Download Sun Fire E6900/E4900 Systems Service Manual

B.2
Boards and Assemblies
B.2.1
CPU/Memory Boards
1. Requirement—Install CPU/Memory boards in their designated slots:
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Slots SB0–SB5 for the Sun Fire E6900 system
Slots SB0, SB2, and SB4 in the Sun Fire E4900 systems
2. Requirement—For the Sun Fire E6900 system, the CPU/Memory boards are
populated from right to left, beginning with SB5 and ending with SB0. For the
Sun Fire E4900 systems, the CPU/Memory boards are populated from right to
left, beginning with SB2 and ending with SB0.
3. Requirement—For the Sun Fire E4900 systems, if you remove two CPU/Memory
boards, you must install a filler board in one board slot and install a filler panel
covering the second board slot within one minute of removing the boards to
prevent overheating. You must not install two filler panels.
4. Requirement—Mixing CPU/Memory board in the same chassis is supported.
B.2.1.1
Memory Modules
1. Requirement—Use the DIMM part number assigned to these systems. Do not use
other types of memory modules.
2. Requirement—Insert DIMMs in a bank across from the controlling CPU
processor.
3. Requirement—Each DIMM bank must be fully populated with the same capacity
DIMM.
4. Requirement—Install the larger capacity DIMMs into banks before installing the
smaller capacity DIMMs into banks.
5. Requirement—The minimum number of DIMMs you can install per CPU
processor is four DIMMs or one bank.
6. Requirement—If the number of CPU processors on each CPU/Memory board are
the same, place DIMM banks on CPU/Memory boards that have fewer populated
DIMM banks before placing DIMMs on CPU/Memory boards that already have
more populated DIMM banks.
Appendix B
System Serial Number Locations and Rules for System Configuration
B-5