Download Samsung SCH-A302 service manual
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Cellular Phone SCH-A302 SERVICE Cellular Phone Manual CONTENTS 1. Specification 2. Trouble Shooting 3. Tune-up Procedure & Test Procedure list 4. Frequency Synthesizer Circuit & Spurious Radiation Suppression Circuit 5. NAM Programming 6. Electrical Parts List 7. Exploded Views & Parts List 8. Block Diagram 9. PCB Diagrams 10. Circuit Description & Circuit Diagrams ELECTRONICS ©Samsung Electronics Co.,Ltd. December. 2001 Pinted in Korea. Code No.: GH68-02488A BASIC. 1. SCH-A302 Specification (REF TIA/EIA/IS-137-A-1) 1. GENERAL ITEM CDMA TX Freq. Range 824 ~ 849 MHz RX Freq. Range 869 ~ 894 MHz Channel Bandwidth 1.23 MHz Channel Spacing 30 kHz Number of Channels 20 FA Duplex Separation 45 MHz In/Output Impedance 50 Ω TX Intermediate Freq. 130.38 MHz RX Intermediate Freq. 85.38 MHz TX Local Freq. 1st(FTX + 130.38 MHz) 2nd(260.76 MHz) 1st(FTX + 210.38 MHz) RX Local Freq. 2nd(170.76 MHz) TCXO freq. 19.68 MHz Freq. Stability (FRX - 45 MHz) ± 350 Hz Operating Temperature -30 °C ~ +60 °C Supply Voltage + 3.8 V SMALL : 81 x 42 x 21 mm 84 g Size and Weight MIDDLE : 81 x 42 x 22 mm 87 g LARGE : 81 x 42 x 25 mm 98 g SAMSUNG Proprietary-Contents may change without notice 1-1 SCH-A302 Specification 2. 800 MHz CDMA 2-1. GENERAL TX Freq. Range 824 ~ 849 MHz RX Freq. Range 869 ~ 894 MHz Channel Bandwidth 1.23 MHz Channel Spacing 30 kHz Number of Channels 20 FA Duplex Separation 45 MHz In/Output Impedance 50 Ω TX Intermediate Frequency 130.38 MHz RX Intermediate Frequency 85.38 MHz TX Local Frequency 1st (FTX + 130.38 MHz) 2nd (260.76 MHz) RX Local Frequency 1st (FRX + 85.38 MHz) 2nd (170.76 MHz) TCXO Frequency 19.68 MHz Freq. Stability (FRX - 45 MHz) ± 150 Hz Operating Temperature -30 °C ~ +60 °C Supply Voltage + 3.8 V 2-2. TRANSMITTER Waveform Quality 0.944 or more Open Loop Power Control -25 dBm -57.5 dBm ~ -38.5 dBm -65 dBm -17.5 dBm ~ +1.5 dBm -104 dBm +18.0 dBm ~ +30.0 dBm Minimum TX Power Control Below -50 dBm Closed Loop TX Power Control Range ± 24 dB Maximum RF Output Power 200 mW (+24.5 dBm) Occupied Band Width 1.32 MHz Conducted Spurious Emission @900 kHz -42 dBc / 30 kHz @1.25 MHz -54 dBc / 30 kHz SAMSUNG Proprietary-Contents may change without notice 1-2 SCH-A302 Specification 2-3. RECEIVER Rx Sensitivity and Dynamic Range -104 dBm, FER=0.5 % or less -25 dBm, FER=0.5 % or less Conducted Spurious Emission 869 ~ 894 MHz < -81 dBm 824 ~ 849 MHz < -61 dBm All other Frequencies < -47 dBm Single Tone Desensitization Rx Power level -101 dBm Tone Power level -30 dBm Lower than 1 % Tone Offset from Carrier ± 900 kHz Intermoculation Spurious Response Attenuation Tone 1 offset from carrier = ± 900 kHz Tone 2 offset from carrier = ± 1,700 kHz -Test 1, 2 Rx power = -101 dBm Tone 1 power = -43 dBm Tone 2 power = -43 dBm -Test 3, 4 Lower than 1 % Rx power = -90 dBm Tone 1 power = -32 dBm Tone 2 power = -32 dBm -Test 5, 6 Rx power = -79 dBm Tone 1 power = -21 dBm Tone 2 power = -21 dBm SAMSUNG Proprietary-Contents may change without notice 1-3 2. SCH-A302 Trouble Shooting 1. Logic Section 1-1. No Power Press PWR button U501 pin38 Input=HIGH N Check Q507, Q509 and its neighboring circuits N Check U501 pin6 & pin10 and its neighboring circuits N Check R536 and its neighboring circuits Y U501 pin6 & pin10 output=2.8 V? Y U501 pin39 Input=HIGH? Y END SAMSUNG Proprietary-Contents may change without notice 2-1 SCH-A302 Trouble Shooting 1-2. Abnormal Initial Operation Press PWR Key TCXO CLK applied to U609 pina17/U404 pin7? N Check VCTCXO output. Replace if required. N Check OSC401 and its neighboring circuits. Replace if required. N Check OSC401 and its neighvoring circuits. Replace if required. N Check OSC402 and its neighvoring circuits. Replace if required. N Check the LED and its neighboring circuits. Replace if required. N Check the LCD pins and its neighboring circuits. Replace if required. Y TCXO CLK signal outputted from OSC401 pin3? Y TCXO CL signal outputted from OSC401 pin4? Y TCXO CL signal outputted from OSC402 pin4? Y LED on? Y Normal initial display on LCD? Y END SAMSUNG Proprietary-Contents may change without notice 2-2 SCH-A302 Trouble Shooting 1-3. Abnormal Backlight Operation Press any button on the phone ‘L’ level outputted from U501 pin1? N Check U501 pin1 and its neighboring circuits. Replace if required. N Check U501 pin1 and its neighboring circuits. Replace if required. N Check keypad dom switch. Replace if required. Y ‘L’ level outputted from U501 pin2? Y Backlight LED on 1-4. Abnormal Key Data Input Check initial status Scanning signals outputted from U609 pins C2, A3, E4, D3, C1? Y END SAMSUNG Proprietary-Contents may change without notice 2-3 SCH-A302 Trouble Shooting 1-5. Abnormal Keytone Abnormal Keytone CLK wavefrom outputted from U609 pin L16 & pin M17? N Check the U609 pin and its neighboring circuits. Replace if required. N Resolder CON500 and its neighboring circuits. Replace if required. N Check C631. Replace if required. N Replace the SPK assembly. Y CLK waveform outputted from CON500 pin 5? Y Key tone waveform applied to C561? Y Normal Keytone? Y END SAMSUNG Proprietary-Contents may change without notice 2-4 SCH-A302 Trouble Shooting 1-6. Abnormal Alert Tone Abnormal Keytone CLK waveform outputted from U609 pin C14. N Check the U609 pin and its neighboring circuits. Replace if required. N Check R552, Q511 and its neighboring circuits. Replace if required. N Connect the buzzer correctly. Y CLK waveform applied to Q511 Base? Y Is the buzzer connection correct? Y Check the buzzer and replace if required. 2. Transmitter Section Turn On Max PWR Abormal transmitter section N N Check U204 TX RFT out level OK? Y Check U402 local level. -10~0 dBm Y N Check U201 PWR AMP out level OK? CDMA : 25~26 dBm SAMSUNG Proprietary-Contents may change without notice 2-5 SCH-A302 Trouble Shooting 3. Receiver Section : CDMA MODE Start CDMA mode Normal CDMA SVC & ROAM OK? N Check CDMA Rx path. N Check Transmitter. Y Setup CDMA call. OK? Y Measure CDMA FER N Normal CDMA RF? SAMSUNG Proprietary-Contents may change without notice 2-6 SCH-A302 Trouble Shooting 4. Repair Guide 4-1. TX Part Check Point Using commands in test mode -01, 09 (0363), 07, 34, 71 (380) (1) 130.38 MHz (TX IF) output line - RFT3100 (U204) PIN #14,#15 (about -30 dBm) - IF TXIF problem Then Check TX 2nd LOCAL (260.76 MHz) - TX 2nd LOCAL check - RFT 3100 PIN #19 (about 23 dBm) (2) TXRF (824~849 MHz) out lines. From RFT3100 (U204) pin #15 to CELLA_OUT - F201 input and output is ok? - Pin #2 and #5 (about 16 dBm) - PAM input is ok? U201 pin #2 (about 20 dBm) - PAM voltage is ok? U201 pin #3 (3 V), 1,4 (3.7 V) - PA output is ok? U201 pin #5 (about +10 dBm) - Duplex input and out put is ok? Duplex input is same with PAM output. Output is You can check CN302 #2 (about 10 dBm) 4-2. RX Part Check Point (1) RX RF (869~894 MHz) Signal input lines. - HP Equipment setting - RF ch 363 (RX:880.89 MHz, TX:835.89 MHz)- at CALL CTRL MENU - sctr A pwr : -25 dBm (for more easy to check use Spectrum Analyzer) - Rf Lvl offset : -1.4 at config screen - Spectrum Analyzer Setting - center Freq: 880.89 MHz (when check RXRF in 363 Ch) - span : 5 MHz - RF input line from Duplex to Mixer check point - CN302 input and Duplex out (You can check Duplex out at C652) is ok? - LNA (U360)input ,output and operating voltage is ok? :Operating voltage-pin#1 (2.5 v) in & out (#3 66 dBm,#4 49 dBm) - F303 input and output is ok? #2,#5 (about 50 dBm) - RX Mixer (U361) input is ok? #1 (about 49 dBm) (2) RF IF circuit (Received RXRF Signal + 1st local = RX IF (85.38 MHz fixed) - 1st local is ok? U361 #4,#5 (about 13 dBm) - Voltage is ok? U361 pin #3 3.0v - Mixer output is ok? U361 pin #6 RXIF (85.38 Mhz-fixed) (about 50 dBm) - F301 input and output is ok? (3) IFR (U302) neighbor circuit - IF input is ok? U300 pin #11,12 (about 75 dBm) - RX 2nd local is ok? U300 pin #21,22 (about 25 dBm) - 3.0 V IF (3.0IF) lines are ok? IFR operating voltage SAMSUNG Proprietary-Contents may change without notice 2-7 SCH-A302 Trouble Shooting 4-3. PLL Part Check Point (1) VCO (Voltage Controlled Oscillator) - Operating voltage is ok? OSC402 pin #7 - VT voltage is ok? OSC402 pin #5 (VT voltage was changed according to CH) - Out is ok? OSC402 pin#1 output 1st local frequency each CH (2) PLL(Phase Looped Lock) - Operating voltages are ok? It use + 3.0 VR lines voltages - TCXO_IN input is ok? U402 pin#8 It use TCXO Freq (19.68 MHz) for Reference. 4-4. Power Line Check Point (1) U501 VBATT - #4 check Reset - #B7 check (2) X501 (Sleep X-tal) 32.768 MHz (pk-pk 2.7 v) (3) TCXO(OSC401) 19.68 MHz (4) IFR3000(U302) - #37 check TCXO-N (4.96 MHz) TCXO/N #38 check CHIP X8-(9.84 MHz) 4-5. Reference Regulators PM1000 U501 RESET : B7 RESET SIGNAL OUT 3.0_RX : H5 - RX CIRCUIT OPERATING VOLTAGE 3.0_TX : G5 TX CIRCUIT OPERATING VOLTAGE. (Controlled By Idle Signal) 3.0_IF : H7 RFT3100,IFR3000 AND Etc. 4-6. SAMPLING REPAIR RESULT (SCH-A302) (1) No.1 : 24108148669 Tx Power Problem - TX IF does not out from RFT3100 (U204) pin#1,2. - 2nd local and operating voltages (3.0 IF,3.0 VR,VDC) are ok. - Estimated factor: IFT After replace IFT It working ok. (2) No.2 : 24108205255 - Tx Power Problem - TX IF does not out from RFT3100 (U402)pin#6,7. - 2nd local and operating voltages (3.0_MP, 3.0_TX, 3.0_TX_IF, 3.0_TXRF, 3.0_TX_LO) are ok. - PA ON signal does not out from MSM. - MSM also failed to J-TAG Tester. - Estimated factor: MSM defect SAMSUNG Proprietary-Contents may change without notice 2-8 SCH-A302 Trouble Shooting (3) No.3 : 24108167813 - Tx Power Problem - All TX path is good from RFT 3100 to Mixer input port. - Mixer output is lower than normal status. - 1st local and operating voltages are ok. - TX AGC ADJ voltage is too low. - Estimated factor: Chip capacitor (C203) which connect to TX AGC ADJ voltage line C203 Replace ok. (4) No.4 : Tx Power Problem - All TX path and voltages are ok from Duplex input to RFT3100 input - CELLA_OUT (-pin#17) is ok, But U201 RF_IN (-pin#2)is not good. - Estimated factor : F201 Replace ok. (5) No.5 : 24108146584 When touch MSM, RX RSSI value has lost. - All RX path is good from Duplex to Mixer input port . - 1st local & TCXO did not oscillate. - TCXO upper case pushed then case and inside components were short when B'D is twisted. Estimated factor : TCXO After replace TCXO It working ok. (6) No.6 : 24108221088 - Problem with display (When power on, display was abnormal working) - LCD and neighbor patterns are ok. - Estimated Factor: Broken data which is in E2PROM. Data Rebuilding OK (7) No.7 : 24108134768 - RX problem (No SVC) - Handset doe not acquire SVC then searching CH repeat very quickly. - All RX value is good at Rx Part Check Point. - Ec/Io value (in debug screen) is bad. - Estimated factor : MSM does not decode receiving signal. (8) No.8 : No Power on (Can't not power on) - X501 Sleep X-tal (32.768 MHz) is O.K - V_DC 3.0V