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DVD PLAYER
DVP3320X/78
DVD PLAYER
DVP3320X/78
Service Manual
Service Manual
Conteúdo Especificações Técnicas
Instruções de Segurança
Instruções Mecânicas e Desmontagem
Atualização de Software
Fluxos de Solução de Problemas
Diagrama de Ligações
Painel Frontal
Painel Switch
Painel OK Painel Power
Painel Principal
Guias de Placas
Vista Explodida
Impresso no Brasil
Sujeito a Alterações
08/2009
2
3
5
9
10
21
22
23
24
25
26
30
35
CLASS 1
LASER PRODUCT
4806 727 17377
CLASS
1
LASER PRODUCT
Todos os Direitos Reservados
PHILIPS
08/2009
Impresso no Brasil
Página
Sujeito a Alterações
Todos os Direitos Reservados
4806 727 17377
PHILIPS
DVP3320
Especificações
Nota
•
Especificações e aparência estão sujeitas a
alterações sem prévio aviso.
Acessórios fornecidos
•
Controle remoto
•
Cabos de áudio/vídeo
•
Cabo de força
Desempenho do áudio
•
Conversor DA: 24 bits, 192 kHz
•
Resposta de frequência:
•
DVD: 4 Hz - 22 kHz (48 kHz); 4 Hz
- 44 kHz (96 kHz)
•
SVCD: 4 Hz - 20 kHz (44.1 kHz); 4
Hz - 22 kHz (48 kHz)
•
CD/VCD: 4 Hz - 20 kHz (44.1 kHz)
•
Sinal-Ruído(1 kHz): > 90 dB (Aweighted)
•
Relação Dinâmica(1 kHz): > 80 dB (Aweighted)
•
Crosstalk (1 kHz): > 90 dB
•
Distorção/ruído(1 kHz): > 65 dB
•
MPEG MP3: MPEG Audio L3
Mídia de reprodução
•
DVD-Video, Video CD/SVCD, Audio CD,
Formato de áudio
CD-R/CD-RW, DVD+R/+RW, DVD-R/•
Digital:
RW, Picture CD, MP3-CD, WMA-CD,
•
MPEG/AC-3/PCM: Compressão
USB flash drive
digital (16, 20, 24 bits fs, 44.1, 48, 96
USB
kHz)
•
Compatível: USB
•
MP3 (ISO 9660): 96, 112, 128, 256
•
Classe suportada: UMS (USB Mass Storage
kbps & variable bit rate fs, 32, 44.1,
Class)
48 kHz
•
Audio analógico estéreo
•
Downmix compatível Dolby surround
TV padrão
do áudio Dolby Digital multi-channel
•
Número de linhas:
•
625 (PAL/50Hz); 525 (NTSC/60Hz)
Conexões
•
Reprodução: Multi-standard (PAL/NTSC)
•
Saída YPbPr: Cinch3x
•
Saída de Vídeo: Cinch (amarelo)
Desempenho de vídeo
•
Saída de Áudio: (L+R): Cinch (branco/vermelho)
•
Video DAC: 14 bits, 108 MHz
•
Saída Digital :
•
Y Pb Pr: 0.7 Vpp ~ 75 ohm
•
1 coaxial: IEC60958 para CDDA/
•
Saída de vídeo: 1 Vpp ~ 75 ohm
LPCM; IEC61937 para MPEG 1/2,
Dolby Digital
Unidade Principal
Formato de vídeo
•
Dimensões (L x A x P): 360 x 37 x 209
•
Compressão Digital:
(mm)
•
MPEG 2: DVD/SVCD
•
Peso: aproximado 1.3 kg
•
MPEG 1: VCD
Alimentação
•
Resolução Horizontal:
•
Tensão de alimentação : 110 V - 240 V; 50/60
•
DVD: 720 pixels (50 Hz); 720 pixels
Hz
(60 Hz)
•
Consumo de energia: < 10 W
•
VCD: 352 pixels (50 Hz); 352 pixels
•
Consumo de energia no modo standby:
(60 Hz)
<1W
•
Resolução Vertical:
•
•
DVD: 576 pixels (50 Hz); 480 pixels
(60 Hz)
VCD: 288 lines (50 Hz); 240 lines
(60 Hz)
Especificação do Laser
•
Tipo: Semicondutor laser InGaAIP
(DVD), AIGaAs (CD)
•
Comprimento de onda: 655 nm (DVD), 790 nm
(CD)
•
Potência de saída: 10 mW (DVD), 5 mW
(VCD/CD)
•
Divergência do feixe: 60 graus
3139 785 3093x
Safety Information, General Notes & Lead Free Requirements
2.
EN 5
DVP3320
2.
Safety
Information,
General
&Requirements
Lead Free3139
Requirements
3139
3093x
Safety
Information,
General
Notes
& Notes
Lead
Free
785785
3093x
Safety
Information,
General
Notes
& Lead
Free
Requirements
2.1
deInformation,
segurança, Notas General
Gerais & Exigência
Sem
Chumbo
2.Informações
Safety
Notes
&
Lead
Free
Requirements
2.2.
Safety
Information,
General
Notes
&de&
Lead
Free
Requirements
Safety
General
Notes
Lead
Free
Requirements
2. 2.1 Instruções
deInformation,
Segurança
General Safety
2.2.1 General
2.1.1
2.1.2
EN 4
2.
3139 785 31500
Safety Instructions
Safety
Instructions
2.12.1.1
Segurança
geral
2.1
Safety
Instructions
Safety
that during a repair:
2.1 regulations
Safetyrequire
Instructions
2. 2. ENEN
5 5
Safety Information, General Notes & Lead Free Requirements
2.2
Warnings
2.2
Cuidados
2.2 Warnings
Warnings
2.2
• 2.2
and
many other semiconductors are susceptible to
Warnings
All ICs
2.2.1
Geral
• Connect
the unit
to the mains
via an isolation
transformer.
electrostatic discharges (ESD, ). Careless handling
As normas
de Safety
segurança
requerem
que durante
um reparo:
2.1.1
General
General
2.1.1
General
Safety
2.2.12.2.1
General
• 2.1.1
Replace
safety
components,
indicated
by theum
symbol
,
repairos
can
reduce
life drastically.
Make sure that,
during
• Todos
CIs
e muitos
outros semicondutores
são suscetí-
•Conecte
a unidade
principais
transformador
2.2.1
General
Safety aos cabos
General
onlyde
byisolamento.
components identical to the original ones. Any
duringveis
repair,
you are at the
same potential
asw)
thea mass
as
descargas
eletrostáticas
(ESD,
manipulação
Safety
regulations
require
that
during
a
repair:
•
All
ICs
and
many
other
semiconductors
are
susceptible
Safety
regulations
require (other
that during
a
repair:type)
• set
Allby
ICsa and
many with
otherresistance.
semiconductors
susceptible
to to
component
than
original
of the
wristband
Keep are
descuidada
durante
o reparo
pode
reduzir
a vida
drasticamente.
other
•Recoloque
ossubstitution
componentes
de
segurança,
indicados
pelo sím-
Safety
regulations
require
that
during
a
repair:
•
All
ICs
and
many
other
semiconductors
are
susceptible
to •
Connect
the
unit
to
the
mains
via
an
isolation
transformer.
electrostatic
discharges
(ESD,
).
Careless
handling
Connect
unit
to the
mainsshock
via anhazard.
isolation transformer.
electrostatic
discharges
(ESD,
). Careless handling
may•bolo
increase
riskthe
ofthe
re
or
electrical
components
and tools
this same
potential.
i,
somente
pelos
componentes
idênticos
originais.
Certifique-se
queat
durante
o reparo,
você
estáMake
no mesmo
Connect
unit
to
the mains
via
anby
isolation
electrostatic
discharges
(ESD,
). Careless
handling
Replace
safety
components,
indicated
byaos
thetransformer.
symbol, ,
during
repair
can
reduce
life drastically.
sure
that,
• • •Replace
safety
components,
indicated
the
symbol
during
repair
can
reduce
life
drastically.
Make
sure
that,
Available
ESD
protection
equipment:
Qualquer
outra
substituição
de componente
(com
exceção
potencial
que
a terra
doare
aparelho
por
uma
pulseira
com
resis-
• onlyReplace
safety
components,
indicated
byones.
the
symbol
during
repair
Make
only
by components
identical
to original
the original
ones.
during
repair,
you
at life
the drastically.
same
potential
assure
the that,
mass
byrequire
components
identical
to the
Any Any ,
during
repair,
youcan
arereduce
attablemat,
the
same
potential
as the
mass
– Complete
kit repair,
ESD3
(small
wristband,
Safety
thataumentar
after
a repair,
you
must
return
regulations
do tipoonly
original)
pode
o
risco
de
fogo
ou
choque
tência.
Mantenha
os
componentes
eresistance.
ferramentas
mesma
by
components
identical
to
the
original
ones.
Any
during
you
are
at
the
same
potential
asnathe
mass other
component
substitution
(other
than
original
type)
of set
the by
setaby
a wristband
with
Keep
other
component
substitution
(other
than
original
type)
of
the
wristband
with
resistance.
Keep
the
unit elétrico.
in its original
condition. Pay,
in particular,
attention
to type)
extension
cablewith
andresistance.
earth cable)
connection
potência.
other
component
(other
than
original
ofcomponents
thebox,
set by
aand
wristband
Keep
may
increase
of or
reelectrical
or electrical
shock
hazard.
tools
at this
same
potential.
increase
risk risk
of substitution
re
shock
hazard.
components
tools
at this
same
potential.
the followingmay
points:
310
10671.and
4822
Equipamentos
de
proteção
disponíveis
ESD:
may increase risk of re or electrical shock hazard.
components
and
tools
at
this
same
potential.
Available
ESD
protection
equipment:
Available
ESD
protection
equipment:
– Wristband
tester
4822(pequenas
344 13999.
• Route
wires/cables
correctly,
and x them
with the
Asthe
normas
de segurança
requerem
queadepois
de um
- Kit completo
ESD3
TABLEMAT,
WRISTBAND,
ESD
protection
equipment:
–Complete
Complete
kit ESD3
(small
tablemat,
wristband, caixa Safety
regulations
require
repair,
return
– Available
kit ESD3
(small
tablemat,
wristband,
Safety
regulations
require
that that
afterafter
a repair,
you you
mustmust
return
• Be careful
during
measurements
in(small
the
live
voltage
cable
clamps.
mounted
reparo,
você
deve
retornar
a unidade
na
sua
condição
original.
de conexão,
cabo de
extensão
e fio
terra)
4822
310 10671.
Safety
regulations
require
that
after
a
repair,
you
must
return
–
Complete
kit
ESD3
tablemat,
wristband,
connection
box,
extension
cable
and
earth
cable)
the
unit
in
its
original
condition.
Pay,
in
particular,
attention
to
box,
extension
cable
and earth
cable)
thethe
unitinsulation
in its original
condition.
Pay,forinexternal
particular, attention to
• Check
of the
mains lead
section.
Theconnection
primary
side
of
theextension
power
supply,
Preste
atenção,
particularmente,
pontos:
- Verificador
Wristband
4822
344 13999
connection
box,
cableincluding
and earth cable)
the
in points:
its original
Pay,seguintes
in particular,
attention to
theunit
following
points: condition.nos
4822
310
10671.
the
following
4822
310
10671.
heatsink,
carries
live
mains
voltage na
when
you
damage.
