Download Transcend 128MB DDR266 ECC Unbuffer Memory
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184PIN DDR266 Unbuffered DIMM 128MB With 16Mx8 CL2.5 TS16MLD72V6D5 Description Placement The TS16MLD72V6D5 is a 16M x 72bits Double Data Rate SDRAM high-density for DDR266. The TS16MLD72V6D5 consists of 9pcs CMOS 16Mx8 bits Double Data Rate SDRAMs in 66 pin TSOP-II 400mil packages and a 2048 bits serial EEPROM on a 184-pin printed circuit board. The TS16MLD72V6D5 is a Dual In-Line Memory Module and is intended for mounting into 184-pin edge connector sockets. Synchronous design allows precise cycle control with the use of system clock. Data I/O transactions are possible A on both edges of DQS. Range of operation frequencies, programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance B memory system applications. C Features • Power supply: VDD: 2.5V ± 0.2V, VDDQ: 2.5V ± 0.2V • Max clock Freq: 133MHZ. • Double-data-rate architecture; two data transfers per D I clock cycle • H G Differential clock inputs (CK and /CK) • DLL aligns DQ and DQS transition with CK transition • Auto and Self Refresh 15.6us refresh interval. • • Data I/O transactions on both edge of data strobe. • Serial Presence Detect (SPD) with serial EEPROM F E Edge aligned data output, center aligned data input. • SSTL-2 compatible inputs and outputs. PCB: 09-1670 • MRS cycle with address key programs. • CAS Latency (Access from column address): 2.5 • Burst Length (2,4,8 ) • Data Sequence (Sequential & Interleave) Transcend Information Inc. 1 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx8 CL2.5 TS16MLD72V6D5 Dimensions Pin Identification Symbol Inches Function Side Millimeters A 133.35±0.20 5.250±0.008 A0~A11, BA0, BA1 Address input B 72.39 2.850 C 6.35 0.250000 DQ0~DQ63, CB0~CB7 DQS0~DQS8 D 2.20 0.0870 E 31.75±0.20 1.250±0.00800 F 19.80 0.779 G 4.00 0.157 H 12.00 0.472 I 1.27±0.10 0.050±0.004 Data strobe input/output CK0, /CK0, CK1, /CK1 Clock Input. CK2, /CK2 (Refer Placement) Transcend Information Inc. Data Input / Output. 2 CKE0 Clock Enable Input. /CS0 Chip Select Input. /RAS Row Address Strobe /CAS Column Address Strobe /WE Write Enable DM0~DM8 Data-in Mask VDD +2.5 Voltage power supply VDDQ +2.5 Voltage Power Supply for DQS VREF Power Supply for Reference VDDSPD SA0~SA2 +2.5 Voltage Serial EEPROM Power Supply Address in EEPROM SCL Serial PD Clock SDA Serial PD Add/Data input/output VSS Ground NC No Connection 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx8 CL2.5 TS16MLD72V6D5 Pinouts: Pin Pin Pin No Name No 01 VREF 47 02 DQ0 48 03 VSS 49 04 DQ1 50 05 DQS0 51 06 DQ2 52 07 VDD 53 08 DQ3 54 09 NC 55 10 NC 56 11 VSS 57 12 DQ8 58 13 DQ9 59 14 DQS1 60 15 VDDQ 61 16 *CK1 62 17 */CK1 63 18 VSS 64 19 DQ10 65 20 DQ11 66 21 CKE0 67 22 VDDQ 68 23 DQ16 69 24 DQ17 70 25 DQS2 71 26 VSS 72 27 A9 73 28 DQ18 74 29 A7 75 30 VDDQ 76 31 DQ19 77 32 A5 78 33 DQ24 79 34 VSS 80 35 DQ25 81 36 DQS3 82 37 A4 83 38 VDD 84 39 DQ26 85 40 DQ27 86 41 A2 87 42 VSS 88 43 A1 89 44 *CB0 90 45 *CB1 91 46 VDD 92 * Please refer Block Diagram Transcend Information Inc. Pin Name *DQS8 A0 *CB2 VSS *CB3 BA1 DQ32 VDDQ DQ33 DQS4 DQ34 VSS BA0 DQ35 DQ40 VDDQ /WE DQ41 /CAS VSS DQS5 DQ42 DQ43 VDD