Download Service Manual - 5-1/4 Inch Fixed Media Disk Drive 4171 4120
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MAl Basic Four® 5·1/4 Inch Fixed Media Disk Drive (Machine Types 4171/4120/4326) Service Manual APRIL, 1986 008083·010 M8083A H8083 PAGE STATUS Page No. Effective Date Title Page i/ii April 1986 Page Status iii/iv April 1986 Table of Contents v through viii October 1985 Preface ix April 1986 Section I x through 1-8 April 1986 Section II 2-1 through 2-8 October 1985 Section III 3-1 through 3-29/30 October 1985 Section IV 4-1 through 4-2 October 1985 Section V 5-1 through 5-13/14 October 1985 Section VI 6-1 through 6-7/8 October Section VII 7-1 through 7-11/12 October 1985 iii/iv 985 MBOB3 TABLE OF CONTENTS Page SECTION I INTRODUCTION 1.1 1.1.1.1 1.1.1.2 1.1.1.3 1.1.1.4 1.1.1.5 1.1.2 1.1.3 1.2 General Description • • • • • • • • • • • • • • • • • • Mechanical Assembly . . . . . . . . . . . . . . . . . . . Printed Circuit Board Assembly (PCBA) . . . . . . . . . Head Posi tioning Assembly • • • • • • • • • • • • • Spindle Motor Assembly . . . . . . . . . . . . . . . . Heads and Disks • • • • • • • • • • • • • • • • • • Air Filtration System. • • • • • • • • • • • • • • Read/Write and Control Electronics . . . . . . . . . . Power Supply • • • • • • • • • • • • • • • • • • • • Disk Drive Specifications • • • • • • • • .. • • • • • .. SECTION II INSTALLATION 2.1 2.2 2.3 2.4 2.5 2.6 2.6.1 2.6.2 2.7 2.7.1 2.7.2 2.7.3 2.B.1 2.B.2 2.9 Introduction • • • • • . . .. • • • • . Unpacking Instructions • • .. • • • • • Space Requirements • • • • • • • • • • Mounting • • .. .. • • • • • • • • • • • Power Requirments • • • • • • • • • • • Interconnecting Cable Connections • • • DC Power Connector • • • • • • .. • .. Frame Ground Connector • • .. .. • •.• Connectors • • • • • • • • • • • • • • Interface Connectors •• • • • • • • Control Cable Termination • • • • • • Factory Installed Jumper Settings • • Options • • • • • • • • • • • • .. • • • Drive Address Selection Option • • • Write Protection Option • • • • • • • Ventilation • • • • • • • • • • • • • • SECTION III FUNCTIONAL DESCRIPTION 3.1 3.2 3.2.1 3.2.1.1 3.2.1.2 3.2.2 3.2.2.1 3.2.2.2 3.2.3 3.2.3.1 3.2.3.2 3.2.4 3.2.5 3.3 3.3.1 Introduction •• • • • • • • • Operational Description • • • • Spindle Motor Operation • • • Start Mode • .. • • • • .. • Run Mode • • • • • .. • Servo System Operation • • • Servo Circuitry • • • • • • Servo Pattern • .. • .. • • • Read/Write Channel Operation Write Function •• . • • • Read Func tion • .. .. .. .. .. • Power-Up Sequencing .. • • • • Power Down Operation • • • .. Interface Description • • • • • Control Signal Interface • • 1. 1. 1 2.B .. v • • • • • • • .. • • • • • • • • • • • .. • • • • • • • • • .. • • • • • • . • • .. • .. • . • • • • • • • • • • • • • • • • .. • • .. • • • • .. • • • • • • • • • • .. • • • • • • • • • • • • • • • ••••••• • • • • • • • • • • • • • • .. .. • • • .. • • • • • • • • • • • • .. • • • • • • • • • • ~ • • • • • .. • • • • • 2-1 2-1 2-1 2-2 2-4 2-4 2-5 2-5 2-5 2-5 2-7 2-7 2-7 2-7 2-7 2-7 • • • • • • • • 3-1 3-1 3-1 3-3 3-4 3-4 3-6 3-7 . . • • • • • • • .. 1-1 1-1 1-1 1-1 1-3 1-3 1-4 1-4 1-5 1-5 • • • • • • • • • .. .. • .. .. • • • .. • • • • • • • • • • • • • • • • • • • • • • • • • • • • .. • · • • . . . . . . • . • 3-9 • • • .. .. .. • • • • • • ·• • .. • • • • .. .. • • • • • • • • • • • • .. • • • .. • • • • • .. • • .. • • • • • .. • .. • • • • • • • .. • • • • • • 3-11 3-11 3-14 3-15 3-15 3-16 M8083 TABLE OF CONTENTS Page SECTION III FUNCTIONAL DESCRIPTION (continued) 3.3.1.1 3.3.1.2 3.3.2 3.3.2.1 3.3.2.2 3.3.2.3 3.4 3.4.1 3.4.2 3.4.3 3.4.4 Control Input Signals • • • • • • • • • • • • • •• Control Output Signals • • • • • • • • • • • • • • • Data Interface • • • • • • • • • • • • • • • • • • • General Description • • • • • • • • • • • • • • • • MFM Write Data • • • • • • • • • • • • • • • • • • MFM Read Data • • • • • • • • • • • • • • • • • • • Format Description and Examples • • • • • • • • • • • • ST506/412 Format • • .• • • • • • • • • • • • • • • • Address Marks • • • • • • • • • • • • • • • • • • • • Gap Length Calculation • • • • • • • • • • • • • • • Sector Interleaving • • • • • • • • • • • • • • • • • SECTION IV MAINTENANCE 4.1 4.2 Introduction • • • • • • • • • • • • • • • • • • • • • 4-1 Preventive Maintenance 4-1 SECTION V REMOVAL/REPLACEMENT PROCEDURES 5.1 5.2 5.3 5.4 5.4.1 5.4.2 .5.4.3 5.5 5.6 In troduc tion •• • • • • • • • • • • • • • • • • • • • Disk Drive Removal/Replacement Series 2000 Systems •• Second Disk Drive Installation Series 2000 Systems •• Disk Drive Removal/Replacement Series 7000 Systems. • General Procedures. • • • • • • • • • • • • • • • • • Removal/Replacement of Disk 0 or Disk 1 • • • • • • • Removal/Replacement of Disk 2 or Disk 3 • • • • • • • Disk Drive Installation - Series 7000 Systems • • • • • Removal/Replacement of Disk Drive PCBA • • • • • • • • • 3-19 3-22 3-24 3-24 3-26 3-27 3-27 3-27 3-28 3-29 3-29 . . . . . . . . . . . . . . .i . 5-1 5-1 5-3 5-6 5-6 5-8 5-9 5-11 5-13/14 SECTION VI ILLUSTRATED PARTS LISTS 6.1 6.2 Introduction • • • • • • • • • • • • • • • • • • • • • 6-1 Index of Assemblies • • • • • • • • • • • • • • • • • • 6-1 SECTION VII SCHEMATICS 7.1 Introduction • • • • • • • • • • • • • • • • • • • • • 7-1 vi M8083 LIST OF FIGURES FIGURE 1-1 1-2 1-3 1-4 2-1 2-2 2-3 2-4 2-5 2-6 2-7 3-1 3-2 3-3 3-4 3-5 3-6 3-7 3-8 3-9 3-10 3-11 3-12 3-13 3-14 3-15 3-16 3-17 3-18 3-19 3-20 3-21 3-22 3-23 4-1 5-1 5-2 5-3 5-4 6-1 7-1 PAGE 5-1/4 Inch Fixed Media Disk Drive • • • • • • • • • • • Disk Drive PCBA • • • • • • • • • • • • • • • • • • • • Head Posi tioning Sys tem • • • • • • • • • • • • • • • • Ai r Fi I tra tion Sys tem • • • • • • • • • • • • • •. • • • Disk Drive Mechanical Dimensions • • • • • • • • • • • Disk Drive Mounting Dimensions • • • • • • • • • • • • Motor Start Current Requirements • • • • • • • • • • • DC Power Connector (J3) Pin -Locations and Pin Assignments • • • • • • • • • • • • • • • • • • • • • Connector Jl Dimensions • • • • • •.• • • • • • • • • • Connector J2 Dimensions • • • • • • • • • • • • • • • • Drive Select Jumper Options • • • • • • • • • • • • • • Spindle Motor Control Block Diagram • • • • • • • • • • Spindle Motor Hall Sensors Relationships • • • • • • • Spindle Motor Current Profile • • • • • • • • • • • • • Servo System Block Diagram • • • • • • • • • • • • •• Servo Pattern • • • • • • • • • • • • • • • • • • • • • Read Function Timing Diagram • • • • • • • • • • • • • Read Function Block Diagram • • • • • • • • • • • • • • Write Function Block Diagram • • • • • • • • • • • • • Read/Write Circuits (Pre-Amp) • • • • • • • • • • • • • Power-Up Sequencing • • • • • • • • • • • • • • • • • • Interface Connectors Locations • • • • • • • • • • • • Control Signal Driver/Receiver Combination • • • • • • Jl/Pl Connector Pin Assignments • • • • • • • • • • • • General Step Timing • • • • • • • • • • • • • • • • • • Step Pulse Timing • • • • • • • • • • • • • • • • • • • Index Timing • • • • • • • • • • • • • • • • • • • • • General Timing Requirements • • • • • • • • • • • • • • Data Line Driver/Receiver Combination • • • • • • • • • J2/P2 Connector Pin Assignments • • • • • • • • • • • • MFM Write Data Timing • • • • • • • • • • • • • • • • • MFM Read Data Timing • • • • • • • • • • • • • • • • • ST506/412 Format • • • • • • • • • • • • • • • • • • • "AI" Address Mark Byte • • • • • • • • • • • • • • • • Cleaning the Disk Drive • • • • • • • • • • • • • • • • Disk Drive Removal/Replacement/Installation, Series 2000 Systems • • • • • • • • • • • • • • • • • Removal of Front, Top, and Side Panels, Series 7000 Systems • • • • • • • • • • • • • • • • • Disk Drive Removal/Replacement/Installation, Series 7000 Systems • • • • • • • • • • • • • • • • • MTCS Removal/Replacement. • • • • • • • • • • • • • • • Printed Circuit Board Assembly (P/N 59055) • • • • • • Disk Drive Schematics • • • • • • • • • • • • • • • • • vii x 1-2 1-3 1-5 2-2 2-3 2-4 2-5 2-6 2-6 2-8 3-2 3-2 3-3 3-5 3-8 3-9 3-10 3-12 3-13 3-15 3-16 3-17 3-18 3-20 3-21 3-23 3-24 3-25 3-25 3-26 3-27 3-28 3-28 4-2 5-2 5-7 5-8 5-10 6-2 7-2 M8083 LIST OF TABLES PAGE TABLE 1-1 2-1 3-1 3-2 3-3 6-1 6-2 Specifications, 5-1/4 Inch Fixed Media Disk Drive • • • • DC Power Requirements • • • • • • • • • • • • • • • • • • Control Signals (Daisy Chained) • • • • • • • • • • • • • Seek Performance Vs Step Time • • • • • • • • • • • • • • Data Signals (Radial) • • • • • • • • • • • • • • • • • • Printed Circuit Board Assembly (PiN 59055) • • • • • • • Mechanical Kit (PiN 50461) • • • • • • • • • • • • • • • NOTICE MAl Basic Four® equipment is designed to meet the safety requirements of Underwriters Laboratories (UL), the emission requirements of the Federal Communications Commission (FCC) and Verbandes Deutcher Elektrotechniker (VDE), as well as certain requirements of other safety or regulatory agencies. Compliance with the recommendations and standards of these agencies o~ organizations may require the use of specific interconnecting cables, which have been determined to meet the applicable criteria. Use of cables not meeting these requirements could result in violation of local Building Codes or other regulations, and result in damages. MAl Basic Four, Incorporated, shall have no reponsibility for any results whatsoever that arise from any use of any cables not supplied or installed by MAl Basic Four, Incorporated, or our authorized representative. viii 1-6 2-4 3-19 3-21 3-26 6-3 6-7 M8083 PREFACE This manual contains service information for the 5-1/4 Inch Fixed Media Disk Drive, Machine Types 4171 (71 MB), 4120 (120 MB), and 4326 (127 MB). The information is presented as a field-service aid and supports the installation, operation, and maintenance of the subject Disk Drive. The Disk Drive is used on the MAl Basic Four® Series 2000 and Series 7000 computer systems, and differs only in the formatted storage capacity provided by each system. On Series 2000 systems, the Disk Drive is formatted for 71 MB (Machine Type 4171) or 120 MB (Machine Type 4120); on Series 7000 systems, the Disk Drive is formatted for 127 MB (Machine Type 4326). The major topics covered in this manual are: Section I Introduction Section II Installation Section III Functional Description Section IV Maintenance Section V Removal/Replacement Section VI Illustrated Parts Lists Section VII Schematics WARNING This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions manual, may cause interference to radio communications, as temporarily permitted by regulation. It has not been tested for compliance with the limits for Class A Computing Devices pursuant to Subpart J of Part 15 of FCC rules, which are designed to provide reasonable protection against such interference. Operation of this equipment in a residential area is likely to cause interference, in which case the User at his own expense will be required to take whatever measures that may be required to correct the interference. ix M8D83 Figure 1-1. 5-1/4 Inch Fixed Media Disk Drive x M8083 SECTION I INTRODUCTION 1.1 GENERAL DESCRIPTION The 5-1/4 Inch Fixed Media Disk Drive, used on MAl Basic Four® Series 2000 (Machine Types 4171 and 4120) and Series 7000 computer systems (Machine Types 4326), is a microprocessor controlled servo disk drive system (see figure 1-1). The Machine Type 4171 Disk Drive uses eight data heads, one servo head, and five non-removable 5-1/4 inch disks as storage media. Machine Type 4171 Disk Drive data surfaces employ one moveable head to access 1,024 cylinders for a total of 8,192 tracks. The Machine Types 4120 and 4326 use 15 data heads, one servo head, and eight non-removable 5-1/4 inch disks as storage media. Each data surface employs one moveable head to access 918 cylinders for a total of 13,770 tracks. The disk drive unit consists of the following major components: o Mechanical Assembly o Read/Write and Control Electronics o Power Supply 1.1.1 Mechanical Assembly The disk drive consists of a single printed circuit board, a frame for mounting the drive, and a head disk assembly (HDA). The components· inside the HDA are: disks, spindle motor, head positioning assembly, heads, actuator arm assembly, and air filter. Shock mounts are provided to minimize the transmission of vibration from the frame to the HDA. 1.1.1.1 Printed Circuit Board Assembly (PCBA) The PCBA, figure 1-2, is a multilayer board with the internal planes being primarily used for voltage and ground only. The circuitry contained on the PCBA is used to control the spindle motor, actuator positioning system, actuator latch, and read/write circuitry. 