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Package Mechanical Specifications
9.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component
keep-out zone requirements. A thermal and mechanical solution design must not
intrude into the required keep-out zones. Do not contact the Test Pad Area with
conductive material. Decoupling capacitors are typically mounted to either the topside
or land-side of the package substrate. See Figure 9-2 through Figure 9-3 for keep-out
zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in.
9.3
Package Loading Specifications
Table 9-1 provides load specifications for the processor package. These maximum
limits should not be exceeded during heatsink assembly, shipping conditions, or
standard use condition. Exceeding these limits during test may result in component
failure. The processor substrate should not be used as a mechanical reference or loadbearing surface for thermal solutions.
.
Table 9-1.
Processor Loading Specifications
Parameter
Maximum
Notes
Static Compressive Load
890 N [200 lbf]
1, 2, 3, 5
Dynamic Load
1779 N [400lbf] [max static compressive + dynamic load]
1, 3, 4, 5
Notes:
1.
These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2.
This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism
(ILM).
3.
These specifications are based on limited testing for design characterization. Loading limits are for the
package constrained by the limits of the processor socket.
4.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
5.
See Intel® Xeon® Processor E5-2400 v2 Product Family Thermal/Mechanical Design Guide (TMDG) for
minimum socket load to engage processor within socket.
9.4
Package Handling Guidelines
Table 9-2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Table 9-2.
9.5
Package Handling Guidelines
Parameter
Maximum Recommended
Shear
70 lbs
Tensile
25 lbs
Torque
35 in.lbs
Notes
Package Insertion Specifications
The processor can be inserted into and removed from an 1356 socket 15 times. The
socket should meet the 1356 requirements detailed in the Intel® Xeon® Processor E52400 v2 Product Family Thermal/Mechanical Design Guide (TMDG).
Intel® Xeon® Processor E5-2400 v2 Product Family
Datasheet Volume One
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