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Intel® Atom™ Processor E6xx Series Thermal Test Vehicle
Intel® Atom™ Processor E6xx
Series Thermal Test Vehicle
3
3.1
Thermal and Electrical Vehicle Characteristics
This section describes the thermal attributes of the thermal test vehicle (TTV),
electrical connections of the heater and temperature sensors, temperature
measurements, and test vehicle specifications. The thermal test vehicle includes
heaters to simulate component power levels and temperature sensors to monitor the
component temperatures.
3.1.1
Heaters
3.1.1.1 Heater Dimension
Figure 4. Heater Dimension on the Test Chip
Heater Dimension: 9250 x 9250 um >90% die area
M9 width 33 um; Min spacing 13 um
M8
M9 length – approximately 911 um
2 v8 per M8 - 1.4 um x 10 um
M8 width 2.5 um; Pitch 8.41 um
Two V8
M8 length ~9250 um
3.1.1.2 Heater Connectivity and Locations
8
•
Each group of five FH and five FL bumps are shorted together on substrate and
connected to 3 BGA each.
•
5 uvias and PTH is required on each layer for each FH and FL pinouts.
•
For whole die heating connect HTR_FH/MH and HTR_FL/ML. Otherwise, half die
heating.
Thermal Test Board User Guide