is O.K - CHIP X8 No output IFR #38 - TCXO_N No output IFR #37 - TCXO Not oscillator Pin # 3 - TCXO crack : TCXO replace O.K (9) No.9 : 24108233382 - ESN INVALID - ESN No was broken : 0000000 - ESN data at E2PROM was broken caused ESD or Electric shock. - E2PROM replace and rewriting ESN number. SAMSUNG Proprietary-Contents may change without notice 2-9 3. SCH-A302 Tune-up Rrocedure & Test Procedure list 1. List of Equipment • DC Power Supply • Test Jig : HHP I/F TESTJIG GH80-10502C • Test Cable : GH3900052A • RF Cable : GH3900075A • CDMA Mobile Station Test Set HP8924C, HP83236A, CMD-80, etc • Spectrum Analyzer(include CDMA Test Mode) HP8596E 2. Configuration of Test Spectrum Analyzer RF IN RF cable HP8924C RF IN/OUT Audio Audio OUT IN DUT Directional Coupler Data cable Test Jig To A-Out To A-In DC Power Supply (+3.93 V) • CAUTION : The test jig and data cable has a voltage drop of 0.15 V at FM Max power output, you’d better set the DC power supply is 3.8 V for normal test condition. (Nominal voltage of battery is 3.8 V at cellular phone) SAMSUNG Proprietary-Contents may change without notice 3-1 SCH-A302 Tune-up Rrocedure & Test Procedure list 3. Test Cable Description for SCH-A302 3-1. Test Cable 1 5 3 4 2 6 3-2. Test Cable Connections 1 MHC 172 2 RF CABLE (1.4 dB Loss for CDMA800 and AMPS, 2.1 dB Loss for PCS) 3 BNC CONECTOR (RF) 4 PLUG CONNECT TO SCH-A302 5 DATA CABLE 6 Dsub 25PIN CONNECTOR (DATA) Change to Test Mode A. To Change the phone’s state from Normal Mode to Test Mode, You should enter the following keys. : Press [ 7 5 9 # 8 1 3 5 8 0 "(A+Y)"] B. The Command “2 1” is mode and channel change. “20363” Channel number Mode : CDMA and Push the [OK] Key to save. C. The command “0 1” is Suspend. D. To finish the Test Mode, You should enter the command “0 2”. Channel Selection and Tx Power Output Level Control 1. CDMA A. Enter to Test Mode [ 7 5 9 # 8 1 3 5 8 0 "(A+Y)"] B. The command “2 1” is mode and channel change. “20363” Channel number Mode : CDMA Push the [OK] Key to save. SAMSUNG Proprietary-Contents may change without notice 3-2 SCH-A302 Tune-up Rrocedure & Test Procedure list C. “0 1” : Suspend. D. “2 1 + 2 0 3 6 3 ‘#’ “ : Set to ‘0363’ channel. E. “0 7” “ Carrier On. F. “3 4” : Spread spectrum to 1.23 MHz band width. G. “7 1 “ : Adjust RF power level. Set the acurate power with press ‘SEND’ (power growing up) or ‘END’ (power growing down). “ “ means AGC level and AGC level range is from 000 to 511. 2. CDMA TEST ITEMS PROCEDURE 1. PREPARANCE Set test equipments up. [ 7 5 9 # 8 1 3 5 8 0 "(A+Y)"] : Enter the Test Mode “0 1” : Suspend Confirm that the phone is in te “CDMA Mode”. (If not CDMA Mode, Use Test COMMAND “21” “2XXXX” and Push the [OK] Key to “save”, and enter “0 2” to restart) If you select a wrong key, press “CLR”, then enter new command. To exit the Test Mode at any time, just press [0 2]. 2. FREQUENCY ACCURACY “0 1” : Suspend. “0 9 + 0 3 6 3 ‘#’ ” : Set channel to 363. “0 7” : Carrier On. “3 4” : Spread spectrum. “7 1 3 0 0 ‘#’ ” : Set AGC level. Measure the TX frequency : 836.49 MHz ± 300 Hz. 3. OCCUPIED CDMA BANDWIDTH “0 1” : Suspend. “0 9 + 0 3 6 3 ‘#’ ” : Set channel to 383. “0 7” : Carrier On. “3 4” : Spread spectrum. “7 1 X X X ‘#’ ” : Enter AGC Code(XXX) to adjust RF Output Power. Measure the bandwidth (spec : 1.23 MHz) 4. LIMITATIONS ON EMISSIONS “0 “0 “0 “3 “7 1” : Suspend. 9 + 0 3 6 3 ‘#’ ” : Set channel to 363. 7” : Carrier On. 4” : Spread spectrum. 1 X X X ‘#’ ” : Enter AGC Code(XXX) to adjust RF Output Power. Measure the spurious at Fc ± 900 kHz, Fc ± 1.98 MHz, 2Fc, 3Fc, 1/2Fc. spec : Fc ± 900 kHz below 42 dBc / 30 kHz Fc ± 1.98 kHz below 54 dBc / 30 kHz Outside Receive Band 43 + 10 log (PY) PY : Mean Output Power in watts SAMSUNG Proprietary-Contents may change without notice 3-3 SCH-A302 Tune-up Rrocedure & Test Procedure list 3. CDMA Test Procedure (1) PREPARATION (2) FREQUENCY ACCURACY Set to HP8924c auto test mode. Then run auto test. See the auto test result. (3) OCCUPIED CDMA BANDWIDTH Before call condition. 1 HP8924c call control screen. 1. RF channel : equal to CDMA terminal. 2. Protocol : IS-95a 3. RF CH STD : MS AMPS 4. Traffic data mode : SVC OPT 2 5. Data rate : full rate 6. Power : avg power 7. Sector a power : -75 dBm 2 Range screen setting 8. Piolot : -7 dBm 9. Traffic : -7.4 dBm 10.Pwr cotl : always up 3 Config screen(shift + test) 1. RF level offset : on 2. RF in/out : -1.4 dBm 4 Etc 1. Test cable loss : -1.4 dBm 2. Splitter loss : input measured loss A method of measurement 1 Call control screen 1. HP8924C channel equal to CDMA terminal. 2. Send call Power : Always up. Sector A power : -104 dBm 3. Spectrum analyser Mode : cdma analyser - Freq - occupy bandwidth - occupied 4. Read Max power (4) LIMITATIONS ON EMISSIONS Before call control 1 HP8924C call control screen 1. RF channel : Equal to CDMA terminal 2. Protocol : IS-95a 3. RF CH STD : MS AMPS 4. Traffic data mode : SVC OPT 2 5. Data Rate : FULL Rate 6. Power : CH power 7. Sector A power : -60 dBm 8. PWR COTL : CLOSED LOOP SAMSUNG Proprietary-Contents may change without notice 3-4 SCH-A302 Tune-up Rrocedure & Test Procedure list 2 3 1 2 Config Screen (shift + test) screen 1. RF Level Offset : ON 2. RF In/Out : Input measured LOSS ETC 1. Test cable loss : -1.4 dBm 2. SPLITTER : Input measured loss A method of measurement Call control screen 1. HP8924C channel equal to CDMA terminal. 2. Send call 3. Spectrum analyser Mode : cdma analyser - more - more - xmtr spurious-spurious close Measure -13 dB spurious 4. Change segment F-, F+, Fc then check wave form quality Specification "A" is pass, or when "A" was fail, "B" and "C" must pass. IN BAND Center Frequency OFF set OUT BAND *30 kHz bandwidth-over 900 kHz *1 MHz bandwidth-over 1.385 MHz *30 kHz bandwidth-over 1.98 MHz *1 MHz bandwidth-over 2.465 MHz (A) -42dBc / 30kHz (A) -54dBc / 30kHz (B) -60dBc / 30 kHz (B) -60dBc / 30 kHz (C) -55dBm / 30 kHz (C) -55dBm / 30 kHz 4. Download New software To download program, you need to connect your pc and mobile using data link cable or jig box. Please make sure your phone is in DM mode ( menu 4 -> 9 ) before you are using Ndloader. (It is easier this way) (1) Connect your pc and handset using data link cable or jig box. (2) Power on the phone. Please check that the phone is in DM mode. (Menu->4->9). If it is in Handsfree mode, please change it to DM mode and press ok. The phone will be restarted. (3) Run the Ndloader. (4) To make sure that your phone is connected with Ndloader, click ? icon on the program, you would get the phone information. (5) Click folder icon on the Ndloader to choose new binary file to download. You will see the file information. (6) On the right middle of Ndloader, you will see download types. Choose Normal. (7) Now you are ready to download new software. Then Click download icon ( the green runner ) to start download. Please wait until download is done. If download is completed properly, the phone will be restarted. SAMSUNG Proprietary-Contents may change without notice 3-5 4. SCH-A302 Frequency Synthesizer Circuit & Spurious radiation suppression circuit 1. Frequency Synthesizer Circuit The Frequency synthesizer is an indirect frequency synthesizer PLL(Phased Locked Loop). It consists of a VCTCXO(OSC401), PLL, VCO (OSC402, U402), and loop filter. VCTCXO The VCTCXO is a reference source of the frequency synthesizer. It provides 19.68MHz reference frequency to PLL, VCO (OSC402, U402). The VCTCXO is a Voltage Controlled Temperature Compensated Crystal Oscillator having 19.68 MHz ± 2.5 ppm frequency stability over all useful temperature range. A correct frequency tuning is made by the control voltage. VCO, PLL The PLL, VCO Module(OSC402, U402) generates the signal having 966 ± 12.5 MHz center frequency with the voltage control. The PLL, VCO (OSC402, U402) controls this signal. The PLL, VCO Module(OSC402, U402) includes prescalers and charge pump. The reference divider in the PLL, VCO Module(OSC402, U402) divides the frequency of VCTCXO by 1968 and makes reference frequency 10kHz. This reference frequency is supplied to one of the input of phase detector. The signal generated at the PLL, VCO Module(OSC402, U402) goes into another input stage of the phase detector through a prescaler and the main divider. At this point, the error proportional to the phase difference of two inputs is occurred. This error signal is supplied to the frequency control input stage of the PLL, VCO (OSC402, U402) through the loop filter consisted RC. SAMSUNG Proprietary-Contents may change without notice 4-1 SCH-A302 Frequency Synthesizer circuit & Spurious radiation suppression circuit 2. Spurious Radiation Suppression Circuit The spurious signal from antenna is suppressed at the duplexer. The duplexer has a flat characteristics to the receive signal and a high attenuation characteristics to the harmonic signal of transmission. So it suppress the spurious radiation Table: The characteristic of CDMA duplexer filter(F302) PARAMETER VALUE TX Center Frequency 836.5 MHz (FT) Bandwidth FT ± 12.5 MHz Insertion Loss at BW 3.0 dB Max VSWR at BW 1.8 Max Input power 3.0 W Max Attenuation 869 ~ 894 MHz Ripple at BW 1.6 dB Max 40 dB Min RX Center Frequency 881.5 MHz (FR ) Bandwidth FR ± 12.5 MHz Insertion Loss at BW 4.0 dB Max VSWR at BW 1.8 Max Input power 1 W Max Attenuation 824 ~ 849 MHz Ripple at BW 2.0 dB Max 56 dB Min T X to R X Isolation 824 ~ 849 MHz 55 dB Max 869 ~ 894 MHz 49 dB Max SAMSUNG Proprietary-Contents may change without notice 4-2 5. SCH-A302 NAM Programming NAM features can be programmed as follows: Notes: • If you enter the NAM program mode, each item shows the currenly stored data. Go to the next item by pressing OK. • You can modify the data by entering a new data. • If you enter a wrong digit, press CLR to delete the last digit. Press and hold CLR to delete all digits. • To scroll items backwards or forwards, press the VOLUME button on the left side of the phone. 