Download Dai Telecom Roadrunner Specifications

Transcript
Telit GE864 and GC864
Product Description
80273ST10008A Rev. 3 - 10/02/06
2.12.11
2.12.12
2.12.13
2.12.14
2.12.15
2.12.16
2.12.17
2.12.18
2.13
Call status indication ................................................................................................ 15
Indication of network service availability .................................................................. 16
Automatic answer (Voice, Data or FAX) .................................................................. 16
Supplementary services (SS)................................................................................... 16
Acoustic signaling .................................................................................................... 16
DTMF tones ............................................................................................................. 17
Buzzer output ........................................................................................................... 17
RF Transmission Monitor ......................................................................................... 17
Logic level specifications .................................................................................17
2.13.1
Reset signal................................................................................................................. 18
2.14
RTC Bypass out.................................................................................................19
2.15
VAUX power output...........................................................................................19
2.16
Audio levels specifications...............................................................................20
2.17
Camera compatibility (EASY CAMERA) ..........................................................21
2.18
Converters .........................................................................................................21
2.18.1
2.18.2
2.19
ADC Converter ............................................................................................................ 21
DAC Converter ............................................................................................................ 21
Board to Board interface ..................................................................................23
2.19.1
2.19.2
2.19.3
GE864 balls allocation................................................................................................. 23
GE864 BGA balls layout.............................................................................................. 27
GC864 pins allocation ................................................................................................. 28
NOTE: RESERVED pins must not be connected ..........................................................30
2.20
Mounting the GE864 on your Board ................................................................31
2.20.1
2.20.2
2.20.3
2.20.4
2.20.5
2.20.6
General........................................................................................................................ 31
Module finishing & dimensions.................................................................................... 31
Stencil.......................................................................................................................... 31
PCB pad design .......................................................................................................... 31
Solder paste ................................................................................................................ 33
GE864 Solder reflow ................................................................................................... 33
2.21
Mounting the GC864 on your board.................................................................35
2.22
Packing system .................................................................................................36
2.22.1
2.22.2
2.22.3
3
GE864 orientation on the tray ..................................................................................... 37
GC864 orientation on the tray ..................................................................................... 38
Moisture sensibility ...................................................................................................... 38
EVALUATION KIT......................................................................................................39
3.1
3.1.1
Evaluation Kit description ................................................................................40
Power Supply ................................................................................................................. 40
Reproduction forbidden without DAI Telecom written authorization – All Right reserved – Right of modification reserved
page 4 of 72