Download ADC Phase 5 Microprocessor AD-170 Specifications

AD7822/AD7825/AD7829
6.60
6.50
6.40
20
11
4.50
4.40
4.30
6.40 BSC
1
10
PIN 1
0.65
BSC
1.20 MAX
0.15
0.05
COPLANARITY
0.10
0.30
0.19
0.20
0.09
0.75
0.60
0.45
8°
0°
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-153-AC
Figure 34. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
1.280 (32.51)
1.250 (31.75)
1.230 (31.24)
24
13
1
12
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
PIN 1
0.100 (2.54)
BSC
0.210
(5.33)
MAX
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
0.015
(0.38)
MIN
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.060 (1.52)
MAX
0.015 (0.38)
GAUGE
PLANE
SEATING
PLANE
0.005 (0.13)
MIN
0.430 (10.92)
MAX
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
COMPLIANT TO JEDEC STANDARDS MS-001-AF
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
Figure 35. 24-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-24-1)
Dimensions shown in inches and (millimeters)
Rev. C | Page 21 of 28
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)