Download Intel Core i7 Processor I7-940

Contents
1
Introduction .............................................................................................................. 9
1.1
Terminology ..................................................................................................... 10
1.2
References ....................................................................................................... 11
2
Electrical Specifications ........................................................................................... 13
2.1
Intel® QPI Differential Signaling ......................................................................... 13
2.2
Power and Ground Lands.................................................................................... 13
2.3
Decoupling Guidelines ........................................................................................ 13
2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling......................................................... 14
2.4
Processor Clocking (BCLK_DP, BCLK_DN) ............................................................. 14
2.4.1 PLL Power Supply ................................................................................... 14
2.5
Voltage Identification (VID) ................................................................................ 14
2.6
Reserved or Unused Signals................................................................................ 17
2.7
Signal Groups ................................................................................................... 18
2.8
Test Access Port (TAP) Connection....................................................................... 19
2.9
Platform Environmental Control Interface (PECI) DC Specifications........................... 20
2.9.1 DC Characteristics .................................................................................. 20
2.9.2 Input Device Hysteresis .......................................................................... 21
2.10 Absolute Maximum and Minimum Ratings ............................................................. 21
2.11 Processor DC Specifications ................................................................................ 22
2.11.1 DC Voltage and Current Specification ........................................................ 23
2.11.2 VCC Overshoot Specification .................................................................... 29
2.11.3 Die Voltage Validation ............................................................................. 30
3
Package Mechanical Specifications .......................................................................... 31
3.1
Package Mechanical Drawing............................................................................... 31
3.2
Processor Component Keep-Out Zones ................................................................. 34
3.3
Package Loading Specifications ........................................................................... 34
3.4
Package Handling Guidelines............................................................................... 34
3.5
Package Insertion Specifications.......................................................................... 34
3.6
Processor Mass Specification ............................................................................... 35
3.7
Processor Materials............................................................................................ 35
3.8
Processor Markings............................................................................................ 35
3.9
Processor Land Coordinates ................................................................................ 36
4
Land Listing............................................................................................................. 37
5
Signal Definitions .................................................................................................... 73
5.1
Signal Definitions .............................................................................................. 73
6
Thermal Specifications ............................................................................................ 77
6.1
Package Thermal Specifications ........................................................................... 77
6.1.1 Thermal Specifications ............................................................................ 77
6.1.2 Thermal Metrology ................................................................................. 81
6.2
Processor Thermal Features ................................................................................ 82
6.2.1 Processor Temperature ........................................................................... 82
6.2.2 Adaptive Thermal Monitor........................................................................ 82
6.2.3 THERMTRIP# Signal ............................................................................... 85
6.3
Platform Environment Control Interface (PECI) ...................................................... 85
6.3.1 Introduction .......................................................................................... 85
6.3.2 PECI Specifications ................................................................................. 87
6.4
Storage Conditions Specifications ........................................................................ 88
7
Features .................................................................................................................. 89
7.1
Power-On Configuration (POC) ............................................................................ 89
Datasheet
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