•Distribua
os fios
ewires/cables
cabos corretamente,
eand
separe-os
com os
the •
Tenha–cuidado
durante
a medida
seção
4822
310
10671.
following
•Route
Route
thepoints:
correctly,
x them
Wristband
tester
4822
344
13999.viva da tensão. O –the Wristband
tester
4822
344when
13999.
• the
the wires/cables
correctly,
andthe
x them
withwith
the the
connect
player
to
mains
(even
the
• Check
electrical
DC
resistance
between
mains
suportes
de montagem
de cabos.
lado
primário
dathe
fonte
de
energia
(pos.
105),
incluindo
o dissi-
•the
Route
the
wires/cables
correctly,
and

x
them
with
the
–
Wristband
tester
4822
344
13999.
•
Be
careful
during
measurements
in
the live
voltage
mounted
cable
clamps.
• isBe
careful
measurements
in the
live
voltage
mounted
cable clamps.
player
‘off’!).
Itcalor,
isduring
possible
to
copper
tracks
and/
and
the
secondary
side:
plug
•Verifique
se não
há
danos
na
dos
fiosfor
daexternal
rede elétrica.
pador
decareful
carrega
atouch
tensão
dos
fios
devoltage
rede
quando mounted
cable
clamps.
• section.
Be
during
measurements
in
the
live
section.
The
primary
side
ofviva
the power
supply,
including
•Check
Check
the
insulation
ofisolação
the mains
lead
The
primary
side
of
the
power
supply,
including
•
the
insulation
of
the
mains
lead
for
external
Unplug
thea mains
cord,elétrica
andof
connect
a wire
or components
in this
unshielded
primary
area,
when
1. •Verifique
resistência
DCmains
entre
os between
fios
plugue de
vocêsection.
conecta
o aparelho
na
rede
elétrica
(mesmo
quando
o The
primary
side
of the
power
supply,
including
• damage.
Check
the insulation
the
lead
fordo
external
damage.
the heatsink,
carries
live
mains
voltage
when
the heatsink,
carries
livepersonnel
mains
voltage
when
you you
two
pins
ofsecundário:
the mains plug.
you service
theheatsink,
player.
Service
must
take
the
rede
e
o
lado
aparelho
está
desligado!).
É
possível
tocar
nas
trilhas
the
carries
live
mains
voltage
when
you e nos damage.
•Check
Check
the electrical
DC resistance
between
the mains
connect
the player
to mains
the mains
(even
the
connect
the
player
to
the
(even
when
the
•
the
electrical
DC
resistance
between
the
mains
precautions
to prevent
touching
this
areapreliminar
or(even
components
mainsthe
switch
to de
theDC
‘on’resistance
position
(keep
2. 1.Set
• the
Desplugue
othe
cabo
rede,
e conecte
um the
fio entre
os componentes
de
cobre
desprotegida,
connect
topossible
the área
mains
when
the
Check
electrical
between
the mains
player
isthe
‘off’!).
isnesta
to touch
copper
tracks
plug
and
secondary
side:
player
is ‘off’!).
Itplayer
is Itpossible
touch
copper
tracks
and/and/
plug
andunplugged!).
the secondary
side:
cord
in thisquando
area.
A você
‘lightning
stroke’
and ato
stripe-marked
mains
dois
pinos
do
cabo
de rede.
prestar
serviços
de
manutenção
no
aparelho.
plug
and
the
secondary
side:
player
is
‘off’!).
It
is
possible
to
touch
copper
tracks
and/
or
components
in
this
unshielded
primary
area,
when
1.
Unplug
the
mains
cord,
and
connect
a
wire
between
or components
in thisboard,
unshielded
primary
area, when
1. Unplug
the mainsvalue
cord,between
and connect
a wire between
printing
thecomponents
printed
wiring
indicate
the primary
the
thenamains
3. 2.Measure
Ajuste
osresistance
fios
do
interruptor
de
rede
posição
O on
pessoal
de serviço
deve
tomar
precauções
para
evitar
this
unshielded
primary
area,
1.the
Unplug
the
and
connect
a wire“ON”
between
the
two
pins
of mains
thecord,
mains
plug.
you
service
theinplayer.
Service
personnel
must
taketocar two
pins
ofmains
the
plug.
youor
service
the player.
Service
personnel
must
takewhen
side
of
the
power
supply.
plug
and
the
front
panel,
controls,
and
chassis
(mantenha
o cabo
de
rede
desplugado!)
esta you
área
ou em the
componentes
destapersonnel
área.
Ummust
“lightning
stroke” service
player.
Service
take
the
two
pins
of
the
mains
plug.
2.
Set
the
mains
switch
to
the
‘on’
position
(keep
the
precautions
to
prevent
touching
this
area
or
components
precautions
to prevent
touching this
area
or
components
2. Set the mains switch to the ‘on’ position (keep the
bottom.
Never éreplace
modules,
components,
the
unit
3.
Meça
omains
valor
da resistência
os pinos
do (keep
cabo de
uma
marcada
impressa
no while
painel
destripe-marked
fiação,
indica o lado precautions
toAorprevent
touching
this
area
or iscomponents
2.mains
Set
the cord
mains
switch toentre
the ‘on’
position
theforça • unplugged!).
inlistra
this
area.
‘lightning
stroke’
and
a
cord
unplugged!).
in
this
area.
A
‘lightning
stroke’
and
a
stripe-marked
4. Repair
correct
unit when
thede
resistance
‘on’. preliminar
e oorpainel
frontal,
botões
controle
e chassis.
da
fonte
de
alimentação.
inprinting
thison
area.
A ‘lightning
stroke’
and
a indicate
stripe-marked
mains
cord
unplugged!).
Measure
the
resistance
value
between
the mains
on printed
the
printed
wiring
board,
the primary
3. 3.
Measure
the
resistance
value
between
the mains
printing
the
wiring
board,
indicate
the primary
measurement
isreparado
less
than
1 Mȍ.
4.
O3.produto
está
normal
quando
a resistência
• Nunca
substitua
módulos
ou
componentes
enquanto
o produto printing
on
the
printed
wiring
board, indicate
the primary
Measure
the
resistance
value
between
the
mains
plug
and
the
front
panel,
controls,
and
chassis
side
of
the
power
supply.
plug
and
the
front
panel,
controls,
and
chassis
side
of
the
power
supply.
5. Verifymedida
this, plug
before
you
the unitcontrols,
to the customer/
é de
mais
de
1 MΩ.
estiver
ligado.
side
of replace
the power
supply.
and
thereturn
front
panel,
and chassis 2.2.2 Laser
bottom.
•Never
Never
modules,
or components,
while
the unit
bottom.
•
replace
modules,
or
components,
while
the
unit
is is
user Verifique
(ref. UL-standard
no.de
1492).
5.
isto, or
antes
retornar
o produto
ao cliente / usuá-
• ‘on’.Never
bottom.
‘on’. replace modules, or components, while the unit is
4.
Repair
correct
when
the resistance
4. the
Repair
or
correct
unit unit
when
the
resistance
6.
Switch
unit
‘off’,
and
remove
the
wire
between
the
•
The
use
of
optical
instruments
with
this
product,
will
rio4.(ref.
UL- padrão
no.
1492).
2.2.2 Laser
‘on’.
Repair
or correct
resistance
measurement
is unit
less
than
1the
Mȍ.
measurement
is less
thanwhen
1 Mȍ.
increase eye hazard.
two pins
ofmeasurement
mains para
plug.
6.
Mude
othe
produto
“OFF”,
e remova
ounit
fio to
entre
os
dois 2.2.2
is
less
than
1
MΩ.
Laser
5.
Verify
this,
before
you
return
the
the
customer/
2.2.2OnlyLaser
5. Verify this, before you return the unit to the customer/
personnel
may com
remove
cover irá
or aumentar o pinos
do
plugue
de
força.
•quali
OLaser
usoeddeservice
instrumentos
ópticos
estethe
produto
5. Verify
this,
before
you
the unit to the customer/ • 2.2.2
user
UL-standard
no. 1492).
(ref.(ref.
UL-standard
no.return
1492).
attempt
to service
this device,
due to possible eye injury.
Laser Safety user
perigo
de
danos
aos
olhod.
user
(ref.
UL-standard
no.
1492).
•The The
of optical
instruments
this
product,
Switch
the unit
remove
the wire
between
• handling
use use
of
optical
instruments
withwith
this
product,
will will
6. 6.
Switch
the unit
‘off’,‘off’,
and and
remove
the wire
between
the the
should
take
place
as
much
asthis
possible
2.1.2 Segurança
de of
laser
• Apenas
ouse
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• increase
The
ofeye
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with
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andplug.
remove the wire between the • Repair
increase
hazard.
two
pins
the‘off’,
mains
eye
hazard.
pins
ofthe
theunit
mains
plug.
with
a
disc
loaded
inside
the
player.
This unit employs
a
laser.
Only
quali
ed
service
personnel
ou
tentar
prestar
serviço
depersonnel
manutenção
a remove
esse dispositivo,
two pins of the mains plug.
increase
eye
hazard.
•Only
Only
quali
ed
service
may
the cover
•
quali
ed
service
personnel
may
remove
the
cover
or or
Text below
is a
placed
inside
the aos
unit,
on the laser
cover the cover
may
remove
the cover,
or attempt
to service
this device
(due
2.1.2
EssaLaser
unidade
emprega
um laser.
Somente
pessoal
de serviço • devido
possível
danos
olhos.
•
Only
quali
ed
service
personnel
may
remove
or
attempt
to
service
this
device,
due
to
possible
eye
injury.
Safety
attempt to service this device, due to possible eye injury.
2.1.2
Laser
to possible
eyeSafety
injury).
qualificado
pode remover a tampa, ou tentar prestar serviços de shield:
• A manipulação
do reparo
deve
ocorrer
tanto
quanto
possível
2.1.2
Laser
Safety
attempt
to
service
this
device,
due
toaspossible
injury. Repair
handling
should
take
place
much
aseye
possible
• •Repair
handling
should
take
place
as much
as possible
manutenção
nesse
dispositivo
(devido
a
possível
danos
aos
com
um
disco
carregado
dentro
aparelho
•
Repair
should
take
place
as much as possible
with
a handling
disc
loaded
inside
thedo
player.
This
unit
employs
a laser.
Only
quali
ed service
personnel
with
a
disc
loaded
inside
the
player.
This
unit
employs
a
laser.
Only
quali
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service
personnel
Laser
Device
Unit
CAUTION VISIBLE AND
RADIATION
WHENé
OPEN
AVOID inside
EXPOSURE
TO BEAM
olhos).
INVISIBLE
• O•LASER
texto
abaixo
dentro
da unit,
unidade,
nolaser
protetor
de This
unit
employs
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quali
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abelow
disc
loaded
the
player.
may
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orOnly
attempt
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service
device
(due SYNLIG OG
Text
iscolocado
placed
inside
the
on laser
the
cover
• LASERSTRÅLING
Textwith
below
placed
the
on the
cover
remove
the cover,
attempt
to
service
this this
device
(dueADVARSEL
USYNLIG
VEDis
ÅBNING
UNDGÅ inside
UDSÆTTELSE
FORunit,
STRÅLING
Type may
:orSemiconductor
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ADVARSEL SYNLIG OG
USYNLIG
NÅR DEKSEL
ÅPNES UNNGÅ
EKSPONERING
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tampa
dobelow
laser:
may
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the injury).
cover,
or attempt to service
this device (due
•LASERSTRÅLING
Text
is placed
inside
the FOR
unit,
on the laser cover
to possible
shield:
shield:
to possible
eye eye
injury).