NC DQ48 DQ49 VSS */CK2 *CK2 VDDQ DQS6 DQ50 DQ51 VSS NC DQ56 DQ57 VDD DQS7 DQ58 DQ59 VSS NC SDA SCL Pin No 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 3 Pin Name VSS DQ4 DQ5 VDDQ DM0 DQ6 DQ7 VSS NC NC NC VDDQ DQ12 DQ13 DM1 VDD DQ14 DQ15 *CKE1 VDDQ NC DQ20 *A12 VSS DQ21 A11 DM2 VDD DQ22 A8 DQ23 VSS A6 DQ28 DQ29 VDDQ DM3 A3 DQ30 VSS DQ31 *CB4 *CB5 VDDQ CK0 /CK0 Pin No 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 Pin Name VSS *DM8 A10 *CB6 VDDQ *CB7 VSS DQ36 DQ37 VDD DM4 DQ38 DQ39 VSS DQ44 /RAS DQ45 VDDQ /CS0 */CS1 DM5 VSS DQ46 DQ47 NC VDDQ DQ52 DQ53 NC VDD DM6 DQ54 DQ55 VDDQ NC DQ60 DQ61 VSS DM7 DQ62 DQ63 VDDQ SA0 SA1 SA2 VDDSPD 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx8 CL2.5 TS16MLD72V6D5 Block Diagram A0~A11, BA0,BA1 DQ0~DQ63 A0~A11, BA0,BA1 DQ0~DQ7 A0~A11, BA0,BA1 DQ0~DQ7 A0~A11, BA0,BA1 DQ0~DQ7 A0~A11, BA0,BA1 DQ0~DQ7 A0~A11, BA0,BA1 /RAS /RAS /RAS /RAS /RAS /RAS /CAS /CAS /WE /WE /CS0 /CS CKE0 CKE /CS CKE DM1 DQS1 DM0 DQS0 /WE /CS CKE DM2 DQS2 /CAS /WE /CS CKE /CS CKE SCL Serial EEPROM SCL SDA A0 CKE DM6 DQS6 DM5 DQS5 DQS4 /WE /CAS /WE 16Mx8 DDR SDRAM /CS CKE CK,/CK CK,/CK A0~A11, BA0,BA1 DQ0~DQ7 /RAS CKE DQS /CS /CAS 16Mx8 DDR SDRAM /CS DM8 DQS8 DM /WE /RAS DQS CK,/CK CK,/CK DM4 /CAS A0~A11, BA0,BA1 DQ0~DQ7 DM CKE DM /CS 16Mx8 DDR SDRAM DQS /WE /RAS DM /CAS 16Mx8 DDR SDRAM DQS /RAS A0~A11, BA0,BA1 DQ0~DQ7 /WE 16Mx8 DDR SDRAM CB0~ CB7 DM3 DQS3 CK1,/CK1 CK0,/CK0 CK2,/CK2 A0~A11, BA0,BA1 DQ0~DQ7 /CAS DQ0~DQ7 DM DQS CK,/CK /WE /CAS 16Mx8 DDR SDRAM DM DQS CK,/CK /CAS 16Mx8 DDR SDRAM DM DQS CK,/CK DM DQS CK,/CK DDR SDRAM 16Mx8 DDR SDRAM DM DQS CK,/CK 16Mx8 DM7 DQS7 SDA A1 A2 SA0 SA1 SA2 This technical information is based on industry standard data and tests believed to be reliable. However, Transcend makes no warranties, either expressed or implied, as to its accuracy and assume no liability in connection with the use of this product. Transcend reserves the right to make changes in specifications at any time without prior notice. Transcend Information Inc. 4 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx8 CL2.5 TS16MLD72V6D5 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Unit Voltage on any pin relative to Vss VIN, VOUT -0.5 ~ 3.6 V Voltage on VDD supply to Vss VDD, VDDQ -1.0 ~ 3.6 V Storage temperature TSTG -55~+150 °C Power dissipation PD 13.5 W Short circuit current IOS 50 mA Mean time between failure MTBF 50 year Temperature Humidity Burning THB 85°C/85%, Static Stress °C-% Temperature Cycling Test TC 0°C ~ 125°C Cycling °C Note: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. DC OPERATING CONDITIONS Recommended operating conditions (Voltage referenced to Vss = 0V, TA = 0 to 70°C) Parameter Symbol Min Max Unit Note Supply voltage VDD 2.3 2.7 V I/O Supply voltage VDDQ 2.3 2.7 V I/O Reference voltage VREF VDDQ/2-50mV VDDQ/2+50mV V 1 I/O Termination voltage VTT VREF-0.04 VREF+0.04 V 2 Input logic high voltage VIH (DC) VREF+0.15 VDDQ+0.3 V 4 Input logic low voltage VIL (DC) -0.3 VREF-0.15 V 4 Input Voltage Level, CK and /CK inputs VIN (DC) -0.3 VDDQ+0.3 V Input Differential Voltage, CK and /CK inputs VID (DC) 0.3 VDDQ+0.6 V 3 Input crossing point voltage, CK and /CK inputs VIX (DC) 1.15 1.35 V 