1. General Setup LCD Display Key in Function 47 869#08#9 -selects NAM programming 1 -Choose ‘General’ ESN B0000000 Volume -Electronic Serial Number of the phone is displayed CAI version 3 Volume -Common Air Interface version is displayed NAM Program 1:General 2.NAM1 Setup 3:NAM2 Setup 4:Advanced 13K EVRC/8K 13K voice or # OK SCM 01101010 Lock Code 0000 Volume -Station Class Mark displays the power class, transmission, slotted class, dual mode. Volume 4-digit code OK Lock code, current status is displayed -to change, enter new code. -stores it Slot Mode Yes Slot Index 2 Vocoder sample rate -changes the status. -stores it. -8K is not supported. OK Slot mode. ‘Yes’ indicates the slot mode. -changes the status. -stores it. Volume 0~7 OK Slot mode index. The higher,the longer sleeping time -to change, enter new one. -stores it. or # SAMSUNG Proprietary-Contents may change without notice 5-1 SCH-A302 NAM Programming 2. Setting Up NAM LCD Display Key in Function NAM Program 1:General 2.NAM1 Setup 3:NAM2 setup 4:Advanced 2 -Choose ‘NAM1 Setup’ CDMA TEL NO. 3003003000 number OK MIN1,MIN2 is displayed -to change, enter new one. -stores it. IMSI MCC 000 number OK IMSI Moble Country Code,current code is displayed. -to change, enter new one. -stores it. IMSI MNC 00 number OK IMSI Moble Network Code,current code is displayed. -to change, enter new one. -stores it. SYSTEM Standard OK - Only ‘Standard’ mode is supported. class number OK CDMA Access Overload Class,current status is displayed. -to change,enter new one. -stores it. ACCOLC 0 Pchn Sys A 000 Pchn Sys B 000 Schn Sys A 000 Schn Sys B 000 LockoutSID 1~10 0000 CDMA HOME SID Yes channel number OK Primary CDMA Channel for System A is displayed -to change, enter new one. -stores it. channel number OK Primary CDMA Channel for System B is displayed -to change, enter new one. -stores it. channel number OK Secondary CDMA Channel for System A is displayed -to change, enter new one. -stores it. channel number OK Secondary CDMA Channel for System B is displayed -to change, enter new one. -stores it. SID number OK CDMA SID to lockout is displayed -to change, enter new one. -stores it. # or OK CDMA Home system ID, current value is displayed. -changes the status. -stores it. SAMSUNG Proprietary-Contents may change without notice 5-2 SCH-A302 NAM Programming LCD Display Key in CDMA fSID Yes CDMA fNID Yes HomeSID #1 ~ #4 4120 HomeNID #1 ~ #4 65535 Function # or OK CDMA foreign SID, current value is displayed. -changes the status. -stores it. # or OK CDMA foreign NID, current value is displayed. -changes the status. -stores it. number OK CDMA HOME SIDs written in the list, current value is displayed. -to change, enter new one. -stores it. number OK CDMA HOME NIDs written in the list, current value is displayed. -to change, enter new one. -stores it. SAMSUNG Proprietary-Contents may change without notice 5-3 6. SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 0 GH92-00996A 1 GH41-00192A PCB-SCHA302 MAIN SCH-A302, -, 6L, -, 0.7T, 100 x 138 mm, -, 3, -, - 1 GH71-00052A NPR-ANT.CONTACT SCH-A100, BE-CU, T0.1, AU 1 GH73-00214A RMO-ANTENNA RUBBER SPH-A1000, RUBBER, 2 x 3 x T0.5, BLK, 50 1 GH73-00442A RMO-BUZZER HOLDER SCH-A300, RUBBER, -, BLK, 50, - 1 GH74-00843A MPR-FPCB CUSHION SCH-A8800, 71TS, T3, BRN, - 1 GH74-00892A MPR-SHIELD TAPE 5 SCH-A8800, TAPE, T0.14, -, - 1 GH74-00898A MPR-SHIELD TAPE 6 SCH-A300, -, 6 x 4, S/BLU, - 1 3002-001101 AU501 BUZZER-MAGNETIC 88 dB, 3.6 V, 100 mA, 2550 Hz, TP 1 2203-000254 C101 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000995 C102 C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000254 C103 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000940 C104 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000940 C105 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000254 C106 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-005061 C107 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-005061 C108 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000254 C109 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000233 C110 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-005061 C111 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000233 C112 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-005061 C113 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000940 C114 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000940 C115 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000254 C116 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000233 C117 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000233 C118 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000438 C119 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000438 C120 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000438 C121 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-005061 C122 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000254 C123 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-005061 C124 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 6-1 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 2203-000438 C125 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000438 C126 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000438 C127 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000254 C128 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000714 C129 C-CERAMIC, CHIP 3.3 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000254 C140 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-005061 C142 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-005061 C143 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000254 C144 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000940 C145 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000254 C146 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000438 C147 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000438 C150 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000438 C151 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000438 C152 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2404-001017 C160 C-TA, CHIP 1 uF, 20 %, 10 V, GP, TP, 2012, 2, 0 1 2203-000940 C161 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000940 C162 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000628 C201 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-005061 C202 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000885 C203 C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, - 1 2203-000995 C204 C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000254 C205 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000233 C207 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000254 C208 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-001598 C209 C-CERAMIC, CHIP 2200 nF, +80-20 %, 16 V, Y5 V, TP, 2012 1 2203-005503 C210 C-CERAMIC, CHIP 0.18 nF, 5 %, 25 V, NP0, TP, 1005 1 2203-005503 C211 C-CERAMIC, CHIP 0.18 nF, 5 %, 25 V, NP0, TP, 1005 1 2203-001598 C213 C-CERAMIC, CHIP 2200 nF, +80-20 %, 16 V, Y5 V, TP, 2012 1 2203-000254 C214 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000233 C215 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000995 C216 C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000254 C217 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-001072 C218 C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 6-2 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 2203-000254 C219 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2404-001151 C220 C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216 1 2203-001017 C221 C-CERAMIC, CHIP 0.004 nF, 0.25 pF, 50 V, NP0, TP, 1005 1 2203-001259 C222 C-CERAMIC, CHIP 0.008 nF, 0.5 pF, 50 V, NP0, TP, 1005 1 2203-001072 C223 C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000940 C226 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, - 1 2404-001017 C227 C-TA, CHIP 1 uF, 20 %, 10 V, GP, TP, 2012, 2, 0 1 2203-000233 C229 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000438 C23 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000254 C230 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000233 C231 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-001072 C234 C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000438 C235 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000995 C237 C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000995 C238 C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000386 C240 C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000438 C250 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-001437 C318 C-CERAMIC, CHIP 5 pF, 0.25 pF, 50 V, X7R, TP, 1005, 1.0 1 2203-000254 C320 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-005382 C321 C-CERAMIC, CHIP 0.006 nF, 0.1 pF, 50 V, NP0, TP, 1005 1 2203-001437 C323 C-CERAMIC, CHIP 5 pF, 0.25 pF, 50 V, X7R, TP, 1005, 1.0 1 2203-000438 C331 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000438 C332 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2404-001105 C333 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012 1 2203-000254 C334 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000233 C335 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000233 C337 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000254 C338 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000885 C339 C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, - 1 2203-000254 C340 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-005061 C341 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000438 C342 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000359 C343 C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-005395 C344 C-CERAMIC, CHIP 0.0047 nF, 0.1 pF, 50 V, NP0, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 6-3 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 2203-000885 C345 C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, - 1 2203-000359 C346 C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-005480 C349 C-CERAMIC, CHIP 33 nF, 10 %, 10 V, X7R, TP, 1005, - 1 2404-001086 C350 C-TA, CHIP 4.7 uF, 20 %, 6.3 V, GP, TP, 2012, - 1 2203-005383 C370 C-CERAMIC, CHIP 7 pF, 0.1 pF, 50 V, NPO, TP, 1005, - 1 2203-000628 C371 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000438 C372 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000233 C373 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000696 C375 C-CERAMIC, CHIP 0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005 1 2203-005444 C376 C-CERAMIC, CHIP 0.003 nF, 0.1 pF, 50 V, NP0, TP, 1005 1 2203-000438 C377 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-005061 C378 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2404-001105 C379 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012 1 2203-000233 C380 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000278 C381 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005 1 2203-000438 C382 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-005444 C383 C-CERAMIC, CHIP 0.003 nF, 0.1 pF, 50 V, NP0, TP, 1005 1 2203-002443 C384 C-CERAMIC, CHIP 0.33 nF, 10 %, 50 V, X7R, TP, 1005 1 2203-005480 C385 C-CERAMIC, CHIP 33 nF, 10 %, 10 V, X7R, TP, 1005, - 1 2203-005061 C386 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000233 C387 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-005061 C388 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2404-001105 C389 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012 1 2203-000386 C390 C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000386 C391 C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000233 C392 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000885 C393 C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, - 1 2203-005061 C394 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000885 C395 C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, - 