VARNING SYNLIG OCH OSYNLIG LASERSTRÅLNING
NÄR DENNA DEL ÄR ÖPPNAD BETRAKTA EJ STRÅLEN
GaAlAs
VARO! AVATTAESSA OLET ALTTIINA NÄKYVÄLLE
JA NÄKYMÄTTÖMÄLLE LASER SÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN
Unidade
do dispositivo
de
Laser
shield:
to possible
eye injury).
VORSICHT SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG WENN ABDECKUNG GEÖFFNET NICHT DEM STRAHL AUSSETSEN
Wavelength
: GaAlAs
650 nm (DVD)
DANGER VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAM
Tipo: Laser
laser semi-condutor
Device
Unit
Laser Device Unit
ATTENTION RAYONNEMENT
LASER
VISIBLE
INVISIBLE
EN CAS
D’OUVERTURE
EXPOSITION
DANGEREUSE
AU FAISCEAU
CAUTION
VISIBLE
AND ET
INVISIBLE
LASER
RADIATION
WHEN OPEN
AVOID EXPOSURE
TO BEAM
: 780
(VCD/CD)
CAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM
Comprimento
de onda:
nmnm
(DVD)
ADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING VED ÅBNING UNDGÅ UDSÆTTELSE FOR STRÅLING
Laser
Unit 650
Type Device
: Semiconductor
ADVARSEL
SYNLIG
OG USYNLIG
LASERSTRÅLING
VED ÅBNING
UNDGÅ
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CAUTION
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AVOID
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Type
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laserlaser
ADVARSEL
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OGINVISIBLE
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UNNGÅ EKSPONERING
Output
Power
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20
mW
ADVARSEL
SYNLIG
OG USYNLIG
LASERSTRÅLING
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ÅPNES
UNNGÅ
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FOR
STRÅLEN
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SYNLIG
OG
USYNLIG
LASERSTRÅLING
VED
ÅBNING
UNDGÅ
UDSÆTTELSE
FOR
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780nm (VCD/CD)
VARNING SYNLIG OCH OSYNLIG LASERSTRÅLNING NÄR DENNA DEL ÄR ÖPPNAD BETRAKTA
EJ STRÅLEN
Type
: Semiconductor
laser
GaAlAs
VARNING
SYNLIGSYNLIG
OCH OSYNLIG
LASERSTRÅLNING
NÄRNÅR
DENNA
DEL ÄR
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BETRAKTA EJ STRÅLEN
ADVARSEL
OGOLET
USYNLIG
LASERSTRÅLING
DEKSEL
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FOR
STRÅLEN
GaAlAs
VARO! AVATTAESSA
ALTTIINA
NÄKYVÄLLE
JA NÄKYMÄTTÖMÄLLE
LASER EKSPONERING
SÄTEILYLLE. ÄLÄ
KATSO
SÄTEESEEN
Figure
2-2
(DVD+RW
writing)
VARO!VARNING
AVATTAESSA
OLET
ALTTIINA
NÄKYVÄLLE
JA NÄKYMÄTTÖMÄLLE
LASER
SÄTEILYLLE.
ÄLÄ KATSO
SÄTEESEEN
SYNLIG
OCH
OSYNLIG
LASERSTRÅLNING
NÄR DENNAWENN
DEL
ÄR
ÖPPNAD
BETRAKTA
EJNICHT
STRÅLEN
Potência
de
saída:
20
mW
(DVD+RW
writing)
VORSICHT
SICHTBARE
UND UNSICHTBARE
LASERSTRAHLUNG
ABDECKUNG
GEÖFFNET
DEM STRAHL AUSSETSEN
GaAlAs
Wavelength
: 650
nm (DVD)
VORSICHT
SICHTBARE
UND
UNSICHTBARE
LASERSTRAHLUNG
WENN ABDECKUNG
GEÖFFNET
NICHT
DEM STRAHL
AUSSETSEN
VARO!
AVATTAESSA
OLET
ALTTIINALASER
NÄKYVÄLLE
JA NÄKYMÄTTÖMÄLLE
LASER
SÄTEILYLLE.
ÄLÄ
Wavelength
: 650
nm (DVD)
DANGER
VISIBLE AND
INVISIBLE
RADIATION
WHEN OPEN AVOID
DIRECT
EXPOSURE
TOKATSO
BEAM SÄTEESEEN
:
0.8
mW
DANGER
VISIBLESICHTBARE
AND INVISIBLE
LASER
RADIATION
WHEN OPEN AVOID
DIRECT
EXPOSURE
TO BEAM
VORSICHT
UND
UNSICHTBARE
LASERSTRAHLUNG
WENN
ABDECKUNG
GEÖFFNET
NICHT
DEM
STRAHL
AUSSETSEN
:
0.8
mW
(leitura
de
DVD)
ATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS D’OUVERTURE EXPOSITION DANGEREUSE AU
FAISCEAU
Wavelength
: : 650
780
nm(DVD)
(VCD/CD)
ATTENTION
RAYONNEMENT
LASER VISIBLE
ETRADIATION
INVISIBLE WHEN
EN CAS
D’OUVERTURE
EXPOSITION
DANGEREUSE
DANGER
VISIBLE AND INVISIBLE
LASER
OPEN
AVOID DIRECT
EXPOSURE
TO BEAM AU FAISCEAU
: reading)
780
nmnm
(VCD/CD)
(DVD
2.2.3
Notes
ATTENTION RAYONNEMENT LASERFigura
VISIBLE ET INVISIBLE
: 0.3 mW (leitura de VDC/CD)
2-2 EN CAS D’OUVERTURE EXPOSITION DANGEREUSE AU FAISCEAU
:
780
nm
(VCD/CD)
Output
Power
:
20
mW
Output Power
:
20
mW
0.3 mW : 20 mW
Divergência
do feixe: 60: graus
Output Power
Figure
(DVD+RW writing)
Figure
2-2 2-2
(DVD+RW
(VCD/CD
reading) writing)
Dolby
2.2.3 Notas
Figure 2-2
: (DVD+RW
0.8 mW writing)
: 0.8
mW
Beam divergence
: 60 degree
Manufactured
under
licence
from
Dolby
Laboratories. “Dolby”,
: 0.8
mWreading)
(DVD
2.2.3Notes
Notes
(DVD
reading)
2.2.3
“Pro
Logic”
and
the
double-D
symbol
are
trademarks of Dolby
Dolby
reading)
2.2.3 Notes
: (DVD
0.3 mW
: 0.3
mW
Laboratories.
Condential
Works.
Manufaturado
sob Unpublished
licença do Dolby
Laboratories. "Dolby", "Pro :
0.3
mW
(VCD/CD
reading)
Dolby
(VCD/CD reading)
©1992-1997
Dolby
Laboratories,
Inc.
Allmarcas
rights reserved.
Dolby
Logic"
e o símbolo
duplo-D
são
resgistradas do Laborató
(VCD/CD
reading)
Dolby
Beam
divergence
60 degree
Manufactured
under
licence
Dolby
Laboratories.
“Dolby”,
Beam
divergence
: 60: degree
under
licence
fromfrom
Dolby
Laboratories.
“Dolby”,
Manufactured
rio Manufactured
Dolby.
CLASS 1
Beam divergence
: 60 degree
under
licence
from
Dolby
Laboratories.
“Dolby”,
“Pro
Logic”
and
the
double-D
symbol
are
trademarks
of Dolby
“Pro
Logic”
and
the
double-D
symbol
are
trademarks
of
Dolby
©
1992-1997
Laboratório
Dolby,
Inc.
Todos
os
direitos
reservados.
LASER PRODUCT
“Pro
Logic”Con
andCon
the double-D
symbolWorks.
areWorks.
trademarks of Dolby
Laboratories.
dential
Unpublished
Laboratories.
dential
Unpublished
Laboratories.
Con
dential
Unpublished
Works.
©1992-1997
Dolby
Laboratories,
Inc.
All
rights
reserved.
©1992-1997 Dolby Laboratories, Inc. All rights
reserved.
Figura 2-1 CLASS 1
©1992-1997 Dolby Laboratories, Inc. All rights reserved.
CLASS 1
Figure 2-3
Figure
2-1PRODUCT
CLASS
1
LASER
LASER
PRODUCT
Nota: o uso dos controles
ou do
ajuste ou o desempenho do pro-
LASER
PRODUCT
cedimento à exceção daqueles especificado neste manual, podem Trusurround
TRUSURROUND,
SRS
and symbol (g 2-4) are trademarks
Figura
2-3
resultar
na
exposição
perigosa
à
radiação.
Evite
a
exposição
direta
Note: Use of controls or adjustments or performance of
Figure
2-3
Figure
2-3
Figure
2-1
of SRS Labs, Inc. TRUSURROUND
technology
is
Figure
2-1may
ao feixe.
Figure
2-3
procedure
other than those specied
herein,
result
in
Figure 2-1
manufactured
under
licence
frm
SRS
labs,
Inc.
Trusurround
hazardous radiation exposure. Avoid direct exposure to beam.
Trusurround
Trusurround
TRUSURROUND,
SRS e o símbolo (fig. 2-4) são marcas registra
Trusurround
TRUSURROUND,
SRS
and
symbol
(g 2-4)
are trademarks
TRUSURROUND,
and
symbol
(g 2-4)
are trademarks
Note:
Use
of
controls
or
adjustments
or
performance
of
das
do LaboratórioSRS
SRS,
Inc.
A tecnologia
é Note: Use of controls or adjustments or performance of
TRUSURROUND,
SRS
and
symbol
(technology
gTRUSURROUND
2-4) are
trademarks
of SRS
Labs,
Inc.
TRUSURROUND
is
of
SRS
Labs,
Inc.
TRUSURROUND
technology
is
Note:
Use
of
controls
or
adjustments
or
performance
of
procedure
other
those
speci
ed herein,
result
manufaturada
sob
licença
do
laboratório
SRS,
Inc.
procedure
other
thanthan
those
speci
ed herein,
maymay
result
in in
ofmanufactured
SRS Labs,
Inc.
TRUSURROUND
technology
under
licence
frm SRS
labs,
manufactured
under
licence
frm SRS
labs,
Inc. Inc. is
procedure
other
than
those speci
ed herein,
may result
hazardous
radiation
exposure.
Avoid
direct
exposure
toinbeam.
hazardous
radiation
exposure.
Avoid
direct
exposure
to beam.
manufactured
under
Figure
2-4licence frm SRS labs, Inc.
hazardous radiation exposure. Avoid direct exposure to beam.
Figura 2-4
Figure
Figure
2-4 2-4
Figure 2-4
93x
Safety Information, General Notes & Lead Free Requirements
3139 785 3093x
EN 6
2.
Safety Information, General Notes & Lead Free Requirements
6
EN
DVP3320 3139 785 3093x
Safety Information,
General
Notes &some
Lead
Free
Requirements
Due to lead-free
technology
rules
have
to be respected by the
Video 2.