5 Input leakage current II -2 2 uA Output leakage current IOZ -5 5 uA Output High Current (Normal strength driver) IOH -16.8 mA VOUT= VTT + 0.84V Output Low Current (Normal strength driver) IOL 16.8 mA VOUT= VTT – 0.84V Output High Current (Half strength driver) IOH -9 mA VOUT= VTT + 0.45V Output High Current (Half strength driver) IOL 9 mA VOUT= VTT - 0.45V Note: 1. Includes ± 25mV margin for DC offset on VREF, and a combined total of ± 50mV margin for all AC noise and DC offset on VREF, bandwidth limited to 20MHz. The DRAM must accommodate DRAM current spikes on VREF and internal DRAM noise coupled. TO VREF, both of which may result in VREF noise. VREF should be de-coupled with an inductance of <=3nH. 2. VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF, and must track variations in the DC level of VREF 3. VID is the magnitude of the difference between the input level on CK and the input level on /CK. 4. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in simulation. The AC and DC input specifications are relative to a VREF envelop that has been bandwidth limited to 200MHZ. 5. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the dc level of the same. Transcend Information Inc. 5 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx8 CL2.5 TS16MLD72V6D5 DC CHARACTERISTICS (Recommended operating condition unless otherwise noted, VDD=2.7V, TA = 10 °C) Parameter Symbol Max. Unit Note Operating current - One bank Active-Precharge; tRC=tRCmin; tCK=133MHZ for DDR266 IDD0 855 mA DQ, DM and DQS inputs changing twice per clock cycle; Address and control inputs changing once per clock cycle Operating current - One bank operation; One bank open, Burst=4; Reads IDD1 1080 mA - Refer to the following page for detailed test condition. Percharge power-down standby current; All banks idle; power –down mode; IDD2P 27 mA CKE = <VIL(max); tCK=133MHZ for DDR266, VIN = VREF for DQ,DQS and DM Precharge Floating standby current; CS# > =VIH(min);All banks idle; IDD2F 198 mA CKE > = VIH(min); tCK=133MHZ for DDR266, Address and other control inputs changing once per clock cycle; VIN = VREF for DQ,DQS and DM Precharge Quiet Standby current; CS#>=VIH(min); All banks idle; IDD2Q 135 mA CKE>=VIH(min); tCK=133MHZ for DDR266; Address and other control inputs stable with keeping >=VIH(min) or =< VIL(max); VIN=VREF for DQ,DQS and DM Active power - down standby current; one bank active; power-down mode; IDD3P 315 mA CKE<= VIL (max); tCK=133MHZ for DDR266; VIN = VREF for DQ,DQS and DM Active standby current; CS# >= VIH (min); CKE>=VIH (min); one bank active; active - precharge; tRC=tRASmax; tCK=133MHZ for DDR266; IDD3N 495 mA DQ, DQS and DM inputs changing twice per clock cycle; Address and other control inputs changing once per clock cycle Operating current - burst read; Burst length = 2; reads; continuous burst; IDD4R 1278 mA One bank active; address and control inputs changing once per clock cycle; 50% of data changing at every burst; lout = 0 mA Operating current - burst write; Burst length = 2; writes; continuous burst; One bank active address and control inputs changing once per clock cycle; IDD4W 1170 mA CL=2.5 at tCK=133MHZ for DDR266; DQ, DM and DQS inputs