1.1.1.2 Head Arm Assembly The read/write heads are mounted on a head arm assembly which is then mounted to a ball-bearing supported shaft. The voice coil, an integral part of the head arm assembly, lies inside the magnet housing when installed in the drive. See figure 1-3. 1-1 M8083 ,... J Figure 1-2. Disk Drive PCBA 1-2 M8083 READ/WRITE HeADS VOICE COIL MAc!JNIET MA6N£r HOUSJNG Figure 1-3. Head Positioning System Current from the power amplifier, controlled by the servo system, causes a magnetic field in the voice coil which interacts with the field around the permanent magnets. This reaction causes the voice coil to move within the magnetic field. Since the head arms are mounted to the voice coil, the voice coil movement is translated through the pivot point directly to the heads and achieves positioning over the desired cylinder. Actuator movement is controlled by the servo feedback signal from the servo head. The servo head is located on the lower surface of the bottom disk where servo information is prewritten at the factory. This servo information is used as a control signal for the actuator to provide track-crossing signals during on-cylinder seek operation, and timing information such as index and servo clock. 1.1~1.3 Spindle Motor Assembly The spindle drive is a brushless dc drive motor contained within the spindle hub itself. The rotational speed of spindle is 3600 rpm. The motor and spindle are dynamically balanced to insure a low vibration level during operation. Dynamic braking is used to quickly stop the spindle motor when power is removed. 1-3 M8083 1.1.1.4 Reads and Disks The heads utilized in the Disk Drive are composite manganese-zinc ferrite head sliders and flexures. These heads are used to record and read information on the thin film metal disks. The thin film metal disks provide a highly abrasion-resistant surface decreasing the potential for damage caused by shipping shock and vibration. 1.1.1.5 Air Filtration System The disks and read/write heads are assembled in a clean-air environment and then sealed within the RDA. The RDA contains a 0.3 micron absolute filter mounted inside the casting to provide constant internal air filtration. A second 0.3 micron filter, located on the RDA top cover, permits pressure equalization between internal air and ambient air. See figure 1-4. 1.1.2 Read/Write and Control Electronics The read/write and control electronics are packaged on the PCBA. This PCBA, which includes two microprocessors, performs the following functions: • Read/write of data • Index detection • Read positioning • Head selection • Drive selection • Fault detection • Voice coil actuator drive circuitry • Track 0 detection • Recalibration to track 0 on power-up • Track position counter • Power and speed control for spindle drive motor • Braking for the spindle drive motor • Drive up-to-speed indication circuit • Reduced write current on the inner tracks • Monitor write fault conditions • Control of all internal timing • Generation of seek complete signals 1-4 M8083 RECIRCULATING FIJ.:TeR. AIR FLOW PATH Figure 1-4. 1.1.3 Air Filtration System Power Supply The Disk Drive requires only dc power for operation. DC power is supplied from an external power supply with outputs of +12 Vdc (+5%) at 4.5A maximum, and +5 Vdc (+5%) at 1.9A maximum. Typical current drawn from the +12 Vdc source during operation is 1.57A and from the +5 Vdc source is l.7A. DC power is fed to the disk drive via a 4-pin connector on the component side of the PCBA. 1.2 DISK DRIVE SPECIFICATIONS Table 1-1 lists the specifications for the 5-1/4 Inch Fixed Media Disk Drive. 1-5 M8083 Table 1-1. Specifications, 5-1/4 Inch Fixed Media Disk Drive PHYSICAL Height: Width: Depth: Weight: ENVIRONMENTAL (continued) 3.4 5.9 8.2 6.3 in (8.6 em) in (15.0 em) in (20.8 em) lbs (2.9 kg) Non-Operating Shock °G s 2 t (1 /2 sine -11 ID s ) POWER ENVIRONMENTAL DC Voltage Ambient Temperature Operating: 50 to 113 OF (10 to 45°C) Non-Operating: -40 to 140 OF (-40 to 60 °C) Control: +12V +5%, 1.57A Typical, 4.5A Max (at-power on) Logic: +5V +5%, 1.7A Typical, 1.9A Max - Maximum Temperature Gradient Maximum Ripple (Included in Tolerance): +5 = 5OmV, +12 = 120mV Operating: 18 °F/hr (10 °C/hr) Non-Operating: Below Condensation Power Dissipation: 57W, high; 9W, low Relative Humidity (non-condensing) Heat Dissipation: 25W, Typical, 28W Max Operating: 8 to 80% Non-Operating: 8 to 95% GENERAL Capacity (Unformatted) Maximum Elevation Operating: 10,000 ft Non-Operating: -1,000 ft to 40,000 ft Machine Type 4171: Per Drive: Per Surface: Per Track: Vibration Machine Types 4120: Per Drive: 143.55 MB Per Surface: 9.57 MB Per Track: 10.42 KB Operating: 5-25 Hz, 0.006 in P-P 25-500 Hz, 0.25G peak acceleration Operating Shock With retries: 2 GiS (1/2 sine -11 IDS) Without retries: 10 GiS (1/2 sine -11 IDS) 85.32 MB 10.60 MB 10.42 KB Machine Types 4326: Per Drive: 143.55 MB Per Surface: 9.57 MB Per Track: 10.42 KB 1-6 M8083 Table 1-1. Specifications, 5-1/4 Inch Fixed Media Disk Drive (continued) GENERAL (continued) GENERAL (continued) Capacity (Formatted) NOTE Machine Type 4171: (Series 2000 Systems) Per Drive: 71.32 MB Per Surface: 8.40 MB Per Track: 8.20 KB Per Sector: 512 Bytes The disk drive is provided with an error map showing the location of media defects. The defective areas are identified by cylinder number, head number, and bytes from index. Machine Type 4120 (Series 2000 Systems) Per Drive: 119.85 MB Per Surface: 7.99 MB Per Track: 8.20 KB Per Sector: 512 Bytes The disk drive is guaranteed to be error free on cylinder 000. Additionally there will be no more than an average of 10 defects per surface. The maximum number of defects is 128. Machine Type 4326: (Series 7000 Systems) Per Drive: 126.90 MB Per Surface: 8.46 MB Per Track: 8.20 KB Per Sector: 1,024 Bytes No surface shall have more than 20 defects. No track shall have more than 5 defects. Mean Time Between Failures: 8,000 POH, Typical Access Time (Includes Settling Time) Component Design Life: 5 years Rotational Speed: 3,600 rpm Machine Type 4171: Average: 28 msec 4 msec Track-to-Track: Full Stroke: 49 msec Recording Density: 9,875 bits per inch Track Density: 1,000 Machine Types 4120 and 4326: Average: 27 msec Track-to-Track: 4 msec 46 msec Full Stroke: Cylinders (Machine Type 4171): 1,024 Cylinders (Machine Types 4120 and 4326): 918 Error Rates Soft Read: Hard Read*: Seek: Tracks Machine Type 4171: 8,192 Machine Types 4120 and 4326: 13,770 1 per lOll bits read 1 per 1013 bits read 1 per 10 7 seeks *Not Recoverable within 16 retries 1-7 M8083 Table 1-1. Specifications, 5-1/4 Inch Fixed Media Disk Drive (continued) GENERAL (continued) Sectors: 440,640 Data Heads (Machine Type 4171): 8 Data Heads (Machine Types 4120 and 4326): 15 Servo Heads: 1 Disks (Machine Type 4171): 5 Disks (Machine Types 4120 and 4326): 8 DC Power Connector (P3): 4-pin AMP P/NI-480424-0 (using AMP pins PIN 350078-4) (strip) or PIN 61173-4 (loose piece) DC Power Connector (J3, on PCBA): 4-pin AMP MATE-N-LOCK connector PIN 350543-1 Frame Ground Connector (J4): AMP PIN 61761-2 (Faston Type) Frame Ground Connector (J4): AMP PIN 62187-1 (Recommended) 1-8 M8083 SECTION II INSTALLATION 2.1 INTRODUCTION This section contains general procedures/requirements for Disk Drive installation. Specific procedures for removal/replacement and installation of the Disk Drive on the Series 2000 and Series 7000 systems may "be found in section V. NOTE Further information on disk drive installation and configuration may be found in the Series 2000 System Installation Manual, M8086, or in the Series 7000/8000 System Installation Manual, M8089. 2.2 2.3 UNPACKING INSTRUCTIONS 1. Open the shipping container. 2. Carefully remove the top half of the inner foam insert. 3. Remove the drive from the container and remove the conductive plastic covering. Inspect the drive for physical damage. 4. Remove the defect map from the top of the drive. Use the information on the map for defect management. Copy the map and file a copy for use in the event the original is lost or misplaced. 5. The Drive is now ready for operation. locks. 6. After unpacking the drive, store the packing materials for possible future use. There are no external shipping SPACE REQUIREMENTS The Disk Drive is shipped mounted in a frame assembly with a face plate installed. Figure 2-1 shows the external dimensions of the drive. 2-1 M8083 •19 ~ ~ • REF~l'87 J~ REF ~ 3.12 REF~ Figure 2-1. Disk Drive Mechanical Dimensions 2.4 MOUNTING The Disk Drive may be mounted in any orientation. The Disk Drive has mounting holes on three sides of the frame for ease of mounting. Figure 2-2 shows the. location of the mounting holes. The casting is very close to the frame mounting holes in some locations. Mounting screw lengths must be chosen such that no more than 0.125" of the screw is available to enter the frame mounting hole. The torque applied to the mounting screws should be at least 9 inchpounds but to avoid stripping the threads, the maximum torque applied shall not exceed 12 inch-pounds. 2-2 M8083 .06 % .01 + T --~I 3.25 - - - % .01 t I 3.38 ~ .01 LL' + ~-~~-~-~-~--~~~~~~~~~~~~~ I. - - - - - - - - - - .19 •. 01-1 !:1.87 •. 02-........ ' •....-- 3.12 % .02 ~ 8.00 -------\r-----~I .86 % .02 ;.AOVl.Jn~ ~ HOLES 40N B:JTroM) Co ON EACH SIDE - ~OTE: MOUNTJ 115 $Cl<EWS SHALL NaT BE TOR~UED 70 ~Et:lTER. THAN /2 IN. lb. PR7TRVS1()N OF ~CR.EWS THROUG·H ~._ SlD~!:!.C}LE~ IS LIMITEr> TO .12 IN. --------- .. +00 5.75 - .02 5.88 ± .01 5.50 .02 % I.. 3.12 % .02 ALL DJIfIENSIONj Figure 2-2. IN JWCH£.S Disk Drive Mounting Dimensions 2-3 " M8083 2.5 POWER REQUIREMENTS No ac power is required. The dc voltages and currents required to operate the Disk Drive are shown in table 2-1. The current profile for 12 volts is shown in figure 2-3. Table 2-1. VOLTAGE Nominal Regulation DC Power Requirements HIGH LIMIT LOW LIMIT +12V +O.6V* +5V +O.25V CURRENT 1.7A 1.9A 1.57A 4.5A** Typical Maximum POWER DISSIPATION 9W 57W RIPPLE AND NOISE 120mV Maximum (P-P) 50mV * Regulation may be +1.2 volts during power up ** At power ON for a period of not more than 10 seconds. Maximum current is drawn until RPM's reach 1000. If after 10 seconds, RPM is still less than 1000, a timeout occurs and the spindie motor is turned OFF. S.f) 405 ~ ~ ..., ~ 4.0 ~ 2 3.0 III a: § ~ 2.0 o 5 10 IS SECONDS fl2 V CUR.R..EHT POWER. UP CYCL.E Figure 2-3. 2.6 Motor Start Current Requirements INTERCONNECTING CABLE CONNECTORS The following paragraphs describe the requirements for the dc power connector and frame ground connector. 2-4 M8083 2.6.1 DC Power Connector The dc power connector (J3) is the equivalent of a 4-pin AMP MATE-N-LOCK connector PIN 350543-1 mounted on the component side of the PCBA. The recommended mating connector (P3) is AMP pIN 1-480424-0 utilizing AMP pins pIN 350078-4 (strip) or pIN 61173-4, (loose piece). DC power connector J3 pin locations and voltage assignments are shown in figure 2-4. 2.6.2 Frame Ground Connector The frame ground connector (J4) is a Faston type connector, AMP pIN 61761-2. The recommended mating connector is AMP pIN 62187-1. If wire is used, the hole in J4 will accommodate a wire size of 18AWG maximum. Frame and logic ground are NOT connected together when the drive is shipped. 2.7 CONNECTORS The following paragraphs describe the Interface Connectors, Control Cable Termination, and Jumper Settings required to operate the disk drive. 