Plus
workshopby
during
“Video Plus+” Due
and to
“PlusCode”
are registered
trademarks
of to be respected
lead-free technology
some
rules have
the a repair:
the Gemstar
Development
Corporation.
workshop during
a repair: The “Video Plus+”
stered trademarks
of
Due to lead-free
technology
some
rules
have
to beSAC305
respected
byorder
the
Video
Plus
x Use only
lead-free
solder
alloy
Philips
with
system
is manufactured under licence from the Gemstar
n. The “Video Plus+”
Vídeo
Plus
companhias
externas.
workshop
during
a
repair:
“Video
Plus+”
and
“PlusCode”
are
registered
trademarks
of
code 0622 149 00106. If lead-free solder-pate is required,
Development Corporation.
x Use only lead-free solder alloy Philips SAC305 with order
from the Gemstar
"Video
e "Plus
Code" são
marcas registradas
do Plus+”
Gemstar
• Informações
para
ICs BGA sem
chumbo:
estes ICs
thePlus+"
Gemstar
Development
Corporation.
The “Video
pleaseespeciais
contact the
manufacturer
of your
solder-equipment.
code 0622 149 00106. If lead-free solder-pate is required,
Development
Corporation.
O
sistema
"Video
Plus+"
é
fabricado
serão
entregues
no
chamado
“pacote
a seco”
para proteger
o IC
system is manufactured under licence from the Gemstar
x Use
only lead-free
solder
alloy Philips
SAC305
with
order
In
general
use
of
solder-paste
within
workshops
should
be
please contact the manufacturer of your solder-equipment.
sob Development
a licença da Gemstar
Development Corporation.
contracode
umidade.
Este
pacote
só
pode
ser
aberto
pouco
antes
de
0622
149
00106.
If
lead-free
solder-pate
is
required,
Corporation.
avoided
In general use of solder-paste within workshops should
be because paste is not easy to store and to handle.
ser usado
Oumanufacturer
então
o corpo
doyour
IC fica
“molhado”
dentro
please
contact
the
solder-equipment.
Use(soldado).
only
adequate
solder
tools of
applicable
for
lead-free
avoided because paste is not easy to store and to x
handle.
e durante
o tempo
de
aquecimento
a
estrutura
do
IC
será
destruInsolder
general
use
of
solder-paste
within
workshops
should
be
alloy. The solder tool must be able
x Use only adequate solder tools applicable for lead-free
ída por
causa
da altaattemperatura
corpo.
pacote for
avoided
pasteaissolder-temperature
notdentro
easy todostore
and
toohandle.
o To because
reach
least
ofSe
400°C,
solder alloy. The solder tool must be able
aberto
antes
uso, o the
ICsolder
deve
ser
por
algumas
horas
x Use
onlydoadequate
toolsesquentado
applicable for
lead-free
adjusted
temperature
at the
solder-tip
o To reach at least a solder-temperature of 400°C, o To stabilize
o
(em torno
de
90
)
Para
secar
(pense
na
proteção
ESD!).
NÃO
solder
alloy.
The
solder
tool
must
be
able
Figure
2-5
o To exchange solder-tips for different applications. REo To stabilize the adjusted temperature at the solder-tip
Figura 2-5
modo
algum!
o To de
reach
at
least
a solder-temperature
of 400°C,
USExBGAs
Adjust
your
solder
tool
so that a temperature
around 360°C
o To exchange solder-tips for different applications.
• Para produtos
produzidos
ante
de
1.1.2005,
contendo
ferramenta
o
To
stabilize
the
adjusted
temperature
at
the solder-tip
380°C is reached and stabilized at the solder
joint.
x Adjust
your solder tool so that a temperature around –360°C
Figure
2-5
Microvision
de solda
chumbo solder-tips
e componentes,
toda a applications.
lista de peças será
o com
To exchange
for different
Macrovision
– 380°C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed ~ 4 sec.
Este produto
incorpora
tecnológia
de proteção
de cópia
que é that avaliada
atéyour
o fimsolder
do período
serviço.
Para reparo
destes
x Adjust
tool sodethat
a temperature
around
360°C
This product
incorporates
copyright
protection
technology
Heating-time
of the solder-joint
should not exceed ~ Avoid
4 sec. temperatures above 400°C otherwise wear-out of tips
o metódo
dethat
proteção
exigidoclaims
da certificado
U.S
depatents
patentes
e
aparelhos,
nada
muda.
– will
380°C
is
reached
and
stabilized
at
the
solder
joint.
is protected
by method
of
certain
U.S.
and
otection technology
rise
drastically
and

ux-
uid
will
be
destroyed.
To
avoid
Avoid
temperatures
above
400°C
otherwise
wear-out
of
tips
Macrovision
• No website
outros
proprietários
intelectuais
da própria
Macrovision
Corporawww. atyourservice.ce.Philips.com
encontra
mais
Heating-time
of the solder-joint should notvocê
exceed
~ 4 sec.
other
property
rights
owned
by Macrovision
in U.S. patents
and intellectual
will
rise drastically
and
ux-uid will
be destroyed. Towear-out
avoid of tips switch off un-used equipment, or reduce
This
product
incorporates
copyright
protection
technology
that
tion. Corporation and other rights owners.
informações
sobe:
Avoid
temperatures
above
400°C
otherwise
wear-out
of
tips
d by Macrovision
heat.
wear-out
of tipsU.S.
switch
off un-used
or reduce
isUse
protected
method
claims
ofde
certain
patents
and equipment,
O uso
desta
de protection
proteção
cópia deve
ser be
autorizada
• (De) xSolda
BGA
(+ instruções
de operação).
will
rise
drastically
and ux-
uid
will be
destroyed.
To avoid
of tecnologia
thisby
copyright
technology
must
Mix
of
lead-free
solder
alloy
/ parts
with
leaded solder
alloy
heat.
other
intellectual
property
rights
owned
by
Macrovision
pela
Macrovision
Corporation
e
é
permitido
para
casas
e
outros
•
Perfis
de
aquecimento
dos
BGAs
e outros
ICs usados
em aparewear-out
ofpossible
tips switch
off
un-used
equipment,
or reduce
Corporation,
and
is
intended
for
logy must be authorized by Macrovision
/
parts
is
but
PHILIPS
recommends
strongly
to
x Mixowners.
of lead-free solder alloy / parts with leaded solder alloy
Corporation
and
other
rights
somente
da Macrovision
Corporation.
A
lhos Philips.
heat. mixed solder alloy types (leaded and lead-free).
home
otherautorização
limited viewing
only unless
otherwise
n, and is limites
intended
forand com
/ partstechnology
isuses
possible
but PHILIPS
recommends stronglyavoid
to
Use
of this écopyright
protection
must
beengineering
desmontagem
proíbida.
x Mix
of lead-free
solderoralloy
parts
withwhether
leaded solder
alloy
authorized
by Macrovision
Corporation.
Reverse
nly unless
otherwise
If one
cannot avoid
does/ not
know
product
is
avoid
mixed
solder
alloy
types
(leaded
and
lead-free).
authorized
by
Macrovision
Corporation,
and
is
intended
for
Você /encontra
estas
e
mais
informações
técnicas
em
“magazine”,
parts
is
possible
but
PHILIPS
recommends
strongly
to
or disassembly is prohibited.
n. Reverse engineering
lead-free,
clean carefully the solder-joint from old solder
If one uses
cannot
avoid
or does
not know whether product
is
home
and
other
limited
viewing
only
unless
otherwise
capítulo
“workshop
news”.
2.3 Solda sem chumbo
avoid
mixed
solder
alloy
(leaded
and(SAC305).
lead-free).
alloy
and re-solder
withtypes
new solder
alloy
clean
carefully
the solder-joint from old solder
authorized by Macrovisionlead-free,
Corporation.
Reverse
engineering
If Use
one only
cannot
avoidspare-parts
or does notlisted
knowinwhether
product is
2.3 orLead
Free
Requirement
x
original
the
Service-Manuals.
alloy and re-solder with new solder alloy (SAC305).
disassembly
is prohibited.
Para lead-free,
questões
por favor,
contate o from
helphas
desk
local.
A Philips
CE está produzindo
aparelhos sem chumbo (PBF) de
clean
carefully
the solder-joint
old
solder
Not listedadicionais,
standard-material
(commodities)
to
be
x Use only original spare-parts listed in the Service-Manuals.
1.1.2005 para frente.
alloy
and re-solder
with new
solder alloy (SAC305).
purchased
at
external
companies.
Not
listed
standard-material
(commodities)
has
to
be
Information
about Lead-free produced sets
2.3 Lead
Free Requirement
xxUse
only original
spare-parts
listed in the Service-Manuals.
Special
information
for BGA-ICs:
purchased at external companies.
ed sets
3. Instrução
destandard-material
Usothe 12nc-recognizable
Identificação: A etiqueta de modelo tem um número de série de 14
Not
listed
(commodities)
has to
be
- always
use
soldering
temperature
x Special information
BGA-ICs:
Philips CE is starting
production
of lead-freefor
sets
from
dígitos.
Os dígitosabout
5 e 6 Lead-free
referem-seproduced
ao ano desets
produção, os dígitos
purchased
at external
companies.
Information
pro
le
of
the
speci
c
BGA
(for
de-soldering
always
use the
- always use the 12nc-recognizable soldering temperature
1.1.2005 onwards.
d-free sets
Manualinformation
no GIP. for BGA-ICs:
7 efrom
8 referem-se à semana de produção (no exemplo abaixo, é
Veja
x oSpecial
lead-free
prole of the specic BGA (for de-soldering always use
the temperature prole, in case of doubt)
1991Philips
na semana
- always
useBGA-ICs
the 12nc-recognizable
soldering
temperature
CE is 18).
starting production
of lead-free
setspro
from
- lead free
will be delivered
in so-called
‘drylead-free
temperature
le, in case of doubt)
INDENTIFICATION:
pro
le
of
the
speci
c
BGA
(for
de-soldering
always
use
1.1.2005 onwards.
packaging’ (sealed pack including a silica gel pack)
to the
- lead free BGA-ICs will be delivered in so-called ‘drylead-free
temperature
le, in case
doubt) dependent
protect the
IC againstpro
moisture.
Afterofopening,
packaging’ (sealed pack including a silica gel pack) to
Regardless of special logo (not always indicated)
- lead
free BGA-ICs
willindicator-label
be delivered ininso-called
INDENTIFICATION:
of MSL-level
seen on
the bag, ‘drythe
protect the IC against moisture. After opening, dependent
s indicated)
packaging’ (sealed pack including a silica gel pack) to
of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture
One must treat all sets from 1 Jan 2005 onwards, according
protect
the IC
against
moisture.
After opening, dependent
Sensitivity
Level).
This
will be communicated
via AYSpossibly
still has to be baked dry. (MSL=Moisture
Regardless
of special logoBGA-IC
(not always
indicated)
next
05 onwards,
according
Apesar
do rules.
logo especial sem chumbo (que nem sempre é
ofwebsite.
MSL-level seen on indicator-label in the bag, the
Sensitivity Level). This will be communicated via AYSindicado),todos os aparelhos desta data pra frente de acordo com
BGA-IC
still has
to be baked dry. (MSL=Moisture
Do not possibly
re-use BGAs
at all.
website.
One
treat all sets from
1 Jan 2005 onwards, according
Example
S/N:must
as regras
descritas abaixo.
Sensitivity Level). This will be communicated via AYSDo not re-use BGAs at all.
next rules.
xwebsite.
