Download Intel Xeon 7041
Transcript
Contents 1 Introduction....................................................................................................................... 11 1.1 Terminology......................................................................................................... 12 1.2 Reference Documents......................................................................................... 14 1.3 State of Data ....................................................................................................... 14 2 Electrical Specifications.................................................................................................... 15 2.1 Front Side Bus and GTLREF .............................................................................. 15 2.1.1 Front Side Bus Clock and Processor Clocking....................................... 15 2.1.2 Front Side Bus Clock Select (BSEL[1:0]) ............................................... 16 2.1.3 Phase Lock Loop (PLL) Power and Filter............................................... 17 2.2 Voltage Identification (VID).................................................................................. 17 2.3 Reserved, Unused, and TESTHI Pins.................................................................20 2.4 Mixing Processors ............................................................................................... 20 2.5 Front Side Bus Signal Groups............................................................................. 21 2.6 GTL+ Asynchronous Signals and AGTL + Asynchronous Signals...................... 22 2.7 Test Access Port (TAP) Connection.................................................................... 23 2.8 Absolute Maximum and Minimum Ratings .......................................................... 23 2.9 Processor DC Specifications............................................................................... 24 2.9.1 Flexible Motherboard (FMB) Guidelines................................................. 24 2.9.2 Vcc Overshoot Specification .................................................................. 28 3 Mechanical Specifications ................................................................................................ 33 3.1 Package Mechanical Drawing ............................................................................. 33 3.2 Processor Component Keepout Zones ............................................................... 36 3.3 Package Loading Specifications ......................................................................... 36 3.4 Package Handling Guidelines ............................................................................. 37 3.5 Package Insertion Specifications ........................................................................ 37 3.6 Processor Mass Specifications ........................................................................... 37 3.7 Processor Materials............................................................................................. 37 3.8 Processor Markings............................................................................................. 38 3.9 Processor Pin-Out Coordinates........................................................................... 39 4 Pin Listing......................................................................................................................... 41 4.1 Dual-Core Intel Xeon Processor 7000 Series Pin Assignments.......................... 41 4.1.1 Pin Listing by Pin Name ......................................................................... 41 4.1.2 Pin Listing by Pin Number ...................................................................... 50 5 Signal Definitions.............................................................................................................. 59 5.1 Signal Definitions................................................................................................. 59 6 Thermal Specifications ..................................................................................................... 67 6.1 Package Thermal Specifications ......................................................................... 67 6.1.1 Thermal Specifications ........................................................................... 67 6.1.2 Thermal Metrology ................................................................................. 70 6.2 Processor Thermal Features............................................................................... 70 6.2.1 Thermal Monitor ..................................................................................... 70 Dual-Core Intel® Xeon® Processor 7000 Series Datasheet 3