2.7.1 Interface Connectors Two interface connections are required by the disk drive: a control cable (J1) and a data cable (J2). Details of the control and data signals required can be found in section III. Connection to J1 is via a 34-pin PCBA edge connector. Connector dimensions are shown in figure 2-5. The pins are numbered 1 through 34 with the even pins located on the component side of the PCBA and the odd pins located on the solder side. Pin 2 is located on the end of the connector closest to the power connector J3. A key slot is provided between pins 4 and 6. The recommended mating connector for PI is AMP ribbon connector pIN 88373-3. Connection to J2 is via a 20-pin PCBA edge connector. Connector dimensions are shown in figure 2-6. The pins are numbered 1 through 20 with the even pins located on the component side of the PCBA. The recommended mating connector is an AMP ribbon connector pIN 88373-6. A key slot is provided between pins 4 and 6. PIAJ 4 +5" VOt..TS DC= SOlo PIN 3 + 5 VOL. T RE:TUR.N PIN! + 12 VOLTS PIN 2 (PC-SA ~COMPONENT~/DE.) Figure 2-4. + 12. oc= S"'Q VOLT Rt=ilJRN DC Power Connector (J3) Pin Locations and Pin Assignments 2-5 M8G83 I3O~Rf) THICkNE~ .062=.007 141-----/,,175=.010 Figur~ 2-5. ----~ ALL DIMEN510N.5 IN INCMe~ Connector J1 Dimensions -:1".036 -.004 1~ .iOO •• 010 '''"IT '. ,.... ,.... ,.... > 80ARD THICkNES5 () tiS ____ 1 _'---.......w_! ~~.~=. .062=.007 I II I l l/ I OIQ -i ......----/·075-.010 Figure 2-6. I I I .100-.010 AU. DINfEN510N.5 IN Connector J2 Dimensions 2-6 INCJff~ MBOB3 2.7.2 Control Cable Termination If the Disk Drive is the last drive at the 220/330 ohm termination resistor pack must nector J1. The terminator must be removed string of drives. The part number for the 2.7.3 end of the control signal cable, a be installed on the PCBA near conif the drive is not at the end of a terminator pack is 4210r. Factory Installed Jumper Settings The following jumpers are located on the Disk Drive PCBA and are installed at the factory. The jumper locations are shown in figure 1-2. Jumper JA provides for different track per inch (tpi) settings. Jumper JC enables off-track detection to create a WRITE FAULT if off-track is detected during a write operation. Jumper JD is a factory aid used to disable the UNSAFE signal from the RDA. 2.B OPTIONS The Disk Drive has two options available to the operator or user by means of jumper settings, drive address selection (J7) and write protect switch connection (JB). Figure 1-2 shows the location of these jumpers. The installer must set the drive address jumper to the appropriate position to allow the system to address the drive. If Write Protect is to be used, a switch must be connected to terminals located on the drive PCBA. 2.B.1 Drive Address Selection Option In mUltiple drive configurations it is necessary to configure each drive (maximum of four per host controller) with an unique address. This is accomplished by locating the jumper plug over the correct pins as shown in figure 2-7. The standard drive is shipped addressed as Drive l/Drive 0 (actual address designation is dependent upon the numbering system used). 2.B.2 Write Protect Option A write invoked located ease of 2.9 protect option is incorporated into the Disk Drive. The' option can be by attaching a shorting plug or attaching a switch across two test pins near IC U63 on the PCBA. These pins are on 0.100" centers to allow installing a switch connector. VENTILATION The Disk Drive operates with a minimum of air circulation. Air circulation of 3 cfm around the drive is adequate provided the temperature of the ambient air does not exceed 122 of (SO °C). Enclosures should be designed or chosen such that this minimal air circulation is provided and that the maximum temperature is not exceeded. 2-7 M8083 J3 Jl J2 4'C j 2 C 1 '1000000 I 1 2:r 456' TERMI~ATOR RESISTOR PACK FUNCTION PHASE 1 JUMPER BLOCK PIN NUMBERS PHASE 2 JUMPER BLOCK PIN NUMBERS Drive Select 0 C,1 5,6 Drive Select 1 2,C 4,5 Drive Select 2 C,3 2,3 Drive Select 3 4,C 1,2 Figure 2-7. Drive Select Jumper Options 2-8 M8083 SECTION III FUNCTIONAL DESCRIPTION 3.1 INTRODUCTION This section contains the functional description of the Disk Drive on the following levels: • Operational description of the various tasks performed by the system • Interface description • Format description and examples of formats 3.2 OPERATIONAL DESCRIPTION The Disk Drive consists of read/write and control electronics, read/write heads, head positioning actuator, disks, and air filtration system. These components interpret and generate control signals, position the heads over the desired track, read and write data, and provide a contamination-free environment. 3.2.1 Spindle Motor Operation The Disk Drive uses a Z8 microprocessor for spindle motor control. The timers within the microprocessor are used to time a revolution within 3.6 microseconds. The timers are crystal controlled to ensure the accuracy of the measurement. With this measurement the microprocessor develops an error signal relative to the deviation from 3600 rpm and assures that the rotational speed is within +3.6 microseconds of 3600 rpm. This results in a +0.1% speed control. An adaptive offset loop (figure 3-1) provides error correction to lock the spindle motor exactly on 3600 rpm. The input to the microprocessor is a square wave developed by the switching of the hall sensors in the brushless dc motor. Physical position of the spindle relative to the hall sensors provides rotational information to the microprocessor, figure 3-2. As the motor rotates the microprocessor in effect rotates the commutation so that the motor speed is exactly in sync with the hall sensors. Spindle rotation is controlled with two modes of operation: start mode and run mode. A description of each mode follows. 3-1 M8D83 ADAPT/VE. OI'F.5rr LOOP - COM/.1urE~-t TA~Le. - HALL SUf~ORS ~ OC.~I I I - JNTEt;AATt;/l.,.. I" ~ DC-rei FDf<AGr If} 19 c,ol)NTS &IJW FAST f ) R£F. 10 (,()(JlJrs RPM 10.'7 ,I.Ifl£~/COIINT 10 aOIJ/lT5 • 3/,00 Figure 3-1. Spindle Motor Control Block Diagram 100 I2.COMMVTCS!REV Figure 3-2. Spindle Motor Hall Sensors Relationships 3-2 M8083 3.2.1.1 Start Mode The start mode starts the spindle motor rotating and causes the heads to fly as soon as possible to minimize the headwear. To achieve this, a high torque is required due to the mass of the disks and the drag caused by the non-flying heads. The heads nominally start to fly off of the disk at approximately 1000 rpm which takes about 3·seconds. Because of system and/or power supply constraints, this initial torque is limited by limiting the +12 volt current to 4 amps. This current limiting is accomplished via analog circuitry on the PCBA assembly. The spindle is allowed to run at 4 amps for approximately 3 seconds which is the time it takes to get the disks rotating to at least 1000 rpm and the heads flying. After the 3 second current limit, the motor rotational speed increases, increasing the back electromagnetic force (emf) and decreasing the motor current, figure 3-3. As figure 3-3 shows, the current decreases exponentially as the spindle speed approaches 3600 rpm. This operation consumes approximately 18 seconds. At this point', the current is approximately 1 amp which is where the second mode of operation begins. Another feature of the start mode is the time-out condition which occurs in the event that the spindle is not up to 1000 rpm in 10 seconds. This feature protects the heads from excessive wear if there is a problem, and also protects the spindle drivers if too much current is required to get the spindle up in the appropriate amount of time. If the time-out condition exists, the spindle motor is turned off and the only way to start the spindle up again is to remove power from the drive and then reapply power to the drive. It should be noted at this time that if the drive is power cycled at a rate faster than 30 seconds, and there is a problem in the RDA, that is physically restraining the spindle from turning, the spindle drivers could overheat and be damaged in the process. AMPS 4"'-~~-~~--""-- START CURRENT 'SeNSE. AV(Y. LOCX-ON (fi) 3~OO RPM I 5 Figure 3-3. SECONOS 10 t Spindle Motor Current Profile 3-3 M8083 .2.1.2 Run Mode n the run mode the drive uses pulse width modulation to control· the speed. 'his method of analog control also reduces noise. Since the drive to the pindle does not have to be a full ON and full OFF condition, no audible noise s generated. Pulse width modulation causes the driving hexfets to operate in heir linear region. This reduces the large surge of ON and OFF currents which ould result in an audible 720 Hz noise. Figure 3-3 shows that at the 3600 rpm ock, the current drops from 2 amps to approximately 1.2 amps. This is due to he analog control taking effect in which the hexfets now are run in their inear region requiring less current and resulting in less heat dissipation. ue to the switching of the hexfets and the internal inductance of the motor, arge induced current spikes are generated that need to be suppressed. These arge currents are produced in part because of the delta configuration of the pindle motor. The delta hookup has circulating currents when switching from ,ne phase to another. Small capacitors are added to the spindle drive hexfets :0 minimize these spikes that would otherwise be on the +12 volt power bus. head arm assembly is driven to the landing zone and latched when power is 'emoved from the disk drive. This is accomplished by using energy stored in a :apacitor during ·normal operation. A capacitor is charged from the +12 volt tower supply. When power is lost, the capacitor's charge is applied to the lctuator to move the heads into the landing zone and become latched. After the leads are latched and in the landing zone, the drive goes into the dynamic Iraking mode. During dynamic braking, there is still voltage available due to :he back emf of the spindle motor. The spindle motor is now used as a generLtor to cause all the motor windings to be shorted via the hexfets which are :till enabled by the residual emf. The large short circuit current acts in tpposition to spindle motion, causing heavy breaking action. ~he 1.2.2 Servo System Operation servo system in the disk drive utilizes a di-bit pattern on the lower sur:ace of the lower disk in the HDA assembly. The servo head, servo pattern, :ervo circuitry on the main PCBA, and the actuator mechanism are the main comtonents that make up a closed loop servo system in the drive. This servo :ystem allows precision track following which compensates for variations in :rack location caused by thermal conditions. See figure 3-4. ~he 3-4 SERVO REAO SIGNAL ADJU5TED PE.S I'1'j t-J. OQ ~ HEAD AMPliFIER s::~ C'D ~f w I .po. • CIl rJ)NJPEAJ ~ -SATOR. ~ DerMODU PfS -LA7l)R + • A·GC ~~~~~~ I I I NISM ICUBRENTI C'D ~ ~ <: w I VI o CIl '< CIl M' C'D GUARD - SYNC TR.I<O - Der£c,r ....-1--1 INOCX -: CfRClJ/7' ~ o () ~ t::::I t-J. III OQ ~ III S CURREJJT § CDWTROL OFF5t:.T r 'DEC S OJ ~ I +sYNC DEMOD It ,SAMPLeY CON1'ROl- .....