For sets produced before 1.1.2005 (except products of
Do not re-use
BGAsleaded
at all. solder-alloy and components,
containing
Example S/N:
x For sets produced before 1.1.2005 (except products 2004),
of
all needed spare-parts will be available till the end of the
2004), containing leaded solder-alloy and components,
x For sets produced
before
products
of
For
repair1.1.2005
of such (except
sets nothing
changes.
all needed spare-parts will be available till the end ofservice-period.
the
2004), containing leaded solder-alloy and components,
service-period. For repair of such sets nothing changes.
needed
spare-parts
will be available till the end of theyou
xallOn
our website
www.atyourservice.ce.Philips.com
service-period.
For repair
nd more information
to:of such sets nothing changes.
x On our website www.atyourservice.ce.Philips.comyou
nd more information to:
xƒ
On
our website www.atyourservice.ce.Philips.com
you
BGA-de-/soldering
(+ baking instructions)
nd
more information
to: and other ICs used in Philips-sets
ƒ
Heating-pro
les
of
BGAs
ƒBGA-de-/soldering (+ baking instructions)
ƒHeating-proles of BGAs and other ICs used in Philips-sets
Com a tecnologia sem chumbo, algumas regras devem ser respei
ƒBGA-de-/soldering
(+ baking
instructions)
You will nd this and
more technical
information within the
Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is
tadas pelo posto autorizado durante o reparo:
ƒHeating-pro
les
of
BGAs
and
other
ICs used in Philips-sets
“magazine”,
chapter “workshop
news”.
You
the
the
week
number,
so in this case 1991
wkwill
18 nd this and more technical information within
6 is the
year,
digit
7&8
is
• Use apenas ferramentas de solda sem chumbo Philips SAC305
“magazine”, chapter “workshop news”.
o0501
código
de pedido
149
Seisathe
pasta
solda
sem
You will nd this and more technical information within the
Socom
from
onwards
= from
10622
Jan 2005
onwards
Bottom
line
of
typeplate
gives
a 14-digit
S/N.00106.
Digit 5&6
year,de
digit
7&8 is
chumbo
for necessária,
favor
contate o fabricante do equi“magazine”,
chapter
“workshop
news”.
the week
number,
so in this casepor
1991
wk 18
For additional
questions
please
contact your
local repair-helpdesk.
pamento de solda. No geral, o uso de pasta de solda em postos
For
additional
questions
please
contact
your
local
repair-helpdesk.
SoImportant
from
0501
onwards
=
from
1
Jan
2005
onwards
In fact alsopois
products
of yearnão
2004émust
be treated manuseada
in this way as long
as you
deve note:
ser evitada
a pasta
facilmente
nem
avoid
mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher
armazenada.
For additional questions please contact your local repair-helpdesk.
ated in this way
as long as you
temperatures belong to this.
ys use•SAC305
the higher
Useand
apenas
ferramentas de solda aplicáveis para ferramenta de
Important note: In fact also products of year 2004 must be treated in this way as long as you
solda sem chumbo. A ferramenta de solda deve:
avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher
temperatures
- Alcançar
nathis.
ponta da ferramenta a temperatura de pelo menos
belong to
400o
- Estabilizar o ajuste de temperatura na ponta da solda.
- Troque a ponta de solda para diferentes aplicações.
• Ajuste sua ferramenta de solda para que a temperatura de 360o
- 380o seja alcançada e estabilizada na junção da solda. O tempo
de aquecimento da junção da solda não deve exceder ~ 4s. Evite
temperaturas acima de 400o , ou então "wear-out" das pontas
irá aumentar drasticamente e o fluxo- fluido será destruído. Para
evitar "wear-out" de pontas, desligue o equipamento quando não
usado ou reduza a temperatura.
• Misturar parte/ ferramenta de solda sem chumbo com partes/
ferramentas de solda com chumbo é possível mas a PHILIPS
recomenda que se evite isso. Se não puder ser evitado, cuidadosamente limpe a solda da antiga ferramenta e re-solde com uma
nova ferramenta.
• Use apenas peças originais listadas no Manual de Serviço. Materiais padrão não listados (comodities) devem ser comprados em
DVP3320
Instruções Mecânicas e Desmontagem
Instruções de Desmontagem
O guia a seguir mostra como desmontar o aparelho.
Passo 1: Remova os 5 parafusos da Tampa Superior e retire-a. (Figura 1).
Figura 1
Passo 2: Se for necessário desmonte o Painel Frontal ou o Carregador, a porta Frontal deve ser removida primeiro. (Figura 2)
Nota: Certifique-se de operar gentilmente ou o guia pode ser danificado.
Certifique-se de desmontar a porta frontal cuidadosamente
para não danificar a bandeja e a porta frontal.
Figura 2
DVP3320
3-2
Mechanical and Dismantling Instructions
Instruções
de Desmontagem
Dismantling
Instruction
Detailed information please refer to the model set.
Passo
Se can’t
a bandeja
não
pode way,
ser aberta
normalmente,
podemos
abri-la seguindo
instruções
Step3:
If the3:tray
open in
normal
you can
make it through
the instruction
as belowas(Figure
3). abaixo (Figura 3).
de operar
gentilmente
nãowould
danificar
o guia.
Note:Nota:
MakeCertifique-se
sure to operate
gently otherwise
thepara
guider
be damaged.
Figura 3
Figure 3
Passo
4: Desmontagem
do disconnect
Painel Frontal,
solte os conectores
(XP1),
solte 4assnaps
4 travas
do Painel
Step4:
Dismantling
Front Panel,
the connectors
(XP1), need
release
of Front
PanelFrontal
as 2 travas
do gabinete
então
retire
Painel
aparelho.
and 2e snaps
of bottom
cabinet ,inferior,
then gently
pull
the oPanel
outdofrom
the set.(Figura
(Figure44- -Figura
Figure6)6)
XP7
XP5
XP6
XP8
XP9
FigureFigura
4
4
XP10 XP2
XP1
DVP3320
Figura 5
Passo 5 : Desmontagem do Carregador, solte os 3 conectores (XP7, XP8, XP9 ) conforme a figura abaixo e remova o parafuso que
conecta o carregador e o gabinete frontal. (Figura 5 & 6)
Figura 6
DVP3320
Passo 6: Desmontagem do Painel Principal, primeiro desconecte (XP2), e remova os 4 parafusos. (Figura 7)
Passo 7: Remova os 4 parafusos do Painel Power para desmontá-lo. (Figura 7)
Figura 7
DVP3320
Atualização do Software
B. Lendo a versão do Firmware para confirmar a
Como atualizar o software
1)
A.
atualização
Grave os dados em um disco CD-R ou RW virgem.
1)
Ligue o aparelho e Abra a porta da bandeja.
2)
Pressione as teclas <9><6><6> para checar as
Procedimentos para atualização do software:
1) Ligue o aparelho e insira o CDR de atualização
A versão do software e as outras informações aparecem
na tela do TV como segue:
preparado.
2) O aparelho ligará lendo o disco e aparecerá
Versão BE: DVP33XX_XX.XX
Versão FE: XXXX.XXXXXX
a seguinte tela no TV:
Versão DSP: DSP.XX
Loading
Firmware Upgrade Erase and program.
OK
informações do software.
Código da Região: X
Cancel
Selecione OK para iniciar a atualização.
3) Pressione a tecla <OK> para confirmar, a tela
mostrará :
Firmware Upgrade Programming, Please Wait...
Do not Switch the Player Off !
4) O disco de atualização dairá automaticamente quando
estiver completada a cópia dos arquivos, retire o disco.
5)
Após 1 minuto, a bandeja fechará automaticamente
quando a atualização estiver completa.
Troca do Código da Região
1) Ligue o aparelho e abra a porta da bandeja;
2) Pressione "9" "8" "7" "9" e o número código da
região (0-6) no controle remoto.
Notas: reinicie após os passos acima.
Atenção: O aparelho não deve ser desligado
durante a atualização, pois o Painel Principal
será danificado inteiramente.
10
DVP3320
FLUXOS SOLUÇÃO DE PROBLEMAS
Motor Spindle não funciona
Motor não funciona
Acesse
Cheque o conector FFC
Não
Faça a conexão correta
de 24P no carregador
Sim
Cheque se “RFA5V”
Não
Cheque a alimentação
RFA5V
Não
Cheque/Troque Q4,Q5
tensão (+5V) esta normal
Sim
Cheque se tensão de laser
(2,3V para DVD & 1,9V para CD)
no Coletor de Q4 e Q5
Sim
1.Se tensão no pino 97 do
U2 varia entre 0 e 3.3V
(3.3V para CD e 0V para DVD),
2. Se componentes periféricos estão
corroídos ou mal soldados
Não
Cheque/troque U2.
Sim
Não tem foco
Não
1.
Cheque U2 pino 89, sinais
FOCUS_PWM
2.Se existe sinais F+, F-, T+ e Tnas saídas de U4.
Sim
Cheque/troque o carregador
forma de onda FOCUS_PWN
DVP3320
Não é possível ligar ou desligar
Não é possível ligar ou
desligar
Acesse
Cheque se a alimentação
Não
no painel power esta normal
Repare o painel power
Sim
Cheque se o CON2 no painel
Yes
frontal do XP6 no painel decodificador
Não
Cheque/Faça a conexão correta
esta com bom contato.
Sim
Cheque se XP1 no painel decodificador para XS301 no painel frontal esta com bom contato.
Sim
Não
Faça a conexão correta
11
12
DVP3320
Todas as saídas de tensões do painel power estão 0V ou erradas.
Todas as saídas de tensões
do painel power estão 0V ou
erradas
Sim
Cheque se
Sim
Troque F1
F1 está queimado
Não
Cheque se existe
Não
Troque C1 e C2 se D1, D2, D3, D4
estiverem normal.
300V no C1 ou C2.
Sim
Cheque se sinal do oscilador
Não
Cheque/troque U1.
de 100KHz no Pino 6 do U1
U1(PINO 3 - RC forma de onda)
U1(PINO 8 - Desenho da forma de onda)
Sim
Cheque se +5V e +12V
estão em curto
Sim
Cheque se os componente na tensão do
curto-circuito estão defeituosos ou corroídos.
Não
Cheque se U2 está corroído
DVP3320
Disco não pode ser lido
Disco não pode ser lido
Sim
Cheque a conexão FFC de
Não
Cheque o circuito carregador
24P até o carregador
Sim
Cheque se existe tensão
laser (2,3V para DVD
e 1,9V para CD) no
coletor de Q4 e Q5
1.Cheque se a tensão no pino 97 de
U2 varia entre 0 e 3.3V:
3.3V para CD
0V para DVD
2. Cheque se componentes periféricos estão corroídos ou defeituosos.
Não
Sim
Cheque U2, U4,e componentes periféricos estão
corroídos ou mal soldados
Não
Re-solde ou troque as partes defeituosas
Sim
Cheque se existe sinal RFO
no pino 10 do XP7. (O
sinal normal RFO é uma onda
reticulada limpa)
Não
Cheque U1 e componentes periféricos
Sim
Cheque a conexão
de U2
Sim
Troque U2 ou o carregador
Não
Faça a conexão correta
13
14
DVP3320
Somente disco DVD ou somente disco exceto DVD é reproduzido
Somente disco DVD ou
somente disco exceto DVD é reproduzido
Acesse
Cheque a conexão FFC
de 24 pinos até o carregador
Não
Cheque o circuito carregador
Sim
Cheque a
tensão de saída do laser (2,3V) no
coletor de Q4 e se o pino 87 de U2
está em nível baixo
Não
Cheque a solda em U2 e componentes
periféricos
Sim
Cheque se existe tensão
variavel no pino 88
do U2.
