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Intel® Compute Module MFS5000SI TPS 1. 0BIntroduction Introduction This Technical Product Specification (TPS) provides board-specific information detailing the features, functionality, and high-level architecture of the Intel® Compute Module MFS5000SI. The Intel® 5000 Series Chipsets Server Board Family Datasheet should also be referenced for more in-depth detail of various board subsystems, including chipset, BIOS, System Management, and System Management software. 1.1 Chapter Outline This document is divided into the following chapters: 1.2 Chapter 1 – Introduction Chapter 2 – Product Overview Chapter 3 – Functional Architecture Chapter 4 – Connector / Header Locations and Pin-outs Chapter 5 – Jumper Block Settings Chapter 6 – Product Regulatory Requirements Appendix A – Integration and Usage Tips Appendix B – BMC Sensor Tables Appendix C – Post Error Messages and Handling Appendix D – Supported Intel® Modular Server System Intel® Compute Module Use Disclaimer Intel® Modular Server components require adequate airflow to cool. Intel ensures through its own chassis development and testing that when these components are used together, the fully integrated system will meet the intended thermal requirements. It is the responsibility of the system integrator who chooses not to use Intel-developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the system does not operate correctly when used outside any of their published operating or non-operating limits. Revision 1.4 Intel order number: E15154-007 1