C639
0.01uF
L607
2S DA-8580 2F
R624
4.7K
C637
0.1uF
R640
680K
R639
680K
+5V_MULTI
R638
680K
R637
680K
E
C
C665 2.2uF
SW_R
B
R633
4.7K
R641 10K
COMP1_R
SIDE_RIN
for SIDE R/L
C641
0.1uF
+5V_MULTI
C664 2.2uF
Q600
RT1C3904-T112
+5V_MULTI
+5V_MULTI
CONTROL_D
XD
C634
1000pF
C630
1000pF
C632
0.47uF
L611
UBW2012-121F
EAM38769505
L612
UBW2012-121F
EAM38769505
R635
3.3
C647
0.01uF
R636
3.3
C648
0.01uF
AUDIO_SW
SPK_R-
SPK_R+
SPK_L-
SPK_L+
L613
UBW2012-121F
EAM38769505
Digital Audio AMP
R621
3.9
R622
3.9
R617
3.9
C629
0.1uF
+16V_NTP
R618
3.9
C635
1000pF
C625
C631
22000pF 1000pF
CONTROL_A
VCC
C
E
+3.3V_MST
C626
0.1uF
1S
1F
EAP38319001
L603
2S DA-8580 2F
+16V_NTP
100V
1uF +16V_NTP
D607
READY 1N4148W
C624
C621
1000pF
R610
3.9
R609
3.9
C622
1000pF
+16V_NTP
30V
D600
READY
C623 22000pF
NC_2
41
C619
1000pF
R608
3.9
R607
3.9
42
C618 1uF
IC602
MC74HC4066ADR2G
C614
1uF
+16V_NTP
C666
C620
330uF 35V 1000pF
D606
READY 1N4148W
Audio S/W : COMP1 or SIDE L/R
GND
CONTROL_C
CONTROL_B
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
for COMP1
6
CLK_I
VDD_IO
7
5
VSS_IO
CLK_O
4
AD
3
1
2
BST1A
VDR1A
/RESET
+5V_MULTI
COMP1_L
SIDE_LIN
C604
10uF 16V
AUDIO_SW
+1.8V_DVDD
C600
10uF 16V
C642
100pF
C606
1000pF
READY
C602
0.1uF
+3.3V
+1.8V_AVDD
C601
100pF R600
3.3K
C603
1000pF
+1.8V_AVDD
I2S_MCLK
SW_RESET
R601
100
C608 READY
1uF D602
30V
PGND1A_2
56
15
DVSS
PGND1A_1
55
16
DVDD
OUT1A_2
54
17
OUT1A_1
53
18
WCK
PVDD1A_1
51
PVDD1B_2
50
21
SCL
22000pF
PWM_3B/PWM_HP2
C611
PVDD1B_1
49
22
100V
C613
0.01uF
OUT1B_2
48
23
PVDD1A_2
52
19
SDATA
OUT1B_1
47
24
PROTECT
0
BCK
I2S_SDO
I2S_WS
I2S_SCK
PGND1B_2
46
25
HOTEL_OPT
20
SDA
PGN