changing twice per clock cycle, 50% of input data changing at every burst Auto refresh current; tRC = tRFC(min), IDD5 1620 mA 10*tCK for DDR266at 133Mhz; distributed refresh Self refresh current; CKE <= 0.2V; External clock should be on; IDD6 18 mA tCK=133MHZ for DDR266; Operating current - Four bank operation; Four bank interleaving with BL=4 IDD7 2700 mA -Refer to the following page for detailed test condition Note: 1. Module IDD was calculated on the basis of component IDD and can be differently measured according to DQ loading capacitor. Transcend Information Inc. 6 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx8 CL2.5 TS16MLD72V6D5 AC OPERATING CONDITIONS Parameter Input High (Logic 1) Voltage, DQ, DQS and DM signals Input Low (Logic 0) Voltage, DQ, DQS and DM signals Input Differential Voltage, CK and /CK inputs Input Crossing Point Voltage, CK and /CK inputs Symbol VIH(AC) VIL(AC) VID(AC) VIX(AC) Min VREF + 0.31 0.7 0.5*VDDQ - 0.2 Max Unit Note VREF - 0.31 VDDQ + 0.6 0.5*VDDQ + 0.2 V V V V 3 3 1 2 Note: 1. VID is the magnitude of the difference between the input level on CK and the input on /CK. 2. The value of VIX is expected to equal 0.5*V DDQ of the transmitting device and must track variations in the DC level of the same. 3. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in simulation. The AC and DC input specifications are relative to a VREF envelope that has been bandwidth limited 20MHz. AC OPERATING TEST CONDITIONS (VDD=2.5, VDDQ=2.5, TA=0 to 70°C) Parameter Input reference voltage for Clock Input signal maximum peak swing Input Levels(VIH/VIL) Input timing measurement reference level Output timing measurement reference level Output load condition Value 0.5*VDDQ 1.5 VREF+0.31/VREF-0.31 VREF VTT See Load Circuit Unit V V V V V Note VTT=0.5*VDDQ RT=50ohm Output ZO=50ohm VREF =0.5*VDDQ CLOAD=30pF Output Load circuit Input/Output CAPACITANCE (VDD = 2.5V, VDDQ = 2.5V,TA = 25°C, f = 1MHz) Parameter Input capacitance (A0~A11, BA0~BA1, /RAS, /CAS, /WE) Input capacitance (CKE0) Input capacitance (/CS0) Input capacitance (CK0 ~ CK2) Input capacitance (DM0~DM8) Data and DQS input/output capacitance (DQ0~DQ63) Data input/output capacitance (CB0~CB7) Transcend Information Inc. Symbol CIN1 CIN2 CIN3 CIN4 CIN5 COUT1 COUT1 7 Min 51 44 44 21 6 6 6 Max 60 53 53 26 8 8 8 Unit pF pF pF pF pF pF pF 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx8 CL2.5 TS16MLD72V6D5 AC Timing Parameters & Specifications (These AC characteristics were tested on the Component) Parameter Symbol Row cycle time tRC Refresh row cycle time tRFC Row active time tRAS /RAS to /CAS delay tRCD Row active to Row active delay tRP Row active to Row active delay tRRD Write recovery time tWR Last data in to Read command tWTR Col. Address to Col. Address delay tCCD Clock cycle time tCK Clock high level width tCH Clock low level width tCL DQS-out access time from CK /CK tDQSCK Output data access time from CK /CK tAC Data strobe edge to output data edge tDQSQ Read Preamble tRPRE Read Postamble tRPST CK to valid DQS-in tDQSS DQS-in setup time tWPRES DQS-in hold time tWPREH DQS falling edge to CK rising-setup time tDSS DQS falling edge from CK rising-hold time tDSH