- - _...... CIRCUIT , 1. .sEM\lO ClJNmOL (,uP =RE6ISTEI< ) ~ 00 o 00 w M8083 3.2.2.1 Servo Circuitry The output of the servo head must be proportional to the distance off track for any given head position with respect to the servo track. Since each head has a slightly different width, and output is a function of width, the gain for each head must be compensated for in the electronics. This guarantees that the output in volts per inch of track offset is identical for any servo head so that the circuitry will perform smooth and accurate track following. The head output signal is fed to the servo read amplifier. The output of this amplifier is of constant amplitude due to the Automatic Gain Control (AGe) signal. The amplitude of the sync pulses in the di-bit pattern is about 4.4 volts peak-to-peak at the Servo Read Signal (figure 3-4) which is between the servo read amplifier and the demodulator. The demodulator, under control of the demod control circuits, samples A and B or C and D pulses and uses the difference in amplitude to generate a position error signal (PES). The discharge signal is used to discharge the peak detector circuit in the demodulator prior to the next sample period. The demodulator output, PES, is applied to a summing mode along with the DAC output from the microprocessor to generate ADJUSTED PES. This DAC output signal is only used during seeks or to force off track conditions for analysis. ADJUSTED PES feeds the compensator which takes a position signal and generates an acceleration command. This acceleration command must be smooth and orderly to obtain a well behaved servo loop. The compensator output is fed to the actuator mechanism through an actuator current control circuit. The output is 0.25 amp for each volt of input from the compensator. This current through the actuator coil causes the actuator mechanism to move the heads over the disk surface. The actuator mechanism contains a coil with a dc resistance of approximately 4.5 ohms and a shorted turn to allow the fast rise times required to obtain fast access times. The coil and the shorted turn act as a transformer with a turns ratio of 136:1. The low impedance of the shorted turn (secondary) is reflected into the voice coil (primary), allowing the fast rise time. The microprocessor is essentially not used during the track following mode except to monitor that the servo system is operating properly. The processor is required to get the servo system started when power is applied or after a malfunction and for performing seeks. The sync detect circuit detects guard bands, track 0, and index pulses. Guard bands are written outside track 0 and inside the innermost data track. The purpose of the guard band is to allow the servo circuitry to sense that the heads are not over a known data area. The guard bands are written in such a manner as to cause the actuator to move in the proper direction to get back over the data area. The index pulse is used to signify the beginning of a track. The track 0 pulse indicates that the actuator is positioned at cylinder O. 3-6 M8083 3.2.2.2 Servo Pattern The servo pattern is basically a di-bit pattern. The servo circuitry along with this pattern has been designed to be tolerant of small disk defects. Since the patterns are timing related, fake sync pulses can be inserted if sync is not detected in signals read from the servo track. The pattern contains eleven bits of information and is repeated 625 times per track. See figure 3-5. The information that can be contained in the pattern is: sync, 4 bits of information; track 000; guard band; index; and 4 bits of track center information A, B, C, and D. The sync, track 0000, guard band, and index signals are written 10 time units apart. The track information is written 20 time units from the sync bits and 20 time units from each other. The track information is repeated every four tracks (figure 3-5). These pulses are monitored for track following. In figure 3-5, the example shows the head path such that the amplitudes of pulses A and B will be equal and half amplitude when the head is following the track center. Pulse C will have no amplitude and pulse D will have full amplitude. Since pulses A and B are only known by their time relationship, one additional piece of information is required. This information will allow the servo system to know the proper direction to drive the actuator when an off-track condition exists. For example, if the A pulse is larger than the B pulse, the error is in a different direction on track 0 than it is on track 2. The drive does not know which of the 918 tracks the heads are on, however, it does know which track of any given set of four that it is looking at. In this way the circuitry applies correction in the proper direction. The microprocessor keeps track of which track the heads are on by monitoring the increments and decrements to track count on the data bus, under the direction of the direction in signal. If the least significant bit (LSB) is a 0, the A and B pulses are monitored for track posi tion. If the least significant bi t is aI, the C and D pulses are monitored. The most significant bit of the counter (direction in) controls the direction of correction applied for an offset between an"y pulse pair. The sync pattern is written starting with a pair of pulses. Following this pair are time slots for track 0, guard band, and index pulses, if required. These are then followed by another pair of sync pulses. The A, B, C, and D pulses for track location are as shown in figure 3-5. The guard band track center pulses, however, are somewhat different. The outer guard bands, outside of track 0, are written with only A and C pulses. This will cause correction to always be applied to move the heads inward toward track O. Likewise, the inner guard bands, inside the innermost track, are written with only Band D pulses, thus causing correction outward toward the data tracks. The index pulse is repeated twice for redundancy. pulse is not detected, the other should be and the an index pulse once per revolution. If one of the ed, the width of the index pulse will be halved to index pulse width is 53.4 microseconds. 3-7 Therefore, if one index drive will always generate index pulses is not detect26.7 microseconds. Normal PATTERN l\EPEATS 62STIME.S PER RfiVOL.unoN ~-S-E-RV-O-P-O-S-In-O-N-D-A-r~ ,.,,-- ~~ X> ceNTeR'; OF ~ t"%j ~. OQ ~ 0A14 ~ TRACKS I c ... HI!AD ~ PATH ~~ ~ CI) .., g;,~ - _u-__ =~=== "REPEATS I \JI I <Xl ~ FO~C.KS~ ~~ r - , A" - e C ...... -- ---- -~ - -lr --]-___ u.. 0 ;#~ ~~ ~o ~ )C tt .. :z. ~O -~ ~: 0 ~ ~UARO X)- ~ ~ o~ A B II I:~~~ ---~~I~-~~U~~~J~:~i .J..J_ - - - .ll_ - ' 1- LL-_ - - - I L.._,, _____ - - -(P:. <:'L ___ " __ 1..~.:~2.- -==~[~==_:~=_U_ - - - ___ -~~~ -===[~=]------ 6- • w PATTERN R~PEATS EVERY U- n;l~ ><:1:>- 4 (D w • -- 6UARD ~ (C.D I ___ - - J._ _ __ ~.:.A)_ (D.C) ~ <Xl o CIl <Xl (D W t1 < o '"d III rt rt (1) t1 ~ READS'&NAL OFF--t} TRACk O()WN EVEW TRACKS ODDTRACKS r--------~---------l I , I (~S'nVE) (mWARD SPlWbLE ) CENTER I I ------------------~ P051110N tNFORMAnoN 'S OE.RIVE 0 FROM TH£Se. PUL.'E~. M8083 3.2.3 Read/Write Channel Operation The read/write channel performs the recording and reading of data to the disk drive. Figure 3-6 shows typical read timing while figure 3-7 shows a block diagram of the read/write channel. The read/write circuits are provided with +11 volts through the voltag~ regulator circuit consisting of U31 and Q15. This +11v is derived from the +12F input voltage. The read/write data is transmitted between the heads and the drive PCBA electronics via the read/write flex circuit and the associated preamps (SS1104). A B c J.J D E -.J F J1 , r U U U U n Figure 3-6, n n I n n- , J n n Read Function Timing Diagram 3-9 U U I , I n U I I I U t'%j U2.3PIN2. ~ O'Q ~ Ii ('I) U1 w A I -.....I • ~ III p.. W I ..... o Oy ::l TRAHCONCUCTAt-4C~ ~ () ,u,S'" AM PlIfiE.R rt ~. o GAIN CONTROl.. \ ::l VDLTAGe. ..... \J )av o ?;" "NF -- ~. III O'Q Ii \Altr 0 ~\ f UZ,S PlN1 () t:::l UI5 u" -MFM RC DAT" UI. t;d I LT Ie I ~ FILTER C8ATiD III o-+- - - . 1 80N' LOW PA:aS t'%j S U2.3 Ul5 L7)L8 HYSTERf~ts U87 I QII,r2,13 GATE UJ' Plt-I to ::s:: 00 o 00 w M8G83 3.2.3.1 Write Function The write function is shown in block diagram form in figure 3-8. The two signals HDSEL22 and HDSEL23 are fed to the decoder U29 selecting one of the set of four preamps within the HDA. Actual writing of data happens if, and only if, the four signals to the decode chip are true, namely safe condition from the HDA preamp, drive selected, seek complete, and write gate true. The MFM WRITE DATA signal received by the differential receiver will then be written on the disk. As each transition is received by the write data receiver U11, it goes through a resistor level translator U21. As long as WRITE GATE is active, flip-flop U23 will toggle for each transition. If any of the conditions for the write function are not true, flip-flop U23 will be held reset forcing the Q output to be a logic 1 level. This forces the Q output to be a logic 1 thus disallowing any current to flow through the Read/Write preamps. The two diodes at the Dx Dy HDA outputs are back biased. When the decode U29 is satisfied, the write select and write current control signals are at +8.5 and +1 volt levels respectively. This indicates that a write function is in process. When the decode U29 is not satisfied, the write select and write current controls are at +5 and +4.3 volts. This indicates that a read function is in process. During the write operation, U37B, a transistor package, is turned off. This causes the voltage controlled current sink to allow current to flow from the preamps. When U19B is on, it is a non-write function. The voltage controlled current sink is forced to sink current from the +5 volt supply. A block diagram-of the read/write preamps used on the Disk Drive is shown in figure 3-9. Each preamp supports four heads. 3.2.3.2 Read Function The read function is shown in block diagram form in figure 3-7. analog signal that can be seen at the differential inputs Dx and figure 3-6, Read Function Timing Diagram. This analog signal is AGC amplifier and then to a low pass filter. At this point, the has two directions. The typical Dy is shown in fed into the signal path The first direction is the AGe loop which is the direction going towards the bottom of the page. The analog signal is now processed through a buffer amplifier which branches again in two directions. The AGC loop is the direction that goes toward the GATED TRANSCONDUCTANCE AMPLIFIER. This amplifier is gated with WRITE GATE to inhibit the AGC loop during WRITE operations. This gating inhibits saturation of the read amplifiers due to the very high amplitude write signals. The transconductance amplifier is referenced to a fixed reference voltage (Vref). If the average input voltage is above Vref, the output of the amplifier is increased, thereby reducing the. gain of the AGC amplifier. Conversely, if the average input signal is below Vref, the amplifiers output is decreased, which causes the AGC amplifier gain to be increased. 3-11 MSOS3 +1 _•• --1 • ~~T ......... ·IIV_~ ( v ) FI :,.ec Q.1S'" U31 ~u' -U$ -~50 MD5ILt1 -e~' - ~2. -C$3 + ..... WU~T.A DX DY - ..... WItT I)A,.A ~I +t2V -e.S~T) 4SoO(iililb) ws REG QZ3 +5V we HY'P-+--I uo....w eweR Q\& WLTAGE eo)l1'ROl.LED eUAAIitn' SIN I( O-IA/V Figure 3-S. Write Function Block Diagram 3-12 M8083 w.:t'n CtrRlU!Mi • SS'~4 ~ MA Net. UP("751 a r-- - - -.--- - --- - - ..... - - - - - - - - - - - - - - -------., we • -'* • 'we . ...... • I , ---- ,, WI . I~ ~TE - Ru It - St~C'T , '-" / ~eAC AMP • I• Y I ~f! N I I I eE • Q41P E~Le I- - • ... t HS2. ' ws£Y .I - ~ "" V.U$ ±- I WI~ ... ... HEAD 0 A" u III ..J fit Q ~ ..J ~.r Hoa I I ~.) o.rr I I I I I I ./ HEAD I ~ • HEAD, % "' ~ HEAC3 ~~~- - , ~I I -'f I ,•I Nt! ~, 1 ...j "YHz?: I I f I I I I ./ ~ PRE- I " ~P .~ '-J •H y.mI f I DR' W~9 I ~ , Read/Write Circuits (Pre-Amp) 3-13 H31 ""'Ii I I I .... ______________________________________ -___ .J Figure 3-9. HIl. I ~IT I I L.