Não
Cheque se solda esta ruim em U2 e
componentes periféricos
Sim
Cheque se os pinos
de U2 e componentes periféricos estão
mau soldados ou defeituosos
Não
Troque as partes defeituosas
Sim
Cheque s e Q4
está em boas condições
Sim
Troque U2 ou o carregador
Não
Faça a conexão correta
DVP3320
Sem display e teclas não funcionam
Sem display e
teclas não funcionam
Sim
Cheque se existe contato
correto entre XS301 e
XP1
Não
Faça a conexão correta
Sim
Cheque a tensão VCC
(+5v) no painel
power e no painel frontal
Não
Troque o painel power
Sim
Cheque se existem os sinais
CS,DATA e CLK no XS301 no
painel frontal
Não
Cheque os pinos 48, 95, 96 do U2
cheque as condições do conector
XP1.
XP1 (PINO 1 CLK)
XP1 (PINO3 DOUT)
Sim
1.Cheque
se solda esta ruim em U600 e pinos
do LED,
2.Cheque se os circuitos conectados em
K301, K302 estão quebrados,
3.Cheque se R303, R301 e R302
estão com circuito aberto.
Sim
Troque U301 ou LED
Não
Faça a conexão correta
15
16
DVP3320
Distorção do áudio e ruído alto
Distorção no áudio
e ruído alto
Sim
Cheque as tensões de alimentação +12V
Não
Cheque se a saída do painel
Power esta normal.
Se anormal, troque painel Power.
Sim
Cheque se os transistores
mute R73, R77
estão normais
Não
Troque R77, R73
Sim
Cheque se os transistores
mute Q8, Q10,Q12
estão normais
Não
Troque Q8, Q10,Q12
Sim
Cheque os fios U5
não estão quebrados ou
abertos
Não
Faça a conexão correta
Sim
Cheque se a alimentação
de U7 ou U8 estão normais
Sim
Troque U7 ou U8
Não
Cheque U7, U8
DVP3320
Cor anormal da imagem
Cor anormal da
imagem
Sim
Cheque se o sinal de saída
Não
de 27MHz está normal
Cheque Y2, R28, C31 e C33
Sim
Cheque se as tensões 3.3V
e 1.8V da alimentação
no painel decodificador
estão normais
Não
Cheque outros circuitos elétricos da
alimentação
Sim
Cheque se o circuito da
rede do filtro de vídeo
esta normal
Não
Faça a conexão correta
Sim
Cheque se o sinal de vídeo nos
pinos 58,60,61,63 de U1 estão
normais
Não
Troque U2
17
18
DVP3320
Recepção remoto está insensível ou falhando.
Recepção do remoto está
insensível ou falhando
Acesse
Cheque se o controle remoto
funciona apropriadamente
Não
Cheque as pilhas
Sim
Cheque se a tensão da
alimentação para o sensor do
remoto está normal
Não
Cheque L2
Sim
Use um osciloscópio para checar
se existe saída da forma de onda do
primeiro pino IR do sensor do remoto
após pressionar um botão
Não
IR600 (pino1-forma de onda do
controle remoto)
Sim
Cheque se existe sinal
IR no pino 49 do U2
Sim
Troque U2
IR forma de onda
Não
Faça a conexão
correta
DVP3320
19
Sem vídeo e sem áudio
Sem vídeo
e sem áudio
Cheque se todas as tensões
do painel power para o painel
decodificador estão normais
Não
Cheque o circuito
carregador
CVBS(ponto R1) forma de onda
Sim
Cheque se o circuito de reset
(CE3, D2 e R21) está normal
(no nível alto para milisegundos, está
constante no 3,3V).
Não
Troque CE3, D6 e R21
Sim
27Mhz forma de onda
Cheque se existe sinal de
saída 27MHz
Oscilador Cristal Y2 e
componentes periféricos
estão defeituosos ou
corroídos
Não
Sim
Cheque se existe sinal de
Cheque se existe
curto-circuito ou solda
ruim em U1,U3
Não
saída 135MHz em R31
SDRAM(R31 PCLK) forma de onda
Não
Sim
Cheque se existe curtocircuito e solda ruim no pino 60
Sim
Reconecte o componente
Não
Cheque U2.
20
ANOTAÇÕES:
DVP3320DVD703
/XX
DVP3320
6-1
DIAGRAMA DE LIGAÇÕES
6-1
A
B
C
D
E
DVP3320(2CH+USB) WIRING DIAGRAM
4
4
XP5
Y
Pb
CVBS
AUDIO
AMP&LPF
24
VIDEO LPF&DRIVE
XP7
24PIN*0.5
1
LOAD+
LOADTROUT
GND
TRIN
2
XP9
5PIN*2.0
5
64M/16M
SDRAM
AM5888S
6
1
MOTER
DRIVER
1
1
SPSP+
LIMIT
GND
SLSL+
6PIN*2.0
XP8
ZR36966XE2/XF2
8M/16M
FLASH
XP1
6PIN*2.0
1
6
+5V
G ND
5
2
4
4PIN*2.0
1
6
XS301 (3-8PIN)
6PIN*2.0
1
USB
LED-
POWER+
POWER-K
XS302
XP601 (4-7PIN)
1
LED+
4PIN*2.0
4
4
SWITCH
XP1
BOARD 4PIN*2.0
CON2
5PIN*2.5
+5V
GND
+12V
5
3
IR
5V
GND
DATA
CS
CLK
MAIN BOARD
MP-1
1
XP11
4PIN*2.0
1
POWER
SUPPLY
1
ASA + SANYO DV38
P2
XP2 5PIN*2.5
DVD LOADER
R
L
P1
DOWN-LOAD
3
COAX
Pr
4
1
1
A
B
C
D
E
21
22
DVP3320
PAINEL FRONTAL - ESQUEMA ELÉTRICO
7-1
7-1
5
4
3
2
1
Front Board Electric Diagram for DVP3320:
VCC
D
U5V
D
R315
)5200$,1%2$5'
5
REM301
5
4
4
VCC
GND
IR
3
2
1
for dvp331x
IR
VCC
GND
DATA
CS
CLK
1
2
3
4
5
6
7
8
9
10
11
C306
0.1u
C315
47p
WAKE_SW
U5V
R320
V CC
0R
100R/NC
+
REM
XS301
1
2
3
4
100 ohm R318
IR
LED+
LEDPOWER_K1
POWER_K
XS302
CON4(2.0)
CE301
47uF
C316
100p
IR
DATA
CS
CLK
U5V
STB_LED
C307
100p
C308
100p
VCC
POWER_K
STB_LED
R303 R304 R305
5VL
CON11(2.0)
LEDC309 C310
0.1uF 0.1uF
R306
4K7
4K7
4K7
R317 33R
51K
U301
ET6202
C
DATA
CLK
CS
R300
R301
R302
100
100
100
R307
R308
10K
10K
R309
R310
100P
C303
0.1u
1K
1K
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
C300 C301 C302
100P 100P
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CE300
+
GRID[1:7]
OSC
DI/O
CLK
STB
KEY1
KEY2
VDD
SEG1/KS1
SEG2/KS2
SEG3/KS3
SEG4/KS4
SEG5/KS5
SEG6/KS6
SEG7/KS7
GND
GRID1
GRID2
GND
GRID3
GRID4
GND
VDD
SEG14/GRID5
SEG13/GRID6
SEG12/GRID7
SEG10/KS10
SEG9/KS9
SEG8/KS8
28
27
26
25
24
23
22
21
20
19
18
17
16
15
GRID1
GRID2
GRID3
GRID4
5VL
GRID7
GRID6
GRID5
LED+
R316 33R
LED1
GRID1
GRID2
GRID3
GRID4
GRID5
GRID6
GRID7
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
1
2
3
4
5
6
7
8
9
10
11
12
13
C
GRID1
GRID2
GRID3
GRID4
GRID5
GRID6
GRID7
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
JDD350501AG
47uF
SEG[1:6]
KEY1
KEY2
K301
B
1N4148
D301
R312
1N4148
D302R311
1K
1K
R313
KS2
1K
K302
open/close
WAKE_SW
POWER_K
B
R314
R319
0R
play/pause
0R/nc
POWER_K1
C304
100p
C305
100p
A
A
5
4
3
2
1
DVP3320
PAINEL SWITCH - ESQUEMA ELÉTRICO 7-2
A
7-2
B
C
D
E
Switch Board Electric Diagram for DVP3320:
1
1
K303
1
2
3
4
2
XP1
CON4(2.0)
POWER
2
LED3
C319
47p
SWITCH
C317
47p
C318
47p
BOARD
3
3
4
4
A
B
C
D
E
23
24
DVP3320
7-3
PAINEL OK - ESQUEMA ELÉTRICO
7-3
1
2
3
4
5
OK Board Electric Diagram for DVP3320:
A
A
R210
12VA
150
CE201
22uF
REF
22K
0.1u
CE200
22uF
R203
22K
C205
47p
R205
180K
B
C210
20K
2.2uF
R200
10K
2
3
C203
U5A
100K
1
2.2uF/NC
NJM4558 OPA
CE202
1000p
REF
C211
12VA
8
R201
C208
100p
10uF
C204
100p
C
5
+
6
-
NJM4558 OPA
MIC_OUT
7
4
1
2
3
4
R211
8
KARAOKE
ĭ3.5mm
47-EAR024-XX0
P601
KARAOKE INPUT
C201
+
B
R202
12VA
-
12V
U5B
C
R206
R207
100K
20K
C206
47p
C209
2.2uF
R208
MIC_OUT
MIC
12V
1K
D
R209
1
2
3
D
3PIN/2.0mm
XP601
750R
E
E
1
2
3
4
5
DVP3320
7-4
PAINEL POWER - ESQUEMA ELÉTRICO
7-4
A
B
C
D
E
Power Board Electric Diagram for DVP3320:
1
1
F1
T2AL/250ac
TR1
NTC 10&20
D1
1N4007
2
1
P3
D2
1N4007
+
1
RV1
10K471
AC INPUT
D3
1N4007
1
1
+
+
2
+
L1
CON1
AC INPUT
+ C1
D4
1N4007
680uH
+ C2
10uF/400V(250V/450V)
P2
15uF/400V(250V/450V)
L6
⺕⦴
T1
5
C5
152/1KV
2
R2
R3
1/4W120K 1/4W120K
EEL19
4
D5
FR102
6
D8
IN4007
EN/UV
S
CON2
6
5
4
3
2
1
R4
C6
47uF/25V
1/6W10k
D10
R1
NU
2
SR360/SR340
C14
NU
L2
6.8uH
+
C7
1000uF/16V
+
C8
470uF/16V
R5
1/6W12K 1%
R10
1/6W100
R13
-22V
GND
+12V
GND
+5V
+5V
6X2.5 HEADER
10
1/6W22
4
1
1/6W100k
8
S
S
7
S
11
1
2
BP/M
3
4
Drain
NC
6
10uF/50V
8
1
12
5
+
D7
FR102
9
R11
U1
TNY176/177
C3
7
3
C9
104/50V
+
AC INPUT
C N1
R8
1/6W1k
C11
0.1uF/63V
R9
1/6W10k
3
2
3
U2
PC123X92
1
R7
1/6W11.3k 1%
2
U3
TL431
3
3
CY1
102/400Vac
* CAUTION :
THE PARTS MARKED WITH
ARE IMPORTANT PARTS ON THE SAFETY.