1 2203-001432 C396 C-CERAMIC, CHIP 47 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2404-001105 C397 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012 1 2203-000438 C398 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000438 C407 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000233 C408 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 6-4 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 2203-000438 C409 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000254 C410 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000233 C411 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000233 C412 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000233 C413 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-001072 C414 C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005 1 2404-001151 C415 C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216 1 2203-000725 C416 C-CERAMIC, CHIP 3.9 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-005061 C417 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000254 C418 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000254 C419 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000585 C420 C-CERAMIC, CHIP 220 pF, 10 %, 50 V, X7R, TP, 1005, - 1 2404-001092 C421 C-TA, CHIP 220 nF, 20 %, 20 V, GP, TP, 2012, - 1 2203-000254 C422 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000233 C423 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000233 C424 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000254 C425 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000233 C426 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000278 C427 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005 1 2203-000254 C428 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000995 C429 C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000233 C431 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000233 C432 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000233 C433 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000254 C435 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000233 C436 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000233 C437 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000233 C438 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000254 C501 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000254 C502 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000254 C503 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000254 C504 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2404-001151 C506 C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216 1 2203-000233 C507 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 6-5 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 2203-005061 C508 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2404-001151 C509 C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216 1 2203-005061 C510 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000679 C513 C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000679 C514 C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-005065 C515 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608 1 2203-000254 C516 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-005061 C517 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000233 C519 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-001724 C520 C-CERAMIC, CHIP 4700 nF, +80-20 %, 16 V, Y5 V, TP, 3216 1 2203-000233 C522 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-005065 C523 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608 1 2203-005061 C524 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-001724 C525 C-CERAMIC, CHIP 4700 nF, +80-20 %, 16 V, Y5 V, TP, 3216 1 2203-000233 C526 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-001724 C527 C-CERAMIC, CHIP 4700 nF, +80-20 %, 16 V, Y5 V, TP, 3216 1 2203-005061 C528 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000233 C529 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-001598 C530 C-CERAMIC, CHIP 2200 nF, +80-20 %, 16 V, Y5 V, TP, 2012 1 2203-005061 C531 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-001598 C532 C-CERAMIC, CHIP 2200 nF, +80-20 %, 16 V, Y5 V, TP, 2012 1 2404-001017 C533 C-TA, CHIP 1 uF, 20 %, 10 V, GP, TP, 2012, 2, 0 1 2203-005061 C534 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000233 C535 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-005065 C536 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608 1 2203-005061 C537 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-005061 C538 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000233 C539 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000233 C540 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000254 C542 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-005061 C549 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-001432 C556 C-CERAMIC, CHIP 47 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000438 C566 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000359 C567 C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 6-6 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 2203-000438 C568 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-001432 C601 C-CERAMIC, CHIP 47 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 1405-001082 C602 VARISTOR 5.6 V, 20 A, 1 x 0.5 x 0.6 mm, TP 1 1405-001082 C603 VARISTOR 5.6 V, 20 A, 1 x 0.5 x 0.6 mm, TP 1 2404-001151 C604 C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216 1 2203-000585 C605 C-CERAMIC, CHIP 220 pF, 10 %, 50 V, X7R, TP, 1005, - 1 2404-001105 C606 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012 1 2203-005061 C607 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-005061 C608 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000254 C609 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-005061 C610 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-005061 C611 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-005061 C612 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-005061 C613 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-005061 C615 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000254 C616 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-005061 C617 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-005061 C618 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-005061 C619 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000254 C620 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000254 C621 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000254 C622 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-005061 C640 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-005061 C641 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-005061 C651 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 1 2203-000438 C652 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000233 C653 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000254 C654 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, - 1 2203-000233 C655 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 1 2203-000438 C656 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 2203-000438 C663 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 1 3710-001653 CN101 CONNECTOR-SOCKET 18P, 1R, 0.5 mm, SMD-A, A uF 1 3705-001178 CN302 CONNECTOR-COAXIAL SMC, JACK, 100 Mohm, 50 ohm, .5DB 1 3722-001530 CN303 JACK-PHONE 5P, 2.6PI, A uF, BLK, - SAMSUNG Proprietary-Contents may change without notice 6-7 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 0407-000115 D160 DIODE-ARRAY DAN202U, 80 V, 100 mA, CA2-3, SC-70, 1 0405-001035 D201 DIODE-VARACTOR 1SV279, 15 V, 3 nA, USC, TP 1 0405-001035 D202 DIODE-VARACTOR 1SV279, 15 V, 3 nA, USC, TP 1 0405-001035 D302 DIODE-VARACTOR 1SV279, 15 V, 3 nA, USC, TP 1 0405-001035 D303 DIODE-VARACTOR 1SV279, 15 V, 3 nA, USC, TP 1 0409-001016 D350 DIODE-PIN BAR63-02 W, 50 V, 100 mA, SCD-80, TP 1 0409-001016 D351 DIODE-PIN BAR63-02 W, 50 V, 100 mA, SCD-80, TP 1 0407-000115 D501 DIODE-ARRAY DAN202U, 80 V, 100 mA, CA2-3, SC-70, 1 0407-001006 D601 DIODE-ARRAY DA221, 20 V, 100 mA, C2-3, EM3, TR 1 0407-001006 D602 DIODE-ARRAY DA221, 20 V, 100 mA, C2-3, EM3, TR 1 2901-001193 F101 FILTER-EMI SMD 25 V, 0.1 A, -, 35 pF, 3.2 x 1.6 x 0.75 mm, TP 1 2901-001193 F102 FILTER-EMI SMD 25 V, 0.1 A, -, 35 pF, 3.2 x 1.6 x 0.75 mm, TP 1 2901-001193 F103 FILTER-EMI SMD 25 V, 0.1 A, -, 35 pF, 3.2 x 1.6 x 0.75 mm, TP 1 2904-001172 F201 FILTER-SAW 836.5 MHz, 25 MHz, +-12.5 MHz/1.5, TP, +-12.5 MHz/2.5 dB, 1 2904-001236 F301 FILTER-SAW 85.38 MHz, -, 0.8, TP, 9.4 dB, - 1 2909-001122 F302 FILTER-DUPLEXER 881.5 MHz, 836.5 MHz, 4/2.5 dB, TP, 824-849 1 2904-001173 F303 FILTER-SAW 881.5 MHz, 25 MHz, +-12.5 MHz/2 dB, TP, +-12.5 MHz/3.5 dB, 1 4709-001242 F401 COUPLER-DIRECTION 925-960 MHz, 10+-1.5 dB, 23 dB, 2 x 1.25 x 1 mm, 1 3710-001585 J101 CONNECTOR-SOCKET 20P, 2R, 0.5 mm, SMD-S, A uF 1 3710-001585 J102 CONNECTOR-SOCKET 20P, 2R, 0.5 mm, SMD-S, A uF 1 3301-001120 L201 CORE-FERRITE BEAD AB, 30 ohm, 2 x 1.25 x 0.85 mm, 3000 mA, TP, 1 3301-001105 L202 CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, - 1 2703-001726 L204 INDUCTOR-SMD 27 nH, 5 %, 1 x 0.5 x 0.5 mm 1 2703-001726 L205 INDUCTOR-SMD 27 nH, 5 %, 1 x 0.5 x 0.5 mm 1 2703-001786 L206 INDUCTOR-SMD 10 nH, 5 %, 1.0 x 0.5 x 0.5 mm 1 2703-001543 L209 INDUCTOR-SMD 33 nH, 5 %, 1.8 x 1.12 x 1.02 mm 1 3301-001105 L210 CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, - 1 3301-001105 L211 CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, - 1 3301-001342 L212 CORE-FERRITE BEAD AB, 1.5 kohm, 1 x 0.5 x 0.5 mm, 100 mA, TP, M, 1 3301-001342 L213 CORE-FERRITE BEAD AB, 1.5 kohm, 1 x 0.5 x 0.5 mm, 100 mA, TP, M, 1 2703-001126 L307 INDUCTOR-SMD 270 nH, 5 %, 2.29 x 1.73 x 1.52 mm 1 2703-001914 L311 INDUCTOR-SMD 180 nH, 2 %, 1.6 x 0.8 x 0.8 mm 1 3301-001105 L318 CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, - 1 2703-001514 L319 INDUCTOR-SMD 68 nH, 5 %, 1.8 x 1.12 x 1.02 mm SAMSUNG Proprietary-Contents may change without notice 6-8 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 2703-001954 L320 INDUCTOR-SMD 2.7 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm 1 3301-001105 L321 CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, - 1 3301-001105 L322 CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, - 1 2703-002106 L323 INDUCTOR-SMD 220 nH, 5 %, 1.6 x 0.8 x 0.8 mm 1 2703-001595 L324 INDUCTOR-SMD 47 nH, 5 %, 1.0 x 0.5 x 0.5 mm 1 2703-001790 L325 INDUCTOR-SMD 3.3 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm 1 2703-001728 L326 INDUCTOR-SMD 1.5 nH, 0.3 nH, 1 x 0.5 x 0.5 mm 1 2703-001952 L327 INDUCTOR-SMD 8.2 nH, 5 %, 1.0 x 0.5 x 0.5 mm 1 2703-001772 L328 INDUCTOR-SMD 18 nH, 5 %, 1.0 x 0.5 x 0.5 mm 1 2703-001772 L329 INDUCTOR-SMD 18 nH, 5 %, 1.0 x 0.5 x 0.5 mm 1 2703-000175 L331 INDUCTOR-SMD 270 nH, 10 %, 0.8 x 1.6 x 0.8 mm 1 2703-001409 L332 INDUCTOR-SMD 12 nH, 10 %, 1 x 0.5 x 0.5 mm 1 3301-001105 L402 CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, - 1 3301-001105 L403 CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, - 1 2703-001952 L405 INDUCTOR-SMD 8.2 nH, 5 %, 1.0 x 0.5 x 0.5 mm 1 2703-001748 L406 INDUCTOR-SMD 5.6 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm 1 3301-001342 L501 CORE-FERRITE BEAD AB, 1.5 kohm, 1 x 0.5 x 0.5 mm, 100 mA, TP, M, 1 2703-001748 L601 INDUCTOR-SMD 5.6 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm 1 2703-001952 L602 INDUCTOR-SMD 8.2 nH, 5 %, 1.0 x 0.5 x 0.5 mm 1 2809-001241 OSC401 OSCILLATOR-VCTCXO 19.68 MHz, 2ppm, 10 kohm//10 pF, TP, 2.8 V, 1.5mA 1 2806-001200 OSC402 OSCILLATOR-VCO 967 MHz, -, 50, TP, 3 V, 8.5 mA 1 0501-002202 Q101 TR-SMALL SIGNAL MMBT2222AWT1, NPN, 150 mW, SOT-323 1 0501-002202 Q102 TR-SMALL SIGNAL MMBT2222AWT1, NPN, 150 mW, SOT-323 1 0504-000167 Q160 TR-DIGITAL RN1102, NPN, 100 mW, 10K/10K, SSM, TP 1 0501-000162 Q161 TR-SMALL SIGNAL 2SA1576, PNP, 200 mW, SOT-323, TP, 180-390 1 0501-000218 Q350 TR-SMALL SIGNAL 2SC4081, NPN, 200 mW, UMT, TP, 180-3 1 0504-000172 Q501 TR-DIGITAL RN2104, PNP, 100 mW, 47K/47K, SSM, TP 1 0501-000225 Q502 TR-SMALL SIGNAL 2SC4617, NPN, 200 mW, EM3, TP, 120-5 1 0501-002202 Q503 TR-SMALL SIGNAL MMBT2222AWT1, NPN, 150 mW, SOT-323 1 0505-001165 Q505 FET-SILICON SI3443D V, P, -20 V, +-3.5 mA, 65mohm 1 0501-000225 Q507 TR-SMALL SIGNAL 2SC4617, NPN, 200 mW, EM3, TP, 120-5 1 0504-000168 Q508 TR-DIGITAL RN1104, NPN, 100 mW, 47K/47K, SSM, TP 1 0504-000168 Q509 TR-DIGITAL RN1104, NPN, 100 mW, 47K/47K, SSM, TP 1 0501-002202 Q511 TR-SMALL SIGNAL MMBT2222AWT1, NPN, 150 mW, SOT-323 SAMSUNG Proprietary-Contents may change without notice 6-9 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 2007-000148 R101 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-003019 R103 R-CHIP 430 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000157 R104 R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000758 R105 R-CHIP 330 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R106 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000138 R108 R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R109 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000153 R110 R-CHIP 22 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000932 R111 R-CHIP 470 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000138 R115 R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000165 R117 R-CHIP 200 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000165 R118 R-CHIP 200 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000165 R122 R-CHIP 200 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R123 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000157 R124 R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000138 R125 R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000138 R126 R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001313 R127 R-CHIP 330 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000138 R128 R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000138 R129 R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000162 R130 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001319 R131 R-CHIP 1.2 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001313 R132 R-CHIP 330 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000165 R133 R-CHIP 200 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R134 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R136 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R137 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R138 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R139 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R140 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R141 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R142 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R144 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R147 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 6-10 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 2007-007771 R148 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R149 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R160 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000137 R161 R-CHIP 2 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000157 R169 R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000138 R170 R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000138 R171 R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R172 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R175 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R201 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R202 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001311 R203 R-CHIP 270 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000162 R204 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000162 R205 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R206 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R207 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R208 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R209 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007309 R210 R-CHIP 12 kohm, 1 %, 1/16 W, DA, TP, 1005 1 2007-007771 R211 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R213 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001320 R214 R-CHIP 1.8 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000165 R215 R-CHIP 200 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000138 R216 R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001284 R218 R-CHIP 4.7 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001284 R219 R-CHIP 4.7 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001298 R220 R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007137 R221 R-CHIP 1.2 kohm, 1 %, 1/16 W, DA, TP, 1005 1 2007-007771 R222 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R312 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000775 R313 R-CHIP 33 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001313 R315 R-CHIP 330 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R316 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R317 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 6-11 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 2007-007771 R318 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001317 R319 R-CHIP 910 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R330 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R331 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000172 R370 R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000172 R371 R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001319 R372 R-CHIP 1.2 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000172 R373 R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R374 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R375 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000172 R376 R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000932 R377 R-CHIP 470 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001298 R380 R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R404 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000172 R406 R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-003006 R410 R-CHIP 16 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R411 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-003010 R413 R-CHIP 20 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000141 R414 R-CHIP 2.2 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000144 R415 R-CHIP 5.1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R418 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000172 R420 R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R424 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000170 R427 R-CHIP 1 Mohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R480 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 1404-001040 R501 THERMISTOR-NTC 10 kohm, 5 %, 3650K, -, TP 1 2007-000142 R502 R-CHIP 2.7 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000147 R503 R-CHIP 8.2 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000143 R504 R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R506 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000153 R507 R-CHIP 22 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R508 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001325 R509 R-CHIP 3.3 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001294 R510 R-CHIP 36 ohm, 5 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 6-12 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 2007-001294 R511 R-CHIP 36 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001294 R512 R-CHIP 36 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R514 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R515 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R521 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R524 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000305 R528 R-CHIP 10 Mohm, 5 %, 1/16 W, DA, TP, 1608 1 2007-007771 R529 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R531 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R535 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000146 R536 R-CHIP 6.8 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R537 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000162 R539 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000162 R540 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000162 R541 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000143 R542 R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000153 R543 R-CHIP 22 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000162 R544 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R552 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R553 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007137 R554 R-CHIP 1.2 kohm, 1 %, 1/16 W, DA, TP, 1005 1 2007-000165 R603 R-CHIP 200 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000162 R604 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000162 R605 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000143 R606 R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-007771 R607 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000141 R611 R-CHIP 2.2 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000242 R612 R-CHIP 1.5 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R613 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001339 R614 R-CHIP 180 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R616 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000168 R617 R-CHIP 470 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R618 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001339 R619 R-CHIP 180 kohm, 5 