-~_ I '" N I , I I I .I~ I .:r: - !"" • I <~tt.....1f/p c£I , ~Sl - WRI~> DD...o ./' -~ -- "'" ~ AA~ v UHSAF£ I I Ru ... - Tv\AP6 UNS"'FE I ~ -:;:Ru .. • WRJ1"!, I- I V. -"CT:c -- M8083 The AGC amplifier is used to cause a constant average amplitude with varying head outputs. This compensates for output variations from head to head and for the signal reduction that occurs as the heads are moved from cylinder 000 to cylinder 917. This reduction of signal with cylinder position is due to increased bit density and decreased wavelength. The other output of the buf~ered amplifier is a 2V p-p signal which is fed through a hysteresis loop. This loop compensates for bit patterns that on high resolution media will cause the signal to cross through the hysteresis levels again. High resolution can cause a phenomenon called shouldering. Shouldering is a portion of the signal waveform that has 'zero slope other than at the peaks. These areas of zero slope can be mistaken for peaks if not properly recognized and processed. The hysteresis loop causes these potential pulses to be ignored as the analog signal is converted to digital as shown on signal D of figure 3-6. This signal is fed into the D input of flip-flop U23. The second path for the signal is through the low pass filter. The filter output is fed into a differential amplifier. The output of this amplifier is signal A. The other path of the low pass filter output is through the differentiator and pulse shaper. The output of the pulse shaping circuit is designated as signal C. This signal is fed into the clock of flip-flop U23 and along with the signal on the D input, generates the signal E. This signal E is then processed by a bi-directional circuit to generate a MFM read signal. This MFM signal is translated from ECL levels to TTL levels, buffered, and presented differentially to the interface as +MFM READ DATA and -MFM READ DATA. 3.2.4 Power-Up Sequencing DC power (+5V and +12V) may be applied to the drive in any order, but +12 volt is required to start the spindle motor. When the spindle reaches full rotational speed, the actuator lock automatically disengages and the heads then. recalibrate to track 000. Step pulses received during the recalibration, Track 000, READY, and SEEK COMPLETE status signals will be true. The drive will not perform any read, write, or seek operations until READY is true. If 1000 rpm spindle speed is not reached within 10 seconds of power application, an automatic shutdown procedure is initiated: power to the spindle motor is removed and the drive will not come ready. Figure 3-10 shows the timing for power up sequencing. NOTE During power-up and recalibration, the drive will emit a variety of audible sounds. This is caused by the actuator voice coil and is perfectly normal. 3-14 M8083 DC R)WER ON ----.. AUTO~LI~ Ir--------------------------~--.... (SE.EKTOm4CKODO~ -.;....--;------....1 2.2$CCMAl(--1 .:~: : 1 ...._ _ _ _ __ I ' 2O.seetNtX=:J_ _ _ _ _ _ -i!i-_________ -REAOY C,-......(UP1OSPEED) ____________________________ ~~~S~MAA SeEk~~~ NOM"'-L. TIME. I~ _ ______________ .ENAB'-S Ai:AOY 'TRACk CQ:) ~NO ~ COMPl...ETE "n) I N1"f.RFAC£ Figure 3-10. 3.2.5 Power-Up Sequencing Power-Down Operation Upon removal of either or both of the dc voltages from the drive, the drive circuitry causes the actuator to be retracted to a shipping and landing zone located at the inner diameter of the disks. The actuator is latched in this position by the actuator latch until power is again applied and the spindle motor is up to speed. The spindle motor 1s also dynamically braked, by back emf, to decrease the stopping time when the heads are in contact with the disks. The disks will stop rotating in approximately 9 seconds. 3.3 INTERFACE DESCRIPTION The Disk Drive has two interface connectors: one for control signals (J1) and one for data transfer signals (J2). The control signals are TTL while the data signals are differential. The following paragraphs describe the signals, timing requirements, and pin assignments associated with these two interface connectors. The driver/receiver pair used on the drive is also discussed. The location of these two connectors is shown in figure 3-11. 3-15 M8083 l~ONT PANEL t COMPONENT SIDE t &14 Figure 3-11. 3.3.1 Interface Connector Locations Control Signal Interface The control signals are both input and output, originating external to the drive and internal to the drive respectively. The control signals can also be divided into two types: those intended to be multiplexed in a multi-drive system and those intended to do the multiplexing. The controls signals that do the multiplexing are: • • • • DRIVE DRIVE DRIVE DRIVE SELECT SELECT SELECT SELECT 0 1 2 3 3-16 M8083 The signals to be multiplexed are: • • • • • HEAD SELECT HEAD SELECT HEAD SELECT HEAD SELECT TRACK 000 20 21 22 23 • • • • • WRITE GATE INDEX READY SEEK COMPLETE WRITE FAULT Up to four drives may be installed in a daisy chain configuration using a single control cable. The last drive in the string must have a termination resistor pack installed while all others must have the terminator removed. The input lines have the following electrical characteristics: Logic "0" = TRUE Logic "I" = FALSE = 0.0 = 2.5 Vdc to 0.4 Vdc @ 1 in Vdc to 5.25 Vdc @ 1 in = 40ma (max) = LO = 250ua (open) = HI The output lines are driven with a TTL open collector output capable of sinking a maximum of 40 millamperes at the Logic "0" or TRUE state with a maximum voltage of 0.4 volts dc measured at the driver. When the driver is in the Logic "1" or FALSE state, the driver transistor is OFF and the source current is 250 microamperes maximum. Driver/Receiver - The recommended driver/receiver combination for control signals is shown in figure 3-12. The maximum cable length recommended is 20 feet (6 meters). Pin assignments for the control cable are shown in figure 3-13 and table 3-1. +5V 74~8 "'--2.0Fr:(MAXJ-~ eroll 74LSI 330$1. Figure 3-12. Control Signal Driver/Receiver Combination 3-17 M8083 ~LAT RIBBON OR TWISTED PAIR MAX Z() FcET PI (!,Nt) /tiD SEt. SIT3 r&ND ND .5EJ. SIT 2 - r - GND _ .gEE-I< COMPLETESND - TRAC~ 000- N/C (wo SYS7CM HD sa GND _ 9 IS - . BIT 1- 8 l2. GND HOST 7 II WRITE~T- aND , 10 GlYO HD $£L 8ITO- 3 5 14I~'T£ ~A'TE. - . L-. I 2 4 /llJ1"J - ')1 - INDEX GNO 14 15 /)ISk " DRIVE 17 18 " z.o 21 2.e. _ REAOY- J.7ND 5rEP- - GINO 23 24- z5 2.h &iD 2.7 DRIVE $EL 1- .... 2B GlJD t,9 DRIVE. 5EL 2.. DRIVE SEt. 0 - GND - DRlYE. $£1.. .3 - .... GNO C>lRECTJON IN - Figure 3-13. ~ :;/ 3z.. 33 - .34- J1/P1 Connector Pin Assignments 3-18 M8083 Table 3-1. Control Signals (Daisy Chained) GND RTN PIN 1 2 Hd Sel Bit 3 4 Hd Sel Bit 2 6 Write Gate 8 Seek Complete 10 Track 000 12 Write Fault 14 Hd Sel Bit 0 16 N/C 18 Hd Sel Bit 1 20 Index 22 Ready24 Step26 Drive Sel 0 28 Drive Sel 1 30 Drive Sel 2 32 Drive Sel 3 34 Direction In - 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 Note: 3.3.1.1 SIGNAL PIN AND NAME "-" indicates low true signal Control Input Signals The following paragraphs describe the control input signals. Head Select Lines - The following head select lines allow selection of each individual read/write head in a binary coded sequence: 0 2 , 21 , 22, and 2 3 Head select 20 is the least significant select line. The heads are numbered 0 through 15. When all head select lines are high (inactive), head 0 will be selected. A 220/330 ohm resistor pack provides line termination. Write Gate - The active state of this signal, or LO level, enables write data to be written on the disk. The inactive state of this signal, or HI level, enables data to be read from the drive. A 220/330 ohm resistor pack provides line termination. Step - This interface line is a control signal which causes the read/write heads to move in the direction defined by the DIRECTION IN line. The access motion is initiated at the high to low level transition or leading edge of the signal pulse. Any change in the DIRECTION IN line must be made at least 100 nanoseconds before the leading edge of the STEP pulse. The DIRECTION IN line must not change for at least 100 nanoseconds after the trailing edge of the last STEP pulse. See figure 3-14 for General Step Timing. A 220/330 ohm resistor pack provides line termination. 3-19 M8083 /OO7t:5MIN ~t---- 100')15 MIN ~ f.. I I ,I -DIRECTION :1Z:/~f4:-~:~2=;h:II:~·~~1_______ ,at. ;1&1T'!/~·" '0L i~"/!. . :. Oj~J/~i" "Z~.-.-... ·;-? ; .... ~'~--£' IN I I ..;..1 u« -3~P----~UI , .. , I t~ SOO n.s MAX Ul~---.8.1ms I l.,.:MIN .1 HEAD SentI:I I ~AY I , -SEE.K COMPl-ETE ----------'~I~------------~------_I Figure 3-14. ___ General Step Timing All multiple cylinder seeks in the Disk Drives are buffered seeks. Optimum performance from the drive will be achieved if the time between step pulses is from 1 microsecond to 13 microseconds. Any time up to 3100 microseconds (3.1 milliseconds) will be accepted by the drive. See figure 3-15 and table 3-2. Table 3-2 also shows performance expectations for different step rates. The equations for the time of a seek of any given length L, are: SEEK LENGTH (L) 2 8 32 128 1 ~ SEEK TIME (including settling) 5ms 5ms 8ms Ilms 15ms 23ms 7 31 127 511 512 + + + + + 0.43ms(L) 0.22ms(L) O.llms(L) 0.053ms(L) 0.027ms(L) The equation for calculating the average seek time is: M AVERAGE SEEK TIME = 2/M L (1 - L/M)tL L=1 WHERE: M is the number of cylinders L is the length of the seek in cylinders tL is the time for an L cylinder seek 3-20 M8083 sao 7tsec MIN -STEP 104-- 2-"Sec MfN.-----J 3'00 ~ec MAX. Figure 3-15. Table 3-2. Step Pulse Timing Seek Performance Vs Step Time STEP TIME (usee) AVERAGE ACCESS TIME (msec) 1-13 14-26 30 35 40 30 34 42 43 45 45 50 46 60 47 70 80 52 90 57 100 150 59 71 83 110 140 170 200 230 260 290 320 200 300 400 500 600 700 800 900 1000 MAXIMUM ACCESS TIME (msec) 48 78 85 92 92 92 92 105 112 115 122 126 164 210 296 383 44 55 474 564 653 744 835 926 Time between step pulses cannot exceed 3.1 msec. All seek times include settling and begin upon reception of the first step pulse. 3-21 M8083 Direction In - This signal defines the direction of motion of the read/write heads when the STEP line is pulsed. An open circuit or HI level defines the direction as "out" and when the STEP line is pulsed. the read/write heads will move away from the center of the disk and toward cylinder 000 (the outermost cylinder). If this line is at a LO level, the direction of motion will be defined as "in" and the read/write heads will move toward the center of the disk. Any changes in the level of the DIRECTION IN line must conform to the timing restrictions shown in figure 3-14. A 220/330 ohm resistor pack provides line termination. Drive Select - DRIVE SELECT, when LO, connects the drive interface to the control lines. Positioning the DRIVE SELECT jumper between two appropriate pins on the PCB determines the address to which the drive will respond. The location of the DRIVE SELECT jumpers is shown in figure 2-7. The following table indicates which drive will be selected for each jumper position. 3.3.1.2 Control Output Signals The following paragraphs describe the control output signals. See figure 3-13. Seek Complete - This signal. when LO or true. indicates that the read/write heads have settled at the destination cylinder and that another seek, a read, or a write may be initiated. Track 000 - This interface signal, when LO or true, indicates that the read/write heads are positioned at cylinder zero (the outermost data cylinder). Write Fault - When LO or true, this signal indicates that a condition exists in the drive that may cause improper writing on the disk. Further writing is inhibited in the drive until the improper condition is cleared. WRITE FAULT can be cleared by deselecting the drive or by cycling power OFF and ON. NOTE This signal should be edge detected by the controller. 3-22 M8083 There are three conditions detected: • Write current in a head without WRITE GATE active or no write current with WRITE GATE active and drive selected • Multiple heads selected, no head selected, or improperly selected • Head not properly positioned over track (OFF-TRACK detected) Index - A pulse on this interface signal line is provided by the drive once each revolution (16.67 millseconds) to indicate the beginning of a track. This signal is normally HI and makes a transition to LO to indicate INDEX. The LO pulse is nominally 53.4 microseconds in length. Only the HI to LO transition is valid. Index timing is shown in figure 3-16. Ready - This interface signal, when true together with SEEK COMPLETE, indicates that the spindle is up to speed and the drive is ready to read, write, or seek. When this line is false, writing and seeking are inhibited. Typical time for READY after power on is 15 seconds. Figure 3-17 shows some of the general timing requirements of the input and output signal lines of the drive. 1/60'7",5 NOM, -INDEX -----.1 I ---..J 110--1 I--sa.4~ec TYP Figure 3-16. Index Timing 3-23 M8083 DC. POWER. ON .-J :....- 20 SEC MAX -. I -RUcDI( (IF ~L.ECT~) -~TEP ~I I _________________________________________________ ~ 1--5££ F'&UA~$ 131,14- ~~--.