PLEASE USE THE PARTS HAVING THE DESIGNATED PARTS NUMBER WITHOUT FAIL.
4
4
A
B
C
D
E
25
26
DVP3320
7-5
7-5
PAINEL PRINCIPAL - ESQUEMA ELÉTRICO - POWER
A
B
C
D
E
R1
CE1
CVBS_C
CVBS_C
L1
C1
150pF
R2
4.7K
1
CLK
CS
DAT
GND
LED_5V
IR
0R
RCA_CVBS_OUT
+
DSPVCC33
Main Board Electric Diagram for DVP3320: Power
0R
220uF/16V
C2
100pF
1
XP1
6PIN/2.0mm
R90
R91
R86
1
2
3
4
5
6
100R
100R
100R
FPC_CLK
FPC_STB
FPC_DOUT
L2
R3
500
33R
FPC_CLK
FPC_STB
FPC_DOUT
M5V
IRRCV
Imax 60mA
Y_R_V
Y_R_V
L3
0R
V_OUT
C3
150pF
C4
150pF
C10
100p
C5
C6
C8
C7
0.1uF 100pF 100pF 100pF
CVBS_G_Y
CVBS_G_Y
L4
0R
Y_OUT
C11
150pF
2
C12
150pF
2
M5V
RFA5V
RFA5V
Imax=17mA
C13
10nF
TO POWER BOARD
XP2
1
2
3
4
5
5PIN/2.5mm
Imax 800mA
+P12V
U_OUT
C16
0.1uF
0R
U_OUT
C15
150pF
U11
V_OUT
M5V
20mA
L6
C14
150pF
6
2
5
3
4
[NM]
P1
RCA/AUDIO OUT
1
2
3
4
5
6
+12V
LED/PCON
4.7K
Q2
BT3904
1
C18
47pF
LED/PCON:
L: STBY.
H:
Working.
4
A
3
2
1
2
1
D12
PESD5V0S(L)1BA
R7
PCON
D11
PESD5V0S(L)1BA
4.7K
2
C88
0.1uF
D10
PESD5V0S(L)1BA
R13
4.7K
2
R6
PESD5V0S(L)1BA
D9
1
8550D
DSPVCC33
Y_OUT
RCA_CVBS_OUT
Y_OUT
U_OUT
V_OUT
Q3
R12
22K
RCA_CVBS_OUT
PESD3V3L5UY
R9
C17
0.1uF
1
RCA
47-RCA151-XX1
3
C_B_U
C_B_U
4
B
C
D
E
DVP3320
PAINEL PRINCIPAL - ESQUEMA ELÉTRICO
7-6- VADDIS_SDRAM_FLASH
7-6
B
C
RESET Circuit
CE19
10uF/16v
CEL5-5
Close to Vaddis!
FOCUS_PWM
TRACK_PWM
8
7
6
5
R19
C82
NC
0.1U
U2A
R22
4.7K
F1
MBRX120
2USB5V
[FUSE(500MA)]
S FCS
MUTE_CTL
SFCS_0
SFDO
SF DI
SFDO_0
SFDI_0
SFCLK R85
XP11
USB_DP
USB_DN
4
3
2
1
USB5V
4PIN/2.0mm
R106
C90
C91
15K/NC 0.1U
PCON
27R/NC
R105
27R/NC
C92
15K/NC
0.1U
C27
0.1U
VDDPLL
R18
9MA
4.7
DSPVCC18
C29
0.1U
33R
SFCLK_0
RAMADD4
RAMADD3
RAMADD5
RAMADD2
RAMADD6
RAMADD1
RAMADD7
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
Gen_4/VID7
SFCS
GND
SFDO/RS_SF
SFDI/RS128_Bootsel2
VDDC
VDDP
SFCLK/RS128_Bootsel1
GPIO[5]
SD_D/IGPIO[7]
PWM5
SD_CMD/GPIO[6]
SD_CLK/IGPIO[7]
VDDP
DP
DN
RAMADD[4]
RAMADD[3]
RAMADD[5]
VDDIP
RAMADD[2]
RAMADD[6]
RAMADD[1]
RAMADD[7]
VDDC
GND
RSET
DAC1
VDDDAC
DAC2
DAC3
VDDDAC
DAC4
GNDC
XIN
XO
VDDPLL
GNDPLL
RESET#
VDDC
VDDP
IGPIO[44]
GPIO[43]/DUPRD0/TDO/SSCTXD
GND
GPIO[32]/SPDIFO
VDDP
GPIO[29]/AMCLK/APWM0GPIO[28]/APWM1GPIO[26]/APWM2GPIO[25]/AOUT2/APWM3GPIO[24]/DUPRD1/ALRCLK/APWM4IGPIO[23]/DUPTD1/ABCLK/APWM5-
Vaddis-966XE/XF
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
R23
392 Ohm 1%
Close to
Vaddis
VDD DAC
2
C_B_U
C_B_U
Y_R_V
CVBS_C
VDD DAC
OSCIN
OSCOUT
VDDPLL
Y_R_V
CVBS_C
CVBS_G_Y
CVBS_G_Y
RESET#
OSCOUT
IR RCV
DU PRD0/FPC_DOUT
S/PDIF_OUT
S/PDIF_OUT
GP-0
GP-1
R30
100
C31
33pF
IR RCV
FPC_DOUT
APWM_LAPWM_R-
VDDAPWM
C32
0.1uF
Crystal
Y2
27.000MHz
R28
220K
GP-4
GP-5
OSCIN
C33
33pF
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
0.1U
R104
R107
C26
10nF
RAMADD[0]
RAMADD[8]
RAMADD[10]
VDDP
RAMADD[9]
RAMADD[11]/GPO[64]
RAMCS0#
RAMBA
RAMCS1#/GPO[65]
RAMRAS#
RAMCAS#
VDDP
RAMWE#
RAMDQM
GNDPCLK
PCLK
VDDPCLK
RAMDAT[8]
RAMDAT[7]
RAMDAT[9]
RAMDAT[6]
RAMDAT[10]
RAMDAT[5]
RAMDAT[11]
RAMDAT[4]
RAMDAT[12]
RAMDAT[3]
VDDIP
RAMDAT[13]
RAMDAT[2]
VDDC
RAMDAT[14]
RAMDAT[1]
RAMDAT[15]
RAMDAT[0]
VDDP
GNDAPWM
VDDAPWM
MUTE_CTL
M5V
DSPVCC33
500
C9
DSPVCC33
D1
1
165MA
L8
VDD DAC
DSPVCC18
DSPVCC33I
4.7K
SFCLK
SFDO
SPI FLASH-SOP8
Atmel: AT26DF081A
2
RF
1%
1%
1%
1%
4.7K
/CS
VDD
SO /HOLD
/WP
SCK
GND
SI
RF
C24
33pF
75R
75R
75R
75R
1
2
3
4
1nF
1
C21
0.1U
R24
R25
R26
R27
R20
DSPVCC33
U1
S FCS
SF DI
C28
1nF
1nF
C23
DSPVCC33
500
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
DSPVCC33
CD_DVD
CLOSE
HOMESW
CD_DVD
VDDAFE
FPC_CLK
LD_DVD
LD_CD
MD_DVD
MD_CD
1K
FOCUS_PWM
LD_DVD
LD _CD
MD_DVD
MD_CD
R17
SLED_PWM
SPDL_PWM
TRACK_PWM
FPC_STB
VDDPWM
1K
C22
VDDAFE
C20
10nF
Gen_5/GPIO[0]
Gen_6
VDDP
Gen_7
Gen_8
Gen_9
Gen_11
Gen_12/VID0
VDDC
GPIO[52]/PWMCO[3]/HSYNC
GPIO[51]/PWMCO[2]/FIELD
GPIO[50]/PWMCO[1]/VCLKx2
VDDPWM
GPIO[49]/PWMCO[0]
DVD_LD
CD_LD
DVD_MD
CD_MD
VDDSAFE
GNDREF
RESOUT
VREF
VC
GND1AFE
VFE_YIN
F
K
E
J
D
C
VDDAFE
B
A
VDD1AFE
RFN
RFP
GNDDACBS2
IN_OUT_SW
R16
OPEN
DRVSB
CD_DVD_1
FPC_STB
FPC_STB
DUPTD0/FPC_CLK FPC_CLK
SPDL_PWM
SLED_PWM
INSW
DSPVCC33
120MA
L7
C89
1uF
RFN
R FP
+
4.7
+ CE2
100U/16V
RF_B
RF_A
2N3904
R F_B
R F_A
2N3904
R14
RESET#
Q14
R102
4.7k
1
R100 1k
1MA
VDDPWM
VDDAFE
Q13
Important power supply!