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 6-13 SCH-A302 Electrical parts list Level SEC CODE Design LOC DESCRIPTIONS 1 2007-000137 R620 R-CHIP 2 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000140 R622 R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000831 R628 R-CHIP 39 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000161 R629 R-CHIP 82 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000162 R631 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000162 R632 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-000148 R636 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001298 R643 R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001305 R645 R-CHIP 120 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001305 R646 R-CHIP 120 ohm, 5 %, 1/16 W, DA, TP, 1005 1 2007-001298 R647 R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005 1 1106-001274 U101 IC-SRAM 616U4110, 256K x 16BIT, CSP, 48P, -, 70NS, 3 V, -, -, -40TO85 C, 1 1109-001158 U103 IC-ETC. MEMORY 84VD22194, 4M x 8/2M x 16Bit, BGA, 73P, 457MIL, 90nS, 1 1103-001184 U106 IC-EEPROM 24C256, 32K x 8Bit, dBGA, 8P, 92MIL, -, 2.7 V, -, PLASTIC, - 1 1201-001491 U201 IC-POWER AMP 912, LCC, 7P, 226MIL, SINGLE, 28 dB, PLASTIC, 4.2 V, -, - 1 0505-001376 U202 FET-SILICON FDC6329L, N/P, 8 V, 2.5A, -, 0.7 W, SC-74 1 0505-001376 U203 FET-SILICON FDC6329L, N/P, 8 V, 2.5A, -, 0.7 W, SC-74 1 1204-001682 U204 IC-IF/FM/AM RFT3100, BCC, 32P, 196MIL, PLASTIC, 3 V, -, -30to+85C, TP, - 1 1204-001581 U302 IC-IF CIRCUIT IFR3000-48BCCF-TR, BCC, 48P, -, PLASTIC, 3.5 V, -, - 1 1205-001943 U360 IC-DATA COMM./GEN. RF2366TR7, SOT23-6, 6P, -, PLASTIC, 8 V, -, - 1 1205-001928 U361 IC-MIXER CMY212B, SOP, 8P, 63MIL, PLASTIC, 5 V, -, -55to+150C, TP, - 1 1209-001197 U402 IC-PLL LMX2332LSLB, CSP, 20P, -, PLASTIC, 1 1201-001248 U404 IC-CASCODE AMP 0916, SOT-143, 4P, -, -, 2.7 V, -, 6Vd 1 1203-001967 U501 IC-POWER SUPERVISOR 1000, BGA, 64P, 315MIL, PLASTIC, 1.6/3.3 V, -, - 1 1202-000192 U601 IC-PHASE COMPARATOR 75W393, -, 8P, -, DUAL, 36 V, CMOS, PL 1 1205-002032 U609 IC-TRANSCEIVER MSM3100C, FBGA, 208P, -, PLASTIC, 3.7 V, -, - 1 1201-001248 U610 IC-CASCODE AMP 0916, SOT-143, 4P, -, -, 2.7 V, -, 6Vd 1 3711-004642 VCON1 CONNECTOR-HEADER NOWALL, 2P, 1R, 2.5 mm, SMD-S, A uF 1 3711-004642 VCON2 CONNECTOR-HEADER NOWALL, 2P, 1R, 2.5 mm, SMD-S, A uF 1 2801-003856 X501 CRYSTAL-SMD 0.032768 MHz, 20PPM, 28-ACP, 7 pF, 65 kohm, TP 1 0406-001051 ZD101 DIODE-TVS SMS05C, 6 V, 300 W, SOT-23-6 1 0406-001051 ZD102 DIODE-TVS SMS05C, 6 V, 300 W, SOT-23-6 1 0406-001051 ZD103 DIODE-TVS SMS05C, 6 V, 300 W, SOT-23-6 1 0403-001387 ZD601 DIODE-ZENER UDZS5.1B, 4.89-5.2 V, 200 mW, SOD-323, TP SAMSUNG Proprietary-Contents may change without notice 6-14 7. SCH-A302 Exploded View & parts list 1. Cellular phone Exploded View 1 2 14 3 15 4 16 5 17 6 13 7 18 12 19 20 11 21 10 8 22 9 24 23 SAMSUNG Proprietary-Contents may change without notice 7-1 SCH-A302 Exploded view and its Part List 2. Cellular phone Parts List SEC CODE Location No. Description Gold Silver 1 DUAL WINDOW GH72-03350A GH72-03350A 2 SUA, FOLDER UPPER GH75-01081B GH75-01081C 3 FPCB ASS’Y GH59-00109A GH59-00109A 4 LCD PBA GH96-00918A GH96-00918A 5 SPEAKER 6 VIBRATOR GH31-00018A GH31-00018A 7 SUA, FOLDER LOWER GH75-01016B GH75-01016D 8 LCD WINDOW GH72-02386H GH72-02386J 9 DUMMY LABEL GH68-00370J GH68-00370H 10 SCREW MACHINE ( M1.4 X L3) 6001-000464 6001-000464 11 IF CONN-COVER 12 MIC 13 MIC HOLDER GH73-00441A GH73-00441A 14 SUA, FRONT COVER GH75-00687B GH75-00687D 15 VOLUME KEY GH72-01572A GH72-01572A 16 KEY PAD GH72-01582K GH72-01582L 17 SUA, SHIELD COVER GH75-00719A GH75-00719A 18 KEY FPCB GH59-00107A GH59-00107A 19 PBA GH92-00996A GH92-00996A 20 ANTENNA GH42-00126A GH42-00126A 21 RF JACK GH73-00440B GH73-00440D 22 SUA, REAR COVER GH75-00690D GH75-00690E 23 SCREW MACHINE ( M1.4 X L5) 24 BATTERY 3001-001176 Remark 3001-001176 GH73-00921A GH73-00921B 3003-001053 6001-000883 3003-001053 6001-000883 GH43-00338A GH43-00339A 520mAh GH43-00331A GH43-00332A 820mAh SAMSUNG Proprietary-Contents may change without notice 7-2 DUPLEXER ANT ENNA SAMSUNG Proprietary-Contents may change without notice 8-1 3 .6 V B A T T ER Y LNA 869.64~893.37MHz V CO BU F FER PM 1 00 0 Fc=85.38 M Hz IF AMP PLL PA M VCC 955.02~ 978.75MHz BUF FER COUPLER 9 55 .02 ~ 97 8.7 5M H z 8 24 .64 ~ 8 4 8.37 M Hz P.A. D R IV ER 3 . 0 TX 3. 0RX 3 .0 SY N 3 .0 IF 3 .0 M A 3 .0 M C 3 .0 M P 3 . 0 T C XO 1 7 0 .7 6 M H z TANK C I RC U IT V CT CX O 1 9 .6 8 M H z 2 6 0 .7 6 M H z TANK C I RC U IT F c = 1 3 0 .3 8 MH Z 1 /2 I FR30 0 0 1 /2 VCO RF T 310 0 T X IF PLL V CO LOCK SENSING 3 2 M / 4 M M EM O RY 4M SRAM M O DU L A T O R & De mo d. U A RT V i t er bi D E C OD ER CO DE C M S M V OC O D E R CP U A RM 7 CH A N N E L C OD EC 2 5 6 K EE PR OM R EC E IV ER U ni t M IC KEY F P C A SS’Y L CD M OD U L E 8. SCH-A302 Block Diagram SCH-A302 Block Diagram MEMO SAMSUNG Proprietary-Contents may change without notice 8-2 9. SCH-A302 PCB Diagrams C538 R221 C526 U609 C227 C226 C567 C525 C233 C250 U106 R104 C104 R109 R111 C608 R621 R625 C621 C 6 1 9 C620 C616 C615 C129 D601 C568 SAMSUNG Proprietary-Contents may change without notice 9-1 R172 R175 R560 R171 C162 X501 V103 V102 C350 C513 R532 U101 V101 V100 D302 U103 C344 R 3 1 7 R316 C 3 4 5 R318 C428 C343 C346 L319 C161 R524 C341 R313 R315 D303 U501 C332 R330 C514 L321 C318 C323 C331 R331 R319 C349 C378 C340 C320 R380 U302 C334 R169 R170 C342 L318 C333 R311 C549 C379 L330 C383 C321 R378 C335 R312 C376 C373 C374 C384 F303 C381 L326 C380 C382 R372 R371 C337 C338 C339 R370 L329 C389 U361 C375 L328 L322 L331 C392 C371 C370 L323 C394 C377 L332 C397 C566 R373 C388 U360 C386 R374 C387 C393 C390 L311 C372 Q350 R376 C395 C391 CN101 C240 L212 R211 R214 C114 R108 R622 L211 C239 R215 C244 C229 R147 C223 C 2 2 1 R209 R210 C230 C211 C210 R141 R103 R105 R138 R136 D201 D202 R206 C238 R213 L209 L206 R208 C234 C501 C503 R219 U204 R216 C502 C231 R212 C225 R220 C222 R501 ZD103 R503 C237 C218 R218 C216 C23 R502 C235 L202 C207 C203 R207 C201 R202 C208 C243 C204 C202 U203 U202 C205 L204 C144 R377 L324 C396 D351 R375 C385 L205 C217 R205 C398 L325 L201 L327 CN303 D350 R351 C209 C220 C160 R352 C214 R204 C215 R203 C219 R160 R162 D160 Q161 R161 Q160 C213 L210 1. Main PCB Top Diagram L320 C416 R413 R649 R222 R415 T105 T103 R149 C109 R106 C108 T104 T102 T106 T101 U402 C408 C426 C407 R134 R133 R420 VCON1 R507 C651 R128 C617 C618 C128 D602 C600 C606 R603 C601 R509 R514 C604 R605 R601 F101 R528 R118 R117 C510 R529 C520 F103 R631 C515 C508 C507 VCON2 C504 R543 R535 R536 D501 C125 C147 C119 C121 C151 R127 Q102 R541 R122 R534 Q508 R130 C123 J101 Q101 C126 C127 C150 C120 C152 R132 C517 R611 C519 C605 C113 R620 C112 ZD101 F102 F301 C528 C539 C654 C535 C524 OSC401 R626 R628 C655 U610 C415 L602 C653 C425 L213 R606 R552 R604 R553 Q511 C522 C523 C556 R636 L402 L601 R647 F401 L405 C435 C436 C409 C437 L406 C438 C406 R554 C102 L501 C145 C609 C612 R614 R619 C611 C622 C122 R616 LWR1 C105 C142 C143 R139 R115 R425 R426 OSC402 F201 C224 R201 C421 C414 C431 C424 C412 R410 R140 R137 C140 C146 C115 R110 C652 CN302 U201 R648 L302 L303 C106 C419 R411 C417 C433 C432 C422 C427 R418 R515 R406 C410 C530 R629 R424 U404 R404 R602 R632 Q503 Q502 R414 C420 C411 C418 C533 C531 C529 Q509 F302 R480 R643 C656 R646 R645 L403 C534 C540 U601 R523 C536 C537 C101 R101 C613 R630 C107 R612 R506 R618 C 6 0 7 R617 C 6 1 0 C429 C423 R427 C 4 1 3 R510 R512 R511 R519 R 6 1 3 C640 C117 C103 R125 C614 R126 ZD102 R 1 4 4 R145 R 1 4 2 R 1 4 3 C542 C506 C516 R 5 3 1 C527 R607 R123 C 1 1 6 R121 C505 R 5 0 8 Q501 R129 R124 C118 R521 C124 R131 C663 C509 C319 J102 Q505 C110 R504 R150 AU501 C641 C 1 1 1 C602 R148 C603 L307 R538 R539 C546 R544 R542 R540 C545 R537 SAMSUNG Proprietary-Contents may change without notice 9-2 ZD601 C532 R518 Q507 CN301 SCH-A302 PCB Diagrams 2. Main PCB Bottom Diagram 10. SCH-A302 Circuit description & Circuit Diagrams 1. Logic Section (1) Power Supply For the POWER ON, with the battery installed on the phone and by pressing the PWR key, the VBAT and ON_SW signals will be connected, also by connecting the TA(travel adaptor). This will turn on Q507(2SC4617). This will turn on U501. This voltage is supplied to pin 6 and pin10 of PM(power management) U501 , thus releasing them from the shut-down state to output regulated 2.8 V, thus releasing them from the shut-down state to output regulated 2.8 V. Simultaneously, VBAT applied to ON_SW will turn on Q508(DTC144EE/TR) resulting in the signal ON_SW_SENSE to change state from HIGH to LOW. This will allow MSM to send out PS_HOLD(logical HIGH) to turn on Q507(2SC4617) even after the PWR key is released. For the POWER OFF, by pressing PWR_KEY of the keypad for few seconds the VBAT voltage will be applied to the ON_SW and will drive Q508(DTC144EE/TR) to input LOW on the ON_SW_SENSE of the MSM. The MSM will recognize this and will output LOW on the PS_HOLD. The voltage(+2.8 V) from the pin 6 and pin10 of the U501 is used in the digital parts of MSM. The voltage(+3.0 V) from the pin 20 of the U501 is used in the parts of IFR. The voltage(+3.0 V) from the pin 15 of the U501 is used in the RX parts of RF. The voltage(+3.0 V) from the pin 18 of the U501 is used in the TX parts of RF. The voltage(+2.7 V) from U501 is used in the analog part. (2) Logic Part The logic part consists of internal CPU of MSM, Memory and EEPROM. The MSM receives TCXO and CHIPX8 clock signals from the IFR and controls the phone during the CDMA and the FM mode. The major components are as follows: • CPU : MSM3100C(U609) - ARM7TDMI µ-processor • Memory : U103(MB84VD2219EC-90PBS) - 16MBIT FLASH ROM U101(KM616U4110CLZI-7L) - 4MBIT SRAM • EEPROM : U106(AT24C256-10UI-2.7-T.R) - 256KBIT SERIAL EEPROM CPU ARM7TDMI µ-processor is used for the main processing. The CPU controls all the circuitry. For the CPU clock, 27 MHz resonator is used. MEMORY (U103 and U101) 16M FLASH ROM(U103)and 4M SRAM(U101) packages are used to store the terminal’s program, the internal flag information, call processing data, data service, and timer data. Using the down-loading program, the program can be changed even after the terminal is fully assembled. EEPROM(U106) One 256KBIT EEPROM is used to store ESN, NAM, power level, volume level, and telephone number. SAMSUNG Proprietary-Contents may change without notice 10-1 SCH-A302 Circuit description & Circuit Diagrams KEY MATRIX For key recognition, key matrix is setup using KEYSENE0-2 of KEYSENSE signals and KEYSENE0-2 of input ports of MSM. Ten LEDs and backlight circuitry are included in the board for easy operation in the dark. LCD MODULE LCD module contains a controller which will display the information onto the LCD by 8-bit data from the MSM. (3) Baseband Part MOBILE SYSTEM MODEM (MSM) The MSM equipped with the QUALCOMM ARM7TDMI µ-processor is an important component of the CDMA cellular phone. The MSM comes in a 208 pins FBGA package. MICROPROCESSOR INTERFACE The interface