-------------------------------- I ---4za$S'W( -S~l!IC ~: L-il~------~I~--------------------------------~ ~2M5EO~ CQMPIJTC -l -TRACK 000 -----" I I ____~I I I IfEAD DATA VAL.ID - ()R.IVE ~'T HeAD .$w/TCHeD I¥NJ 04TA VALID ~I------------------------------- --------------------______~Il~--------------------~ ~8,.....s !f4AK ------------------------------t....ll ~1OO,.,.wAX ,I , --t I I ~a~ MA.l( I --t i4-tfCD..-BMN< WAITE O~TA ----------------------------_----~II~_____ Figure 3-17. 3.3.2 General Timing Requirements Data Interface The following paragraphs describe the data interface. 3.3.2.1 General Description The lines associated with data transfer between the drive and the controller are differential in nature and may not be multiplexed. These lines t MFM READ DATA and MFM WRITE DATA t are provided at the J2/P2 connector on all drives. The driver/receiver combination used for these lines is shown in figure 3-18. A third signal is available at J2/P2. That signal is DRIVE SELECTED which indicates the selection status of the drive. This line is an open collector TTL output. 3-24 M8D83 HIGH 1RUE-~ >----HIGH TRUE /00 4MD 26LS3e NOMINAL "_" LINE LOr;/~ LOGIC i Z=I05.n • NOMINA'- "-" LINE FLAT RIBBON OR TWISTCD PAIR MAX/1\.1UM Figure 3-18. 20 FEET Data Line Driver/Receiver Combination Pin assignments and line titles for J2/P2 are shown in figure 3-19 and table 3-3. f:LAT RIB80N OR TVV/STED PAIR MAX 2.0 F~E.T P2 J2. - [)RJV£ SELECTED- RESERV£D RESERVED RE.5ERVf:D ~E,eRvED RESeRVED t:..ES£RYW RESER.VED RE5ERVEV HOST SYSTEM I i, I t i I I I I I ! I , ReSERVE!) GROUIJO CABLE; PR.E5£NT+M;:M WRITe MTA -Mf!"M WR../i£ Cl4TA .sIGNAl.. GND SIGNAl.- GNP :__ +M!=M Re.AO DATA i _ -MI!M ~€AD DATA tI ,s1(;N4t... (J,tJ() "sIGNAL GND I 2 '::< ...J 4- S' ~ 7 DISK DRIVE B 9 /0 1/ 12 13 14 I I i IS' : I 16 i /7 18 19 2.0 I I 1 1 I I I I I ! ! I ! ; : i I Figure 3-19. i I J2/P2 Connector Pin Assignments 3-25 M8083 Table 3-3. Data Signals (Radial) SIGNAL NAME SIGNAL PIN Drive Selected Reserved Ground Cable Present + MFM Write Data - MFM Write Data Signal Ground Signal Ground + MFM Read Da ta - MFM Read Da ta Signal Ground Signal Ground 1 2 - 10 11 12 13 14 15 16 17 18 19 20 Note: "_" indicates low true signal 3.3.2.2 MFM Write Data This is a differential pair of data lines which define the transitions to be written on the disk. The transition of + MFM WRITE DATA will cause a flux reversal on the disk provided WRITE GATE is active. This signal must be driven to an inactive state (+ MFM WRITE DATA more negative than - MFM WRITE DATA) by the controller when in the read mode. See figure 3-20 for write data timing. No write precompensation is required by the drive; if write precompensation is used, some loss in read performance may result. -DRIV~ SEt. - - - - , -HD 5£L--.., ---i +MI=M VALID READ MTA -WRITE \.-- 8p4 MAX (HEAD SWITCH/IVa] -..f 't-- 25715 M/N)/507t..IIIA'iIMUM I ---j t.--2tJ07t.S TVP. arreELL -..l" I ~TE ------~~;.::.::.::........---.'"-_ _---Jr-I--~-- READ/ WRITE. ReCOVERY Figure 3-20. MFM Write Data Timing 3-26 M8083 3.3.2.3 MFM Read Data Data recovered by reading prerecorded information from the disk is transmitted to the controller by the differential pair of MFM READ DATA lines. The transition of the + MFM READ DATA going more positive than the - MFM READ DATA. line represents a flux reversal detection from the disk under the selected head. See figure 3-21 for MFM READ DATA timing. 3.4 FORMAT DESCRIPTION AND EXAMPLES The purpose of a format is to organize a data track into small blocks of data called sectors. Each sector has a unique address in its header or ID field. 3.4.1 STS06/412 Format The format shown below in figure 3-22, the STS06/412 format, is a format commonly used on lower performance disk drives. Its efficiency of 81% (unformatted capacity/formatted capacity) is typical; however other efficiencies can be obtained by varying the number of sectors per track. The STS06/412 format is a soft sectored format which means that the beginning of each sector is defined by an Address Mark and a prewritten identification (ID) field which contains the physical sector address plus cylinder and head information. The ID field is then followed by a user supplied data field. The STS06/412 format is a slightly modified version of the IBM System 34 double density format which is commonly used on floppy disk drives. The encoding is Modified Frequency Modulation (MFM). -DRJVE ~EL -HD ,jeL j.--- 8 ...us MAX (HEAD $WITCHI NG) +MF'M VAL.ID READ DATA . - WRITE 6141£ I ---i J--eS"M MIN) IS'O?t.s ----t ~2007&$ 7Yp. _ _ _ _ _ _--=8;.;.IT--=:;CE=..;L:;;.:I.~_., WRITE DATA I ,,-__~I 400,.,s -I- IttF --I M4XIMUM r.- MAX. 8.1"'5 ---l If4-~--i~SO-J$()X5 j..~ ______________ eMf BE. ~nunun-------- --1 I-- 200,... 7YP. BIT' CELL. Figure 3-21. MFM Read Data Timing 3-27 ___ REA D/ WRITE. RECOVE.R,Y 0 TO e.oo?f., M8083 NarES: I. },J~RL TR.ACJ< CAPACITY a 1fH.16 8l"7ES UNFIJIlM ~T"rEO t. TDTAL ~7A S.,'E.$ Figure 3-22. 3.4.2 TAACJ(- 2S'X~2·8.J92. ST506/412 Format Address Marks The beginning of both the ID field and the data field are flagged by unique characters called Address Marks. An Address Mark is two bytes in length. The first byte is an "AI" data pattern. This is followed by either an "FE" pattern for an ID address mark, or an "F8" for the data address mark. The "AI" pattern is made tmique by violating the encoding rules of MFM by omitting one clock bit. See figure 3-23. This makes the Address Mark pattern unique to any other serial bit combination that could occur on the track. BIT ~ITlON 0 I 2 , 4 5 6 1 co CO CD CO CD CD CD CD nAI t DArA BITS I 0 I 0 0 0 0 "AI" CLOCK BITS 0 0 0 0 I 0 I - r-- r-- I 0 - r-- ENCODED PATTERN WITH DROPPED CLOCk NORMAL ENCODED PATTeRN Wfn40UT DROPPeD CLOCk 1-._ '-- - - D D - - ~ c C· CLOCk BIT D· OATA BIT Figure 3-23. "AI" Address Mark Byte 3-28 ,....- ~ c c -- M8083 3.4.3 Gap Length Calculation Gaps surrounding the ID and data fields establish physical and timing relationships between these fields. Gap 1 '- provides for variations in index detection. This gap must be at least 12 bytes long. Gap 1 is immediately followed by a sync field preceding the first ID field. Gap 2 - follows the CRC or ECC bytes of the ID field, and continues to the Data Address Mark. It provides a known area for the data field write splice to occur. The latter portion of this gap serves as the sync up area for the data field Address Mark. Gap 2 is normally 16 bytes long, however, its minimum length is determined by the "lock up" performance of the phase-Iock-Ioop in the data separator, which is part of the host control unit. Gap 3 - follows each data field to allow for spindle speed variations. This allows for the situation where a track has been formatted while the disk is running slower than nominal, then write updated with the disk running faster than normal. Without this gap, or if it is too small, the sync bytes or ID field of the next field could be overwritten. The minimum gap is 8 bytes for· a sector size of 256 oytes. Gap 4 - is a speed tolerance gap for the entire track, which is applicable in full track formatting operations to avoid overflow into the index area. The format operation which writes ID fields begins with the first encountered index and continues to the next index. The actual bytes in Gap 4 depend on the exact rotational speed during the format operation. 3.4.4 Sector Interleaving The ST506/412 format normally uses an interleave factor of 4: That is, sequentially sectored ID numbers are 0, 4, 8, 12, ••••••• , 1, 5, 9, 13, etc. This allows sufficient system turnaround time to process multiple sectors during a single revolution, thus enhancing through-put of typical file read/write operations. Other interleave factors can be used. 3-29/30 M8083 SECTION IV MAINTENANCE 4.1 INTRODUCTION This section contains the information required by the technician for the maintenance of the Disk Drive. 4.2 PREVENTIVE MAINTENANCE Other than a visual inspection to insure that dust accumulation has not restricted air flow, preventive maintenance is limited to general cleaning, which should be accomplished along with scheduled maintenance of the host system. Cleaning of the Disk Drive is done in the following manner (see figure 4-1): 1. Use a soft bristle brush to clean dust from electrical surfaces. Do not use abrasive cleaners and chemical cleaning agents that contain acetone, toluene, xylene, or benzene. These cleaners may cause equipment damage that requires major rpair. 2. Use a lint-free cloth dampened with a solution of 90 percent isopropyl alcohol to clean non-electrical surfaces. 3. Clean away any dust accumulation which could cause speed fluctuations. 4-1 M8083 TBD Figure 4-1. Cleaning the Disk Drive 4-2 MBOB3 SECTION V REMOVAL/REPLACEMENT PROCEDURES 5.1 INTRODUCTION This section contains removal/replacement procedures for the Disk Drive and the Disk Drive PCBA as installed on MAl Basic Four® Series 2000 and Series 7000 systems. Also included are procedures for installing additional disk drives. NOTE Whenever a Disk Drive must be replaced, retain the packing material from the replacement unit for use in repacking and returning the defective unit. 5.2 DISK DRIVE REMOVAL/RELACEMENT - SERIES 2000 SYSTEMS Remove/replace a disk drive in the Series 2000 Base Unit as follows: 1. Shut down the system and turn off the Base Unit power. 2. Unplug the Base Unit power cord from the ac outlet. 3. Unplug all connections to the Base Unit, including all attached peripherals. 4. Insert a screwdriver, or similar device, into the slot at the bottom right-hand side of the Base Unit cover, and push in to disengage the latch. Repeat with the left-hand side, and remove the cover. 5. If necessary, remove the required controller PCBAs to gain access to the cable connectors on the disk drive controller. 6. Unplug the bus and radial ribbon cables from connectors J1 and J2 on the disk drivels (see figure 5-1). 7. Unplug the power cable from connector J3 on the disk drivels (figure 5-1). B. Remove the front and rear facias by pulling up slightly on each plastic card holder until the corresponding facia is disengaged from the card holder. 9. Using a screwdriver, or similar tool, push back the two (2) plastic latches at the bottom rear of the disk drive chassis, while lifting the back of the drive to clear the latches (see figure 5-1). 5-1 M8083 ~ .-.---- ---- - - ----- ---- ~~~- r-..::- .::::-_ I - ---__ ----..::::..--_ I I I .;' /"'- --:::"::..~-:....-_ -----=:-.::~ _"./ --- ~ /" LATCHES // ---~ ~~~_ I I LIGHTLY TWIST SCREW DRIVER TO SPRING LATCH BACK I I I I I LIFT PLATE \ (ONE SIDE AT A TIME) DRIVE MOUNTI~G PLATE PLATE RESTS AND HINGES HERE DRIVE MOUNTING LATCHES (TYPICAL) POWER CABLE PA2 POWER CABLE PAl DRIVE 0 RADIAL CABLE PIN 907604-001 o o DRIVE 1 RADIAL CABLE PIN 907604-002 Figure 5-1. SINGLE DRIVE BUS CABLE PIN 907605-001 OR DUAL DRIVE DAISY CHAIN BUS CABLE PIN 907606-001 Disk Drive Removal/Replacement/Installation, Series 2000 Systems 5-2 M8083 10. Push the drive slightly toward the rear of the CMB so that the flange at the front of the drive clears the slot in the Base Unit bottom panel; lift the disk drive assembly from the Base Unit. 11. Before installing the replacement drive, observe the following: a. If replacing the drive on a single-drive system, be sure that the terminator resistor pack is installed and that the address select jumper plug is installed on the correct pins for Drive Select 0 (see figure 2-7). b. If replacing Drive 0 on a two-drive system, be sure that its terminator resistor pack is removed and that the address select jumper plug is installed on the correct pins for Drive Select 0 (figure 2-7). c. If replacing Drive 1 on a two-drive system, be sure that its terminator resistor pack is installed and that the address select jumper plug is installed on the correct pins for Drive Select 1 (figure 2-7). Use care not to damage CMB components when replacing disk drives.