DQS-in high level width tDQSH DQS-in low level width tDQSL DQS-in cycle time tDSC Address and Control input setup time tIS Address and Control input hold time tIH Data-out high-impedance time from CK, /CK tHZ Data-out low-impedance time from CK, /CK tLZ Mode register set cycle time tMRD DQ & DM setup time to DQS tDS DQ & DM hold time to DQS tDH DQ & DM input pulse width tDIPW Power down exit time tPDEX Exit self refresh to non-Read command tXSNR Exit self refresh to read command tXSRD Refresh interval time tREF Clock half period tHP Min 65 75 45 20 20 15 15 1 1 7.5 0.45 0.45 -0.75 -0.75 0.9 0.4 0.75 0 0.25 0.2 0.2 0.35 0.35 0.9 1.0 1.0 -0.75 -0.75 15 0.5 0.5 1.75 7.5 75 200 15.6 tCLmin or tCHmin Max 120K 12 0.55 0.55 0.75 0.75 0.5 1.1 0.6 1.25 1.1 0.75 0.75 Unit ns ns ns ns ns ns ns tCK tCK ns tCK tCK ns ns ns tCK tCK tCK ns tCK tCK tCK tCK tCK tCK ns ns ns ns ns ns ns ns ns ns tCK us Note 2 1 ns Data hold skew factor tQHS 0.75 ns DQS write postamble time tWPST 0.4 0.6 tCK 3 Note: 1. Maximum burst refresh of 8 2. The specific requirement is that DQS be valid (High or Low) on or before this CK edge. The case shown (DQS going from High_Z to logic Low) applies when no writes were previously in progress on the bus. If a previous write was in progress, DQS could be High at this time, depending on tDQSS. 3. The Maximum limit for this parameter is not a device limit. The device will operate with a great value for this parameter, but system performance (bus turnaround) will degrade accordingly. Transcend Information Inc. 8 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx8 CL2.5 TS16MLD72V6D5 SIMPLIFIED TRUTH TABLE COMMAND Extended Register Mode Register Set Register Mode Register Set Auto Refresh Refresh Self Refresh Entry Exit Bank Active & Row Addr. (V=Valid, X=Don’t Care, H=Logic High, L=Logic Low) CKEn-1 CKEn /CS /RAS /CAS /WE H X L L L L OP CODE 1,2 X L L L L OP CODE 1,2 L L L H X H H H L L H H H H X X X X L L H H V X L H L H V L H H H Column Address Auto Precharge Enable Column Address Auto Precharge Enable Burst Stop Precharge All Banks Entry X X H X H L Active Power Down Exit Entry L H H L Precharge Power Down Mode L H L H L H L H X X X L V V V X X X X H X X X L H H H H X X X L V V V No Operation Command L 7. 8. 9. Column (A0~A9) V Column Address H (A0~A9) X V L X H 4 4 4 4, 6 7 X 5 X H X H H X X X X X 8 9 X L 5. 6. 3 3 Address H L L H 4. H L 3 3 X Exit DM 1. 2. 3. L Note Row Address L H H Bank Selection A0~A9, A11 L Auto Precharge Disable Write & A10/AP X Auto Precharge Disable Read & Note: BA0,1 H H H 9 OP Code: Operand Code. A0 ~ A11 & BA0 ~ BA1: Program keys. (@EMRS/MRS) EMRS/ MRS can be issued only at all banks precharge state. A new command can be issued 2 clock cycles after EMRS or MRS. Auto refresh functions are same as the CBR refresh of DRAM. The automatic precharge without row precharge command is meant by "Auto". Auto/self refresh can be issued only at all banks precharge state. BA0 ~ BA1: Bank select addresses. If both BA0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected. If both BA0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank B is selected. If both BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank C is selected. If both BA0 and BA1 are "High" at read, write, row active and precharge, bank D is selected. If A10/AP is "High" at row precharge, BA0 and BA1 are ignored and all banks are selected. During burst write with auto precharge, new read/write command cannot be issued. Another bank read/write command can be issued after the end of burst. New row active of the associated bank can be issued at tRP after the end of burst. Burst stop command is valid at every burst length. DM sampled at the rising and falling edges of the DQS and Data-in is masked at the both edges (Write DM latency is 0). This combination is not defined for any function, which means "No Operation (NOP)" in DDR SDRAM. Transcend Information Inc. 9 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx8 CL2.5 TS16MLD72V6D5 Serial Presence Detect Specification Serial Presence Detect Byte No. 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 16 17 18 19 20 Function Described # of Bytes Written into Serial Memory Total # of Bytes of S.P.D Memory Fundamental Memory Type # of Row Addresses on this Assembly # of Column Addresses on this Assembly # of Module Rows on this Assembly Data Width of this Assembly Data Width of this Assembly VDDQ and Interface Standard of this Assembly DDR SDRAM Cycle Time at CAS Latency=2.5 DDR SDRAM Access Time from Clock at CL=2.5 DIMM configuration type (non-parity, Parity, ECC) Refresh Rate Type Primary DDR SDRAM Width Error Checking DDR SDRAM Width Min Clock Delay for Back to Back Random Column Address Burst Lengths Supported # of banks on each DDR SDRAM device CAS Latency supported CS Latency WE Latency 21 DDR SDRAM Module Attributes 22 DDR SDRAM Device Attributes : General 15 23 24 25 26 27 28 29 30 31 32 33 34 35 36-61 62 63 DDR SDRAM Cycle Time CL=2.0 DDR SDRAM Access from Clock CL=2.0 DDR SDRAM Cycle Time CL=1.5 DDR SDRAM Access from Clock CL=1.5 Minimum Row Precharge Time (tRP) Minimum Row Active to Row Activate delay (tRRD) Minimum RAS to CAS Delay (tRCD) Minimum active to Precharge time (tRAS) Module ROW density Command/Address Input Setup Time Command/Address Input Hold Time Data Signal Input Setup Time Data Signal Input Hold Time Superset Information SPD Data Revision Code Checksum for Bytes 0-62 Transcend Information Inc. 10 Standard Specification 128bytes 256bytes DDR SDRAM 12 10 1 bank 72bits SSTL 2.5V 7.5ns ±0.75ns ECC 15.625us/Self Refresh X8 X8 Vendor Part 80 08 07 0C 0A 01 48 00 04 75 75 02 80 08 08 tCCD=1CLK 01 2,4,8 4 bank 2, 2.5 0 CLK 1 CLK Registered address & control inputs and on-card DLL +/-0.2V voltage tolerance 10ns ±0.75ns 20ns 15ns 20ns 45ns 128MB 0.9ns 0.9ns 0.5ns 0.5ns - 0E 04 0C 01 02 20 00 A0 75 00 00 50 3C 50 2D 20 90 90 50 50 00 00 AE 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx8 CL2.5 TS16MLD72V6D5 64-71 72 73-90 91-92 93-94 95-98 99-127 128~255 Manufacturers JEDEC ID Manufacturing Location Transcend T 7F, 4F 54 Manufacturers Part Number TS16MLD72V6D5 54 53 31 36 4D 4C 44 37 32 56 36 44 35 20 20 20 20 20 Revision Code Manufacturing Date Assembly Serial Number Manufacturer Specific Data Unused Storage Locations By Manufacturer By Manufacturer Undefined Variable Variable - Transcend Information Inc. 11