circuitry consists of reset circuit, address bus(A1-A20), data bus(D1-D16), and memory controls (~LBE,~UBE,~LWR,~RAM_CS1,~ROM_CS,~RD,~RESIN). INPUT CLOCK • CPU clock: 19.68 MHz, 32.769 kHz(sub-clock) • TCXO(pin A17): 19.68 MHz. This clock signal from the IFR is the reference clock for the MSM except in CDMA mode. • CHIPX8(pin 2G): 9.8304 MHz. The reference clock used during the CDMA mode. • SLEEP-XTAL-IN/OUT(pins R17,T17) : 32.768 MHz IFR INTERFACE CDMA, FM Data Interface • TXIQDATA0-7 (pins 11, 12, 13, 14, 15, 16, 17, 18):TX data bus used during COMA and FM mode. • C_RX_IDATA0-3 (pins 45-48) and C_RX_QDATA0-3 (pins 39-42):RX data bus used during CDMA mode. • FM_RX_IDATA (pin 47) and FM_RX_QDATA (pin 48):RX data bus used during FM mode. Clock • TX_CLK(pin 19), TX_CLK/(pin 20):Analog to Digital Converter(ADC) reference clock used in TX mode. • CHIPX8: ADC reference clock used in CDMA RX mode. • FMCLK: Reference clock in FM RX mode. Data Port Interface Includes the UART. Also, supports Diagnostic Monitor(DM) and HP equipment interface. RF Interface TX: TX_AGC_ADJ(pin 2L) port is used to control the TX power level. The PA_ON(pin 1P) signal is used to control the power amplifier. RX: TRK_LO_ADJ(pin 1R) is used to compensate the TCXO clock. General Purpose I/O Register Pins Input/output ports to control external devices. SAMSUNG Proprietary-Contents may change without notice 10-2 SCH-A302 Circuit description & Circuit Diagrams Power Consumption Control When the phone is the sleep mode, it is disabled all the pins except for the basic operation of the MSM. (4) Audio Part TX AUDIO PATH The voice signal from the microphone is filtered and amplified by the internal OP-AMP1 and the external OP-AMP2, is converted to PCM data by the MSM(U609)’s internal CODEC. This signal then applied to the MSM’s internal vocoder. RX AUDIO PATH The PCM data from the MSM is converted to audio signal by ADC of MSM CODEC, is then amplified by MSM’s internal CODEC to be sent to the speaker unit. FM TX PATH Pre-Emphasis Circuit The circuit features +6 dB/oct to reduce signal loss and noise in Tx path. Compressor The compressor features 2:1 level to reduce signal loss and noise in Tx path. The zero crossing level of the compressor is ± 2.9 kHz/dev, attack time is 3 mS, and release time is 13.5 mS. Limiter The limiter performs to cut ± 0.53 Vp-p or higher audio signal level so that the FM frequency deviation is not over ±12 kHz/dev. The function is sued confusion over phone line. LPF is used to reduce a specific high frequency of limited signal. RX AUDIO PATH De-Emphasis Circuit This circuit is lst LPE featuring -6 dB/oct to reduce signal loss and noise in Rx path. Expander The expander features 1:2 level to reduce signal loss and noise in Rx path. The zero crossing level of the expander is ±2.9 kHz/dev, attack time is 3 mS, and release time is 13.5 mS. Vloume Adjust Volume can be adjusted up to 3 steps for the user to obtain a proper loudness of received signal. (5) TX WBD, ST, and SAT Thess signals are generated from MSM. The modulation level of TX WBD and ST is ± 8 kHz/dev, and SAT is ± 2 kHz/dev. (6) Buzzer Driving Circuitry Buzzer generate alert tone. When the buzzer receives the timer signal from the MSM, it generates alert tone. The buzzer level is adjusted by the alert signal’s period generated from the MSM timer. SAMSUNG Proprietary-Contents may change without notice 10-3 SCH-A302 Circuit description & Circuit Diagrams 2. CDMA (1) Receiver Low Noise Amplifier(LNA) The low noise amplifier featuring 1.8 dB Noise Figure and 14.5 dB gain amplifier a weak signal receiver from the base station to obtain the optimum signal level. Down Converter(MIXER) First local signal is applied to this down converter. The down converter tranfers the signal amplified at the LNA into 85.38 MHz IF signal. 85.38 MHz IF signal is made by subtracting 881 ± 12.5 MHz RF signal 966 ± 12.5 MHz first local signal. The LNA and down converter is U361. RF Band Pass Filter(BPF) The RF BPF(F303) passes only a specific frequency(881.49 ± 12.5 MHz) from the signal received from the mobile station. The width is 25 MHz. IF SAW Band Pass Filter(CDMA) If SAW BPF(F200) is used for CDMA system having 1.23 MHz wide band and ± 630 kHz bandwidth. The filter also eliminates the image product generated by the mixer. Voltage Controlled Oscillator, Phase Locked Loop(PLL) The VCO+PLL (OSC402 , U402) generates the signal having 966 MHz center frequency and ± 12.5 MHz deviation with voltage control. The VCO , PLL Module(OSC402, U402) controls this signal. Input reference frequency is generated at VC-TCXO(OSC402, U402) and RF local signal is generated at VCO , PLL (OSC402, U402). The VCO , PLL (OSC402, U402) compares the two signals and generates the desired signal with a preprogrammed counter which controls voltage. Voltage Controlled Temperature Compensated Crystal Oscillator It provides 19.68 MHz reference frequency to VCO , PLL (OSC402, U402) and RFT3100(U204), IFR(U302). A correct frequency tunning is made by the voltage control. Duplexer Duplexer(F302) controls to transmit through the antenna only signals within acceptable TX frequency range(836.03 ± 12.5 MHz). It also matches LNA(U360) input in receiving part and PA output in transmitter part with the antenna. (2) Transmitter Power Amp Power amp module(U201) amplifiers the signal to be sent out to the base station through the antenna. RFT3100 The RFT3100(U204) receives the first local signal to generate 836.03 ± 12.5 MHz. 836.03 ± 12.5 MHz signal comes out from the mixer output by substracting 130.38 MHz IF signal to 967.41 ± 12.5 MHz first local signal. Antenna Antenna allows signal to send to receive from the base station. SAMSUNG Proprietary-Contents may change without notice 10-4 SCH-A302 Circuit description & Circuit Diagrams RF Band Pass Filter(BPF) The RF BPF(F303, F201) accepts only specific frequency(836.03 ± 12.5 MHz) to send it out to base station module. The bandwidth is 25 MHz. PM1000 The PM1000(U501) supply a regulated power to each part of transmitter. U501 supplies 3.0 V to the RFT3100(U204) and VBATT is connected to power amp module(U201) directly. SAMSUNG Proprietary-Contents may change without notice 10-5 SCH-A302 Circuit description & Circuit Diagrams 3. BASIC BLOCK DIAGRAM M SM 3 1 0 0 C D U PL E X ER PC C o nn ec t iv it y T es t / D eb ug Sy s t em USB 19.68 MHz U A RT 1 PL L U A RT 2 P OWE R A M P M O DU L E RF R X PA R T H K A D Cs V CT C XO TWL2214 Char gi ng sy stem V o lt age Regul at o r 32. 768 K hz A RM7 T DMI BUS RF I nt e r f ace SRA M ,FL A S H, E EP RO M , L CD d isp la y Ge n er n al P ur p o s e I nt e r f ac e Receive Data K E Y PA D RINGER CDMA P ro ce ss or I F R 30 0 0 V o c o de r EV RC 13K T r ansmit I and Q Data Tx DA Cs C OD EC R F T 3 10 0 DFM P ro ce ss or Mo de Sel ect I nt er f ace SB I AN SI/ I EEE 11 49. 1A - 199 3 JT A G Int er f c e Digital Test Bus SAMSUNG Proprietary-Contents may change without notice 10-6 SCH-A302 Circuit description & Circuit Diagrams 4. RF Circuit Diagram 1 2 3 6 5 4 8 7 9 10 11 12 R101 A R108 100 R104 47K CX8 C102 47PF C104 470PF C103 10NF R169 47K LOCK LNA_GAIN C162 470PF U601 R603 200K 2 3 C601 47NF CN303 1 4 3 AOUT VCC A- BOUT A+ B- GND B+ 8 C108 100NF 7 3.0_MA C109 10NF 6 5 3.0_TCXO A16 B16 C12 A17 U15 U14 T17 R17 N17 P17 M16 R16 U17 D15 F17 E16 D14 D9 K4 M15 E14 M4 P8 D5 D10 F4 F15 L14 B1 A1 B2 G2 F1 G3 F2 E1 F3 E2 A5 B4 C3 C6 D4 B17 D17 D16 C15 E17 H1 J4 J3 H4 R605 4.7K 100K R106 0 C SLEEP R611 2.2K MIC C122 100NF TRK_LO_ADJ R136 10K R147 RX_AGC_ADJ Q_OFFSET I_OFFSET C605 220PF C_RX_QD(0) C_RX_QD(1) C_RX_QD(2) C_RX_QD(3) C_RX_ID(0) C_RX_ID(1) C_RX_ID(2) C_RX_ID(3) R138 10K C142 100NF SPK+ SPK- C143 100NF C603 3.0_TX C604 33UF 6.3V PA_R0 TX_AGC_ADJ PA_ON IREF 3.0_MA 6.3V 10UF C606 C640 100NF C145 470PF C144 10NF 2K R619 100NF 180K C613 C146 10NF R614 180K C609 10NF R620 TX_QB TX_Q TX_IB TX_I C612 C622 10NF 100NF R618 10K 100NF C614 NC R621 E C607 100NF R616 10K C611 470K R612 1.5K R617 C600 220PF 3.0_TCXO R139 10K B9 C8 C140 C10 10NF A8 B7 B11 B12 1K C7 R137 C9 1K A11 B10 A10 D13 C13 B13 A13 B14 B15 C17 C16 A15 A14 A9 R140 1K D7 A12 C11 R141 D6 1K C4 A6 B5 B6 A7 F16 C608 100NF E15 G14 H17 J17 100NF C610 H16 G16 G15 L16 M17 NC G17 J16 K17 H14 H15 K14 J14 J15 L17 K16 3.0_MA C615 100NF R622 1K RX_AUDIO D601 R626 NC D602 C617 100NF PDM2 PDM1 SYNTH_LOCK SLEEP_N IDLE_N TRK_LO_ADJ LNA_GAIN LNA_RANGE0 LNA_RANGE1 RX_AGC_ADJ Q_OFFSET I_OFFSET C_RX_QDATA0 C_RX_QDATA1 C_RX_QDATA2 C_RX_QDATA3 FM_RX_QDATA FM_RX_IDATA C_RX_IDATA2 C_RX_IDATA3 FM_RX_STB CX8_FM_CLK PA_R0 PA_R1 TX_AGC_ADJ PA_ON2 PA_ON DAC_IREF Q_OUT_N Q_OUT I_OUT_N I_OUT GND_RET CCOMP MICFBN MICINP MICOUTN MICOUTP MICINN MICFBP EAR10P EAR10N MICBIAS MIC1P MIC1N MIC2P MIC2N EAR20 AUX1P AUX1N AUX0P AUX0N R625 NC C616 10NF R628 39K U609 A(3) A(4) R12 U10 R11 T10 U9 P10 R10 T9 U8 R9 T8 U7 R8 T7 U6 P7 N16 N15 U12 R13 T12 U11 T11 P11 R7 T6 U5 R6 T5 T4 R5 U4 T3 R4 U3 U2 T2 N14 M14 R15 P4 P14 N4 P6 P12 P13 R14 P16 P15 L4 P9 L15 AD(0) A(5) AD(1) A(6) AD(2) A(7) AD(3) A(8) AD(4) A(9) AD(5) A(10) AD(6) A(11) AD(7) 3.0_MP C618 100NF F R127 330 C619 100NF C621 10NF Q102 SVC_LED_ON 3 A(12) A(13) AD(9) A(14) A(15) AD(11) A(16) AD(12) A(17) R121 NC AD(13) AD(14) A(18) A(19) A(20) AD(15) A(0) A(21) G2 F2 E2 D2 F3 E3 D3 C3 C7 E7 F7 C8 D8 E8 F8 D9 G9 F4 E4 D7 E6 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 AD(0:15) H2 J2 H3 C4 D4 C5 D5 A(5) RAM_CS1 A(6) A(7) A(8) RAM_CS2 A(0) A(9) A(10) RESET A(11) R122 R123 0 C116 10NF A(12) A(13) A(14) A(15) A(17) A(18) A(19) A(20) A(21) A(22) A(17) A(15) A(12) A(11) AD(0:15) DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15/A-1 _CEF _CE1S _OE _LBS _UBS _WP/ACC _RESET J3 G4 K4 H5 H6 K7 G7 J8 K3 H4 J4 K5 J7 H7 K8 H8 AD(0) A(9) AD(1) A(8) AD(2) A(7) AD(3) A(6) AD(4) A(5) AD(5) A(4) AD(6) A(3) AD(7) A(2) AD(8) A(1) AD(11) AD(13) AD(14) AD(15) R144 LCD_CS A(2) 0 2 NC 3 100K 4 0 IN OUT IN OUT IN G 9 F103 1 AD(6) H 2 AD(4) 3 AD(2) 4 AD(0) IN C123 10NF IN OUT IN OUT G 9 OUT G C150 C125 1NF C126 1NF C127 1NF 1NF C152 1NF 1 3 5 7 9 11 13 15 17 19 1 3 5 7 9 11 13 15 17 19 2 4 6 8 10 12 14 16 18 20 2 4 6 8 10 12 KEY3 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC C120 1NF C121 1NF RESET SPK+ 2 4 6 8 10 12 14 16 18 20 14 16 18 20 SVC_LED_ON 1NF ON_SW LED_ON AD(5) AD(4) AD(3) AD(2) AD(1) AD(0) 1D VSS1 6E VSS2 1 2 3 1 2 3 1 2 3 VBATT V_F 1 2 3 C641 100NF 5 OUT 6 OUT 7 OUT 8 OUT G DP_RX_DATA DP_TX_DATA HP_PWR RI CD 12 13 14 15 16 17 18 19 20 21 22 V_F R172 RTS VBATT VBATT CTS DTR 0 G V100 V101 DP_RX_DATA2 V102 V103 DP_TX_DATA2 R160 10K 3 R175 0 2 1 R161 2K C128 D160 3 Q161 10NF C129 3.3NF VIBRATOR 3 U106 IN 1 IN 2 3 IN IN 4 G CD RI DP_TX_DATA DP_RX_DATA AD(7) AD(5) ZD101 DTR CTS DSR RTS 8 R133 200K ZD102 AD(3) 6 4 3 1 5 6 AD(1) 4 3 1 SCL SDA 5 2 10 1 2 3 4 5 6 7 8 9 10 11 Q160 1 VIBRATOR SPK- AD(6) VCON2 C118 100PF VBATT 3.0_MP 14 16 18 20 AD(7) C651 100NF C_F DSR TX_AUDIO F102 2 4 6 8 10 12 