Download Dai Telecom Roadrunner Specifications
Transcript
Telit GE864 and GC864 Product Description 80273ST10008A Rev. 3 - 10/02/06 2.12.11 2.12.12 2.12.13 2.12.14 2.12.15 2.12.16 2.12.17 2.12.18 2.13 Call status indication ................................................................................................ 15 Indication of network service availability .................................................................. 16 Automatic answer (Voice, Data or FAX) .................................................................. 16 Supplementary services (SS)................................................................................... 16 Acoustic signaling .................................................................................................... 16 DTMF tones ............................................................................................................. 17 Buzzer output ........................................................................................................... 17 RF Transmission Monitor ......................................................................................... 17 Logic level specifications .................................................................................17 2.13.1 Reset signal................................................................................................................. 18 2.14 RTC Bypass out.................................................................................................19 2.15 VAUX power output...........................................................................................19 2.16 Audio levels specifications...............................................................................20 2.17 Camera compatibility (EASY CAMERA) ..........................................................21 2.18 Converters .........................................................................................................21 2.18.1 2.18.2 2.19 ADC Converter ............................................................................................................ 21 DAC Converter ............................................................................................................ 21 Board to Board interface ..................................................................................23 2.19.1 2.19.2 2.19.3 GE864 balls allocation................................................................................................. 23 GE864 BGA balls layout.............................................................................................. 27 GC864 pins allocation ................................................................................................. 28 NOTE: RESERVED pins must not be connected ..........................................................30 2.20 Mounting the GE864 on your Board ................................................................31 2.20.1 2.20.2 2.20.3 2.20.4 2.20.5 2.20.6 General........................................................................................................................ 31 Module finishing & dimensions.................................................................................... 31 Stencil.......................................................................................................................... 31 PCB pad design .......................................................................................................... 31 Solder paste ................................................................................................................ 33 GE864 Solder reflow ................................................................................................... 33 2.21 Mounting the GC864 on your board.................................................................35 2.22 Packing system .................................................................................................36 2.22.1 2.22.2 2.22.3 3 GE864 orientation on the tray ..................................................................................... 37 GC864 orientation on the tray ..................................................................................... 38 Moisture sensibility ...................................................................................................... 38 EVALUATION KIT......................................................................................................39 3.1 3.1.1 Evaluation Kit description ................................................................................40 Power Supply ................................................................................................................. 40 Reproduction forbidden without DAI Telecom written authorization – All Right reserved – Right of modification reserved page 4 of 72