Download DSP56F803, 56F803 - Data Sheet

S
0.15 (0.006) S AC T-U
Z
S
S
-T-
B
0.15
0.15 (0.006) S AC Z
-Z-
(0.006) S
V
AC Z
S
S
T-U
T-U
S
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -AB- IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED
AT DATUM PLANE -AB-.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -AC-.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT
DATUM PLANE -AB-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014). DAMBAR CAN NOT BE LOCATED
ON THE LOWER RADIUS OR THE FOOT.
MINIMUM SPACE BETWEEN PROTRUSION
AND AN ADJACENT LEAD IS 0.070 (0.003).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
-UA
9
0.15
(0.006) S
AB T-U
S
AE
Z
MILLIMETERS
DIM MIN MAX
A 13.950 14.050
B 13.950 14.050
C 1.400 1.600
D 0.170 0.270
E 1.350 1.450
F 0.170 0.230
G
0.500 BSC
H 0.050 0.150
J
0.090 0.200
K 0.500 0.700
M
12° REF
N 0.090 0.160
Q
1°
5°
R 0.150 0.250
S 15.950 16.050
V 15.950 16.050
W
0.200 REF
X
1.000 REF
S
AD
-AB-AC96X
G
SEATING
PLANE
(24X PER SIDE)
AE
0.100 (0.004) AC
M°
C
R
0.25 (0.010)
E
GAUGE PLANE
D
F
J
N
H
INCHES
MIN MAX
0.549 0.553
0.549 0.553
0.055 0.063
0.007 0.011
0.053 0.057
0.007 0.009
0.020 BSC
0.002 0.006
0.004 0.008
0.020 0.028
12° REF
0.004 0.006
1°
5°
0.006 0.010
0.628 0.632
0.628 0.632
0.008 REF
0.039 REF
Q°
W
K
X
0.20 (0.008) M AC T-U
S
Z
S
SECTION AE-AE
DETAIL AD
Figure 4-2 100-pin LQPF Mechanical Information
56F803 Technical Data, Rev. 16
50
Freescale Semiconductor