C19
10nF
VDDAFE
R101 3.3k
E
D8
1N4148
R99
22k
VFE_YIN
R F_F
SPDL_SENS+
RF_E
SPDL_SENSR F_D
R F_C
R98
3.3k
VFE_YIN
R F_F
SPDL_SENS+
R F_E
SPDL_SENSR F_D
R F_C
R97
15k
15.4K 1%
0.1uF
INSW
DRVSB
IN_OUT_SW
CLOSE
OPEN
HOMESW
VC
INSW
DRVSB
IN_OUT_SW
CLOSE
OPEN
HOMESW
D
Main Board Electric Diagram: Vaddis_SDRAM_Flash
URST#
R15
C25
DSPVCC33I
RESOUT
V REF
VC
A
C39
0.1U
C40
0.1U
C43
0.1U
DSPVCC33
RAMDAT14
RAMDAT1
RAMDAT15
RAMDAT0
RAMDAT13
RAMDAT2
RAMDAT8
RAMDAT7
RAMDAT9
RAMDAT6
RAMDAT10
RAMDAT5
RAMDAT11
RAMDAT4
RAMDAT12
RAMDAT3
RAMADD11
SCHEMATIC1, 3.Vaddis_SDRAM_Flash
RAMADD9
RAMADD8
RAMADD7
RAMADD6
RAMADD5
RAMADD4
RAMDQM
PCLK
RAMCKE
RAMDAT8
RAMDAT10
RAMDAT9
RAMDAT12
RAMDAT11
RAMDAT14
RAMDAT13
IPCLK
RAMRASRAMCAS-
RAMWERAMDQM
10R
XXmA
DUPTD0/FPC_CLK
DU PRD0/FPC_DOUT
CE4
470uF/6.3V
(165.10, 185.42)
GP-4
GP-5
DU PRD0/FPC_DOUT
DUPTD0/FPC_CLK
XP5
4PIN/2.0mm
1
2
3
4
DUPTD0
DUPRD0
Download & debug
APWM_LAPWM_R-
Down load
Close to pin 38
DSPVCC33
GP-5
GP-4
‫ݐ‬ᆍ64Msdram ᴧ
VSYNC_VGA
HSYNC_VGA
XP6
4PIN/2.0mm
1
2
3
4
Hyper Terminal
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
VSS
NC
DQMH
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
VSS
DUPTD1
DUPRD1
2ch internal Audio output
VGA support
internal KOK support
GP-0
GP-1
AMCLK
AOUT0
GP-4
GP-5
ALRCLK
ABCLK
External 2ch Audio DAC amd ADC
4
RAMCKE
A
B
R33
10K
RAMDQM
RAMWERAMCASRAMRASRAMCS1RAMBA
RAMCS0RAMADD10
RAMADD0
RAMADD1
RAMADD2
RAMADD3
RAMDAT7
RAMDAT5
RAMDAT6
RAMDAT3
RAMDAT4
C49
0.1U
RAMDAT1
RAMDAT2
C48
0.1U
RAMDAT0
C47
0.1U
RAMDAT1
RAMDAT0
C46
0.1U
RAMDAT3
RAMDAT2
C45
0.1U
RAMDAT5
RAMDAT4
C84
0.1U
RAMDAT7
RAMDAT6
C83
0.1U
RAMADD3
RAMADD2
RAMADD1
RAMADD0
RAMADD10
RAMBA
RAMCS0RAMRASRAMCASRAMWERAMDQM
DSPVCC33
DSPVCC33I
3
DUPRD1
DUPTD1
DUPRD0
DUPTD0
[64Mbit:K4S641632H-UC70]
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
4
+
NM
U10
16Mbit: K4S161622C-TC/L70
C44
0.1U
R32
DSPVCC33
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
VDD
DQML
WE#
CAS#
RAS#
CS#
BA0
BA1
A10
A0
A1
A2
A3
VDD
C42
0.1U
DSPVCC33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
C41
0.1U
VDD
A3
A2
A1
A0
A10/AP
BA
CS
RAS
CAS
WE
LDQM
VDDQ
DQ7
DQ6
VSSQ
DQ5
DQ4
VDDQ
DQ3
DQ2
VSSQ
DQ1
DQ0
VDD
SDRAM3V3
U3
VSS
A4
A5
A6
A7
A8
A9
NC
CKE
CLK
UDQM
NC
VDDQ
DQ8
DQ9
VSSQ
DQ10
DQ11
VDDQ
DQ12
DQ13
VSSQ
DQ14
DQ15
VSS
L10
500
C35
0.1uF
Net has fewer than two connections N21830557:
RAMDAT15
RAMDAT12
RAMDAT13
RAMDAT10
RAMDAT11
SDRAM3V3
VDDAPWM
3.30V
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
C38
0.1U
WARNING [DRC0006]
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
C37
0.1U
DSPVCC18
RAMDAT8
RAMDAT9
DSPVCC18
RAMCKE
PCLK
RAMDQM
Down load
RAMADD4
RAMADD5
RAMADD6
RAMADD7
RAMADD8
RAMADD9
Close to
Vaddis
RAMCS1-
down load
C34
5P
SFCLK
C36
0.1U
RAMADD11
PCLK
RAMCS0RAMBA
HYPER
1
.
TP1
RAMADD9
R31
56R
SF DI
RAMDAT14
RAMDAT15
R29
1K
[NM]
RAMADD0
RAMADD8
RAMADD10
IPCLK
DSPVCC33
3
SDRAM3V3
C
D
E
27
28
DVP3320
PAINEL PRINCIPAL - ESQUEMA ELÉTRICO -7-7
FE_REGULADOR
A
7-7
B
C
D
E
Main Board Electric Diagram for DVP3320: FE_Regulator
EMC
Close to CN201
C50
NM
[470pF]
R34
4.7R
C51
NM
[470pF]
1
+ CE5
220uF/16V
Q4
9012
R36
220R
LD_DVD
DSPVCC33
CN201 is used for Sanyo/Samsung/Sony OPUs
R38
4.7R
25
26
XP7
SMD0.5 TOP
TOP
C52
1nF
C53
1nF
R42
220R
R43
OPU_HFM
LD_CD
OPU
HOP1200W
Arima681
Others
R202=300R, for HOP1200W only
0R [300R]
C54
1nF
L11
R44
Others
4.7R
4.7R
10uH
33R
+
R270
100R
100R
NM
2.1V
RFA5V
U4
VC
R45
3.3K
PDIC Control:
DVD=LOW
CD=HIGH
CD_DVD
R F_D
R F_C
TACTTACT+
FACT+
FACT-
R39
100R
[NM]
R283
100R
100R
NM
VR _CD
MD_CD
BAT54C
2K
SPDL_SENS+
SPDL_SENS+
MUTE
2
TR_B1
BIAS
27
REGO2
3
REGO2
VINTK
26
4
VINSL
TR_B2
25
5
REGO1
NC
24
6
FWD
VINLD
23
7
REV
GND
22
30
SLED_S
+ CE8
47uF/16V
AM5888S(HSOP-28)
28
29
GND
GND
8
VCC1
VCTL
21
M5V
R46
1K
SPDL_S
2
M5V
9
LOAD+
VOTR-
NC
20
10
VOTR+
VCC2
19
SL_MOT- 11
VOSL+
VOLD-
18
SP_M-
SL_MOT+
SL_MOTHOMESW
SL_MOT+12
VOSL-
VOLD+
17
SP_MOT+
FACT-
13
VOFC-
VOTK-
16
TACT-
SP_MOT+
SP_MOT-
FACT+
14
VOTK+
15
TACT+
VOFC+
C55
100pF
TR_B2
LOAD-
C58
0.1uF
DRVSB
VC2
TRACK_S
FOCUS_S
TRACK_S
Close to Vaddis!
SPDL_S
SLED_S
R47
R48
51K [27K]
51K [27K]
R49
R50
22K [22K]
51K [33K]
C59
C60
C61
C62
1nF
1nF
27nF
27nF
FOCUS_PWM
TRACK_PWM
SPDL_PWM
SLED_PWM
DSPVCC33
2.2 OHM 2W
R52
4.7K
HOMESW
IN_OUT_SW
INSW
3
Imax=600mA
Õǂ?540mA
R51
LOADLOAD+
C63
NM
[1nF]
C64
NM
[1nF]
Imax=300mA
Õǂ?I=290mA
HOMESW
IN_OUT_SW
INSW
5.6 OHM 1W
R53
Imax=300mA
Õǂ?250mA
C65
NM
[1nF]
DSPVCC18
DSPVCC33
TR_B1
TR_B2
Q6
SS8550D
C66
0.1uF
REGO1
SS8550D
+
20k/1%
CE10
220uF/16v
REGO2
R59
DSPVCC33
b
Q7
R56
3
Close to motor driver.
e
1
2
3
4
5
R41
SP_MOT-
R40
100R
[NM]
R54
1K 1%
c
LOADLOAD+
OUTSW
GND
INSW
3
1
M5V
XP9
5PIN/2.0mm
DSPVCC33
VR_DVD
TR_B1
OPEN
6
5
4
3
2
1
SPDL_SENS-
1
2
MD_DVD
VINFC
CD_DVD
CE9
100uF/16V
SLEDSLED+
HOMESW
GND
SP+
SP-
SPDL_SENS-
R37
1R 0603-R
1
CLOSE
XP8
6PIN/2.0mm
2K
D5
FOCUS_S
REGO1
C57
0.1uF
R35
SP_M-
CE7
100uF/16V
RF_E
R F_F
RF_B
RF_A
RF
C56
0.1uF
BEMF
Current Type(Default)
R40
100R
0
100R
10R
0
91R
0
NM
0
91R
NM
RFA5V
C DLD
VR_DVD
VR _CD
OPU5V
VC1
HD65PS
3.3R
3.3R
+ CE6
220uF/16V
Q5
9012
DV DLD
OPU
R34:
R38:
R39
100R
0
100R
10R
0
91R
0
NM
0
91R
NM
27
28
2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
OPU
Sony310
DL3
IAT510
TOP1100S
SEMCO-SP1
MITSM820W
HD8(DV23)
HOP1200W
HD65/HD62
502W
Arima681
C DLD
DV DLD
DSPVCC33
R57
4.7K/1%
R60
CE11
+
R55
33K
VC2
R58
1K 1%
220uF/16v
C67
0.1uF
GND
10k/1% GND
12k/1%
GND
GND
4
4
A
B
C
D
E
DVP3320
7-8- ÁUDIO ENTRADA/SAÍDA
PAINEL PRINCIPAL - ESQUEMA ELÉTRICO
A
7-8
B
C
D
E
Main Board Electric Diagram for DVP3320: Audio Input Output
M5V
Q8
R63
4.7K
C68
75pF
4
C69
1.2nF
+6VA
OP-
6
OP+
5
C70
0.1uF
Q10
CE14
R71
APWM_R-
39K
R70
82K
R72
4.7K
C71
+6VA
OP-
2
OP+
3
8
MUTE_CTL
R77
4.7K
R65
470
LMAIN_OUT
1
R66
10K
MUTE
R67
470
Q9
3904
75pF
4
C72
1.2nF
R73
4.7K
MUTE_CTL
10uF/16V
9012
+
220U/16V
2
CE13
MUTE
+
R69
3.3K
4.7K
-
R68
U5B
LM4558
7
U5A
LM4558
CE16
1
+12VA
R74
R75
10K
C73
0.1uF
Q12
2N3904
10uF/16V
470
RMAIN_OUT
+
1
82K
+
APWM_LR64
4.7K
R61
8
39K
+
R62
-
9012
MUTE
R76
470
Q11
3904
2
R78
22K
DSPVCC33
+6VA
R96
VFE_YIN
1k
+
VFE_YIN
R103
4.7K/NC
C74
CE20
1uF/NC
10uF/16V
0R
MIC
1
2
3
C75
C77
C76
3300p
100p
0.1uF
XP10
+6VA
+ CE17
100U/16V
+12V
R82
R79
100K
+12VA
R80
+
33K
100R
+12V
CE18
47uF/16V
pitch=2.0mm*3
3
THE OK USE C74 or CE20
R81
+12VA
R108
4.7K/NC
2
BAT54S/NC
1
3
D7
3
DSPVCC33
P2
RCA/AUDIO OUT
C78
COAX_SPDIF
100
R84
1
2
3
4
5
6
LMAIN_OUT
RMAIN_OUT
COAX_SPDIF
0.1uF
100
C80
100pF
C81
100pF
RCA
47-RCA151-XX1
R83
S/PDIF_OUT
C79
100pF
4
4
A
B
C
D
E
29
30
DVP3320
7-9
PAINEL FRONTAL & SWITCH - LAYOUT INFERIOR
Front Board & Switch Board Print-layout (Bottom side):
7-9
DVP3320
PAINEL OK - LAYOUT SUPERIOR E INFERIOR
OK Board Print-layout (Top side):
OK Board Print-layout (Bottom side):
31
32
DVP3320
PAINEL POWER - LAYOUT INFERIOR
Power Board Print-layout (Bottom side):
7-12
7-12
PAINEL PRINCIPAL - LAYOUT SUPERIOR
Main Board Print-layout (Top side):
DVP3320
33
7-13
34
7-13
DVP3320
PAINEL PRINCIPAL - LAYOUT INFERIOR
Main Board Print-layout (Bottom side):
8-1
DVP3320
VISTA EXPLODIDA
Exploded View for DVP3320/55:
12
13
11
10
8
9
7
6
5
4
3
14
15
16
17
2
18
1
21
20
19
It's a general mechanical view for DVP3320/55, pls refer to the model set
for detailed information.
Assy 1 component includes:1.3.4.5.21
35