Download Intel Xeon E5450

Contents
1
Introduction .............................................................................................................. 9
1.1
Terminology ..................................................................................................... 10
1.2
State of Data .................................................................................................... 13
1.3
References ....................................................................................................... 13
2
Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications................ 15
2.1
Front Side Bus and GTLREF ................................................................................ 15
2.2
Power and Ground Lands.................................................................................... 16
2.3
Decoupling Guidelines ........................................................................................ 16
2.3.1 VCC Decoupling...................................................................................... 16
2.3.2 VTT Decoupling ...................................................................................... 16
2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 16
2.4
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]) .................................. 17
2.4.2 PLL Power Supply ................................................................................... 18
2.5
Voltage Identification (VID) ................................................................................ 18
2.6
Reserved, Unused, and Test Signals..................................................................... 21
2.7
Front Side Bus Signal Groups .............................................................................. 22
2.8
CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 24
2.9
Test Access Port (TAP) Connection....................................................................... 24
2.10 Platform Environmental Control Interface (PECI) DC Specifications........................... 24
2.10.1 DC Characteristics .................................................................................. 24
2.10.2 Input Device Hysteresis .......................................................................... 25
2.11 Mixing Processors.............................................................................................. 26
2.12 Absolute Maximum and Minimum Ratings ............................................................. 26
2.13 Processor DC Specifications ................................................................................ 27
2.13.1 Flexible Motherboard Guidelines (FMB) ...................................................... 27
2.13.2 VCC Overshoot Specification .................................................................... 38
2.13.3 Die Voltage Validation ............................................................................. 39
2.14 AGTL+ FSB Specifications................................................................................... 39
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Mechanical Specifications ........................................................................................ 43
3.1
Package Mechanical Drawings ............................................................................. 43
3.2
Processor Component Keepout Zones................................................................... 47
3.3
Package Loading Specifications ........................................................................... 47
3.4
Package Handling Guidelines............................................................................... 48
3.5
Package Insertion Specifications.......................................................................... 48
3.6
Processor Mass Specifications ............................................................................. 48
3.7
Processor Materials............................................................................................ 48
3.8
Processor Markings............................................................................................ 48
3.9
Processor Land Coordinates ................................................................................ 49
4
Land Listing............................................................................................................. 51
4.1
Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments ........................... 51
4.1.1 Land Listing by Land Name ...................................................................... 51
4.1.2 Land Listing by Land Number ................................................................... 61
5
Signal Definitions .................................................................................................... 71
5.1
Signal Definitions .............................................................................................. 71
6
Thermal Specifications ............................................................................................ 79
6.1
Package Thermal Specifications ........................................................................... 79
6.1.1 Thermal Specifications ............................................................................ 79
6.1.2 Thermal Metrology ................................................................................. 90
6.2
Processor Thermal Features ................................................................................ 90
Quad-Core Intel® Xeon® Processor 5400 Series Datasheet
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