- Do not apply pressure to the top of the drives when installing same in the Base Unit. Using a screwdriver to press on the flange of the drive mounting plate will prevent damage to the CMB. 12. 5.3 Install the replacement drive by following steps 1 thru 10 in reverse order SECOND DISK DRIVE INSTALLATION - SERIES 2000 SYSTEMS The Series 2000 Base Unit may have one or two disk drives installed; i.e., either Drive 0 or Drive 0 and Drive 1. The last drive in the system must have a terminator resistor pack installed. When a second drive (Drive 1) is added, the terminator must be removed from the Drive 0 PCBA and installed on Drive 1. The second drive must also be configured for the proper address (i.e., Drive Select 1). In addition, the "superblock" for the second drive must be modified and a filesystem must be installed. Remove the floppy disk drive and install a second fixed disk drive in the Series 2000 Base Unit as follows: 1. Perform steps 1 thru 6, and step 8, of paragraph 5.2. 2 Unplug the power cable (PA2) from the rear of the floppy drive. 5-3 MBOB3 3. Using a screwdriver, or similar tool, push back the two (2) plastic latches at the bottom rear of the floppy drive chassis, while lifting the back of the drive to clear the latches (see figure 5-1). 4. Push the floppy drive slightly toward the rear of the CMB so that the flange at the front of the drive clears the slot in the Base Unit bottom panel. 5. Raise the floppy drive, unplug the ribbon cable from the CMB, and lift the floppy drive assembly from the Base Unit. 6. Repeat steps 3 and 4 to remove Drive O. 7. Remove the terminator resistor pack from Drive 0 and verify that the terminator is installed on Drive 1 (the new drive). B. Configure Drive 1 for the proper address (Drive Select 1) by installing the address select jumper plug over the correct pins (see figure 2-7). Use care not to damage the CMB components when installing the second fixed disk drive. On some CMBs, R31, near the left-front shock mount, may require bending to clear the chassis of the second drive. Do not apply downward pressure on a drive when installing same in the Base Unit. Using a screwdriver to press on the flange of the drive mounting plate will prevent damage to the CMB. 9. Reverse steps 3 and 4 to reinstall Drive 0 and to install Drive 1. 10. Connect radial cable pIN 907604-001 to connector J4 on disk drive controller and to connector J2 on Drive 0 (see figure 5-1). 11. Connect radial cable pIN 907604-002 to connector J5 on disk drive controller and to connector J2 on Drive 1 (figure 5-1). 12. Connect daisychain bus cable pIN 907606-001 to connector J3 on disk drive controller, connector J1 on Drive 0, and connector J1 on Drive 1 (figure 5-1). 13. Connect power cable PAl to connector J3 on Drive 0, and power cable PA2 to connector J3 on Drive 1 (figure 5-1). 14. Reassemble the Base Unit and connect power cord to ac outlet. nect peripherals and power-up the system. 5-4 Con- M8083 15. Change the Drive 1 superblock to reflect two partitions and install a filesystem on Drive 1 as follows: a. Log on to the system administrstor: ADMIN> usb /dev/rwdl -get desc=driv-el Note that "drivel" is an arbitrary name assigned to a file, used in this example to store the contents of the superblock in the second disk drive. b. Ved (edit) the file, /etc/diskdesc/drivel. that the last two lines read: Modify the file so **partition # : starting block : length in blocks 1: 0: - 1 You should only have to add the last line. with the new edits. c. Save the file with Update the superblock on Drive 1 wi th the parameters described in etc/diskdesc/drive1: ADMIN> usb /dev/rwdl -save -set type=drive1 d. Create the unbuffered raw device and the buffered device with the following commands: ADMIN>makedev /dev/rdrivel U 14 33 ADMIN>makedev /dev/drivel B 14 33 The device names used in this example are rdrivel and drivel, but can be defined using other names. To follow convention, the unbuffered raw device should begin with the Ie tter "r," which stands for raw device. e. Once the device is defined, create a filesystem using the makefs command: ADMIN>makefs /dev/rdrivel f. Verify that the second drive is correctly partitioned by using the "space" command: ADMIN) space /dev/rdrivel The number of blocks returned should reflect the size of the disk drive installed. 5-5 M8083 g. To access the second disk drive. the device must be mounted to a directory on Drive O. The /mnt directory is not recommended for this purpose. Instead use the makedir command to create a new directory for use as the mount point for the second drive (for example, /mntwdl): ADMIN>makedir /mntwdl h. So that the user may access the second drive each time the system is loaded, ved the /etc/sinit file and add the following line at the end of the file: mount /dev/drivel /mntwdl i. Save the edited file. Each time the system is loaded the file is executed and drivel will be mounted to /mntwdl. Again, note that "drivel," as well as tlmntwdltl are arbitrary names. NOTE Path names must be prefixed with /mntwdl (arbitrary name) for the user to access Drive 1. j. 5.4 Add devices /dev/drivel and /dev/rdrivel to the boot partition. This is accomplished by booting to the boot and using the makedev commands as described in this procedure (step d). Refer to the Commands Manual section of the User's Guide for further details on all commands used in this procedure. DISK DRIVE REMOVAL/RELACEMENT - SERIES 7000 SYSTEMS The Series 7000 Primary Mainframe and Add-on Disk Modules may receive from one to four disk drives. The disk drives in each Mainframe or Add-on Module are numbered in a logical sequence from (Disk) a to (Disk) 3. When replacing the only or last drive in the Mainframe or Add-on Module, be sure that the drive's terminator resistor pack is installed. When not replacing the last drive, be sure that the terminator is removed. All replacement drives must have their address select jumper plug installed on the correct pins (i.e., for Drive Select 0, 1, 2, or 3). Remove/replace a disk drive in the Series 7000 Primary Mainframe or Add-on Disk Module as follows: 5.4.1 General Procedures 1. Shut down the system and switch off the circuit breaker on the ACDU/s. 2. Unplug the Mainframe/Add-on Module power cable/s from the ac outlet. 3. Remove the Mainframe/Add-on Module front and top panels as shown in figure 5-2. Remove left or right side panels as required. 5-6 M8083 USE SLOT-HEAD SCREWDRIV£R TO PR£~S AND LlF"I TOP PANEL FILLER / /~. f( @~ \ I I I QUARTER TuRN EACH ~I 0 E 11-\ E N T1LT FORWARD AND LIFT ClUT Figure 5-2. Removal of Front, Top, and Side Panels, Series 7000 Systems 5-7 M8083 5.4.2 Removal/Replacem~nt of Disk 0 or Disk 1 Remove/replace Disk 0 or Disk 1 on right-hand mounting plate as follows: 1. Disconnect power cables from connector J3 on Disk 0 and Disk 1 (see figure 5-3). Tag power cable for Disk O. 2. Disconnect Disk 1 power supply (figure 5-3) from disk ACDU. PLATE r-IlUNTI NG SCREWS (UPPER) DISK 1 (DISK 2 ON LE FT -HAND fi«)UNTING PLATE) TO ctl REMOVE o J3 POWER SUPPLY (DISK 1) L---H---,-= ~: PLATE f«lUNTING '---------~~ SCREWS (LOWER) DISK 0 (DISK 3 ON LEFT-HAND t«lUNTI NG PLATE) NOTE: ORIENTATION OF DRIVE CONNECTORS JI-J3 IS INVERTED ON DISKS 2 &3 Figure 5-3. Disk Drive Removal/Replacement/Installation, Series 7000 Systems 5-8 MBOB3 3. Disconnect the daisychain bus cable from connector Jl and radial cables from connector J2 on Disk 0 and Disk O. Identify cables for Disk O. 4. Loosen the upper and lower plate-mounting screws with a 1/4-inch nut driver. Do NOT remove. The screw holes in the plate are slotted. 5. Grasp the plate firmly and slide it toward the rear of the unit. 6. Lift the plate out of the unit and lay it on a level, secure surface, drive side up. Be careful; the plate is heavy. 7. Carefully position the plate so that the disk drive to be removed extends over the edge of the level surface. This provides easy access for removal of the screws •. B. While holding the disk drive to be removed with your hand, remove the four screws and washers from the underside of the panel and the plastic spacers from the upper side of the panel at each of the four locations. 9 Lift the drive off the plate. 10. 11. 5.4.3 Before installing the replacement drive, observe the following: a. If replacing the only or last drive in a module, be sure that the terminator resistor pack is installed and that the address select jumper plug is installed on the correct pins for Drive Select 0, 1, 2, or 3 (see figure 2-7). b. If not replacing the last drive in a module, be sure that the terminator resistor pack is removed and that the address select jumper plug is installed on the correct pins for Drive Select 0, 1, or 2 (see figure 2-7). Install the replacement drive by following steps 1 through 9 in reverse order. Insert the screw connected to the ground mount first. Removal/Replacement of Disk 2 or Disk 3 Remove/replace Disk 2 or Disk 3 on left-hand mounting plate as follows: 1. To access the lower-left plate-mounting screw, remove the Magnetic Tape Cartridge Streamer (MTCS) drive as follows: a. Remove cartridge from the MTCS drive. b. Disconnect power cable from MTCS connector P2 and bus cable from MTCS connector PI (see figure 5-4). c. Remove the four hex-head screws on the bottom of the MTCS using a 1/4-inch nut driver. d. Remove MTCS drive from Mainframe/Disk Module. 5-9 M8G83 P2 /' II I I • Figure 5-4. REMOVE 4 SCREWS TO' REMOVE MTCS. MTCS Removal/Replacement 5-10 M8083 5 •. 5 2. Perform steps 1 through 11 of paragraph 5.4.2 to. remove/replace Disk 2 or Disk 3. 3. Replace the MTCS as follows: a. Position MTCS drive and insert the four hex-head mpounting screws. Finger tighten the screws. b. Replace the front cover and bring the MTCS drive flush with the opening in the front cover. This can be accomplished by using one of three methods: • When inserting the MTCS, slide it as far forward as the slotted screw holes allow. Replace the front cover and allow it to push the MTCS into the proper position. Tighten the screws under the MTCS by working through the open side panel; or by carefully removing the front panel, tightening the MTCS screws, and replacing the front panel. • If the side panel(s) of the unit are removed, replace the front cover and carefully reach through the side opening and slide the drive forward until it is flush with the front cover. Tighten the screws under the MTCS by working through the open side panel. Replace the side panel(s). • Replace the front cover and pull the MTCS forward by inserting your finger in the cartridge space and pulling the MTCS forward. Tighten the screws under the MTCS. DISK DRIVE INSTALLATION - SERIES 7000 SYSTEMS The Series 7000 Primary Mainframe and Add-on Disk Modules may receive from one to four disk drives. The disk drives in each Mainframe or Add-on Module are numbered in a logical sequence from (Disk) 0 to (Disk) 3. When installing an additional drive in the Mainframe or Add-on Module (i.e., the last drive in the sequence), be sure that the drive's terminator resistor pack is installed. The preceding drive must have its terminator removed. All drives added to a Mainframe or Add-on Module must have their address select jumper plug installed on the correct pins (i.e., for Drive Select 0, 1, 2, or 3). Install a second, third, or fourth disk drive in the Series 7000 Primary Mainframe or Add-on Disk Module as follows: 1. Perform steps 1 thru 3 of paragraph 5.4.1. 2. If adding Disk 1, proceed as follows: a. Perform applicable procedures in steps 1 thru 7 of paragraph 5.4.2 to remove right-hand disk mounting plate. b. Remove screws that secure cover for Disk 1 Power Supply (see figure 5-3). 5-11 M8083 c. Install Power Supply PiN 400446-002 on mounting plate using hardware supplied. d. Connect two-conductor ac power cable PiN 907747-001 to connector P3 on Power Supply. e. Install address select jumper plug over correct pins on Disk Drive PCBA for Drive Select 1 (see figure 2-7). f. If Disk 1 is to be last drive in sequence, be sure that terminator resistor pack is installed on Disk Drive PCBA. g. Install drive on mounting plate (above Disk 0) using hardware supplied. h. Connect hard-wired power cable from Disk 1 Power Supply to connector J3 on Disk 0 (see figure 5-3). i. Install cover on Power Supply using screws removed in step 2b. j. Remove Disk 0 from mounting plate as instructed in steps 8 and 9 of paragraph 5.4.2. k. Remove terminator resistor pack from Disk 0 and reinstall drive on mounting plate. 