Download Intel Xeon X3370

Contents
1
Introduction ............................................................................................................ 11
1.1
Terminology ..................................................................................................... 11
1.1.1 Processor Terminology ............................................................................ 12
1.2
References ....................................................................................................... 13
2
Electrical Specifications ........................................................................................... 15
2.1
Power and Ground Lands.................................................................................... 15
2.2
Decoupling Guidelines ........................................................................................ 15
2.2.1 VCC Decoupling ..................................................................................... 15
2.2.2 Vtt Decoupling ....................................................................................... 15
2.2.3 FSB Decoupling...................................................................................... 16
2.3
Voltage Identification ......................................................................................... 16
2.4
Market Segment Identification (MSID) ................................................................. 18
2.5
Reserved, Unused, and TESTHI Signals ................................................................ 18
2.6
...................................................................................................................... 19
2.7
Voltage and Current Specification ........................................................................ 19
2.7.1 Absolute Maximum and Minimum Ratings .................................................. 19
2.7.2 DC Voltage and Current Specification ........................................................ 20
2.7.3 VCC Overshoot ....................................................................................... 24
2.7.4 Die Voltage Validation ............................................................................. 24
2.8
Signaling Specifications...................................................................................... 25
2.8.1 FSB Signal Groups.................................................................................. 25
2.8.2 CMOS and Open Drain Signals ................................................................. 27
2.8.3 Processor DC Specifications ..................................................................... 27
2.8.3.1 GTL+ Front Side Bus Specifications ............................................. 29
2.8.4 Clock Specifications ................................................................................ 29
2.8.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 29
2.8.6 FSB Frequency Select Signals (BSEL[2:0])................................................. 30
2.8.7 Phase Lock Loop (PLL) and Filter .............................................................. 30
2.8.8 BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 30
2.8.9 BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 32
2.9
PECI DC Specifications ....................................................................................... 33
3
Package Mechanical Specifications .......................................................................... 35
3.1
Package Mechanical Drawing............................................................................... 36
3.1.1 Processor Component Keep-Out Zones ...................................................... 40
3.1.2 Package Loading Specifications ................................................................ 40
3.1.3 Package Handling Guidelines.................................................................... 40
3.1.4 Package Insertion Specifications............................................................... 40
3.1.5 Processor Mass Specification .................................................................... 41
3.1.6 Processor Materials................................................................................. 41
3.2
Processor Markings............................................................................................ 41
3.2.1 Processor Land Coordinates ..................................................................... 43
4
Land Listing and Signal Descriptions ....................................................................... 45
4.1
Processor Land Assignments ............................................................................... 45
4.2
Alphabetical Signals Reference ............................................................................ 68
5
Thermal Specifications and Design Considerations .................................................. 75
5.1
Processor Thermal Specifications ......................................................................... 75
5.1.1 Thermal Specifications ............................................................................ 75
5.1.2 Thermal Metrology ................................................................................. 80
5.2
Processor Thermal Features ................................................................................ 80
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
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