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nozzle without effectively heating the component or solder joints. It will also create a
laminar (or horizontal) flow across the circuit board, heating other components that you
don’t want to heat. It will also result in longer removal times, resulting in unnecessary
heating of adjacent component and the circuit board.
Figure 1
Figure 2
Figure 3
Figure 3 shows the correct height relationship of nozzle to component, with
approximately 1/8" to 3/8” gap for airflow escape. 1/8”-3/8”
The same problem of heating adjacent areas occurs when nozzles that are too large or too
small are used.
Figure A below shows a nozzle too large for the component. Adjacent areas are being
heated that should not be, including small chip caps.
Figure B shows a too-small nozzle being used. Only the center of the top of the
component is being effectively heated. Air flows out across the flat surface of the
component, heating adjacent components. The BGA or component being heated does not
achieve a uniform heating across the total area of the component, therefore, heating time
is prolonged because heat must migrate through the component itself at a slower rate to
reach the lead attach area.
Figure C shows the correct nozzle for use with the component.
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