1. Reinstall right-hand mounting plate within Mainframe or Add-on Module. m. Connect two-conductor ac power cable (from Disk 1 Power Supply) to ACDU. n. Attach connector PB on daisychain bus cable (existing cable) to connector Jl on Disk O. Attach connector PC to connector Jl on Disk 1. o. Attach radial cable from Micro-Peripheral Controller (MPC) PCBA, connector Jl, to connector J2 on Disk O. Attach radial cable from J2 on MPC PCBA to J2 on Disk 1. 3. Plug the Mainframe/Add-on Module power cable/s into the ac outlet. 4. Power-up the Series 7000 and load the operating system. 5. Refer to section 5 of the MAl BOSS/VS Utilities User Guide, MSI02, for procedures on adding disks to the family of system drives. 6. If adding Disk 2 and/or Disk 3, proceed as follows: a. Using supplied left-hand disk mounting plate, disk drivels, power supply, cables, and attaching hardware, perform step 1 and steps 2c thru 2m for Disk 2 and/or Disk 3. 5-12 M8083 5.6 b. Attach connector PD on daisychain bus cable (existing cable) to connector Jl on Disk 2. Attach connector PE to connector Jl on Disk 3. c. Attach radial cable from Micro-Peripheral Controller (MPC) PCBA, connec tor J3, to connector J2 on Disk 2. At tach radial cable from J4 on MPC PCBA to J2 on Disk 3. d. Perform steps 3 thru 5. REMOVAL/REPLACEMENT OF DISK DRIVE PCBA Removal of the Disk Drive PCBA is accomplished with the Disk Drive removed from the mounting plate. Refer to paragraph 5.4.2 or 5.4.3 for Disk Drive removal procedures. To remove the PCBA perform the following steps: 1. Remove the grounding lug J4 from the frame assembly. 2. Remove the three "E" clip retainers for the shock mounts. 3. Lift the frame off the drive. LED cable and its connector. 2. Remove the PCBA. Use care not to damage the front panel To replace the Disk Drive PCBA, repeat the above steps in reverse order. 5-13/14 M8083 SECTION VI ILLUSTRATED PARTS LISTS 6.1 INTRODUCTION This section provides the parts list information for the Printed Circuit Board Assembly and the Disk Drive Mechanical Kit. 6.2 INDEX OF ASSEMBLIES The following is an index of the assemblies covered in this section (the RDA is a sealed unit and not repairable): ASSEMBLY Printed Circuit Board Assembly (P/N 59055) Mechanical Kit (P/N 50461) RDA (P/N 50454) 6-1 FIGURE TABLE 6-1 N/A N/A 6-1 6-2 N/A M8083 JA JD JC Figure 6-1. J7 Printed Circuit Board Assembly (PIN 59055) 6-2 M8083 Table 6-1.- Printed Circuit Board Assembly (P/N 59055). PART NUMBER 30091 30104 30108 40109 40114 40119 47015 48010 50487 59056 59058 REFERENCE DESIGNATION DESCRIPTION Adhesive, Tak Pack Adhesive Accelerator Shrink Tubing PVC 3/8 ID Plug, Shorting Pin, IC Post, Feedthru MCU, Z-8 4K, 1ZMhz Crystal, 1ZMhz, HC-18 La. bel, PCB Asm Fabrication, PCB Schematic, Control Module U43 Y1 CAPACITORS 43000 43004 43006 43008 43010 43012 43014 43018 43030 43300 43301 Capac, Capac, Capac, Capac, Capac, Capac, Capac, Capac, Capac, Capac, Capac, 43552 Capac, 10. OUF, 25V, Bulk 43560 43562 43600 Capac, 2200UF, 16V Capac, 220UF Elect, 16V Min Capac, O.OOIUF, 10% X 7R, 50V 43608 43612 43614 43618 43624 Capac, Capac, Capac, Capac, Capac, 10.0PF, 5% (NPO) , 50V 22.0PF, 5% (NPO) , 50V 33.0PF, 5% (NPO) , 50V 47.0PF, 5% (NPO) , 50V 68.0PF, 5% (NPO), 50V 100PF, 5% (NPO), 50V 150PF, 5% (NPO), 50V 330PF, 5% (NPO), 50V 3900pf, 5%, NPO 50V O.OlUF, +80/-20%, 50V 0.10UF, +80/-20%, 50V 0.0047UF, 10% X 7R, 50V O.OlUF, 10% X 7R, 50V 0.015UF, 10% X 7R, 50V 0.033UF, 10% X 7R, 50V O.lUF, 10% (NPO) , 50V 6-3 C1 C40, 84, 85 C11 C37 C128 C42, 88, 91 C12, 43 C44, 45, 46, 51, 52 C67, 68 C6, 7, 13, 14, 17, 19, 22, C2, 3, 18, 23, 26, 34, 48, 49, 66, 71, 72, 73, 81, 86, 87, 89, 90, 93, 94, 100, 102, 103, 104, 107, 108, 109, 110, 111, 113, 116, 117, 118, 120, 121, 122, 123, 124, 125, 126, 127 C55, 70, 76, 82, 96, 97, 98, 105 C29, 83 C25, 30 C20, 21, 24, 27, 50, 59, 62, 64, 65, 79, 99, 114 C32, 33, 35, 36, 53, 54 C39, 41, 92, 106 C61, 69 C10 C4, 5, 8, 9, 15, 16, 28, 31, 47, 60, 63, 75, 78, 115 M8083 Table 6-1. Printed Circuit Board Assembly (P/N 59055) continued PART ~UMBER REFERENCE DESIGNATION DESCRIPTION CONNECTORS 40104 40120 40123 J4 J5 J3 Conn, 28 Contact, Fem Conn, 24 Contact, Fem Conn 4 Contact, Fem DIODES 46001 Diodes Switching, 1N914 46002 46004 46005 46007 Diodes Schottky, 1N6263 Diodes, 1N4001, Pwr, 50V (DD-41) Diodes, 80SQ030, Scottky Pwr Diodes, 1N5818 CR1, 2, 5, 6, 7, 8, 10, 12, 13, 15, 17, 18, 19, 20, 25 CR16 CR3, 4, 14 , 22 CR23 CR9, 21, 24 INTEGRATED CIRCUITS 44010 44011 44051 44053 44058 44062 44067 44202 44203 44251 44300 44301 44302 45001 45003 45005 45007 45008 45009 45013 45014 45052 45054 45056 45060 47011 47013 IC, 26LS31 QD, Hgh Spd Ln Drvr IC, 26LS32 QD, Diff Ln Recv SOIC14, 74LSOOD QD, 2-In ND Gate SOIC14, 74LS74AD, DL-D TP ET F-F SOIC20, 74LS240D OCT INV BUF 3S SOIC14, 74LS04D, Hex Inverter SOIC14, 74LS02D, QD 2-in NOR GA IC, QD 7438, 2-in NAND Buf (OC) IC, 7445 BCD, DECI/DECD DR (OC) SOIC14, 7406D, HX INV Buf/Dr (OC) IC, Quad, Ex-Dr ECL, 10107 IC, 10131 ECL Dual D F-F IC, Triple Rec ECL, 10114 IC, LM318N, Hi Speed OP-AMP IC, Ref 2.5V, LM336BZ-2.5 IC, OP-AMP, LF356 IC, MC1350PIF AMP IC, DAC0832 88TuP, D-Buf D-A Con IC, Volt Reg Low P. 8V, 78L08 IC, LF347, WD BDWTH QD JFT OP-AM IC, TBA810P, 7W Audio Amp SOICI4, LM324D, 6-P S-S OP-M1P SOICI4, LM339D, QD Volt Comparat SOICI4, NE592D, Video Amplifier SOIC14, HEF4066B, QDRUF Bilt Swt IC, Z8-2K, MCU 8Mhz 40-Pin DIP IC, Gate Array, Servo Control 6-4 U4 U11 U33 U41 U32 U39 U36 U35, 38 U29, 30 U27, 34, 46, 47 U15 U23 U17 Ul CRII U22 U3, 7 U42 Ql U14 U9, 10 U6, 12, 18, 31 U5, 20, 40 48 U2, 8, 16 U13, 19, 28 U45 U44 M8083 Table 6-1. PART NUMBER Printed Circuit Board Assembly (PiN 59055) continued REFERENCE DESIGNATION DESCRIPTION RESISTORS 41001 41009 41025 41027 41028 41032 41033 41035 41037 41038 41041 41043 41044 41046 41047 41049 Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, 10.0 Ohms, 1%, 0.25W 21.5 Ohms, 1%, 0.25W 100.0 Ohms, 1%, 0.25W 121.0 Ohms, 1%, 0.25W 133.0 Ohms, 1%, 0.25W 196.0 Ohms, 1%, 0.25W 215.0 Ohms, 1%, 0.25W 261.0 Ohms, 1%, 0.25W 316.0 Ohms, 1%, 0.25W 348.0 Ohms, 1%, 0.25W 464.0 Ohms, 1%, 0.25W 562.0 Ohms, 1%, 0.25W 619.0 Ohms, 1%, 0.25W 750.0 Ohms, 1%, 0.25W 825.0 Ohms, 1%, 0.25W 1K Ohm, 1%, 0.25W 41052 41056 41061 41062 41063 41066 41067 41068 41069 41071 41073 Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, 1.33K Ohms, 1%, 0.25W 1.96K Ohms, 1%, 0.25W 3.16K Ohms, 1%, 0.25W 3.48K Ohms, 1%, 0.25W 3.83K Ohms, 1%, 0.25W 5.11K Ohms, 1%, 0.25W 5.62K Ohms, 1%, 0.25W 6.19K Ohms, 1%, 0.25W 6.81K Ohms, 1%, 0.25W 8.25K Ohms, 1%, 0.25W 10K Ohms, 1%, 0.25W 41075 41076 41079 41080 41084 41089 41090 41093 41097 41100 41106 41108 41125 41211 Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, 12.1K Ohms, 1%, 0.25W 16.2K Ohms, 1%, 0.25W 17.8K Ohms, 1%, 0.25W 19.6K Ohms, 1%, 0.25W 28.7 Ohms, 1%, 0.25W 46.4K Ohms, 1%, 0.25W 51.1K Ohms, 1%, 0.25W 68.1K Ohms, 1%, 0.25W lOOK Ohms, 1%, 0.25W 133K Ohms, 1%, 0.25W 237K Ohms, 1%, 0.25W 287K Ohms, 1%, 0.25W 76.8K Ohms, 1%, 0.25W 27.4 Ohms, 1%, 0.25W 6-5 R116 R109 R2, 43, 55, 59, 66, 76, 78 R98 R7, 8 R9, 10, 103, 106 R69 R86 RS, 6, 45, 68, 79, 80, 95, R99 R23, 24, 96, 96, 124 R11, 12, 13, 56 Rl19 R29 R62 R14, 15, 16, 19, 50, 51, 61, 64, 65, 83, 100, 105, 108,117,128,135,143 R44 Rl14 R1, 3, 4," 49, 52, 63, 115 R17, 18, 21, 22 Rl18 R92, 107 R130 R73, 93 R48 R38 R20, 33, 42, 47, 58, 77, 85, 94, 101, 104, Ill, 120, 123, 125, 138, 139, 142 R60 R131 R54, 75 R57 R133, 134 R81 R88 R129 R132, 140 R34, 90 Rll0 R122 R76 R25, 28 M8083 Table 6-1. PART NUMBER Printed Circuit Board Assembly (P/N 59055) continued REFERENCE DESIGNATION DESCRIPTION RESISTORS 41260 41284 41291 41292 41557 41560 41563 41564 41566 41572 41573 41574 41575 42000 42007 42010 42016 42045 42046 42100 42101 42102 42106 42109 42111 42117 42121 42131 42152 42157 Resis, 3.01K Ohms, 1%, 0.25W Resis, 30.1K Ohms, 1%, 0.25W Resis, 59.0K Ohms, 1%, 0.25W Resis, 64.9K"Ohms, 1%, 0.25W Resis, 18.2K Ohms, 1%, 0.25W Resis, 4.99K Ohms, 1%, 0.25W Resis, 10.OM Ohms, 1%, 0.25W Resis, 26.7K Ohms, 1%, 0.25W Resis, 10.7K Ohms, 1%, 0.25W Resis, 13.7K Ohms, 1%, 0.25W Resis, 57.6K Ohms, 1%, 0.25W Resis, 143K Ohms, 1%, 0.25W Resis, 19.1K Ohms, 1%, 0.25W Resis, 0.1 Ohms, 3%, 2W Resis, 1.00 Ohm, 5%, 0.25W Resis, 0.5 Ohm, 1%, 1W Resis, 1.00M Ohm, 5%, 0.25W Resis, 309K Ohms, 5%, 0.25W Resis, 200 Ohms, 5%, 0.50W Resis, DIP TTL-ECL Xlator Network Resis, DIP 14-Pin, 220/330 Resis, Network, 470 Ohms, DIP Resis, SIP, 1.0K, 6-Pin Ind. Resis, SIP, 10K, 6-Pin IND Resis, SIP, 68K, 6-Pin IND Resis, SIP, 680, 6-Pin COM Resis, SIP, 10K, 6-Pin COM Resis, SIP, 2.2K, 8-Pin COM Resis Netw, 180 Ohms, SIP, 8-Pin-4R Resis, SIP, 10K, 2%, 8-Pin IND R30 R70, 71, 72, 136 R36, 37 R102, 126 R74 R35, 82 Rl12 R46 R53 R39, 40 R89 R91 R84 R87 R26, 27 R31, 32 R113, 141 R41 R121 U21 U25 U24 RP5 RPl, 2, 7,12 RP8 RPII RP6, 9, 10 RP14 RP3 RP4, 13 TRANSISTORS 46102 46103 46107 46108 46110 46111 46112 46151 46152 46153 Tran, Tran, Tran, Tran, Tran, Tran, Tran, Tran, Tran, Tran, 2N3906 Quad 2NPN/2PNP 6700 IRFD123 N Ch Fet 4-Pin DIP IRFD9123 P Ch Fet 4-Pin DIP PN4393, N-CH JFET, TO-92 IRF521 , N-CH HEXFET TD220 IRF9521, P-CH HEXFET, T0220 2N3904, NPN SOT-23 2N3906, PNP SOT-23 SOT-23, NPN 2222A 6-6 Q20 U26, 37 Q8, 18 Q15, 19 Q9 Q5, 6, 7 Q2, 3, 4 QI0, 22 Q14, 23 Ql1, 12, 13, 16, 17 M8083 Table 6-2. PART NUMBER Mechanical Kit (P/N 50461) REFERENCE DESIGNATION DESCRIPTION RESISTORS 41266 41267 41268 41269 41279 41280 41281 41282 41283 41284 4128S 41SSS 41SS6 41SS7 41SS8 41S60 41S7S 41S76 41S77 41S78 Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, Resis, S.36K S.90K 6.49K 7.1SK 18.7K 20.5K 22.6K 24.9K 27.4K 30.1K 33.2K 17.4K 22.1K 18.2K 20. OK 4.99K 19.1K 6.34K 6.6SK 6.98K Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, Ohms, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, 1%, O.2SW 0.2SW 0.25W O".2SW O.2SW 0.2SW 0.2SW 0.2SW 0.2SW 0.2SW 0.2SW 0.2SW 0.2SW 0.2SW 0.2SW 0.25W 0.2SW 0.25W 0.2SW 0.2SW MISCELLANEOUS 30033 30073 30078 30088 30110 30144 30147 30148 40106 S0091 S0284 S0288 S04S8 S0463 S0468 50475 SCR 4-40 X 0.2S PAN PHIL E-Ring Washer, Lock Split #6 Set Thread Locking Compound Screw, Socket Head, 6-32 X 0.18 4-40 X 3/16 Flthd Rlvd Phillips Washer, FIt Sm Pattern Washer, Lock Ext Tooth Ground Lug ASM Face Plate Label Warranty Washer ASM Chassis (SC2) Label, Ser No. PCB Insulator Disk Drive ASM-Tab 6-7/8 R2 R2 R2 R2 Rl R1 R1 R1 R1 R1 R1 R1 R1 R1 R1 R2 R1 R2 R2 R2 M8D83 SECTION VII SCHEMATICS 7.1 INTRODUCTION The schematic diagrams for the 5-1/4 Inch Fixed Media Disk Drive are located in figure 7-1. 7-1 o ---.·~~.~l~.~_==!===] ___._.._:._~~~~~_~~~~.=[ ~ ~=.===~.~=.=.~ :'1 ~.~_==--=~~.=: ~_~=_==I_-·_. .__=r=__ ~_==---T 3 P12S "5~' t'1j D "5t'~ ~ . IlW fn : - 4 2 ze ~r" • N oo""d I'P. --H - < t "" 22l'1flUF' 3~ P20 P21 P22 P30 3" 33 5 _ (4C 1'1 213 (SDI \ 08 C '10~~~~~1< 3 Eo -=.!.Jf.'!'.~i#ULTI' I RP10 "SU 'O::r XTAL P 13 181 Pll 24 22 40 P36 vee In-= ' - t1 CD I N fn CI) CI) l0 (66 "~ n 0 t1 t j ~ t1 t1 n ~ ~ Q) B S "::r CI) CI) fu a-. - tD fn R112 10N 3 D S 1 8 1 . F.: PH4393 " EDGE DETECTOR ./ L504 1.139 0 : RP7 10K -i ~lJ.~i RPI6 ______ ... _____ - '.' _____ ,01. -1"- - -.:,----._-[-- -.-.- --'-1 ---.- - - - ._- "._------ ---- ...-.--. -.-. --... ..----. -'-" l. . I .,~ I D ~ '" ell IC 11 12 ~ RP8 5 G 00 I I-- It' :~14 IN 4001 .. C76 1'1o • . 2J.1 TP16 , 4A MTRGRD NOTES; I l_. 1,'1 ___ . _ ,, __ ~-=.~.~: !~ - =.. : ~~. ] ...~ ___ .. <1 ·_~~.~.~r===--=}l~== 1"' 8 all (9CS) ...- 1. SOURSCE REFERENCE = 59858 REV/H 2. SIGHAL DESIGNI\TIONS IHCLUDE SHEET LOCI\TION DI\~ (IN PI\REHTHESES) 3. RESISTOR VALUES IN OHHS AND CI\PAACITANCE VI\LUES IH HICROA FARADS. UNI,ESS OTIIER"I SE SPECIFIED 4. 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