AD(8) F R126 100 C147 1NF 3.0_MP 1 3 5 7 9 11 13 13 15 15 17 17 19 19 C AD(9) F10 G1 G10 L1 L5 L6 L10 M1 M10 CD RI C117 100PF R125 100 C151 J102 6 8 _OE _CS1 CS2 _WE _UB _LB ZD601 2 1 3 5 7 9 11 AD(10) D SEND_END DSR 100 7 5 7 MIC ALT_LED_ON VBATT 3.0_MP HALL_EFFECT_IC 8 AD(11) VCON1 C119 1NF 6 EL_EN_A OUT IN OUT G AD(12) G3 VSS1 J9 VSS2 RX_AUDIO 5 10 AD(13) CN101-1 F101 R142 AD(14) 2G NC1 1H NC2 NC3 3E 6H NC4 C_F R131 1.2K R130 OUT AD(15) 3.0_MP R128 C124 100NF IN 1G 1F 2F 2E 2D 2C 1C 1B 6G 6F 5F 5E 5D 6C 5C 6B LWR Q101 1 I/O16 I/O15 I/O14 I/O13 I/O12 I/O11 I/O10 I/O9 I/O8 I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 E ON_SW_SENSE NC R145 2A 5B 6A 5G 2B 1A RAM_CS1 A(21) LWR A(0) RAM_CS2 AD(12) HP_DET RINGER HALL_EFFECT_IC NC VCC2 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 AD(9) AD(10) J101 GP_CS A(10) 3.0_MP 0 R143 A(16) LWR VCC1 6D R124 47K 1 2 3D 4E 4F 3F 4G 3G 5H 4H 3H 2H 4D 4C 3C 4B 3B 5A 4A 3A A(18) DTR 3 R150 200K A(22) R129 100 ALT_LED_ON LCD_EN R118 1E RAM_CS1 RAM_CS2 GP_CS LCD_CS LCD_EN 2 LWR 200K 200K A1 A10 B1 B5 B6 B10 C1 E9 F1 F9 A(16) R117 A(13) A(3) A(4) U101 J5 J6 H9 K6 D6 E5 C6 G8 A(14) A(2) 1 R132 330 R148 3.0_MP A(1:18) VCCF VCCS CIOF CIOS CE2S RY/_BY _WE SA A(1) MSM_INT PLL_EN PLL_CLK PLL_DATA PS_HOLD JACK_S V_F_CON SCL SDA EL_EN_A C620 10NF 3.0_MP AD(8) AD(10) TCXO_ON_OFF TX_AUDIO A(2) A(0:20) D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 ROM_CS1_N ROM_CS2_N RAM_CS1_N RAM_CS2_N GP_CS_N LCD_CS_N LCD_EN RD_N LWR_N HWR_N GND12 GND11 GND10 MSM3100C AD(0:15) A(1) U13 GPIO47 T13 GPIO46 T16 GPIO45 T15 GPIO44 U16 GPIO43 T14 GPIO42 C2 GPIO36 A3 GPIO35 E4 GPIO34 D3 GPIO33 C1 GPIO32 B3 GPIO30 A2 GPIO29 B8 GPIO28 A4 GPIO27 L3 GPIO26 K2 GPIO25 J1 GPIO24 K3 GPIO23 J2 GPIO22 K1 GPIO17 L2 GPIO16 M3 GPIO14 L1 GPIO13 M2 GPIO12 N3 GPIO11 M1 GPIO10 N2 GPIO9 P3 GPIO8 N1 GPIO7 R3 GPIO6 P2 GPIO5 P1 GPIO4 R1 GPIO3 R2 GPIO2 T1 GPIO1 U1 GPIO0 H2 KEYSENS4 G1 KEYSENS3 D1 KEYSENS2 D2 KEYSENS1 E3 KEYSENS0 C14 RINGER D12 GND1 P5 GND2 G4 GND3 C5 GND4 D11 GND5 K15 GND6 F14 GND7 H3 GND8 D8 GND9 R606 C112 100PF U103 A(1:20) RSVD1 RSVD2 YAMN1 TCXO XTAL48_IN XTAL48_OUT SLEEP_XTAL_IN SLEEP_XTAL_OUT RESIN_N RESOUT_N WDOG_EN MODE1 MODE0 AUX_PCM_CLK AUX_PCM_SYNC AUX_PCM_DIN AUX_PCM_DOUT VDD_C1 VDD_C2 VDD_C3 VDD_P1 VDD_P2 VDD_P3 VDD_A1 VDD_A2 VDD_A3 VDD_A4 VDD_A5 SBDT SBCK SBST HKADC6 HKADC5 HKADC4 HKADC3 HKADC2 HKADC1 HKADC0 TDO TDI TMS TRST_N TCK TMODE DP_TX_DATA DP_RX_DATA CTS_N RFR_N DP_TX_DATA2 DP_RX_DATA2 RFR_N2 CTS_N2 4 C113 100NF CTS RTS R115 100 C115 470PF C114 470PF B C110 100PF C111 100NF R149 10K 5 2 R110 22K R111 470 JACK_S 100K R604 1 SEND_END R602 NC 3.0_MP T101 T102 T103 T104 T105 T106 R601 NC G VBATT 3.0_MP 3.0_MP 3.0_MC B C602 3.0_MP R171 100 6 C106 10NF 4 C107 100NF 3 R613 1K C161 470PF 3.0_TCXO 5 D DGND DP_TX_DATA2 DP_RX_DATA2 2 1 VBATT DGND HP_PWR DP_RX_DATA DP_TX_DATA LWR R109 1K R170 100 TDO TDI TMS TRST_N TCK ZD103 C105 470PF A LWR1 DP_TX_DATA DP_RX_DATA 3.0_MP R103 430 HP_PWR 3.0_MP RESET SLEEP_CLK MSM_TCXO DP_RX_DATA C101 10NF 10K F_WE SBDT SBCK SBST R105 330K DP_TX_DATA 3.0_MP 9 A0 WP A1 6 SCL A2 5 SDA R134 2 7 VCC GND R162 NC 1 C160 1UF 10V 1 2 2 3 Engineer LJC 4 Drawn by LJC Address City Size TITLE R&D CHK 1K 10 H COMPANY NAME DOC CTRL CHK A2 SCH-A302 (i) MFG ENGR CHK Changed by 1 2 3 4 5 6 7 SAMSUNG Proprietary-Contents may change without notice 10-7 8 9 LJC Date Changed 2001.09.18 10 Time Changed 5:00:42 pm REV QA CHK 06 11 Drawing Number Sheet 1 12 of 3 SCH-A302 Circuit description & Circuit Diagrams 5. RF Circuit Diagram 5 6 2.2UF 16V 3.0_TX R203 270 TX_AGC_ADJ C203 4.7NF C201 22PF R207 1K L205 27NH 3.0_TX_IF R204 100K 3.0_TX U202 6 R1C1 PA_ON TX_IB C207 100PF C210 180PF L202 C208 10NF 3.0_TX_RF TX_I TX_QB 28 R210 C223 56PF 27 12K,1% LOCK R213 26 0 C C226 470PF 3 C2 VINR1 C2 3 VINR1 4 VREF C214 10NF LABEL VDDA4 TXVCO_T1 PCSB_OUT VDDD PCSA_OUT RFT3100-32BCCPF-MT CELLB_OUT PD_OUT PD_ISET CELLA_OUT LOCK_DET G A R648 NC R649 NC G PA_R0 L201 R201 0 VDDA5 G B 5 F201 OUT C216 47PF C220 33UF 6.3V 10NF L210 34 10 3.0_TX IN VDDA2 IF_BPF2 VCONTROL VDDA1 IF_BPF1 TX_I TX_IB TX_Q TXVCO_T2 11 C224 NC 6 4 3 1 3.0_TX_RF 3.0_TX_RF 2 12 13 R208 0 14 R220 51 C222 8PF 15 3.0_TX_LO 16 C225 NC 3.0_TX R212 NC L206 10nH C 35 25 24 23 22 21 20 19 18 17 L211 3.0_MP C227 1UF 10V R215 R221 1.2K 200K R214 1.8K 36 C235 1NF G VDDA3 PA_ON C238 47PF R219 4.7 4 C213 2.2UF 16V C215 100PF VCC1 12 11 10 9 8 7 6 G G G G G G GG G C217 10NF U204 9 VDDA6 29 IREF 8 RF_LO C221 4PF D202 R209 R211 0 L209 33nH 7 6 VDDM 30 5 AB_SEL 31 D201 G 4 SBST 32 3 SBDT IREF TCXO C237 47PF R218 4.7 2 TX_QB 1 33 C218 56PF R1C1 6 2 C1 VON/OFF 5 VCC2 C219 SBCK 3.0_TX R206 1 R2 R2 1 5 VON/OFF C1 2 R205 100K U201 VBATT TX_Q 10K U203 3.0_TX C211 180PF B TXOUTPUT C209 R202 1K C204 47PF R222 0 RFOUT 5 A 12 11 C205 10NF C243 NC L204 27NH C202 100NF 10 9 8 2 RFIN 3.0_TX_IF 7 4 4 1 3 2 3 1 C229 100PF C233 NC C231 100PF C230 10NF L212 C23 1NF C234 56PF RFT-IFR_TCXO TX_LO PA_ON SBST SBDT SBCK RFT_TCXO C250 1NF IFR_TCXO C244 NC C240 15PF R216 100 C239 NC D D 3.0_TX_LO C653 100PF C654 10NF L602 8.2nH U610 3.0_RX L601 5.6nH E C435 10NF C436 100PF C655 100PF E R480 0 C656 1NF R647 51 TX_LO F401 RF_IN 1 R406 10 C406 NC L406 5.6nH R420 10 23 R413 20 1 OUT VT 5 24 5 C416 3.9NF C417 100NF R415 5.1K 2 22 OSC401 C413 100PF 8 3 TCXO_IN RX_IN _RX_IN 6 4 G1 G2 G3 G4 G5 C418 10NF R411 0 C414 56PF OSC402 7 VCC C415 33UF 6.3V C410 10NF C412 100PF R410 16 C411 100PF L403 C407 1NF C408 100PF 2 3.0_SYN L402 F R643 51 VP VP1 GND2 IN R404 0 3 DO_RF 2 3 4 6 8 C421 220NF 20V G 17 C422 10NF 18 RX_IF_IN U402 IF_IN DOIF 14 EN DATA 20 _IF_IN 15 12 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 FOLD 4 GND1 ISO 2 CLK R426 NC RF_OUT C438 100PF 1 3.0_SYN 3 VCC 3 RX_LO R425 NC 6 U404 C437 100PF R424 0 G VCC1 C409 1NF OUT G 1 4 GND 5 COUP VC 4 R646 120 VCC OUT L405 8.2nH F R645 120 2 R414 2.2K TRK_LO_ADJ 1 C419 10NF R427 1M 7 9 10 13 16 19 21 3.0_TCXO C420 220PF G L213 C423 100PF C424 100PF C426 100PF C425 10NF 11 C427 10PF TCXO R418 0 PLL_CLK RX_IF_DO RFT_TCXO PLL_EN PLL_DATA C428 10NF C431 100PF H C432 100PF C429 470PF C433 100PF H COMPANY NAME Engineer LJC Address City Drawn by LJC Size TITLE R&D CHK A2 SCH-302 (i) DOC CTRL CHK MFG ENGR CHK Changed by LJC 1 2 3 4 5 6 7 SAMSUNG Proprietary-Contents may change without notice 10-8 8 9 Date Changed 2001.09.18 10 Time Changed 4:55:22 pm REV QA CHK 06 11 Drawing Number Sheet 2 12 of 3 SCH-A302 Circuit description & Circuit Diagrams 6. RF Circuit Diagram 1 3 2 6 5 4 7 9 8 11 10 12 3.0_RX 3.0_RX A A L322 L321 R376 10 CN301 1 2 3 1 2 3 C395 4.7NF C389 10UF 6.3V C388 100NF R373 10 C379 10UF 6.3V C378 100NF R370 10 L302 NC L327 8.2nH U360 3 TX 13 RX C384 C375 2PF OUT U361 L328 18nH 1 5 2 GG GG R371 10 1 3 4 6 R372 1.2K 3 C374 NC L330 NC VD LOIN C382 1NF L325 3.9nH L307 C319 270nH NC F301 GND 7 6 IFOUT 5 BPC GND C370 7PF C371 22PF 10 IN+ OUT+ 5 9 IN- OUT- 4 C318 5PF RXIF _RXIF G1 G2 G3 G4 G5 G6 1 L311 180nH L332 12nH C385 33NF R375 0 IFIN 8 RFIN 4 D351 C398 1NF G G G G G G G G G G G G G G G G G TXOUTPUT F302 18 ANT C C390 18PF IN 100NF C393 4.7NF 2 330PF C652 1NF F303 C383 3PF 4 R311 GND1 GND2 5 L324 47nH 100PF C566 1NF L331 270nH C549 2 100NF 100PF VREF/PDSEL 6 RFIN RFOUT C372 1NF C381 10PF B 1 3 C380 2 3 6 7 8 C323 5PF 33 R374 1K 2 C396 1 2 3 4 5 6 47NF 1 2 3 4 5 6 C556 CN302 47NF B Q350 L323 220nH L329 18nH C377 1NF 3 1 L326 1.8NH R636 10K LNA_GAIN C386 L303 NC C387 L320 2.7nH C C376 3PF C373 100PF D350 201917161514121110 9 8 7 6 5 4 2 1 C391 18PF R377 470 RX_LO 3.0_RX 3.0_IF R502 2.7K R501 3.0_MP 2 R330 1K 3.0_MP Q_OFFSET 1 I_OFFSET Q501 C502 10NF C501 10NF 1 R503 8.2K C503 10NF R506 1K R504 4.7K 3 C331 1NF L318 LED_ON R523 NC C333 10UF 6.3V 2 C505 NC 3.0_MP C507 100PF V_IN C506 33UF 6.3V R509 3.3K R511 36 R512 36 37 27 28 C334 10NF C335 100PF 4 6 14 15 17 20 24 35 44 3.0_IF R510 36 C508 100NF R514 0 3.0_MC C509 33UF 6.3V E U501 C2 C3 D1 D2 D3 R515 10K E4 SBDT E3 SBCK H4 SBST SBDT SBCK SBST KBDPWR_ON PS_HOLD C542 4 VBATT G 3 6 C532 2.2UF 16V 5 2 1 10NF Q505 3.0_MP R631 100K VBATT R521 0 R607 0 R632 100K 1 HP_DET 3 C663 1NF C510 100NF 2 3.0_MP Q509 R630 NC TCXO TCXO_ON_OFF R535 D4 D5 E5 E6 E7 F5 F6 F7 G PON_RESET/ A8 KBDPWR_ON MSM_INTERRUPT A4 PS_HOLD VREG_MSMP H3 VREG_MSMC CCNT1 G3 VREG_MSMA CCNT2 F1 VREG_IF CHARGER_SEL VREG_SYNT F2 VREG_TCXO GATE_LIMIT H1 VCHARGER VREG_RF_TX VREG_RF_RX G1 CHG_FET/ F3 RINGER_DRV ICHARGE G2 LCD_DRV ICHARGEOUT H2 BATVOLT KEYBD_DRV VIBRATOR_DRV F4 VBAT1 EL_INTENSITY E2 BAT1_FET/ XTAL_OUT G4 VBAT2 XTAL_IN E1 BAT2_FET/ SLEEP_CLK B6 NC B5 TCXO_OUT COIN_CELL B1 RINGER_TONE C7 TCXO_IN RESERVED C6 SCI_IN R524 0 R534 NC C338 10NF R536 HP_PWR 0 7 3.0_MP 3.0_MC 3.0_MA 3.0_IF 3.0_SYN 3.0_TCXO 3.0_TX 3.0_RX B7 B8 D8 E8 D6 H7 H8 G7 G5 H5 C339 4.7NF 3.0_IF RESET MSM_INT 10 9 C340 10NF 32 30 31 26 29 SBCK SBST SBDT R313 33K SLEEP 33 C341 100NF RXQD3 RXQD2 RXQD1 RXQD0 RXID3 RXID2 38 39 40 41 42 C_RX_QD(3) C_RX_QD(2) C_RX_QD(1) C_RX_QD(0) 45 46 C_RX_ID(3) C_RX_ID(2) 48 C_RX_ID(0) R380 51 NC R378 CDMA_IF FM_RX_QDATA_RXID0 CDMA_IF/ RM_RX_CLK FM_RX_STB VCONTROL FM_RX_IDATA_RXID1 FM_IF FM_IF/ GND1 GND2 SBCK_SLEEP/ GND3 SBST_IDLE/ GND4 SBDT_FM/ GND5 SBI_EN GND6 FM_SLOT GND7 GND8 GND9 DNC GND10 1 2 4 3 SLEEP_CLK 47 C_RX_ID(1) 3 5 8 13 16 18 19 23 34 43 F R315 330 RX_IF_IN R532 NC R554 C343 150PF C321 6PF MSM_TCXO 3.0_MP C568 1NF C4 C342 1NF R316 10K D302 NC L501 C8 E 1 2 NC X501 A5 A6 C5 C_RX_ID(0:3) TCXO IFR_TCXO R519 CX8 C_RX_QD(0:3) 21 22 25 C320 A1 B2 A2 B3 F8 3.0_MC 3.0_MA 3.0_IF L319 68nH R553 0 1.2K C344 4.7PF R317 10K R318 0 RX_IF_DO RFT-IFR_TCXO R529 0 C513 27PF C515 1UF C514 27PF C346 150PF C567 150PF R531 0 Q507 C539 100PF C516 10NF KBDPWR_ON 3 2 C527 4.7UF C529 100PF C528 100NF 3.0_SYN C530 2.2UF 16V C531 100NF C522 100PF C524 100NF C523 1UF 10V C519 100PF C520 4.7UF G D303 C345 4.7NF C517 100NF R319 910 C349 33NF 3.0_TCXO 3.0_TX C350 4.7UF 6.3V 3.0_RX V_IN 3.0_MP 1 R539 100K D U302 CHIPX8 R518 NC R537 10K C545 NC 11 12 RXIF _RXIF R312 1K 10M R538 NC 36 RX_AGC_ADJ PS_HOLD R528 VBATT 6.8K D7 G6 H6 G8 A3 C1 B4 A7 VDD1 VDD2 VDD3 VDD4 VDD5 VDD6 REF_BYP XTAL_BYP GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 R629 82K HKADC7 HKADC6 HKADC5 KHADC4 HKADC3 C337 100PF VDD1 VDD2 VDD3 VDD4 VDD5 VDD6 VDD7 VDD8 VDDM I_OFFSET 3 1 RXVCO_OUT Q503 Q502 1 TCXO/N 3 2 Q_OFFSET EL_EN_A V_F F R331 1K C332 1NF R507 22K C504 10NF R508 1K RXVCO_T2 2 V_F_CON RXVCO_T1 D AU501 R540 100K 3 R541 100K H R542 R543 ON_SW 4.7K 22K R544 100K 1 ON_SW_SENSE 3 R552 1K Q508 RINGER 2 2 3 1 1 C540 100PF D501 C533 1UF 10V C535 100PF C534 100NF C536 1UF 10V C537 100NF C526 100PF C525 4.7UF 16V C538 100NF C392 100PF C397 10UF 6.3V Size TITLE R&D CHK 2 Q511 Address City Drawn by LJC A2 SCH-A302 (i) DOC CTRL CHK C546 NC H COMPANY NAME Engineer LJC C394 100NF MFG ENGR CHK Changed by LJC 1 2 3 4 5 6 7 SAMSUNG Proprietary-Contents may change without notice 10-9 8 9 Date Changed 2001.09.18 10 Time Changed 5:11:41 pm REV QA CHK 06 11 Drawing Number Sheet 3 12 of 3